Wafer processing apparatus and wafer processing device

Abstract

The application relates to a wafer processing device and a wafer processing apparatus, which can solve the problem of large edge critical dimension error of a wafer and improve the yield of wafer production. The wafer processing device is provided with a focusing ring placing position for placing a focusing ring, further comprises a limiting part exposed on the upper surface of the focusing ring placing position, which is used for limiting the focusing ring by matching with the clamping groove arranged on the surface of the focusing ring. The limiting part can be elastically deformed, and the size of the limiting part in a horizontal direction is larger than the size of the clamping groove in the horizontal direction.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing and processing equipment, and more specifically to a wafer processing equipment and a wafer processing apparatus. Background Technology

[0002] Existing technologies use wafer etching machines to etch wafers. Specifically, the wafer is first placed in a preset position, and the wafer etching machine determines the area on the wafer that needs to be etched using etching ions based on the preset position, and then controls the etching process to perform the etching ion bombardment. However, existing technologies often suffer from large errors in critical dimensions at the wafer edges, which significantly affects wafer production yield. Summary of the Invention

[0003] The purpose of this invention is to provide a wafer processing equipment and a wafer processing apparatus that can solve the problem of large edge critical dimension errors of wafers and improve the yield of wafer production.

[0004] To address the aforementioned technical problems, a wafer processing apparatus is provided, comprising a focusing ring placement position for placing a focusing ring, and a limiting part exposed on the upper surface of the focusing ring placement position for engaging with a slot on the surface of the focusing ring to limit the focusing ring. The limiting part is capable of springback deformation, and the dimension of the limiting part in at least one horizontal direction is larger than the dimension of the slot in that horizontal direction.

[0005] Optionally, it also includes a base disposed within the focusing ring placement position, and the limiting portion is connected to the base.

[0006] Optionally, the limiting part is integrally formed with the bottom.

[0007] Optionally, the limiting part includes at least two sub-lobes, which are evenly distributed on the upper surface of the base.

[0008] Optionally, the limiting portion includes at least one of the following: a sub-lobe made of polyimide resin, a sub-lobe made of TUV, a sub-lobe made of HUS, and a sub-lobe made of PE.

[0009] Optionally, the sub-lobes are arranged in a circle, and the diameter of the circle ranges from 3 cm to 5 cm.

[0010] Optionally, the number of limiting portions is the same as the number of slots provided on the surface of the focusing ring.

[0011] Optionally, the position of the limiting part corresponds to the position of the groove on the focusing ring surface.

[0012] Optionally, when the limiting part is placed horizontally, the vertical height of the limiting part is greater than or equal to the depth of the slot.

[0013] Optionally, the outer surface of the limiting part is provided with anti-slip ribs.

[0014] Optionally, the limiting part can be detachably installed to the focusing ring placement position.

[0015] To address the aforementioned technical problems, a wafer processing apparatus is also provided, comprising the wafer processing equipment and a focusing ring, wherein the focusing ring is disposed at the focusing ring placement position and is limited by the limiting portion.

[0016] Optionally, the number of limiting parts is less than or equal to the number of slots provided on the surface of the focusing ring, and the position of the limiting parts also corresponds to the position of the slots.

[0017] Optionally, the focusing ring surface is provided with at least three slots.

[0018] The wafer processing equipment and apparatus of the present invention include a limiting part at the focusing ring placement position. This limiting part is capable of springback deformation, and its dimension in a horizontal direction is larger than that of the slot in the same horizontal direction. Therefore, when the limiting part is engaged with the slot to limit the focusing ring, it can be inserted into the slot by squeezing the limiting part. Thus, after the limiting part is placed in the slot, it remains in a state of being squeezed and deformed. Simultaneously, because the limiting part undergoes springback deformation, the deformed portion of the limiting part has a constant tendency to spring back. This directly acts on the inner wall of the slot, increasing the pressure of the limiting part on the inner wall of the slot, thereby increasing the friction between the limiting part and the inner wall of the slot and reducing the possibility of the focusing ring sliding when the limiting part is in the slot. In this way, the probability of the focusing ring moving after being placed in the focusing ring placement position is reduced, and the problem of large edge critical dimension error of the wafer can also be solved, thereby improving the yield of wafer production. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the limiting part in a specific embodiment of the present invention.

