A packaged chip testing device and application method thereof

Abstract

The present invention provides a packaged chip testing device and an application method thereof. After the first material moving module extracts the chip to be tested from the loading unit, it first undergoes the gold wire spacing detection of the first chip detection CCD module. After ensuring that the incoming material is normal, the chip to be tested is placed on the test fixture for performance testing. After the performance test, the second material moving module extracts the chip to be tested and first undergoes the gold wire spacing detection of the second chip detection CCD module. It is judged again whether the gold wire of the chip is damaged during the test process. After ensuring that it is normal, the qualified chip is placed on the good product tray, and the chips that fail the test and the gold wire spacing detection are placed on the defective product tray, so as to realize automatic test judgment in each link, improve test efficiency, and make the control of defective products more accurate and highly automated. The detection and positioning of the material tray to be tested by the material tray detection CCD module ensures that the first material moving module grabs accurately; the detection and positioning of the chip to be tested by the test fixture detection CCD module ensures that the position of the chip to be tested is normal.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing equipment, and in particular relates to a packaged chip testing equipment and an application method thereof. Background Art

[0002] Packaged chips are currently entering a period of rapid development, and there is a strong demand for them in all walks of life. Automated testing equipment for packaged chips is of great significance to the research and development and production of packaged chips. The main task of automated testing equipment is to test the working status and related performance of packaged chips. With the continuous increase in chip production, more and more testing needs have become the need to test each chip. This demand has caused the testing cost to account for a larger proportion of the chip production cost. The testing cost is very high, and the current testing equipment is not accurate in locating the cause of the defect, and it is impossible to accurately determine at which link the abnormality occurs. The control of defective products is not accurate enough, and the degree of automation is not high. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art and to provide a packaged chip testing device and an application method thereof, so as to solve the problems in the prior art of low efficiency of packaged chip testing, inaccurate control of defective products, and low degree of automation.

[0004] In a first aspect, the present invention provides a packaged chip testing device, comprising a base, a first material moving module, a second material moving module, a loading unit, a unloading unit, a test fixture, a first chip detection CCD module, a defective incoming material placement tray, and a second chip detection CCD module. The first material moving module, the second material moving module, the loading unit, the unloading unit, the test fixture, the first chip detection CCD module, and the second chip detection CCD module are all arranged above the base. The loading unit is used to provide a material tray to be tested, on which the chip to be tested is placed. The first material moving module is used to grab the chip to be tested on the material tray to be tested and place the chip to be tested on the test fixture. The first chip detection CCD module is used to perform gold wire spacing on the chip to be tested before the chip to be tested is moved to the test fixture. Detection, the defective incoming material placement tray is used to place the unqualified chips to be tested after being detected by the first chip detection CCD module, the test fixture is used to perform performance test on the qualified chips to be tested after being detected by the first chip detection CCD module, the second material transfer module is used to grab the chips to be tested on the test fixture and place them on the unloading unit, the second chip detection CCD module is used to perform gold wire spacing detection on the chips to be tested before the chips to be tested are moved to the unloading unit, the unloading unit includes a defective product tray and a good product tray, the defective product tray is used to place the unqualified chips to be tested after being detected by the second chip detection CCD module, and the good product tray is used to place the qualified chips to be tested after being detected by the second chip detection CCD module, and the number of the test fixture is at least one.

[0005] Furthermore, it also includes a tray detection CCD module, which is arranged above the tray to be tested, and is used to detect and locate the tray to be tested. The first material moving module grabs the chip to be tested on the tray to be tested according to the positioning information fed back by the tray detection CCD module.

[0006] Furthermore, it also includes a test fixture detection CCD module, which is arranged above the test fixture and is used to detect and position the chip to be tested on the test fixture.

[0007] Furthermore, it also includes an empty tray detection CCD module, which is arranged above the good product tray, and the empty tray detection CCD module is used to detect and locate the good product tray. The second material transfer module places the chip to be tested on the good product tray according to the positioning information fed back by the empty tray detection CCD module.

