A fully automatic wafer re-grinding machine

Abstract

The present application discloses a fully automatic wafer pelletizing machine, which is applied in the field of wafer preparation. The key points of its technical solution are a fully automatic wafer pelletizing machine, comprising a workbench, a placing table is arranged on the workbench, a detection device is arranged above the placing table, a mechanical arm is arranged on one side of the detection device, the placing table is connected with a material picking moving device, a loading tray is arranged on the workbench on one side of the mechanical arm, the loading tray is connected with a material discharging moving device, the mechanical arm comprises a support frame, a rotating motor is arranged on the support frame, the output end of the rotating motor is arranged vertically downward, the end of the output end is connected with a material picking arm, the end of the material picking arm is provided with a material picking nozzle, an air pump is arranged on the support frame, an air extraction pipe is connected between the air pump and the material picking nozzle, a PLC control box is arranged on the workbench, and the material picking moving device, the material discharging moving device, the detection device and the mechanical arm are electrically connected with the PLC control box; the technical effect is to improve the efficiency of clamping and boxing wafers.

Description

Technical Field

[0001] The present application relates to the technical field of wafer preparation, and in particular to a fully automatic wafer pelletizing machine. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. During the wafer preparation process, several wafers need to be arranged in an orderly manner on a carrier, and then the several wafers on the carrier need to be inspected and taken out for packaging.

[0003] The conventional wafer picking and separation is usually completed by staff using clamps. The staff clamps qualified wafers from the carrier and places them in a storage box, and then clamps unqualified wafers from the carrier and places them in a storage box separately.

[0004] With respect to the above-mentioned related technologies, the inventors believe that there is a defect that the manual work of clamping and packaging wafers is slow. Summary of the invention

[0005] In order to improve the efficiency of wafer clamping and boxing, the present application provides a fully automatic wafer retrieval machine.

[0006] The present application provides a fully automatic wafer pelletizing machine, which adopts the following technical scheme: a fully automatic wafer pelletizing machine, comprising a workbench, a placing table is arranged on the workbench, a detection device is arranged above the placing table, a mechanical arm is arranged on one side of the detection device, the placing table is connected with a material picking moving device, a loading tray is arranged on the workbench on one side of the mechanical arm, the loading tray is connected with a material discharging moving device, the mechanical arm comprises a support frame, a rotating motor is arranged on the support frame, the output end of the rotating motor is arranged vertically downward, the end of the output end is connected with a material picking arm, the end of the material picking arm is provided with a material picking nozzle, an air pump is arranged on the support frame, an exhaust pipe is connected between the air pump and the material picking nozzle, a PLC control box is arranged on the workbench, and the material picking moving device, the material discharging moving device, the detection device and the mechanical arm are electrically connected to the PLC control box.

[0007] Through the above technical solution, the material picking moving device can be controlled by the PLC control box, so that each wafer on the carrier can be moved to the bottom of the detection device for detection. After the detection device detects that the wafer below is a qualified product, the PLC control box controls the rotating motor to rotate the material picking arm, so that the end of the material picking arm moves to the top of the qualified product to absorb the qualified wafer. After the material picking arm completes the material picking, the rotating motor will move the end of the material picking arm to the top of the receiving tray, so that the wafer is placed in the placement groove of the receiving tray. The receiving tray is moved by the material placement moving device, so that each placement groove of the receiving tray can be moved in turn to the bottom of the material picking nozzle for loading, thereby realizing automatic detection and material picking of the wafer, and improving the efficiency of wafer picking and boxing.

[0008] The present application is further configured as follows: the detection device includes a fixing frame, an imaging camera and a display screen are arranged on the fixing frame, and the imaging camera is electrically connected to the display screen.

[0009] Through the above technical solution, the wafers on the carrier are photographed by an imaging camera, and the image taken by the imaging camera is then imaged and analyzed through a display screen, which facilitates the detection of the wafers on the carrier and also facilitates monitoring by staff.

[0010] The present application is further configured as follows: a shadowless lamp ring is provided below the imaging camera, and a horizontal distance from the output end of the rotating motor to the center of the shadowless lamp ring is the same as the length of the material picking arm.

[0011] Through the above technical solution, the shadowless light ring can enable the imaging camera to capture the image of the wafer on the carrier more clearly, which is convenient for imaging analysis of the wafer. The material picking arm picks the wafer below the center of the shadowless light ring to ensure the accuracy of material picking.

