Method and system for uniform CT detector thermal distribution

Abstract

The present invention is entitled "Methods and Systems for Uniform CT Detector Thermal Distribution". The present invention provides various methods and systems for imaging detector arrays. In one example, a detector module of the array has a central slit that separates a first tile from a second tile of the detector module. An integrated circuit is positioned along a first side of the first tile and along a first side of the second tile, and a flexible cable of the integrated circuit coupled to the first portion extends through the central slit of the detector module.

Description

Technical Field

[0001] Embodiments of the subject matter disclosed herein relate to non-invasive diagnostic imaging and non-destructive testing, and more particularly to computed tomography (CT) detectors and methods for uniform heat distribution across a CT detector. Background Art

[0002] Non-invasive imaging techniques allow images of the internal structures of a patient or object to be obtained without performing an invasive procedure on the patient or object. Specifically, techniques such as computed tomography (CT) use various physical principles (such as differential transmission of x-rays through a target volume) to acquire image data and construct a tomographic image (e.g., a three-dimensional representation of the interior of the human body or other imaged structure).

[0003] Non-attenuated x-rays that pass through the target volume may be collected by a CT detector. The CT detector may include an array of detector modules configured to emit light when interacting with the x-rays. The emitted light may be converted into electrical signals and used to generate a tomographic image. The detector modules may each be a separate circuit coupled to a common computing device. Digital reconstruction may be performed at the computing device based on signals received from the array of detector modules. Summary of the invention

[0004] In one embodiment, an imaging system includes: at least one detector module having a central slit separating a first tile of the at least one detector module from a second tile; a first integrated circuit positioned along a first side of the first tile, the first side of the first tile facing the central slit and adjacent to the second tile; and a second integrated circuit positioned along a first side of the second tile, the first side of the second portion being an outwardly facing surface of the at least one module and distal to the first portion; and a first cable coupled to the first integrated circuit of the first tile and extending through the central slit of the at least one detector module. In this way, heat is more evenly dispersed across a detector array formed by one or more detector modules.

[0005] It should be understood that the above brief description is provided to introduce in a simplified form selected concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is solely defined by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present invention will be better understood by reading the following description of non-limiting embodiments with reference to the accompanying drawings, in which:

[0007] Figure 1 shows a pictorial view of an imaging system according to one embodiment;

[0008] Figure 2 shows a block schematic diagram of an exemplary imaging system according to one embodiment;

[0009] Figure 3 A first example of a detector module according to an embodiment is shown, which may include Figure 1 In the imaging system;

[0010] Figure 4 Shown by more than one Figure 3 A detector array formed by detector modules;

[0011] Figure 5 shows a second example of a detector module according to an embodiment, the detector module being configured with a removable cover;

[0012] Figure 6 shows a base block of a detector module according to one embodiment;

[0013] Figure 7 shows the detector module implemented in Figure 6 A first view of a base block;

[0014] Figure 8 shows the detector module implemented in Figure 6 A second view of the base block;

[0015] Fig. 9 shows a third example of a detector module formed from two detachable parts according to an embodiment;

[0016] Fig.10 A fourth example of a detector module according to an embodiment is shown, the detector module being adapted to enable coupling of a flexible cable to a single side of a circuit board.

[0017] Figures 3 to 10 are shown approximately to scale, but other relative dimensions may be used if desired. DETAILED DESCRIPTION

[0018] The following description relates to various embodiments of a CT detector. The CT detector may be included in an imaging system, such as a pictorial view and as a Figure 1 and Figure 2An imaging system is shown in the schematic diagram of FIG. The CT detector may include an array of detector modules, each detector module forming an electronic circuit. In some examples, the upper portion of the detector module may include a slit that divides the upper portion into two groups of chiclets or tiles, each tile having a direct conversion detector, such as a photodiode, stacked above each tile. Each group of tiles may include one or more tiles. Figure 3 A first example of a detector module suitable for having a slit is shown in FIG. Figure 4 As shown, more than one detector module may be included in the detector array, wherein the presence of a slot in each detector module allows an application specific integrated circuit (ASIC) to be coupled to the same side of each detector module. Thus, the ASICs may be evenly spaced or evenly distributed throughout the detector array, thereby achieving even distribution of heat throughout the array and reducing exposure of the detector photodiodes to high temperatures. In one example, as Figure 5 As shown, the detector module may be further adapted to have a removable cover that is also a heat sink, which may further help remove heat from the photodiode. As another optional aspect, the base block of the detector module may be configured with a thermal bridge that allows equalization of thermal gradients between tiles of the detector module. Figure 6 An example of a base block is shown in Figure 7 and Figure 8 The incorporation of the base block into the detector module is depicted in FIG. Fig. 9 , another example of a detector module is shown, wherein the detector module has a two-piece structure. The two-piece structure is configured to be detachable to allow access to internal fasteners of the detector module and to access opposite sides of a single circuit board. In other examples, such as Fig.10 As shown, the circuit board may be configured to be coupled to the electrical connector along a single side of the circuit board, thereby allowing for more convenient and efficient manufacturing of the detector module.

[0019] CT imaging can be used to obtain 3-dimensional (3D) x-ray images, which can be generated by combining x-ray measurements taken from different angles. The x-ray measurements produce cross-sectional images of the target imaging area, which can be digitally stacked to form a 3D image. The images produced by CT imaging can provide more detailed information than conventional two-dimensional x-ray imaging.

[0020] The CT scanner may include an electric x-ray source configured to rotate around the patient, thereby emitting an x-ray beam passing through the patient from the x-ray source. The x-ray beam that is not attenuated by the patient is received at a detector positioned opposite the x-ray source. The detector may be formed by an array of detector modules, each module including a plurality of photodiodes configured to convert light into electrical signals. One or more application specific integrated circuits (ASICs) may be coupled to each detector module, and these ASICs enable the electrical signals to be transmitted to the circuit board via a flexible cable. The ASICs may be attached to flexible cables that provide electrical coupling of the photodiodes to the circuit board. The flexible cables are much thinner and more flexible than conventional cables, thereby taking up less space and allowing a streamlined coupling of the flexible cables to the photodiodes (e.g., without the need for bulky electrical connectors) and the ASICs to be arranged below the photodiodes along one side of the detector module frame. Therefore, the gaps between the photodiodes may be minimized.

[0021] The ASIC may generate heat during operation of the CT scanner, causing the detector modules to heat up. The ASIC may be coupled to the outer surface of each detector module, causing localized heating at the outer periphery of the detector modules. Due to the positioning of the ASIC, the interior area of ​​each module may experience little heating. Localized heating may cause hot and cold areas to form throughout the detector array, and such uneven heat distribution may cause high variability in the performance of the CT scanner.

[0022] The inventors herein have recognized such problems. In one example, the above-described problems can be at least partially solved by routing a flexible cable through a slit disposed in a central region of the module. At least a portion of the ASICs of the detector array can be positioned at an interior region of the detector module, thereby allowing for more uniform spacing of these ASICs across the detector array. Similarly, at least a portion of the flexible cable of the detector array can be coupled to the ASICs positioned at the interior region such that the flexible cable extends along the interior region of the detector module. Thus, the temperature of the detector module can be more uniform across the detector array, thereby achieving more consistent and reliable CT imaging results, and the length of the flexible cable can be reduced. In the overview Figure 1 and Figure 2 After the CT imaging system described in the following, reference will be made to Figures 3 to 10 The details of the positioning of the ASIC and the flexible cable are further elaborated.

