A semiconductor high voltage insulation detection device

Abstract

The present invention relates to the field of rectifier bridge chips and semiconductor high-voltage insulation testing in the field of chip detection, and is specifically a semiconductor high-voltage insulation detection device, including a horizontal track, a base, a detection platform and a lifting device. The detection platform is arranged on the upper part of the base and is fixedly connected to the upper end of the lifting device. The lower end of the base or the lifting device is slidably connected to the horizontal track. A chip placement groove is provided on the upper part of the base, a lower detection card slot is provided inside the chip placement groove, an upper sampling block is provided at the position corresponding to the lower detection card slot at the lower part of the detection platform, and the upper sampling block and the lower detection card slot form a slot with an open side and tightly wrapped around the chip, and the shape of the slot matches the shape of the chip body, and a detection probe is provided at the lower part of the detection platform corresponding to the slot opening, and a lead terminal is provided on the upper part of the detection platform that is electrically connected to the detection probe and the upper sampling block respectively, and the lead terminal is used to connect an external detection device. The present invention has the beneficial effect of quickly and accurately detecting the high-voltage resistance performance of a chip.

Description

Technical Field

[0001] The invention relates to the field of high voltage testing of rectifier bridge chips in the field of chip detection, and in particular to a semiconductor high voltage insulation detection device. Background Art

[0002] In the prior art, the method for high voltage resistance detection of chips is to apply high voltage to the pins of the chips, and then receive the leakage of the chip shell through the receiving component. At present, the chips are placed in the detection device manually, and then tested. After the test is completed, the tested chips are sorted according to the test results. It is convenient to detect a small number of chips, but it is very labor-intensive and material-intensive for large-scale production. In addition, in the case of manual detection, errors caused by human factors are prone to occur, which reduces the accuracy of the detection. Therefore, it is an urgent requirement to design a semiconductor high-voltage insulation detection device that can automatically and quickly detect chips. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a semiconductor high-voltage insulation detection device with an automated rapid detection chip.

[0004] The technical solution to the technical problem to be solved by the present invention is: a semiconductor high voltage insulation detection device, characterized in that:

[0005] It includes horizontal track, base, testing platform and lifting device;

[0006] The detection platform is arranged on the upper part of the base, and the detection platform is fixedly connected to the upper end of the lifting device, and the lower end of the base or the lifting device is slidably connected to the horizontal track;

[0007] The upper part of the base is provided with a chip placement groove, and the interior of the chip placement groove is provided with a lower detection card slot.

[0008] An upper sampling pressure block is provided at a position corresponding to the lower detection card slot at the lower part of the detection platform. The upper sampling pressure block and the lower detection card slot form a slot with an open side and tightly wrapping the chip. The shape of the slot matches the shape of the chip body. A detection probe is provided at the opening of the slot at the lower part of the detection platform. Lead terminals electrically connected to the detection probe and the upper sampling pressure block are provided at the upper part of the detection platform. The lead terminals are used to connect to an external detection device.

[0009] Preferably, a chip card slot having the same shape as the chip body is provided on one side of the lower detection card slot, one side of the chip card slot is open for placing the pins of the chip, and a supporting card slot is provided in the middle of the vertical edges on both sides of the open end of the chip card slot; the depth of the bottom of the supporting card slot from the bottom of the chip card slot is the same as the thickness of the chip; a wrapping groove is provided at a position opposite to the open side, and the depth of the wrapping groove is greater than the depth of the supporting card slot and less than the depth of the chip card slot;

[0010] A crimping protrusion is provided at a position of the lower part of the upper sampling pressing block corresponding to the supporting card slot, and a clamping protrusion is provided at a position of the lower part of the upper sampling pressing block corresponding to the wrapping groove.

[0011] Preferably, a center hole detection column is provided at the lower part of the upper sampling block, and when the lower detection slot and the upper sampling block are combined into one and loaded into the plastic-sealed chip, the center hole detection column is inserted into the center hole of the plastic-sealed chip.

[0012] Preferably, the horizontal track is provided with a pneumatically or electrically driven linear motion mechanism.

[0013] Preferably, protective plates are provided on both sides of the detection platform, and in the detection state, the lower edge of the protective plate is lower than the upper edge of the base.

[0014] More preferably, it also includes a feeding device arranged on one side of the base, and the feeding device includes:

[0015] Horizontal slide rail, parallel to the length of the base;

[0016] A carrier plate is slidably arranged on a horizontal slide rail, wherein a chip placement groove is arranged on the upper portion of the carrier plate, wherein the number of the chip placement grooves is the same as the chip placement grooves on the base, and the bottom of the chip placement groove is higher than or flush with the bottom of the chip placement groove;

[0017] The feeding drive mechanism drives the carrying plate to move on the horizontal slide rail;

[0018] The propulsion mechanism comprises a propulsion plate disposed on the upper portion of the carrier plate and a propulsion driver for driving the propulsion plate to move;

[0019] The lower part of the push plate is provided with a push tooth at a position corresponding to the chip placement slot;

[0020] The feeding device is arranged on the chip production line, and the base platform coincides with the plastic-encapsulated chip conveying track of the production line. When feeding:

[0021] The loading drive mechanism drives the carrier plate to move to one side of the conveying track, and pushes the plastic-encapsulated chips into the chip placement slots one by one through the air pipe or push rod on the production line;

[0022] After all the chip placement slots are inserted with the plastic-encapsulated chips, the loading drive mechanism drives the carrier plate to move to the side of the base and be flush with the base;

[0023] Then, the push driver is started to push the chip in the chip placement slot into the chip placement groove through the push plate.

