Ceramic electronic components

Abstract

The present invention relates to a ceramic electronic component. The ceramic electronic component of the present invention comprises: a component body including a ceramic layer; at least one terminal electrode provided on one main surface of the component body; and an insulating coating layer provided across the ceramic layer and the terminal electrode so as to cover a portion of the peripheral portion of the terminal electrode instead of covering the entire peripheral portion of the terminal electrode, and when viewed from above from one main surface of the component body, at the intersection where the terminal electrode not covered by the coating layer intersects with the coating layer, the coating layer intersects with the terminal electrode at a non-perpendicular angle.

Description

Technical Field

[0001] The present invention relates to ceramic electronic components. Background Art

[0002] As an example of a ceramic electronic component mounted on a mounting substrate, Patent Document 1 discloses a ceramic electronic component comprising a component body and an external terminal electrode provided along a main surface of the component body, wherein the external terminal electrode comprises a peripheral portion and a central portion surrounded by the peripheral portion, the peripheral portion is thicker than the central portion, and at least a portion of the peripheral portion is buried in the component body. Patent Document 1 states that an electrically insulating coating layer is preferably formed along the main surface of the component body so as to cover at least a portion of the peripheral portion of the external terminal electrode.

[0003] Patent Document 1: International Publication No. 2012 / 157436

[0004] As described in Patent Document 1, by covering the entire circumference or a portion of the peripheral portion of an external terminal electrode (hereinafter simply referred to as a terminal electrode) with a covering layer, the adhesion strength of the terminal electrode can be improved.

[0005] Fig.11 This is a plan view schematically showing an example of a conventional ceramic electronic component in which the entire periphery of a terminal electrode is covered with a covering layer. Fig.12 This is a plan view schematically showing an example of a conventional ceramic electronic component in which a portion of the peripheral edge portion of a terminal electrode is covered with a covering layer.

[0006] In such Fig.11 When the entire periphery of the terminal electrode 20 is covered with the covering layer 30 as shown in FIG. Fig.12 Compared with the case where a part of the peripheral portion of the terminal electrode 20 is covered with the covering layer 30 as shown, the adhesion strength of the terminal electrode 20 with respect to the component body 10 is increased.

[0007] However, since the area of ​​the terminal electrode that can be formed on the component body having a predetermined size is limited, when the entire periphery of the terminal electrode is covered with a coating layer, the exposed area of ​​the terminal electrode becomes smaller, so the electrical characteristics such as the resistance becomes higher and the like are degraded. In addition, when the terminal electrode is formed near the end face of the component body, it is necessary to consider the width of the coating layer when forming the terminal electrode, so it is impossible to reduce the distance between the end face of the component body and the terminal electrode.

[0008] To solve the above problem, it is effective to cover a portion of the peripheral portion of the terminal electrode with a coating layer instead of covering the entire peripheral portion of the terminal electrode. However, the contact strength of the terminal electrode is reduced in the peripheral portion of the terminal electrode not covered by the coating layer.

[0009] In addition, when the coating layer covers a portion of the peripheral portion of the terminal electrode instead of covering the entire peripheral portion of the terminal electrode, stress is concentrated at the overlapping portion of the terminal electrode and the coating layer, so that the terminal electrode is easily deformed, for example, relative to the intended direction. Fig.12 The terminal electrode is peeled off by shrinking in the direction of the arrow shown. Summary of the invention

[0010] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a ceramic electronic component in which a portion of the peripheral edge of a terminal electrode is covered with a coating layer and the terminal electrode is unlikely to be peeled off.

[0011] The ceramic electronic component of the present invention comprises: a component body, including a ceramic layer; at least one terminal electrode, arranged on a main surface of the above-mentioned component body; and an insulating coating layer, which is arranged across the above-mentioned ceramic layer and the above-mentioned terminal electrode so as to cover a part of the peripheral portion of the above-mentioned terminal electrode instead of covering the entire peripheral portion of the above-mentioned terminal electrode. When viewed from above from a main surface of the above-mentioned component body, at the intersection where the above-mentioned terminal electrode not covered by the above-mentioned coating layer intersects with the above-mentioned coating layer, the above-mentioned coating layer intersects with the above-mentioned terminal electrode at a non-perpendicular angle.

