Circuit board flipping mold and circuit board flipping method

Abstract

The invention discloses a circuit board flipping mold and a circuit board flipping method. The flipping mold includes an upper mold and a lower mold. The upper mold includes a pressing plate and a pushing member. The pushing member is installed on a pushing mechanism. The pressing plate is provided with at least one push rod through groove corresponding to the shape of the pushing member. The bottom end opening of the push rod through groove is for a top strip to penetrate. A hot pressing through groove is provided above the pressing plate corresponding to the push rod through groove. The hot pressing through groove is connected with the push rod through groove up and down. The hot pressing through groove is for a hot pressing head to pass through. The pushing member is provided with a hot pressing head through groove for the hot pressing head to pass through. The lower mold includes a carrier plate, a top strip plate and a top strip. The bottom end of the top strip is arranged on the top strip plate. The top strip corresponds to the push rod through groove of the upper mold pressing plate one by one. The carrier plate is arranged on a carrier mechanism and located above the top strip plate. A top strip through groove is provided on the carrier plate for the top strip to pass through. The invention can improve the flipping accuracy of the circuit board, improve the processing quality of the circuit board, and the flipping mold is used to automatically flip the package, and the consistency of the product is good.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a circuit board packaging turning mold and a packaging turning method. Background Art

[0002] Circuit boards, such as flexible circuit boards and software-integrated boards, have a wide range of applications in the field of wearable smart electronic products due to their flexibility, lightness, and thinness. For example, smart wearable electronic products such as Bluetooth headsets and smart watches require 180-degree folding and assembly due to their highly integrated design and volume. Existing product folding is mainly done manually, with each person completing about 100 PCS of unit products per hour. The production efficiency is extremely low and it takes up a lot of manpower. The maximum folding accuracy of manual folding is ±0.3mm, which is relatively low. The quality of manual products is not uniform and cannot meet product requirements. In addition, manual operation can easily cause products to be wrinkled and scrapped, resulting in poor product quality and low yield. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a circuit board flipping mold which can replace manual operation, has high production efficiency, good product consistency, and can improve product quality.

[0004] In order to achieve the above object, the solution of the present invention is:

[0005] A circuit board flipping mold, comprising an upper mold and a lower mold;

[0006] The upper mold includes a pressing plate and a pushing member, the pushing member is arranged on the pushing mechanism, the pressing plate is provided with at least one push rod through groove corresponding to the shape of the pushing member, the bottom end opening of the push rod through groove is for the top strip to penetrate, the pressing plate is provided with a hot pressing through groove above the push rod through groove, the hot pressing through groove is connected with the push rod through groove up and down, the hot pressing through groove is for the hot pressing head to pass through, and the pushing member is provided with a hot pressing head through groove for the hot pressing head to pass through;

[0007] The lower mold includes a carrier plate, a top strip plate and the top strip, the bottom end of at least one top strip is arranged on the top strip plate, the top strip corresponds one to one with the push rod through groove of the upper mold pressure plate, the carrier plate is arranged on the carrier mechanism and is located above the top strip plate, and the carrier plate is provided with a top strip through groove for the top strip to pass through.

[0008] Furthermore, the pushing member of the upper mold includes a push rod and a mounting block; the front end of the push rod is provided with the hot pressing head groove, the upper part of the front end surface of the push rod is provided with a top plate protrusion, and the front end bottom surface of the push rod is provided with a pressure plate protrusion.

[0009] Furthermore, a guide groove protrusion is also provided on the bottom surface of the push rod, and the guide groove protrusion is embedded in the bottom end opening of the push rod through groove to further improve the movement stability of the push member.

[0010] Furthermore, the push rod slot and the push member are processed by wire cutting, and the single-side spacing between the two is 0.02mm. The top bar and the top bar slot of the carrier plate are processed by wire cutting, and the single-side spacing between the two is 0.02mm, which further improves the product packaging accuracy.

[0011] Furthermore, a product raised clearance groove is provided on the bottom surface of the pressing plate. The product raised clearance groove is designed according to the raised contact surface between the product and the pressing plate to prevent the product from being crushed and damaged when the upper mold and the lower mold are pressed, thereby further ensuring the product processing quality.

[0012] Furthermore, the lower mold also includes a top strip guide column, which is arranged between the carrier plate and the top strip plate to play a guiding role.