[0024] More preferably, it also includes a sorting and discharging device arranged on one side of the base, and the sorting and discharging device includes:

[0025] A conveying track arranged parallel to the base, the conveying track comprising a qualified product conveying track and a non-qualified product conveying track;

[0026] A sorting rack is arranged between the conveying track and the base; the sorting rack comprises a sorting lifting rod, a sorting rack platform and a vacuum suction head arranged at the bottom of the sorting rack platform, and the vacuum suction head is connected to an electric control valve;

[0027] The conveying track or the sorting rack is slidably connected to the horizontal track; the conveying track or the sorting rack is provided with an output driving mechanism;

[0028] It also includes a controller electrically connected to the output drive mechanism, the sorting rack, the upper sampling block and the detection probe, and the controller controls the vacuum suction head to suck the plastic-sealed chip on the upper part of the detection table and place it on the conveying track.

[0029] Preferably, the base, the feeding device, and the sorting and discharging device are arranged at an angle, and the feeding device is higher than the sorting and discharging device.

[0030] Preferably, an anti-displacement support is provided at the position of the lower portion of the sorting platform corresponding to the through hole of the plastic-sealed chip.

[0031] Preferably, the conveying track is provided with a holding mechanism, which includes a holding plate, a release drive mechanism and an electric stop bolt arranged at the lower end of the conveying track;

[0032] The holding plate covers the upper part of the qualified product conveying track, the release drive mechanism is an electric push rod or a pneumatic push rod, the end of the telescopic end of the release drive mechanism is fixedly connected to the holding plate, and the telescopic direction of the release drive mechanism is perpendicular to the length direction of the holding plate and the qualified product conveying track;

[0033] The locking bolt of the electric stop bolt is driven by an electromagnet or a cylinder, and a retaining socket is provided at the lower end of the qualified product conveying track, and the locking bolt of the electric stop bolt is inserted into the retaining socket.

[0034] A control method for a semiconductor high voltage insulation detection device comprises the following steps:

[0035] Step 1: After the detection is completed, the controller controls the base to move from the lower part of the detection table to the sorting and discharging device;

[0036] Step 2: The controller controls the sorting rack to descend, and controls the electric valve of the vacuum suction head corresponding to the qualified product to open according to the detection result to suck the plastic-sealed chip;

[0037] Step 3: The controller controls the sorting rack to rise, and controls the conveying track to move to the lower part of the sorting rack, and then controls the sorting rack to descend, and then controls the electric air valve to close, and puts the sucked qualified products into the qualified product conveying track;

[0038] Step 4, then according to the unqualified products in the test results, the unqualified products are moved into the unqualified product conveying track according to the control method of step 2 and step 3;

[0039] Step 5, control the lock bolt of the electric stop bolt to descend, and control the holding plate to separate from the qualified product conveying track and the unqualified product conveying track. At this time, under the action of gravity, the qualified products and unqualified products enter the straight lines of different production lines respectively.

[0040] The beneficial effects of the present invention are:

[0041] 1. The beneficial effect of quickly and accurately testing the high voltage resistance performance of the chip.

[0042] 2. Automated testing greatly improves the efficiency of semiconductor testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a three-dimensional schematic diagram of the overlap of the detection platform and the base platform according to an embodiment of the present invention.

[0044] Figure 2 It is a three-dimensional schematic diagram of a base according to an embodiment of the present invention.

[0045] Figure 3 It is a three-dimensional schematic diagram of an embodiment of the present invention in which a detection platform and a base are staggered.

[0046] Figure 4 It is a three-dimensional schematic diagram of an upper sampling pressing block and a lower detection card slot according to an embodiment of the present invention.

[0047] Figure 5 It is a three-dimensional schematic diagram of a detection platform according to an embodiment of the present invention.

[0048] Figure 6 It is a schematic diagram of the electrical contact components of a detection device according to an embodiment of the present invention.

[0049] Figure 7 It is a cross-sectional schematic diagram of an electrical contact component of a detection device according to an embodiment of the present invention.

[0050] Figure 8 It is a side view of an embodiment of the present invention.

[0051] Fig. 9 It is a schematic diagram of a horizontal track and a base according to an embodiment of the present invention.

[0052] Fig.10 It is a schematic diagram of a feeding device showing the feeding direction of an embodiment of the present invention.

[0053] Fig.11 It is a schematic diagram of a sorting and discharging device in the feeding direction of an embodiment of the present invention.

