processing device

Abstract

Provided is a processing apparatus in which an operator can confirm whether or not a groove formed on the back surface side of a work conforms to a division line set on the front surface side of the work. The processing apparatus includes a holding table having a prescribed area formed from one surface to the other surface by a transparent material; a processing unit that processes the work; a first imaging unit disposed above the holding table; a second imaging unit disposed below the holding table; a display unit; and a control section including a storage section that stores position information of a prescribed pattern included in an image of the front surface side obtained by imaging the work held by one surface of the holding table from the front surface side, the control section causing the prescribed pattern included in a second area on the front surface side corresponding to a first area on the back surface side of the work in the thickness direction of the work to be displayed on the display unit in superposition with an image of the first area.

Description

TECHNICAL FIELD

[0001] The present application relates to a processing apparatus that processes a back surface side of a workpiece in a state where the workpiece having a prescribed pattern formed on a front surface side is held by a holding jig. BACKGROUND

[0002] A semiconductor device chip for an electronic device such as a mobile phone, a personal computer, or the like is manufactured, for example, by processing a wafer (workpiece) formed of a semiconductor material such as silicon in a disc shape. A plurality of division intended lines are provided on a front surface side of the workpiece, and a device such as an IC (Integrated Circuit), an LSI (Large Scale Integration), a MEMS (Micro Electro Mechanical Systems), or the like is formed in each region divided by the plurality of division intended lines.

[0003] In order to manufacture a device chip from the workpiece, for example, after the workpiece is thinned to a prescribed thickness by grinding a back surface side of the workpiece, the workpiece is cut along each division intended line, thereby dividing the workpiece into a device unit to manufacture the device chip.

[0004] In a cutting process of cutting the workpiece, a cutting apparatus having a cutting unit in which a cutting tool is attached to one end of a main shaft and a holding table that holds the workpiece by suction is used. In a normal cutting process, first, the front surface side of the workpiece is made to face upward, and the back surface side of the workpiece is held by suction by the holding table.

[0005] After the back surface side is held, the front surface side of the workpiece is photographed by a camera provided above the holding table, thereby performing alignment. In the alignment, a camera having a photographing element such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor for photographing a subject by visible light is used.

[0006] Alignment such as position correction of the workpiece is performed in accordance with a result of photographing the front surface side of the workpiece on which an alignment mark or the like is formed by the camera. After the alignment, the workpiece is cut along each division intended line by the cutting tool.

[0007] However, in recent years, along with diversification of devices, the workpiece is sometimes cut from the back side thereof (for example, refer to Patent Document 1). In this case, since the front side of the workpiece is arranged downward and held by the holding table, even if the camera provided above the holding table is used to take an image of the back side of the workpiece, the alignment mark or the like cannot be imaged.

[0008] Therefore, a cutting device has been developed, which has a holding table formed of a material transparent to visible light and a camera for visible light arranged below the holding table (for example, refer to Patent Document 2). If this cutting device is used, the front side of the workpiece can be imaged from below the holding table in a state where the front side of the workpiece is held by the holding table. Therefore, even in a case where the back side of the workpiece is made to face upward and the front side of the workpiece is held by the holding table, alignment can be performed.

[0009] Patent Document 1: Japanese Patent Application Publication No. 2006-140341

[0010] Patent Document 2: Japanese Patent Application Publication No. 2010-87141

[0011] However, even in a case where the cutting device in which the camera is arranged below the holding table is used, it is sometimes impossible to confirm whether the cutting groove formed in the workpiece is formed along the division predetermined line.

[0012] For example, in a case where a cutting groove (i.e., a half-cut groove) is formed, which locally removes the workpiece from the back side of the workpiece to a prescribed depth that does not reach the front side of the workpiece, the worker cannot confirm whether the cutting groove is formed along the division predetermined line set on the front side. SUMMARY

[0013] The present application was achieved in view of the above problems, and has an object to provide a machining device in which a worker can confirm whether a groove formed on the back side of a workpiece is formed along a division predetermined line set on the front side of the workpiece.

[0014] According to one embodiment of the present application, there is provided a processing apparatus including: a plate-shaped holding stage including one surface and another surface on a side opposite to the one surface, and having a prescribed region formed from the one surface to the another surface by a transparent material; a processing unit that processes a workpiece having a prescribed pattern on a front surface side in a state in which the front surface side of the workpiece is held by the one surface of the holding stage and a back surface side of the workpiece is exposed upward; a first imaging unit disposed above the holding stage in a manner facing the one surface; a second imaging unit disposed below the holding stage in a manner facing the another surface; a display unit that displays an image captured by at least any one of the first imaging unit and the second imaging unit; and a control section including a storage section that stores position information of the prescribed pattern included in an image of the front surface side captured by imaging the workpiece having the front surface side held by the one surface of the holding stage using the second imaging unit, the control section causing the prescribed pattern included in a second region of the front surface side corresponding to a first region of the back surface side of the workpiece in a thickness direction of the workpiece to be displayed on the display unit in superposition with an image of the first region.

[0015] Preferably, the image of the first region displayed on the display unit includes a region indicating a processing groove formed by the processing unit, and the control section causes the prescribed pattern in the second region to be displayed on the image of the first region including the region indicating the processing groove.

[0016] Further, preferably, the image of the second region is displayed on the display unit, the image of the first region includes a region indicating a processing groove formed by the processing unit, and the control section causes at least the region of the image of the first region indicating the processing groove to be displayed on the image of the second region.

[0017] Further, preferably, the control section causes the image of the first region and the image of the second region to be displayed on the display unit in superposition in a state in which orientations in X-axis and Y-axis directions are the same in the image of the first region and the image of the second region.

[0018] Further, preferably, the processing unit is a cutting unit provided with a cutting tool or a laser irradiation unit that irradiates a laser beam.

