A separation device and separation method for silicon wafer inserter

Abstract

The present invention provides a separation device for a silicon wafer inserter and a separation method thereof, including a clip mechanism, a spray mechanism and a negative pressure mechanism. The clip mechanism is a slot-shaped structure with a single-side opening, and the bottom surface of the clip mechanism is arranged parallel to the silicon wafer; the spray mechanism is placed on one side of the clip mechanism opening and is arranged perpendicular to the silicon wafer; the negative pressure mechanism is placed directly above the clip mechanism; wherein the spray mechanism includes a spray column arranged in a counter-positioned manner, and a plurality of water spray holes are arranged on the spray column, and the water sprayed from the water spray holes on both sides is arranged toward the middle axis of the moving direction of the silicon wafer, and the water spray holes are arranged downwardly with respect to the upper end surface of the silicon wafer. The separation device of the present invention solves the technical problem that stacking is easy to occur during the separation of the inserter in the prior art, resulting in a high silicon wafer breakage rate. It has a simple structure, high separation efficiency and good reliability, and can evenly separate large-sized silicon wafers, ensure the quality of silicon wafers, and improve the silicon wafer yield rate.

Description

Technical Field

[0001] The invention belongs to the technical field of solar monocrystalline silicon wafer inserting, and in particular relates to a separation device for a silicon wafer inserting machine and a separation method thereof. Background Art

[0002] After the monocrystalline silicon round rod is squared and peeled, it is cut, debonded, inserted, cleaned, dried and tested in sequence to finally obtain the monocrystalline silicon wafer. The existing inserting machines are all automatic inserting. In the inserting process, the silicon wafer separation device is the core mechanism of the silicon wafer inserting automation, which directly affects the work quality and work efficiency of the silicon wafer inserting. Solar silicon wafers are gradually developing towards larger sizes and thinner slices. It is easy to separate small-sized silicon wafers, but for large-sized silicon square wafers with a diameter of 270-300mm and a side length of 190-210mm, the thickness is only 150-200μm. Due to the large area of ​​adhesion between the upper and lower silicon wafers, traditional equipment cannot separate the silicon wafers evenly, resulting in frequent stacking when conveying to the next process, causing serious damage to the silicon wafers. The equipment needs to be frequently stopped for manual separation, resulting in reduced product quality and low work efficiency, which cannot adapt to the existing mass production scale. Summary of the invention

[0003] The present invention provides a separation device for a silicon wafer inserter and a separation method thereof, which are particularly suitable for large-size silicon square wafers with a diameter of 270-300 mm, a side length of 190-210 mm, and a thickness of 150-200 μm. The device solves the technical problem in the prior art that wafer overlap is easily caused during wafer separation, resulting in a high silicon wafer breakage rate, thereby ensuring the quality of the silicon wafers and improving the efficiency and reliability of silicon wafer separation.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A separation device for a silicon wafer inserter comprises a clip mechanism for placing a horizontal silicon wafer, a spray mechanism for separating the silicon wafer, and a negative pressure mechanism for adsorbing the separated silicon wafer, wherein the clip mechanism is a slot-shaped structure with a single-side opening, and the bottom surface of the clip mechanism is arranged parallel to the silicon wafer; the spray mechanism is arranged on one side of the opening of the clip mechanism and is arranged perpendicular to the silicon wafer; the negative pressure mechanism is arranged directly above the clip mechanism; wherein the spray mechanism comprises a spray column arranged in a counter-positioned manner, and a plurality of water spray holes are arranged on the spray column, and the water sprayed from the water spray holes on both sides is arranged toward the middle axis of the moving direction of the silicon wafer, and the water spray holes are arranged obliquely downward relative to the upper end surface of the silicon wafer.

[0006] Furthermore, two vertically arranged rows of water spray holes are provided on the spray column, and the number of water spray holes in each row is two. The angles formed by the water spray holes with the upper end surface of the silicon wafer increase from top to bottom, and the angle is 10-25°; each water spray hole in each row of water spray holes forms the same angle with the upper end surface of the silicon wafer.

[0007] Furthermore, the number of the water spray holes in each column is four, and the angles formed by the water spray holes and the silicon wafer are 10°, 15°, 20° and 25° respectively.