[0054] Fig.12 It is a schematic diagram of a sorting and discharging device according to an embodiment of the present invention.

[0055] Fig.13 It is a side view of the sorting and discharging device of an embodiment of the present invention.

[0056] Fig.14 It is a schematic diagram of a sorting and discharging device according to an embodiment of the present invention.

[0057] Fig.15 It is a schematic diagram of an embodiment of the present invention placed obliquely.

[0058] In the figure:

[0059] 713, track fixing seat; 7531, locking bolt; 7331, electric control valve; 878, anti-slip sliding block; 622, anti-slip baffle plate set on the upper part; 6411, pushing tooth; 250, base driving mechanism; 324, lead electrode; 321, sliding shaft; 323, sliding tube; 301, fixed crossbeam of testing platform; 211, chip body placement groove; 212, pin placement groove; 220, insulating substrate; 290, base fixing seat; 210, chip placement groove; 450, lifting drive cylinder; 440, lifting drive rod; 430, lifting rod; 420, sliding connector; 410, lifting fixed frame; 350, protective plate; 7511, plastic package chip placement gap; 753, electric baffle; 752, release drive mechanism; 751, retaining plate; 734, anti-displacement support; 720 , output drive mechanism; 710, conveying track; 733, vacuum suction head; 732, sorting rack; 731, sorting lifting rod; 740, sorting drive mechanism; 730, sorting rack; 712, unqualified product conveying track; 711, qualified product conveying track; 642, propulsion driver; 641, propulsion plate; 640, propulsion mechanism; 630, feeding drive mechanism; 621, chip placement slot; 620, carrier plate; 610, horizontal slide rail; 523, center hole detection column; 513, wrapping groove; 522, clamping protrusion; 521, crimping protrusion; 512, support card slot; 511, chip card slot; 320, detection probe; 520, upper sampling block; 510, lower detection card slot; 400, lifting device; 300, detection table; 200, base; 100, horizontal track; DETAILED DESCRIPTION

[0060] In order to make the technical solutions and beneficial effects of the present invention clearer, the embodiments of the present invention are further explained in detail below.

[0061] A semiconductor high-voltage insulation detection device comprises a horizontal track 100, a base 200, a detection platform 300 and a lifting device 400. The detection platform 300 is arranged on the upper part of the base 200, and the detection platform 300 is fixedly connected to the upper end of the lifting device 400, and the lower end of the base 200 or the lifting device 400 is slidably connected to the horizontal track 100; thus, the base 200 and the detection platform 300 can be overlapped and interlaced, and the feeding and discharging before and after the detection can be further realized. The upper part of the base 200 is provided with a chip placement groove 210, and the lower detection card slot 510 is provided inside the chip placement groove 210. The upper sampling pressure block 520 is provided at the position corresponding to the lower detection card slot 510 at the lower part of the detection platform 300. The upper sampling pressure block 520 and the lower detection card slot 510 form a slot with an open side and tightly wrapped with the chip, and the shape of the slot matches the shape of the chip body. The lower part of the detection platform 300 is provided with a detection probe 320 at the corresponding slot opening, and the upper part of the detection platform 300 is provided with a lead terminal electrically connected to the detection probe 320 and the upper sampling pressure block 520, respectively, and the lead terminal is used to connect an external detection device. After the chip is loaded into the slot, a high voltage is applied to the pins of the chip through the detection probe 320, and the upper sampling pressure block 520 and the lower detection card slot 510 wrapped on the outside of the chip are used to receive the electric energy released by the local leakage or the position of insufficient withstand voltage, and transmit it to the detection controller for judgment.

[0062] like Figure 1 As shown, the lifting device 400 is used to drive the lifting of the testing platform 300. The lifting device 400 includes a lifting fixed frame 410, a sliding connection member 420, a lifting rod 430, a lifting driving rod 440 and a lifting driving cylinder 450.

[0063] The lifting and fixing frame 410 is arranged vertically, and it can be fixed on the bracket of the chip production line or on other frames. The lifting and fixing frame 410 is provided with one on each side of the horizontal slide rail 610. The lifting rod 430 is arranged on the outside of the lifting and fixing frame 410 and the two are arranged in parallel. The sliding connection member 420 is arranged between the lifting and fixing frame 410 and the lifting rod 430 to realize the sliding connection between the lifting and fixing frame 410 and the lifting rod 430. The sliding connection member 420 can adopt linear bearings, linear slide rails and other devices. The upper end of the lifting rod 430 is used to install the detection table 300. The two ends of the detection table 300 are respectively fixedly connected to the upper ends of the two lifting rods 430. The two ends of the lifting drive rod 440 are respectively fixedly connected to the lower ends of the two lifting rods 430. In this embodiment, a cylinder is used for driving, and it can also be driven by an electric push rod or other equipment. The lifting drive cylinder 450 can be fixedly installed on the bracket of the production line or on other frames or fixedly connected to the lifting and fixing frame 410. The telescopic direction of the lifting driving cylinder 450 is parallel to the length direction of the lifting rod 430 , and the end of the telescopic portion of the lifting driving cylinder 450 is fixedly connected to the lifting driving rod 440 .