[0019] The holding stage of the processing apparatus according to one embodiment of the present application has a prescribed region formed from one surface to another surface by a transparent material. A first imaging unit is disposed above the holding stage in a manner facing the one surface of the holding stage, and a second imaging unit is disposed below the holding stage in a manner facing the another surface of the holding stage.

[0020] The control section includes a storage section in which position information of the prescribed pattern included in the image of the front side obtained by capturing the workpiece held by the holding worktable on one face of the front side using the second capturing unit is stored.

[0021] Further, the control section causes the prescribed pattern included in the second region of the front side corresponding to the first region of the back side of the workpiece in the thickness direction of the workpiece to be displayed on the display unit in superposition with the image of the first region. Therefore, the operator can confirm whether the groove formed in the workpiece is formed along the division predetermined line. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a perspective view of the cutting device.

[0023] Figure 2 is a perspective view of the workpiece unit.

[0024] Figure 3 is a perspective view of the holding worktable or the like.

[0025] Figure 4 is a partial sectional side view of the holding worktable or the like.

[0026] Figure 5 is an enlarged view of the region A of Figure 4

[0027] Figure 6 is an enlarged perspective view of the Z-axis moving mechanism or the like.

[0028] Figure 7 is a view showing the cutting step.

[0029] Figure 8 is a view showing the back surface display step.

[0030] Figure 9 (A) of is an example of the image of the first region, Figure 9 (B) of is an example of the image of the second region.

[0031] Figure 10 is an example of the image displayed in the back surface display step.

[0032] Figure 11 is another example of the image displayed in the back surface display step.

[0033] Figure 12 is a perspective view of the laser processing device.

[0034] REFERENCE NUMERALS

[0035] ​2: cutting device (processing device); 4: base; 4a, 4b, 4d: opening; 4c: support structure; 6: cassette; 10: holding table; 11: workpiece; 11a: front surface; 11b: back surface; 11c: groove (processing groove); 12: holding member; 12a: one surface; 12b: another surface; 12c1: first suction path; 12c2: second suction path; 12c3: intersection; 12d: opening portion; 12e: outer peripheral suction path; 12f: suction path; 13: division line; 14: suction source; 15: device; 16: frame; 16a: opening portion; 16b: pulley portion; 17: belt; 18: X-axis moving table; 18a: bottom plate; 18b: side plate; 18c: top plate; 18d: space; 19: frame; 20: X-axis guide rail; 20a: X-axis linear scale; 21: workpiece unit; 22: X-axis ball screw; 24: X-axis pulse motor; 26: X-axis moving mechanism; 28: conveyer belt; 30: rotary drive source; 30a: pulley; 32: Y-axis moving mechanism; 34: Y-axis guide rail; 36: Y-axis moving table; 38: Y-axis ball screw; 40: Y-axis pulse motor; 42: Z-axis moving mechanism; 42a: support structure; 44: Z-axis guide rail; 46: Z-axis moving plate; 48: Z-axis ball screw; 50: Z-axis pulse motor; 52: support arm; 54: lower photographing unit (second photographing unit); 56: low magnification camera; 56a: illuminating device; 58: high magnification camera; 58a: illuminating device; 60: processing unit moving mechanism; 62: Y-axis guide rail; 64: Y-axis moving plate; 66: Y-axis ball screw; 68: Y-axis pulse motor; 70: Z-axis moving plate; 72: Z-axis guide rail; 74: Z-axis ball screw; 76: Z-axis pulse motor; 78: cutting unit (processing unit); 80: spindle housing; 82a: spindle; 82b: cutting tool; 84: upper photographing unit (first photographing unit); 86: cleaning unit; 88: cleaning table; 90: nozzle; 92: touch panel (display unit); 94: control section; 96: storage section; 98: mark; 100: circuit; 102, 102a: image; 104: laser processing device (processing device); 106: stationary base; 108: Y-axis moving table; 110: Y-axis guide rail; 110a: Y-axis scale; 112: Y-axis ball screw; 114: Y-axis pulse motor; 116: Y-axis moving mechanism; 118: column; 120: housing; 122: laser irradiation unit (processing unit); 124: irradiation head; A: area; B, C, D: corner. DETAILED DESCRIPTION

[0036] An embodiment of one mode of the present application will be described with reference to the drawings. Figure 1 is a perspective view of the cutting device 2 of the first embodiment. In addition, in the Figure 1In the diagram, a portion of the structural elements is shown using a function block diagram. Furthermore, the X-axis (machining feed direction), Y-axis (indexing feed direction), and Z-axis (vertical direction, infeed feed direction) used in the following description are perpendicular to each other.

[0037] The cutting device (machining device) 2 has a base 4 that supports various structural elements. An opening 4a is formed at the front corner (+Y direction) of the base 4, and a box lift (not shown) is installed within this opening 4a. Multiple workpieces 11 (see reference) are placed on the upper surface of the box lift. Figure 2 Box 6.

[0038] exist Figure 1 For ease of explanation, only the outline of box 6 is shown in the diagram. The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. However, there are no limitations on the material, shape, structure, size, etc., of the workpiece 11. For example, a substrate made of other semiconductor, ceramic, resin, metal, or other materials may also be used as the workpiece 11.

[0039] like Figure 2 As shown, the front side 11a of the workpiece 11 is divided into multiple regions by intersecting predetermined dividing lines (spacers) 13. In each region of the front side 11a, devices such as ICs (Integrated Circuits) 15 and alignment marks are formed. Figure 9 (B) marked 98), etc. However, there are no restrictions on the type, quantity, shape, structure, size, or arrangement of the device 15. It is also possible not to form the device 15 on the workpiece 11.

