Submicron imprinting equipment based on screen printing and control method thereof

Abstract

The present application discloses a submicron imprinting device based on screen printing and a control method thereof, wherein the imprinting device comprises a screen printing machine body, an imprinting platform, a heatable imprinting head, a screen frame and a printing plate; the imprinting platform is arranged on the screen printing machine body and is used to carry a substrate to be imprinted; the heatable imprinting head is arranged on the screen printing machine body; the screen frame is arranged on the screen printing machine body and is located above the imprinting platform; the printing plate is arranged on the screen frame and comprises a submicron pattern. When the device is working, the temperature of the heatable imprinting head is controlled within a preset temperature range, and the control system of the screen printing machine body controls the heatable imprinting head to apply pressure to the printing plate and move it to achieve scraping, so as to imprint the submicron pattern on the printing plate onto the imprinting glue on the substrate, thereby solving the problem of small imprinting area and low efficiency in nanoimprinting technology and achieving large-area imprinting with submicron precision.

Description

Technical Field

[0001] The present application relates to the field of printing technology, and in particular to a submicron imprinting device based on screen printing and a control method thereof. Background Art

[0002] Nanoimprint technology uses mechanical means to transfer patterns. It has the advantages of high resolution, easy mass production, low cost and simple process. It is an important manufacturing technology for nano-sized electronic devices and has a wide range of applications in silicon field effect transistors, nanoelectromechanical systems, microwave integrated circuits, nanoelectronic devices, nanointegrated circuits, quantum memory devices, photonic crystal arrays and OLED flat panel display arrays. Although nanoimprint technology has high precision, it has a small imprinting area and low efficiency. Summary of the invention

[0003] The present application provides a submicron imprinting device based on screen printing and a control method thereof, which fills the gap in the current large-area preparation technology of submicron-scale micro-nanostructures. The present application combines the existing nanoimprinting technology, but at the same time solves the problems of small imprinting area and low efficiency of nanoimprinting technology, realizes large-area imprinting with submicron-level precision, and improves user experience.

[0004] In a first aspect, an embodiment of the present application provides a submicron imprinting device based on screen printing, comprising a screen printing machine body, an imprinting platform, a heatable imprinting head, a screen frame and a printing plate; the imprinting platform is arranged on the screen printing machine body for carrying a substrate to be imprinted; the heatable imprinting head is arranged on the screen printing machine body; the screen frame is arranged on the screen printing machine body and is located above the imprinting platform; the printing plate is arranged on the screen frame and comprises a submicron pattern; wherein the heatable imprinting head comprises an imprinting component, a heating component, a temperature sensor The device comprises a temperature sensor and a controller, wherein the controller is connected with the heating component and is used to control the heating component to heat the stamping component, the stamping component is used to contact the printing plate, and the temperature sensor is connected with the controller and is used to measure the temperature of the heatable stamping head; when the device is working, the temperature of the heatable stamping head is controlled within a preset temperature range, and the control system of the screen printing machine body controls the heatable stamping head to apply pressure to the printing plate and move to achieve scraping, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate.

[0005] In an optional embodiment, the stamping device further includes: a light-emitting lamp; a driving component, wherein the light-emitting lamp is mounted on the driving component and is located under a supporting plate of the stamping platform, the supporting plate is a light-transmitting plate, and the driving component is used to drive the light-emitting lamp to move relative to the stamping platform; when the device is working, the control system of the screen printing machine body controls the heated stamping head to apply pressure to the printing plate and move to achieve scraping, and at the same time controls the driving component to drive the light-emitting lamp to move, so that the light emitted by the light-emitting lamp can pass through the supporting plate and irradiate the substrate, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate.

[0006] In an optional embodiment, when the device is working, the light-emitting lamp and the heatable stamping head both move in the same direction; wherein the movement speed of the light-emitting lamp is the same as the movement speed of the heatable stamping head.

[0007] In an optional embodiment, the stamping component includes: a contact portion, wherein the contact portion is used to contact the printing plate, wherein the contact portion is arranged at a preset inclination angle.

[0008] In an optional embodiment, the contact portion is a linear contact portion, and the contact between the stamping component and the printing plate is linear contact.

[0009] In an optional embodiment, the light-emitting lamp tube includes: a light-emitting portion, which is a linear light-emitting portion and matches the shape of the contact portion of the stamping component.