[0064] Better yet, in order to prevent high-voltage electric shock accidents, protective plates 350 are provided on both sides of the test platform 300 . In the test state, the lower edges of the protective plates 350 on both sides are lower than the upper edge of the base 200 .

[0065] As shown in the figure, the base 200 is used to place the plastic-encapsulated chip to be tested. The base 200 includes a base fixing seat 290 connected to the horizontal track 100 and an insulating substrate 220. The insulating substrate 220 is fixedly connected to the base fixing seat 290, and a chip placement groove 210 is provided on the upper surface of the insulating substrate 220 along the length direction, wherein the chip placement groove 210 includes a pin placement groove 212 and a chip body placement groove 211. The depth of the chip body placement groove 211 is deeper than the pin placement groove 212. In order to facilitate the pushing of the chip, the side of the pin placement groove 212 is open. The lower detection card slot 510 is placed in the chip body placement groove 211.

[0066] More preferably, in order to facilitate the clamping or installation of the lower detection card slot 510 , the chip body placement slot 211 is narrower than the pin placement slot 212 .

[0067] As shown in the figure, the lower detection slot 510 includes a chip slot 511, a support slot 512 and a wrapping groove 513. The chip slot 511 is open to the side of the pin placement slot 212, and the wrapping groove 513 is opened on the side facing away from the pin placement slot 212. The sidewalls of the other two opposite sides of the chip slot 511 are provided with a support slot 512. The depth of the support slot 512 is less than the depth of the chip slot 511, and is used to support the upper sampling block 520 to prevent the device from directly pressing against the chip. The depth of the wrapping groove 513 is greater than the depth of the support slot 512, and less than the depth of the chip slot 511. The wrapping groove 513 is also a groove with a side open, which is used to enable the plastic-encapsulated chip to slide into the chip slot 511. The shape of the chip slot 511 is the same as the shape of the plastic-encapsulated chip body.

[0068] The detection platform 300 is in the shape of a long strip and is mounted on the upper part of the base 200. The upper sampling block 520 and the detection probe 320 are arranged at the lower part of the detection platform 300 corresponding to the position of the lower detection slot 510 on the upper part of the base 200. In this example, in order to achieve that the upper sampling block 520 and the detection probe 320 apply effective pressure to the chip to maintain electrical connection, while preventing excessive pressure from damaging the chip structure, the upper sampling block 520 and the detection probe 320 are connected to the detection platform 300 in an elastic connection manner. Specifically:

[0069] In order to fix the test platform 300, two test platform fixing beams 301 are installed on the upper ends of the two lifting devices 400, that is, the upper ends of the lifting rods 430. The test platform 300 is a plate made of insulating material. The test platform 300 is fixedly connected by nuts and screw holes opened on the test platform fixing beams 301.

[0070] In order to achieve the same number of upper sampling blocks 520 and detection probes 320 as the upper and lower detection slots 510 of the base 200, the detection platform 300 can be provided with a long strip or a plurality of long strips spliced ​​together.

[0071] In order to realize the installation of the detection probe 320 and the upper sampling block 520, a mounting hole is set on the upper part of the detection platform 300, and a sliding tube 323 is set inside the mounting hole. In order to realize the installation of the sliding tube 323, a retaining spring slot is opened on the outer side wall of the upper and lower parts of the sliding tube 323. The sliding tube 323 is inserted into the mounting hole, and the upper retaining spring slot is located at the upper part of the mounting hole, and the lower retaining spring slot is located at the lower part of the mounting hole. Then, the retaining spring is inserted into the retaining spring slot to install the sliding tube 323 inside the mounting hole. The sliding tube 323 is used to realize electrical conduction and conductive connection to the sliding shaft 321.

[0072] The sliding shaft 321 is inserted into the lumen of the sliding tube 323, and a lead electrode 324 is installed on the upper part of the sliding tube 323. The sliding shaft 321 slides inside the lumen of the sliding tube 323 and is electrically connected to the sliding tube 323. The lower end of the sliding shaft 321 is fixedly connected and electrically connected to the detection probe 320 or the upper sampling block 520. A spring is sleeved on the sliding shaft 321 between the sliding tube 323 and the detection probe 320. A spring is also sleeved on the sliding shaft 321 between the sliding tube 323 and the upper sampling block 520.

[0073] The position of the detection probe 320 coincides with the position of the pin placement slot 212, and the position of the upper sampling pressure block 520 coincides with the position of the lower detection card slot 510. After the detection platform 300 descends, the detection probe 320 and the upper sampling pressure block 520 are driven to descend. The detection probe 320 abuts against the pin of the plastic-encapsulated chip, and the upper sampling pressure block 520 abuts against the main body of the plastic-encapsulated chip and forms a slot that wraps the main body of the plastic-encapsulated chip with the lower detection card slot 510, and the upper sampling pressure block 520 is conductively connected to the lower detection card slot 510.

