Electronic circuit unit
By employing bus assemblies with specific arrangements and connections in the converter, the inductance and loss problems caused by bus stacking connections are solved, achieving low-inductance and low-loss current connections, improving connection stability and ease of manufacturing.
Patent Information
- Application Number
- CN202011400411.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-12-05
- Filing Date
- 2020-12-04
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2040-12-04
AI Technical Summary
In existing converters and inverters, the stacked connection of busbars leads to increased inductance and power loss, making it difficult to achieve low inductance and low loss current connection.
The method employs a connection component, including a carrier substrate and a busbar, which is arranged and connected in a specific manner on the carrier substrate. Electrical insulation is achieved by constructing recesses in the patch area, thereby reducing the line cross-section and inductance of the busbar.
It achieves low-inductance and low-loss current connection, reduces the impedance of inductive and ohmic connections, and improves connection stability and ease of manufacturing.
Smart Images
Figure CN112928562B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an electronic circuit unit, and more particularly to a circuit unit used as an inverter for a motor or as a converter. Background Technology
[0002] In hybrid or electric vehicles, a converter and converter structure is employed that has a commutation circuit consisting of, for example, an intermediate circuit capacitor and a half-bridge constructed within a power module. For example, a converter is used to provide phase current to a motor. The converter and converter include, for example, a power module and at least one intermediate circuit capacitor that provides electrical energy for short periods. The power module may include, for example, a carrier substrate with printed conductors, on which, for example, power semiconductors are arranged, forming an electronic component assembly together with the carrier substrate. It is known that the connection contacts of the intermediate circuit capacitor are electrically connected to the power module. For this purpose, contact elements leading from the power module that electrically contact the electronic component assembly are connected to the connection contacts of the intermediate circuit capacitor, for example, constructed as a busbar.
[0003] US 2007 0109715 A1 describes such an intermediate loop capacitor that is electrically connected to the power module.
[0004] Due to the high current, the current-carrying element must have a correspondingly low resistance, and thus a large cross-section, through which electrical and / or electronic components are connected to each other. The repeated switching process results in high frequency-dependent power loss due to the alternating current. It is known that a significant reduction in inductance caused by the switching process, and consequently a significant reduction in power loss, is achieved through planar and parallel current guidance and through the magnetic interaction between current layers caused by opposite current directions. Therefore, the current in such a component is guided via, for example, from an intermediate loop capacitor and also referred to as busbars. Here, for example, two busbars with opposite current directions, i.e., the feed conductor and the return conductor, are directly stacked and guided parallel to each other with a small spacing.
[0005] In the case of connections between different electrical and / or electronic components, such as between a power module and an intermediate circuit capacitor, to establish a safe and secure connection, the parallel and overlapping guides of the busbar in the area establishing the connection are interrupted. The interruption of the overlapping guides of the busbar results in increased inductance in the area where the electrical and / or electronic components are connected, and thus leads to increased losses in the assembly. Summary of the Invention
[0006] According to the present invention, a connection assembly for electrically contacting an inverter with an intermediate circuit capacitor is provided. The connection assembly includes a carrier substrate and a bus pair, wherein at least one first conductor surface and two second conductor surfaces electrically insulated from the first conductor surface are formed on the carrier substrate, wherein the two second conductor surfaces are formed side-by-side on the carrier substrate in a first direction, wherein a contact area of the first conductor surface extends through the space between the two second conductor surfaces in a second direction, wherein the second direction is arranged perpendicular to the first direction, wherein a connection area of the first conductor surface is connected to the contact area of the first conductor surface, wherein the connection area has a connection width in the first direction, and the contact area has a contact width in the first direction, wherein the connection width is greater than the contact width, and wherein the bus pair includes a... A first bus having a first connection region and a second bus having a second connection region, wherein the first connection region of the first bus extends in a first direction with its plane parallel to the first conductor surface, and the first connection region is electrically connected to the first conductor surface at the connection region along the first direction, wherein the second connection region of the second bus extends in a first direction with its plane parallel to the second conductor surface, and the second connection region is electrically connected to the second conductor surface at the second connection region along the first direction, wherein a recess is formed in the second bus in the region of the patch region, thereby separating the second bus from the patch region in that region and thus electrically insulating it.