[0013] Furthermore, the carrier plate of the lower mold and the pressure plate of the upper mold are also provided with matching mold pins and positioning grooves, and the matching of the mold pins and the positioning grooves can improve the mold clamping accuracy of the lower mold and the upper mold.

[0014] Furthermore, the platform mechanism has a platform lifting assembly, which includes a lifting cylinder, a lifting plate, a mounting column and a lift bar lifting cylinder. The push plate of the lifting cylinder is arranged upward and connected to the lifting plate, so that the lifting plate moves up and down with the push plate of the lifting cylinder. The lifting plate is provided with a mounting column and a lift bar lifting cylinder. The lower mold of the bag turning mold is arranged on the mounting column, and the lift bar lifting cylinder is arranged on the lifting plate below the corresponding lower mold and its push rod is arranged upward.

[0015] Furthermore, the pushing mechanism includes a pushing linear module and a pushing member mounting plate, and at least one pushing member is installed at the front end of the pushing mounting plate, and the pushing member corresponds one-to-one with the hot pressing head and the top strip.

[0016] Another object of the present invention is to overcome the deficiencies of the prior art and provide a circuit board repackaging method that can replace manual operation, has high production efficiency, good product consistency, and can improve product quality.

[0017] In order to achieve the above object, the solution of the present invention is:

[0018] A circuit board flipping method using the circuit board flipping mold comprises the following steps:

[0019] Step A: Position the circuit board to be flipped on the carrier plate of the lower mold;

[0020] Step B: The platform mechanism lifts up the upper mold to close the upper mold with the lower mold;

[0021] Step C: The platform mechanism lifts up the top bar of the upper mold, and the top bar passes through the carrier plate to push the flipping part of the product into the push rod slot and the hot pressing slot of the pressing plate;

[0022] Step D: The pushing mechanism drives the pushing member to move so that its end is close to the top strip, and the pushing member is located above the top strip and supports the middle and upper part of the product's bag turning part;

[0023] Step E: The platform mechanism drives the top strip to descend and return to its original position, and the pushing mechanism drives the pushing member to continue to move forward, so that the pushing member folds the flipping part of the product onto the fitting part of the product until the hot pressing head slot of the pushing member is located below the hot pressing head;

[0024] Step F: The hot pressing head is pressed downward, and the bottom end of the hot pressing head passes through the hot pressing groove of the pressing plate and the hot pressing groove of the pushing member to hot press the turned-over part of the product onto the fitting part of the product;

[0025] Step G: The hot pressing head rises and returns to its original position, and the pushing mechanism drives the pushing member to retreat and return to its original position;

[0026] Step H: The carrier mechanism drives the lower mold to descend and return to its original position, and the upper mold is separated from the lower mold.

[0027] After adopting the above scheme, the present invention can realize the automatic packaging operation of flexible circuit board products, replace manual operation, and realize intelligent manufacturing. The present invention arranges multiple sets of mutually matching pushers, top strips and hot pressing heads, and can complete the packaging operation of multiple unit products in a single execution. The production efficiency is high. One person can operate at least two devices, which can greatly reduce manpower. In addition, the automatic packaging of the equipment is used to replace manual operation, and the product consistency is good, which can improve the product packaging accuracy and improve the product processing quality.

[0028] The top strip of the lower mold of the bag-turning mold of the present invention lifts up the bag-turning part of the product, which is a key step in realizing the bag-turning processing. Cooperating with the pushing member of the upper mold, the progressive pushing realizes the pre-flipping and folding of the product. The hot pressing head presses down to hot-press the bag-turning part onto the fitting part of the product to realize the bag-turning processing of the product. The working principle of the present invention is simple, easy to realize and can be industrialized. The push rod slot and the pushing member of the upper mold can also be processed by slow wire cutting, and the single-side spacing between the two is 0.02mm. The top strip and the top strip slot of the carrier plate are processed by slow wire cutting, and the single-side spacing between the two is 0.02mm, which further improves the product bag-turning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a three-dimensional diagram of the bag turning mold of the present invention installed on the automatic bag turning equipment.

[0030] Figure 2 This is a front view of the bag turning mold of the present invention installed on the automatic bag turning equipment.

[0031] Figure 3 This is a top view of the bag turning mold of the present invention installed on the automatic bag turning equipment.