[0012] The present application is further configured as follows: the material picking moving device includes a longitudinal electric screw for picking up material, the longitudinal electric screw for picking up material is located on one side of the placing table, a longitudinal sliding block for picking up material is connected to the longitudinal electric screw for picking up material, a longitudinal groove for picking up material is arranged on the outer side of the longitudinal electric screw for picking up material, the opening end of the longitudinal groove for picking up material is arranged toward one side of the placing table, a transverse electric screw for picking up material is vertically connected to the outer side wall of the longitudinal sliding block, a transverse sliding block for picking up material is connected to the transverse electric screw for picking up material, a transverse groove for picking up material is arranged on the outer side of the transverse electric screw for picking up material, the opening end of the transverse groove for picking up material is arranged toward one side of the placing table, and the side wall edge of the placing table is connected to the outer side wall of the transverse sliding block for picking up material.

[0013] Through the above technical scheme, the carrier can be moved longitudinally and transversely respectively by the longitudinal electric screw and the transverse screw for material picking, ensuring that each wafer on the carrier can be moved under the detection device for detection. The longitudinal electric screw and the transverse screw for material picking can make the carrier move more stably.

[0014] The present application is further configured as follows: a fixing cylinder is provided on the placement table, a locking groove is provided on the upper end of the fixing cylinder, a plurality of threaded columns are rotatably connected to the placement table, a connecting plate for threaded connection of the threaded columns is provided on the outer wall of the fixing cylinder, a toothed wheel is provided at the lower end of each of the threaded columns, a brake wheel is provided on the placement table, the brake wheel is connected to a brake motor, a rack belt is mounted on each of the toothed wheels and the brake wheel, and the brake motor is electrically connected to a PLC control box.

[0015] Through the above technical solution, the threaded columns can be rotated by the brake motor to move the fixed cylinder upward, so that the wafer on the carrier plate contacts the lower end of the material removal nozzle, ensuring that the material removal nozzle can stably hold the wafer.

[0016] The present application is further configured as follows: an adjusting cylinder is provided on the placement table, and the end of the piston rod of the adjusting cylinder abuts against the outer side wall of the rack belt.

[0017] Through the above technical solution, the tightness of the rack belt can be adjusted by adjusting the cylinder to ensure the transmission effect of the brake wheel on each toothed wheel.

[0018] The present application is further configured as follows: the placement table below the fixed cylinder is hollowed out, a supporting cylinder is provided on the workbench, a piston rod of the supporting cylinder is vertically upward, a supporting block is provided at the end of the piston rod, the supporting block is located directly below the center of the shadowless lamp ring, and the supporting cylinder is electrically connected to the PLC control box.

[0019] Through the above technical solution, while the brake motor moves the fixed cylinder upward, the piston rod of the supporting cylinder will also extend upward, so that the upper end of the supporting block remains in contact with the lower end of the carrier until the wafer on the carrier contacts the material removal air nozzle, ensuring that the material removal nozzle is in close contact with the wafer and that the material removal nozzle can suck up the wafer.

[0020] The present application is further configured as follows: a weak current wire is sleeved on the outer side of the support block, an ammeter and a power supply bottle are connected in series on one end of the weak current wire, and the ammeter is electrically connected to the PLC control box.

[0021] Through the above technical solution, the weak-current wire will discharge when it contacts the fixed cylinder. At this time, the ammeter will detect the current and send a signal to the PLC control box, so that the PLC control box controls the material-grabbing moving device to adjust the placement table to prevent the carrier on the placement table from moving out of the detection range of the imaging camera, and at the same time prevent the fixed cylinder from causing the fixed block to shift.

[0022] The present application is further configured as follows: the material unloading moving device includes a material unloading longitudinal electric screw, a material unloading longitudinal slider is connected to the material unloading longitudinal electric screw, a material unloading longitudinal groove is arranged on the outer side of the material unloading longitudinal electric screw, the opening end of the material unloading longitudinal groove is arranged upward, a material unloading transverse electric screw is arranged above the material unloading longitudinal electric screw, the material unloading transverse electric screw and the material unloading longitudinal electric screw are arranged in a cross shape, the material unloading transverse electric screw is connected to the material unloading transverse slider, a material unloading transverse groove is arranged on the outer side of the material unloading transverse electric screw, the opening end of the material unloading transverse groove is arranged upward, the bottom end of the outer wall of the material unloading transverse groove is connected to the upper end of the outer wall of the material unloading longitudinal slider, and the bottom end of the receiving plate is connected to the upper end of the material unloading transverse slider.