[0074] The upper sampling block 520 and the lower detection card slot 510 cooperate with each other to form a slot for placing the plastic-encapsulated chip. The lower shape of the cross-sectional shape of the upper sampling block 520 matches the upper shape of the cross-sectional shape of the plastic-encapsulated chip, that is, the lower plane of the upper sampling block 520 can be embedded and fit with the upper plane of the plastic-encapsulated chip. The upper sampling block 520 includes a crimping protrusion 521 and a clamping protrusion 522. The crimping protrusion 521 fits with the low-lying part of the plastic-encapsulated chip, and the two ends are embedded in the inside of the support card slot 512, and the clamping protrusion 522 fits with the end of the wrapping groove 513 close to the chip card slot 511.

[0075] Better yet, some chips have a through hole in the middle. In order to detect the high-voltage resistance of the through hole, a center hole detection column 523 is provided at the lower part of the upper sampling block 520 corresponding to the through hole of the plastic-encapsulated chip placed in the chip card slot 511. After the upper sampling block 520 abuts against the lower detection card slot 510, the center hole detection column 523 is inserted into the through hole of the chip. The center hole detection column 523 is made of conductive material.

[0076] The horizontal track 100 is a linear bearing or a linear slide. The lower end of the base 200 or the lifting and fixing frame 410 of the lifting device 400 is slidably connected to the horizontal track 100. In this embodiment, the base fixing seat 290 of the base 200 is slidably connected to the horizontal track 100.

[0077] In order to realize the automation of the equipment and improve the production efficiency, a base driving mechanism 250 is provided to drive the base 200 to move, wherein the base 200 can be driven by a linear motor, a wire shaft, an electric push rod, a pneumatic push rod and other devices.

[0078] When loading or unloading, the base 200 and the testing platform 300 are staggered in the vertical direction. When testing, the base 200 moves to the lower part of the testing platform 300. In order to detect the moving distance and position of the base 200, so as to achieve accurate control and avoid damage to the chip caused by position misalignment, the base drive mechanism 250 is also provided with a corresponding position detection device, such as a travel switch, a position switch, a grating, etc.

[0079] Better yet, in order to achieve automated operation, the device further includes a feeding device disposed on one side of the base 200 and a sorting and discharging device disposed on the other side of the base 200 .

[0080] The feeding device includes a horizontal slide rail 610 , a carrying plate 620 , a feeding drive mechanism 630 and a propulsion mechanism 640 .

[0081] The horizontal slide rail 610 is parallel to the length direction of the base 200. At the same time, the horizontal slide rail 610 is parallel to the plastic package chip conveying track 710 of the chip production line.

[0082] The carrier plate 620 is slidably disposed on the horizontal slide rail 610, and a chip placement groove 621 is disposed on the upper portion of the carrier plate 620. The chip placement groove 621 can be opened on the upper portion of the carrier plate 620, or evenly arranged stoppers are disposed on the upper portion of the carrier plate 620, and the chip placement groove 621 is formed between the stoppers. The number of the chip placement grooves 621 is the same as the chip placement grooves 210 on the base 200. The bottom of the chip placement groove 621 is higher than or flush with the bottom of the chip placement groove 210.

[0083] Alternatively, an anti-slip blocking piece 622 is provided on the upper portion of the edge of the chip placement groove 621 to prevent the plastic-encapsulated chip from slipping out.

[0084] The carrier plate 620 realizes a transfer function. When loading, the carrier plate 620 first slides to a position close to the plastic-encapsulated chip conveying track 710, so that the chip placement groove 621 is aligned with the outlet of the plastic-encapsulated chip conveying track 710, and then the plastic-encapsulated chip is loaded into the chip placement groove 621 through the blowing component or the push rod component set on the plastic-encapsulated chip conveying track 710. After loading one, the carrier plate 620 is moved to align the next chip placement groove 621 with the outlet of the plastic-encapsulated chip conveying track 710 until all chip placement grooves 621 are loaded with plastic-encapsulated chips. Then the carrier plate 620 is moved to a position close to the base 200, so that all chip placement grooves 621 correspond to the position of the wrapping groove 513 in the chip body placement groove 211. Then the chip is pushed into the chip card slot 511 through the wrapping groove 513.

[0085] In order to realize the movement of the carrier plate 620, it is necessary to set a feeding drive mechanism 630 and a position detection device for detecting the position of the carrier plate 620, such as a travel switch, a position switch, a grating, etc. The feeding drive mechanism 630 drives the carrier plate 620 to move on the horizontal slide rail 610. The feeding drive mechanism 630 can be implemented by a linear motor, a wire shaft, an electric push rod or a pneumatic push rod. In this embodiment, the feeding drive mechanism 630 drives the carrier plate 620 to move by driving a pulley with a motor.

[0086] In order to push the plastic-encapsulated chip into the chip slot 511 , the pushing mechanism 640 includes a pushing plate 641 disposed on the upper portion of the carrier plate 620 and a pushing driver 642 for driving the pushing plate 641 to move.