[0008] Furthermore, the water spray holes are evenly arranged on the same wall surface of the spray column, the water spray holes are placed in the height direction of the spray column and are arranged in the same row and in parallel; the water spray holes have the same hole diameter and hole depth.

[0009] Furthermore, the spray column is a vertically arranged polygonal structure, and the side surface where the water spray hole is located is inclined and forms an acute angle of 30-60° with the moving direction of the silicon wafer.

[0010] Furthermore, a water hole is provided on the top surface of the spray column, the water hole is arranged along the height direction of the spray column, and the water hole is communicated with the water spray hole.

[0011] Furthermore, the clip mechanism includes a bottom plate and vertical plates arranged along three side end surfaces of the bottom plate, and the height of the vertical plates is greater than the height of the injection column; the silicon wafer moves outward along the opening of the bottom plate.

[0012] Furthermore, the lower end surfaces of adjacent injection columns are fixed on a horizontally arranged support plate, and the injection columns are connected to the base plate via a connecting frame.

[0013] Furthermore, the negative pressure mechanism includes a horizontally arranged negative pressure plate and roller assemblies placed on both sides of the negative pressure plate, and the roller assemblies are arranged along the length direction of the negative pressure plate; adsorption holes and connecting pipes are provided on the negative pressure plate, and the adsorption holes are interconnected with the connecting pipes.

[0014] A separation method for a separation device for a silicon wafer inserter, using the separation device as described in any of the above items, placing a stack of silicon wafers on the clip mechanism, and using the aligned water spray holes to spray water toward the edge on the side close to the moving direction of the silicon wafers, so that the silicon wafer located at the top is separated from the other silicon wafers; and then using the adsorption mechanism to completely separate the separated silicon wafer from the silicon wafer below it.

[0015] The separation device and separation method designed by the present invention are particularly suitable for large-sized silicon square wafers with a diameter of 270-300 mm, a side length of 190-210 mm, and a thickness of 150-200 μm. ... BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of a large-size silicon wafer;

[0017] Figure 2 It is a three-dimensional diagram of a separation device for a silicon wafer inserter according to an embodiment of the present invention;

[0018] Figure 3 is a top view of a separation device according to an embodiment of the present invention;

[0019] Figure 4 is a cross-sectional view taken along line AA of an embodiment of the present invention;

[0020] Figure 5 It is a side view of the relative position of the water spray hole and the silicon wafer according to one embodiment of the present invention.

[0021] In the figure:

[0022] 10. Silicon wafer 20. Clip mechanism 21. Bottom plate

[0023] 22. vertical plate 30. spray mechanism 31. spray column

[0024] 32. Water spray hole 33. Water spray hole 34. Water spray hole

[0025] 35. Spray hole 36. Water hole 37. Support plate

[0026] 38. Connecting column 40. Negative pressure mechanism 41. Negative pressure plate

[0027] 42. Roller assembly 43. Adsorption hole 44. Connecting pipe DETAILED DESCRIPTION

[0028] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The structure of the solar silicon wafer 10 is as follows Figure 1As shown, the silicon wafer 10 is a square silicon wafer, and chamfers are provided at the connection of the four straight sides of the silicon wafer 10, and the chamfer angle is 45°; the diameter of the circle where the silicon wafer 10 is located is 270-300mm, the side length of the silicon wafer 10 is 190-210mm, and the thickness is 150-200μm. When inserting the wafer, due to the large area of ​​adhesion between the silicon wafers, it is not easy to be separated, and the phenomenon of stacking is easy to occur. The present invention designs a separation device dedicated to the inserting machine for this large-sized silicon wafer 10. Through the separation device, not only the technical problem of stacking easily when inserting and separating the wafers in the prior art is solved, but also the product quality of the silicon wafer 10 can be guaranteed. The separation device has a simple structure, high separation efficiency and good reliability, and can make large-sized silicon wafers 10 evenly separated, thereby improving the yield rate of silicon wafers.