[0023] Figure 1An exemplary CT imaging system 100 configured for CT imaging is shown. Specifically, the CT imaging system 100 is configured to image a subject 112 (such as a patient, an inanimate object, one or more manufactured parts, industrial parts) and / or a foreign object (such as an implant, a stent, and / or a contrast agent present in the body). In one embodiment, the CT imaging system 100 includes a gantry 102, which in turn may also include at least one x-ray source 104, which is configured to project an x-ray radiation beam 106 (see Figure 2 ) for imaging a subject 112 lying on an examination table 114. Specifically, the x-ray source 104 is configured to project an x-ray radiation beam 106 toward a detector array 108 positioned on an opposite side of the gantry 102. Figure 1 Only a single x-ray source 104 is depicted, but in some embodiments, multiple x-ray sources may be employed to project multiple x-ray radiation beams toward multiple detectors to acquire projection data at different energy levels corresponding to the patient. In some embodiments, the x-ray source 104 may implement dual-energy gem spectral imaging (GSI) by fast peak kilovolt voltage (kVp) switching. In some embodiments, the x-ray detector employed is a photon counting detector capable of distinguishing x-ray photons of different energies. In other embodiments, two sets of x-ray sources and x-ray detectors are used to generate dual-energy projections, one set at low kVp and the other set at high kVp. It should therefore be understood that the methods described herein may be implemented with single energy acquisition techniques as well as dual energy acquisition techniques.

[0024] In certain embodiments, the CT imaging system 100 further includes an image processor unit 110 configured to reconstruct an image of a target volume of the subject 112 using an iterative or analytical image reconstruction method. For example, the image processor unit 110 may use an analytical image reconstruction method such as filtered back projection (FBP) to reconstruct an image of the target volume of the patient. As another example, the image processor unit 110 may use an iterative image reconstruction method (such as advanced statistical iterative reconstruction (ASIR), conjugate gradient (CG), maximum likelihood expectation maximization (MLEM), model-based iterative reconstruction (MBIR), etc.) to reconstruct an image of the target volume of the subject 112. As further described herein, in some examples, in addition to the iterative image reconstruction method, the image processor unit 110 may also use an analytical image reconstruction method (such as FBP).

[0025] In some CT imaging system configurations, an x-ray radiation source projects a cone beam that is collimated to lie in the XYZ plane of a Cartesian coordinate system and is often referred to as an "imaging plane." The x-ray radiation beam passes through an object being imaged, such as a patient or subject. The x-ray radiation beam, after being attenuated by the object, impinges upon an array of x-ray detector elements. The intensity of the attenuated x-ray radiation beam received at the detector array depends on the attenuation of the x-ray radiation beam by the object. Each x-ray detector element of the detector produces a separate electrical signal that is a measure of the attenuation of the x-ray radiation beam at the detector location. Attenuation measurements from all x-ray detector elements are collected individually to produce a transmission profile.

[0026] In some CT imaging systems, a gantry is used to rotate the x-ray source and detector array around the object to be imaged in the imaging plane so that the angle at which the x-ray radiation beam intersects the object is constantly changing. A set of x-ray radiation attenuation measurements (e.g., projection data) from the detector array at one gantry angle is called a "view". A "scan" of an object includes a set of views made at different gantry angles or viewing angles during one rotation of the x-ray source and detector. It is conceivable that the benefits of the methods described herein are derived from medical imaging modalities other than CT, so as used herein, the term "view" is not limited to the use described above with respect to projection data from one gantry angle. The term "view" is used to mean a data acquisition whenever there are multiple data acquisitions from different angles (whether from CT, positron emission tomography (PET) or single photon emission CT (SPECT) acquisitions), and / or any other modality (including modalities yet to be developed) and their combination in fusion embodiments.

[0027] The projection data is processed to reconstruct an image corresponding to a two-dimensional slice acquired through the object, or in some examples where the projection data includes multiple views or scans, an image corresponding to a three-dimensional rendering of the object. A method for reconstructing an image from a set of projection data is known in the art as a filtered back projection technique. Transmission and emission tomography reconstruction techniques also include statistical iterative methods such as maximum likelihood expectation maximization (MLEM) and ordered subset expectation reconstruction techniques and iterative reconstruction techniques. The method converts the attenuation measurements from the scan into an integer called a "CT number" or "Hou's unit", which is used to control the brightness of the corresponding pixel on the display device.

[0028] To reduce the total scan time, a "helical" scan can be performed. To perform a "helical" scan, the patient is moved while data for a specified number of slices is acquired. Such systems produce a single spiral from a cone beam helical scan. The spiral mapped out by the cone beam produces projection data from which an image in each specified slice can be reconstructed.

[0029] As used herein, the phrase "reconstructing an image" is not intended to exclude embodiments of the invention in which data representing an image is generated rather than a visible image. Thus, as used herein, the term "image" broadly refers to both a visible image and data representing a visible image. However, many embodiments generate (or are configured to generate) at least one visible image.

[0030] Figure 2 Shows something like Figure 1 1. An exemplary imaging system 200 of the CT system 100 of FIG. According to aspects of the present disclosure, the imaging system 200 is configured to image a subject 204 (eg, Figure 1In one embodiment, the imaging system 200 includes a detector array 108 (see Figure 1 ). The detector array 108 also includes a plurality of x-ray detector elements 202 that together sense the x-ray radiation beam 106 passing through a subject 204 (such as a patient) to acquire corresponding projection data. Thus, in one embodiment, the detector array 108 is fabricated in a multi-slice configuration that includes multiple rows of units or x-ray detector elements 202. In such a configuration, one or more additional rows of x-ray detector elements 202 are arranged in a parallel configuration for acquiring projection data.

[0031] In some embodiments, the imaging system 200 (such as a CT imaging system or an x-ray imaging system) is configured to traverse different angular positions around the subject 204 to acquire the desired projection data. Therefore, the gantry 102 and the components mounted thereon can be configured to rotate around the rotation center 206 to acquire, for example, projection data at different energy levels. Alternatively, in embodiments where the projection angle relative to the subject 204 varies over time, the mounted components can be configured to move along a general arc rather than along a section of a circle.

[0032] Thus, as the x-ray source 104 and the detector array 108 rotate, the detector array 108 collects data of the attenuated x-ray beam. The data collected by the detector array 108 then undergoes pre-processing and calibration to condition the data to represent the line integral of the attenuation coefficient of the scanned subject 204. The processed data is often referred to as a projection.

[0033] In some examples, individual detectors or x-ray detector elements 202 in detector array 108 may include photon counting detectors that register interactions of individual photons into one or more energy bins. It should be appreciated that the methods described herein may also be implemented using energy integrating detectors.

[0034] The acquired projection data sets may be used for base material decomposition (BMD). During BMD, the measured projections are converted into a set of material density projections. The material density projections may be reconstructed to form a pair or set of material density maps or images for each corresponding base material (such as bone, soft tissue, and / or contrast agent maps). The density maps or images may then be correlated to form a volume rendering of the base material (e.g., bone, soft tissue, and / or contrast agent) in the imaging volume.

[0035] Once reconstructed, the base material image produced by the imaging system 200 shows the internal features of the subject 204 represented by the density of the two base materials. The density image can be displayed to show these features. In traditional methods of diagnosing medical conditions (such as disease states), and more generally diagnosing medical events, a radiologist or physician will consider a hard copy or display of a density image to discern characteristic features of interest. Such features may include lesions, size and shape of specific anatomical structures or organs, as well as other features that should be discernible in the image based on the skills and knowledge of the individual practitioner.

