Composite electronic component

Abstract

The present invention provides a composite electronic component, and the composite electronic component includes: a capacitor structure including a dielectric layer and first inner electrodes and second inner electrodes alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrodes and the second inner electrodes; a fuse structure including a fuse and a fuse body; a common electrode disposed between one surface of the capacitor structure in a second direction intersecting the first direction and one surface of the fuse structure in the second direction, and connected to the first inner electrode and the fuse; a first external electrode disposed on the other surface of the fuse structure in the second direction and connected to the fuse; and a second external electrode disposed on the other surface of the capacitor structure in the second direction and connected to the second inner electrode.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2019-0174305, filed with the Korean Intellectual Property Office on Dec. 24, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a composite electronic component. Background Art

[0003] A multilayer ceramic capacitor (MLCC), which is a multilayer electronic component, may be a chip capacitor mounted on a printed circuit board of various electronic products such as imaging devices (including liquid crystal displays (LCDs), plasma display panels (PDPs), etc.) and computers, smartphones, mobile phones, etc., for charging or discharging therein. In addition, the MLCC serves functions such as stabilizing a power supply voltage, decoupling, attenuation of high-frequency noise, and DC blocking in an electronic control unit (ECU) of a vehicle.

[0004] Recently, due to the increase in the use of automotive electrical / electronic components caused by autonomous driving of vehicles, introduction of eco-friendly vehicles, etc., the number of MLCCs used in vehicles has increased. Since the usage environment of automotive electrical / electronic components is more severe than that of general electronic components and vehicles are directly related to human life, a relatively high degree of reliability may be required for MLCCs used in automotive electrical / electronic components.

[0005] Specifically, the MLCC has an advantage of being able to ensure a relatively high level of capacitance per unit volume by stacking relatively thin dielectric layers and internal electrodes. However, in order to ensure a relatively high capacitance, since the use of internal space should be maximized, external shocks may have a critical impact on the internal structure. If cracks occur inside the MLCC due to external shocks or the like, internal electrodes having different polarities may be short-circuited, thereby cutting off the power to the load and generating an overcurrent.

[0006] In addition, since most MLCCs may be configured in parallel in a circuit, when a failure occurs in any one of the MLCCs configured in parallel, the circuit may no longer function.

[0007] Therefore, there is a need to develop a composite electronic component that can solve the problems that occur when the MLCC is short-circuited. Summary of the Invention

[0008] One aspect of the present disclosure is to provide a composite electronic component in which a fuse structure and a capacitor structure are combined to protect a circuit from an overcurrent by disconnecting the fuse structure when the MLCC is short-circuited.

[0009] However, the object of the present disclosure is not limited to the above description and will be more easily understood during the process of describing specific embodiments of the present disclosure.

[0010] According to one aspect of the present disclosure, a composite electronic component includes: a capacitor structure including a dielectric layer and first and second inner electrodes alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; a fuse structure including a fuse and a fuse body; a common electrode disposed between one surface of the capacitor structure in a second direction intersecting the first direction and one surface of the fuse structure in the second direction, and connected to the first inner electrode and the fuse; a first outer electrode disposed on the other surface of the fuse structure in the second direction and connected to the fuse; and a second outer electrode disposed on the other surface of the capacitor structure in the second direction and connected to the second inner electrode.

[0011] According to another aspect of the present disclosure, a composite electronic component includes: a capacitor structure including a dielectric layer and first and second inner electrodes alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; a fuse structure including a polymer and a plurality of conductive particles; a common electrode disposed between one surface of the capacitor structure in a second direction intersecting the first direction and one surface of the fuse structure in the second direction, and connected to the first inner electrode and the fuse; a first outer electrode disposed on the other surface of the fuse structure in the second direction and connected to the fuse; and a second outer electrode disposed on the other surface of the capacitor structure in the second direction and connected to the second inner electrode.