[0007] Compared to existing technologies, the connection assembly according to the invention has advantageously low inductance. The buses can also be arranged planarly with small spacing in the region where the buses connect to the carrier substrate. The reduction in the bus line cross-section towards the carrier substrate is advantageously minimized and must be reduced relatively little in the connection assembly according to the invention, thereby ensuring a particularly low-ohmic connection between the bus and the carrier substrate. In this connection assembly, the current-guiding regions of the two buses are also closely stacked in the regions where the buses extend towards the carrier substrate, thereby constructing these regions with particularly low inductance. The first conductor surface is also covered by the second bus. Therefore, the total inductance of the connection assembly is advantageously reduced.
[0008] Furthermore, the connecting components according to the invention can be advantageously and easily manufactured, and are particularly insensitive to tolerances.
[0009] Other advantageous designs and improvements of the invention are achieved by means of the features described below.
[0010] According to an advantageous embodiment, two second conductor surfaces extend in a first direction over a width substantially equal to the connection width of the connection area of the first conductor surfaces. Surfaces thus constructed on a carrier substrate can be contacted along the first direction by busbars constructed with substantially the same width over a similarly wide range. Therefore, a low-inductance connection assembly is advantageously formed.
[0011] According to an advantageous embodiment, the patch width is less than 30% of the connection width, preferably less than 20%, and particularly preferably less than 10%. Therefore, despite the patch area of the first conductor surface between the second conductor surfaces, the two second conductor surfaces can still be advantageously arranged close to each other. Therefore, the recess in the second bus that bridges the first conductor surface can be advantageously constructed to be small. Therefore, the area of the second bus that electrically contacts the second conductor surface along the first direction is constructed to be particularly large, and is interrupted only by opposing recesses in the second bus that bridge the patch area of the first conductor surface.
[0012] According to an advantageous embodiment, the patch area of the first conductor surface, together with the connection area of the first conductor surface, is configured in a T-shape. This results in a patch area on the first conductor surface that is narrower than the connection area. The bus can thus be electrically connected to the conductor surface along a first direction over an advantageously wide area.
[0013] According to an advantageous embodiment, a first connection region of the first bus is disposed between the connection region of the first conductor surface and the second bus. The second bus thus covers the first bus up to its end at the first connection region, at which point current is diverted from the first bus into the first conductor surface. The connection region of the first conductor surface is also covered by the second bus.
[0014] According to an advantageous embodiment, the first bus is configured as a stepped shape having a first intermediate region bent from the first connection region and a first base region bent from the first intermediate region, and / or the second bus is configured as a stepped shape having a second intermediate region bent from the second connection region and a second base region bent from the second intermediate region. Guided by the stepped shape of the bus, the bus can advantageously and easily be guided from the upper side of a substrate on which the first and second conductor surfaces are arranged to the conductor surfaces. The connection region of the bus can be arranged planar parallel to the carrier substrate, while the base region, although planar parallel to the carrier substrate, is spaced apart from the carrier substrate in a third direction perpendicular to the carrier substrate.
[0015] According to an advantageous embodiment, the first base region and the second base region are arranged in a plane parallel to each other, and / or the first intermediate region and the second intermediate region are arranged in a plane parallel to each other. This achieves the goal of guiding current as parallel to each other as possible in the two buses. Consequently, an advantageously small inductance is achieved in the connection assembly.
[0016] According to an advantageous embodiment, an electrically insulating element is arranged between the first bus and the second bus, particularly between the first base region of the first bus and the second base region of the second bus, the insulating element making the first bus and the second bus electrically insulated.