[0030] The present invention provides a separation device for a silicon wafer inserter, such as Figure 2 As shown, it includes a clamping mechanism 20 for placing a horizontal silicon wafer 10, an injection mechanism 30 for separating the silicon wafer 10, and a negative pressure mechanism 40 for adsorbing the separated silicon wafer 10, wherein the clamping mechanism 20 is a slot-type structure with a single-side opening, and the bottom surface of the clamping mechanism 20 and the silicon wafer 10 are both horizontally arranged; the injection mechanism 30 is arranged on the opening side of the clamping mechanism 20 and is vertically arranged with the silicon wafer 10 arranged in the clamping mechanism 20; the negative pressure mechanism 40 is arranged directly above the clamping mechanism 20. The clamping mechanism 20, the spraying mechanism 30, the negative pressure mechanism 40 and the silicon wafer 10 are all placed in the water in the wafer inserter, the silicon wafer 10 is stacked on the lower end surface of the clamping mechanism 20, and the spraying mechanism 30 is placed at a certain distance in front of the silicon wafer 10. Preferably, the spraying mechanism 30 is arranged 2-3 cm in front of the silicon wafer 10; the spraying mechanism 30 is arranged on both sides in front of the silicon wafer 10, and the high-pressure water flow sprayed from the spraying mechanism 30 is sprayed directly at the front end edge of the silicon wafer 10, and the water flow sprayed from the spraying mechanism 30 forms a certain angle with the upper end surface of the silicon wafer 10, and the angle is 10-25°, which includes the height of 10-15 vertically stacked silicon wafers 10. The pressurized water flows through the water spray holes at the bevels on both sides and is ejected at high speed corresponding to the front end edge of the silicon wafer 10, so that the silicon wafers 10 are separated one by one without damage. At the same time, the high-speed water flow can wash away the cutting fluid and impurities on the surface of the silicon wafer 10 and clean the silicon wafer 10. The separated silicon wafers 10 are simultaneously adsorbed by the negative pressure mechanism 40 placed above, so that the uppermost silicon wafer 10 is completely separated from the silicon wafer 10 below, and the separated silicon wafers are transmitted to the water surface through the transmission device arranged on the epitaxial part of the separation device and inserted into the flower basket.

[0031] Specifically, Figure 2As shown, the clip mechanism 20 includes a bottom plate 21 and a vertical plate 22 arranged vertically along the three side end surfaces of the bottom plate 21. The length of the bottom plate 21 is greater than the side length of the silicon wafer 10, and the width of the bottom plate 21 is adapted to the width of the silicon wafer 10. A spring clip of any kind is also arranged in the middle position of the bottom plate 21. This is common knowledge in the art and is omitted in the figure. The silicon wafer 10 is placed above the spring clip. The silicon wafer 10 can automatically move vertically upward with the spring clip to ensure that the relative position of the injection mechanism 30 and the silicon wafer 10 remains unchanged. The height of the vertical plate 21 is greater than the height of the injection column 31 in the injection mechanism 30. Among them, the silicon wafer 10 is placed in the clip mechanism 20 and moves outward along the length direction of the vertical plate 21 along the opening of the bottom plate 21.

[0032] like Figure 2 As shown, the spray mechanism 30 includes symmetrically arranged spray columns 31, a support plate 37 connecting adjacent spray columns 31, and two connecting frames 38 respectively connecting the spray columns 31 to the bottom plate 21. The spray column 31 is a vertically arranged polygonal structure. Figure 3 As shown, the spray column 31 is a pentagonal structure, wherein the four side surfaces are planes arranged perpendicularly to each other. An inclined plane is provided at the inner corner of the spray column 31 on the side close to the silicon wafer 10. The inclined plane is perpendicular to the end face of the silicon wafer 10 and forms a certain angle with the direction of horizontal movement close to the silicon wafer. The angle is an acute angle. Preferably, the angle is 30-60°. The inclined plane is located directly in front of the silicon wafer 10, and the spray columns 31 on both sides have the same structure. A plurality of water spray holes are provided on the spray column 31, and the water spray holes are arranged on the inclined plane. Specifically, two vertically arranged rows of water spray holes are provided on the inclined plane, and each row is provided with four water spray holes. There are two water spray holes in each row, such as Figure 4 As shown, from top to bottom are water spray hole 32, water spray hole 33, water spray hole 34 and water spray hole 35, and the water flow sprayed from the water spray holes on both sides is sprayed toward the middle axis of the moving direction of the silicon wafer 10, and the water spray holes are arranged to be inclined downward relative to the upper end surface of the silicon wafer 10. During the separation process, because the connecting frame 38 is fixed to the bottom plate 21, that is, the position of the water spray holes remains unchanged, the silicon wafer 10 can automatically move vertically upward along with the spring clip at the bottom of the clip mechanism 20, ensuring that the relative position of the water spray holes and the silicon wafer 10 remains unchanged.