[0023] Through the above technical scheme, the receiving tray can be moved longitudinally and transversely respectively by the longitudinal electric screw rod and the transverse screw rod, ensuring that each placement groove of the receiving tray can be moved in turn to the bottom of the material taking suction nozzle for loading.

[0024] The present application is further configured as follows: a plurality of placement grooves are provided on the receiving tray, and elastic clips are provided in the placement grooves.

[0025] Through the above technical solution, the wafer is placed more stably by means of the elastic clip, thereby ensuring the quality of wafer packaging.

[0026] In summary, the beneficial technical effects of this application are:

[0027] 1. Through the material picking and discharging moving device, the detection device and the robotic arm, the wafers can be automatically detected and picked up, thereby improving the efficiency of wafer picking and boxing;

[0028] 2. The image captured by the imaging camera is analyzed through the display screen, which is convenient for detecting the wafers on the carrier and also convenient for the staff to monitor;

[0029] 3. When the brake motor moves the fixed cylinder upward, the piston rod of the supporting cylinder will also extend upward to ensure that the material suction nozzle is in close contact with the wafer and that the material suction nozzle can suck up the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of this embodiment;

[0031] Figure 2 is an exploded view of the material taking and moving device of this embodiment;

[0032] Figure 3 It is an exploded view of the material discharging and moving device of this embodiment.

[0033] Description of the drawings: 1. Workbench; 2. Placing table; 3. Loading tray; 4. Support frame; 5. Rotating motor; 6. Material picking arm; 7. Air pump; 8. PLC control box; 9. Fixed frame; 10. Imaging camera; 11. Display screen; 12. Shadowless lamp ring; 13. Longitudinal electric screw for material picking; 14. Longitudinal slider for material picking; 15. Horizontal electric screw for material picking; 16. Horizontal slider for material picking; 17. Fixed cylinder; 18. Threaded column; 19. Connecting plate; 20. Toothed wheel; 21. Brake wheel; 22. Brake motor; 23. Rack belt; 24. Adjusting cylinder; 25. Supporting cylinder; 26. Ammeter; 27. Power supply bottle; 28. Longitudinal electric screw for material discharge; 29. ​​Longitudinal slider for material discharge; 30. Horizontal electric screw for material discharge; 31. Horizontal slider for material discharge. DETAILED DESCRIPTION

[0034] The present application is further described in detail below in conjunction with the accompanying drawings.

[0035] Example:

[0036] Reference Figure 1 and Figure 2 , is a fully automatic wafer pelletizing machine disclosed in the present application, comprising a workbench 1, a dust baffle is provided at the edge of the workbench 1, and part of the dust is blocked by the dust baffle. A material picking moving device is provided on the workbench 1, and the material picking moving device comprises a material picking longitudinal electric screw 13, a material picking longitudinal slider 14 is threadedly connected to the material picking longitudinal electric screw 13, and a material picking longitudinal groove is fixedly sleeved on the outer side of the material picking longitudinal electric screw 13. The outer wall of the material picking longitudinal slider 14 fits with the inner wall of the material picking longitudinal groove, and when the material picking longitudinal electric screw 13 is working and rotating, the material picking longitudinal slider 14 will slide horizontally in the material picking longitudinal groove. The inner side of the longitudinal material picking groove is opened, and a transverse material picking electric screw 15 is arranged at the open end of the longitudinal material picking groove. A transverse material picking slider 16 is threadedly connected to the transverse material picking electric screw 15. The outer side of the transverse material picking electric screw 15 is sleeved and fixed with a transverse material picking groove. When the transverse material picking electric screw 15 rotates, the transverse material picking slider 16 will slide horizontally in the transverse material picking groove.