[0036] In one embodiment, the imaging system 200 includes a control mechanism 208 to control the movement of components, such as the rotation of the gantry 102 and the operation of the x-ray source 104. In certain embodiments, the control mechanism 208 also includes an x-ray controller 210 configured to provide power and timing signals to the x-ray source 104. Additionally, the control mechanism 208 includes a gantry motor controller 212 configured to control the rotational speed and / or position of the gantry 102 based on imaging requirements.

[0037] In certain embodiments, the control mechanism 208 also includes a data acquisition system (DAS) 214 that is configured to sample analog data received from the x-ray detector elements 202 and convert the analog data into digital signals for subsequent processing. The DAS 214 can also be configured to selectively aggregate analog data from a subset of the x-ray detector elements 202 into a so-called macro-detector, as further described herein. The data sampled and digitized by the DAS 214 is transmitted to a computer or computing device 216. In one example, the computing device 216 stores the data in a storage device or mass storage device 218. For example, the storage device 218 can include a hard drive, a floppy disk drive, a compact disk-read / write (CD-R / W) drive, a digital versatile disk (DVD) drive, a flash drive, and / or a solid-state storage drive.

[0038] In addition, the computing device 216 provides commands and parameters to one or more of the DAS 214, the x-ray controller 210, and the gantry motor controller 212 to control system operations, such as data acquisition and / or processing. In certain embodiments, the computing device 216 controls system operations based on operator input. The computing device 216 receives operator input, which includes, for example, commands and / or scan parameters, via an operator console 220 operatively coupled to the computing device 216. The operator console 220 may include a keyboard (not shown) or a touch screen to allow an operator to specify commands and / or scan parameters.

[0039] Although Figure 2Only one operator console 220 is shown, but more than one operator console may be coupled to the imaging system 200, e.g., for inputting or outputting system parameters, requesting exams, plotting data, and / or viewing images. In addition, in certain embodiments, the imaging system 200 may be coupled to multiple displays, printers, workstations, and / or the like located locally or remotely, e.g., within an institution or hospital or at an entirely different location, via one or more configurable wired and / or wireless networks (such as the Internet and / or a virtual private network, a wireless telephone network, a wireless local area network, a wired local area network, a wireless wide area network, a wired wide area network, etc.).

[0040] In one embodiment, for example, the imaging system 200 includes or is coupled to a picture archiving and communication system (PACS) 224. In an exemplary embodiment, the PACS 224 is further coupled to a remote system (such as a radiology department information system, a hospital information system) and / or to an internal or external network (not shown) to allow operators at different locations to supply commands and parameters and / or gain access to image data.

[0041] The computing device 216 uses operator-supplied and / or system-defined commands and parameters to operate a table motor controller 226, which in turn can control the table 114, which can be a motorized table. Specifically, the table motor controller 226 can move the table 114 to properly position the subject 204 in the gantry 102 to acquire projection data corresponding to a target volume of the subject 204.

[0042] As previously described, the DAS 214 samples and digitizes the projection data acquired by the x-ray detector elements 202. Subsequently, the image reconstructor 230 uses the sampled and digitized x-ray data to perform high-speed reconstruction. Figure 2 The image reconstructor 230 is shown as a separate entity, but in certain embodiments, the image reconstructor 230 may form part of the computing device 216. Alternatively, the image reconstructor 230 may not be present in the imaging system 200, and instead the computing device 216 may perform one or more functions of the image reconstructor 230. Furthermore, the image reconstructor 230 may be located locally or remotely, and may be operably connected to the imaging system 200 using a wired or wireless network. In particular, one exemplary embodiment may use computing resources in a "cloud" network cluster for the image reconstructor 230.

[0043] In one embodiment, the image reconstructor 230 stores the reconstructed image in the storage device 218. Alternatively, the image reconstructor 230 may transmit the reconstructed image to the computing device 216 to generate usable patient information for diagnosis and evaluation. In certain embodiments, the computing device 216 may transmit the reconstructed image and / or the patient information to a display or display device 232 that is communicatively coupled to the computing device 216 and / or the image reconstructor 230. In some embodiments, the reconstructed image may be transmitted from the computing device 216 or the image reconstructor 230 to the storage device 218 for short-term or long-term storage.

[0044] Various methods and processes further described herein may be stored as executable instructions in a non-transitory memory on a computing device (or controller) in the imaging system 200. In one embodiment, the image reconstructor 230 may include such executable instructions in a non-transitory memory and may apply the methods described herein to reconstruct an image from the scan data. In another embodiment, the computing device 216 may include instructions in a non-transitory memory and may apply the methods described herein, at least in part, to the reconstructed image after receiving the reconstructed image from the image reconstructor 230. In another embodiment, the methods and processes described herein may be distributed on the image reconstructor 230 and the computing device 216.

[0045] In one embodiment, the display 232 allows the operator to assess the imaged anatomy. The display 232 may also allow the operator to select a volume of interest (VOI) and / or request patient information, such as via a graphical user interface (GUI), for subsequent scanning or processing.

[0046] It should be understood that although Figure 1 and Figure 2 An exemplary CT imaging system is shown in FIG. 1 , but the details of the detector module described herein may be applicable to systems other than CT imaging systems. For example, the detector module may be used in a PET CT system, an ultrasound system, and a mobile x-ray imaging system.

[0047] As described above, a detector array may include a plurality of detector elements (e.g., Figure 2 The detector array may be implemented in a variety of imaging systems, such as in Figure 1 and Figure 2The invention can be implemented in a CT imaging system as shown, in a stationary x-ray imaging system, in an ultrasound system, etc. Each of the plurality of detector elements can be incorporated into a detector module formed by a plurality of components, such as one or more direct conversion detectors, one or more ASICs, a circuit board, an electrical connector, a heat sink, etc. When used in a CT imaging system, the direct conversion detector can be a photodiode. Heat can be generated at the ASIC during the transmission of the electrical signal from the photodiode to the circuit board. Thus, hot and cold regions can be formed across the detector module, the hot region being located at the ASIC and the cold region occurring between the ASICs.

[0048] Heat may be more evenly distributed across the detector module by evenly spacing the ASICs. Even spacing of the ASICs may be achieved by adapting the detector module to have a centrally located slot that provides clearance for one of the ASICs and a flexible cable coupled to the ASIC. Configuring the detector module with the slot allows the ASIC to be positioned along an interior region of the detector module, thereby circumventing uneven heating caused by conventional placement of the ASICs along an exterior surface of the detector module. Figure 3 An example of a detector module equipped with a central slit is depicted in .

[0049] Figure 3 302 of a first example of a detector module 300 is shown in FIG. A set of reference axes 301 indicating the y-axis, the x-axis, and the z-axis are provided. The upper portion 302 may be coupled to the lower portion of the detector module 300, such as Figure 5 and Figures 7 to 10 As shown. The upper portion 302 includes a first sub-panel or tile 306 and a second tile 308, each of which is formed of similar components. In some examples, the first tile 306 and the second tile 308 may be identical. In addition, in some examples, the first tile 306 may be one of the tiles in a first group of tiles aligned on the same side of the centrally located slit 324 along the z-axis. Similarly, the second tile 308 may be one of the tiles in a second group of tiles opposite to the first group of tiles, also aligned on the same side of the slit 324 along the z-axis. Each group of tiles may include one or more tiles. As an example, the detector module 300 may include two tiles in each group of tiles, thereby forming a 2×2 tile array.