[0033] Further, such as Figure 5As shown, the eight water spray holes arranged on each side are evenly arranged on the same inclined side wall of the spray column 31, and the hole diameter and hole depth are the same; the eight water spray holes are all arranged in the height direction of the spray column 31 and are arranged in four rows and two columns in parallel; the water spray holes in each column are water spray hole 32, water spray hole 33, water spray hole 34 and water spray hole 35 from top to bottom, and the angle formed by the water spray holes in each column and the upper end surface of the silicon wafer 10 increases successively, and the angle is 10-25°. Each water spray hole in each row of water spray holes forms the same angle with the upper end surface of the silicon wafer. Specifically, the angles formed by water spray hole 32, water spray hole 33, water spray hole 34 and water spray hole 35 and the silicon wafer 10 are 10°, 15°, 20° and 25° respectively. That is, the angle formed by the water spray hole 32 at the top and the silicon wafer is 10°, and correspondingly, the angle formed by the water spray hole 33 and the silicon wafer 10 is 15°, the angle formed by the water spray hole 34 and the silicon wafer 10 is 20°, and the angle formed by the water spray hole 35 at the bottom and the silicon wafer 10 is 35°; the vertical hole spacing between the water spray holes 32, 33, 34 and 35 is 0.5-1cm, the hole spacing between the horizontally adjacent water spray holes is 1-1.5cm, the hole diameter is 0.8-1mm, and the hole depth is 2-5cm; the distance between the water spray hole and the front hypotenuse of the silicon wafer 10 is 2-3c At m, the water spray holes 32, 33, 34 and 35 set at the side spray not only increase the height area of ​​contact with the side of the silicon wafer, and maximize the contact with the side of the silicon wafer 10, but also can be set at different angles to further increase the water jet intensity and increase the slicing ability. The symmetrically arranged water spray holes can further ensure the stability of the spray water pressure and ensure the uniform separation of the silicon wafers. The separated silicon wafers 10 can further reduce the risk of stacking of the silicon wafers 10, improve the accuracy and reliability of silicon wafer insertion, thereby improving the yield rate, and also reduce the damage or cracks caused by stacking, thereby improving the yield rate of the silicon wafers.

[0034] Furthermore, a water hole 36 is provided on the top surface of the spray column 31. The water hole 36 is provided along the height direction of the spray column 31 and is respectively communicated with each row of the water spray holes 32, 33, 34 and 35. The externally provided high-intensity water flow passes through the water pipe to the water hole 36, and then is sprayed toward the silicon wafer 10 through each water spray hole, thereby completing the separation spraying of the silicon wafer 10.

[0035] Furthermore, the negative pressure mechanism 40 includes a horizontally arranged negative pressure plate 41 and roller assemblies 42 disposed on both sides of the negative pressure plate, the roller assembly 42 includes four symmetrically arranged rollers, and the roller assembly 42 is arranged along the length direction of the negative pressure plate 41. The negative pressure plate 41 is provided with an adsorption hole and a connecting pipe 43, one end of the adsorption hole and the connecting pipe 43 is connected to an external negative pressure device (omitted in the figure), and the other end is interconnected with the adsorption hole.

[0036] During the separation process, the injection mechanism 30 is symmetrically arranged on both sides in front of the silicon wafer 10, and the high-pressure water flow injected from the injection mechanism 30 is injected directly toward the front end edge of the silicon wafer 10, and the water flow injected from the injection mechanism 30 forms a certain angle with the upper end surface of the silicon wafer 10, and the angle is 10-25°, covering the height of a certain number of vertically stacked silicon wafers 10; the pressurized water flows through each water spray hole at the oblique angle on both sides and is ejected at high speed corresponding to the front end edge of the silicon wafer 10, so that the silicon wafers 10 are separated one by one without damage, and at the same time, the high-speed water flow can wash the cutting fluid and impurities on the surface of the silicon wafer 10, and clean the silicon wafer 10. The separated silicon wafers 10 are simultaneously adsorbed by the negative pressure mechanism 40 placed above, so that the uppermost silicon wafer 10 is completely separated from the silicon wafer 10 below, and the separated silicon wafer is transmitted to the water surface through the transmission device arranged on the epitaxial part of the separation device, and inserted into the flower basket; the other silicon wafers 10 placed in the clip mechanism 20 can automatically move vertically upward along with the spring clip at the bottom of the clip mechanism 20, ensuring that the relative position of the water spray hole and the silicon wafer 10 remains unchanged, so that the silicon wafer 10 is always located within the range covered by the water flow sprayed from the water spray hole; and then continue to repeat the above-mentioned spray separation to complete the insertion and separation of other silicon wafers 10.