[0012] According to another aspect of the present disclosure, a composite electronic component includes: a capacitor structure including a dielectric layer and first and second inner electrodes alternately arranged, and a corresponding one of the dielectric layers is interposed between the first inner electrode and the second inner electrode; a common electrode directly connected to the first inner electrode; a fuse structure including a fuse and a fuse body; a first outer electrode disposed on the fuse structure; and a second outer electrode disposed on the capacitor structure and connected to the second inner electrode. The fuse connects the common electrode and the first outer electrode to each other. Description of the Drawings

[0013] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0014] Figure 1is a perspective view schematically showing a composite electronic component according to an embodiment of the present disclosure.

[0015] Figure 2 is a sectional view taken along Figure 1 line I-I'.

[0016] Figure 3 is a sectional view taken along Figure 1 line II-II′.

[0017] Figure 4 is a sectional view taken along Figure 1 line III-III′.

[0018] Figure 5 is a circuit diagram showing an equivalent circuit of a composite electronic component according to an embodiment of the present disclosure.

[0019] Figure 6 is a sectional view showing a modified example of a composite electronic component according to an embodiment of the present disclosure taken along Figure 1 line I-I'.

[0020] Figure 7 is a sectional view showing a modified example of a composite electronic component according to an embodiment of the present disclosure taken along Figure 1 line III-III'.

[0021] Figure 8 is a perspective view schematically showing another modified example of a composite electronic component according to an embodiment of the present disclosure.

[0022] Figure 9 is a sectional view taken along Figure 8 line IV-IV′.

[0023] Figure 10 is a sectional view taken along Figure 8 line V-V′.

[0024] Figure 11 is a perspective view schematically showing a composite electronic component according to another embodiment of the present disclosure.

[0025] Figure 12 is a sectional view taken along Figure 11 line VI-VI′.

[0026] Figure 13 is a sectional view taken along Figure 11 line VII-VII′.

[0027] Figure 14 is a sectional view showing a state where an overcurrent is applied and a fuse is blown, taken along Figure 11 line VI-VI'. Detailed Embodiments

[0028] Hereinafter, embodiments of the present disclosure will be described with reference to specific examples and the accompanying drawings. However, the embodiments of the present disclosure can be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure can be provided to more completely describe the present disclosure to those of ordinary skill in the art. Therefore, for the sake of clarity of description, the shapes and sizes of the elements in the drawings can be exaggerated, and in the drawings, elements denoted by the same reference numerals can be the same elements.

[0029] In the drawings, for the sake of clarity of the present disclosure, parts irrelevant to the description may be omitted, and in order to clearly show the layers and regions, the thickness may be enlarged. The same reference numerals will be used to indicate the same components. In addition, throughout the specification, unless otherwise clearly stated, when an element is referred to as "comprising" or "including" an element, it means that the element may also include other elements without excluding other elements.

[0030] In the drawings, the X direction may be defined as the second direction, the L direction, or the length direction, the Y direction may be defined as the third direction, the W direction, or the width direction, and the Z direction may be defined as the first direction, the T direction, or the thickness direction.

[0031] Composite electronic component

[0032] Figure 1 is a perspective view schematically showing a composite electronic component according to an embodiment of the present disclosure.

[0033] Figure 2 is along Figure 1 a cross-sectional view taken along line I-I'.

[0034] Figure 3 is along Figure 1 a cross-sectional view taken along line II-II′.

[0035] Figure 4 is along Figure 1 a cross-sectional view taken along line III-III′.

[0036] Figure 5 is a circuit diagram showing an equivalent circuit of a composite electronic component according to an embodiment of the present disclosure.