[0017] Furthermore, according to the invention, an electronic circuit unit, particularly one used as a converter for a motor or as a transducer, is proposed, comprising a contact component according to the invention. Therefore, if this connection component is applied, for example, in the intermediate circuit of the converter to connect the power electronic unit to the intermediate circuit capacitor, the electronic circuit unit can be advantageously configured to have particularly low inductance.
[0018] According to an advantageous embodiment, at least one electronic unit, particularly a power electronic unit, is constructed on a carrier substrate, wherein the electronic circuit unit further includes at least one electrical component or electronic component, wherein a first bus is configured for electrically contacting the electronic component, and a second bus is configured for electrically contacting the electronic component. Attached Figure Description
[0019] Embodiments of the present invention are shown in the accompanying drawings and explained in detail in the following description. Wherein are shown:
[0020] Figure 1 An illustration of one embodiment of the carrier substrate is shown.
[0021] Figure 2 The first bus is shown Figure 1 A diagram of the carrier substrate.
[0022] Figure 3 It shows having Figure 2 An illustration of one embodiment of the connection assembly between the carrier substrate, the first busbar, and the second busbar.
[0023] Figure 4 It shows Figure 3 A side view of an embodiment of the connection component. Detailed Implementation
[0024] The connection component 2 according to the invention can be applied in electronic circuit units, such as those used in motor vehicle technology, for example, in converters or inverters. For example, electronic circuit unit 1 can be used as an inverter for operating a motor in, for example, a hybrid vehicle or an electric vehicle; this inverter is also referred to as a converter.
[0025] Here, electronic circuit unit 1 includes electronic units, particularly power electronic units including carrier substrate 5. Various electrical and / or electronic devices (not shown in the figures), such as power semiconductors, such as field-effect transistors (FETs), IGBTs (Insulated Gate Bipolar Transistors), power MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), and / or diodes, such as rectifier diodes, can be arranged on the substrate side of carrier substrate 5. For example, this can refer to unpackaged power semiconductors (bare-die). Furthermore, passive devices such as resistors or capacitors can also be arranged on carrier substrate 5 as electrical and / or electronic devices. Carrier substrate 5 can form electronic units, particularly power electronic units, and especially circuit units, together with the electrical and / or electronic devices arranged on the carrier substrate.
[0026] In addition, the electronic circuit unit 1 also includes electrical and / or electronic components 8 disposed outside the carrier substrate 5. The electrical and / or electronic components 8 may, for example, refer to capacitors. These electrical and / or electronic components may, for example, refer to power capacitors, which serve as intermediate-loop capacitors for example, in the electronic circuit unit 1. Such capacitors may also include multiple capacitor elements electrically connected to each other, each capacitor element forming its own capacitance, and may also include conductive connecting elements necessary for the conductive connection of these capacitor elements. Here, different capacitor technologies can be used as capacitors or as capacitor elements, such as film capacitors, stacked capacitors, or Rundwickel capacitors, or other suitable capacitor technologies. Buses may, for example, be the busbars of the electrical and / or electronic components 8, such as intermediate-loop capacitors. Busbars may be implemented as a single piece and extend one piece from the electrical and / or electronic components 8 to the carrier substrate 5. However, buses may also be implemented in multiple pieces, where the various components together form a busbar extending from the electrical and / or electronic components 8. In particular, the first busbar 15 can be implemented in one piece, while the second busbar 25 can be implemented in two pieces.
[0027] In electronic circuit unit 1, the busbars of electrical components and / or electronic components 8 can be electrically contacted with power electronic units on carrier substrate 5 via connection assembly 2.
[0028] The connection assembly 2 includes a carrier substrate 5 having a first conductor surface 10 and a second conductor surface 20, and a bus pair, the bus pair being electrically connected to the first conductor surface 10 and the second conductor surface 20 of the carrier substrate 5. Here, the first bus 15 is electrically connected to the first conductor surface 10. The second bus 25 is electrically connected to both second conductor surfaces 20. The following is achieved by means of... Figures 1 to 4 An embodiment of the connecting component 2 is described.
