Electroplating device for single-core connector core

Abstract

The present invention discloses an electroplating device for a single-core connector core, wherein single-core connectors are evenly arranged on a positioning plate, a conductive plate is arranged on the upper end of the positioning plate, a conductive probe spring connected to the upper end of the connector core is evenly arranged on the upper end of the conductive plate, the lower end of the positioning plate is connected to the isolation plate through an insulating plate, and the connector core passes through the insulating plate and the isolation plate in sequence from top to bottom. The present invention places the electroplating device horizontally in an electroplating tank, with the plated metal in the electroplating tank as the anode and the core as the cathode to ensure the best current distribution, and the cations of the plated metal are reduced on the surface of the core to form a plating layer. The present invention changes the traditional wire binding core plating process, greatly reduces the labor cost of electroplating, reduces the dependence on skilled employees, and reduces the risk of the enterprise; improves the appearance quality of electroplating, solves the problem of core leakage plating quality caused by poor contact between wire printing and binding wire, and improves the electroplating pass rate.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating, and in particular relates to an electroplating device for a core body of a single-core connector. Background Art

[0002] Glass sintered single-core connectors have the advantages of simple structure, excellent sealing and mechanical properties, high pressure resistance, corrosion resistance, strong radiation resistance, etc. In recent years, they have been widely used in complex and harsh environments such as aviation, aerospace and ocean. In order to ensure the above performance, the leads or cores and shells of single-core connectors need to be electroplated during production. Since the core and shell of the connector are isolated by sintered glass, the two are not conductive. During the electroplating process, the core conducts electricity poorly. The film thickness of the core after gold plating is much lower than that of the shell. The gold plating thickness of the core is generally required to be greater than that of the shell, usually requiring the core to be greater than 1.27 microns and the shell to be greater than 0.5 microns. There are two common solutions in the electroplating industry: one is to electroplate the connector as a whole to the required gold layer thickness of the core. The biggest disadvantage of this process is that the thickness of the gold layer of the shell will be much greater than the required film thickness, resulting in a large waste of gold and high production costs; the other method is to first electroplate the connector as a whole to make the shell reach the required gold-plated film thickness, and then wire bind the core, that is, use a thin copper wire as the core power wire, manually wrap it around a single pin or core of each connector, and then use a special fixture to plate the core to the required gold layer thickness. This wire binding process has three disadvantages: wire binding is difficult. Due to the small size of the connector, which is generally only about 1 square centimeter or less, the single-side gap of the core is only about 1 mm or less, and manual binding is difficult. Therefore, this process has always had problems such as large manual workload and low production efficiency; due to wire binding wire printing and loose contact of the binding copper wire, the yield rate is low; the binding copper wire consumes a lot of gold and is not economical. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide an electroplating device for a single-core connector core that completely eliminates the wire binding process, greatly improves production efficiency and the qualified rate of electroplated products, and effectively reduces the plated metal and reduces production costs.

[0004] The technical solution adopted to solve the above technical problems is: single-core connectors are evenly arranged on the positioning plate, and the single-core connector is: a core body is arranged inside the shell, and the first insulating glass is respectively arranged at the upper and lower ends of the connection between the shell and the core body, and a second insulating glass is arranged around the outer side of the core body between the two first insulating glasses, a conductive plate is arranged at the upper end of the positioning plate, and conductive probe springs connected to the upper end of the core body are evenly arranged on the upper end of the conductive plate, and the lower end of the positioning plate is connected to the isolation plate through the insulating plate, and the core body passes through the insulating plate and the isolation plate from top to bottom in sequence.

[0005] The conductive plate of the present invention is a stainless steel plate, and the conductive probe spring is a copper conductive probe spring.

[0006] The insulating plate of the present invention is a silica gel plate.

[0007] The number of the single-core connectors 3 of the present invention is 50 to 2,000.

[0008] The number of the single-core connectors 3 of the present invention is the same as the number of the conductive probe springs.

[0009] The horizontal center line of the insulating plate of the present invention is parallel to the horizontal center lines of the positioning plate, the conductive plate and the isolation plate.