[0012] According to the present invention, a ceramic electronic component can be provided in which a portion of the peripheral edge portion of a terminal electrode is covered with a covering layer and the terminal electrode is unlikely to be peeled off. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a cross-sectional view schematically showing a ceramic electronic component according to one embodiment of the present invention.

[0014] Figure 2 Yes Figure 1 An example of an enlarged cross-sectional view of the vicinity of a terminal electrode of a ceramic electronic component is shown.

[0015] Figure 3 Yes Figure 1 An example of an enlarged plan view of the vicinity of a terminal electrode of a ceramic electronic component is shown.

[0016] Figure 4 yes Figure 3 An enlarged view near the intersection is shown.

[0017] Figure 5 Yes Figure 1 Another example of an enlarged plan view of the vicinity of a terminal electrode of a ceramic electronic component is shown.

[0018] Figure 6 It is a plan view schematically showing another example of a covering layer whose front end portion protrudes from a terminal electrode.

[0019] Figure 7 It is a plan view schematically showing an example of a covering layer whose front end portion does not protrude from a terminal electrode.

[0020] Figure 8 This is a cross-sectional view for explaining the relationship between the linear expansion coefficients of the ceramic layer, the terminal electrode, and the coating layer.

[0021] Fig. 9 It is a plan view schematically showing an example of a covering layer intersecting with a terminal electrode, wherein the covering layer intersects with the terminal electrode so that an angle formed between the covering layer and the terminal electrode is an obtuse angle.

[0022] Fig.10 yes Fig. 9 An enlarged view near the intersection is shown.

[0023] Fig.11 This is a plan view schematically showing an example of a conventional ceramic electronic component in which the entire periphery of a terminal electrode is covered with a covering layer.

[0024] Fig.12 This is a plan view schematically showing an example of a conventional ceramic electronic component in which a portion of the peripheral edge portion of a terminal electrode is covered with a covering layer. DETAILED DESCRIPTION

[0025] Hereinafter, the ceramic electronic component of the present invention will be described.

[0026] However, the present invention is not limited to the following configurations, and can be appropriately modified and applied within the scope of the gist of the present invention. In addition, a configuration in which two or more of the preferred configurations described below are combined is also the present invention.

[0027] The ceramic electronic component of the present invention is a ceramic electronic component that can be mounted on a mounting substrate. The present invention can be applied to various laminated ceramic electronic components such as multilayer ceramic substrates. However, the ceramic electronic component of the present invention is not limited to a laminated structure, and can also be a single-layer structure.

[0028] Figure 1 It is a cross-sectional view schematically showing a ceramic electronic component according to one embodiment of the present invention.

[0029] Figure 1The ceramic electronic component 1 shown is a laminated ceramic electronic component. The ceramic electronic component 1 includes a component body 10 including a plurality of laminated ceramic layers 11. Inside the component body 10, an internal conductor film 12 is provided along a specific interface between the ceramic layers 11 as an internal conductor, and a through-hole conductor 13 penetrates a specific ceramic layer 11. However, the ceramic electronic component 1 is not limited to a laminated structure, and may also be a single-layer structure. That is, the component body 10 may include a plurality of ceramic layers 11 or may include a single ceramic layer 11.

[0030] Figure 1 The ceramic electronic component 1 shown further includes a terminal electrode 20 provided on one main surface 10a of the component body 10. The ceramic electronic component 1 is mounted on a mounting substrate (not shown) by electrically connecting and mechanically fixing the terminal electrode 20 to the mounting substrate.