[0008] Furthermore, it also includes several image acquisition cards and several processors. The test fixture includes a base plate and a cover plate. The cover plate can be movably covered on the base plate. Several chip slots are provided in the base plate. The chip slots are used to place the chips to be tested. Each of the chip slots is connected to a corresponding image acquisition card, and each of the image acquisition cards is connected to a corresponding processor.

[0009] Furthermore, the test fixture also includes a heating unit, which is arranged under the bottom plate and is used to heat the chip slot of the bottom plate.

[0010] In a second aspect, the present invention provides an application method applied to the above-mentioned packaged chip testing equipment, wherein the first material moving module grabs the chip to be tested from the material tray to be tested of the loading unit, and the chip to be tested passes through the first chip detection CCD module, and the first chip detection CCD module performs gold wire spacing detection on the bottom of the chip to be tested and makes a qualified judgment on the gold wire spacing, and the first material moving module places unqualified chips to be tested on the bad incoming material placement tray, and places qualified chips to be tested on the test fixture;

[0011] The test fixture performs performance testing on the chip to be tested, and determines the qualified status of each chip to be tested in the same test fixture by combining the performance test judgment of at least one technical indicator among the single photoreceptor defect detection time not exceeding 200s, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitivity reaction detection detection time, and dark current detection;

[0012] According to the qualified status of each chip to be tested in the test fixture, the second material moving module extracts the chip to be tested that fails the test and places it on the defective product tray. The second material moving module extracts the chip to be tested that passes the test and passes it through the second chip detection CCD module. The second chip detection CCD module performs gold wire spacing detection on the chip to be tested and makes a qualified judgment on the gold wire spacing. The second material moving module places the unqualified chip to be tested on the defective product tray, and places the qualified chip to be tested on the good product tray.

[0013] Furthermore, before the first material moving module grabs the chip to be tested from the material tray to be tested of the loading unit, the material tray detection CCD module detects and locates the material tray to be tested, and determines whether each chip position on the material tray to be tested is equipped with a chip to be tested. The material tray detection CCD module sends the positioning information to the first material moving module, and the first material moving module grabs the chip to be tested on the material tray to be tested according to the positioning information fed back by the material tray detection CCD module;

[0014] Before the second material moving module places the qualified chips to be tested on the good product tray, the empty tray detection CCD module detects and locates the good product tray to determine whether each chip position on the good product tray is empty. The empty tray detection CCD module sends the positioning information to the second material moving module, and the second material moving module places the chips to be tested on the empty positions of the good product tray according to the positioning information fed back by the empty tray detection CCD module.

[0015] Furthermore, after the first material transfer module places the chip to be tested on the test jig, the test jig detection CCD module detects and locates the chip to be tested on the test jig, detects and determines whether there is a chip to be tested on the chip slot of the test jig, and determines whether the chip to be tested is offset. If the chip to be tested on the chip slot is offset, the control buzzer emits a warning sound.

[0016] Furthermore, when the test fixture is testing the chip to be tested, the chip slot of the bottom plate of the test fixture is heated by the heating unit to make the test temperature within the range of 38 to 48°C.

[0017] Beneficial effects of the present invention:

[0018] The present invention provides a packaged chip testing device and an application method thereof. After a first material moving module extracts a chip to be tested from a loading unit, the chip is first subjected to a gold wire spacing detection by a first chip detection CCD module. After ensuring that the incoming material is normal, the chip to be tested is placed on a test fixture for performance testing. After the performance test, a second material moving module extracts the chip to be tested and first subjected to a gold wire spacing detection by a second chip detection CCD module. It is judged again whether the gold wire of the chip is damaged during the test process. After ensuring that everything is normal, qualified chips are placed on a good product tray, and chips that fail the test and the gold wire spacing detection are placed on a defective product tray, thereby realizing automatic test judgment in each link, improving test efficiency, and making defective product management and control more accurate with a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of a packaged chip testing device of the first embodiment at a viewing angle.