[0010] In an optional embodiment, the screen printing machine body includes: a limiting groove, and the screen frame is detachably connected to the screen printing machine body through the limiting groove.

[0011] In an optional embodiment, the heated stamping head further comprises: a heat insulating member, which is arranged at an end of the stamping component away from the stamping platform.

[0012] In a second aspect, the present application further provides a control method, which is applied to the above-mentioned imprinting device, and the control method includes:

[0013] Controlling the heating component to heat the stamping component by a controller so that the temperature of the heatable stamping head is within a preset temperature range;

[0014] Controlling the heated stamping head to apply pressure to the printing plate and controlling the movement of the heated stamping head through the control system of the screen printer body, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate;

[0015] In an optional embodiment, the control method further includes: obtaining an imprinting mode selected by a user, the imprinting mode including a thermal curing mode and a light curing mode; wherein the thermal curing mode is: controlling the temperature of the heatable imprinting head within a preset temperature range, and controlling the heatable imprinting head through the control system of the screen printing machine body to apply pressure to the printing plate and move to achieve scraping, so as to imprint the submicron pattern on the printing plate onto the imprinting glue on the substrate; the light curing mode is: controlling the heatable imprinting head through the control system of the screen printing machine body to apply pressure to the printing plate and move to achieve scraping, and at the same time controlling the driving component to drive the light-emitting lamp to move, so that the light emitted by the light-emitting lamp is irradiated on the substrate through the carrier plate, so as to imprint the submicron pattern on the printing plate onto the imprinting glue on the substrate.

[0016] The present application provides a submicron imprinting device based on screen printing and a control method thereof, wherein the imprinting device comprises a screen printing machine body, an imprinting platform, a heatable imprinting head, a screen frame and a printing plate; the imprinting platform is arranged on the screen printing machine body and is used to carry a substrate to be imprinted; the heatable imprinting head is arranged on the screen printing machine body; the screen frame is arranged on the screen printing machine body and is located above the imprinting platform; the printing plate is arranged on the screen frame and comprises a submicron pattern; wherein the heatable imprinting head comprises an imprinting component, a heating component, a temperature A temperature sensor and a controller are provided, wherein the controller is connected to the heating component and is used to control the heating component to heat the stamping component, and the stamping component is used to contact the printing plate. The temperature sensor is connected to the controller and is used to measure the temperature of the heatable stamping head. When the device is working, the temperature of the heatable stamping head is controlled within a preset temperature range, and the control system of the screen printer body controls the heatable stamping head to apply pressure to the printing plate and move to achieve scraping, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate. This can make up for the defect that nanotechnology cannot print on a large area, and can achieve large-area stamping at the submicron level, improve stamping efficiency and convenience, and improve user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the structure of a printing plate in a nanoimprint technology provided in an embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the working principle of a nanoimprint technology provided in an embodiment of the present application;

[0020] Figure 3 It is a structural schematic diagram of a submicron imprinting device based on screen printing provided in an embodiment of the present application;

[0021] Figure 4 It is a structural schematic diagram of a screen frame provided in an embodiment of the present application;

[0022] Figure 5 It is a structural schematic diagram of a printing plate provided in an embodiment of the present application;

[0023] Figure 6 It is a structural schematic diagram of a screen frame including a printing plate with a submicron pattern provided in an embodiment of the present application;

[0024] Figure 7 is a schematic block diagram of a heatable stamping head provided in an embodiment of the present application;

[0025] Figure 8 This is a schematic diagram of the working principle of a submicron imprinting device based on screen printing provided in an embodiment of the present application;

[0026] Fig. 9 is a schematic structural diagram of another heatable stamping head provided in an embodiment of the present application;

[0027] Fig.10 is a schematic structural diagram of another heatable stamping head provided in an embodiment of the present application;

[0028] Fig.11 It is a schematic diagram of the structure of a heated stamping head and a screen printing machine body provided in an embodiment of the present application;

[0029] Fig.12 It is a structural schematic diagram of an imprinting device with a light-emitting lamp tube provided in an embodiment of the present application;

[0030] Fig.13 It is a structural schematic diagram of a light-emitting lamp provided in an embodiment of the present application;

[0031] Fig.14 It is a structural schematic diagram of another imprinting device with a light-emitting lamp provided in an embodiment of the present application;

[0032] Fig.15 It is a schematic flow chart of the steps of a control method of a sub-micron imprinting device based on screen printing provided in an embodiment of the present application.