[0040] A strip (scribing strip) 17 with a diameter larger than that of the workpiece 11 is adhered to the front side 11a of the workpiece 11. The strip 17 is formed of a transparent material that allows visible light to pass through. The strip 17 has, for example, a laminated structure having a substrate layer and an adhesive layer (paste layer).

[0041] The substrate layer is formed, for example, of polyolefin (PO). The adhesive layer is formed, for example, of an adhesive resin such as an ultraviolet (UV) curable acrylic resin. The adhesive layer side of the strip 17 is adhered to the front side 11a.

[0042] A ring-shaped frame 19 made of metal is attached and fixed to the outer periphery of the belt 17. In this way, the workpiece 11 is stored in the box 6 as a workpiece unit 21 supported by the frame 19 via the belt 17. Figure 2 This is a three-dimensional view of the workpiece unit 21.

[0043] like Figure 1As shown, an opening 4b longer in the X-axis direction is formed behind (−Y direction) the opening 4a. A holding stage (chuck stage) 10 is disposed in the opening 4b. A circular ring-shaped frame suction plate (not shown) is provided on the outer peripheral portion of the holding stage 10, and suction ports are discretely formed in the frame suction plate along the circumferential direction.

[0044] Here, reference will be made to Figures 3 to 5 The holding stage 10 and the like will be described in more detail. Figure 3 is a perspective view of the holding stage 10 and the like, Figure 4 is a partial cross-sectional side view of the holding stage 10 and the like. However, in Figure 4 , the hatching is omitted for convenience. Figure 5 is an enlarged view of the area A of Figure 4 . In Figure 5 , a portion of the structural elements is shown by a functional block diagram.

[0045] The holding stage 10 has a disc-shaped (plate-shaped) holding member 12. The holding member 12 includes one substantially flat face 12a and another face 12b on the side opposite the one face 12a (see Figure 5 ). The holding member 12 is formed of a transparent material such as soda glass, borosilicate glass, or quartz glass that transmits visible light.

[0046] A plurality of flow paths are formed inside the holding member 12. In the holding member 12 of the present embodiment, a first suction path 12c1 in a straight line shape is formed so as to cross the central axis of the disc when the holding member 12 is viewed from the Z-axis direction. In addition, a second suction path 12c2 in a straight line shape is formed so as to be perpendicular to the first suction path 12c1 in the XY plane direction.

[0047] The first suction path 12c1 and the second suction path 12c2 intersect at an intersection 12c3 located on the central axis of the disc, and are connected to each other. A plurality of opening portions 12d are formed in the outer peripheral portion of the one face 12a so as to be separated from each other in the circumferential direction. Each opening portion 12d is formed to a prescribed depth from the one face 12a without reaching the other face 12b.

[0048] The opening portions 12d are respectively formed at both end portions of the first suction path 12c1 and both end portions of the second suction path 12c2. Each opening portion 12d is connected in the circumferential direction by an outer peripheral suction path 12e formed to a prescribed depth in the outer peripheral portion of the holding member 12.

[0049] An attraction path 12f extending in the radial direction of the holding member 12 is formed on the outer peripheral side of the opening portion 12d, and a suction source 14 such as an ejector is connected to the attraction path 12f (see Figure 5When the suction source 14 is activated to generate negative pressure, negative pressure is generated at the opening 12d. Therefore, one surface 12a functions as a holding surface that attracts and holds the workpiece unit 21 (workpiece 11).

[0050] However, in the flow paths of the retaining member 12, such as the first attraction path 12c1, the second attraction path 12c2, the opening 12d, the outer peripheral attraction path 12e, and the attraction path 12f, a portion of the incident light is scattered or reflected. Therefore, when viewed from one surface 12a or the other surface 12b, there are cases where the flow paths of the retaining member 12 are translucent to visible light but not completely transparent, or opaque.

[0051] However, the designated area of ​​the retaining component 12, excluding the flow path, is transparent from one surface 12a to the other surface 12b. Specifically, the area divided into four parts by the first attraction path 12c1 and the second attraction path 12c2 and located radially inside the retaining component 12 compared to the outer peripheral attraction path 12e is transparent from one surface 12a to the other surface 12b.

[0052] A cylindrical frame 16 made of a metal material such as stainless steel is provided on the outer periphery of the retaining component 12. An opening 16a is formed in the upper part of the frame 16 (see reference). Figure 5 The retaining component 12 is configured to close the opening 16a.

[0053] like Figure 3 and Figure 4 As shown, the frame 16 is supported by an X-axis movable stage 18. The X-axis movable stage 18 includes a rectangular base plate 18a when viewed from the Z-axis direction. One front end (+Y direction) of the base plate 18a is connected to the lower end of a rectangular side plate 18b when viewed from the Y-axis direction.

[0054] The upper end of the side plate 18b is connected to the front end of the top plate 18c, which has the same rectangular shape as the bottom plate 18a when viewed from the Z-axis direction. A space 18d is formed between the bottom plate 18a and the top plate 18c, open at one end in the rear (-Y direction) and at both ends in the X-axis direction.

[0055] Below the base plate 18a (in the -Z direction), a pair of X-axis guide rails 20, approximately parallel to the X-axis direction, are provided so that the base plate 18a can slide. The pair of X-axis guide rails 20 are fixed to the upper surface of the stationary base (not shown).

[0056] An X-axis linear scale 20a is provided adjacent to the X-axis guide rail 20 for detecting the position of the X-axis moving stage 18 in the X-axis direction. Additionally, a reading head (not shown) is provided on the lower surface of the X-axis moving stage 18.

[0057] The position (coordinates) of the X-axis moving stage 18 in the X-axis direction and the amount of movement in the X-axis direction are calculated by detecting the scale of the X-axis linear scale 20a with the reading head while the X-axis moving stage 18 is moving.

[0058] A nut portion (not shown) is provided on the lower surface side of the bottom plate 18a of the X-axis moving stage 18, and an X-axis ball screw 22 that is substantially parallel to the X-axis guide rail 20 is rotatably coupled to the nut portion.