[0050] The first tile 306 of the detector module 300 has a first photodiode 310, and the second tile 308 has a second photodiode 312. The first photodiode 310 and the second photodiode 312 can be aligned along the x-axis and can form a layer at an upper region of the detector module 300 relative to the y-axis. Although the first photodiode 310 and the second photodiode 312 are shown as being separated from each other by a small gap, the first photodiode 310 and the second photodiode 312 can be arranged flush, for example in coplanar contact, so that the right edge 303 of the first photodiode 310 contacts the left edge 305 of the second photodiode 312. In yet other examples, a single photodiode can be implemented in the detector module 300 that extends completely across both the first side (i.e., the first tile 306 side) and the second side (i.e., the second tile 308 side) of the detector module 300. However, the use of a single photodiode can disrupt the modularity of the multiple tiles of the detector module. As Fig. 9 The scintillator is shown positioned on top of the photodiode, but for simplicity, it is shown from Figures 3 to 5 and Figures 7 and 8 Omit.

[0051] Furthermore, it should be understood that detector module 300 is a non-limiting example. Other examples of detector modules may include variations in the number of photodiodes included in the detector module. For example, more than two photodiodes may be aligned along the x-axis, and various numbers of photodiodes may be arranged with Figure 3 The first photodiode 310 and the second photodiode 312 are parallel and aligned along the z-axis without departing from the scope of the present disclosure.

[0052] The scintillator may convert the x-ray into light when the x-ray photon is irradiated in the downward direction along the y-axis (as indicated by arrow 314). The first photodiode 310 and the second photodiode 312 may receive the light from the scintillator and convert the light into an electric current. The electric current may be collected from the first photodiode 310 by a first application specific integrated circuit (ASIC) 316 and from the second photodiode 312 by a second ASIC 318. The first ASIC 316 is electronically coupled to the first photodiode 310, and the second ASIC 318 is electronically coupled to the second photodiode 312. The first flexible cable 320 may be attached to the first ASIC 316, and the second flexible cable 322 may be attached to the second ASIC 318.

[0053] The first ASIC 316 may be positioned in a first recess 340 disposed in a first side surface 342 of the first tile 306. The first side surface 342 may be a side, such as a first slot-facing surface, that faces a first side (the first tile 306 side) of the slot 324 of the detector module 300. The first side may also have a second side surface 341 opposite the first side surface 342, which may be a first outward-facing surface 341 that is distal to the slot 324 and distal to a second side (the second tile 308 side) of the detector module 300.

[0054] The second ASIC 318 may be similarly positioned in a second recess 344 disposed in a first side surface 346 of the second side (second tile 308 side) of the detector module 300. The first side surface 346 of the second side may be a side surface, such as a second outwardly facing surface, distal to the slot 324 and distal to the first side (first tile 306 side) of the detector module 300. The second side of the detector module 300 also has a second side surface 343, such as a second slot-facing surface 343, facing the slot 324.

[0055] Positioning the first ASIC 316 within the first recess 340 allows the entire first ASIC 316 to be retained and tucked away below the first photodiode 310 relative to the y-axis and relative to incoming x-ray photons. Positioning the second ASIC 318 within the second recess 344 allows the second ASIC 318 to be tucked away below the second photodiode 312 relative to the y-axis and relative to incoming x-ray photons. Thus, the first and second ASICs 316, 318 do not impede positioning the first photodiode 310 directly beside, and in some cases in contact with, the second photodiode 312 so that the photodiodes of the detector array can be arranged to be as closely spaced as possible from one another. Additionally, tucking the ASICs below the photodiodes can allow the ASICs to be at least partially shielded from x-ray exposure.

[0056] The first flexible cable 320 and the second flexible cable 322 may be flexible flat cables having, for example, a plastic film base bonded to a flat solid conductor along one surface of the film base. The thickness of the flexible cable may be extremely thin, for example, as thin as paper, and the combination of the flexible cable directly coupled to the first photodiode 310 and the second photodiode 312 allows a bulky electrical connector to be positioned at a circuit board (e.g., Figure 5 and Figures 7 to 9 ), positioned below the upper portion 302 of the detector module 300 rather than at the photodiode.

[0057] The first flexible cable 320 and the second flexible cable 322 may transmit current to the circuit board, each of which extends along the right side of each of the first half (the half including the first tile 306) and the second half (the half including the second tile 308) of the detector module 300. The first flexible cable 320 and the second flexible cable 322 may extend linearly between the first and second ASICs 316, 318 and the circuit board, e.g., the flexible cables are not wrapped or coiled around the outer surface of the detector module 300. The first flexible cable 320 may be located in a slot 324, wherein the slot 324 is disposed in a central region of the detector module 300 between a first conductive block 330 and a second conductive block 332, which are positioned directly below the first photodiode 310 and the second photodiode 312, respectively. The slot 324 continues between a first base block 334 and a second base block 336, which are positioned directly below the first conductive block 330 and the second conductive block 332, respectively. The slot 324 may extend through at least a portion of a height 326 of the upper portion 302 of the detector module 300 from the bottom of the first photodiode 310 and the second photodiode 312 to a bottom end 328 of the upper portion 302 of the detector module.

[0058] The slit 324 may separate the detector module 300 into a first portion 307 and a second portion 309. The first portion and the second portion may be a first tile 307 and a second tile 309, respectively, wherein the first tile 307 is formed by a first conductive block 330 and a first base block 334, and the second tile 309 is formed by a second conductive block 332 and a second base block 336. The first tile 307 and the second tile 309 are separated by the width of the slit 324, for example, along the x-axis. The slit 324 may extend substantially along the y-axis between the first tile 307 and the second tile 309, wherein in one example, the alignment of the slit 324 may deviate from the y-axis by up to 15 degrees. In another example, the alignment of the slit 324 may deviate from the y-axis by up to 45 degrees.

[0059] The slot 324 may be machined into the detector module 300 during manufacturing to form a space between the first conductive block 330 and the second conductive block 332. The first conductive block 330 and the second conductive block 332 may be formed of a conductive metal, such as aluminum, to allow heat from the first and second ASICs 316, 318 to be conducted to at least one heat sink located below the upper portion 302 of the detector module 300.

[0060] The first conductive block 330 and the second conductive block 332 may have locating pins 304 protruding downward from the bottom surface of the conductive blocks along the y-axis. The locating pins 304 may be inserted into corresponding holes in the top surfaces of the first base block 334 and the second base block 336, which are arranged below the first conductive block 330 and the second base block 336 are arranged below the second conductive block 332. The first base block 334 and the second base block 336 may also be formed of a conductive material, such as a metal, and may be configured as a heat sink.

[0061] By adapting the detector module 300 to have a slot 324 extending through a central region of the detector module 300, the ASICs and flexible cables (e.g., the first and second ASICs 316, 318 and the first and second flexible cables 320, 322) can be consistently positioned at the same side (e.g., the right side) of each half of the detector module 300, as shown in FIG. Figure 3 In conventional systems, the first ASIC 316 and the first flexible cable 320 may be positioned oppositely along the outer surface of the first half (the half containing the first tile 306) of the detector module 300 (e.g., along the left side of the first half), as shown. Figure 3 When positioned along the left side of the first half of the detector module 300 , the ASIC along the outer surface of the detector module 300 may heat the detector module 300 , thereby forming a cold zone at the inner center region of the detector module (as indicated by the dashed circle 338 ).