[0031] Figure 2 Yes Figure 1 An example of an enlarged cross-sectional view of the vicinity of a terminal electrode of a ceramic electronic component shown in FIG. Figure 2 In, with Figure 1 In contrast, the terminal electrode 20 is shown upside down. Figure 3 Yes Figure 1 An example of an enlarged top view of the vicinity of the terminal electrode of a ceramic electronic component shown in FIG. Figure 3 , a plan view of one main surface of the component body as viewed from the stacking direction is shown.

[0032] like Figure 2 and Figure 3 As shown, in Figure 1 In the ceramic electronic component 1 shown, an insulating cover layer 30 is provided across the ceramic layer 11 and the terminal electrode 20 so as to cover a portion of the peripheral portion of the terminal electrode 20 instead of covering the entire peripheral portion of the terminal electrode 20 .

[0033] The planar shape of the terminal electrode 20 is not particularly limited, but Figure 3 As shown, it is preferably a square or substantially square. Figure 3 In the embodiment, the covering layer 30 covers two sides of the terminal electrode 20 , but it may cover three sides of the terminal electrode 20 , or may cover one side. In addition, the covering layer 30 may cover the middle of the side of the terminal electrode 20 .

[0034] Although not shown, a plating film is preferably formed on the surface of the terminal electrode 20. In this case, the plating film is preferably formed so as to cover not only the entire terminal electrode 20 but also a part of the covering layer 30.

[0035] In this embodiment, if Figure 2As shown, the terminal electrode 20 is embedded in the component body 10, and the surface of the terminal electrode 20 is located on the same plane as one of the main surfaces 10a of the component body 10. In addition, the coating layer 30 is also embedded in the component body 10, and the surface of the coating layer 30 is located on the same plane as the surface of the terminal electrode 20 and one of the main surfaces 10a of the component body 10. However, the terminal electrode 20 and the coating layer 30 do not have to be embedded in the component body 10. In addition, even in the case where the terminal electrode 20 and the coating layer 30 are embedded in the component body 10, the surface of the terminal electrode 20 and the surface of the coating layer 30 do not have to be located on the same plane as one of the main surfaces 10a of the component body 10.

[0036] like Figure 3 As shown, at the intersection portion ( Figure 3 In the portion indicated by point X in FIG. 1 , the coating layer 30 intersects the terminal electrode 20 at a non-perpendicular angle. That is, the coating layer 30 does not intersect the terminal electrode 20 perpendicularly.

[0037] Thus, in the ceramic electronic component of the present invention, the covering layer and the terminal electrode intersect at a non-perpendicular angle at the intersection where the terminal electrode not covered by the covering layer intersects with the covering layer when viewed from one main surface of the component body.

[0038] like Figure 3 As shown in FIG. 1 , by covering a portion of the peripheral edge of the terminal electrode 20 with the coating layer 30, the terminal electrode 20 is Fig.11 Compared with the case where the entire periphery of the terminal electrode 20 is covered with the coating layer 30 as shown, the exposed area of ​​the terminal electrode 20 can be increased, thereby suppressing the reduction of the electrical characteristics. In addition, when the terminal electrode 20 is formed near the end face of the component body 10, the distance between the end face of the component body 10 and the terminal electrode 20 can be reduced by not covering the periphery of the terminal electrode 20 closer to the end face of the component body 10 with the coating layer 30.

[0039] And, with Fig.12 As shown in FIG. 1 , the coating layer 30 is covered so as to intersect the terminal electrode 20 perpendicularly. Figure 3 As shown, by covering with the covering layer 30 so as not to intersect the terminal electrode 20 at right angles, the terminal electrode 20 can be made less likely to be peeled off.

[0040] One of the reasons for this is that Fig.12 Different from the case of Figure 3 The terminal electrodes 20 contracting in the direction of the arrows shown intersect each other obliquely, thereby preventing stress concentration.

[0041] Figure 4 yes Figure 3 An enlarged view near the intersection is shown.

[0042] exist Figure 4 In the embodiment, the angle between the coating layer 30 and the terminal electrode 20 ( Figure 4 In the figure, the angle θ1 is an acute angle. That is, the edge ( Figure 4 , the portion shown as the extension line of the terminal electrode 20 intersects at an acute angle. Therefore, the width of the coating layer 30 widens toward the intersection portion X.