[0059] An X-axis pulse motor 24 is coupled to one end portion of the X-axis ball screw 22. If the X-axis pulse motor 24 is operated to rotate the X-axis ball screw 22, the X-axis moving stage 18 moves in the X-axis direction along the X-axis guide rail 20. The X-axis guide rail 20, the X-axis ball screw 22, the X-axis pulse motor 24, and the like constitute an X-axis moving mechanism 26 that moves the X-axis moving stage 18.

[0060] The frame 16 is supported to the top plate 18c so as to be rotatable about a rotation axis that is substantially parallel to the Z-axis direction on the upper surface side of the top plate 18c of the X-axis moving stage 18. The frame 16 includes a cylindrical side surface, i.e., a pulley portion 16b. The pulley portion 16b is located at a position higher than the top plate 18c in the case where the frame 16 is supported by the X-axis moving stage 18.

[0061] A rotation drive source 30 such as a motor is provided on the side plate 18b of the X-axis moving stage 18. A pulley 30a is provided on the rotation axis of the rotation drive source 30. One endless belt (conveying belt 28) is hung on the pulley 30a and the pulley portion 16b.

[0062] When the rotation drive source 30 is operated to rotate the pulley 30a, the frame 16 is rotated about the rotation axis that is substantially parallel to the Z-axis direction by the force transmitted through the conveying belt 28. By controlling the rotation of the pulley 30a, the holding stage 10 can be rotated by an arbitrary angle about the rotation axis.

[0063] A Y-axis moving mechanism 32 is provided on the extension line of the X-axis direction of the X-axis moving mechanism 26. The Y-axis moving mechanism 32 has a pair of Y-axis guide rails 34 that are substantially parallel to the Y-axis direction. The pair of Y-axis guide rails 34 are fixed to the upper surface of a stationary base (not shown).

[0064] A Y-axis moving stage 36 is slidably mounted on the Y-axis guide rails 34. A nut portion (not shown) is provided on the lower surface side of the Y-axis moving stage 36, and a Y-axis ball screw 38 that is substantially parallel to the Y-axis guide rails 34 is rotatably coupled to the nut portion.

[0065] A Y-axis pulse motor 40 is connected to one end of the Y-axis ball screw 38. If the Y-axis ball screw 38 is rotated by the Y-axis pulse motor 40, the Y-axis moving stage 36 moves in the Y-axis direction along the Y-axis guide rail 34.

[0066] A Y-axis linear scale (not shown) used when detecting the position of the Y-axis moving stage 36 in the Y-axis direction is provided at a position adjacent to the Y-axis guide rail 34. In addition, a reading head (not shown) is provided on the lower surface side of the Y-axis moving stage 36.

[0067] When the Y-axis moving stage 36 moves, the position (coordinates) of the Y-axis moving stage 36 in the Y-axis direction and the amount of movement in the Y-axis direction are calculated by detecting the scale of the Y-axis linear scale with the reading head.

[0068] A Z-axis moving mechanism 42 is provided on the upper surface of the Y-axis moving stage 36. Figure 6 is an enlarged perspective view of the Z-axis moving mechanism 42 and the like. The Z-axis moving mechanism 42 has a support structure 42a fixed to the upper surface of the Y-axis moving stage 36.

[0069] A pair of Z-axis guide rails 44 substantially parallel to the Z-axis direction is fixed to the side of the X-axis moving stage 18 of the support structure 42a. A Z-axis moving plate 46 is slidably attached to the Z-axis guide rails 44.

[0070] A nut portion (not shown) is provided on the side of the Z-axis guide rails 44 of the side surface of the Z-axis moving plate 46, and a Z-axis ball screw 48 substantially parallel to the Z-axis guide rails 44 is rotatably connected to the nut portion.

[0071] A Z-axis pulse motor 50 is connected to one end of the Z-axis ball screw 48. If the Z-axis ball screw 48 is rotated by the Z-axis pulse motor 50, the Z-axis moving plate 46 moves in the Z-axis direction along the Z-axis guide rails 44.

[0072] A Z-axis linear scale (not shown) is provided at a position adjacent to the Z-axis guide rails 44, and a reading head (not shown) is provided on the Z-axis guide rails 44 side of the Z-axis moving plate 46. When the Z-axis moving plate 46 moves, the position (coordinates) of the Z-axis moving plate 46 in the Z-axis direction and the like are calculated by detecting the scale of the Z-axis linear scale with the reading head.

[0073] A lower photographing unit (second photographing unit) 54 is fixed to the Z-axis moving plate 46 via a support arm 52 longer in the X-axis direction. The lower photographing unit 54 of the present embodiment is disposed at a position lower than the holding stage 10, and includes a low-magnification camera 56 and a high-magnification camera 58 respectively provided so as to oppose the other face 12b of the holding member 12.

[0074] However, the lower photographing unit 54 can not have both the low magnification camera 56 and the high magnification camera 58. The lower photographing unit 54 can have only one camera of a prescribed magnification.

[0075] The low magnification camera 56 and the high magnification camera 58 each have a prescribed optical system and a photographing element such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor.

[0076] An illumination device 56a that irradiates visible light to a subject (for example, the workpiece 11) located above is provided to the side of the low magnification camera 56. Similarly, an illumination device 58a is also provided to the side of the high magnification camera 58.

[0077] In the case where the subject is photographed by the lower photographing unit 54, the X-axis moving table 18 is moved to the Y-axis moving table 36 side, and the lower photographing unit 54 is disposed in the space 18d. Thereby, the workpiece 11 disposed on the one face 12a side of the holding member 12 can be photographed from below.

