Scattering film and electronic device

Abstract

Embodiments of the present invention provide a scattering film and an electronic device. The scattering film includes a conductive layer having a plurality of through holes extending through the conductive layer. The through holes allow electromagnetic waves to pass through, and the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes. When the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, and the electromagnetic waves generate transmission paths in multiple directions through diffraction, thereby increasing the spatial range of electromagnetic wave emission, achieving the divergence function of the electromagnetic waves, and minimizing communication blind spots. The number and / or aperture of the through holes in at least one preset direction of the conductive layer show a trend of continuous variation, and the preset direction is any direction within the surface of the conductive layer. This enhances the diffraction of the electromagnetic waves and further increases the spatial range of the electromagnetic wave emission.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a scattering film and electronic equipment. Background Art

[0002] Electromagnetic wave communication utilizes electromagnetic waves with wavelengths between 0.1 mm and 1 meter. This wavelength corresponds to a frequency range of 300 MHz (0.3 GHz) to 3 THz. Unlike modern communication network transmission methods such as coaxial cable, fiber optic, and satellite communications, electromagnetic wave communication uses electromagnetic waves directly as a medium, eliminating the need for a solid medium. Electromagnetic wave transmission can be used whenever there is no obstacle within a straight-line distance between two points.

[0003] Electromagnetic wave communication is directional due to the linear transmission characteristics of electromagnetic waves. If the user is not in the specified direction area, the signal cannot be received, resulting in a communication blind spot. Summary of the Invention

[0004] One object of the present invention is to provide a scattering film, which can scatter electromagnetic waves after passing through the through holes on the scattering film, thereby increasing the spatial range of electromagnetic wave emission and avoiding communication blind spots as much as possible.

[0005] Another object of the present invention is to provide an electronic device having a large electromagnetic wave signal emission range.

[0006] In a first aspect, an embodiment of the present invention provides a scattering film, comprising a conductive layer, wherein a plurality of through holes are formed on the conductive layer and penetrate the conductive layer, wherein the through holes allow electromagnetic waves to pass through, and wherein the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes;

[0007] The number and / or aperture of the through holes in at least one preset direction of the conductive layer presents a trend of continuous change, and the preset direction is any direction within the surface of the conductive layer.

[0008] Optionally, a plurality of the through holes are arranged in an array on the conductive layer, and the apertures of the through holes along the preset direction show a variation trend of being larger in the middle and smaller on both sides, or smaller in the middle and larger on both sides.

[0009] Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the apertures of the through holes present a trend of continuous increase or continuous decrease along the preset direction.

[0010] Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the number of the through holes along the preset direction presents a trend of more in the middle and less on both sides, or less in the middle and more on both sides.

[0011] Optionally, the plurality of through holes are arranged in an array on the conductive layer, and the number of the through holes along the preset direction presents a trend of continuous increase or continuous decrease.

[0012] Optionally, the through hole is filled with a dielectric material that is transmissive of electromagnetic waves.

[0013] Optionally, along the preset direction, the refractive index of the dielectric material to the incident electromagnetic wave shows a trend of being smaller in the middle and larger on both sides.

[0014] Optionally, the scattering film further includes a first protruding structure disposed on the first surface of the conductive layer.

[0015] Optionally, the first protruding structure includes a plurality of protrusions.

[0016] Optionally, an insulating layer is provided on the first surface of the conductive layer, and the first protruding structure extends into the insulating layer.

[0017] Optionally, the scattering film further includes a connecting layer, and the connecting layer is provided on a second surface of the conductive layer, where the second surface is a surface opposite to the first surface.

[0018] Optionally, the second surface of the conductive layer is provided with a second protruding structure extending into the connecting layer.

[0019] In a second aspect, an embodiment of the present invention provides a scattering film, comprising a conductive layer, wherein a plurality of through holes are formed on the conductive layer and penetrate the conductive layer, wherein the through holes allow electromagnetic waves to pass through, and wherein the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes;

[0020] The through hole is filled with a dielectric material that can allow electromagnetic waves to pass through. The refractive index of the dielectric material to the incident electromagnetic waves tends to change continuously in at least one preset direction of the conductive layer. The preset direction is any direction within the surface of the conductive layer.

[0021] Optionally, along the preset direction, the refractive index of the dielectric material to the incident electromagnetic wave shows a trend of being smaller in the middle and larger on both sides.

[0022] Optionally, the scattering film further includes a first protruding structure disposed on the first surface of the conductive layer.

[0023] Optionally, the first protruding structure includes a plurality of protrusions.

[0024] Optionally, an insulating layer is provided on the first surface of the conductive layer, and the first protruding structure extends into the insulating layer.