[0043] In the ceramic electronic component of the present invention, if Figure 4 As shown, the covering layer and the terminal electrode preferably intersect at the intersection of the terminal electrode not covered by the covering layer and the covering layer so that the angle between the covering layer and the terminal electrode is an acute angle.

[0044] exist Fig.12 In the structure shown, stress tends to concentrate on the intersection. Figure 3 and Figure 4 In the structure shown, stress is not concentrated on the intersection portion and is easily dispersed.

[0045] In addition, if Figure 4 As shown, when the covering layer has a curved shape, the angle formed by the covering layer and the terminal electrode means the angle formed by the tangent line of the covering layer and the edge of the terminal electrode covered by the covering layer.

[0046] In the ceramic electronic component of the present invention, when the angle θ1 formed between the covering layer and the terminal electrode is an acute angle, the angle θ1 is preferably not less than 20° and not more than 60°.

[0047] In the ceramic electronic component of the present invention, if Figure 3 and Figure 4 As shown, the coating layer 30 preferably has a curved shape toward the intersection portion X. In this case, the stress applied to the intersection portion X can be further dispersed.

[0048] When the coating layer 30 has a curved shape toward the intersection X, it may be a curved shape that is convex upward or a curved shape that is convex downward. The top of the curved shape may be located outside or inside the terminal electrode 20. In addition, it may be a curved shape having a plurality of bent portions.

[0049] Figure 5 Yes Figure 1 Another example of an enlarged plan view of the vicinity of a terminal electrode of a ceramic electronic component is shown.

[0050] like Figure 5As shown, the coating layer 30 may also have a straight line shape toward the intersection portion X.

[0051] When the coating layer 30 has a straight line shape toward the intersection portion X, it may have a straight line shape having a plurality of bent portions.

[0052] In the ceramic electronic component of the present invention, if Figure 3 and Figure 5 As shown, preferably, when viewed from a plan view from one main surface of the component body 10 , the front end portion of the covering layer 30 protrudes from the terminal electrode 20 and is provided on the surface of the ceramic layer 11 .

[0053] If the front end portion of the covering layer 30 protrudes from the terminal electrode 20 , the area to which the stress is applied by the covering layer 30 increases, and thus the stress can be dispersed.

[0054] When the tip of the covering layer 30 protrudes from the terminal electrode 20 and is provided on the surface of the ceramic layer 11, the tip of the covering layer 30 preferably has a curved shape. In this case, the stress applied to the tip of the covering layer 30 can be further dispersed.

[0055] In the case where the front end portion of the coating layer 30 has a curved shape, such as Figure 3 and Figure 5 As shown in FIG. 1 , the bent shape is preferably convex upward relative to the terminal electrode 20, but may be convex downward relative to the terminal electrode 20. In addition, a bent shape having a plurality of bent portions may be used.

[0056] Figure 6 It is a plan view schematically showing another example of a covering layer whose front end portion protrudes from a terminal electrode.

[0057] like Figure 6 As shown, when the front end portion of the covering layer 30 protrudes from the terminal electrode 20 and is provided on the surface of the ceramic layer 11 , the front end portion of the covering layer 30 may have a linear shape.

[0058] When the front end portion of the coating layer 30 has a linear shape, it may have a linear shape having a plurality of bent portions.

[0059] Figure 7 It is a plan view schematically showing an example of a covering layer whose front end portion does not protrude from a terminal electrode.

[0060] like Figure 7 As shown, the front end portion of the covering layer 30 may not protrude from the terminal electrode 20 but may be located at the same position as the end surface of the terminal electrode 20 .

[0061] When the front end portion of the coating layer protrudes from the terminal electrode, it is preferable that the length of the coating layer protruding from the terminal electrode ( Figure 3The length shown by D1 is greater than the width of the coating layer covering the terminal electrode ( Figure 3 The width W1 of the covering layer covering the terminal electrode is as shown in FIG. Figure 3 The length from the end of the covering layer 30 on the terminal electrode 20 side to the end of the terminal electrode 20 is shown.