[0021] Figure 2 It is a schematic diagram of the overall structure of a packaged chip testing device of the first embodiment from another perspective.

[0022] Figure 3 It is a schematic diagram of the overall structure of a test fixture in a packaged chip testing device of the first embodiment of the present invention. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0025] Embodiment 1:

[0026] Reference Figures 1 to 3 Embodiment 1 provides a packaged chip testing device, comprising a base 10, a first material moving module 11, a second material moving module 12, a loading unit 2, a unloading unit 3, a test fixture 4, a first chip detection CCD module 51, a bad incoming material placement tray 6, and a second chip detection CCD module 52, wherein the first material moving module 11, the second material moving module 12, the loading unit 2, the unloading unit 3, the test fixture 4, the first chip detection CCD module 51, and the second chip detection CCD module 52 are all arranged above the base 10, wherein the first material moving module 11 and the second material moving module 12 are fixedly connected to the first material moving module 11 and the second material moving module 12. On a fixed frame 13, and under the action of a linear motor, it moves along the crossbar part of the first fixed frame 13, thereby realizing the reciprocating movement of the first material moving module 11 between the loading unit 2, the first chip detection CCD module 51 and the test fixture 4, and realizing the reciprocating movement of the second material moving module 12 between the test fixture 4, the second chip detection CCD module 52 and the unloading unit 3; on the base 10, the loading unit 2, the first chip detection CCD module 51, the test fixture 4, the second chip detection CCD module 52 and the unloading unit 3 are arranged in sequence from left to right, and the entire test material moving process is also from left to right.

[0027] The loading unit 2 is used to provide a material tray to be tested, on which the chip to be tested is placed. The first material moving module 11 is used to grab the chip to be tested on the material tray to be tested and place the chip to be tested on the test fixture 4. The first chip detection CCD module 51 is used to perform gold wire spacing detection on the chip to be tested before the chip to be tested is moved to the test fixture 4. Since the first material moving module 11 grabs the chip to be tested from top to bottom, the first chip detection CCD module 51 shoots the chip to be tested from bottom to top. This step does not require flipping the chip to be tested, and the gold wire spacing detection can be completed during the material moving process. The defective incoming material placement tray 6 is used to place unqualified chips to be tested after being detected by the first chip detection CCD module 51. In order to improve the accuracy of defective product control, the incoming chips to be tested must also undergo gold wire spacing detection by the first chip detection CCD module 51 before they can flow to the test fixture 4, so as to determine whether the abnormal condition of the chip to be tested occurs in the incoming material link or the test link.

[0028] The test fixture 4 is used to perform performance tests on the qualified chips to be tested after being tested by the first chip detection CCD module 51. The second material moving module 12 is used to grab the chips to be tested on the test fixture 4 and place them on the unloading unit 3. The second chip detection CCD module 52 is used to perform gold wire spacing detection on the chips to be tested before the chips to be tested are moved to the unloading unit 3. Since the second material moving module 12 grabs the chips to be tested from top to bottom, the second chip detection CCD module 52 shoots the chips to be tested from bottom to top. This step does not require flipping the chips to be tested, and the gold wire spacing detection can be completed during the material moving process. The unloading unit 3 includes a defective product tray 31 and a good product tray 32. The defective product tray 31 is used to place the defective product trays that have been tested by the first chip detection CCD module 51. The good product tray 32 is used to place the chips to be tested that are unqualified after the detection by the second chip detection CCD module 52. In order to improve the accuracy of defective product control, for the chips to be tested after the test fixture 4 is tested, good products and defective products have been distinguished from this batch of chips to be tested. This distinction is caused by the test fixture 4. The defective chips to be tested will also be placed on the defective product tray 31. For the good products produced in this link, after passing through the second chip detection CCD module 52, the good products and defective products in this link will also be distinguished. The defective products in this link are mainly distinguished by gold wire spacing detection, and this part of the defective products will also be placed on the defective product tray 31.