[0025] Optionally, the scattering film further includes a connecting layer, and the connecting layer is provided on a second surface of the conductive layer, where the second surface is a surface opposite to the first surface.

[0026] Optionally, the second surface of the conductive layer is provided with a second protruding structure extending into the connecting layer.

[0027] In a third aspect, an embodiment of the present invention provides an electronic device, comprising the scattering film provided in the first or second aspect of the present invention, and further comprising an antenna device, wherein a surface of the antenna device is connected to the scattering film.

[0028] A scattering film provided in an embodiment of the present invention includes a conductive layer, with a plurality of through holes penetrating the conductive layer being provided on the conductive layer. The through holes allow electromagnetic waves to pass through, and the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes. When the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, and the electromagnetic waves generate transmission paths in multiple directions through diffraction, thereby increasing the spatial range of electromagnetic wave emission, realizing the divergence function of the electromagnetic waves, and avoiding communication blind spots as much as possible. In at least one preset direction of the conductive layer, the number and / or aperture of the through holes show a trend of continuous change, and the preset direction is any direction within the surface of the conductive layer, thereby enhancing the diffraction of the electromagnetic waves and further increasing the spatial range of the electromagnetic wave emission. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0030] Figure 1 A top view of a scattering film provided by an embodiment of the present invention;

[0031] Figure 2 A top view of another scattering film provided by an embodiment of the present invention;

[0032] Figure 3 A top view of another scattering film provided by an embodiment of the present invention;

[0033] Figure 4 A top view of another scattering film provided by an embodiment of the present invention;

[0034] Figure 5 A top view of another scattering film provided by an embodiment of the present invention;

[0035] Figure 6 A top view of another scattering film provided by an embodiment of the present invention;

[0036] Figure 7 A cross-sectional view of a scattering film provided by an embodiment of the present invention;

[0037] Figure 8 A cross-sectional view of a scattering film provided by an embodiment of the present invention;

[0038] Figure 9 A cross-sectional view of an electronic device provided by an embodiment of the present invention;

[0039] Figure 10 A cross-sectional view of another electronic device provided by an embodiment of the present invention.

[0040] Reference numerals:

[0041] 110. Conductive layer; 111. Through hole; 112. Dielectric material; 120. First protruding structure; 121. Protrusion; 130. Insulating layer; 140. Connecting layer; 150. Second protruding structure; 10. Scattering film; 20. Antenna device; 21. Antenna circuit; 22. Substrate. DETAILED DESCRIPTION

[0042] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0043] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0044] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0045] Embodiments of the present invention provide a scattering film comprising a conductive layer made of any one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold, or an alloy of two or more of these materials. The conductive layer is provided with a plurality of through-holes extending therethrough, allowing electromagnetic waves to pass through, and having an aperture smaller than the wavelength of the electromagnetic waves passing through the through-holes. The number and / or aperture of the through-holes exhibit a continuously varying trend in at least one predetermined direction within the conductive layer, where the predetermined direction is defined as any direction within the surface of the conductive layer.

[0046] A scattering film provided in an embodiment of the present invention includes a conductive layer, with a plurality of through holes penetrating the conductive layer being provided on the conductive layer. The through holes allow electromagnetic waves to pass through, and the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes. When the electromagnetic waves pass through the through holes of the conductive layer, diffraction occurs, and the electromagnetic waves generate transmission paths in multiple directions through diffraction, thereby increasing the spatial range of electromagnetic wave emission, realizing the divergence function of the electromagnetic waves, and avoiding communication blind spots as much as possible; in at least one preset direction of the conductive layer, the number and / or aperture of the through holes show a trend of continuous change, and the preset direction is any direction within the surface of the conductive layer, thereby enhancing the diffraction of the electromagnetic waves and further increasing the spatial range of the electromagnetic wave emission.

[0047] In order to enable those skilled in the art to more clearly understand the technical solution of the present invention, the scattering film provided in this embodiment is described in detail below with reference to the accompanying drawings:

[0048] Figure 1 A top view of a scattering film provided by an embodiment of the present invention, such as Figure 1 As shown, the scattering film includes a conductive layer 110, illustratively made of copper. Conductive layer 110 is provided with a plurality of through-holes 111 extending therethrough for passage of electromagnetic waves. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that upon entering through-hole 111, the electromagnetic wave diffracts, changing the propagation path of the electromagnetic wave, which was originally transmitted in a single direction. Diffraction generates propagation paths in multiple directions, thus expanding the spatial range of the electromagnetic wave emission. The aperture in this embodiment refers to the maximum value of the distance between any two points on the outline of any cross-section of through-hole 111.