[0020] Figure 2 This is a rear view schematic diagram of the focusing ring in a specific embodiment of the present invention.

[0021] Figure 3 This is a three-dimensional structural diagram of the limiting part in a specific embodiment of the present invention, viewed from above.

[0022] Figure 4 This is a top view of the limiting part in a specific embodiment of the present invention.

[0023] Figure 5 This is a cross-sectional schematic diagram of the card slot in one specific embodiment of the present invention.

[0024] Figure 6 This is a cross-sectional structural diagram of a wafer processing apparatus according to a specific embodiment of the present invention.

[0025] Figure 7 This is a top view schematic diagram of a specific embodiment of the present invention when the wafer is placed within the area enclosed by the focusing ring. Detailed Implementation

[0026] Research has found that the reason why there are often large errors in the critical dimensions of wafer edges during the etching process is that in the existing technology, the wafer is placed in the area enclosed by the focusing ring, and the position of the focusing ring determines the preset position of the wafer. However, in the existing technology, the position of the focusing ring often moves relative to the preset position, causing a deviation between the placed position of the wafer and the preset position. This directly leads to errors in the processed area during subsequent wafer etching, resulting in errors in the critical dimensions of the wafer edges and affecting the yield of wafer production.

[0027] The reason why the focusing ring is prone to slippage in the prior art is that the focusing ring in the prior art is positioned by an alumina ceramic cylinder set at the focusing ring placement position. However, since the surface of the cylinder is smooth and its size is different from the groove set on the surface of the focusing ring, the focusing ring is prone to slippage during use, causing the etching ions at the wafer edge to shift.

[0028] The wafer processing equipment and wafer processing apparatus proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Please see Figures 1 to 7 ,in Figure 1 This is a three-dimensional structural diagram of the limiting part in a specific embodiment of the present invention. Figure 2 This is a rear view schematic diagram of the focusing ring in a specific embodiment of the present invention. Figure 3 This is a three-dimensional structural diagram of the limiting part in a specific embodiment of the present invention, viewed from above. Figure 4 This is a top view of the limiting part in a specific embodiment of the present invention. Figure 5 This is a cross-sectional schematic diagram of the card slot in one specific embodiment of the present invention. Figure 6 This is a cross-sectional structural diagram of a wafer processing apparatus according to a specific embodiment of the present invention. Figure 7 This is a top view schematic diagram of a specific embodiment of the present invention when the wafer is placed within the area enclosed by the focusing ring.

[0030] In this specific embodiment, a wafer processing apparatus is provided, which includes a focusing ring placement position 601 for placing a focusing ring 201, and a limiting part 101 exposed on the upper surface of the focusing ring placement position 601. The limiting part 101 is used to cooperate with a slot 202 on the surface of the focusing ring 201 to limit the focusing ring 201. The limiting part 101 is capable of springback deformation, and the dimension of the limiting part 101 in at least one horizontal direction is larger than the dimension of the slot 202 in that horizontal direction.

[0031] In this specific embodiment, the wafer processing equipment has a limiting part 101 at the focusing ring placement position 601. The limiting part 101 is capable of springback deformation, and its dimension in a horizontal direction is larger than that of the slot 202 in the same horizontal direction. Therefore, when the limiting part 101 is engaged with the slot 202 to limit the focusing ring 201, the limiting part 101 can be squeezed into the slot 202. Thus, after the limiting part 101 is placed into the slot 202, it remains in a state of being squeezed and deformed. Meanwhile, since the limiting part 101 undergoes springback deformation, the deformed portion of the limiting part 101 always tends to spring back. This directly acts on the inner wall of the slot 202, increasing the pressure of the limiting part 101 on the inner wall of the slot 202, thereby increasing the friction between the limiting part 101 and the inner wall of the slot 202 and reducing the possibility of the focusing ring 201 sliding when the limiting part 101 is in the slot 202. In this way, the probability of the focusing ring 201 moving after being placed in the focusing ring placement position 601 is reduced, and the problem of large edge critical dimension error of the wafer 701 can also be solved, improving the yield of wafer 701 production.