[0029] There are two test jigs 4, the first test jig 4 is on the left, and the second test jig 4 is on the right. The first material moving module 11 first places the chip to be tested on the first test jig 4. During the testing process of the first test jig 4, the first material moving module 11 places the chip to be tested on the second test jig 4. When the first test jig 4 completes the test, the second material moving module 12 takes the chip to be tested on the first test jig 4 away, and then the first test jig 4 places the chip to be tested on the first test jig 4 again, and so on. The material is automatically taken in and out to improve the material moving efficiency.

[0030] Among them, the first material moving module 11 includes a first vertical moving unit, a first fixed plate and six extraction units, the six extraction units are arranged side by side with the first fixed plate, and the first fixed plate is connected to the first fixed frame 13 through the first vertical moving unit. The second material moving module 12 includes a second vertical moving unit, a second fixed plate and six extraction units, the six extraction units are arranged side by side with the second fixed plate, and the second fixed plate is connected to the first fixed frame 13 through the second vertical moving unit. The extraction units on the first material moving module 11 and the second material moving module 12 are respectively moved on the vertical Z axis by the first vertical moving unit and the second vertical moving unit, thereby realizing the grabbing and putting down of the chip to be tested.

[0031] It should be noted that for the loading unit 2, when the photoelectric sensor on the material rack to be tested senses that there is a material tray to be tested on the material rack to be tested, the tray to be tested moves to the set positioning "lower tray to be tested", the lower tray bracket of the material rack to be tested is first lifted to the "high position", the supporting cylinder is released so that the material tray to be tested is out of contact with the supporting cylinder clamp, the lower tray bracket drops to the "middle position", the supporting cylinder is closed to separate the stacked material trays to be tested, the lower tray bracket continues to drop to the "low position", the material tray to be tested remains on the pallet to be tested, and the clamping cylinder on the pallet to be tested is actuated to clamp the material tray to be tested, and the loading action of the material rack to be tested is completed. The working principle of the unloading unit 3 is similar to that of the loading unit 2, but the order is reversed.

[0032] Reference Figure 1 and Figure 2 In the present embodiment, the packaged chip testing equipment further comprises a tray detection CCD module 53, wherein the tray detection CCD module 53 is arranged above the tray to be tested, and the tray detection CCD module 53 is used to detect and locate the tray to be tested, and the first material moving module 11 grabs the chip to be tested on the tray to be tested according to the positioning information fed back by the tray detection CCD module 53. The tray detection CCD module 53 can accurately determine which position in the tray to be tested has the chip to be tested and which position is empty. According to this positioning information, the first material moving module 11 can accurately grab the chip to be tested on the tray to be tested.

[0033] In this embodiment, the packaged chip testing equipment also includes a test jig detection CCD module 54, which is arranged above the test jig 4. The test jig detection CCD module 54 is used to detect and locate the chip to be tested on the test jig 4, detect and determine whether there is a chip to be tested on the chip slot of the test jig 4, and determine whether the chip to be tested is offset. If the chip to be tested on the chip slot is offset, the buzzer is controlled to emit a warning sound.

[0034] In this embodiment, the packaged chip testing equipment also includes an empty tray detection CCD module 55, and the empty tray detection CCD module 55 is arranged above the good product tray 32. The empty tray detection CCD module 55 is used to detect and locate the good product tray 32. The second material transfer module 12 places the chip to be tested on the good product tray 32 according to the positioning information fed back by the empty tray detection CCD module 55. The empty tray detection CCD module 55 can accurately determine whether each chip position on the good product tray 32 is empty, and distinguish which positions can be used to place the chip to be tested, so as to facilitate the second material transfer module 12 to accurately place the chip to be tested.