[0049] The plurality of through holes 111 are arranged in an array. Specifically, the plurality of through holes 111 are arranged in an array along the X direction and the Y direction of the surface of the conductive layer 110, wherein the X direction may be the length direction of the conductive layer 110, and the Y direction may be the width direction of the conductive layer 110. The apertures of the plurality of through holes 111 are arranged along the preset direction ( Figure 1 The X direction in the middle shows a trend of large size and small size on both sides. Figure 1As shown, the cross-sectional shape of the through hole 111 is circular, and the diameter of the circle cut from any cross section perpendicular to the Z direction (the direction perpendicular to the conductive layer 110) is the same, that is, the through hole 111 is a cylindrical through hole, and the apertures of the plurality of through holes 111 show a trend of being larger in the middle and smaller on both sides along the X direction. By setting the aperture of the through hole 111 along the preset direction ( Figure 1 The diameter of the through holes 111 may also vary along the X-direction, with the diameters of the through holes 111 being larger in the center and smaller on the sides. This enhances the diffraction of the electromagnetic wave and further increases the spatial range of the electromagnetic wave emission. In another embodiment, the apertures of the through holes 111 may also vary along the X-direction, with the diameters being smaller in the center and larger on the sides. This embodiment of the present invention will not be further described herein.

[0050] It should be noted that in the above embodiments, the cross-sectional shape of the through hole is not limited and can be a regular shape such as a circle or a square, or an irregular polygon; the cross-sectional area of ​​the same through hole cut in any cross section perpendicular to the Z direction can be the same or different, that is, the aperture of the same through hole can be constant or variable along the Z direction. The embodiments of the present invention do not limit this, as long as the electromagnetic wave can be diffracted after being incident on the through hole. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole can be a regular shape such as a circle or a square, and the cross-sectional area of ​​the through hole cut in any cross section perpendicular to the Z direction is the same.

[0051] Figure 2 A top view of another scattering film provided by an embodiment of the present invention, such as Figure 2 As shown, the scattering film includes a conductive layer 110, illustratively made of copper. Conductive layer 110 is provided with a plurality of through-holes 111 extending therethrough for passage of electromagnetic waves. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that upon entering through-hole 111, the electromagnetic wave diffracts, changing the propagation path of the electromagnetic wave, which was originally transmitted in a single direction. Diffraction generates propagation paths in multiple directions, thus expanding the spatial range of the electromagnetic wave emission. The aperture in this embodiment refers to the maximum value of the distance between any two points on the outline of any cross-section of through-hole 111.

[0052] The plurality of through holes 111 may be arranged in an array. Specifically, the plurality of through holes 111 may be arranged in an array along the X direction and the Y direction of the surface of the conductive layer 110. The X direction may be the length direction of the conductive layer 110, and the Y direction may be the width direction of the conductive layer 110. For example, Figure 2As shown, the embodiment of the present invention is described by taking the through hole 111 as a cylindrical through hole as an example. Along the positive direction of X, the apertures of the multiple through holes 111 show a trend of continuous increase. By setting the apertures of the through holes 111 to show a trend of continuous increase along the X direction, the diffraction of the electromagnetic wave is enhanced, and the spatial range of the electromagnetic wave emission is further increased. In other embodiments of the present invention, along the positive direction of X, the apertures of the multiple through holes 111 can also show a trend of continuous decrease, which can also achieve the technical effects of the present invention. The embodiments of the present invention will not be repeated here.

[0053] It should be noted that in the above embodiments, the cross-sectional shape of the through hole is not limited and can be a regular shape such as a circle or a square, or an irregular polygon; the cross-sectional area of ​​the same through hole cut in any cross section perpendicular to the Z direction can be the same or different, that is, the aperture of the same through hole can be constant or variable along the Z direction. The embodiments of the present invention do not limit this, as long as the electromagnetic wave can be diffracted after being incident on the through hole. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole can be a regular shape such as a circle or a square, and the cross-sectional area of ​​the through hole cut in any cross section perpendicular to the Z direction is the same.

[0054] Figure 3 A top view of another scattering film provided by an embodiment of the present invention, such as Figure 3 As shown, the scattering film includes a conductive layer 110, illustratively made of copper. Conductive layer 110 is provided with a plurality of through-holes 111 extending therethrough for passage of electromagnetic waves. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that upon entering through-hole 111, the electromagnetic wave diffracts, changing the propagation path of the electromagnetic wave, which was originally transmitted in a single direction. Diffraction generates propagation paths in multiple directions, thus expanding the spatial range of the electromagnetic wave emission. The aperture in this embodiment refers to the maximum value of the distance between any two points on the outline of any cross-section of through-hole 111.