[0037] Hereinafter, the composite electronic component 1000 according to an embodiment of the present disclosure will be described in detail with reference to Figures 1 to 5

[0038] A composite electronic component 1000 according to an embodiment of the present disclosure includes: a capacitor structure 110 including a dielectric layer 111 and first inner electrodes 121 and second inner electrodes 122 alternately arranged in a first direction (e.g., the Z direction), and the dielectric layer 111 is interposed between the first inner electrodes 121 and the second inner electrodes 122; a fuse structure 210 including a fuse 220 and a fuse body 211; a common electrode 310 disposed between one surface of the capacitor structure in a second direction (e.g., the X direction) intersecting (e.g., perpendicular to) the first direction and one surface of the fuse structure in the second direction, and connected to the first inner electrode 121 and the fuse 220; a first outer electrode 131 disposed on the other surface of the fuse structure 210 in the second direction and connected to the fuse 220; and a second outer electrode 132 disposed on the other surface of the capacitor structure 110 in the second direction and connected to the second inner electrode 122.

[0039] In the capacitor structure 110, the dielectric layer 111 and the inner electrodes 121 or 122 may be alternately stacked.

[0040] Although the specific shape of the capacitor structure 110 is not particularly limited, as shown, the capacitor structure 110 may have a hexahedron shape or the like. Due to the shrinkage of the ceramic powder contained in the capacitor structure 110 during the firing process, the capacitor structure 110 may not have a perfect hexahedron shape with completely straight lines, but may have an overall substantially hexahedron shape.

[0041] The capacitor structure 110 may have: a first surface and a second surface opposite to each other in the thickness direction (Z direction), a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction (X direction), and a fifth surface and a sixth surface connected to the first surface and the second surface, connected to the third surface and the fourth surface, and opposite to each other in the width direction (Y direction).

[0042] The plurality of dielectric layers 111 forming the capacitor structure 110 may be in a fired state, and the boundary between adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify the boundary without using a scanning electron microscope (SEM).

[0043] According to an embodiment of the present disclosure, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. may be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the ceramic powder may include BaTiO3 or (Ba 1-x Ca x)TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3.

[0044] As a material for forming the dielectric layer 111, for the purposes of the present disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. can be added to a powder such as barium titanate (BaTiO3). In this case, as the ceramic additive, various types of additives such as transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc. can be used.

[0045] The capacitor structure 110 may include: a capacitance forming portion A disposed in the capacitor structure 110 and including a first inner electrode 121 and a second inner electrode 122 disposed to face each other with the dielectric layer 111 therebetween to form a capacitance; and an upper protective layer 112 and a lower protective layer 113 formed on the capacitance forming portion A in the vertical direction, respectively.

[0046] The capacitance forming portion A may be a portion that contributes to the formation of the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first inner electrodes 121 and second inner electrodes 122 with the dielectric layer 111 therebetween.

[0047] The upper protective layer 112 and the lower protective layer 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitance forming portion in the vertical direction, respectively, and may be mainly used to prevent damage to the inner electrodes due to physical or chemical stress.

[0048] The upper protective layer 112 and the lower protective layer 113 may not include inner electrodes and may include the same material as the dielectric layer 111.

[0049] The inner electrodes 121 and 122 may be arranged to face each other with the dielectric layer 111 therebetween. The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 that are alternately arranged to face each other with the dielectric layer 111 therebetween.

[0050] The first internal electrode 121 may be exposed from one surface of the capacitor structure 110 in the second direction (Y direction), and the second internal electrode 122 may be exposed from the other surface of the capacitor structure 110 in the second direction (Y direction). The first internal electrode 121 may be exposed from one surface of the capacitor structure 110 in the second direction (Y direction) to connect to the common electrode 310. The common electrode 310 may be connected to the first external electrode 131 through the fuse 220. The second internal electrode 122 may be exposed from the other surface of the capacitor structure 110 in the second direction (Y direction) to connect to the second external electrode 132. The first internal electrode 121 and the second internal electrode 122 may have different polarities.

[0051] The first internal electrode 121 may be arranged to be spaced apart from the other surface of the capacitor structure 110 in the second direction (Y direction), and the second internal electrode 122 may be arranged to be spaced apart from the one surface of the capacitor structure 110 in the second direction (Y direction). Additionally, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 therebetween.

[0052] The capacitor structure 110 may be formed by alternately stacking the dielectric layer 111 printed with the first internal electrode layer 121 and the dielectric layer 111 printed with the second internal electrode layer 122 in the thickness direction (Z direction), and then firing it.