[0035] It should be noted that the tray detection CCD module 53, the test fixture detection CCD module 54 and the empty tray detection CCD module 55 are all fixedly connected to the second fixed frame 14, and the tray detection CCD module 53, the test fixture detection CCD module 54 and the empty tray detection CCD module 55 are respectively driven by the linear motor to move linearly along the crossbar of the second fixed frame 14. This linear motor realizes the horizontal X-axis movement of the tray detection CCD module 53, the test fixture detection CCD module 54 and the empty tray detection CCD module 55, that is, the tray detection CCD module 53 is horizontally moved to the top of the tray to be tested and detects and positions, the test fixture detection CCD module 54 is horizontally moved to the top of the test fixture 4 and detects and positions, and the empty tray detection CCD module 55 is horizontally moved to the top of the good product tray 32 and detects and positions.

[0036] Reference Figure 3 As an implementation mode, the packaged chip testing equipment further includes a plurality of image acquisition cards and a plurality of processors. The test fixture 4 includes a base plate 41 and a cover plate 42. The cover plate 42 can be movably covered on the base plate 41. The base plate 41 is provided with a plurality of chip slots for placing the chip to be tested. When the chip to be tested is placed in the chip slot, the cover plate 42 is controlled to be covered down so that the space where the chip to be tested is located is relatively closed. Each of the chip slots is connected to a corresponding image acquisition card, and each of the image acquisition cards is connected to a corresponding processor. The processor, the image acquisition card and the chip slot constitute a hardware combination for testing the performance of the chip to be tested. When the test is completed, the cover plate 42 is controlled to be opened so that the second material transfer module 12 can take out the chip to be tested.

[0037] As an embodiment, the test fixture 4 also includes a heating unit 43, and the heating unit 43 is arranged under the base plate 41. The heating unit 43 is used to heat the chip slot of the base plate 41. Through the heating of the heating unit 43, the test performance of the chip to be tested at different temperatures is simulated to provide a more realistic test environment.

[0038] Embodiment 2:

[0039] This embodiment provides an application method for the packaged chip testing equipment in Embodiment 1, wherein the first material moving module 11 grabs the chip to be tested from the material tray to be tested of the loading unit 2, and the chip to be tested passes through the first chip detection CCD module 51, and the first chip detection CCD module 51 performs a gold wire spacing detection on the bottom of the chip to be tested, and makes a qualified judgment on the gold wire spacing, and the first material moving module 11 places unqualified chips to be tested on the bad incoming material placement tray 6, and places qualified chips to be tested on the test fixture 4;

[0040] The test fixture 4 performs a performance test on the chip to be tested, and determines the qualified status of each chip to be tested in the same test fixture 4 by combining the performance test judgment of at least one technical indicator among the single photoreceptor defect detection time not exceeding 200s, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitivity reaction detection detection time, and dark current detection. Of course, the detection items can also include all of the above contents, and other test items can also be added;

[0041] According to the qualified status of each chip to be tested in the test fixture 4, the second material transfer module 12 extracts the chip to be tested that fails the test and places it on the defective product tray 31. The second material transfer module 12 extracts the chip to be tested that passes the test and passes it through the second chip detection CCD module 52. The second chip detection CCD module 52 performs gold wire spacing detection on the chip to be tested and makes a qualified judgment on the gold wire spacing. The second material transfer module 12 places the unqualified chip to be tested on the defective product tray 31, and places the qualified chip to be tested on the good product tray 32.

[0042] It should be noted that before the test, the engineering control software ProH and the visual software VisionMaster are opened, and the operator uses a scanner to scan the chip product batch number into the industrial control software. The PLC subroutine "waferID" in the industrial control software determines the correctness of the current batch number. If the batch number is correct, the subsequent program will be executed, otherwise it will stop and alarm. After the batch number is correct, the operator will put the test tray with a certain number of chips to be tested into the test rack, and at the same time, put a certain number of good product trays 32 into the rack of the unloading unit 3. After the preparation is completed, you can press the "Start" button to let the test equipment operate normally.

[0043] When the back image of the chip is tested for the gold line spacing, the back image of the chip is sent to VsionMaster for gold line spacing detection and judgment. Different CCD modules are set differently in VsionMaster.