[0037] Reference Figure 1 and Figure 2, one end of the transverse slot for picking up materials is vertically connected to the outer side wall of the longitudinal slider, the inner side opening of the transverse slot for picking up materials is provided, a placing table 2 is provided on the inner side of the transverse slot for picking up materials, and the side wall edge of the placing table 2 is fixedly connected to the outer side wall of the transverse slider 16 for picking up materials. A fixing cylinder 17 is provided above the placing table 2, and a snap-fit ​​groove is provided at the inner ring of the upper end of the fixing cylinder 17, and the placing and limiting of the carrier plate is performed through the snap-fit ​​groove, so that the placing of the carrier plate is more stable. When the longitudinal electric screw 13 for picking up materials causes the longitudinal slider 14 for picking up materials to slide, the longitudinal slider 14 for picking up materials will drive the transverse electric screw 15 for picking up materials to move longitudinally, thereby causing the carrier plate on the placing table 2 to move longitudinally. When the transverse electric screw 15 for picking up materials causes the transverse slider 16 for picking up materials to slide, the transverse slider 16 for picking up materials will drive the placing table 2 to move laterally, thereby causing the carrier plate to move laterally.

[0038] Reference Figure 1 and Figure 2 , a detection device is arranged above the placement table 2, and the detection device includes a fixing frame 9, and the lower end of the fixing frame 9 is fixedly connected to the workbench 1. A fixing frame 9 is arranged on the fixing frame 9, and the lower end of the fixing frame 9 is fixedly connected to the workbench 1, and an imaging camera 10 and a display screen 11 are arranged on the fixing frame 9. The imaging camera 10 is located above the fixed cylinder 17, and the imaging camera 10 is electrically connected to the display screen 11. The imaging camera 10 is used to perform imaging detection on the wafers on the carrier, and the image captured by the imaging camera 10 will be displayed on the display screen 11, so as to facilitate the identification of whether each wafer on the carrier is qualified. A shadowless light ring 12 is arranged below the imaging camera 10, and the shadowless light ring 12 makes the imaging area of ​​the imaging camera 10 clearer, so as to facilitate the imaging camera 10 to shoot and image the carrier below.

[0039] refer to Figure 1 A mechanical arm is provided on one side of the detection device, and the mechanical arm includes a support frame 4, and the lower end of the support frame 4 is fixedly connected to the workbench 1. A rotating motor 5 is fixed on the support frame 4, and the rotating motor 5 is arranged in parallel with the imaging camera 10. The output end of the rotating motor 5 is arranged vertically downward, and the end of the output end is vertically connected to the material picking arm 6. The horizontal distance from the output end of the rotating motor 5 to the center of the shadowless lamp ring 12 is the same as the length of the material picking arm 6, so that the rotating motor 5 can make the end of the material picking arm 6 rotate to just below the imaging camera 10. A material picking nozzle is provided at the end of the material picking arm 6, and an air pump 7 is provided on the support frame 4, and an exhaust pipe is connected between the air pump 7 and the material picking nozzle. A PLC control box 8 is provided on the fixed frame 9, and the material picking moving device, the display screen 11, the rotating motor 5 and the air pump 7 are electrically connected to the PLC control box 8.

[0040] refer to Figure 1, the PLC control box 8 will analyze the image on the display screen 11. If the wafer on the carrier directly below the imaging camera 10 is a defective product, the PLC control box 8 will control the material removal moving device to move the carrier. Through the material removal moving device, each wafer on the carrier can be moved to the directly below the imaging camera 10 for inspection. When the PLC control box 8 analyzes the image on the display screen 11 and finds that the wafer directly below the imaging camera 10 is a qualified product, the PLC control box 8 will control the rotating motor 5 to rotate the material removal arm 6, so that the end of the material removal arm 6 moves to the directly below the imaging camera 10, thereby moving the material removal nozzle to the directly above the wafer detected by the imaging camera 10.