[0029] Figure 1 Only carrier substrate 5 is shown. Carrier substrate 5 may include multiple layers made of conductive materials such as metals and / or dielectric materials. Carrier substrate 5 refers, for example, to a circuit carrier, which in this embodiment refers to a DBC substrate (direct bonded copper). Carrier substrate 5 may also refer to, for example, an AMB substrate (active metal brazing), IMS (insulating metal substrate), a circuit board (PCB, printed circuit board), or other substrate suitable for power modules.
[0030] The carrier substrate 5 also includes printed wires and / or conductor surfaces. Electrical and / or electronic components can be electrically connected to each other or to other electrical and / or electronic components disposed outside the electronic unit, for example, through the printed wires and / or conductor surfaces of the carrier substrate 5, through bonding wires, or other suitable conductive contact elements, such as by soldering or sintering. The printed wires can be configured as a first conductor surface 10 and a second conductor surface 20, as in this embodiment. The first conductor surface 10 here has, for example, a polarity opposite to that of the second conductor surface 20, denoted by T-, while the polarity of the second conductor surface 20 is denoted by T+. The second conductor surface 20 has the same polarity T+. Only a portion of the carrier substrate 5 for connecting the bus is shown in the figures. The first conductor surface 10 is configured as a connection point for electrical connection to the first bus 15 and forms only the larger conductor surface or the end of the printed wire on the carrier substrate 5. The second conductor surface 20 is configured as a connection point for electrical connection to the second bus 25 and forms only the larger conductor surface or the end of the printed wire on the carrier substrate 5.
[0031] The carrier substrate 5 of the electronic unit can be disposed, for example, on the upper side of the cooling body (not shown in the figures) and can be brazed to the upper side of the cooling body. The carrier substrate 5 can be disposed on the cooling body directly or with an intermediate thermally conductive layer. The cooling body is used to dissipate the heat generated in the electronic unit 4 and is characterized by high thermal conductivity. The cooling body is made of a material with good thermal conductivity, such as aluminum or copper. The cooling body can be made of copper, for example, and constructed as a plate. Structures for improving heat dissipation, such as fins, pins, or channels, can also be constructed on the cooling body. The carrier substrate 5 of the electronic unit can also be disposed directly on the upper side of the cooling body and insulated from the cooling body, for example, by an electrically insulating layer included by the carrier substrate 5.
[0032] A first conductor surface 10 and a second conductor surface 20 are formed on the substrate surface of a carrier substrate 5. The first conductor surface 10 and the second conductor surface 20 are electrically insulated from each other. The arrangement of the conductor surfaces relative to each other is described in terms of direction. Here, a first direction R1 and a second direction R2 extend parallel to the carrier substrate 5, wherein the second direction R2 extends perpendicular to the first direction R1. A third direction R3 extends perpendicular to the first direction R1 and perpendicular to the second direction R2, and thus perpendicular to the carrier substrate 5. The two second conductor surfaces 20 are arranged side by side on the carrier substrate 5 in the first direction R1. The two second conductor surfaces 20 are spaced apart from each other by an intermediate space on the carrier substrate 5. The patch region 11 of the first conductor surface 10 is arranged in the intermediate space between the two second conductor surfaces 20. The patch region 11 of the first conductor surface 10 passes between the two second conductor surfaces 20 in the second direction R2 and then widens laterally to the connection region 12 of the first conductor surface 10. Therefore, the patch region 11 and the connection region 12 together form a T-shape.
[0033] In the first direction R1, the patch region 11 has a patch width s. The connection region 12 has a connection width v in the first direction R1. The two second conductor surfaces 20 extend together through a width b in the first direction R1. In this embodiment, the connection width v is greater than the patch width s. The patch width s can be, for example, less than 30% of the connection width v, preferably less than 20% or particularly preferably less than 10%. The connection width v can, for example, substantially correspond to the width b, as in this embodiment. Therefore, the connection region 12 of the first conductor surface 10 extends in the first direction R1 to the outer edges of the two second conductor surfaces.