[0053] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent conductivity may be used. For example, the internal electrodes 121 and 122 may be formed by printing a conductive paste containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys for the internal electrodes on a green ceramic sheet.

[0054] As a printing method for the conductive paste for the internal electrodes, a screen printing method, a gravure printing method, etc. may be used, but the present disclosure is not limited thereto.

[0055] The fuse structure 210 may include a fuse 220 and a fuse body 211.

[0056] The fuse body 211 may prevent the first external electrode 131 from directly contacting the common electrode 310 or the internal electrodes 121 and 122 with each other, and may be used to connect the first external electrode 131 and the common electrode 310 through the fuse 220. For example, the first external electrode 131 and the common electrode 310 may be electrically connected to each other through the fuse 220 instead of directly contacting and electrically connecting the first external electrode 131 and the common electrode 310. To this end, the fuse body 211 may have insulating properties.

[0057] The material used to form the fuse body 211 may only need to have insulating properties, without specific limitations. For example, the fuse body 211 may be formed of an insulating material such as ceramics, glass, resin, rubber, etc. Additionally, the fuse body 211 may be formed of the same material as the dielectric layer 111 of the capacitor structure 110, and may be formed by stacking a plurality of ceramic green sheets.

[0058] Although the specific shape of the fuse body 211 is not particularly limited, as shown, the fuse body 211 may have a hexahedral shape or the like. The fuse body 211 may not have the shape of a perfect hexahedron with completely straight lines, but may have an overall substantially hexahedral shape.

[0059] In addition, the thickness and width of the fuse body 211 may respectively have values equal to or approximate to the thickness and width of the capacitor structure 110. The length of the fuse body 211 does not need to be specifically limited, and may be determined in consideration of the length (Fl) of the fuse 220.

[0060] The fuse 220 can be used to block the flow of current because when an overcurrent is applied, the fuse 220 melts and is cut off due to the heat generated by the overcurrent.

[0061] The first internal electrode 121 and the second internal electrode 122 may be short-circuited due to internal defects of the MLCC, external shock, external surge, etc. In the case of an MLCC short circuit, the function of the MLCC may be damaged. When using the voltage of the power supply line, due to the short circuit of the (+) line and the (-) line, the voltage may become 0V, which may cause a failure in the circuit including the MLCC. Additionally, since most MLCCs are arranged in parallel in the circuit, when a failure occurs in any one of the MLCCs arranged in parallel, the circuit may no longer function.

[0062] Referring to Figure 5 , Figure 5 is a circuit diagram showing an equivalent circuit of a composite electronic component according to an embodiment of the present disclosure. The capacitor structure 110 and the fuse structure 210 may be connected in series. Additionally, when the internal electrodes 121 and 122 are short-circuited to each other due to internal defects of the capacitor structure 110, external shock, external surge, etc., an overcurrent will flow between the first external electrode 131 and the second external electrode 132. Due to the heat generated by the overcurrent, the fuse 220 may melt and be cut off, and the current flow between the first external electrode 131 and the second external electrode 132 may be blocked. Therefore, damage to the entire circuit to which the composite electronic component 1000 is connected can be prevented.

[0063] The formation of the fuse 220 is not particularly limited and may be determined in consideration of the tolerance in current of a circuit using a composite electronic component. For example, the fuse 220 may include one or more of silver (Ag), copper (Cu), tin (Sn), zinc (Zn), tungsten (W), and alloys thereof.

[0064] According to an embodiment of the present disclosure, the fuse 220 may have a wire shape. Referring to Figure 2 and Figure 4 , the length (Fl), width (Fw), and thickness (Ft) of the fuse 220 may be determined in consideration of the tolerance in current of a circuit using a composite electronic component. In addition, the cross-section of the wire may have various shapes, such as circular, elliptical, triangular, quadrilateral, etc.