[0087] The lower part of the push plate 641 is provided with a push tooth 6411 at a position corresponding to the chip placement groove 621. The position of the push plate 641 corresponds to the position of the base 200 and the two are parallel, and the lower part of the push tooth 6411 is flush with the upper part of the wrapping groove 513, or slightly higher than the groove bottom of the wrapping groove 513.

[0088] When the carrier plate 620 slides to the position of the base 200, the carrier plate 620 is located between the push plate 641 and the base 200, and then the push plate 641 moves toward the base 200 driven by the push driver 642, thereby pushing the plastic-encapsulated chip inside the chip placement groove 621 into the chip card slot 511.

[0089] Similarly, the horizontal slide rail 610, the feeding drive mechanism 630 and the propulsion mechanism 640 in the feeding device can be installed on the frame of the production line or other frames or cabinets, or supported on the ground by a bracket.

[0090] The feeding device is arranged on the chip production line, and the base 200 overlaps with the plastic-encapsulated chip conveying track 710 of the production line. When feeding:

[0091] First, the loading drive mechanism 630 drives the carrier plate 620 to move to one side of the conveying track 710 , and pushes the plastic-encapsulated chips into the chip placement grooves 621 in sequence through the air pipe or the push rod on the production line.

[0092] Then, after all the chip placement slots 621 are filled with plastic-encapsulated chips, the loading drive mechanism 630 drives the carrier plate 620 to move to the side of the base 200 and to be flush with the base 200;

[0093] Afterwards, the push driver 642 is started to push the chip in the chip placement slot 621 into the chip placement groove 210 through the push plate 641 .

[0094] The sorting and discharging device includes a conveying track 710 , an output driving mechanism 720 and a sorting frame 730 .

[0095] The conveying track 710 includes a qualified product conveying track 711 and a non-qualified product conveying track 712. The qualified product conveying track 711 and the non-qualified product conveying track 712 are respectively connected to the plastic package chip conveying track 710 and the defective product recovery track of the subsequent production line.

[0096] In order to facilitate the operation of the sorting rack 730 or other robots, the conveying track 710 is arranged parallel to the base 200.

[0097] The sorting rack 730 is arranged between the conveying track 710 and the base 200. The sorting rack 730 includes a sorting lifting rod 731, a sorting rack 732 and a vacuum suction head 733 arranged at the bottom of the sorting rack 732, and the vacuum suction head 733 is connected to an electric control valve 7331. The system is provided with a chip detection device, which is electrically connected to the detection platform 300, and each chip is detected, and each chip at each position will have a detection result. Then the corresponding vacuum suction head 733 is controlled to place the detected chips on the qualified product conveying track 711 or the unqualified product conveying track 712 respectively.

[0098] The conveying track 710 or the sorting rack 730 is slidably connected to the horizontal track 100. The conveying track 710 or the sorting rack 730 is provided with an output drive mechanism 720. In order to simplify the structure, in this embodiment, the conveying track 710 and the horizontal track 100 are slidably connected, and a track fixing seat 713 is provided at the lower part of the conveying track 710, and the track fixing seat 713 and the horizontal track 100 are slidably connected. The output drive mechanism 720 is arranged in the middle of the horizontal track 100. The output drive mechanism 720 is a linear motion drive mechanism.

[0099] It also includes a controller electrically connected to the output drive mechanism 720, the sorting rack 730, the upper sampling block 520 and the detection probe 320, and the controller includes or is electrically connected to the semiconductor high-voltage insulation detection device.

[0100] More preferably, in order to facilitate the sliding of the plastic-encapsulated chips, the base 200, the feeding device, and the sorting and discharging device are arranged at an angle, and the feeding device is higher than the sorting and discharging device.

[0101] After feeding, under the action of gravity, the plastic-encapsulated chip slides along the track from the feeding end to the discharging end.

[0102] Furthermore, in this embodiment, the conveying track 710 slides on the horizontal track 100, so when unloading, the conveying track 710 moves to the lower part of the sorting rack 730, and the conveying track 710 is connected to the track of the production line. In order to prevent the chip from slipping off at this time, a holding mechanism is provided on the conveying track 710. The holding mechanism includes a holding plate 751, a release drive mechanism 752, and an electric stop bolt 753 provided at the lower end of the conveying track 710.

[0103] The retaining plate 751 covers the upper part of the qualified product conveying track 711. For the convenience of observation, the upper part of the retaining plate 751 is provided with a notch 7511 for placing the plastic-encapsulated chip. The release drive mechanism 752 is an electric push rod or a pneumatic push rod. The end of the telescopic end of the release drive mechanism 752 is fixedly connected to the retaining plate 751, and the telescopic direction of the release drive mechanism 752 is perpendicular to the length direction of the retaining plate 751 and the qualified product conveying track 711. After loading the chip, the release drive mechanism 752 drives the retaining plate 751 to move toward the qualified product conveying track 711, covers the upper part of the qualified product conveying track 711, and prevents it from slipping. In this embodiment, the release drive mechanism 752 is a pneumatic push rod. A slide is provided on the upper part of the track fixing seat, and a slider is provided on the slide. The slider is fixedly connected to the retaining plate 751 through a straight rod. The release drive mechanism 752 is also fixedly installed on the track fixing seat, and the end of the telescopic component of the release drive mechanism 752 is fixedly connected to the retaining plate 751.