[0034] The first conductor surface 10 and the second conductor surface 20 are constructed symmetrically about a plane E that extends through a patch region 11 of the first conductor surface 10 and is perpendicular to the carrier substrate 5.
[0035] The connection of the bus to the carrier substrate 5 is described below. In the context of this application, a bus is understood as a conductive planar conductor, such as a conductive strip or conductive bar. Therefore, a bus can be, for example, a bus bar. A bus can be, for example, curved or arched, or it can extend in a curved or stepped shape.
[0036] Figure 2 Show Figure 1The carrier substrate 5 is connected to the first bus 15. The first bus 15 has a first connection region 16, an intermediate region 17, and a first base region 18. The first bus 15 is constructed in a stepped shape, wherein the intermediate region 17 is bent from the first base region 18, and the first connection region 16 is bent from the intermediate region 17. The first connection region 16 is arranged parallel to the carrier substrate 5 and extends parallel to the connection region 12 of the first conductor surface in a first direction R1. Along the first direction R1, the first connection region 16 of the first bus 15 is electrically connected to the connection region 12 of the first conductor surface 10, for example, by welding. The connection between the first connection region 16 and the connection region 12 of the first conductor surface 10 extends in the first direction R1. The first bus 15 may, for example, have slits, thereby dividing the first bus 15 into a plurality of parallel connecting pieces.
[0037] Figure 3 Show Figure 1 and Figure 2 The carrier substrate 5 is connected to the first busbar 15 and the second busbar 25. The second busbar 25 has a second connecting region 26, a second intermediate region 27 and a second base region 28. The second busbar 25 is constructed in a stepped manner, wherein the intermediate region 27 bends from the second base region 28 and the second connecting region 26 bends from the intermediate region 27.
[0038] The second connection region 26 is arranged parallel to the carrier substrate 5 and extends parallel to the two second conductor surfaces 20 in a first direction R1. Along the first direction R1, the second connection region 26 of the second bus 25 is electrically connected to the two second conductor surfaces 20, for example, by soldering. The electrical connection between the second connection region 26 and the two second conductor surfaces 20 extends in the first direction R1 and is interrupted by the tab region 11 of the first conductor surface 10 that separates the two second conductor surfaces 20 from each other. In the region where the tab region 11 of the first conductor surface 10 separates the two second conductor surfaces 20 from each other, a recess 29 is formed in the second bus 25, through which the second bus 25 is spaced apart from the tab region 11 of the first conductor surface 10 in this region and thereby electrically insulated from the first conductor surface.
[0039] The first bus 15 and the second bus 25 are symmetrically constructed about a plane E that extends through the patch area 11 of the first conductor surface 10 and is arranged perpendicular to the carrier substrate 5.
[0040] like Figure 4As shown, the first connection region 16 of the first bus 15 is arranged between the carrier substrate 5 and the second bus 25. The second bus 25 overlaps with the first bus 15. The second bus 25 is arranged above and at least partially covers the first bus 15 and the connection region 12 in a first direction R1. The buses extend at least partially parallel to each other. For example, the plane of the first base region 18 of the first bus 15 is parallel to the plane of the second base region 28 of the second bus 25. Here, the first base region 18 and the second base region 28 of the bus are separated from each other, for example, only by the intermediate insertion of an insulating element 40, such as an insulating film. Here, the insulating element 40 between the buses is used to electrically insulate the two buses from each other.
[0041] Of course, other embodiments and combinations thereof are also possible.