[0065] The fuse 220 may be disposed in the fuse body 211 and may be exposed from one surface and the other surface of the fuse body 211 in the second direction (X direction). The fuse 220 may be exposed from one surface of the fuse body 211 in the second direction (X direction) to be connected to the common electrode 310, and may be exposed from the other surface of the fuse body 211 in the second direction (X direction) to be connected to the first external electrode 131.

[0066] Figure 6 is a cross-sectional view showing a modified example of a composite electronic component according to an embodiment of the present disclosure taken along the line I-I' of Figure 1 . Figure 7 is a cross-sectional view showing a modified example of a composite electronic component according to an embodiment of the present disclosure taken along the line III-III' of Figure 1 .

[0067] Referring to Figure 6 and Figure 7 , the fuse 220 may be provided as a plurality of fuses 221, 222, 223, and 224. Although the case where the fuse 220 is configured as four fuses is shown, the present disclosure is not limited thereto, and the number of fuses 220 may be determined in consideration of the tolerance in current of a circuit using a composite electronic component.

[0068] Figure 8 is a perspective view schematically showing another modified example of a composite electronic component 1000a according to an embodiment of the present disclosure. Figure 9 is a cross-sectional view taken along the line IV-IV′ of Figure 8 . Figure 10 is a cross-sectional view taken along the line V-V′ of Figure 8 .

[0069] In another modified example of the composite electronic component according to an embodiment of the present disclosure, the fuse 220a may be provided with a metal thin film covering the outer surface of the fuse body 211a. The thickness (Ft') of the metal thin film is not particularly limited, and the thickness (Ft') of the metal thin film may be determined in consideration of the withstand current of the circuit using the composite electronic component.

[0070] In this case, the fuse 220a may be a metal glaze. In this case, the metal glaze may refer to a metal thin film prepared by mixing a metal or a metal oxide with glass, printing the mixture on the outer surface of the fuse body 211a, and firing the printed mixture at a high temperature. The metal in the metal or the metal oxide may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0071] The common electrode 310 may be provided between one surface of the capacitor structure 110 in the second direction and one surface of the fuse structure 210a in the second direction, and may be used to bond the capacitor structure 110 and the fuse structure 210a. In addition, the common electrode 310 may be used to connect the first internal electrode 121 of the capacitor structure 110 and the fuse 220a of the fuse structure 210a. Therefore, the capacitor structure 110 and the fuse structure 210a may be connected in series with each other.

[0072] The common electrode 310 may be formed of a conductive material (such as a metal), and the specific material may be determined in consideration of electrical characteristics, structural stability, etc. For example, the common electrode 310 may be formed of one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0073] In this case, the common electrode 310 may include glass, resin, etc. to improve the bonding force between the capacitor structure 110 and the fuse body 211a. Specifically, when the fuse body 211a is formed of a dielectric, glass may be included in the common electrode to further improve the bonding force between the capacitor structure 110 and the fuse body 211a. In addition, in the case where the fuse body 211a is formed of a polymer, when the common electrode includes glass and resin, the bonding force between the capacitor structure 110 and the fuse body 211a may be further improved.

[0074] Therefore, the common electrode 310 may include a conductive metal, and may include one or more of glass and resin.

[0075] In addition, although the common electrode is shown as being exposed to the outside in the embodiments of the present disclosure, the present disclosure is not limited thereto. Further, considering the use environment, the common electrode may be arranged not to be exposed to the outside, or the exposed portion of the common electrode may be covered by a covering portion (not shown) to prevent the common electrode from being exposed to the outside.

[0076] Referring to Figure 2 , the first external electrode 131 may be disposed on the other surface of the fuse structure 210 in the second direction and may be connected to the fuse 220, and the second external electrode 132 may be disposed on the other surface of the capacitor structure in the second direction and may be connected to the second internal electrode 122. In a manner similar to that shown in Figure 2 , the first external electrode 131 may be electrically connected to the first internal electrode 121 through the fuse 220 and the common electrode 310.