[0062] However, the slits 324 allow the ASICs to be more evenly spaced across the detector array 400, as shown in FIG. Figure 4 As shown. The detector array 400 includes three detector modules 300, but in other examples, various numbers of detector modules 300 may be included. Each detector module 300 has a first ASIC 316 and a first flexible cable 320 located at the right side of the first tile 307 of the detector module 300, and a second ASIC 318 and a second flexible cable 322 located at the right side of the second tile 309 of the detector module 300. The first flexible cable 320 is fed into a slit 324, which extends linearly along the y-axis. Therefore, at least a portion of the flexible cables of the detector array 400 can each be positioned in the slit 324 of one detector module 300. The slit 324 separates the first tile 307 from the second tile 309 in each detector module 300. Therefore, the distance 402 between each ASIC, for example along the x-axis, is similar.

[0063] The positioning of these ASICs results in the formation of hot zones at the ASICs, as indicated by dashed circles 404. These hot zones are also evenly spaced along the x-axis. Heat generated at the ASICs can be conducted through the half of the detector module 300 coupled to the ASICs, and to the half of the detector module 300 adjacent to the ASICs, such as the half of the detector module 300 immediately to the right of the ASICs. Heat conduction through the detector module 300 is indicated by arrows 406.

[0064] Due to the uniform spacing (e.g., distribution) of these ASICs, these ASICs can similarly heat each detector module. By maintaining each detector module 300 at a uniform temperature, the photodiodes (e.g., first photodiode 310 and second photodiode 312) can experience uniform heating across the detector array. These photodiodes can be temperature sensitive components with thermally dependent properties. By maintaining uniform heating of the detector array, the performance of the photodiodes can be more consistent and reliable.

[0065] Additional aspects and modifications of the detector module may further enhance uniform heat distribution. Figure 5 As shown, the second example of the detector module 500 may include an additional heat sink in the lower portion. The detector module 500 includes an upper portion 502 and a lower portion 504. The upper portion 502 may be similar to Figure 3 The upper portion 302 of the first example of the detector module 300 is shown, including a first tile 506 and a second tile 508, wherein the first tile has a first photodiode 520 disposed above the first tile 506 relative to the y-axis, and the second tile has a second photodiode 528 disposed above the second tile 508. The first tile 506 can be aligned with the second tile 508 along the x-axis, and the first photodiode 520 can be aligned with the second photodiode 528 along the x-axis. The lower portion 504 is located below the upper portion 502 relative to the y-axis, and can include fins 510 disposed along one side of the lower portion 504 and a circuit board 512 disposed at a side of the lower portion 504 opposite the fins 510.

[0066] and Figure 3 and Figure 4 Similar to the slot 324 of the upper portion 502, the slot 514 extends along the y-axis between the first tile 506 and the second tile 508 of the upper portion 502. The first ASIC 516 and the first flex cable 518 are coupled to the first tile 506 at the right side of the first tile 506 along the first conductive block 522 of the first tile 506. The second tile 508 is similarly provided at the right side of the second tile 508 with a second ASIC 524 and a second flex cable 526 positioned along the second conductive block 530.

[0067] The upper end 532 of the lower portion 504 of the detector module 500 relative to the y-axis can be attached to the bottom end 534 of the upper portion 502 of the detector module 500. The fins 510 are arranged in parallel, extending along the x-axis, along one side of the lower portion 504 of the detector module 500 and forming a comb-like structure when viewed along the yx plane. These fins can provide a high surface area structure to maximize cooling of the lower portion 504 via, for example, air cooling. The fins 510 can be divided between a first section 536 and a second section 538. The first section 536 is positioned above the second section 538, and the edges 540 of the fins 510 of the first section 536 can be aligned with the edges 542 of the fins 510 of the second section 538 along the y-axis.

[0068] The first section 536 can be formed of a material that allows the first section 536 to act as a heat sink. For example, the first section 536 can be formed of aluminum, copper, other conductive metals, or conductive filled polymer materials (e.g., filled with silver, gold, nickel, carbon, etc.). In addition, the first section 536 can be a separate structure from the second section 538 and configured to be removable to allow access to an electrical connector coupled to the circuit board 512. The first section 536 can be bolted in place, for example, to secure the first section 536 to the bottom end 534 of the upper portion 502 of the detector module 500 and to the top 544 of the second section 538. Loosening the bolts and removing the first section 536 can allow access to the recess 546 in the lower portion 504 of the detector module 500.

[0069] The recess 546 may be fluidly coupled to the slit 514. In other words, the slit 514 may open to the recess 546 at the bottom end relative to the y-axis so that air in the slit 514 may mix with air in the recess 546. By configuring the slit 514 to be continuous with the recess 546, the first flexible cable 518 may be fed into the slit 514 and into the recess 546. The first flexible cable 518 may extend between the first ASIC 516 and a first electrical connector 548, which is coupled to the first side 550 of the circuit board 512. In addition, the incorporation of the recess 546 allows a single circuit board (e.g., the circuit board 512) configured to receive electrical connectors at both sides of the circuit board to be used for electrical communication with more than one photodiode. Therefore, the number of circuit boards included in the detector array may be reduced.

[0070] The second flexible cable 526 can extend between the second ASIC 524 and the second electrical connector 552. The second electrical connector 552 can be coupled to a second side 554 of the circuit board 512, the second side opposite the first side 550. The first electrical connector 548 and the second electrical connector 552 can be similarly configured to enable the first flexible cable 518 and the second flexible cable 526 to be attached to the circuit board 512 to provide electrical communication between the first and second ASICs 516, 524 and the circuit board 512.

[0071] A slit 514 exists between the first tile 506 and the second tile 508 to allow a first flexible cable 518 to be routed along a side (eg, Figure 5 The slit 514 is positioned along the right side of the first tile 506, which shortens the length of the first flexible cable 518 compared to the case where the first flexible cable 518 is positioned along the opposite side (e.g., the left side) of the first tile 506. The slit 514 provides a more direct route for the transmission of electrical signals from the first photodiode 520 to the circuit board 512, thereby reducing signal loss and enhancing the overall performance of the detector module 500.

[0072] The removable first section 536 provides access to the first side 550 of the circuit board so that electrical connectors, such as the first electrical connector 548, can be coupled, decoupled, and / or replaced as needed. Additionally, by configuring the first section 536 as a heat sink, heat generated by the first and second ASICs 516, 524 can be carried away from the photodiodes, through the first and second conductive blocks 522, 530, through the base block 556, and into the first section 536 of the lower portion 504 of the detector module 500, further helping to maintain the photodiodes at a uniform temperature.

[0073] It should be noted that although the base block 556 is Figures 3 to 5 are shown as two separate units (e.g., Figure 3 The first base block 334 and the second base block 336 of the present invention may be included in the present invention, but the two units may be included in a single integral base block structure so that the two units of the base block are actually part of a single continuous base block, such as Figures 6 to 8 In other words, the first tile 506 and the second tile 508 may be combined at the base block 556. In addition, the lower portion 504 of the detector module 500 may also be combined with the base block 556. Figure 5 Since the detector module is depicted as a cross section, Figures 3 to 5 The two units of the base block and the lower part of the detector module are shown in Figure 5 is shown as a separate structure.

[0074] The detector module may further be adapted to have an optional thermal bridge incorporated in the base block of the detector module to equalize the temperature between tiles of the detector module. Figure 6 6 shows an example of a base block 602 from a perspective view 600, which is depicted without a photodiode, conductive block, or removable heat sink (e.g., Figure 5 The base block may be formed of a metal, such as aluminum, and may include a lower portion of each detector module (e.g., Figure 5 Hereinafter, reference to base block 602 includes the continuous coupling of the lower portion of each detector module to base block 602, such as Figure 6 shown.