[0010] The conductive plate, the isolation plate, the insulating plate and the positioning plate of the present invention have the same shape.

[0011] The present invention places the electroplating device horizontally in the electroplating tank, the coating metal in the electroplating tank acts as the anode, and the core acts as the cathode, to ensure the best current distribution, and the cations of the coating metal are reduced on the surface of the core to form a coating. The present invention changes the traditional wire binding core plating process, greatly reduces the electroplating labor cost, reduces the dependence on skilled employees, and reduces the enterprise risk; improves the electroplating appearance quality, solves the core body leakage plating quality problem caused by poor contact between the wire print and the binding wire, and improves the electroplating qualified rate; saves the use of coating metal, and saves the use of coating metal by at least 40 to 200% compared with the above-mentioned traditional process. The present invention has the advantages of simple structure, repeated use, effective reduction of production cost, improvement of production efficiency, and improvement of electroplating appearance quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0013] Figure 2 yes Figure 1 Top view of the .

[0014] Figure 3 yes Figure 1 Schematic diagram of the structure of the single-core connector 3. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0016] Example 1

[0017] like Figure 1-3 As shown, the electroplating device for the core of a single-core connector of this embodiment is composed of a conductive plate 1, a conductive probe spring 2, an isolation plate 4, an insulating plate 5, and a positioning plate 6.

[0018] 440 positioning plate holes are evenly processed on the positioning plate 6, and single-core connectors 3 are respectively installed in the positioning plate holes. The single-core connector 3 is composed of a core body 301, a first insulating glass 302, a second insulating glass 303, and a shell 304. The core body 301 is installed inside the shell 304, and the first insulating glass 302 is installed at the upper and lower ends of the connection between the shell 304 and the core body 301. The second insulating glass 303 is installed around the outer side of the core body 301 between the first insulating glass 302 at the upper end and the first insulating glass 302 at the lower end. The first insulating glass 302 and the second insulating glass 303 are used to isolate the shell 304 and the core body 301 from mutual conduction. A conductive plate 1 is installed on the upper end of the positioning plate 6, and 440 conductive probe springs 2 are evenly installed on the conductive plate 1. The conductive probe spring 2 is connected to the upper end of the core body 301. The conductive plate 1 is a stainless steel plate, and the conductive probe spring 2 is a copper conductive probe spring. The number of single-core connectors 3 is the same as the number of conductive probe springs 2. The conductive probe spring 2 is used to make the core body 301 conductive, improve the appearance quality of electroplating, solve the quality problem of core body 301 leakage caused by poor contact between wire printing and binding wire, and improve the electroplating pass rate. The lower end of the positioning plate 6 is connected to the isolation plate 4 through the insulating plate 5. The insulating plate 5 is a silicone plate, which has the functions of friction resistance, buffering and insulation. The horizontal center line of the insulating plate 5 is parallel to the horizontal center lines of the positioning plate 6, the conductive plate 1 and the isolation plate 4. The conductive plate 1, the isolation plate 4, the insulating plate 5 and the positioning plate 6 have the same shape. 440 insulating plate holes are evenly processed on the insulating plate 5, and 440 insulating plate holes are evenly processed on the isolation plate 4. The core 301 passes through the insulating plate holes of the insulating plate 5 and the isolation plate holes of the isolation plate 4 from top to bottom.

[0019] Example 2

[0020] There are 50 positioning plate holes evenly processed on the positioning plate 6, and single-core connectors 3 are installed in the positioning plate holes respectively. A conductive plate 1 is installed on the upper end of the positioning plate 6, and 50 conductive probe springs 2 are evenly installed on the conductive plate 1. The conductive probe springs 2 are connected to the upper end of the core body 301, and the number of single-core connectors 3 is the same as the number of conductive probe springs 2. The lower end of the positioning plate 6 is connected to the isolation plate 4 through the insulating plate 5. The horizontal center line of the insulating plate 5 is parallel to the horizontal center lines of the positioning plate 6, the conductive plate 1, and the isolation plate 4. The conductive plate 1, the isolation plate 4, the insulating plate 5, and the positioning plate 6 have the same shape. There are 50 insulating plate holes evenly processed on the insulating plate 5, and there are 50 insulating plate holes evenly processed on the isolation plate 4. The core body 301 passes through the insulating plate holes of the insulating plate 5 and the isolation plate holes of the isolation plate 4 from top to bottom.