[0077] The external electrodes 131 and 132 may be formed of any material such as metal as long as they have conductivity. The specific material may be determined in consideration of electrical characteristics, structural stability, etc., and the external electrodes 131 and 132 may have a multilayer structure.

[0078] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a and plating layers 131b and 132b respectively formed on the electrode layers 131a and 132a.

[0079] As more specific examples of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be sintered electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0080] In addition, the electrode layers 131a and 132a may have a form in which the sintered electrode and the resin-based electrode are sequentially formed on the capacitor structure 110 or the fuse structure 210. In addition, the electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal onto the capacitor structure 110 or the fuse structure 210, or may be formed by transferring a sheet including a conductive metal onto the sintered electrode. In addition, the first electrode layer 131a and the second electrode layer 132a may be formed using an atomic layer deposition (ALD) process, a molecular layer deposition (MLD) process, a chemical vapor deposition (CVD) process, a sputtering process, etc.

[0081] There is no specific limitation on the conductive metal for the electrode layers 131a and 132a as long as it is a material that can be electrically connected to the internal electrode to form a capacitance. For example, it may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0082] As more specific examples of the coatings 131b and 132b, the coatings 131b and 132b may be nickel (Ni) coatings or tin (Sn) coatings, may have a form in which nickel (Ni) coatings and tin (Sn) coatings are sequentially formed on the electrode layers 131a and 132a, and may have a form in which tin (Sn) coatings, nickel (Ni) coatings, and tin (Sn) coatings are sequentially formed. Additionally, the coatings 131b and 132b may include multiple nickel (Ni) coatings and / or multiple tin (Sn) coatings.

[0083] Figure 11 is a perspective view schematically showing a composite electronic component according to another embodiment of the present disclosure.

[0084] Figure 12 is along Figure 11 a sectional view taken along line VI-VI'.

[0085] Figure 13 is along Figure 11 a sectional view taken along line VII-VII'.

[0086] Figure 14 is a sectional view showing a state in which an overcurrent is applied and the fuse is disconnected along line VI-VI' shown in Figure 11

[0087] Hereinafter, the composite electronic component 1000b according to another embodiment of the present disclosure will be described in detail with reference to Figures 11 to 14 However, in order to avoid redundant description, the description common to the composite electronic component 1000 according to the embodiment of the present disclosure may be omitted.

[0088] The composite electronic component 1000b according to another embodiment includes: a capacitor structure 110 including a dielectric layer 111 and first inner electrodes 121 and second inner electrodes 122 alternately arranged in a first direction (e.g., the Z direction), with the dielectric layer 111 interposed between the first inner electrodes 121 and the second inner electrodes 122; a fuse structure 210b including a fuse 220b and a polymer 211b, the fuse 220b including a plurality of conductive particles; a common electrode 310 disposed between one surface of the capacitor structure in a second direction (e.g., the X direction) intersecting (e.g., perpendicular to) the first direction and one surface of the fuse structure 210b in the second direction, and connected to the first inner electrode 121 and the fuse 220b; a first outer electrode 131 disposed on the other surface of the fuse structure 210b in the second direction and connected to the fuse 220b; and a second outer electrode 132 disposed on the other surface of the capacitor structure 110 in the second direction and connected to the second inner electrode 122.

[0089] ​The fuse structure 210b may include a fuse 220b and a polymer 211b to be used as a resettable fuse. Generally, a fuse cannot be reused because when an overcurrent flows and the fuse is cut to an open state, the electricity of the fuse cannot flow again. The fuse structure 210b according to another embodiment of the present disclosure can be used as a resettable fuse. The fuse structure 210b can be disconnected when an overcurrent occurs and can short-circuit again when the overcurrent is released. Therefore, the fuse structure 210b according to another embodiment of the present disclosure can be reused and can prevent abnormal operation of the composite electronic component to improve the stability of the composite electronic component.