[0032] Figure 4 This is a left side view of the bag turning mold of the present invention installed on the automatic bag turning equipment.

[0033] Figure 5 This is a three-dimensional diagram of the lower mold of the bag turning mold of the present invention installed on the carrier mechanism.

[0034] Figure 6 This is a front view of the lower mold of the bag turning mold of the present invention installed on the carrier mechanism.

[0035] Figure 7 It is a top view of the lower mold of the bag turning mold of the present invention installed on the carrier mechanism.

[0036] Figure 8 This is a left view of the lower mold of the bag turning mold of the present invention installed on the carrier mechanism.

[0037] Fig. 9 This is a three-dimensional diagram of the upper mold of the bag turning mold of the present invention installed on the hot pressing mechanism.

[0038] Fig.10 This is a front view of the upper mold of the bag turning mold of the present invention installed on the hot pressing mechanism.

[0039] Fig.11 This is a left side view of the upper mold of the bag turning mold of the present invention installed on the hot pressing mechanism.

[0040] Fig.12 This is a three-dimensional diagram of the upper mold of the bag turning mold of the present invention installed on the hot pressing assembly.

[0041] Fig.13 This is a three-dimensional diagram of the pusher of the bag turning mold of the present invention installed on the push mechanism.

[0042] Fig.14 This is a front view of the pusher of the bag turning mold of the present invention installed on the push mechanism.

[0043] Fig.15 This is a bottom view of the pusher of the bag turning mold of the present invention installed on the push mechanism.

[0044] Fig.16 It is a right view of the pusher of the bag turning mold of the present invention installed on the push mechanism.

[0045] Fig.17 It is a three-dimensional diagram of the bag turning mold of the present invention.

[0046] Fig.18 It is a front view of the bag turning mold of the present invention.

[0047] Fig.19 It is a top view of the bag turning mold of the present invention.

[0048] Fig. 20 It is the left side view of the bag turning mould of the present invention.

[0049] Fig.21It is a three-dimensional diagram of the pusher of the present invention.

[0050] Fig. 22 It is a right side view of the pusher of the present invention.

[0051] Fig.23 It is a schematic diagram of the working principle of the present invention.

[0052] Fig.24 It is a schematic diagram of the local product of the present invention before being turned over.

[0053] Fig.25 This is a schematic diagram of some unit products of the local product of the present invention after being turned over. DETAILED DESCRIPTION

[0054] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0055] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “X”, “Y”, “Z”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0060] like Figures 1 to 4 The figure shows an automatic bag turning device 1, which includes a chassis 10, a platform mechanism 20, a hot pressing mechanism 30, a pushing mechanism 40 and a bag turning mold 100 of the present invention. The platform mechanism 20 and the hot pressing mechanism 30 are arranged on the chassis 10. The bag turning mold 100 of the present invention includes an upper mold 110 and a lower mold 120. The lower mold 120 is arranged on the platform mechanism 20, and the upper mold 110 is arranged on the hot pressing mechanism 30. The pushing mechanism 40 is arranged on a side of the hot pressing mechanism 40 corresponding to the upper mold 110.

[0061] The chassis 10 is provided with a human-machine interface 11 and a heating thermostat 12 . The heating thermostat 12 is used to set and control the temperature of the heat pressing head 3433 of the heat pressing mechanism 30 .

[0062] like Figures 5 to 8 As shown, the carrier mechanism 20 includes a base 21, a carrier linear module 22, a guide rail mounting frame 23, a carrier linear guide 24 and a carrier lifting assembly 25; the base 21 is fixed on the chassis 10, the carrier linear module 22 is fixedly set on the base 21, the guide rail mounting frame 23 is set above the carrier linear module 22, and the carrier linear guide 24 is fixedly set on the guide rail mounting frame 23.

