Pipe cleaning device and pipe cleaning method
By using a combination of flow-blocking devices and plasma cleaning gases in the pre-line piping of a chemical vapor deposition (CVD) equipment, the problem of residue contamination of the reaction chamber within the piping was solved, achieving efficient piping cleaning and preventing product contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2019-12-17
- Publication Date
- 2026-04-24
AI Technical Summary
The accumulation of residual reactants in the front-end piping of existing chemical vapor deposition equipment affects the defect indicators of the products in the reaction chamber, leading to product contamination.
Design a pipeline cleaning device that delivers cleaning gas through an intake pipe and uses a baffle device to change the airflow direction, ensuring that the cleaning gas makes full contact with the pipe wall. Combined with plasma cleaning gas and flow control, an automated cleaning process is achieved.
It effectively removes residues from the pipeline, preventing them from contaminating the samples in the reaction chamber and improving cleaning efficiency and effectiveness.
Smart Images

Figure CN112974418B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a pipe cleaning device and a pipe cleaning method. Background Technology
[0002] Chemical vapor deposition (CVD) is one of the main methods for depositing thin films. During the deposition process using current CVD equipment, residual reactants are typically removed via a pre-treatment pipeline and vacuum pump to prevent them from causing product defects, such as contaminating the wafer.
[0003] However, the inventors of this invention discovered that with the accumulation of process cycles, residual reactants in the upstream pipeline also accumulate, affecting the defect indicators of the product within the reaction chamber and often causing product contamination defects near the exhaust end. There is an urgent need to provide a pipeline cleaning device capable of thoroughly cleaning the pipeline. Summary of the Invention
[0004] The purpose of this invention is to provide a pipe cleaning device and a pipe cleaning method that can thoroughly clean the target pipe and prevent residues in the target pipe from contaminating the sample in the reaction chamber.
[0005] To address the aforementioned technical problems, embodiments of the present invention provide a pipeline cleaning device, comprising: a target pipeline, and at least one air inlet pipeline connected to the target pipeline; one end of the target pipeline is connected to a reaction chamber; the air inlet pipeline is used to deliver cleaning gas to the target pipeline to clean the target pipeline; a flow-blocking device is provided inside the target pipeline, the flow-blocking surface of the flow-blocking device facing the air outlet of the air inlet pipeline.
[0006] In addition, the flow-blocking device is retractably mounted on the wall of the target pipe, suitable for extending into or withdrawing from the target pipe through its wall. When cleaning the target pipe, the flow-blocking device extends to change the direction of the cleaning gas flow, ensuring full contact between the cleaning gas and the pipe wall. When performing processes or cleaning the reaction chamber, the flow-blocking device can be withdrawn from the target pipe to avoid affecting the airflow.
[0007] Additionally, it includes a first controller for controlling the flow-blocking device to extend into or withdraw from the target pipe through the pipe wall. This enables automated extension and retraction of the flow-blocking device.
[0008] In addition, the flow-blocking device is equipped with a rotating shaft, which is parallel to the flow-blocking surface; the flow-blocking device is adapted to rotate around the rotating shaft. The rotation of the flow-blocking device has a greater impact on the airflow, enabling the clean gas to make more thorough contact with the pipe wall of the target pipeline, resulting in a better cleaning effect.
[0009] Additionally, a second controller is included to control the rotation of the flow-blocking device around the rotation axis. This enables the automation of the flow-blocking device's rotation.
[0010] In addition, the target pipeline includes a main pipeline, a first sub-pipeline, and a second sub-pipeline; one end of the first sub-pipeline is connected to the first reaction chamber, and one end of the second sub-pipeline is connected to the second reaction chamber; the other ends of the first and second sub-pipelines converge at one end of the main pipeline; there are multiple air inlet pipelines, and the first and second sub-pipelines are each connected to at least one air inlet pipeline. This method is suitable for cleaning the pre-stage pipelines of multiple reaction chambers and has a wide range of applications.