[0032] Please see Figure 7 Because the focusing ring 201 is well-defined, the centers of the wafer 701 and the focusing ring 201 can be well aligned, ensuring the etching performance of the wafer 701 edge. According to experimental statistics, when etching a 12-inch wafer 701 using an etching machine, using a cylinder to limit the focusing ring 201 in existing technology results in a slippage of 0.254 cm in the X direction and 0.275 cm in the Y direction relative to the preset position. However, when the limiting part 101 in this specific embodiment is used to limit the focusing ring 201, the slippage of the focusing ring 201 relative to the preset position is very small, only 0.055 cm in the X direction and only 0.061 cm in the Y direction.

[0033] In one specific embodiment, a base 102 is further disposed within the focusing ring placement position 601, and the limiting portion 101 is connected to the base 102. (See here for more details.) Figure 6 In this specific embodiment, the base 102 is embedded within the focusing ring placement position 601, with only the limiting part 101 exposed on the upper surface of the focusing ring placement position 601, engaging with the slot 202 of the focusing ring 201. It should be noted that in some specific embodiments, the limiting part 101 is detachably installed onto the focusing ring placement position 601. In this case, the surface of the base 102 is threaded, and the position where the base 102 is installed on the focusing ring placement position 601 has corresponding holes. The inner walls of these holes are threaded with corresponding threads to the surface of the base 102, facilitating the screwing of the base 102 in and out, and enabling convenient installation and replacement by the user.

[0034] In one specific embodiment, the limiting part 101 and the base 102 are integrally formed. The limiting part 101 and the base 102 are made of the same material, both being elastic and etching-resistant. Preferably, the limiting part 101 and the base 102 are made of polyimide resin. In this embodiment, the base 102 is elastic and is installed within the focusing ring placement position 601 by compression.

[0035] In one specific embodiment, the limiting part 101 includes at least two sub-lobes 103, which are evenly distributed on the upper surface of the base 102. The structure formed by all the sub-lobes 103 extends into the slot 202 when the focusing ring 201 is placed in the focusing ring placement position 601. When the limiting part 101 is placed in the slot 202 and compressed, the relative positions of the individual sub-lobes 103 change. Figures 1 to 6 In the specific embodiment shown, the limiting part 101 includes four sub-lobes 103, which together form an elastic, expandable, and compressible structure so as to completely lock the inner wall of the slot 202 of the focusing ring 201 and prevent the focusing ring 201 from sliding.

[0036] Please see Figure 4 , 5The shape formed by the sub-lobes 103 of the limiting part 101 is circular, with a diameter ranging from 3cm to 5cm, such as 3.5cm. The slot 202 has a rectangular cross-section with rounded edges, a width of 2.5cm in the X direction, a length of 3.5cm in the Y direction, and a depth of 2.5cm in the Z direction. Thus, the size of the shape formed by the outer surfaces of the sub-lobes 103 is wider than the size of the slot 202 in the X direction. When the limiting part 101 engages with the slot 202 and limits its movement, all sub-lobes 103 are inserted into the slot 202. Furthermore, the two sub-lobes 103 in the X direction are compressed by the inner wall of the slot 202, causing the two opposing sub-lobes 103 in the X direction to move closer together. Simultaneously, the two opposing sub-lobes 103 in the Y direction are also compressed further apart. (See reference...) Figure 6 .

[0037] By individually configuring each sub-lobe 103, it is possible to effectively prevent a continuous block of material from breaking apart and contaminating the wafer when squeezed by the slot 202. Simultaneously, it facilitates significant deformation of the limiting portion 101 in multiple directions.