[0063] The platform lifting assembly 25 includes a slide 251, a lifting cylinder 252, a lifting plate 253, a mounting column 254 and a lifting cylinder 255. The bottom of the slide 251 is provided with a slider 2511 that cooperates with the platform linear guide rail 24 and a transmission arm 2512 connected to the platform linear module 22. The guide rail mounting frame 23 is provided with a slot 231 for the transmission arm 2512 to pass through and for the transmission arm 2512 to reciprocate along the platform linear guide rail 24, so that the platform linear module 22 can drive the slide 251 to reciprocate along the platform linear guide rail 24 through the transmission arm 2512. A lifting cylinder 252 is respectively provided on the left and right sides of the slide 251, and the push plate of the lifting cylinder 252 is arranged upward and connected to the lifting plate 253, so that the lifting plate 253 moves up and down with the push plate of the lifting cylinder 252. The lifting plate 253 is provided with a mounting column 254 and a top bar lifting cylinder 255. The lower mold 120 of the bag turning mold 100 is set on the mounting column 254, and the top bar lifting cylinder 255 is set on the lifting plate 253 below the corresponding lower mold 120. The push rod of the top bar lifting cylinder 255 is set upward and passes through the lifting plate 253.

[0064] Since the flexible circuit board product is soft, if the product is only placed on the lower mold 120 for processing, the part of the product protruding from the lower mold 120 will sag and be difficult to process. In order to position the product more flatly on the lower mold 120, the platform lifting assembly 25 also includes a platform 256 and a platform mounting frame 257. The platform mounting frame 257 is arranged on the lifting plate 253, and the platform 256 is arranged on the top of the platform mounting frame 257. The platform 256 is hollowed out in the area corresponding to the lower mold 120 for placing the product, facilitating product operation and ensuring product quality.

[0065] like Figure 5 and Figure 6 As shown, the platform mechanism 20 also includes a height detection component 26, which includes a micrometer lifting cylinder 261 and a micrometer 262; the fixed part of the micrometer lifting cylinder 261 is installed on one side of the slide 251, and the sliding part of the micrometer lifting cylinder 261 is connected to the lifting cylinder 252; the micrometer 262 includes a micrometer body 2621 and a micrometer anvil 2622, and the micrometer anvil 2622 is installed on one side of the fixed part of the micrometer lifting cylinder 261, and the micrometer body 2621 is correspondingly installed on one side of the sliding part of the micrometer lifting cylinder 261. The micrometer lifting cylinder 261 drives the micrometer body 2621 to lift, so that the micrometer body 2621 is separated from the micrometer anvil 2622. After reaching the specified height, the required lifting height can be read on the micrometer 262. The height of the lifting plate 253 and the lower mold 120 lifted by the lifting cylinder 252 is set and detected accordingly to ensure that the lower mold 120 is lifted into place, protect the bag turning mold and prevent the product from being crushed and damaged.

[0066] like Figures 9 to 11As shown, the hot pressing mechanism 30 includes a pillar 31, an upper mold mounting plate 32, a hot pressing mounting plate 33, a hot pressing assembly 34 and a lower pressure control assembly 35; at least two pillars 31 are fixedly mounted on the chassis 10 on both sides of the corresponding carrier lifting assembly 25, the upper mold mounting plate 32 is arranged on the pillar 31, the upper mold 110 is arranged on the upper mold mounting plate 32 and is located at an upper position within the travel range of the carrier linear module 22, the hot pressing mounting plate 33 is arranged on the pillar 31 and is located above the upper mold 110, and at least one hot pressing assembly 34 is arranged on the hot pressing mounting plate 33.

[0067] like Fig.12 As shown, the hot pressing assembly 34 includes a pressing cylinder 341, a module mounting block 342, a hot pressing module 343, a linear bearing 344 and a guide column 345; the pressing cylinder 341 is fixedly arranged on the hot pressing mounting plate 33, the piston rod 3411 of the pressing cylinder 341 passes downward through the hot pressing mounting plate 33 and is connected to the module mounting block 342, the guide column 345 is arranged on the top surface of the module mounting block 342 and passes through the hot pressing mounting plate 33, and the linear bearing 344 is sleeved on the guide column 345 and installed on the hot pressing mounting plate 33. The hot pressing module 343 includes a connection block 3431, a heating block 3432 and a hot pressing head 3433; the connection block 3431 is arranged at the bottom of the module mounting block 342, the heating block 3434 is arranged at the bottom of the connection block 3434, the hot pressing head 3433 is arranged at the bottom of the heating block 3432, and the heating block 3432 is connected to the heating device and heats the hot pressing head 3433 to a preset temperature. In order to improve work efficiency, the hot pressing assembly 34 can be provided with multiple groups.