[0104] The locking bolt 7531 of the electric stop bolt 753 is driven by an electromagnet or a cylinder. A retaining socket is provided at the lower end of the qualified product conveying track 711, and the locking bolt 7531 of the electric stop bolt 753 is inserted into the retaining socket.

[0105] After the detection is completed, the controller stores the detection results of the plastic-encapsulated chips in each chip slot 511. Then, the corresponding vacuum suction head 733 is controlled to move according to the detection results. Based on this embodiment, the specific control method includes the following steps:

[0106] Step 1: After the detection is completed, the controller controls the base platform 200 to move from the lower part of the detection platform 300 to the sorting and discharging device; and moves to the lower part of the sorting rack 730.

[0107] Step 2: The controller controls the sorting rack 730 to descend, and controls the electric valve of the vacuum suction head 733 corresponding to the qualified product to open according to the detection result to suck the plastic-sealed chip.

[0108] Step 3, the controller controls the sorting rack 730 to rise, and then controls the base 200 to move away from the lower part of the sorting rack 730; then controls the conveying track 710 to move to the lower part of the sorting rack 730, and then controls the electric air valve to close, and puts the sucked qualified products into the qualified product conveying track 711;

[0109] Step 4: Then, according to the unqualified products in the test results, the unqualified products are moved into the unqualified product conveying track 712 in accordance with the control method of steps 2 and 3;

[0110] Step 5, the controller controls the conveying track 710 to dock with the subsequent track, then controls the locking bolt 7531 of the electric stop bolt 753 to descend, and controls the retaining plate 751 to separate from the qualified product conveying track 711 and the unqualified product conveying track 712. At this time, under the action of gravity, the qualified products and unqualified products enter the straight lines of different production lines respectively.

[0111] In order to improve safety, a protective shell or a protective cover is provided outside each driving mechanism.

[0112] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Through the above description, relevant staff can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the contents of the specification. All so-called equal changes and modifications of the shapes, structures, features and spirits described in the scope of the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A semiconductor high voltage insulation detection device, characterized in that: It comprises a horizontal track (100), a base (200), a detection platform (300) and a lifting device (400); The detection platform (300) is arranged on the upper part of the base platform (200), and the detection platform (300) is fixedly connected to the upper end of the lifting device (400), and the lower end of the base platform (200) or the lifting device (400) is slidably connected to the horizontal track (100); A chip placement groove (210) is provided on the upper part of the base (200), and a lower detection card slot (510) is provided inside the chip placement groove (210). An upper sampling block (520) is provided at a position corresponding to the lower detection card slot (510) at the lower part of the detection platform (300); the upper sampling block (520) and the lower detection card slot (510) form a slot with an open side and tightly wrapping the chip; the shape of the slot matches the shape of the chip body; a detection probe (320) is provided at the lower part of the detection platform (300) corresponding to the slot opening; lead terminals electrically connected to the detection probe (320) and the upper sampling block (520) are provided at the upper part of the detection platform (300); the lead terminals are used to connect to an external detection device; A chip card slot (511) having the same shape as the chip body is provided on one side of the lower detection card slot (510); a side of the chip card slot (511) is open for placing the pins of the chip; a support card slot (512) is provided in the middle of the vertical edges on both sides of the open end of the chip card slot (511); the depth of the bottom of the support card slot (512) from the bottom of the chip card slot (511) is the same as the thickness of the chip; a wrapping groove (513) is provided at a position opposite to the open side; the depth of the wrapping groove (513) is greater than the depth of the support card slot (512) and less than the depth of the chip card slot (511); A crimping protrusion (521) is provided at a position of the lower part of the upper sampling pressing block (520) corresponding to the supporting card slot (512), and a clamping protrusion (522) is provided at a position of the lower part of the upper sampling pressing block (520) corresponding to the wrapping groove (513); A central hole detection column (523) is provided at the lower part of the upper sampling pressing block (520); when the lower detection card slot (510) and the upper sampling pressing block (520) are combined into one body and loaded into the plastic-encapsulated chip, the central hole detection column (523) is inserted into the central hole of the plastic-encapsulated chip; Protective plates (350) are provided on both sides of the detection platform (300); in the detection state, the lower edge of the protective plate (350) is lower than the upper edge of the base platform (200).

2. A semiconductor high voltage insulation detection device according to claim 1, characterized in that: The horizontal track (100) is provided with a pneumatically or electrically driven linear motion mechanism.