[0062] The length D1 of the covering layer protruding from the terminal electrode is not particularly limited, and may be, for example, less than 4 times the width W1 of the covering layer covering the terminal electrode, or less than 2 times. In addition, the length D1 of the covering layer protruding from the terminal electrode may be equal to or greater than the width W1 of the covering layer covering the terminal electrode.

[0063] In the ceramic electronic component of the present invention, when the linear expansion coefficient of the ceramic layer is α1, the linear expansion coefficient of the terminal electrode is α2, and the linear expansion coefficient of the coating layer is α3, the relationship of α3<α1<α2 preferably holds.

[0064] Figure 8 This is a cross-sectional view for explaining the relationship between the linear expansion coefficients of the ceramic layer, the terminal electrode, and the coating layer. Figure 8 In the figure, the length of the arrow indicates the magnitude of the linear expansion coefficient.

[0065] Generally, the linear expansion coefficient α1 of the ceramic layer 11 is smaller than the linear expansion coefficient α2 of the terminal electrode 20. Figure 8 When the terminal electrode 20 contracts in the direction of the arrow shown in FIG. 1 , the ceramic layer 11 around the terminal electrode 20 is subjected to tensile stress. Therefore, by covering the terminal electrode 20 with the coating layer 30 having the smallest linear expansion coefficient α3, the terminal electrode 20 is Figure 8 As shown by the dotted arrow, a force is generated to counteract the tensile stress caused by the contraction of the terminal electrode 20. As a result, the concentration of stress caused by the contraction of the terminal electrode 20 can be prevented, and the strength can be improved.

[0066] The linear expansion coefficient was obtained as a value measured by thermomechanical analysis (TMA) at a heating rate of 5°C / min from room temperature to 500°C.

[0067] So far, the following embodiment has been described: the coating layer and the terminal electrode intersect at the intersection of the terminal electrode not covered by the coating layer and the coating layer, so that the angle between the coating layer and the terminal electrode is an acute angle. However, the coating layer and the terminal electrode intersect at the intersection of the terminal electrode not covered by the coating layer and the coating layer, so that the angle between the coating layer and the terminal electrode can also be an obtuse angle.

[0068] Fig. 9It is a plan view schematically showing an example of a covering layer intersecting with a terminal electrode, wherein the covering layer intersects with the terminal electrode so that an angle formed between the covering layer and the terminal electrode is an obtuse angle. Fig.10 yes Fig. 9 An enlarged view near the intersection is shown.

[0069] exist Fig. 9 and Fig.10 In, with Figure 3 and Figure 4 Similarly, an insulating coating layer 30 is provided across the ceramic layer 11 and the terminal electrode 20 so as to cover a portion of the peripheral portion of the terminal electrode 20 instead of covering the entire peripheral portion of the terminal electrode 20. Fig. 9 and Fig.10 In the embodiment, the angle between the coating layer 30 and the terminal electrode 20 ( Fig.10 In the figure, the angle θ2 is an obtuse angle. That is, the edge ( Fig.10 , the portion shown as the extension of the terminal electrode 20 intersects at an obtuse angle. Therefore, the width of the coating layer 30 becomes narrower toward the intersection portion X.

[0070] Even if Fig. 9 as well as Fig.10 The structure shown is also similar to Figure 3 and Figure 4 The structure shown in the figure can also make it difficult for the terminal electrode 20 to be peeled off.

[0071] One of the reasons is that Figure 3 The same can be considered that the coating layer 30 toward the intersection X and the coating layer 30 toward the intersection X are Fig. 9 The terminal electrodes 20 contracting in the direction of the arrows shown intersect each other obliquely, thereby preventing stress concentration.