[0011] In addition, the air inlet of the air intake pipe is connected to a clean gas preparation device, which is used to deliver clean gas to the air intake pipe.
[0012] In addition, a mass flow controller is installed on the air intake pipe. This controller can control the flow rate of the clean gas, thereby controlling the concentration of the clean gas in the target pipe to achieve maximum cleaning efficiency.
[0013] In addition, the clean gas preparation device is used to prepare clean gases in plasma state. Using plasma to clean target pipelines provides greater energy and a more thorough cleaning.
[0014] An embodiment of the present invention also provides a pipeline cleaning method applied to the above-mentioned pipeline cleaning device, comprising: introducing cleaning gas into the target pipeline through an air inlet pipe to clean the target pipeline.
[0015] In addition, before cleaning the target pipe by introducing clean gas through the intake pipe, the method includes: controlling a flow-blocking device to extend into the target pipe from its wall. During cleaning, the flow-blocking device automatically extends to change the direction of the clean gas flow, ensuring full contact between the clean gas and the target pipe wall. When processing or cleaning the reaction chamber, the flow-blocking device automatically retracts from the target pipe to avoid affecting the airflow.
[0016] In addition, before cleaning the target pipe by introducing clean gas through the intake pipe, the process includes controlling the flow-blocking device to rotate around a rotation axis parallel to the flow-blocking surface. The rotation of the flow-blocking device has a greater impact on the airflow, enabling the clean gas to make more thorough contact with the pipe wall of the target pipe, resulting in a better cleaning effect.
[0017] In addition, the process of cleaning the target pipeline by introducing clean gas through the intake pipe also includes controlling the flow rate of the clean gas to be between 200 sccm and 2000 sccm. When the flow rate of the clean gas is within the range of 200 sccm to 2000 sccm, the clean gas can react fully with the residue on the target pipeline, resulting in the best cleaning effect.
[0018] In addition, cleaning gases include fluoride ions.
[0019] Compared with the prior art, the present invention introduces clean gas into the target pipe through an air inlet pipe connected to the target pipe, and uses a baffle device to agitate the airflow so that the clean gas can fully contact the pipe wall of the target pipe, thereby thoroughly cleaning the target pipe and preventing residues in the target pipe from contaminating the sample in the reaction chamber. Attached Figure Description
[0020] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments, and unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0021] Figure 1 This is a schematic diagram of the pipe cleaning device provided in the first embodiment of the present invention;
[0022] Figure 2 This is a partial structural diagram of the pipe cleaning device provided in the first embodiment of the present invention;
[0023] Figure 3 This is a partial structural diagram of the pipe cleaning device provided in the second embodiment of the present invention;
[0024] Figure 4 This is a schematic diagram of a pipe cleaning device provided in the third embodiment of the present invention;
[0025] Figure 5 This is a schematic diagram of another pipe cleaning device structure provided in the third embodiment of the present invention;
[0026] Figure 6 This is a flowchart of the pipe cleaning method provided in the fourth embodiment of the present invention. Detailed Implementation
[0027] As can be seen from the background technology, there is an urgent need to provide a pipe cleaning device that can thoroughly clean upstream pipes.
[0028] It is understood that the terms "first," "second," etc., used in this invention may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this invention, a first sub-channel may be referred to as a second sub-channel, and similarly, a second sub-channel may be referred to as a first sub-channel. Both the first and second sub-channels are sub-channels, but they are not the same sub-channel.
[0029] To address the aforementioned problems, embodiments of the present invention provide a pipeline cleaning device, comprising: a target pipeline, and at least one inlet pipeline connected to the target pipeline; one end of the target pipeline is connected to a reaction chamber; the inlet pipeline is used to deliver cleaning gas to the target pipeline for cleaning; a flow-blocking device is provided inside the target pipeline, with the flow-blocking surface of the flow-blocking device facing the outlet of the inlet pipeline. By introducing cleaning gas into the target pipeline through the inlet pipeline connected to the target pipeline, and by agitating the airflow through the flow-blocking device, the cleaning gas thoroughly cleans the target pipeline, thereby preventing residues in the target pipeline from contaminating the sample in the reaction chamber.