[0055] The plurality of through holes 111 may be arranged in an array. Specifically, the plurality of through holes 111 may be arranged in an array along the X direction and the Y direction of the surface of the conductive layer 110. The X direction may be the length direction of the conductive layer 110, and the Y direction may be the width direction of the conductive layer 110. For example, Figure 3As shown, the embodiment of the present invention is described by taking the through hole 111 as a cylindrical through hole as an example. The multiple through holes 111 have the same aperture, and along the X direction, the number of through holes 111 shows a trend of more in the middle and less on both sides. That is, along the X direction, the through holes 111 in the middle are arranged more densely, and the through holes 111 on both sides are arranged more sparsely. By setting the number of through holes 111 to show a trend of more in the middle and less on both sides along the X direction, the diffraction of electromagnetic waves is enhanced and the spatial range of electromagnetic wave emission is further increased. It should be noted that in other embodiments of the present invention, along the X direction, the number of through holes 111 can also show a trend of less in the middle and more on both sides, which can also achieve the technical effects of the present invention. The embodiments of the present invention are not repeated here. In addition, along the X direction, the apertures of the through holes 111 can also be unequal, for example, showing a trend of larger in the middle and smaller on both sides, or smaller in the middle and larger on both sides, or showing a trend of continuous increase or continuous decrease, which can also achieve the technical effects of the present invention. The embodiments of the present invention are not repeated here.

[0056] It should be noted that in the above embodiments, the cross-sectional shape of the through hole is not limited and can be a regular shape such as a circle or a square, or an irregular polygon; the cross-sectional area of ​​the same through hole cut in any cross section perpendicular to the Z direction can be the same or different, that is, the aperture of the same through hole can be constant or variable along the Z direction. The embodiments of the present invention do not limit this, as long as the electromagnetic wave can be diffracted after being incident on the through hole. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole can be a regular shape such as a circle or a square, and the cross-sectional area of ​​the through hole cut in any cross section perpendicular to the Z direction is the same.

[0057] Figure 4 A top view of another scattering film provided by an embodiment of the present invention, such as Figure 4 As shown, the scattering film includes a conductive layer 110, illustratively made of copper. Conductive layer 110 is provided with a plurality of through-holes 111 extending therethrough for passage of electromagnetic waves. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that upon entering through-hole 111, the electromagnetic wave diffracts, changing the propagation path of the electromagnetic wave, which was originally transmitted in a single direction. Diffraction generates propagation paths in multiple directions, thus expanding the spatial range of the electromagnetic wave emission. The aperture in this embodiment refers to the maximum value of the distance between any two points on the outline of any cross-section of through-hole 111.

[0058] The plurality of through holes 111 may be arranged in an array. Specifically, the plurality of through holes 111 may be arranged in an array along the X direction and the Y direction of the surface of the conductive layer 110. The X direction may be the length direction of the conductive layer 110, and the Y direction may be the width direction of the conductive layer 110. For example, Figure 4As shown, the embodiment of the present invention is described by taking the through hole 111 as a cylindrical through hole as an example. Along the positive direction of X, the apertures of the multiple through holes 111 show a trend of continuous increase, and the number of through holes 111 along the X direction shows a trend of continuous decrease. Through the described design, the diffraction of electromagnetic waves is enhanced, and the spatial range of electromagnetic wave emission is further increased. It should be noted that in other embodiments of the present invention, along the X direction, the apertures of the through holes 111 can also be equal, or show a trend of being large in the middle and small on both sides, or small in the middle and large on both sides, or a trend of continuously decreasing, which can also achieve the technical effects of the present invention. The embodiments of the present invention will not be repeated here.

[0059] It should be noted that in the above embodiments, the cross-sectional shape of the through hole is not limited and can be a regular shape such as a circle or a square, or an irregular polygon; the cross-sectional area of ​​the same through hole cut in any cross section perpendicular to the Z direction can be the same or different, that is, the aperture of the same through hole can be constant or variable along the Z direction. The embodiments of the present invention do not limit this, as long as the electromagnetic wave can be diffracted after being incident on the through hole. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole can be a regular shape such as a circle or a square, and the cross-sectional area of ​​the through hole cut in any cross section perpendicular to the Z direction is the same.

[0060] In some embodiments of the present invention, Figure 1-4 As shown, based on the above embodiment, dielectric material that can transmit electromagnetic waves is filled in the through holes 111. For example, each through hole can be filled with the same dielectric material.