[0075] Base block 602 includes a portion of slot 604 similar to Figure 3 and Figure 4 The slit 324 and Figure 5 The thermal bridge 606 may extend across the slit 604 between the opposite sidewalls of the slit 604 along the x-axis. The thermal bridge 606 may be continuous with the sidewalls of the slit 604 and formed of the same material as the base block 602. In some examples, the base block 602 may be manufactured with the thermal bridge 606 (e.g., molded or cast) so that the entire base block 602 including the thermal bridge 606 is a single continuous structure. Therefore, the thermal bridge 606 may be integrated into the base block 602.

[0076] The thermal bridge 606 can allow heat to be conducted across the slit 604 through the base block 602 so that differential heating between the detector modules supported by the base block 602 can be equalized. For example, two photodiodes of a detector module (and two conductive blocks disposed below the photodiodes) can be disposed side by side along the x-axis within a recess 610 of the base block 602. The recess 610 can be disposed in an upper surface of the base block 602, configured as an area where the height 608 of the base block 602 is reduced. Two detector modules can be placed in the recess 610 along the z-axis, each detector module having one photodiode (with a corresponding conductive block). In other examples, more or less than two detector modules can be placed in the recess 610.

[0077] For example, Figure 7 FIG. 7 shows a first cross-section 700 of the base block 602. The first cross-section 700 may be along Figure 6The base block 602 supports a first tile 701 for both a first detector module 702 and a second detector module 704, which are positioned adjacent to each other along the z-axis within a recess 610 of the base block 602. Each detector module has a first photodiode 706, a first conductive block 708 located below the first photodiode 706, and a scintillator 710 layered above the first photodiode 706 of both the first detector module 702 and the second detector module 704. In some examples, the scintillator 710 can be a continuous layer that completely covers all photodiodes of both detector modules.

[0078] The length 712 of the first photodiode 706 defined along the z-axis can be greater than the width 714 of the first photodiode 706 defined along the x-axis. The ASIC and the flexible cable can be attached to the outside of the first detector module 702 and the second detector module 704 along the yz plane (not shown). The first cross-section 700 shows an ASIC 716 and a flexible cable 718, which can be coupled to the first photodiodes 706 of the first detector module 702 and the second detector module 704. The flexible cable 718 can extend through the slot 724 and be coupled to the circuit board 720 at the electrical connector 722. It should be noted that the ASIC 716 is coupled to the opposite location of the detector module and the flexible cable 718 is connected along the detector module to the outside of the detector module. Figures 3 to 5 and Figures 9 and 10 However, the different positioning of ASIC 716 and flexible cable 718 does not change the transmission of electrical signals provided by ASIC 716 and flexible cable 718.

[0079] The first cross-section 700 provides a cross-sectional view of the thermal bridge 606. The thermal bridge 606 can have a rectangular cross-section along the yz plane and can be positioned between the flexible cables 718 below the ASIC 716. The thermal bridge 606 is also Figure 8 602 is shown in a second cross-section 800 of the base block 602. Similar to the first cross-section 700, the second cross-section 800 also includes other components of the detector module and a removable cover, which may be a heat sink, similar to Figure 5 The first section 536 of the lower portion 504 of the detector module 500 .

[0080] The second cross section 800 may be along Figure 6The second photodiode 802 of the second tile 804 of the first detector module 702 can be stacked on top of the second conductive block 806, which is separated from the first conductive block 708 by the slit 724. The thermal bridge 606 is indicated by the dashed circle and is shown as being continuous with the base block 602. In other words, the thermal bridge 606 is part of the base block 602 and is not attached to the base block 602 by any seams or joints.

[0081] The thermal bridge 606 provides a path for heat flow between the first tile 701 and the second tile 804. Therefore, any thermal gradient generated between the tiles can be effectively removed by heat conduction from the hotter side to the cooler side across the thermal bridge 606. The positioning of the thermal bridge 606 in the central region of the slot 724 relative to the z-axis enables heat transfer and equalization between each tile of the detector module and between adjacent detector modules.

[0082] Other optional aspects of the detector module may be incorporated to increase the accessibility, ease of manufacturing, and thermal control of the detector module.As one example, the detector module may be configured with a two-piece frame to enable easy access to fasteners of the detector module. Fig. 9 , a third example of a detector module 900 is shown in FIG. 9 , which may be a two-piece detector module 900. The two-piece detector module 900 may have an upper portion 902 and a lower portion 904 that may be detachable from each other.

[0083] When the upper portion 902 is disassembled and separated from the lower portion 904, fasteners 906 attaching components of each tile 901 of the two-piece detector module 900 may be accessible at the bottom end 908 of the upper portion 902. The fasteners 906 may extend through the base block 910 and the conductive block 912 of each tile 901 along the y-axis, thereby coupling the conductive block 912 to the base block 910. A photodiode 914 may be disposed at the top of each tile 901 above the conductive block 912 relative to the y-axis, coupled to the conductive block 912 by, for example, an adhesive.

[0084] The upper portion 902 may be removably coupled to the lower portion 904 by a fastening device such as a bolt, a clip, a clamp, etc. The two-piece detector module 900 may be configured with a removable cover, similar to Figure 5 504 of the detector module 500. Prior to releasing the upper portion 902 of the two-piece detector module 900 from the lower portion 904, the removable cover of the lower portion 904 can be removed to allow the first electrical connector 916 coupled to one end of the first flexible cable 918 to be removed from the first side 920 of the circuit board 922. Similarly, the second electrical connector 924 coupled to one end of the second flexible cable 926 can be removed from the second side 928 of the circuit board 922.

[0085] The upper portion 902 may then be separated from the lower portion 904 as indicated by arrow 930. Access to the head of the fastener 906 is provided when the upper portion 902 is pulled away from the lower portion 904. By manufacturing the detector module 900 in a two-piece configuration, maintenance and / or replacement of components may be more easily performed.

[0086] In another example, the detector module may be adapted to have a minimum number of thermal interfaces to configure the detector module for efficient manufacturing. Fig.10 A fourth example of a detector module 1000 is shown in . The detector module 1000 comprises a first tile 1002 and a second tile 1004 which are included in an upper portion 1001 of the detector module 1000 and are separated by a slit 1006 which extends along the y-axis and along a centre line 1008 of the detector module 1000 .

[0087] The circuit board 1010 is positioned below the first tile 1002 and the second tile 1004 and along one side of the lower portion 1003 of the detector module 1000. At least a portion of the lower portion 1003 of the detector module 1000 may be offset to one side of the centerline 1008 (e.g., Fig.10 1008) so that the circuit board 1010 is aligned with the center line 1008. A first side 1012 of the circuit board parallel to the center line 1008 can be in coplanar contact with the lower portion 1003 of the detector module 1000. A first flexible cable 1014 coupled to the first ASIC 1016 can be connected to a second side 1020 of the circuit board 1010, which is opposite to the first side 1012, via a first electrical connector 1018.

[0088] Similarly, a second flexible cable 1022 coupled to a second ASIC 1024 may be connected to the second side 1020 of the circuit board 1010 via a second electrical connector 1026. Figures 3 to 5 and Figures 7 to 9 Unlike the detector module example shown, the two flex cables are Fig.10 1008. By moving the circuit board 1010 to align with the centerline 1008, the circuit board 1010 is positioned closer to the first ASIC 1016 than in previous examples of detector modules, and the length of the first flexible cable 1014 is kept relatively short. In addition, coupling the two flexible circuits to the same side of the circuit board 1010 results in one thermal interface, as opposed to two thermal interfaces generated when the flexible circuits are coupled to opposite sides of the circuit board 1010. Fewer thermal interfaces can allow for better thermal management of the detector module. Additionally, manufacturing a detector module in which the circuit board is configured to be coupled to the flexible cable along only one side of the detector module can simplify the manufacturing process, thereby reducing costs and increasing throughput.