[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the various embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.
[0031] Figure 1 The first embodiment of the present invention provides a schematic diagram of a pipeline cleaning device, as shown in the figure, including: a target pipeline 1, and at least one air inlet pipeline 2 connected to the target pipeline 1; one end of the target pipeline 1 is connected to a reaction chamber 3; the air inlet pipeline 2 is used to deliver cleaning gas to the target pipeline 1 to clean the target pipeline 1; a flow-blocking device 4 is provided in the target pipeline 1, and the flow-blocking surface of the flow-blocking device 4 faces the air outlet of the air inlet pipeline 2.
[0032] Specifically, in this embodiment, the flow-blocking device 4 is a rectangular plate structure, and the upper surface of the flow-blocking device 4 is the flow-blocking surface, which is rectangular. In practical applications, the flow-blocking surface can also be set as a circle or other arbitrary shape, and the corresponding flow-blocking device can also be other arbitrary shapes; this embodiment does not impose any restrictions. The target pipe 1 is the pipe to be cleaned. When cleaning the target pipe 1, cleaning gas is introduced into the target pipe 1 through the air inlet pipe 2. When the cleaning gas flows into the target pipe 1, it is blocked by the flow-blocking surface of the flow-blocking device 4, thereby changing the flow direction of the cleaning gas, so that the cleaning gas diffuses evenly in the target pipe 1 and fully contacts the pipe wall of the target pipe 1. On the one hand, the airflow of the cleaning gas can carry away the residue in the target pipe 1; on the other hand, the cleaning gas can also undergo a physical or chemical reaction with the residue to remove the residue in the target pipe 1, and the reaction products are carried away with the airflow, thereby achieving the cleaning effect on the target pipe 1.
[0033] like Figure 1As shown, in this embodiment, the air inlet of the air inlet pipe 2 is located near the reaction chamber 3, which can mainly clean the pipe wall of the target pipe 1 at the connection between the reaction chamber 3 and the target pipe 1, effectively preventing residues near the port of the target pipe 1 from returning to the reaction chamber 3 and contaminating the sample. In other embodiments, the air inlet of the air inlet pipe 2 can be located at any position on the target pipe 1 for targeted cleaning of different positions within the target pipe 1.
[0034] In this embodiment, there is only one reaction chamber 3 connected to the target pipe 1, and only one corresponding air inlet pipe 2. In other embodiments, there can be multiple reaction chambers and multiple air inlet pipes. In one example, multiple air inlet pipes can be provided on the target pipe, evenly distributed and connected to it, enabling distributed cleaning of the target pipe for a more thorough cleaning. Correspondingly, a baffle device can be provided opposite the outlet of each air inlet pipe, or several air inlet pipes can be selected from the distributed multiple air inlet pipes, and baffle devices can be provided opposite the outlets of these several air inlet pipes to interfere with the airflow of the cleaning gas.
[0035] Furthermore, such as Figure 2 The diagram shown is a partial structural schematic of the pipeline cleaning device in this embodiment. In this embodiment, the flow-blocking device 4 is retractably mounted on the wall of the target pipeline 1, suitable for extending into or withdrawing from the target pipeline 1 through its wall. Specifically, when cleaning the target pipeline 1, the flow-blocking device 4 is controlled to extend into the target pipeline 1, interfering with the flow direction of the cleaning gas to achieve thorough cleaning of the target pipeline 1 wall; when cleaning the reaction chamber 3 or when a process is being carried out in the reaction chamber 3, the flow-blocking device 4 is controlled to withdraw from the wall of the target pipeline 1 to prevent it from interfering with the airflow in the target pipeline 1, thereby affecting the cleaning of the reaction chamber 3 or the process within the reaction chamber 3.
[0036] Correspondingly, the pipe cleaning device in this embodiment may also include a first controller (not shown) for controlling the flow-blocking device 4 to extend into or withdraw from the target pipe 1 through the pipe wall of the target pipe 1, thereby automating the extension and retraction of the flow-blocking device 4.