[0041] refer to Figure 1 and Figure 2 , a plurality of threaded columns 18 are rotatably connected to the placement table 2, a plurality of connecting plates 19 are fixed to the outer wall of the fixed cylinder 17, and the threaded columns 18 vertically pass through the connecting plates 19 and are threadedly connected to the connecting plates 19. The lower ends of the threaded columns 18 are all penetrated with toothed wheels 20, and the upper end surface of the placement table 2 is rotatably connected with a brake wheel 21, and the brake wheel 21 is connected with a brake motor 22. A rack belt 23 is sleeved on each toothed wheel 20 and the brake wheel 21, and the brake wheel 21 is connected to each toothed wheel 20 through the rack belt 23. An adjusting cylinder 24 is provided on the placement table 2, and the piston rod end of the adjusting cylinder 24 is against the outer wall of the rack belt 23. The tightness of the rack belt 23 can be adjusted by adjusting the cylinder 24 to ensure the transmission effect of the brake wheel 21 on each toothed wheel 20. The brake motor 22 is electrically connected to the PLC control box 8. After the material picking nozzle moves to the position directly above the wafer detected by the imaging camera 10, the PLC control box 8 controls the brake motor 22 to rotate, causing each threaded column 18 to rotate, thereby causing the fixed cylinder 17 to move upward.

[0042] refer to Figure 1 and Figure 2 , the upward movement of the fixed cylinder 17 will make the wafer on the carrier contact with the lower end of the material picking nozzle, and the PLC control box 8 will control the air pump 7 to start, suck the wafer through the material picking nozzle, and then control the brake motor 22 to restore the fixed cylinder 17 to its original position. A receiving tray 3 is provided on the workbench 1 on the side of the robot arm away from the placement table 2, and a plurality of placement grooves are provided on the receiving tray 3, and elastic clips are provided in the placement grooves. The PLC control box 8 controls the rotating motor 5 to rotate the material picking arm 6 180°, so that the end of the material picking arm 6 moves to the top of the receiving tray 3, and then controls the air pump 7 to stop working, so that the material picking nozzle releases the sucked wafer, so that the wafer is placed in the placement groove of the receiving tray 3.

[0043] refer to Figure 1 and Figure 3A material discharging moving device is arranged below the receiving tray 3, and the material discharging moving device includes a material discharging longitudinal electric screw 28, which is fixed on the workbench 1, and a material discharging longitudinal slider 29 is connected to the material discharging longitudinal electric screw 28, and a material discharging longitudinal groove is fixedly sleeved on the outer side of the material discharging longitudinal electric screw 28. The outer wall of the material discharging longitudinal slider 29 fits the inner wall of the material discharging longitudinal groove, and when the material discharging longitudinal electric screw 28 is working and rotating, the material discharging longitudinal slider 29 will slide horizontally in the material discharging longitudinal groove. The upper end of the material discharging longitudinal groove is opened, and a material discharging transverse electric screw 30 is arranged above the material discharging longitudinal electric screw 28, and the material discharging transverse electric screw 30 is arranged crosswise with the material discharging longitudinal electric screw 28. A material discharging transverse slider 31 is connected to the material discharging transverse electric screw 30, and a material discharging transverse groove is arranged on the outer side of the material discharging transverse electric screw 30. The outer wall of the material discharging transverse slider 31 is in contact with the inner wall of the material discharging transverse groove. When the material discharging transverse electric screw 30 rotates, the material discharging transverse slider 31 moves horizontally in the material discharging transverse groove.

[0044] refer to Figure 1 and Figure 3 The outer wall of the bottom end of the discharging transverse groove is fixedly connected to the upper end of the discharging longitudinal slider 29. When the discharging longitudinal electric screw 28 is working, it will drive the discharging transverse electric screw 30 to move longitudinally. The upper end of the discharging transverse groove is open, and the bottom end of the receiving tray 3 is connected to the upper end of the discharging transverse slider 31, so that when the discharging transverse electric screw 30 is working, it will drive the receiving tray 3 to move horizontally. The discharging longitudinal electric screw 28 and the discharging transverse screw can respectively move the receiving tray 3 in the longitudinal and transverse directions, so that each placement groove of the receiving tray 3 can be moved in sequence to the bottom of the material taking suction nozzle for loading.

[0045] refer to Figure 1 and Figure 2 , a circular through hole is provided on the placing table 2 below the fixed cylinder 17, and the diameter of the circular through hole is the same as the inner diameter of the fixed cylinder 17. A supporting cylinder 25 is provided on the workbench 1 directly below the imaging camera 10, and the piston rod of the supporting cylinder 25 is vertically arranged upward. A supporting block is provided at the end of the piston rod, and the supporting block is located directly below the center of the shadowless lamp ring 12, and the upper end surface of the supporting block is in contact with the carrier. The supporting cylinder 25 is electrically connected to the PLC control box 8. When the PLC control box 8 controls the brake motor 22 to move the fixed cylinder 17 upward, it will also control the piston rod of the supporting cylinder 25 to extend upward, so that the upper end of the supporting block remains in contact with the lower end of the carrier until the wafer on the carrier contacts the material extraction nozzle, and the PLC control box 8 controls the brake motor 22 and the supporting cylinder 25 to stop working at the same time. When the material extraction nozzle contacts the wafer, the supporting block plays a supporting role on the carrier, ensuring that the material extraction nozzle is in close contact with the wafer, so that the material extraction nozzle can suck up the wafer.