3. A semiconductor high voltage insulation detection device according to claim 1, characterized in that: It also includes a feeding device arranged on one side of the base (200), the feeding device comprising: A horizontal slide rail (610) parallel to the length direction of the base (200); A carrier plate (620) is slidably disposed on a horizontal slide rail (610), wherein a chip placement groove (621) is disposed on the upper portion of the carrier plate (620), wherein the number of the chip placement grooves (621) is the same as the number of the chip placement grooves (210) on the base (200), and the bottom of the chip placement groove (621) is higher than or flush with the bottom of the chip placement groove (210); A loading drive mechanism (630) drives the carrier plate (620) to move on the horizontal slide rail (610); A propulsion mechanism (640) includes a propulsion plate (641) disposed on the upper portion of the carrier plate (620) and a propulsion driver (642) for driving the propulsion plate (641) to move; A propulsion tooth (6411) is provided at a position of the lower portion of the propulsion plate (641) corresponding to the chip placement slot (621); The feeding device is arranged on a chip production line, and the base (200) coincides with the plastic-encapsulated chip conveying track (710) of the production line. When feeding: The loading drive mechanism (630) drives the carrier plate (620) to move to one side of the conveying track (710), and pushes the plastic-encapsulated chips into the chip placement groove (621) in sequence through the air pipe or the push rod on the production line; After all the chip placement grooves (621) are inserted with plastic-encapsulated chips, the loading drive mechanism (630) drives the carrier plate (620) to move to the side of the base (200) and to be flush with the base (200); Then, the push driver (642) is started to push the chip in the chip placement groove (621) into the chip placement recess (210) via the push plate (641).

4. A semiconductor high voltage insulation detection device according to claim 1 or 3, characterized in that: It also includes a sorting and discharging device arranged on one side of the base platform (200), and the sorting and discharging device includes: A conveying track (710) arranged parallel to the base platform (200), wherein the conveying track (710) comprises a qualified product conveying track (711) and a non-qualified product conveying track (712); A sorting rack (730) is arranged between the conveying track (710) and the base (200); the sorting rack (730) comprises a sorting lifting rod (731), a sorting rack platform (732) and a vacuum suction head (733) arranged at the bottom of the sorting rack platform (732); the vacuum suction head (733) is connected to an electric control valve (7331); The conveying track (710) or the sorting rack (730) is slidably connected to the horizontal track (100); the conveying track (710) or the sorting rack (730) is provided with an output drive mechanism (720); It also includes a controller electrically connected to the output drive mechanism (720), the sorting rack (730), the upper sampling block (520) and the detection probe (320), and the controller controls the vacuum suction head (733) to suck the plastic-encapsulated chip on the upper part of the detection table (300) and place it on the conveying track (710).

5. A semiconductor high voltage insulation detection device according to claim 4, characterized in that: The base platform (200), the feeding device, and the sorting and discharging device are arranged tilted, and the feeding device is higher than the sorting and discharging device.

6. A semiconductor high voltage insulation detection device according to claim 5, characterized in that: An anti-displacement support (734) is provided at a position corresponding to the through hole of the plastic-encapsulated chip at the lower part of the sorting stand (732).

7. A semiconductor high voltage insulation detection device according to claim 4, characterized in that: The conveying track (710) is provided with a holding mechanism, which comprises a holding plate (751), a release drive mechanism (752), and an electric stop bolt (753) arranged at the lower end of the conveying track (710); The holding plate (751) covers the upper part of the qualified product conveying track (711); the release drive mechanism (752) is an electric push rod or a pneumatic push rod; the end of the telescopic end of the release drive mechanism (752) is fixedly connected to the holding plate (751); and the telescopic direction of the release drive mechanism (752) is perpendicular to the length direction of the holding plate (751) and the qualified product conveying track (711); The locking bolt (7531) of the electric stop bolt (753) is driven by an electromagnet or a cylinder, and a retaining socket is provided at the lower end of the qualified product conveying track (711), and the locking bolt (7531) of the electric stop bolt (753) is inserted into the retaining socket.

8. The control method of a semiconductor high voltage insulation detection device according to claim 7, characterized in that: Step 1: After the detection is completed, the controller controls the base platform (200) to move from the lower part of the detection platform (300) to the sorting and discharging device; Step 2: The controller controls the sorting rack (730) to descend, and controls the electric valve of the vacuum suction head (733) corresponding to the qualified product to open according to the detection result to suck the plastic-sealed chip; Step 3: The controller controls the sorting rack (730) to rise, and controls the conveying track (710) to move toward the lower part of the sorting rack (730), and then controls the sorting rack (730) to descend, and then controls the electric air valve to close, and puts the sucked qualified products into the qualified product conveying track (711); Step 4, then according to the unqualified products in the test results, the unqualified products are moved into the unqualified product conveying track (712) according to the control method of steps 2 and 3; Step 5, control the locking bolt (7531) of the electric stop bolt (753) to descend, and control the retaining plate (751) to separate from the qualified product conveying track (711) and the unqualified product conveying track (712). At this time, under the action of gravity, the qualified products and unqualified products enter the straight lines of different production lines respectively.

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