Wafer processing apparatus and wafer processing device

By incorporating a spring-loaded limiting part in the wafer processing equipment that works in conjunction with the focusing ring slot, the problem of critical dimension error at the wafer edge is solved, thereby improving the yield of wafer production.

CN112885734BActive Publication Date: 2026-08-07CHANGXIN MEMORY TECH INC
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Patent Information

Application Number
CN201911198096.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-11-29
Publication Date
2026-08-07
Estimated Expiration
2039-11-29

AI Technical Summary

Technical Problem

In existing technologies, the critical dimension error at the edge of the wafer is relatively large, which affects the wafer production yield.

Method used

A limiting part is set in the wafer processing equipment. The limiting part cooperates with the slot of the focusing ring. The limiting part can spring back and deform, increasing the friction with the inner wall of the slot and preventing the focusing ring from sliding.

Benefits of technology

It effectively reduces the probability of the focusing ring moving at the placement position, improves the precision of wafer edge etching, and increases wafer production yield.

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Abstract

The application relates to a wafer processing device and a wafer processing apparatus, which can solve the problem of large edge critical dimension error of a wafer and improve the yield of wafer production. The wafer processing device is provided with a focusing ring placing position for placing a focusing ring, further comprises a limiting part exposed on the upper surface of the focusing ring placing position, which is used for limiting the focusing ring by matching with the clamping groove arranged on the surface of the focusing ring. The limiting part can be elastically deformed, and the size of the limiting part in a horizontal direction is larger than the size of the clamping groove in the horizontal direction.
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