[0072] And, in Fig. 9 and Fig.10 In the structure shown, Figure 3 and Figure 4 Compared with the structure shown in FIG. 1 , the exposed area of ​​the terminal electrode 20 can be increased. Therefore, the degradation of the electrical characteristics can be further suppressed. In addition, when the terminal electrode 20 is formed near the end surface of the component body 10, Figure 3 and Figure 4 The illustrated structure can also reduce the distance between the end surface of the component body 10 and the terminal electrode 20 .

[0073] In the ceramic electronic component of the present invention, when the angle θ2 formed between the covering layer and the terminal electrode is an obtuse angle, the angle θ2 is preferably not less than 120° and preferably not more than 160°.

[0074] like Fig. 9 and Fig.10 As shown, the coating layer 30 preferably has a curved shape toward the intersection portion X.

[0075] In this case, the curved shape may be convex upward or convex downward. The top of the curved shape may be located outside or inside the terminal electrode 20. In addition, the curved shape may have a plurality of bent portions.

[0076] Alternatively, the coating layer 30 may have a straight line shape toward the intersection X.

[0077] In this case, a straight line shape having a plurality of bent portions may be sufficient.

[0078] like Fig. 9 and Fig.10 As shown, when viewed from one main surface of the component body 10, the front end of the coating layer 30 preferably protrudes from the terminal electrode 20 and is provided on the surface of the ceramic layer 11. In this case, the front end of the coating layer 30 preferably has a curved shape.

[0079] In the case where the front end portion of the coating layer 30 has a curved shape, such as Fig. 9 As shown in FIG. 1 , the bent shape is preferably convex upward relative to the terminal electrode 20, but may be convex downward relative to the terminal electrode 20. In addition, a bent shape having a plurality of bent portions may be used.

[0080] Alternatively, when the front end of the coating layer 30 protrudes from the terminal electrode 20 and is provided on the surface of the ceramic layer 11, the front end of the coating layer 30 may have a straight line shape. When the front end of the coating layer 30 has a straight line shape, it may have a straight line shape having a plurality of bent portions. In addition, the front end of the coating layer 30 may not protrude from the terminal electrode 20, but may be located at the same position as the end face of the terminal electrode 20.

[0081] When the front end portion of the coating layer protrudes from the terminal electrode, the length of the coating layer protruding from the terminal electrode ( Fig. 9 The length indicated by D2 is preferably greater than the width of the coating layer covering the terminal electrode ( Fig. 9 The width W2 of the covering layer covering the terminal electrode is as shown in FIG. Fig. 9 The length from the end of the covering layer 30 on the terminal electrode 20 side to the end of the terminal electrode 20 is shown.

[0082] The length D2 of the covering layer protruding from the terminal electrode is not particularly limited, and may be, for example, less than 4 times the width W2 of the covering layer covering the terminal electrode, or less than 2 times. In addition, the length D2 of the covering layer protruding from the terminal electrode may also be equal to or greater than the width W2 of the covering layer covering the terminal electrode.

[0083] Even when the angle between the coating layer and the terminal electrode is an obtuse angle, when the linear expansion coefficient of the ceramic layer is set to α1, the linear expansion coefficient of the terminal electrode is set to α2, and the linear expansion coefficient of the coating layer is set to α3, the relationship α3<α1<α2 preferably holds.

[0084] The ceramic electronic component of the present invention is preferably manufactured as follows. Figure 1 An example of a method of manufacturing the ceramic electronic component 1 will be described below.

[0085] First, a plurality of ceramic green sheets are prepared to be the plurality of ceramic layers 11. The ceramic green sheets are formed by, for example, applying a doctor blade method to a ceramic slurry on a carrier film.

[0086] The thickness of the ceramic green sheet is, for example, not less than 5 μm and not more than 100 μm.