[0068] like Fig. 9 As shown, the downward pressure control assembly 35 includes a top plate 351, a force pressure reducing valve 352, a vacuum solenoid valve 353 and a vacuum generator 354; the top plate 351 is arranged at the top of the support 31 and is located above the hot pressing mounting plate 33, the force pressure reducing valve 352, the vacuum solenoid valve 353 and the vacuum generator 354 cooperate to control each downward pressure cylinder 341 to independently drive the hot pressing module 343 to press down and rise, and the force pressure reducing valve 352 controls the downward pressure of the hot pressing head 3433 through the downward pressure cylinder 341 to be within the preset pressure value range to prevent the product from being crushed and damaged. The hot pressing mechanism 30 also includes an exhaust fan 39 for heat dissipation of the hot pressing assembly 34.

[0069] like Figures 13 to 16As shown, the pushing mechanism 40 includes a module mounting plate 41, a pushing linear module 42, a pushing linear guide rail 43 and a pushing member mounting plate 44; the module mounting plate 41 is arranged below the hot pressing mounting plate 33 of the hot pressing mechanism 30, the pushing linear module 42 and the pushing linear guide rail 43 are arranged below the module mounting plate 41, and the pushing member mounting plate 44 is slidably arranged on the pushing linear guide rail 43 and connected to the pushing linear module 42, so that the pushing linear module 42 can drive the pushing member mounting plate 44 to reciprocate along the pushing linear guide rail 43. The front end of the pushing mounting plate 42 is connected to the pushing member 112, and a plurality of pushing members 112 can be provided, and the number of pushing members 112 corresponds to the number of hot pressing components 34 of the hot pressing mechanism 30. In order to facilitate the pushing member 112 to be better installed on the pushing member mounting plate 44, the pushing mechanism 40 also includes a floating joint 45, and the floating joint 45 can make the pushing member 112 move more smoothly.

[0070] Furthermore, the pushing mechanism 40 also includes a limit sensing module 46, which includes a sensor 461 and a sensor sheet 462. The sensor module 46 is arranged at a pushing safety limit position of the movement trajectory of the pushing member 112, wherein the sensor 461 is arranged below the module mounting plate 41, and the sensor sheet 462 is arranged at a corresponding position of the pushing member mounting plate 44 and senses the passing of the sensor to ensure the safe operation of the pushing mechanism 40.

[0071] like Figures 17 to 22 As shown, the bag turning mold 100 of the present invention includes an upper mold 110 and a lower mold 120 ; the upper mold 110 includes a pressing plate 111 and a pushing member 112 .

[0072] like Fig.21 and Fig. 22 As shown, the push member 112 includes a push rod 1121 and a mounting block 1122; a hot press head slot 1123 is provided at the front end of the push rod 1121, and the width and length of the hot press head slot 1123 are designed to be greater than the width and length of the hot press head 3433, so that the hot press head 3433 can pass through; a top plate protrusion 1124 is provided on the upper part of the front end surface of the push rod 1121, so that when the push member 112 moves to a specified position, the top plate protrusion 1124 can support the flipping part 211 of the product; a pressing plate protrusion 1125 is provided on the bottom surface of the front end of the push rod 1121, and when the push member 112 pushes, the pressing plate protrusion 1125 folds the flipping part 211 of the product onto the fitting part 212 of the product;

[0073] At least one push rod slot 1111 is longitudinally opened at the lower part of the pressing plate 111. The shape of the push rod slot 1111 is designed to match the pushing member 112. The front and rear ends and the bottom end of the push rod slot 1111 form openings. The bottom opening of the push rod slot 1111 is for the top strip 124 to penetrate. The width of the bottom opening of the push rod slot 1111 is larger than the top strip 124 of the lower mold and the flipping part 211 of the product (matching Fig.24 and Fig.25 ) width, the position and number of the push rod slots 1111 are designed according to the product processing requirements, the push rod slots 1111 are used to accommodate the push member 112 and enable it to move stably in the push rod slots 1111, so that the top strip 124 can pass through the push rod slots 1111 to push the flipped part 211 of the product into the pressing plate 111.

[0074] A hot pressing groove 1112 is provided on the pressing plate 111 above the push rod groove 1111. The hot pressing groove 1112 is connected with the push rod groove 1111 from top to bottom. The width and length of the hot pressing groove 1112 are greater than the width and length of the hot pressing head 3433 and the product's flipping part 211, so that the top strip 124 can push the product's flipping part 211 into the hot pressing groove 1112, so that the hot pressing head 3433 can pass through the hot pressing groove 1112. Furthermore, the hot pressing groove 1112 can be designed to be lengthened to play a role in heat dissipation.