[0037] The separation device designed by the present invention is particularly suitable for large-sized silicon square wafers with a diameter of 270-300mm, a side length of 190-210mm, and a thickness of 150-200μm. It can not only solve the problem of stacking, but also wash the impurities on the surface of the silicon wafers, ensure the quality of the silicon wafers inserted into the flower basket, and reduce the problem of silicon wafer breakage caused by stacking. The separation device has a simple structure, high separation efficiency and good reliability, can evenly separate large-sized silicon wafers, ensure the quality of silicon wafers, and improve the efficiency of inserting.

[0038] A separation method for a separation device for a silicon wafer inserter, using the separation device as described above, specifically comprises the following steps:

[0039] The first step is to place a stack of silicon wafers 10 in the clip mechanism 20 . Specifically, before the inserts are separated, a stack of silicon wafers 10 is placed first, and the silicon wafers 10 are placed horizontally in the clip mechanism 20 , and the silicon wafers 10 are placed on the bottom plate 21 .

[0040] Step 2: Through the eight water spray holes in two columns and four rows arranged in alignment, the water flow sprayed from the water spray holes is sprayed toward the side close to the moving direction of the silicon wafer 10, so that the silicon wafer 10 located at the top is separated from the other silicon wafers. During the spraying process, the water spray holes in each column are water spray holes 32, water spray holes 33, water spray holes 34 and water spray holes 35 from top to bottom, and the angle formed by the water spray holes in each column and the upper end surface of the silicon wafer 10 increases successively, and the angle is 10-25°. The angle formed by the water spray holes in each row and the upper end surface of the silicon wafer 10 is the same. Specifically, the angles formed by the water spray holes 32, water spray holes 33, water spray holes 34 and water spray holes 35 and the silicon wafer 10 are 10°, 15°, 20° and 25° respectively. That is, the angle formed by the water spray hole 32 at the top and the silicon wafer is 10°, and correspondingly, the angle formed by the water spray hole 33 and the silicon wafer 10 is 15°, the angle formed by the water spray hole 34 and the silicon wafer 10 is 20°, and the angle formed by the water spray hole 35 at the bottom and the silicon wafer 10 is 35°; the vertical hole distance between the water spray holes 32, 33, 34 and 35 is 0.5-1cm, the hole diameter is 0.8-1mm, and the hole depth is 3-5cm; the water spray hole is 2-3cm away from the front bevel of the silicon wafer 10, and the water spray arranged on the side is Hole 32, water spray hole 33, water spray hole 34 and water spray hole 35 not only increase the height area of ​​contact with the side of the silicon wafer and maximize the contact with the side of the silicon wafer 10, but also different angle settings can further increase the water jet intensity and increase the slicing ability. The symmetrically arranged water spray holes can further ensure the stability of the spray water pressure and ensure the uniform separation of the silicon wafers. The separated silicon wafer 10 can further reduce the risk of stacking of the silicon wafer 10, improve the accuracy and reliability of silicon wafer insertion, thereby improving the yield rate, reducing the damage or cracks caused by stacking, and improving the silicon wafer yield.

[0041] Step 3: Use the adsorption mechanism 40 to completely separate the separated silicon wafer 10 from the silicon wafer below. The separated silicon wafer 10 is adsorbed by the negative pressure mechanism 40 placed above, so that the uppermost silicon wafer 10 is completely separated from the silicon wafer 10 below, and the separated silicon wafer is transferred to the separation water surface through the transmission device arranged outside the separation device, and inserted into the flower basket.

[0042] The separation method proposed in the present invention can completely solve the technical problem that large-sized silicon wafers are prone to overlap and cause silicon wafer breakage during wafer separation, thereby ensuring the quality of the silicon wafers, and having high separation efficiency and good reliability; large-sized silicon wafers can be evenly separated, ensuring the quality of the silicon wafers and improving the silicon wafer yield.