[0044] In this embodiment, before the first material moving module 11 grabs the chip to be tested from the material tray to be tested of the loading unit 2, the material tray detection CCD module 53 detects and locates the material tray to be tested, and determines whether each chip position on the material tray to be tested is equipped with a chip to be tested. The material tray detection CCD module 53 sends the positioning information to the first material moving module 11, and the first material moving module 11 grabs the chip to be tested on the material tray to be tested according to the positioning information fed back by the material tray detection CCD module 53;

[0045] Before the second material transfer module 12 places the qualified chip to be tested on the good product tray 32, the empty tray detection CCD module 55 detects and locates the good product tray 32 to determine whether each chip position on the good product tray 32 is empty. The empty tray detection CCD module 55 sends the positioning information to the second material transfer module 12. The second material transfer module 12 places the chip to be tested on the empty position of the good product tray 32 according to the positioning information fed back by the empty tray detection CCD module 55.

[0046] In this embodiment, after the first material transfer module 11 places the chip to be tested on the test fixture 4, the test fixture detection CCD module 54 detects and locates the chip to be tested on the test fixture 4, detects and determines whether there is a chip to be tested on the chip slot of the test fixture 4, and determines whether the chip to be tested is offset. If the chip to be tested on the chip slot is offset, the control buzzer sends a warning sound, and the buzzer makes a "beep beep" sound to prompt the operator. Only after the operator eliminates the chip error can the equipment resume normal operation.

[0047] In this embodiment, when the test fixture 4 tests the chip to be tested, the test fixture 4 can set the light source brightness, light source times, etc. through the control interface, and can also control the heating unit 43 to heat the chip slot of the bottom plate 41 of the test fixture 4 to make the test temperature within the range of 38 to 48°C, thereby simulating the test performance of the chip to be tested at different temperatures and providing a more realistic test environment.

[0048] Compared with the prior art, the present invention provides a packaged chip testing device and an application method thereof. After the first material moving module 11 extracts the chip to be tested from the loading unit 2, it first passes through the gold wire spacing detection of the first chip detection CCD module 51 to ensure that the incoming material is normal, and then the chip to be tested is placed on the test fixture 4 for performance testing. After the performance test, the second material moving module 12 extracts the chip to be tested and first passes through the gold wire spacing detection of the second chip detection CCD module 52 to determine again whether the gold wire of the chip is damaged during the test process. After ensuring that it is normal, the qualified chip is placed on the good product tray 32, and the chips that fail the test and the gold wire spacing detection are placed on the defective product tray 31, so as to realize automatic test judgment in each link, improve test efficiency, and make the control of defective products more accurate with a high degree of automation.