[0037] Furthermore, such as Figure 1As shown, a mass flow controller 5 can also be installed on the inlet pipe 2 to control the flow rate of the cleaning gas, thereby adjusting the concentration of the cleaning gas reacting with the residue in the target pipe 1, maximizing the reaction effect, and improving cleaning efficiency. Additionally, the inlet of the inlet pipe 2 is connected to a cleaning gas preparation device 8, which supplies cleaning gas to the inlet pipe 2. In one example, the cleaning gas preparation device is used to prepare plasma-state cleaning gas. Specifically, it can be an RPS (remote plasma system) used to prepare oxygen ion or fluoride ion plasma as a cleaning gas for cleaning the pre-stage pipes of the vapor deposition equipment. In other embodiments, the inlet of the inlet pipe can also be directly connected to a cleaning gas storage device, which stores cleaning gas, and the cleaning gas is directly supplied to the inlet pipe from the cleaning gas storage device.
[0038] Furthermore, the pipeline cleaning device in this embodiment may also include an exhaust device 7 connected to the target pipeline 1 for discharging the cleaned exhaust gas. Specifically, the exhaust device 7 may be a vacuum pump, which removes the cleaned exhaust gas. A valve 6 is also provided between the exhaust device 7 and the target pipeline 1. The valve 6 may be an isolation valve, used to isolate the reaction chamber 3 and the exhaust device 7 during the chemical vapor deposition process in the reaction chamber 3. The valve 6 may be one or more valves; for example, in addition to the isolation valve, the valve 6 may also include a throttle valve, used to adjust the pressure inside the reaction chamber 3 by changing the size of the valve opening. In practical applications, the exhaust device 7 may also be used to discharge the exhaust gas in the reaction chamber 3 or to evacuate the reaction chamber 3; this embodiment does not impose any limitations. In other embodiments, an exhaust gas treatment device may also be provided between the exhaust device 7 and the valve, used to pre-treat the exhaust gas before it is discharged to prevent the discharge of harmful gases.
[0039] In one example, reaction chamber 3 is specifically the process chamber of a chemical vapor deposition (CVD) apparatus, and target conduit 1 is a pre-lined conduit connected to the process chamber. The cleaning gas supplied to target conduit 1 includes plasma-state fluoride ions or oxygen ions, which remove residues within target conduit 1. Correspondingly, the inlet conduit 2 for supplying the cleaning gas is made of stainless steel, which is corrosion-resistant to fluoride and oxygen ions. Furthermore, to prevent damage to the conduit from heat generated during the cleaning process or other processes performed by the equipment, the material of inlet conduit 2 has a temperature tolerance range of -15°C to 800°C.
[0040] In this embodiment, clean gas is introduced into the target pipe 1 through the air inlet pipe 2 connected to the target pipe 1, and the airflow is disturbed by the flow baffle device 4 so that the clean gas can fully contact the pipe wall of the target pipe 1, which can thoroughly clean the target pipe 1 and prevent the residue in the target pipe 1 from contaminating the sample in the reaction chamber 3.
[0041] The second embodiment of the present invention provides a pipe cleaning device, which is substantially the same as the pipe cleaning device in the first embodiment, except that: in the first embodiment, the flow-blocking device is retractably mounted on the wall of the target pipe; while in the second embodiment, the flow-blocking device is provided with a rotating shaft, and the flow-blocking device is adapted to rotate around the rotating shaft. Features that are the same as or corresponding to those in the first embodiment can be referred to the corresponding description of the first embodiment, and will not be repeated below. Figure 3 This is a partial structural diagram of a pipe cleaning device provided in the second embodiment of the present invention.
[0042] like Figure 3 As shown, the flow-blocking device 4 is provided with a rotating shaft 9, which is parallel to the flow-blocking surface; the flow-blocking device 4 is adapted to rotate around the rotating shaft 9.