[0061] Figure 5 A top view of another scattering film provided by an embodiment of the present invention, such as Figure 5 As shown, the scattering film includes a conductive layer 110, illustratively made of copper. Conductive layer 110 is provided with a plurality of through-holes 111 extending therethrough for passage of electromagnetic waves. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that upon entering through-hole 111, the electromagnetic wave diffracts, changing the propagation path of the electromagnetic wave, which was originally transmitted in a single direction. Diffraction generates propagation paths in multiple directions, thus expanding the spatial range of the electromagnetic wave emission. The aperture in this embodiment refers to the maximum value of the distance between any two points on the outline of any cross-section of through-hole 111.

[0062] The plurality of through holes 111 may be arranged in an array. Specifically, the plurality of through holes 111 may be arranged in an array along the X direction and the Y direction of the surface of the conductive layer 110. The X direction may be the length direction of the conductive layer 110, and the Y direction may be the width direction of the conductive layer 110. For example, Figure 5As shown, the embodiment of the present invention is described by taking the through hole 111 as a cylindrical through hole as an example. The multiple through holes 111 have the same aperture and are arranged at equal distances along the X direction.

[0063] Each through hole 111 is filled with a different dielectric material 112 . For example, along the X direction, the refractive index of the dielectric material 112 filled in each through hole 111 shows a trend of being smaller in the middle and larger on both sides.

[0064] When a beam of electromagnetic waves is incident on a medium, it will be deflected toward the area with a high refractive index in the medium. In the embodiment of the present invention, along the X direction, the refractive index of the dielectric material 112 filled in each through hole 111 shows a trend of changing from small in the middle to large on both sides, so that the refractive index of the conductive layer 110 as a whole in the X direction for electromagnetic waves shows a trend of changing from low in the middle to high on both sides, causing the electromagnetic waves to be deflected to both sides, thereby achieving the divergence of electromagnetic waves. For example, iodine crystals, copper oxide, crystal, quartz, polystyrene, sodium chloride, glass, air, glass, sodium chloride, polystyrene, quartz, crystal, copper oxide, and iodine crystals are filled in sequence along the X direction. Figure 5 As shown, the shadows in the through hole 111 represent the dielectric material 112 filled therein, and a greater density of the shadows indicates a greater refractive index of the dielectric material 112 .

[0065] It should be noted that in the above embodiments, the cross-sectional shape of the through hole is not limited and can be a regular shape such as a circle or a square, or an irregular polygon; the cross-sectional area of ​​the through hole can be the same or different in any cross section perpendicular to the Z direction, that is, the aperture of the same through hole can be constant or variable along the Z direction. The embodiments of the present invention do not limit this, as long as the electromagnetic wave can be diffracted after being incident on the through hole. In some embodiments of the present invention, in order to facilitate the formation of the through hole, the cross-sectional shape of the through hole can be a regular shape such as a circle or a square, and the cross-sectional area of ​​the through hole can be the same in any cross section perpendicular to the Z direction.

[0066] In the above embodiment, the technical solution of the present invention is described using the example of through holes 111 having the same aperture and being equidistantly arranged along the X direction, with the refractive index of the dielectric material filling each through hole 111 exhibiting a trend of being smaller in the center and larger on the sides. In other embodiments of the present invention, the apertures of through holes 111 along the X direction may also be unequal, for example, exhibiting a trend of being larger in the center and smaller on the sides, or exhibiting a trend of continuously increasing or decreasing. The through holes 111 may also be arranged at non-equidistant intervals along the X direction, for example, exhibiting a trend of having more through holes 111 in the center and fewer on the sides, or exhibiting a trend of continuously increasing or decreasing. The present invention is not limited thereto. Figure 6 A cross-sectional view of another scattering film provided in an embodiment of the present invention, such as Figure 6As shown, in this embodiment, along the X direction, the apertures of the plurality of through holes 111 present a trend of being smaller in the middle and larger on both sides. The refractive index of the dielectric material filled in each through hole 111 also presents a trend of being smaller in the middle and larger on both sides.

[0067] Figure 7 A cross-sectional view of a scattering film provided by an embodiment of the present invention, Figure 8 A cross-sectional view of another scattering film provided in an embodiment of the present invention, such as Figure 7 and Figure 8 As shown, in some embodiments of the present invention, the scattering film further includes a first protruding structure 120. When electromagnetic waves are emitted through the first protruding structure 120, diffuse reflection occurs, thereby changing the movement path of the electromagnetic waves that were originally only transmitted in a direction. Through diffuse reflection, transmission paths in multiple directions are generated, further expanding the divergence range of the electromagnetic waves.