[0038] In one specific embodiment, the limiting portion 101 includes at least one of a polyimide resin sub-lobe, a TUV sub-lobe, a HUS sub-lobe, and a PE sub-lobe. In practice, a material with a certain degree of resilience can be selected to fabricate the sub-lobe 103. In one specific embodiment, a polyimide resin material is selected to fabricate the sub-lobe, which possesses a certain degree of resistance to ion corrosion. Because the focusing ring 201 is used to focus etching ions, and the limiting portion 101 is also placed in an environment bombarded by etching ions, using an ion-resistant material to fabricate the sub-lobe 103 can effectively improve the service life of the limiting portion 101.

[0039] It should be noted that in this specific embodiment, the limiting part 101 gradually expands outward from bottom to top in the Z direction, and the lower end of the limiting part 101 is slightly smaller than the size of the slot 202.

[0040] In one specific embodiment, the number of limiting portions 101 is the same as the number of slots 202 provided on the surface of the focusing ring 201. Figure 2 In the specific embodiment shown, the focusing ring 201 has three slots 202 on its surface so that the limiting part 101 can limit the focusing ring 201 from three directions. At this time, the focusing ring placement position 601 is also provided with three limiting parts 101, and the three limiting parts 101 cooperate with the three slots 202 respectively.

[0041] In fact, the number of limiting parts 101 may be less than the number of slots 202 provided on the surface of the focusing ring 201.

[0042] In one specific embodiment, the position of the limiting part 101 corresponds to the position of the slot 202 on the surface of the focusing ring 201. Thus, when the focusing ring 201 is placed in the focusing ring placement position 601, each limiting part 101 can extend into a slot 202 and cooperate with the slot 202 to limit the focusing ring 201.

[0043] Please see Figure 2 The slots 202 on the focusing ring 201 are evenly distributed on the surface of the focusing ring 201. Therefore, the limiting parts 101 provided on the focusing ring placement position 601 are also evenly distributed on the focusing ring placement position 601, and the distribution of the limiting parts 101 on the focusing ring placement position 601 is consistent with the distribution of the slots 202 on the surface of the focusing ring 201.

[0044] In one specific embodiment, when the limiting part 101 is placed horizontally, the vertical height of the limiting part 101 is greater than or equal to the depth of the slot 202. This numerical height difference ensures that when the limiting part 101 is placed into the slot 202, it has sufficient height to be fully absorbed by the slot 202, thus providing a better limiting effect for the focusing ring 201.

[0045] In one specific embodiment, the outer surface of the limiting part 101 is provided with anti-slip ribs. Thus, when the limiting part 101 is placed into the slot 202 and deformed by the inner wall of the slot 202, the friction between the outer surface of the limiting part 101 and the inner wall of the slot 202 is further enhanced, thereby further preventing the focusing ring 201 from sliding after being placed in the focusing ring placement position 601.

[0046] Please see Figure 6 In this specific embodiment, a wafer processing apparatus is also provided, including the wafer processing equipment and a focusing ring 201. The focusing ring 201 is disposed at the focusing ring placement position 601 and is limited by the limiting part 101. It should be noted that... Figure 6 The image shows a portion of the wafer processing apparatus, only displaying the positional relationship between a limiting part 101 and a slot 202 provided on the surface of a focusing ring 201. The focusing ring 201 and the focusing ring placement position 601 are only parts of the entire focusing ring 201 and focusing ring placement position 601.

[0047] In this specific embodiment, the wafer processing apparatus has a limiting part 101 at the focusing ring placement position 601. The limiting part 101 is capable of springback deformation, and the dimension of the limiting part 101 in at least one horizontal direction is larger than the dimension of the slot 202 in that direction. Therefore, when the limiting part 101 is engaged with the slot 202 to limit the focusing ring 201, the limiting part 101 can be inserted into the slot 202 by squeezing the limiting part 101 and causing it to deform.