[0078] Next, the other structural elements of the cutting device 2 will be described. Figure 1 A dust-proof and drip-proof cover that is bellows-shaped and is flexible is installed in a manner of covering the opening 4b at positions that are leftward (+X direction) and rightward (-X direction) of the top plate 18c of the X-axis moving table 18.

[0079] A door-shaped support structure 4c is provided in a manner of spanning the opening 4b above the opening 4b. Two processing unit moving mechanisms (indexing feed unit, plunge feed unit) 60 are provided on one of the side faces of the support structure 4c that is on the opening 4a side.

[0080] The processing unit moving mechanisms 60 each share a pair of Y-axis rails 62 that are fixed to one side face of the support structure 4c and are substantially parallel to the Y-axis direction. Two Y-axis moving plates 64 are installed on the Y-axis rails 62 in a manner of being able to slide independently of each other.

[0081] A nut portion (not shown) is provided on one face of the Y-axis moving plate 64 that is on the support structure 4c side, and a Y-axis ball screw 66 that is substantially parallel to the Y-axis rails 62 is linked to the nut portion in a manner of being able to rotate. In addition, the nut portion of the Y-axis moving plate 64 on the front side and the nut portion of the Y-axis moving plate 64 on the rear side are respectively linked to different Y-axis ball screws 66.

[0082] A Y-axis pulse motor 68 is connected to one end of each Y-axis ball screw 66. If the Y-axis pulse motor 68 is used to rotate the Y-axis ball screw 66, the Y-axis moving plate 64 moves in the Y-axis direction along the Y-axis guide rail 62.

[0083] A pair of Z-axis guide rails 72 that are substantially parallel to the Z-axis direction are provided on the other face of each Y-axis moving plate 64 on the side opposite the support structure 4c. A Z-axis moving plate 70 is slidably attached to the Z-axis guide rails 72.

[0084] A nut portion (not shown) is provided on one face of the Z-axis moving plate 70 on the side of the support structure 4c, and a Z-axis ball screw 74 that is parallel to the Z-axis guide rail 72 is rotatably connected to the nut portion.

[0085] A Z-axis pulse motor 76 is connected to one end of the Z-axis ball screw 74. If the Z-axis pulse motor 76 is used to rotate the Z-axis ball screw 74, the Z-axis moving plate 70 moves in the Z-axis direction along the Z-axis guide rail 72.

[0086] A cutting unit (machining unit) 78 is provided in the lower portion of the Z-axis moving plate 70. The cutting unit 78 has a cylindrical spindle housing 80. A portion of a cylindrical spindle 82a (see FIG. 2) is rotatably housed in the spindle housing 80. Figure 7 )。

[0087] A rotation drive mechanism (not shown) such as a servo motor is connected to one end of the spindle 82a to rotate the spindle 82a. A cutting tool 82b having a circular ring-shaped cutting edge is attached to the other end of the spindle 82a.

[0088] An upper photographing unit (first photographing unit) 84 is connected to the lower portion of the Z-axis moving plate 70 adjacent to the cutting unit 78. The upper photographing unit 84 is positioned above the holding table 10, and a camera lens or the like is provided so as to face one face 12a of the holding member 12. The upper photographing unit 84 has a prescribed optical system for photographing the workpiece 11 from above and a photographing element such as a CCD image sensor or a CMOS image sensor.

[0089] An opening 4d is provided at a position on the side opposite the opening 4a with respect to the opening 4b. A cleaning unit 86 for cleaning the workpiece 11 or the like after cutting is provided in the opening 4d. The cleaning unit 86 includes a cleaning table 88 that holds the workpiece 11 and a nozzle 90 having a spray port disposed so as to face the cleaning table 88.

[0090] An outer casing (not shown) is mounted on the base 4. A touch panel (display unit) 92, which serves as both an input device and a display device, is located on the front side of the casing. The touch panel 92 displays images captured by the lower imaging unit 54 and the upper imaging unit 84, processing conditions, GUI (Graphical User Interface) buttons, etc.

[0091] The cutting device 2 has a control unit 94. The control unit 94 controls the suction source 14, the X-axis moving mechanism 26, the rotary drive source 30, the Y-axis moving mechanism 32, the Z-axis moving mechanism 42, the lower imaging unit 54, the processing unit moving mechanism 60, the upper imaging unit 84, the cutting unit 78, the touch panel 92, etc.

[0092] The control unit 94 may be configured as a computer, which includes a processing unit such as a CPU (Central Processing Unit), a main storage device such as DRAM (Dynamic Random Access Memory), and auxiliary storage devices such as flash memory and hard disk drives. The processing unit and the like are operated according to software stored in the auxiliary storage devices, thereby realizing the function of the control unit 94.

[0093] The auxiliary storage device functions as a storage unit 96. The storage unit 96 stores image processing software, such as pattern matching. For example, using the image processing software, a predetermined pattern formed on the front side 11a is extracted from the image of the front side 11a captured by the lower imaging unit 54.

[0094] The prescribed pattern includes, for example, the dividing line 13, the component 15, the mark 98, and the circuit 100 (see reference). Figure 9 The outline of (B), etc. In addition, mark 98 is sometimes also called alignment mark, key pattern, target pattern, etc.

[0095] Next, use Figures 7 to 10 The processing method for the workpiece 11 will be described. First, the workpiece unit 21 is placed on one surface 12a of the holding table 10 with its back side 11b exposed to the top (placement step S10).

[0096] After the loading step S10, the suction source 14 is activated to hold the front side 11a of the workpiece 11 across the belt 17 using a surface 12a, and the frame 19 is held using a frame suction plate (not shown) (holding step S20). After the holding step S20, the teaching step S30 is performed.