[0089] In this way, heat generation in the x-ray detector can be reduced. The detector module of the detector can be configured with a slit extending through the central area of ​​the detector module, thereby allowing the ASIC of the detector module to be evenly spaced throughout the detector. The uniform spacing of the ASIC promotes uniform heat distribution, thereby reducing the formation of hot and cold zones and regulating the heating of the thermal photodiode. The detector module can be further adapted to have various optional elements that increase thermal management, accessibility, and ease of manufacturing, including a removable cover that is also a heat sink, a thermal bridge in the base block of the detector module, a two-piece configuration of the detector module, and adjusting the positioning of the circuit board to modify the coupling of the electrical connector to the circuit board. Therefore, the life of the detector can be extended, while the manufacturing cost can be reduced.

[0090] A technical effect of configuring each detector module of the detector with a central slit is that the detector modules experience more uniform heating across the detector, resulting in more consistent and reliable performance of the detector.

[0091] Figures 1 to 10 An exemplary configuration of the relative positioning of various components is shown. In at least one example, if it is shown as being in direct contact or directly coupled to each other, such elements may be referred to as being in direct contact or directly coupled, respectively. Similarly, in at least one example, elements that are adjacent or adjacent to each other may be adjacent or adjacent to each other, respectively. For example, components that are arranged to be in coplanar contact with each other may be referred to as being in coplanar contact. For another example, in at least one example, elements that are positioned to be spaced apart from each other and have only space therebetween without other components may be described and cited as such. For another example, elements that are shown to be located above / below each other, located on opposite sides of each other, or located between the left / right sides of each other may be described and cited as such relative to each other. In addition, as shown in the figure, in at least one example, the topmost element or point of an element may be referred to as the "top" of a component, and the bottommost element or point of an element may be referred to as the "bottom" of a component. As used herein, top / bottom, upper / lower, upper / lower may be relative to the vertical axis of the figure, and may be used to describe the positioning of elements relative to each other in the figure. Thus, in one example, an element that is shown to be located above other elements is vertically positioned above other elements. For another example, the shapes of the elements shown in the figures may be referred to as having these shapes (e.g., such as being round, straight, planar, curved, rounded, chamfered, angled, etc.). In addition, in at least one example, the elements shown as intersecting each other may be referred to as intersecting elements or intersecting each other. In addition, in one example, an element shown as being located within another element or being shown as being located outside another element may be described as such. In addition, the elements described as being substantially aligned or parallel may be aligned with each other, including a certain amount of deviation from full alignment. For example, an object described as being substantially parallel to an axis may include any tilt between 0 and 15 degrees relative to the axis.

[0092] As used herein, the elements or steps listed in the singular and beginning with the word "one" or "a kind of" should be understood as not excluding a plurality of the elements or steps, unless such exclusion is explicitly stated. In addition, the reference to "an embodiment" of the present invention is not intended to be interpreted as excluding the existence of additional embodiments that also include the cited features. In addition, unless explicitly stated to the contrary, the embodiment of "including", "comprising" or "having" an element or multiple elements with a specific characteristic may include additional such elements without the characteristic. The terms "including" and "in..." are used as the concise language equivalents of the corresponding terms "including" and "wherein". In addition, the terms "first", "second" and "third" etc. are only used as marks, and are not intended to impose numerical requirements or specific positional order on their objects.

[0093] In a first embodiment, an imaging system includes: at least one detector module having a central slit separating a first tile of the at least one detector module from a second tile; a first integrated circuit positioned along a first side of the first tile, the first side of the first tile facing the central slit and adjacent to the second tile; and a second integrated circuit positioned along a first side of the second tile, the first side of the second portion being an outwardly facing surface of the at least one module and distal to the first portion; and a first cable coupled to the first integrated circuit of the first tile and extending through the central slit of the at least one detector module. In the first example of the imaging system, additional detector modules are arranged adjacent to the at least one detector module, each additional detector module having the same configuration as the at least one detector module, and wherein the first integrated circuit and the second integrated circuit coupled to the at least one detector module and the additional detector module are evenly spaced apart. The second example of the imaging system optionally includes the first example, and further includes wherein the first integrated circuit of the first tile is electrically coupled to a first photodiode positioned directly above the first tile, and the first integrated circuit of the second tile is electrically coupled to a second photodiode positioned directly above the second tile, and wherein the first integrated circuit of the first tile is positioned in the central slit. A third example of an imaging system optionally includes one or more of the first and second examples, and further includes wherein a central slit extends between a first conductive block of a first tile and a second conductive block of a second tile, the first and second conductive blocks being arranged directly below a first photodiode and a second photodiode, respectively, and the central slit further extends through a base block positioned directly below the first and second conductive blocks, and wherein a first integrated circuit positioned along a first side of the first tile is positioned within the central slit. A fourth example of an imaging system optionally includes one or more of the first to third examples, and further includes wherein a second integrated circuit positioned along a first side of the second tile extends along a recess in a side surface of the second conductive block, and wherein the first integrated circuit and the second integrated circuit do not protrude beyond outer edges of the first and second photodiodes, respectively, relative to a vertical axis of the detector module along a plane perpendicular to the vertical axis. A fifth example of an imaging system optionally includes one or more of the first to fourth examples, and further includes wherein a first cable extending through the central slit is coupled at one end to a circuit board positioned below the base block, and wherein the first cable extends between the first integrated circuit of the first tile and the circuit board. A sixth example of an imaging system optionally includes one or more of the first to fifth examples, and also includes a second cable extending between a second integrated circuit of a second tile and the circuit board, and wherein the first cable and the second cable are coupled to opposite sides of the circuit board.A seventh example of an imaging system optionally includes one or more of the first to sixth examples, and also includes wherein the first integrated circuit of the first tile and the second integrated circuit of the second tile are positioned only along the first side of the first portion and the first side of the second portion, and not along a second side of the first tile and the second tile of the detector module opposite to the first side.

[0094] In another embodiment, the detector module includes: a first direct conversion detector positioned at an upper region of a first tile; a second direct conversion detector positioned at an upper region of a second tile, the second tile being adjacent to the first tile and separated from the first tile by a slot extending through a central region of the detector module between the first tile and the second tile; a first integrated circuit electrically coupled to the first direct conversion detector, the first integrated circuit positioned in the slot and attached to a first cable extending through the slot; a second integrated circuit electrically coupled to the second direct conversion detector, the second integrated circuit positioned along an outer surface of the second tile and attached to the second cable; and a circuit board disposed below the first tile and the second tile, wherein the first cable and the second cable are connected to the circuit board. In a first example of the detector module, the second integrated circuit and the second cable extend along an outward-facing side of the second tile distal to the first tile, and the first integrated circuit and the first cable extend along a side of the first tile adjacent to the second tile facing the slot, and wherein the first integrated circuit is spaced apart from the second integrated circuit by at least the width of the second tile. The second example of the detector module optionally includes the first example, and further includes wherein the first cable extends between the first integrated circuit and the circuit board along the side of the first tile facing the slit, and the second cable extends between the second integrated circuit and the circuit board along the side facing outward of the second tile, and wherein the first cable and the second cable are flexible cables. The third example of the detector module optionally includes one or more of the first example and the second example, and further includes wherein the first cable and the second cable are coupled to opposite sides of the circuit board. The fourth example of the detector module optionally includes one or more of the first example to the third example, and further includes wherein the circuit board is substantially parallel to the centerline of the detector module, and wherein the first cable and the second cable are coupled to the same side of the circuit board. The fifth example of the detector module optionally includes one or more of the first example to the fourth example, and further includes a lower portion of the detector module positioned below the first tile and the second tile, and wherein the lower portion includes a removable cover configured as a heat sink to absorb heat generated by the first integrated circuit and the second integrated circuit. The sixth example of the detector module optionally includes one or more of the first example to the fifth example, and further includes wherein the removal of the removable cover enables access to the side of the circuit board coupled to the first cable. A seventh example of the detector module optionally includes one or more of the first to sixth examples, and further includes wherein the detector module is formed of two workpieces configured to be detachable. An eighth example of the detector module optionally includes one or more of the first to seventh examples, and further includes a thermal bridge continuous with a base block of the detector module, the thermal bridge being configured to transfer heat across the slit.