[0043] The above embodiments of the present invention are described in detail, and the contents are only preferred embodiments of the present invention, and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A separation device for a silicon wafer inserter, characterized in that: It comprises a clip mechanism for placing a horizontal silicon wafer, a spray mechanism for separating the silicon wafer, and a negative pressure mechanism for adsorbing the separated silicon wafer, wherein the clip mechanism is a slot-shaped structure with a single-side opening, and the bottom surface of the clip mechanism is arranged parallel to the silicon wafer; the spray mechanism is arranged on one side of the opening of the clip mechanism and is arranged perpendicular to the silicon wafer; the negative pressure mechanism is arranged directly above the clip mechanism; wherein the spray mechanism comprises a symmetrically arranged spray column, on which a plurality of water spray holes are arranged, and the water sprayed from the water spray holes on both sides is arranged toward the middle axis of the moving direction of the silicon wafer, and the water spray holes are arranged obliquely downward relative to the upper end surface of the silicon wafer; The spray column is provided with two vertically arranged rows of water spray holes; the angles formed by the water spray holes and the upper end surface of the silicon wafer increase from top to bottom; An inclined wall is provided at the inner corner of the spray column close to the side of the silicon wafer. The inclined wall is perpendicular to the end face of the silicon wafer and forms a certain angle with the direction of horizontal movement of the silicon wafer. The high-pressure water flow sprayed from the spray mechanism is sprayed directly at the front edge of the silicon wafer. The pressurized water flows through the water spray holes at the bevels on both sides and is ejected at high speed close to the front edge of the silicon wafer, so that the silicon wafers are separated one by one without damage. At the same time, the high-speed water flow can wash away the cutting fluid and impurities on the surface of the silicon wafer and clean the silicon wafer. The separated silicon wafers are simultaneously adsorbed by the negative pressure mechanism placed above, so that the top silicon wafer is completely separated from the silicon wafer below.

2. A separation device for a silicon wafer inserter according to claim 1, characterized in that: The number of the water spray holes in each row on the spray column is two; and the included angle is 10°-25°.

3. A separation device for a silicon wafer inserter according to claim 2, characterized in that: There are four water spray holes in each column, and the angles formed by the water spray holes and the silicon wafer are 10°, 15°, 20° and 25° respectively.

4. A separation device for a silicon wafer inserter according to any one of claims 1 to 3, characterized in that: The wall surface where the water spray hole is located is inclined and forms an angle of 30°-60° with the moving direction of the silicon wafer.

5. A separation device for a silicon wafer inserter according to claim 4, characterized in that: A water through hole is provided on the top surface of the spray column. The water through hole is arranged along the height direction of the spray column, and the water through hole is communicated with the water spray hole.

6. A separation device for a silicon wafer inserter according to any one of claims 1 to 3 and 5, characterized in that: The clip mechanism comprises a bottom plate and vertical plates arranged along three side end surfaces of the bottom plate, wherein the height of the vertical plates is greater than the height of the injection column; the silicon wafer moves outward along the opening of the bottom plate.

7. A separation device for a silicon wafer inserter according to claim 6, characterized in that: The lower end surfaces of adjacent injection columns are all fixed on a horizontally arranged support plate, and the injection columns are connected to the bottom plate via a connecting frame.

8. A separation device for a silicon wafer inserter according to any one of claims 1-3, 5 and 7, characterized in that: The negative pressure mechanism includes a horizontally arranged negative pressure plate and roller assemblies placed on both sides of the negative pressure plate, and the roller assemblies are arranged along the length direction of the negative pressure plate; adsorption holes and connecting pipes are provided on the negative pressure plate, and the adsorption holes are interconnected with the connecting pipes.

9. A separation method for a separation device for a silicon wafer inserter, characterized in that: A separation device as described in any one of claims 1 to 8 is used, a stack of silicon wafers is placed on the clip mechanism, and several groups of water streams are sprayed toward the edge close to the moving direction of the silicon wafers through the symmetrically arranged water spray holes, so that the silicon wafer located at the top is separated from the other silicon wafers; and then the negative pressure mechanism is used to completely separate the separated silicon wafer from the silicon wafer below it.

Images