[0075] Furthermore, a guide groove protrusion 1126 is also provided on the bottom surface of the push rod 1121 , and the guide groove protrusion 1126 is embedded in the bottom end opening of the push rod through groove 1111 to further improve the movement stability of the push member 112 .

[0076] Furthermore, the push rod slot 1111 and the push member 112 are processed by wire cutting, and the single-side spacing between the two is 0.02mm. The top bar 124 and the top bar slot of the carrier plate 121 are processed by wire cutting, and the single-side spacing between the two is 0.02mm, which further improves the product packaging accuracy.

[0077] Furthermore, a product protrusion clearance groove 1113 is also opened on the bottom surface of the pressing plate 111. The product protrusion clearance groove 1113 is designed according to the protrusion of the contact surface between the product and the pressing plate to prevent the product from being crushed and damaged when the upper mold 110 and the lower mold 120 are closed, further ensuring the product processing quality.

[0078] The lower mold 120 includes a carrier plate 121, a top strip guide column 122, a top strip plate 123 and a top strip 124; the carrier plate 121 is provided with a top strip through groove (not shown in the figure) for the top strip 124 to pass through; the top strip plate 123 is arranged below the carrier plate 121 so as to be movable up and down through the top strip guide column 122, the top end of the top strip guide column 122 is fixedly arranged below the carrier plate 121, and a nut is arranged at the bottom end of the top strip guide column 122 to prevent the top strip plate 123 from falling off, at least one The bottom end of the top strip 124 is arranged on the top strip plate 123, and the top strip 124 corresponds one-to-one to the push rod slot 1111 of the upper mold pressure plate 121. The top end of the top strip 124 is placed in the top strip slot corresponding to the carrier plate 121. When in use, the top end of the top strip 124 passes through the carrier plate 121 to lift the flipping part 211 of the product on the carrier plate 121. The position and number of the top strip 124 are set corresponding to the push rod slot 1111 of the pressure plate 111 of the upper mold 110.

[0079] A clamping pin 1211 is provided on the carrier plate 121 , and a positioning groove corresponding to the clamping pin 1211 is provided on the pressure plate 111 . The clamping pin 1211 cooperates with the positioning groove to improve the clamping accuracy of the lower mold 120 and the upper mold 110 .

[0080] like Figure 1 and Fig.23 As shown, the operation process and working principle of the automatic bag turning equipment are:

[0081] Before use, the pressing plate 111 of the upper mold 110 of the present invention is installed on the upper mold mounting plate 32 of the hot pressing mechanism 30, and the multiple pushers 112 of the upper mold 110 are installed one by one on the pusher mounting plate 44 of the pushing mechanism 40; the lower mold 120 is installed on the mounting column 254 of the platform lifting assembly 25 of the platform mechanism 20 through the carrier plate 121 of the lower mold 120; the product 200 is positioned and placed on the carrier plate 121 of the lower mold 120 of the present invention, and the automatic bag turning device 1 is started to perform the following steps:

[0082] Step A: The carrier linear module 22 of the carrier mechanism 20 drives the carrier lifting assembly 25 to the bottom of the hot pressing mechanism 30, so that the lower mold 120 is located directly below the upper mold 110;

[0083] Step B: The lifting cylinder 252 of the platform lifting assembly 25 drives the lower mold 120 to push up, so that the upper mold 120 and the lower mold 110 are positioned and molded. Fig.23 As shown in part a of;

[0084] Step C: The top bar lifting cylinder 255 of the platform lifting assembly 25 drives the top bar 124 to push up, and the top bar 124 passes through the carrier plate 121 to push the flipping part 211 of the product into the push rod groove 1111 and the hot pressing groove 1112 of the pressing plate 111, as shown in FIG. Fig.23 As shown in part b of;

[0085] Step D: The linear push module 42 of the push mechanism 40 drives the push member 112 to move so that its end is close to the top bar 124. The top plate protrusion 1124 of the push member 112 is located above the top bar 124 and supports the middle and upper part of the product's flipping part 211. Fig.23 As shown in part c of;