[0090] A resettable fuse is generally referred to as a polymer positive coefficient temperature (PPCT) element. A PPTC element can be formed using a semi-crystalline polymer containing conductive fillers. When the temperature rises due to an overcurrent (generation of Joule heat) under abnormal conditions, the PPTC element can thermally expand in the molten region of the polymer to increase the space between the particles of the conductive fillers in the polymer, thereby changing the crystalline structure to an amorphous structure. The resistance in the conductor can increase rapidly to interrupt the flow of current and limit the overcurrent. When the overcurrent is released and the temperature drops, it can have the characteristic of returning to the normal state again.

[0091] Referring to Figure 12 , in normal operation where no overcurrent flows, a plurality of conductive particles can be arranged as connectors that are continuously connected to each other, so that the first outer electrode 131 and the first inner electrode 121 can be electrically connected through the fuse 220b.

[0092] Referring to Figure 14 , when an overcurrent flows between the first outer electrode 131 and the second outer electrode 132 due to an abnormal situation (such as a state where a short circuit occurs between the inner electrodes 121 and 122), the heat generated by the overcurrent can cause the polymer 211b' to thermally expand. Therefore, the connection between the plurality of conductive particles can be cut off, and the fuse 220b' can be disconnected.

[0093] Subsequently, when the factor causing the overcurrent is eliminated, the temperature of the polymer can drop again and the polymer can contract. In a manner similar to that shown in Figure 12 , a plurality of conductive particles can be arranged again as connectors that are continuously connected to each other, so as to electrically connect the first outer electrode 131 and the first inner electrode 121 through the fuse 220b.

[0094] The fuse 220b can be composed of a plurality of conductive particles.

[0095] At least a part of a plurality of conductive particles may be provided as connectors that are continuously connected to each other, and the connectors may be exposed from one surface and another surface of the fuse structure 210b to electrically connect the first external electrode 131 and the common electrode 310 through the fuse 220b.

[0096] In this case, the conductive particles may include carbon particles.

[0097] A polymer 211b may be used as long as it is a polymer that can be expanded by heat generated by overcurrent, and it may be determined in consideration of the withstand current of the circuit of the composite electronic component. For example, the polymer 211b may be one or more of polyethylene, polypropylene, and linear low-density polyethylene.

[0098] One effect of the present disclosure is that since the composite electronic component includes a capacitor structure and a fuse structure, when a short circuit occurs between the internal electrodes of the capacitor structure, the fuse of the fuse structure can be disconnected due to the overcurrent generated by the short circuit. Therefore, damage to the circuit to which the composite electronic component is connected can be prevented.

[0099] One effect of the present disclosure is that in a composite electronic component including a capacitor structure and a fuse structure, since the fuse structure has a resettable fuse function of disconnecting when an overcurrent appears and short-circuiting again when the overcurrent is released, the stability of the composite electronic component can be improved.

[0100] However, the various advantages and effects of the present disclosure are not limited to the above description, and will be more easily understood during the process of describing specific embodiments of the present disclosure.

[0101] Although the embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A composite electronic component, comprising: A capacitor structure, comprising a dielectric layer and first and second internal electrodes alternately arranged in a first direction, and the dielectric layer is interposed between the first internal electrode and the second internal electrode; A fuse structure, comprising a fuse and a fuse body; A common electrode, disposed between one surface of the capacitor structure in a second direction intersecting the first direction and one surface of the fuse structure in the second direction, and connected to the first internal electrode and the fuse; A first external electrode, disposed on the other surface of the fuse structure in the second direction, and connected to the fuse, and extending to a surface of the fuse structure adjacent to the other surface of the fuse structure; And A second external electrode, disposed on the other surface of the capacitor structure in the second direction, and connected to the second internal electrode, and extending to a surface of the capacitor structure adjacent to the other surface of the capacitor structure, wherein the fuse is disposed inside the fuse body and is exposed from one surface and the other surface of the fuse structure in the second direction to be respectively connected to the common electrode and the first external electrode.

2. The composite electronic component according to claim 1, wherein, The first internal electrode is exposed from the one surface of the capacitor structure in the second direction, and the second internal electrode is exposed from the other surface of the capacitor structure in the second direction.