[0043] Specifically, when cleaning the target pipe 1, the flow-blocking device 4 is controlled to rotate around the rotating shaft 9, and clean gas is introduced into the target pipe 1 through the air intake pipe 2. The flow-blocking device 4 dynamically disturbs the flow direction of the clean gas, so that the clean gas diffuses more quickly and evenly in the target pipe 1, and the clean gas fully contacts the pipe wall of the target pipe 1 to clean the target pipe 1.
[0044] Furthermore, the pipe cleaning device in this embodiment may also include a second controller (not shown) for controlling the flow-blocking device 4 to rotate around the rotation axis 9, thereby automating the rotation of the flow-blocking device.
[0045] It should be noted that, in addition to being able to rotate around the rotation axis 9, the flow-blocking device 4 in this embodiment can also be controlled by the second controller to extend the pipe wall of the target pipe 1 into or out of the target pipe 1, thereby realizing the automation of the rotation and extension of the flow-blocking device 4.
[0046] In this embodiment, clean gas is introduced into the target pipe 1 through the air inlet pipe 2 connected to the target pipe 1. The airflow is agitated by the flow-blocking device 4, allowing the clean gas to diffuse more quickly and evenly within the target pipe 1. The clean gas makes full contact with the pipe wall of the target pipe 1, thereby cleaning the target pipe 1. This method can thoroughly clean the target pipe 1 and prevent residues in the target pipe 1 from contaminating the sample in the reaction chamber 3.
[0047] The third embodiment of the present invention provides a pipeline cleaning device, which is substantially the same as the pipeline cleaning device in the first embodiment, except that: in the third embodiment, there are two reaction chambers connected to the target pipeline, and correspondingly two air inlet pipes. Features that are the same as or corresponding to those in the first embodiment can be referred to the relevant description of the first embodiment, and will not be repeated below. The differences are described below.
[0048] like Figure 4 The diagram shown is a schematic representation of a pipe cleaning device according to a third embodiment of the present invention. The target pipe in this embodiment includes a main pipe 11, a first sub-pipe 12, and a second sub-pipe 13. One end of the first sub-pipe 12 is connected to a first reaction chamber 31, and one end of the second sub-pipe 13 is connected to a second reaction chamber 32. The other ends of the first sub-pipe 12 and the second sub-pipe 13 converge at one end of the main pipe 11. There are multiple air intake pipes 2, and the first sub-pipe 12 and the second sub-pipe 13 are each connected to at least one air intake pipe 2.
[0049] Specifically, in this embodiment, the air inlet of at least one air inlet pipe 2 is located near the first reaction chamber 31, which can primarily clean the wall of the first sub-pipe 12 at the connection between the first reaction chamber 31 and the first sub-pipe 12. Correspondingly, the air inlet of at least one air inlet pipe 2 is located near the second reaction chamber 32, which can primarily clean the wall of the second sub-pipe 13 at the connection between the second reaction chamber 32 and the second sub-pipe 13. In other embodiments, the air inlet of the air inlet pipe 2 can be located at any position on the first sub-pipe 12 and the second sub-pipe 13 for targeted cleaning of different locations within the pipes.
[0050] In this embodiment, there are two air intake pipes connected to the first sub-pipe 12 and the second sub-pipe 13. In other embodiments, the number of air intake pipes 2 is not limited, and multiple air intake pipes 2 can be distributed on the target pipe to perform distributed cleaning of the target pipe, which can achieve a more thorough cleaning.
[0051] Similar to the first embodiment, in this embodiment, a flow-blocking device 4 is respectively installed in the first sub-pipe 12 and the second sub-pipe 13, with the flow-blocking surface of the device 4 facing the outlet of the inlet pipe 2; the flow-blocking device 4 is used to interfere with the airflow of the clean gas to change the flow direction of the clean gas. Correspondingly, a mass flow controller 5 is installed on each inlet pipe 2 to control the flow rate of the clean gas. Correspondingly, a clean gas preparation device 8 is connected to each inlet of the inlet pipe 2 to deliver clean gas to the inlet pipe 2.