[0068] Regarding the material for achieving the electromagnetic wave reflection function, the present invention preferably uses a metal first protrusion structure 120. Of course, the present invention is not limited to this, and any material that can achieve the electromagnetic wave reflection function is suitable for the present invention. For example, an alloy first protrusion structure 120 can also be used. In one embodiment of the present invention, the first protrusion structure 120 can be a metal protrusion disposed on the conductive layer 110. The conductive layer 110 and the first protrusion structure 120 are integrally formed of the same material to improve the bonding strength between the two, making the first protrusion structure 120 less likely to fall off, thereby ensuring the service life and stability of the scattering film.

[0069] Exemplarily, the first raised structure 120 includes a plurality of raised portions 121 to enhance diffuse reflection. Adjacent raised portions 121 may be arranged in a continuous pattern or spaced apart from each other. The present invention does not impose any specific limitation on the size of the raised portions 121; the sizes of the plurality of raised portions 121 may be the same or different.

[0070] In the embodiment of the present invention, the shape of the first protrusion structure 120 can be varied according to actual needs, and can be a regular or irregular three-dimensional geometric shape, which is not limited in the embodiment of the present invention. In some examples, the shape of the first protrusion structure 120 is one or more of a pointed corner, an inverted cone, a granular shape, a dendrite, a columnar shape, and a block shape. For example, Figure 7 and Figure 8 In the example, the first protruding structure 120 has an irregular curved shape.

[0071] like Figure 7 and Figure 8As shown, an insulating layer 130 is also provided on the first surface of the conductive layer 110. Insulating layer 130 provides both insulation and protection, preventing the conductive layer 110 from contacting other external electronic components and causing a short circuit during use of the scattering film. It also protects the conductive layer 110 from damage during use. Exemplarily, insulating layer 130 is made of any of the following: a PPS (polyphenylene sulfide) film layer, a PEN (polyethylene naphthalate twoformic acid glycol ester) film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing epoxy resin ink, a film layer formed by curing polyurethane ink, a film layer formed by curing modified acrylic resin, or a film layer formed by curing polyimide resin.

[0072] In an embodiment of the present invention, the first protruding structure 120 extends into the insulating layer 130, thereby improving the connection reliability between the conductive layer 110 and the insulating layer 130 and preventing peeling and falling off between the insulating layer 130 and the conductive layer 110. The height of the first protruding structure 120 is less than the thickness of the insulating layer 130. The design ensures that the first protruding structure 120 extends into the insulating layer 130 but does not extend out of the insulating layer 130 to prevent failure of the insulating layer 130. It should be noted that when the first protruding structure 120 includes a plurality of protrusions 121 of different heights, the height of the first protruding structure 120 at this time refers to the highest height of all the protrusions 121. Exemplarily, the thickness of the insulating layer 130 is 1μm-25μm, and the height of the first protruding structure 120 is 0.1μm-15μm.

[0073] In order to facilitate the connection of the scattering film of the present invention with other components, such as Figure 7 and Figure 8 As shown, the diffuser film further includes a connecting layer 140, which is disposed on the second surface of the conductive layer 110, the second surface being opposite the first surface. Exemplarily, the connecting layer 140 is an adhesive film layer. The adhesive film layer facilitates connection of the diffuser film of this embodiment to other components. Exemplarily, the adhesive film layer is made of any one of the following materials: epoxy resin, modified epoxy resin, acrylic acid, modified rubber, thermoplastic polyimide, modified thermoplastic polyimide, polyurethane, polyacrylate, and silicone.

[0074] like Figure 7 and Figure 8As shown, the second surface of the conductive layer 110 is further provided with a second protruding structure 150 extending into the connecting layer 140, which improves the connection reliability between the conductive layer 110 and the connecting layer 140 and prevents peeling and falling off between the connecting layer 140 and the conductive layer 110. The connecting layer 140 covers all the second protruding structures 150. Therefore, the height of the second protruding structure 150 of this embodiment is less than or equal to the thickness of the connecting layer 140. Through the above design, it is ensured that the second protruding structure 150 extends into the connecting layer 140 but does not extend out of the connecting layer 140. It should be noted that Figure 7 and Figure 8 The shape of the second protruding structure 150 is merely exemplary. Due to differences in process methods and parameters, the shape of each second protruding structure 150 may be a regular or irregular three-dimensional geometric shape. For example, the shape of the second protruding structure 150 may be one or more of a pointed corner, an inverted cone, a granular shape, a dendrite, a columnar shape, and a block shape. The second protruding structure 150 in the embodiment of the present invention is not limited to the shapes shown in the figure and described above. As long as the second protruding structure 150 is conducive to improving the connection stability between the connecting layer 140 and the conductive layer 110, it is within the scope of protection of the present invention. The shapes of the plurality of second protruding structures 150 may be the same or different, and the sizes of the second protruding structures 150 may also be the same or different. In other words, the shapes of the plurality of second protruding structures 150 may be one or more of a pointed corner, an inverted cone, a granular shape, a dendrite, a columnar shape, and a block shape, and the sizes of the plurality of second protruding structures 150 of the same shape may not be exactly the same. In addition, multiple second protrusion structures 150 are distributed continuously or discontinuously on the side of the conductive layer 110 close to the connecting layer 140. For example, when the multiple second protrusion structures 150 are pointed and continuously distributed, a regular, periodic tooth-like three-dimensional pattern or an irregular, disordered tooth-like three-dimensional pattern can be formed. Of course, only one of the cases is listed here, and the combinations of other shapes mentioned above are also within the scope of protection of this application, so they are not listed one by one here.