[0046] refer to Figure 1 and Figure 2 , a weak-current wire is sleeved on the outside of the support block, and an ammeter 26 and a power bottle 27 are connected in series on one side of the end of the weak-current wire, and the power bottle 27 supplies power to the weak-current wire. When the material-picking moving device moves the placement table 2, the fixed cylinder 17 will move with the placement table 2. When the inner edge of the fixed cylinder 17 moves to the support block and contacts, the weak-current wire contacts the fixed cylinder 17 and discharges, and the ammeter 26 detects the current. The ammeter 26 is electrically connected to the PLC control box 8, and the ammeter 26 sends a signal to the PLC control box 8, so that the PLC control box 8 controls the material-picking moving device to adjust the placement table 2, prevent the carrier on the placement table 2 from moving out of the detection range of the imaging camera, and prevent the fixed cylinder 17 from causing the fixed block to shift.

[0047] The implementation principle of this embodiment is: the carrier can be moved longitudinally and transversely by the longitudinal electric screw 13 and the transverse screw 13, respectively, so that each wafer on the carrier can be moved to the bottom of the imaging camera 10 for detection. When the display screen 11 analyzes that the wafer directly below the imaging camera 10 is a qualified product, the rotating motor 5 will rotate the material picking arm 6, so that the end of the material picking arm 6 moves to the bottom of the imaging camera 10, so that the material picking nozzle moves to the top of the wafer detected by the imaging camera 10, and the qualified wafer is sucked. After the material picking arm 6 finishes picking, the rotating motor 5 will move the end of the material picking arm 6 to the top of the receiving tray 3, and then control the air pump 7 to stop working, so that the wafer is placed in the placement groove of the receiving tray 3. The longitudinal electric screw 28 and the transverse screw 28 of the material discharge can respectively move the receiving tray 3 longitudinally and transversely, so that each placement groove of the receiving tray 3 can be moved to the bottom of the material picking nozzle in turn for loading.

[0048] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A fully automatic wafer pelletizing machine, characterized in that: The invention comprises a workbench (1), wherein a placing table (2) is arranged on the workbench (1), a detection device is arranged above the placing table (2), a mechanical arm is arranged on one side of the detection device, the placing table (2) is connected to a material picking moving device, a receiving tray (3) is arranged on the workbench (1) on one side of the mechanical arm, the receiving tray (3) is connected to a material discharging moving device, the mechanical arm comprises a support frame (4), a rotating motor (5) is arranged on the support frame (4), the output end of the rotating motor (5) is arranged vertically downward, the end of the output end is connected to a material picking arm (6), the end of the material picking arm (6) is provided with a material picking nozzle, an air pump (7) is arranged on the support frame (4), an air extraction pipe is connected between the air pump (7) and the material picking nozzle, a PLC control box (8) is arranged on the workbench (1), and the material picking moving device, the material discharging moving device, the detection device and the mechanical arm are electrically connected to the PLC control box (8); The detection device comprises a fixing frame (9), an imaging camera (10) is arranged on the fixing frame (9), a shadowless lamp ring (12) is arranged below the imaging camera (10), and the horizontal distance from the output end of the rotating motor (5) to the center of the shadowless lamp ring (12) is the same as the length of the material taking arm (6); The placement table (2) is provided with a fixed cylinder (17), the upper end of the fixed cylinder (17) is used to place a carrier plate carrying wafers, and the fixed cylinder (17) can move upward or return to its original position; The material removal moving device drives the placement table (2) to move horizontally and vertically, and the placement table (2) drives each wafer on the carrier to move to the position directly below the imaging camera (10) for detection; The material taking suction nozzle moves to the position directly above the wafer to be inspected, the fixed cylinder (17) drives the wafer to move upward, and the lower end of the material taking suction nozzle contacts and sucks the wafer; The material discharging moving device drives the receiving tray (3) to move in the horizontal and vertical directions, and each placement groove of the receiving tray (3) can be moved in sequence to the position directly below the material taking suction nozzle for loading.