[0097] In the teaching step S30, for example, in a state where the front surface 11a side is displayed on the touch panel 92 using the lower photographing unit 54, the operator searches for the mark 98 on the front surface 11a side (refer to (B) and the like of FIG. 8). Figure 9

[0098] After the operator finds an arbitrary mark 98, the image of the front surface 11a side including the mark 98 is acquired using the lower photographing unit 54. The shape, coordinates, and the like of the mark 98 are stored in the storage section 96 as a template for pattern matching. In addition, the distance between the mark 98 and the center line of the division intended line 13 calculated using the coordinates and the like of the mark 98 and the division intended line 13 is stored in the storage section 96.

[0099] Further, the distance (interval pitch) between two adjacent division intended lines 13 in the Y-axis direction calculated using the coordinates and the like of the mark 98 is stored in the storage section 96. In addition, each of the stored coordinates is an XY coordinate with the above intersection 12c3 as the origin.

[0100] After the teaching step S30, the alignment of the work 11 is performed (alignment step S40). In the alignment step S40, first, the image of the front surface 11a side is acquired using the lower photographing unit 54 at a plurality of positions separated from each other on one division intended line 13 in the X-axis direction.

[0101] Then, in the image of the front surface 11a side acquired at the plurality of positions, the same pattern as the mark 98 stored as a template is detected by a prescribed process such as pattern matching. From the same pattern as the detected mark 98, the shift of the division intended line 13 in the θ direction around the center axis of the holding member 12 is determined.

[0102] Then, the rotation drive source 30 is caused to operate so as to rotate the conveyer belt 28 by a prescribed amount, thereby correcting the shift of the holding member 12 in the θ direction. Thereby, the division intended line 13 is positioned to be substantially parallel to the X-axis direction. In addition, in the alignment step S40, a prescribed process, operation, and the like other than the correction in the θ direction can also be performed.

[0103] After the alignment step S40, the image of the front surface 11a side is acquired by photographing substantially the entire front surface 11a side of the work 11 held by the holding table 10 using the lower photographing unit 54 (image acquisition step S50).

[0104] In the image acquisition step S50, the relative positions of the holding table 10 and the lower photographing unit 54 are adjusted using the X-axis moving mechanism 26, the Y-axis moving mechanism 32, and the like while photographing the front surface 11a side. However, in the image acquisition step S50, it is not necessary to photograph the entire front surface 11a side. ​

[0105] That is, only an image of the entire device region of the device region in which the device 15 is formed and the outer peripheral remaining region surrounding the outer periphery of the device region, or only an image of the region including the mark 98 in the device region can be acquired. If the imaging region is limited, the time required for the image acquisition step S50 can be shortened.

[0106] After the image acquisition step S50, first, the control section 94 performs image processing to detect the edges of the acquired image. Next, the control section 94 calculates the degree of coincidence of the geometry defined by the edges with the geometry registered in advance by a prescribed process such as pattern matching, thereby extracting the prescribed pattern formed on the front surface 11a side.

[0107] The extracted prescribed pattern and the positional information of the prescribed pattern and the like are stored in the storage section 96 (storage step S60). For example, in the case where the mark 98 shown in (B) and the like of FIG. 8 is used as the prescribed pattern, the shape of the mark 98 and the coordinates of the corners B, C, D and the like of the mark 98 located on the side of the division intended line 13 are stored in the storage section 96. Figure 9

[0108] At this time, the coordinates of at least any one of the division intended line 13, the device 15, and the circuit 100, for which the relative positional relationship with the mark 98 is determined in advance, are also stored in the storage section.

[0109] The image on the front surface 11a side is stored in the storage section 96 in the storage step S60, for example, in the same state as the orientations of the X-axis direction and the Y-axis direction when the back surface lib side is observed (i.e., when the workpiece 11 is observed from above).

[0110] In addition, in order to make the orientations of the X-axis direction and the Y-axis direction of the image on the front surface 11a side the same as the orientations of the image on the back surface lib side, for example, the control section 94 can perform a prescribed coordinate conversion (e.g., mirror conversion of flipping the image with respect to the X-axis) on the image on the front surface 11a side. The prescribed coordinate conversion is performed, for example, by prescribed software stored in the control section 94.

[0111] In addition, instead of performing the prescribed coordinate conversion, the front surface 11a side can be imaged via a mirror surface inclined by 45 degrees with respect to the X-axis on the XZ plane, thereby imaging the image on the front surface 11a side after mirror conversion with respect to the X-axis.

[0112] ​In the present embodiment, in which the imaging lens (not shown) of the lower photographing unit 54 is disposed in opposition to the other face 12b, a mirror surface inclined 45 degrees with respect to the X axis in the XZ plane is disposed, for example, at a prescribed position between the imaging lens and the photographing element (not shown) of the lower photographing unit 54. Alternatively, the inclined mirror surface can be disposed between the cover glass (not shown) disposed in opposition to the other face 12b and the photographing lens disposed with the optical axis in the X axis direction.

[0113] In addition, the mirror surface inclined 45 degrees with respect to the X axis in the XZ plane can also be disposed outside the lower photographing unit 54 in a state in which the position of the lower photographing unit 54 is fixed. In this case, the optical axis of the imaging lens of the lower photographing unit 54 is disposed in the X axis direction in a manner facing the mirror surface.

[0114] An arbitrary XY coordinate position on the front face 11a side can be determined with the intersection point 12c3 as the origin of the coordinate system, and an arbitrary XY coordinate position on the back face 11b side can be determined with the intersection point 12c3 as the origin of the coordinate system. Thus, a second region on the front face 11a side corresponding to a first region on the back face 11b side can be determined.

[0115] After the storing step S60, the workpiece 11 is subjected to cutting (cutting step S70). Figure 7 is a view showing the cutting step S70. In the cutting step S70, first, the high-speed rotating cutting tool 82b is positioned on the extension line of the division predetermined line 13. At this time, the lower end of the cutting tool 82b is positioned between the front face 11a and the back face 11b of the workpiece 11.