[0075] It should be noted that the plurality of second protrusion structures 150 may have different heights. In this case, the height of a second protrusion structure 150 refers to the highest height of all second protrusion structures 150. The outer surface of the connection layer 140 and the surface of the conductive layer 110 may be a flat surface with no undulations or a non-flat surface with gently undulating surfaces, and this is not limited in the present embodiment.

[0076] In some embodiments of the present invention, the second protruding structures 150 are made of a conductive material to facilitate the removal of interfering charges accumulated in the conductive layer 110 when using a scattering film, thereby preventing the accumulation of interfering charges and the formation of interference sources. For example, the conductive layer 110 and the second protruding structures 150 are integrally formed from the same material. When connected to other components, through compression, the multiple second protruding structures 150 pierce the connecting layer 140 and connect to the ground, thereby removing interfering charges accumulated in the conductive layer 110.

[0077] In the embodiment of the present invention, the height of the second protruding structure 150 is preferably 0.1 μm-30 μm, and the thickness of the connecting layer 140 is preferably 0.1 μm-45 μm, to ensure that the second protruding structure 150 can pierce the connecting layer 140 when the scattering film is in use, thereby ensuring that the scattering film can be grounded.

[0078] To accommodate a wide range of applications, the diffuser film of the present invention features a flexible, foldable, and bendable structure. Specifically, by employing a flexible conductive layer 110, such as an FPC circuit board, and by providing a flexible connection layer 140 on one surface of the conductive layer 110, and a flexible protective insulating layer 130 on the other surface of the conductive layer 110, the diffuser film of the present invention is both foldable and bendable. In actual use, the diffuser film can be bent or folded into any desired shape, such as a ring or semi-enclosed structure, including arcuate, elliptical, and stacked structures.

[0079] An embodiment of the present invention further provides an electronic device, Figure 9 A cross-sectional view of an electronic device provided by an embodiment of the present invention, Figure 10 A cross-sectional view of another electronic device provided by an embodiment of the present invention, such as Figure 9 and Figure 10 As shown, the electronic device includes a scattering film 10 and an antenna device 20. The antenna device 20 includes an antenna circuit 21 and a substrate 22 for mounting the antenna circuit 21. The scattering film 10 includes a conductive layer 110, which is provided with a plurality of through-holes 111 extending through the conductive layer 110 to allow electromagnetic waves to pass through. The aperture of each through-hole 111 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts upon entering the through-hole 111. This changes the propagation path of the electromagnetic wave, which was originally transmitted in a directional manner, and generates multiple directional propagation paths through diffraction, thereby expanding the spatial range of the electromagnetic wave emission.

[0080] Along the X direction, the number and / or aperture of the through holes 111 on the conductive layer 110 presents a trend of continuous change. The X direction is any direction within the surface of the conductive layer, which enhances the diffraction of electromagnetic waves and further increases the spatial range of electromagnetic wave emission.

[0081] In some embodiments, as Figure 10 As shown, the through hole is filled with a dielectric material 112 that allows electromagnetic waves to pass through. For example, along the X direction, the refractive index of the dielectric material to the incident electromagnetic wave shows a trend of changing from small in the middle to large on both sides, causing the electromagnetic wave to deflect to both sides, thereby achieving electromagnetic wave divergence.

[0082] In some embodiments, as Figure 9 and Figure 10 As shown, the scattering film 10 may further include a first protruding structure 120 and an insulating layer 130 disposed on the first surface of the conductive layer 110, wherein the first protruding structure 120 extends into the insulating layer 130. The scattering film 10 may further include a second protruding structure 150 and a connecting layer 140 disposed on the second surface of the conductive layer 110, wherein the second protruding structure 150 extends into the connecting layer 140, and the second surface is a surface opposite to the first surface.