[0052] Furthermore, Figure 5 This is a schematic diagram of another pipe cleaning device provided in this embodiment. Figure 5 As shown, the two intake pipes 2, which are respectively connected to the first sub-pipe 12 and the second sub-pipe 13, can also be connected to a clean gas preparation device 8. In this embodiment, one end of the two intake pipes converges into a single pipe, which is connected to the clean gas preparation device 8. A mass flow controller 5 is installed on the converging pipe to control the flow rate of the clean gas. In practical applications, the two intake pipes 2 can be connected to the clean gas preparation device 8 separately, and a mass flow controller can be installed on each intake pipe 2 to control the clean gas flow rate of each intake pipe individually.
[0053] In this embodiment, clean gas is introduced into the target pipe through the air inlet pipe 2, which is connected to the first sub-pipe 12 and the second sub-pipe 13 respectively. The airflow is disturbed by the flow baffle device 4 so that the clean gas can fully contact the pipe wall of the target pipe, which can thoroughly clean the target pipe and prevent the residue in the target pipe from contaminating the sample in the reaction chamber.
[0054] The present invention also provides a pipeline cleaning method, applied to the pipeline cleaning device in the above embodiments, comprising: introducing cleaning gas into the target pipeline through an air inlet pipe to clean the target pipeline. The following will provide a detailed description in conjunction with the accompanying drawings.
[0055] Figure 6 This is a flowchart illustrating a pipe cleaning method according to a fourth embodiment of the present invention. The pipe cleaning method in this embodiment can be applied to the pipe cleaning device in the first embodiment. Figure 6 As shown, it includes the following steps:
[0056] Step 101: Control the flow-blocking device to extend into the target pipe from the pipe wall.
[0057] Specifically, the target pipe is the pipe to be cleaned. Before cleaning the target pipe, the first controller first inserts the baffle device into the target pipe so that the baffle surface of the baffle device faces the air outlet of the air inlet pipe.
[0058] Furthermore, after the flow-blocking device extends into the target pipe, the second controller can control the flow-blocking device to rotate around a rotation axis parallel to the flow-blocking surface, thereby increasing the disturbance intensity of the flow-blocking device on the airflow. It should be noted that the step of controlling the flow-blocking device to rotate around the rotation axis can be performed before or after the clean gas is introduced into the target pipe; this embodiment does not impose any restrictions.
[0059] Step 102: Clean gas is introduced into the target pipe through the air intake pipe to clean the target pipe.
[0060] Specifically, a clean gas preparation device connected to the air intake pipe is used to prepare clean gas. In one example, the clean gas is a mixture of multiple gases. Furthermore, the clean gas can also be a plasma gas, which may include oxygen ions, fluoride ions, etc. The plasma cleans the residues in the pipeline of the vapor deposition equipment.
[0061] Simultaneously, the mass flow controller on the intake pipe can be turned on to control the flow rate of the clean gas into the target pipe. For example, the flow rate of the clean gas can be controlled within the range of 200 sccm to 2000 sccm by the mass flow controller, so that the concentration of the clean gas in the target pipe is controlled within a certain range, so as to achieve the maximum cleaning efficiency of the target pipeline.
[0062] When the cleaning gas enters the target pipe from the outlet of the inlet pipe, its flow direction changes due to the baffle device opposite the outlet. Instead of flowing directly out of the target pipe, the gas diffuses within it, making full contact with the pipe wall. This allows the cleaning gas to react thoroughly with any residue on the pipe wall before flowing out, thus cleaning the pipe. Especially near the baffle device, the contact between the cleaning gas and the pipe wall is even more complete, resulting in higher cleaning efficiency.
[0063] Furthermore, the valves installed on the target pipeline and the exhaust device connected to the target pipeline can be opened. The exhaust device can specifically be a vacuum pump. During the cleaning process of introducing clean gas into the target pipeline, the vacuum pump is simultaneously turned on to extract the exhaust gas after the reaction. This can remove the residual exhaust gas after the reaction, or the airflow can carry away the residue in the target pipeline to achieve the effect of cleaning the target pipeline.