[0116] Then, the holding stage 10 and the cutting tool 82b are relatively moved in the X axis direction by the X axis moving mechanism 26. Thus, the workpiece 11 is partially cut (machined) by the cutting tool 82b from the back face 11b side to a prescribed depth that does not reach the front face 11a in the thickness direction of the workpiece 11 (i.e., half-cutting), and a groove (machining groove) 11c is formed along the division predetermined line 13.

[0117] In addition, the cutting in the cutting step S70 is not limited to half-cutting. In the cutting step S70, the workpiece 11 can also be cut in a manner that is cut from the back face 11b to the front face 11a (i.e., full-cutting).

[0118] After the workpiece 11 is cut along one division predetermined line 13 parallel to the X axis direction, the cutting tool 82b is positioned on the extension line of the adjacent division predetermined line 13 in the Y axis direction by indexing feed of the cutting unit 78. Then, the workpiece 11 is cut along the division predetermined line 13 as well.

[0119] After cutting the arbitrary number of division intended lines 13, the operator acquires the image of the back surface 1 lb side using the upper photographing unit 84 and displays it on the touch panel 92 (back surface display step S80).

[0120] Figure 8 is a view illustrating the back surface display step S80. In Figure 8 , the control section 94 and the like are illustrated with a function block diagram. In addition, the lower photographing unit 54 retreats from the space 18d of the X-axis moving work table 18.

[0121] In the back surface display step S80 of the present embodiment, the control section 94 displays the prescribed pattern including the mark 98 and the like of the second region on the front surface 1 la side corresponding to the first region on the back surface 1 lb side in the thickness direction of the workpiece 11, overlapped with the image of the first region on the back surface 1 lb side, on the touch panel 92.

[0122] Figure 9 (A) of is an example of the image of the first region on the back surface 1 lb side. In Figure 9 (A) of, the region indicating the groove 11c formed on the back surface 1 lb side is illustrated with a blacked region. Figure 9 (B) of is an example of the image of the second region on the front surface 1 la side corresponding to the first region on the back surface 1 lb side.

[0123] In Figure 9 (B) of, the outline of the device 15, the division intended line 13, the mark 98, and the circuit 100 are illustrated. In addition, as described above, Figure 9 the orientation of the X-axis direction and the Y-axis direction of the image of the second region on the front surface 1 la side illustrated in (B) of is the same as the orientation of the X-axis direction and the Y-axis direction of the back surface 1 lb side of the workpiece 11.

[0124] The control section 94 reads out the image of the second region corresponding to the first region on the back surface 1 lb side from the storage section 96 and causes the image 102 in which the prescribed pattern in which the image of the second region is overlapped with the image of the first region on the back surface 1 lb side to be displayed on the touch panel 92 (refer to Figure 10 ). Thereby, the operator can confirm whether the groove 11c formed on the workpiece 11 is formed along the division intended line 13.

[0125] In the present embodiment, the image on the back surface 1 lb side displayed on the touch panel 92 is a real-time image on the back surface 1 lb side acquired by the upper photographing unit 84, but can be a still image on the back surface 1 lb side acquired by the upper photographing unit 84.

[0126] Figure 10 is an example of the image displayed in the back surface display step S80 (image 102). In Figure 10In the image 102, the outlines of the devices 15, the division- scheduled lines 13, the marks 98, and the circuit 100 are shown by dotted lines.

[0127] In the back surface display step S80, the image 102 is displayed on the touch panel 92. In the image 102, the outlines of the devices 15, the division- scheduled lines 13, the marks 98, and the circuit 100 are shown by dotted lines. Figure 10 In the image 102, the outlines of the devices 15, the division- scheduled lines 13, the marks 98, and the circuit 100 are shown by dotted lines.

[0128] In addition, the outlines of the division- scheduled lines 13, the marks 98, and the like can also be displayed on the image 102 in a state in which they are processed into prescribed thicknesses, prescribed colors, and prescribed brightnesses after a binarization process is performed on the image of the front surface 11a side, so as to make the division- scheduled lines 13, the marks 98, and the like conspicuous.

[0129] In addition, as shown in FIG. 10, in the image 102, only the outlines of the division- scheduled lines 13, the marks 98, and the like are displayed, but the image of the division- scheduled lines 13, the marks 98, and the like can also be displayed without the outlines. Figure 10

[0130] After the back surface display step S80, in a case in which the workpiece 11 is not cut along all of the division- scheduled lines 13, the cutting step S70 is returned to, and the workpiece 11 is cut. The cutting step S70 and the back surface display step S80 can also be repeatedly performed a plurality of times.

[0131] After the workpiece 11 is cut along all of the division- scheduled lines 13 parallel to the X-axis direction, the rotation drive source 30 is caused to operate, and the holding stage 10 is rotated by 90 degrees. Then, the cutting step S70 is performed again. At this time, the cutting step S70 and the back surface display step S80 can also be repeatedly performed a plurality of times.

[0132] In addition, in the back surface display step S80, an image in which at least a region of the image of the first region that represents the groove 11c is overlaid with an image that contains a prescribed pattern of the marks 98 and the like contained in the second region can also be displayed on the touch panel 92. Figure 11 is another example of the image displayed in the back surface display step S80 (image 102a). In the image 102a, the outlines of the groove 11c are shown by dotted lines. Figure 11

[0133] In the image that contains the region that represents the groove 11c, as shown in FIG. 11, only the outlines of the groove 11c can be displayed, or the groove 11c as obtained by imaging can be directly displayed. In any case, in the image of the first region, at least the region that represents the groove 11c is used. In this way, even in a case in which the touch panel 92 displays the image 102a, the operator is able to confirm whether or not the groove 11c formed in the workpiece 11 is formed along the division- scheduled line 13. Figure 11 In the image that contains the region that represents the groove 11c, as shown in FIG. 11, only the outlines of the groove 11c can be displayed, or the groove 11c as obtained by imaging can be directly displayed. In any case, in the image of the first region, at least the region that represents the groove 11c is used. In this way, even in a case in which the touch panel 92 displays the image 102a, the operator is able to confirm whether or not the groove 11c formed in the workpiece 11 is formed along the division- scheduled line 13.​​

[0134] Next, the second embodiment will be described. In the second embodiment, the workpiece 11 is processed by a laser processing device (processing device) 104 instead of the cutting device 2. However, the above-described placement step S10 to the back surface display step S80 are performed similarly to the first embodiment.