[0048] After the limiting part 101 is placed into the slot 202, since the size of the slot 202 in at least one horizontal direction is smaller than the size of the limiting part 101 in that horizontal direction, the limiting part 101 remains compressed and deformed. However, since the deformation of the limiting part 101 is springback, the limiting part 101 tends to spring back to its initial position. At this time, the limiting part 101 will compress the inner wall of the slot 202, applying greater pressure to the inner wall of the slot 202. A large static friction force can be generated between the outer surface of the limiting part 101 and the inner wall of the slot 202. This means that for the slot 202 to move relative to the limiting part 101, a greater pushing force is required to overcome the static friction force. Therefore, this wafer processing device effectively reduces the possibility of the limiting part 101 moving within the slot 202, ensuring the limiting effect of the limiting part 101 on the focusing ring 201. In this way, the probability of the focusing ring 201 moving after being placed in the focusing ring placement position 601 is reduced, and the problem of large edge critical dimension error of wafer 701 can also be solved, thereby improving the yield of wafer 701 production.

[0049] In one specific embodiment, the number of limiting portions 101 is less than or equal to the number of slots 202 provided on the surface of the focusing ring 201, and the positions where the limiting portions 101 are located also correspond to the positions of the slots 202. Figure 2 In the specific embodiment shown, the focusing ring 201 has three slots 202 on its surface so that the limiting part 101 can limit the focusing ring 201 from three directions. At this time, the focusing ring placement position 601 is also provided with three limiting parts 101, and the three limiting parts 101 cooperate with the three slots 202 respectively.

[0050] In one specific embodiment, the surface of the focusing ring 201 is provided with at least three slots 202 to facilitate the focusing ring 201 to obtain the limiting effect of the limiting part 101 on the focusing ring 201 from more directions.

[0051] In one specific embodiment, the wafer processing apparatus is a wafer etching apparatus, and the focusing ring 201 is used to focus etching ions. In this specific embodiment, the limiting portion 101 is made of a material resistant to ion etching. It should be noted that the material used to prepare the limiting portion 101 also needs to have the property of being able to undergo elastic deformation. Therefore, when selecting the material to prepare the limiting portion 101, polyimide resin, TUV, HUS, and PE can be selected.

[0052] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A wafer processing apparatus, comprising a focusing ring placement position for placing a focusing ring, characterized in that, It also includes a limiting part, which is exposed on the upper surface of the focusing ring placement position and is used to cooperate with a slot provided on the surface of the focusing ring to limit the focusing ring. The limiting part can undergo a spring-loaded deformation, and the dimension of the limiting part in at least one horizontal direction is larger than the dimension of the slot in that horizontal direction. It also includes a base disposed within the focusing ring placement position, and the limiting part is connected to the base; The limiting part includes at least two sub-lobes, which are evenly distributed on the upper surface of the base; The limiting part includes at least one of the following: a sub-lobe made of polyimide resin, a sub-lobe made of TUV, a sub-lobe made of HUS, and a sub-lobe made of PE.

2. The wafer processing equipment according to claim 1, characterized in that, The limiting part is integrally formed with the base.

3. The wafer processing equipment according to claim 1, characterized in that, The sub-lobes are arranged in a circle, and the diameter of the circle ranges from 3 cm to 5 cm.

4. The wafer processing equipment according to claim 1, characterized in that, The number of limiting parts is the same as the number of slots provided on the surface of the focusing ring.

5. The wafer processing equipment according to claim 1, characterized in that, The position of the limiting part corresponds to the position of the groove on the focusing ring surface.

6. The wafer processing equipment according to claim 1, characterized in that, When the limiting part is placed horizontally, the vertical height of the limiting part is greater than or equal to the depth of the slot.

7. The wafer processing equipment according to claim 1, characterized in that, The outer surface of the limiting part is provided with anti-slip ribs.

8. The wafer processing equipment according to claim 1, characterized in that, The limiting part can be detachably installed at the focusing ring placement position.

9. A wafer processing apparatus, characterized in that, Includes the wafer processing apparatus as described in any one of claims 1 to 8 and a focusing ring, wherein the focusing ring is disposed at the focusing ring placement position and is limited by the limiting portion.

10. The wafer processing apparatus according to claim 9, characterized in that, The number of limiting parts is less than or equal to the number of slots provided on the surface of the focusing ring, and the position of the limiting parts also corresponds to the position of the slots.

11. The wafer processing apparatus according to claim 9, characterized in that, The focusing ring surface is provided with at least 3 slots.

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