Claims
1. A connection assembly (2) for electrically contacting a converter with an intermediate circuit capacitor, comprising a carrier substrate (5) and a busbar pair, wherein at least one first conductor plane (10) and two second conductor planes (20) electrically insulated from the first conductor plane (10) are configured on the carrier substrate (5), wherein the two second conductor planes (20) are configured side by side on the carrier substrate (5) in a first direction (R1), wherein a tab region (11) of the first conductor plane (10) extends in a second direction (R2) through between the two second conductor planes (20), wherein the second direction (R2) is arranged perpendicular to the first direction (R1), wherein a connection region (12) of the first conductor plane (10) is coupled with the tab region (11) of the first conductor plane (10), wherein the connection region (12) has a connection width (v) in the first direction (R1) and the tab region (11) has a tab width (s) in the first direction (R1), wherein the connection width (v) is greater than the tab width (s), wherein the busbar pair comprises a first busbar (15) with a first coupling region (16) and a second busbar (25) with a second coupling region (26), wherein the first coupling region (16) of the first busbar (15) extends plane-parallel to the first conductor plane (10) in the first direction (R1) and is electrically conductively connected with the first conductor plane (10) at the connection region (12) along the first direction (R1), wherein the second coupling region (26) of the second busbar (25) extends plane-parallel to the second conductor plane (20) in the first direction (R1) and is electrically conductively connected with the second conductor plane (20) at the second coupling region (26) along the first direction (R1), wherein a recess (29) is configured in the region of the tab region (11) in the second busbar (25), such that the second busbar (25) is spaced apart from and thereby electrically insulated from the tab region (11) in this region.
2. The connection assembly of claim 1, wherein, The two second conductor planes (20) extend in the first direction (R1) over a width (b), wherein the width (b) is equal to the connection width (v) of the connection region (12) of the first conductor plane (10).
3. The connection assembly according to claim 1 or 2, characterized in that The tab width (s) is less than 30% of the connection width (v).
4. The connection assembly of claim 1 or 2, wherein, The tab region (11) of the first conductor plane (10) is configured in a T shape together with the connection region (12) of the first conductor plane (10).
5. The connection assembly of claim 1 or 2, wherein, The first coupling region (16) of the first busbar (15) is arranged between the connection region (12) of the first conductor plane (10) and the second busbar (25).
6. The connection assembly of claim 1 or 2, wherein, The first busbar (15) is configured in a stepped shape with a first intermediate region (17) bent from the first connection region (16) and a first base region (18) bent from the first intermediate region (17), and / or the second busbar (25) is configured in a stepped shape with a second intermediate region (27) bent from the second connection region (26) and a second base region (28) bent from the second intermediate region (27).
7. The connection assembly of claim 6, wherein, The first base region (18) and the second base region (28) are arranged plane-parallel to one another, and / or the first intermediate region (17) and the second intermediate region (27) are arranged plane-parallel to one another.
8. The connection assembly of claim 1 or 2, wherein, An electrically insulating insulation element (40) is arranged between the first busbar (15) and the second busbar (25), which electrically insulates the first busbar (15) from the second busbar (25).
9. The connection assembly of claim 3, wherein, The tab width (s) is less than 20% of the connection width (v).
10. The connection assembly of claim 3, wherein, The tab width (s) is less than 10% of the connection width (v).
11. The connection assembly of claim 8, wherein, The electrically insulating insulation element (40) is arranged between the first base region (18) of the first busbar (15) and the second base region (28) of the second busbar (25).
12. An electronic circuit unit (1) comprising a connection assembly according to any one of claims 1 to 11.
13. The electronic circuit unit (1) according to claim 12, characterized in that The electronic circuit unit (1) is a circuit unit for use as an inverter for an electric machine or as a converter.
14. The electronic circuit unit (1) according to claim 12 or 13, characterized in that At least one electronic unit (4) is configured on the carrier substrate (5), wherein the electronic circuit unit (1) further comprises at least one electrical or electronic component (8), wherein the first busbar (15) is configured for electrically contacting the electronic component (8) and the second busbar (25) is configured for electrically contacting the electronic component (8).
15. The electronic circuit unit (1) according to claim 14, characterized in that The electronic unit (4) is a power electronic unit.
Citation Information
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