[0049] Finally, it should be emphasized that the present invention is not limited to the above-mentioned implementation mode. The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaged chip testing device, characterized in that: The invention comprises a base, a first material moving module, a second material moving module, a loading unit, a unloading unit, a test fixture, a first chip detection CCD module, a tray for placing defective incoming materials, and a second chip detection CCD module. The first material moving module, the second material moving module, the loading unit, the unloading unit, the test fixture, the first chip detection CCD module, and the second chip detection CCD module are all arranged above the base. The loading unit is used to provide a tray for testing, on which the chip to be tested is placed. The first material moving module is used to grab the chip to be tested on the tray for testing and place the chip to be tested on the test fixture. The first chip detection CCD module is used to perform gold wire spacing detection on the chip to be tested before the chip to be tested is moved to the test fixture. The tray for placing defective incoming materials is used to detect the spacing between the gold wires of the chip to be tested. The tray is used to place the unqualified chips to be tested after being detected by the first chip detection CCD module, the test fixture is used to perform performance test on the qualified chips to be tested after being detected by the first chip detection CCD module, the second material moving module is used to grab the chips to be tested on the test fixture and place them on the unloading unit, the second chip detection CCD module is used to perform gold wire spacing detection on the chips to be tested before the chips to be tested are moved to the unloading unit, the unloading unit includes a defective product tray and a good product tray, the defective product tray is used to place the unqualified chips to be tested after being detected by the second chip detection CCD module, and the good product tray is used to place the qualified chips to be tested after being detected by the second chip detection CCD module, and the number of the test fixture is at least one; It also includes a tray detection CCD module, which is arranged above the tray to be tested, and is used to detect and locate the tray to be tested, and the first material moving module grabs the chip to be tested on the tray to be tested according to the positioning information fed back by the tray detection CCD module; It also includes a test fixture detection CCD module, which is arranged above the test fixture and is used to detect and locate the chip to be tested on the test fixture; It also includes an empty tray detection CCD module, which is arranged above the good product tray and is used to detect and locate the good product tray. The second material transfer module places the chip to be tested on the good product tray according to the positioning information fed back by the empty tray detection CCD module. It also includes a plurality of image acquisition cards and a plurality of processors. The test fixture includes a base plate and a cover plate. The cover plate can be movably covered on the base plate. The base plate is provided with a plurality of chip slots. The chip slots are used to place the chips to be tested. Each of the chip slots is connected to a corresponding image acquisition card, and each of the image acquisition cards is connected to a corresponding processor. The test fixture further includes a heating unit, which is disposed under the bottom plate and is used to heat the chip slot of the bottom plate.

2. An application method for the packaged chip testing device according to claim 1, characterized in that: The first material moving module grabs the chip to be tested from the material tray to be tested of the loading unit, and the chip to be tested passes through the first chip detection CCD module, and the first chip detection CCD module performs a gold wire spacing detection on the bottom of the chip to be tested, and makes a qualified judgment on the gold wire spacing, and the first material moving module places the unqualified chip to be tested on the bad incoming material placement tray, and places the qualified chip to be tested on the test fixture; The test fixture performs performance testing on the chip to be tested, and determines the qualified status of each chip to be tested in the same test fixture by combining the performance test judgment of at least one technical indicator among the single photoreceptor defect detection time not exceeding 200s, image distortion, modulation conversion detection, black and white point detection, stain detection, fixed point noise detection, noise ratio, dynamic range detection, color and photosensitivity reaction detection detection time, and dark current detection; According to the qualified status of each chip to be tested in the test fixture, the second material moving module extracts the chip to be tested that fails the test and places it on the defective product tray. The second material moving module extracts the chip to be tested that passes the test and passes it through the second chip detection CCD module. The second chip detection CCD module performs gold wire spacing detection on the chip to be tested and makes a qualified judgment on the gold wire spacing. The second material moving module places the unqualified chip to be tested on the defective product tray, and places the qualified chip to be tested on the good product tray. Before the first material moving module grabs the chip to be tested from the material tray to be tested of the loading unit, the material tray detection CCD module detects and locates the material tray to be tested, and determines whether each chip position on the material tray to be tested is equipped with a chip to be tested. The material tray detection CCD module sends the positioning information to the first material moving module, and the first material moving module grabs the chip to be tested on the material tray to be tested according to the positioning information fed back by the material tray detection CCD module; Before the second material transfer module places the qualified chips to be tested on the good product tray, the empty tray detection CCD module detects and locates the good product tray to determine whether each chip position on the good product tray is empty. The empty tray detection CCD module sends the positioning information to the second material transfer module, and the second material transfer module places the chips to be tested on the empty positions of the good product tray according to the positioning information fed back by the empty tray detection CCD module. After the first material transfer module places the chip to be tested on the test fixture, the test fixture detection CCD module detects and locates the chip to be tested on the test fixture, detects and determines whether there is a chip to be tested on the chip slot of the test fixture, and determines whether the chip to be tested is offset. If the chip to be tested on the chip slot is offset, the control buzzer emits a warning sound; When the test fixture is testing the chip to be tested, the chip slot of the bottom plate of the test fixture is heated by the heating unit to make the test temperature within the range of 38 to 48°C.

Images