[0087] The ceramic slurry includes, for example, ceramic powder, a binder, and a plasticizer. As the ceramic material contained in the ceramic green sheet, for example, a low temperature sintered ceramic (LTCC) material can be used. The low temperature sintered ceramic material is a ceramic material that can be sintered at a temperature below 1000°C and can be fired simultaneously with Au, Ag, Cu, etc., which have a small specific resistivity. As the low temperature sintered ceramic material, specifically, there can be listed a glass composite low temperature sintered ceramic material made by mixing borosilicate glass with ceramic powders such as alumina, zirconium oxide, magnesium oxide, and forsterite, a crystallized glass low temperature sintered ceramic material using a crystallized glass of ZnO-MgO-Al2O3-SiO2, and a non-glass low temperature sintered ceramic material using BaO-Al2O3-SiO2 ceramic powder, Al2O3-CaO-SiO2-MgO-B2O3 ceramic powder, etc.

[0088] For a specific ceramic green sheet, an internal conductor film 12 and a through-hole conductor 13 are formed using a conductive paste. The internal conductor film 12 is formed, for example, by printing a conductive paste using a screen printing method. The through-hole conductor 13 is formed, for example, by irradiating a ceramic green sheet with a laser or using a mechanical punch to provide a through hole, and then filling the through hole with a conductive paste.

[0089] The conductive paste includes, for example, conductive metal powder, adhesive, and plasticizer. A general material (ceramic powder) for adjusting the shrinkage rate may also be added to the conductive paste. As the conductive metal material included in the conductive paste, for example, a metal having at least one of Ag, Ag-Pt alloy, Ag-Pd alloy, Cu, Ni, Pt, Pd, W, Mo, and Au as the main component may be used. Among these conductive metal materials, Ag, Ag-Pt alloy, Ag-Pd alloy, and Cu have a relatively small specific resistance, and therefore can be more preferably used, especially in a conductor pattern for high frequencies.

[0090] In addition, as a constituent material of the covering layer 30, a mixed raw material powder obtained by adding an appropriate amount of alumina (Al2O3) powder to the above-mentioned ceramic powder for the ceramic layer 11 and mixing them is dispersed in an organic vehicle and kneaded to prepare a ceramic paste for the covering layer.

[0091] The organic vehicle is a material obtained by mixing a binder and a solvent. The types of the binder and the solvent and their mixing ratio are not particularly limited. As the organic vehicle, for example, a material obtained by dissolving acrylic resin, alkyd resin, butyral resin, ethyl cellulose, etc. in alcohols such as terpineol, isopropyl alcohol, butyl carbitol, diethylene glycol butyl ether acetate, etc. can be used. In addition, various dispersants, plasticizers, and activators can also be added as needed.

[0092] When preparing the ceramic paste for the coating layer, the linear expansion coefficient of the coating layer can be adjusted by adjusting the amount of alumina powder added. As a result, when the linear expansion coefficient of the ceramic layer is set to α1, the linear expansion coefficient of the terminal electrode is set to α2, and the linear expansion coefficient of the coating layer is set to α3, it is preferred that the relationship α3<α1<α2 is achieved. For example, it is preferred that the linear expansion coefficient of the ceramic layer α1: 10ppm / ℃, the linear expansion coefficient of the terminal electrode α2: 16ppm / ℃, and the linear expansion coefficient of the coating layer α3: 9ppm / ℃.

[0093] The terminal electrode 20 is formed using the above-mentioned conductive paste on the ceramic green sheets arranged on one main surface after being stacked. The terminal electrode 20 is formed by printing the conductive paste by a method such as screen printing.

[0094] The thickness of the terminal electrode 20 after printing is, for example, not less than 10 μm and not more than 20 μm.

[0095] Then, a ceramic paste for the coating layer is printed by screen printing or the like so as to cover a portion of the peripheral edge of the terminal electrode 20 instead of covering the entire peripheral edge of the terminal electrode 20. For example, a ceramic paste having a Figure 3 The coating layer 30 of the shape of the above-mentioned embodiment can be screen printed.

[0096] The thickness of the cover layer 30 after printing is, for example, not less than 20 μm and not more than 30 μm. In addition, the overlap amount between the cover layer 30 and the terminal electrode 20 is, for example, not less than 30 μm and not more than 200 μm.