2. The fully automatic wafer pelletizing machine according to claim 1, characterized in that: The detection device comprises a fixing frame (9), on which an imaging camera (10) and a display screen (11) are arranged, and the imaging camera (10) is electrically connected to the display screen (11).

3. The fully automatic wafer pelletizing machine according to claim 1, characterized in that: The material picking moving device comprises a material picking longitudinal electric screw (13), the material picking longitudinal electric screw (13) is located on one side of the placing table (2), the material picking longitudinal electric screw (13) is connected to a material picking longitudinal sliding block (14), a material picking longitudinal groove is arranged on the outer side of the material picking longitudinal electric screw (13), the opening end of the material picking longitudinal groove is arranged toward one side of the placing table (2), a material picking transverse electric screw (15) is vertically connected to the outer side wall of the longitudinal sliding block, the material picking transverse electric screw (15) is connected to a material picking transverse sliding block (16), a material picking transverse groove is arranged on the outer side of the material picking transverse electric screw (15), the opening end of the material picking transverse groove is arranged toward one side of the placing table (2), and the side wall edge of the placing table (2) is connected to the outer side wall of the material picking transverse sliding block (16).

4. The fully automatic wafer pelletizing machine according to claim 1, characterized in that: The upper end of the fixed cylinder (17) is provided with a locking groove, and the placement platform (2) is rotatably connected with a plurality of threaded columns (18). The outer wall of the fixed cylinder (17) is provided with a connecting plate (19) for threaded connection of the threaded columns (18), and the lower end of each of the threaded columns (18) is provided with a toothed wheel (20). The placement platform (2) is provided with a brake wheel (21), and the brake wheel (21) is connected to a brake motor (22). A rack belt (23) is sleeved on each of the toothed wheels (20) and the brake wheel (21), and the brake motor (22) is electrically connected to a PLC control box (8).

5. The fully automatic wafer pelletizing machine according to claim 4, characterized in that: An adjusting cylinder (24) is arranged on the placing table (2), and the end of the piston rod of the adjusting cylinder (24) abuts against the outer side wall of the rack belt (23).

6. The fully automatic wafer pelletizing machine according to claim 4, characterized in that: The placement table (2) below the fixed cylinder (17) is hollowed out, and a support cylinder (25) is arranged on the workbench (1). The piston rod of the support cylinder (25) is arranged vertically upward, and a support block is arranged at the end of the piston rod. The support block is located directly below the center of the shadowless lamp ring (12), and the support cylinder (25) is electrically connected to the PLC control box (8).

7. The fully automatic wafer pelletizing machine according to claim 6, characterized in that: A weak current wire is sleeved on the outer side of the support block, and an ammeter (26) and a power supply bottle (27) are connected in series on one end of the weak current wire. The ammeter (26) is electrically connected to the PLC control box (8).

8. The fully automatic wafer pelletizing machine according to claim 1, characterized in that: The material discharging moving device comprises a material discharging longitudinal electric screw (28), a material discharging longitudinal slide block (29) is connected to the material discharging longitudinal electric screw (28), a material discharging longitudinal groove is arranged outside the material discharging longitudinal electric screw (28), and the opening end of the material discharging longitudinal groove is arranged upward, a material discharging transverse electric screw (30) is arranged above the material discharging longitudinal electric screw (28), and the material discharging transverse electric screw (30) and the material discharging longitudinal electric screw (28) are arranged in a cross-shaped manner, and a material discharging transverse slide block (31) is connected to the material discharging transverse electric screw (30), a material discharging transverse groove is arranged outside the material discharging transverse electric screw (30), and the opening end of the material discharging transverse groove is arranged upward, the bottom end of the outer wall of the material discharging transverse groove is connected to the upper end of the outer wall of the material discharging longitudinal slide block (29), and the bottom end of the receiving plate (3) is connected to the upper end of the material discharging transverse slide block (31).

9. The fully automatic wafer pelletizing machine according to claim 1, characterized in that: The receiving plate (3) is provided with a plurality of placement grooves, and elastic clips are provided in the placement grooves.

Images