[0064] It should be noted that after cleaning the target pipeline is completed, for example, after continuously introducing cleaning gas into the target pipeline for a period of time, the introduction of cleaning gas can be stopped, and the flow-blocking device can be withdrawn from the target pipeline by the first controller to avoid the flow-blocking device affecting the airflow of the target pipeline in other processes.
[0065] In this embodiment, clean gas is introduced into the target pipe through an air inlet pipe connected to the target pipe, and the airflow is disturbed by a baffle device to ensure that the clean gas thoroughly cleans the target pipe, thus preventing residues in the target pipe from contaminating the sample in the reaction chamber.
[0066] The steps of the various methods described above are only for clarity. In practice, they can be combined into one step or some steps can be broken down into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the process, but without changing the core design of the process, are also within the scope of protection of this patent.
[0067] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes in form and detail can be made without departing from the spirit and scope of the present invention. Any person skilled in the art can make their own modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A pipe cleaning device, characterized in that, include: The target pipe, and at least one intake pipe connected to the target pipe; One end of the target pipeline is connected to the reaction chamber; The air intake pipe is used to deliver cleaning gas to the target pipe to clean the target pipe; A flow-blocking device is installed inside the target pipe, with the flow-blocking surface of the device facing the air outlet of the inlet pipe. The flow-blocking device is retractably mounted on the pipe wall of the target pipe, and is adapted to extend into or exit from the target pipe through the pipe wall. A first controller is configured to control the flow-blocking device to extend into the target pipe through the pipe wall when cleaning the target pipe, or to control the flow-blocking device to be withdrawn from the target pipe when processing or cleaning the reaction chamber.
2. The pipe cleaning device according to claim 1, characterized in that, The flow-blocking device is provided with a rotating shaft, which is parallel to the flow-blocking surface; the flow-blocking device is adapted to rotate around the rotating shaft.
3. The pipe cleaning device according to claim 2, characterized in that, It also includes a second controller for controlling the flow-blocking device to rotate around the rotation axis.
4. The pipe cleaning device according to claim 1, characterized in that, The target pipeline includes a main pipeline, a first sub-pipeline, and a second sub-pipeline; One end of the first sub-pipe is connected to the first reaction chamber, and one end of the second sub-pipe is connected to the second reaction chamber; the other ends of the first sub-pipe and the second sub-pipe converge at one end of the main pipe. There are multiple air intake pipes, and the first sub-pipe and the second sub-pipe are each connected to at least one of the air intake pipes.
5. The pipe cleaning device according to claim 1, characterized in that, The air inlet of the air intake pipe is connected to a clean gas preparation device, which is used to supply clean gas to the air intake pipe.
6. The pipe cleaning device according to claim 1, characterized in that, A mass flow controller is installed on the air intake pipe.
7. The pipe cleaning device according to claim 5, characterized in that, The clean gas preparation device is used to prepare clean gas in plasma state.
8. The pipe cleaning device according to claim 1, characterized in that, A valve is installed on the target pipeline, and the other end of the target pipeline is connected to an exhaust device.
9. A pipe cleaning method, applied to the pipe cleaning apparatus as described in any one of claims 1-6, characterized in that, include: During the cleaning of the target pipe, the flow-blocking device is controlled to extend into the target pipe from the pipe wall; Clean gas is introduced into the target pipe through the air intake pipe to clean the target pipe.
10. The pipe cleaning method according to claim 9, characterized in that, Before the cleaning gas is introduced into the target pipe through the air inlet pipe to clean the target pipe, the method further includes: controlling the flow-blocking device to rotate around a rotation axis on the flow-blocking device that is parallel to the flow-blocking surface.
11. The pipe cleaning method according to claim 9, characterized in that, The process of cleaning the target pipe by introducing clean gas through the air inlet pipe further includes controlling the flow rate of the clean gas to be between 200 sccm and 2000 sccm.
12. The pipe cleaning method according to claim 11, characterized in that, The cleaning gas includes fluoride ions.
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