[0086] Step E: The top bar lifting cylinder 255 of the platform lifting assembly 25 drives the top bar 124 to descend and return to its original position, and the pushing linear module 42 of the pushing mechanism 40 drives the pushing member 112 to continue to move, so that the pressing plate protrusion 1125 of the pushing member 112 folds the product's flipping part 211 onto the product's fitting part 212 until the hot pressing head slot 1123 of the pushing member 112 is located below the hot pressing head 3433 of the hot pressing assembly 34, as shown in FIG. Fig.23 As shown in the d part;

[0087] Step F: The downward pressing cylinder 341 of the hot pressing assembly 34 drives the hot pressing head 3433 to press downward, and the bottom end of the hot pressing head 3433 passes through the hot pressing groove 1112 of the pressing plate 111 and the hot pressing groove 1123 of the pushing member 112 to hot press the flipping part 211 of the product onto the bonding part 212 of the product. Fig.23 As shown in part e of;

[0088] Step G: The pressing cylinder 341 of the hot pressing assembly 34 drives the hot pressing head 3433 to rise and return to its original position, and the pushing linear module 42 of the pushing mechanism 40 drives the pushing member 112 to retreat and return to its original position. Fig.23 As shown in the f part;

[0089] Step H: The lifting cylinder 252 of the platform lifting assembly 25 drives the lower mold 120 to descend and return to its original position, and the upper mold 120 is separated from the lower mold 110;

[0090] Step I: The carrier linear module 22 of the carrier mechanism 20 drives the carrier lifting assembly 25 to exit;

[0091] Another area of ​​the product 200 to be processed is positioned and placed on the carrier plate 121 of the lower mold 120 , and the above steps are repeated until all unit products 210 on the product 200 are processed and the product 200 is removed.

[0092] The product status before repackaging is as follows Fig.24 As shown in the figure, after a single flipping process using the automatic flipping equipment, the product is in the following state after flipping Fig.25 shown.

[0093] Automatic bag turning equipment can be used to automatically turn the product bags, replace manual work, and realize intelligent manufacturing. The present invention provides multiple sets of mutually supporting pushers 112, top strips 124 and hot pressing components 34, and a single execution can complete the bag turning of multiple unit products. The production efficiency is high, and one person can operate at least two devices, which can greatly reduce manpower. The present invention can improve the accuracy of product bag turning and improve product processing quality.

[0094] The carrier mechanism 20 of the automatic bag turning equipment uses a carrier linear module 22 to accurately transfer the lower mold 120 to the bottom of the upper mold 110 to ensure the mold closing accuracy of the lower mold 120 and the upper mold 110; the carrier lifting component 25 uses a lifting cylinder 252 to lift the lower mold 120, and can further use a height detection component 26 to set and detect the lifting height of the lower mold 120 to ensure that the lower mold 120 is lifted in place, protect the bag turning mold 100 and prevent the product from being crushed and damaged. A linear module can also be used to complete a high-precision lifting action, but the cost is relatively high; hot press Each hot pressing component 34 of the structure 30 can be controlled independently. If there are defective unit products on the product, the corresponding hot pressing component 34 can be turned off to reduce the number of times the hot pressing head is used and extend the service life of the hot pressing mechanism; the hot pressing mechanism 30 adopts a force control pressure reducing valve 352 to control the downward pressure of the hot pressing head 3433 within a preset pressure value range to prevent the product from being crushed and damaged; the pushing mechanism 40 adopts a pushing linear module 42 to enable the pushing member 112 to be accurately advanced to the specified position, and cooperate with the top strip 124 and the hot pressing head 3433 to accurately complete the product packaging processing, thereby improving the product packaging accuracy.

[0095] The top strip 124 of the lower mold 120 of the bag-turning mold 100 of the present invention lifts up the bag-turning part of the product, which is a key step in realizing the bag-turning process. Cooperating with the pushing member 112 of the upper mold 110, the product is pre-turned and folded. The hot pressing head 3433 presses down to hot-press the bag-turning part onto the fitting part of the product to realize the bag-turning process. The working principle of the present invention is simple, easy to realize, and can be industrialized. The push rod slot 1111 and the pushing member 112 of the upper mold 110 can also be processed by slow wire cutting, and the single-side spacing between the two is 0.02mm, which further improves the product bag-turning accuracy.

[0096] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present invention.