[0135] Figure 12 FIG. 10 is a perspective view of the laser processing device 104 of the second embodiment. The same reference numerals are assigned to the same structural elements as those of the cutting device 2 of the first embodiment. Hereinafter, mainly the differences from the cutting device 2 will be described.

[0136] In the laser processing device 104, the lower photographing unit 54 is fixed to the stationary base 106. In addition, the X-axis moving table 18 is disposed in a state in which the XY plane is rotated by 90 degrees in the direction of the side plate 18b of the X-axis moving table 18, so that the lower photographing unit 54 can enter the space 18d from the region on the side opposite to the side plate 18b of the X-axis moving table 18.

[0137] The laser processing device 104 has a Y-axis moving table 108 to which a pair of X-axis guide rails 20 is fixed. The Y-axis moving table 108 is slidably mounted on a pair of Y-axis guide rails 110 fixed to the upper surface of the stationary base 106.

[0138] In addition, a Y-axis scale 110a used when detecting the position in the Y-axis direction of the Y-axis moving table 108 is provided at a position adjacent to the Y-axis guide rails 110. A nut portion (not shown) to which a Y-axis ball screw 112 substantially parallel to the Y-axis guide rails 110 is rotatably coupled is provided on the lower surface side of the Y-axis moving table 108.

[0139] The Y-axis ball screw 112 is coupled to a Y-axis pulse motor 114 at one end portion thereof. If the Y-axis ball screw 112 is rotated by the Y-axis pulse motor 114, the Y-axis moving table 108 moves in the Y-axis direction along the Y-axis guide rails 110. The Y-axis guide rails 110, the Y-axis ball screw 112, the Y-axis pulse motor 114, and the like constitute a Y-axis moving mechanism 116 that moves the Y-axis moving table 108.

[0140] A column 118 is provided in a manner that protrudes upward from the upper surface of the stationary base 106 at a position adjacent to the lower photographing unit 54. A housing 120 having an elongated portion substantially parallel to the X-axis direction is provided on the column 118.

[0141] At least a portion of a laser irradiation unit 122 is provided on the housing 120. The laser irradiation unit 122 has a laser oscillator (not shown) and the like for generating a laser beam having a wavelength that is absorbed by the workpiece 11 or a wavelength that transmits through the workpiece 11.

[0142] An irradiation head 124 including a condenser is provided at the front end portion in the X-axis direction of the laser irradiation unit 122. The laser beam of a prescribed wavelength generated by the laser irradiation unit 122 is irradiated downward from the irradiation head 124 through a prescribed optical system. In addition, at the front end portion of the housing 120, an upper photographing unit 84 is provided at a position adjacent to the irradiation head 124.

[0143] In the back surface display step S80 of the second embodiment, a prescribed pattern such as the marker 98 acquired in the image acquisition step S50 can also be displayed superimposed on the image of the first region on the back surface 11b side of the touch panel 92. Thereby, the operator can confirm whether the groove 11c formed in the workpiece 11 is formed along the division predetermined line 13.

[0144] In addition to this, the configuration, method, and the like of the above-described embodiments can be appropriately changed and implemented within a range not departing from the object of the present application. For example, in the second embodiment, a Y-axis moving mechanism that moves the Z-axis moving mechanism 42 in the Y-axis direction can also be added as in the first embodiment.

Claims

1. A processing apparatus, characterized in that, The processing device has the following features: A plate-shaped holding table includes one side and another side located on the opposite side of the one side, and the holding table has a defined area formed from the one side to the other side by a transparent material; The processing unit processes a workpiece with a predetermined pattern on its front side held by one face of the holding table and with the back side of the workpiece exposed upwards. The first shooting unit is positioned above the holding worktable in a manner facing the one above it; The second shooting unit is positioned below the holding worktable in a manner facing the other one; A display unit that displays an image captured by at least one of the first and second imaging units; and The control unit includes a storage unit that stores position information of a predetermined pattern contained in an image of the front side of the workpiece held by one face of the holding table, obtained by using the second imaging unit to capture the front side of the workpiece. The control unit displays the predetermined pattern of the front side contained in a second region of the front side corresponding to a first region of the back side of the workpiece in the thickness direction of the workpiece on the display unit by overlaying the image of the first region of the back side captured by the first imaging unit.

2. The processing apparatus according to claim 1, characterized in that, The image of the first region displayed by the display unit includes an area representing the processing groove formed by the processing unit. The control unit causes the prescribed pattern in the second region to be displayed on the image of the first region, which includes the area representing the processing groove.

3. The processing apparatus according to claim 1, characterized in that, The image of the second region is displayed on the display unit. The image of the first region includes an area representing the machining groove formed by the machining unit. The control unit causes at least the area representing the processing tank in the image of the first region to be displayed on the image of the second region.

4. The processing apparatus according to any one of claims 1 to 3, characterized in that, The control unit displays the images of the first and second regions on the display unit by making the orientations of the X and Y axes the same in the images of the first and second regions.

5. The processing apparatus according to any one of claims 1 to 3, characterized in that, The machining unit is either a cutting unit equipped with cutting tools or a laser irradiation unit that irradiates a laser beam.

Images