3. The composite electronic component according to claim 1, wherein, The fuse is in contact with the common electrode and the first external electrode.

4. The composite electronic component according to any one of claims 1-3, wherein, The fuse has a wire shape.

5. The composite electronic component according to claim 4, wherein, The fuse is provided as a plurality of fuses.

6. The composite electronic component according to any one of claims 1-3, wherein, The fuse body comprises a polymer, and the fuse is a resettable fuse and comprises a plurality of conductive particles dispersed in the polymer.

7. The composite electronic component according to claim 1, wherein, The common electrode comprises one or more of glass and resin and a conductive metal.

8. The composite electronic component according to claim 1, wherein, The second direction is perpendicular to the first direction.

9. A composite electronic component, comprising: A capacitor structure, comprising a dielectric layer and first and second internal electrodes alternately arranged in a first direction, and the dielectric layer is interposed between the first internal electrode and the second internal electrode; A fuse structure, comprising a polymer and a resettable fuse, the fuse comprising a plurality of conductive particles dispersed in the polymer; A common electrode, disposed between one surface of the capacitor structure in a second direction intersecting the first direction and one surface of the fuse structure in the second direction, and connected to the first internal electrode and the fuse; A first external electrode, disposed on the other surface of the fuse structure in the second direction, and connected to the fuse, and extending to a surface of the fuse structure adjacent to the other surface of the fuse structure; And A second external electrode, disposed on the other surface of the capacitor structure in the second direction, and connected to the second internal electrode, and extending to a surface of the capacitor structure adjacent to the other surface of the capacitor structure.

10. The composite electronic component according to claim 9, wherein, The fuse is exposed from one surface and the other surface of the fuse structure in the second direction to contact the common electrode and the first external electrode respectively.

11. The composite electronic component according to claim 9, wherein, The first internal electrode is exposed from the one surface of the capacitor structure in the second direction, and the second internal electrode is exposed from the other surface of the capacitor structure in the second direction.

12. The composite electronic component according to claim 9, wherein, At least a part of the plurality of conductive particles are arranged as connectors that are continuously connected to each other. Wherein, the connectors are exposed from the one surface and the other surface of the fuse structure in the second direction.

13. The composite electronic component according to any one of claims 9-12, wherein, The conductive particles include carbon particles.

14. The composite electronic component according to claim 9, wherein, The common electrode includes one or more of glass and resin and a conductive metal.

15. The composite electronic component according to claim 9, wherein, The second direction is perpendicular to the first direction.

16. A composite electronic component, comprising: A capacitor structure, including a dielectric layer and a first internal electrode and a second internal electrode alternately arranged in a first direction, and a corresponding one of the dielectric layers is interposed between the first internal electrode and the second internal electrode; A common electrode, one surface of which covers one surface of the capacitor structure in a second direction intersecting the first direction and directly contacts the first internal electrode exposed through the one surface of the capacitor structure; A fuse structure, including a fuse and a fuse body, one surface of the fuse structure in the second direction directly contacts the other surface of the common electrode, and the common electrode integrates the fuse structure and the capacitor structure into one body; A first external electrode, provided on the other surface of the fuse structure in the second direction and extending to the surface of the fuse structure adjacent to the other surface of the fuse structure; And A second external electrode, provided on the other surface of the capacitor structure in the second direction and extending to the surface of the capacitor structure adjacent to the other surface of the capacitor structure and directly contacts the second internal electrode exposed through the other surface of the capacitor structure. Wherein, the fuse directly contacts the common electrode and the first external electrode.

17. The composite electronic component according to claim 16, wherein, The fuse has a wire shape embedded in the fuse body.

18. The composite electronic component according to claim 16, wherein, The fuse covers the outer surface of the fuse body.

19. The composite electronic component according to claim 16, wherein, The fuse body includes a polymer, and the fuse is a resettable fuse and includes a plurality of conductive particles dispersed in the polymer.

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