Claims

1. A circuit board turn-over mold, characterized in that: include: Upper mold and lower mold; The upper mold includes a pressing plate and a pushing member, the pushing member is installed on the pushing mechanism, the pressing plate is provided with at least one push rod through groove corresponding to the shape of the pushing member, the bottom end opening of the push rod through groove is for the top strip to penetrate, the pressing plate is provided with a hot pressing through groove above the push rod through groove, the hot pressing through groove is connected with the push rod through groove up and down, the hot pressing through groove is for the hot pressing head to pass through, and the pushing member is provided with a hot pressing head through groove for the hot pressing head to pass through; The lower mold comprises a carrier plate, a top strip plate and the top strip, the bottom end of at least one top strip is arranged on the top strip plate, the top strip corresponds to the push rod through groove of the upper mold pressing plate one by one, the carrier plate is arranged on the carrier mechanism and located above the top strip plate, and the carrier plate is provided with a top strip through groove for the top strip to pass through; The pushing mechanism includes a pushing linear module and a pushing member mounting plate, at least one pushing member is installed at the front end of the pushing member mounting plate, and the pushing member corresponds to the hot pressing head and the top strip one by one; The lower mold also includes a top strip guide column, which is arranged between the carrier plate and the top strip plate.

2. A circuit board turn-over mold according to claim 1, characterized in that: The pushing member of the upper mold includes a push rod and a mounting block; the front end of the push rod is provided with the hot pressing head through groove, the upper part of the front end surface of the push rod is provided with a top plate protrusion, and the front end bottom surface of the push rod is provided with a pressure plate protrusion.

3. A circuit board turn-over mold according to claim 2, characterized in that: The bottom surface of the push rod is also provided with a guide groove protrusion, and the guide groove protrusion is embedded in the bottom end opening of the push rod through groove.

4. A circuit board turn-over mold as claimed in claim 2, characterized in that: The push rod through groove and the pushing member are processed by slow wire cutting, and the single-side spacing between the two is 0.02mm. The top bar and the top bar through groove of the carrier plate are processed by slow wire cutting, and the single-side spacing between the two is 0.02mm.

5. A circuit board turn-over mold according to any one of claims 1 to 4, characterized in that: The bottom surface of the pressing plate is also provided with a product protrusion giving way groove.

6. A circuit board turn-over mold according to any one of claims 1 to 4, characterized in that: The carrier plate of the lower mold and the pressing plate of the upper mold are also provided with mold pins and positioning grooves that cooperate with each other.

7. A circuit board turn-over mold according to any one of claims 1 to 4, characterized in that: The platform mechanism has a platform lifting assembly, which includes a lifting cylinder, a lifting plate, a mounting column and a lift bar lifting cylinder. The push plate of the lifting cylinder is arranged upward and connected to the lifting plate, so that the lifting plate moves up and down with the push plate of the lifting cylinder. The lifting plate is provided with a mounting column and a lift bar lifting cylinder. The lower mold of the bag turning mold is arranged on the mounting column, and the lift bar lifting cylinder is arranged on the lifting plate below the corresponding lower mold and its push rod is arranged upward.

8. A circuit board flipping method using the circuit board flipping mold according to claim 1, characterized in that: The following steps are involved: Step A: Position the circuit board to be flipped on the carrier plate of the lower mold; Step B: The carrier mechanism lifts up the lower mold to close the upper mold with the lower mold; Step C: The platform mechanism lifts up the top bar of the lower mold, and the top bar passes through the carrier plate to push the flipping part of the product into the push rod groove and the hot pressing groove of the pressing plate; Step D: The pushing mechanism drives the pushing member to move so that its end is close to the top strip, and the pushing member is located above the top strip and supports the middle and upper part of the product's bag turning part; Step E: The platform mechanism drives the top strip to descend and return to its original position, and the pushing mechanism drives the pushing member to continue to move forward, so that the pushing member folds the flipping part of the product onto the fitting part of the product until the hot pressing head slot of the pushing member is located below the hot pressing head; Step F: The hot pressing head is pressed downward, and the bottom end of the hot pressing head passes through the hot pressing groove of the pressing plate and the hot pressing head groove of the pushing member to hot press the turned-over part of the product onto the fitting part of the product; Step G: The hot pressing head rises and returns to its original position, and the pushing mechanism drives the pushing member to retreat and return to its original position; Step H: The carrier mechanism drives the lower mold to descend and return to its original position, and the upper mold is separated from the lower mold.

Images