[0095] In yet another embodiment, a detector array: comprises a plurality of detector modules, each detector module being configured with a central slit that separates a first group of one or more tiles of the detector module from one or more tiles of a second group of tiles; an integrated circuit coupled to each of the first group of one or more tiles and each of the second group of one or more tiles, the integrated circuit being evenly distributed throughout the detector array; and a cable coupled to the integrated circuit, wherein a portion of the cable is configured to extend through the central slit of the plurality of detector modules between a first portion and a second portion. In the first example of the detector array, half of the integrated circuits of the detector array are positioned within the central slit. The second example of the detector array optionally includes the first example, and also includes wherein the portion of the cable extending through the central slit of the plurality of detector modules extends through the central slit to couple to a circuit board at a first side of the circuit board, and the portion of the cable that does not extend through the central slit extends along an outer surface of the plurality of detector modules to couple to the circuit board at an opposite second side of the circuit board.

[0096] This written description uses examples to disclose the invention, including the best mode, and also to enable a person of ordinary skill in the relevant art to practice the invention, including making and using any devices or systems and performing any included methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to a person of ordinary skill in the art. Such other examples are intended to fall within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with minor differences from the literal language of the claims.

Claims

1. An imaging system, comprising: at least one detector module having a central slit separating a first tile from a second tile of the at least one detector module; a first integrated circuit positioned along a first side of the first tile, the first side of the first tile facing the central slot and adjacent to the second tile; and a second integrated circuit positioned along a first side of the second tile, the first side of the second tile being an outwardly facing surface of the at least one detector module and distal to the first tile; and A first cable is coupled to the first integrated circuit of the first tile and extends through the central slot of the at least one detector module.

2. The imaging system of claim 1 , further comprising additional detector modules arranged adjacent to the at least one detector module, each additional detector module having the same configuration as the at least one detector module, and wherein the first integrated circuit and the second integrated circuit coupled to the at least one detector module and the additional detector modules are evenly spaced apart.

3. An imaging system according to claim 1, wherein the first integrated circuit of the first tile is electrically coupled to a first photodiode positioned directly above the first tile, and the first integrated circuit of the second tile is electrically coupled to a second photodiode positioned directly above the second tile, and wherein the first integrated circuit of the first tile is positioned in the center slit.

4. An imaging system according to claim 3, wherein the central slit extends between a first conductive block of the first tile and a second conductive block of the second tile, the first conductive block and the second conductive block are arranged directly below the first photodiode and the second photodiode, respectively, and the central slit further extends through a base block positioned directly below the first conductive block and the second conductive block, and wherein the first integrated circuit positioned along the first side of the first tile is positioned within the central slit.

5. An imaging system according to claim 4, wherein the second integrated circuit positioned along the first side of the second tile extends along a recess in the side surface of the second conductive block, and wherein the first integrated circuit and the second integrated circuit do not protrude beyond the outer edges of the first photodiode and the second photodiode, respectively, relative to the vertical axis of the detector module along a plane perpendicular to the vertical axis.

6. An imaging system according to claim 4, wherein the first cable extending through the central slot is coupled at one end to a circuit board positioned below the base block, and wherein the first cable extends between the first integrated circuit of the first tile and the circuit board.

7. The imaging system of claim 6, further comprising a second cable extending between the second integrated circuit of the second tile and the circuit board, and wherein the first cable and the second cable are coupled to opposite sides of the circuit board.

8. An imaging system according to claim 1, wherein the first integrated circuit of the first tile and the second integrated circuit of the second tile are positioned only along the first side of the first tile and the first side of the second tile, and are not positioned along a second side of the first tile and the second tile of the detector module opposite to the first side.

9. A detector module, the detector module comprising: a first direct conversion detector positioned at an upper region of the first tile; a second direct conversion detector positioned at an upper region of a second tile adjacent to the first tile and separated from the first tile by a slit extending through a central region of the detector module between the first tile and the second tile; a first integrated circuit electrically coupled to the first direct conversion detector, the first integrated circuit positioned in the slot and attached to a first cable extending through the slot; a second integrated circuit electrically coupled to the second direct conversion detector, the second integrated circuit being positioned along an outer surface of the second tile and attached to a second cable; and A circuit board is disposed below the first tile and the second tile, wherein the first cable and the second cable are connected to the circuit board.

10. A detector module according to claim 9, wherein the second integrated circuit and the second cable extend along an outward-facing side of the second tile distal to the first tile, and the first integrated circuit and the first cable extend along a slot-facing side of the first tile adjacent to the second tile, and wherein the first integrated circuit is separated from the second integrated circuit by at least the width of the second tile.

11. A detector module according to claim 10, wherein the first cable extends along the side of the first tile facing the slot between the first integrated circuit and the circuit board, and the second cable extends along the outward-facing side of the second tile between the second integrated circuit and the circuit board, and wherein the first cable and the second cable are flexible cables. 12 . The detector module of claim 9 , wherein the first cable and the second cable are coupled to opposite sides of the circuit board.

13. The detector module of claim 9, wherein the circuit board is substantially parallel to a centerline of the detector module, and wherein the first cable and the second cable are coupled to a same side of the circuit board.

14. The detector module of claim 9, further comprising a lower portion of the detector module positioned below the first tile and the second tile, and wherein the lower portion comprises a removable cover configured as a heat sink to absorb heat generated by the first integrated circuit and the second integrated circuit.

15. The detector module of claim 14, wherein removal of the removable cover enables access to a side of the circuit board to which the first cable is coupled.

16. The detector module of claim 9, wherein the detector module is formed from two pieces configured to be detachable.

17. The detector module of claim 9, further comprising a thermal bridge continuous with a base block of the detector module, the thermal bridge configured to transfer heat across the slit.

18. A detector array, the detector array comprising: a plurality of detector modules, each detector module being configured with a central slit separating a first group of one or more tiles from a second group of one or more tiles of the detector module; an integrated circuit coupled to each of the first set of one or more tiles and each of the second set of one or more tiles, the integrated circuit being evenly distributed throughout the detector array; and A cable is coupled to the integrated circuit, wherein a portion of the cable is configured to extend through the central slot of the plurality of detector modules between the first group of one or more tiles and the second group of one or more tiles.

19. The detector array of claim 18, wherein half of the integrated circuits of the detector array are positioned within the central slot.

20. A detector array according to claim 18, wherein the portion of the cable extending through the central slot of the multiple detector modules extends through the central slot to couple to the circuit board at a first side of the circuit board, and the portion of the cable not extending through the central slot extends along the outer surface of the multiple detector modules to couple to the circuit board at an opposite second side of the circuit board.

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