[0083] One surface of the substrate 22 is bonded to the connecting layer 140 of the scattering film 10, thereby connecting the antenna device 20 to the scattering film 10. By connecting the scattering film 10 to the antenna device 20, the electromagnetic wave signal emitted by the antenna circuit 21 is diffracted after passing through the through-holes 111 of the scattering film. In the X-direction, the electromagnetic wave is deflected toward the sides with higher refractive indices, thereby achieving the function of electromagnetic wave divergence and expanding the spatial range of electromagnetic wave emission. Furthermore, after encountering the first protruding structure 120, the diverged electromagnetic wave is diffusely reflected, causing the previously directionally transmitted electromagnetic wave's motion path to change. The diffuse reflection generates multiple directional transmission paths, further expanding the electromagnetic wave's divergence range.

[0084] In the description herein, it should be understood that the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0085] In this specification, reference to terms such as "one embodiment" or "example" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0086] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0087] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A scattering film, characterized in that: The conductive layer comprises a plurality of through holes penetrating the conductive layer, wherein the through holes allow electromagnetic waves to pass through, and the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes; The number and / or aperture of the through holes show a trend of continuous change in at least one preset direction of the conductive layer, and the preset direction is any direction within the surface of the conductive layer; It also includes a first protruding structure, which is arranged on the first surface of the conductive layer. The height of the first protruding structure is 0.1μm-15μm. After the electromagnetic wave passes through the through hole of the conductive layer, it is diffusely reflected when passing through the first protruding structure. The shape of the first protruding structure is dendritic. An insulating layer is provided on the first surface of the conductive layer. The first protruding structure extends into the insulating layer. The thickness of the insulating layer is 1μm-25μm.

2. The scattering film according to claim 1, wherein The plurality of through holes are arranged in an array on the conductive layer, and the apertures of the through holes along the preset direction present a variation trend of being larger in the middle and smaller on both sides, or smaller in the middle and larger on both sides.

3. The scattering film according to claim 1, wherein The plurality of through holes are arranged in an array on the conductive layer, and the apertures of the through holes present a trend of continuous increase or continuous decrease along the preset direction.

4. The scattering film according to claim 1, wherein The plurality of through holes are arranged in an array on the conductive layer, and along the preset direction, the number of the through holes presents a variation trend of more in the middle and less on both sides, or less in the middle and more on both sides.

5. The scattering film according to claim 1, wherein The plurality of through holes are arranged in an array on the conductive layer, and the number of the through holes presents a trend of continuous increase or continuous decrease along the preset direction.

6. The scattering film according to claim 1, characterized in that The through hole is filled with a dielectric material that can transmit electromagnetic waves.

7. The scattering film according to claim 6, characterized in that Along the preset direction, the refractive index of the dielectric material to the incident electromagnetic wave shows a trend of being smaller in the middle and larger on both sides.

8. A scattering film, characterized in that: The conductive layer comprises a plurality of through holes penetrating the conductive layer, wherein the through holes allow electromagnetic waves to pass through, and the aperture of the through holes is smaller than the wavelength of the electromagnetic waves passing through the through holes; The through hole is filled with a dielectric material that is transmissive of electromagnetic waves, and the refractive index of the dielectric material to the incident electromagnetic waves shows a trend of continuous change in at least one preset direction of the conductive layer, and the preset direction is any direction within the surface of the conductive layer; It also includes a first protruding structure, which is arranged on the first surface of the conductive layer. The height of the first protruding structure is 0.1μm-15μm. After the electromagnetic wave passes through the through hole of the conductive layer, it is diffusely reflected when passing through the first protruding structure. The shape of the first protruding structure is dendritic. An insulating layer is provided on the first surface of the conductive layer. The first protruding structure extends into the insulating layer. The thickness of the insulating layer is 1μm-25μm.

9. The scattering film according to claim 8, characterized in that Along the preset direction, the refractive index of the dielectric material to the incident electromagnetic wave shows a trend of being smaller in the middle and larger on both sides.

10. The scattering film according to claim 1 or 8, characterized in that The first protrusion structure includes a plurality of protrusions.

11. The scattering film according to claim 1 or 8, characterized in that: The conductive layer further includes a connecting layer, wherein the connecting layer is disposed on a second surface of the conductive layer, and the second surface is a surface opposite to the first surface.

12. The diffusion film according to claim 11, wherein The second surface of the conductive layer is provided with a second protruding structure extending into the connecting layer.

13. An electronic device, characterized in that: The device comprises the scattering film according to any one of claims 1 to 12, and further comprises an antenna device, wherein one surface of the antenna device is connected to the scattering film.

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