[0021] The connection relationship between other parts in this embodiment is the same as that in embodiment 1.

[0022] Example 3

[0023] 2000 positioning plate holes are evenly processed on the positioning plate 6, and single-core connectors 3 are installed in the positioning plate holes respectively. A conductive plate 1 is installed on the upper end of the positioning plate 6, and 2000 conductive probe springs 2 are evenly installed on the conductive plate 1. The conductive probe springs 2 are connected to the upper end of the core body 301, and the number of single-core connectors 3 is the same as the number of conductive probe springs 2. The lower end of the positioning plate 6 is connected to the isolation plate 4 through the insulating plate 5. The horizontal center line of the insulating plate 5 is parallel to the horizontal center lines of the positioning plate 6, the conductive plate 1, and the isolation plate 4. The conductive plate 1, the isolation plate 4, the insulating plate 5, and the positioning plate 6 have the same shape. 2000 insulating plate holes are evenly processed on the insulating plate 5, and 2000 insulating plate holes are evenly processed on the isolation plate 4. The core body 301 passes through the insulating plate holes of the insulating plate 5 and the isolation plate holes of the isolation plate 4 from top to bottom.

[0024] The connection relationship between other parts in this embodiment is the same as that in embodiment 1.

[0025] The operation steps of this embodiment are as follows:

[0026] The electroplating device is placed horizontally in the electroplating tank, with the plated metal in the electroplating tank acting as the anode and the core 301 acting as the cathode. The bath liquid in the electroplating tank submerges all the cores 301 to be electroplated. The bath liquid height in the electroplating tank is lower than the lower end of the conductive plate 1. The bottom end surface of the isolation plate 4 maintains a specified distance from the bottom of the electroplating tank to ensure optimal current distribution. The cations of the plated metal are reduced on the surface of the core 301 to form a coating.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. An electroplating device for a single-core connector core, characterized in that: Single-core connectors (3) are evenly arranged on the positioning plate (6), and the single-core connector (3) comprises: a core (301) is arranged inside a shell (304), a first insulating glass (302) is arranged at the upper end and the lower end of the connection between the shell (304) and the core (301), a second insulating glass (303) is arranged around the outer side of the core (301) between the two first insulating glasses (302), a conductive plate (1) is arranged at the upper end of the positioning plate (6), and a conductive probe spring (2) connected to the upper end of the core (301) is evenly arranged at the upper end of the conductive plate (1), and the lower end of the positioning plate (6) is connected to the isolation plate (4) through the insulating plate (5), and the core (301) passes through the insulating plate (5) and the isolation plate (4) in sequence from top to bottom.

2. The electroplating device for a single-core connector core according to claim 1, characterized in that: The conductive plate (1) is a stainless steel plate, and the conductive probe spring (2) is a copper conductive probe spring.

3. The electroplating device for a single-core connector core according to claim 1, characterized in that: The insulating plate (5) is a silica gel plate.

4. The electroplating device for a single-core connector core according to claim 1, characterized in that: The number of the single-core connectors (3) is 50 to 2000.

5. The electroplating device for a single-core connector core according to claim 4, characterized in that: The number of the single-core connectors (3) is the same as the number of the conductive probe springs 2.

6. The electroplating device for a single-core connector core according to claim 1, characterized in that: The horizontal center line of the insulating plate (5) is parallel to the horizontal center lines of the positioning plate (6), the conductive plate (1), and the isolation plate (4).

7. The electroplating device for a single-core connector core according to claim 1, characterized in that: The conductive plate (1), the isolation plate (4), the insulating plate (5), and the positioning plate (6) are of the same shape.

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