[0097] The step of printing the ceramic paste for the covering layer may be performed on the ceramic green sheet as described above, or may be performed after the completion of the lamination step described later and before the start of the firing step.

[0098] A plurality of ceramic green sheets are stacked in a predetermined order and pressure-bonded to prepare the unfired component body 10 .

[0099] The unfired component body 10 is fired to obtain the sintered component body 10. Here, the internal conductor film 12, the through-hole conductor 13, and the terminal electrode 20 are also sintered.

[0100] If necessary, a plating step is performed to form a plated film on the terminal electrode 20 .

[0101] According to the above, we can obtain Figure 1 The ceramic electronic component 1 is shown.

[0102] exist Figure 1 In the ceramic electronic component 1 shown, for example, a surface mount component such as an IC chip or a passive element is mounted on the upper surface of the component body 10 (the main surface opposite to one main surface 10a), and a metal cover is assembled on the component body 10 to cover the surface mount component.

[0103] Furthermore, when the above steps are performed in a state where a mother electronic component of a plurality of ceramic electronic components 1 can be taken out, a step of dividing the mother electronic component to take out individual ceramic electronic components 1 is also performed.

[0104] The ceramic electronic component of the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the present invention, for example, with respect to the structure and manufacturing conditions of the ceramic electronic component.

[0105] In the ceramic electronic component of the present invention, it is preferred that the covering layer does not intersect the terminal electrode perpendicularly in all intersections between the terminal electrode not covered by the covering layer and the covering layer, but it is sufficient that the covering layer does not intersect the terminal electrode perpendicularly in at least one intersection.

[0106] The planar shapes of the front end portions of the coating layers may be the same or different. For example, the coating layer and the terminal electrode may intersect at a certain intersection so that the angle between the coating layer and the terminal electrode is an acute angle, while the coating layer and the terminal electrode may intersect at another intersection so that the angle between the coating layer and the terminal electrode is an obtuse angle.

[0107] Description of reference numerals:

[0108] 1…ceramic electronic component; 10…component body; 10a…one main surface of the component body; 11…ceramic layer; 12…internal conductor film; 13…through-hole conductor; 20…terminal electrode; 30…coating layer; D1, D2…length of the coating layer protruding from the terminal electrode; W1, W2…width of the coating layer covering the terminal electrode; X…intersection between the terminal electrode not covered by the coating layer and the coating layer; θ1, θ2…angle between the coating layer and the terminal electrode.

Claims

1. A ceramic electronic component comprising: a component body, including a ceramic layer; at least one terminal electrode disposed on a main surface of the component body; and The insulating coating layer is arranged along the shape of the peripheral portion of the terminal electrode and across the ceramic layer and the terminal electrode so as to cover a portion of the peripheral portion of the terminal electrode instead of covering the entire peripheral portion of the terminal electrode. When viewed from a main surface of the component body, at an intersection where the peripheral portion of the terminal electrode not covered by the covering layer intersects with the covering layer, the covering layer covering the portion of the terminal electrode and the extension line of the peripheral portion of the terminal electrode not covered by the covering layer intersect at a non-perpendicular angle, When viewed from a main surface of the component body, the coating layer intersects with the terminal electrode at the intersection so that the angle between the coating layer and the terminal electrode is an acute angle. The covering layer has a shape in which the width of the covering layer increases from the inner side of the terminal electrode toward the intersection portion.

2. The ceramic electronic component according to claim 1, wherein The coating layer has a curved shape toward the intersection portion.

3. The ceramic electronic component according to claim 1 or 2, wherein: When viewed in plan from one main surface of the component body, a front end portion of the covering layer protrudes from the terminal electrode and is provided on the surface of the ceramic layer.

4. The ceramic electronic component according to claim 3, wherein: The front end portion of the coating layer has a curved shape.

5. The ceramic electronic component according to claim 1 or 2, wherein: When the linear expansion coefficient of the ceramic layer is α1, the linear expansion coefficient of the terminal electrode is α2, and the linear expansion coefficient of the covering layer is α3, a relationship of α3<α1<α2 holds.

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