[0033] Description of main components and symbols:

[0034] 100. Submicron imprinting equipment based on screen printing;

[0035] 10. Screen printing machine body; 11. Sliding part; 12. Limiting groove;

[0036] 20. Imprinting platform; 21. Carrying plate; 210. Through hole portion;

[0037] 30. Heatable stamping head; 31. Stamping component; 310. Contact part; 32. Heating component; 33. Temperature sensor; 34. Controller; 35. Actuator; 36. Heat insulation component;

[0038] 40, screen frame; 41, frame; 42, base plate; 420, printing plate hole;

[0039] 50. Printing plate; 51. Pattern;

[0040] 60. light-emitting lamp; 61. light-emitting part;

[0041] 70. Driving components. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0043] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0044] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0045] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0046] See also Figure 1 and Figure 2 , Figure 1 The structure of the printing plate of the existing nanopressing technology is shown. Figure 2 The process of nanoimprinting technology is shown, specifically, the pattern on the printing plate is imprinted on the imprinting glue on the substrate. The existing nanoimprinting technology is a graphic transfer technology that uses mechanical means to transfer patterns. It has the advantages of high resolution, easy mass production, low cost and simple process. It is an important manufacturing technology for nano-sized electronic devices and has a wide range of applications in silicon field effect transistors, nanoelectromechanical systems, microwave integrated circuits, nanoelectronic devices, nanointegrated circuits, quantum storage devices, photonic crystal arrays and OLED flat panel display arrays. The basic principle of nanoimprinting technology is to first make a template with a microstructure pattern, then imprint the pattern on the template on the material to be processed, and solidify it, and finally remove the template to complete the transfer of the pattern. Although high imprinting accuracy can be achieved using traditional imprinting technology, large-area preparation of micro-nano structures cannot be achieved, so large-area imprinting cannot be performed.

[0047] Screen printing (porcelain printing) has the advantages of strong printing adaptability, strong three-dimensional sense and large printing area, and is widely used in clothing, home appliance circuit boards, advertising, art and other industries. The basic principle of screen printing is that when printing, the ink is applied to the printing plate, the substrate is placed under the printing plate, and the ink is transferred to the substrate through the holes on the printing plate by pressure (such as scraping ink). However, the precision of screen printing is low, and the resolution is generally tens of microns. Therefore, screen printing cannot perform sub-micron precision level printing, and the precision is low.

[0048] In order to solve the above problems, the embodiment of the present application provides a submicron imprinting device based on screen printing. The imprinting device combines the advantages of high imprinting precision of nanoimprinting technology and large printing area of ​​screen printing. The imprinting process is visible to the naked eye, does not require vacuum conditions, is easy to operate, and the cost is much lower than traditional nanoimprinting technology. It realizes large-area imprinting at the submicron level and improves imprinting efficiency and convenience.

[0049] See also Figures 3 to 8 , Figure 3 1 is a schematic diagram of a submicron imprinting device 100 based on screen printing provided in an embodiment of the present application. The imprinting device 100 can solve the problem of small imprinting area and low efficiency in nanoimprinting technology, realize large-area imprinting with submicron-level precision, and improve user experience.

[0050] like Figures 3 to 6As shown, the submicron imprinting device 100 based on screen printing includes: a screen printer body 10, an imprinting platform 20, a heatable imprinting head 30, a screen frame 40 and a printing plate 50. The imprinting platform 20 is arranged on the screen printer body 10, and the imprinting platform 20 is used to carry the substrate to be imprinted. The heatable imprinting head 30 is arranged on the screen printer body 10, the screen frame 40 is arranged on the screen printer body 10 and is located above the imprinting platform 20, and the printing plate 50 is arranged on the screen frame 40.

[0051] Specifically, the stamping platform 20, the heated stamping head 30 and the screen frame 40 are all detachably connected to the screen printing machine body 10, and the screen frame 40 is located above the stamping platform 20 and below the heated stamping head 30, so that the heated stamping head 30 applies pressure to the printing plate 50 set on the screen frame 40, wherein the printing plate 50 can be placed on the screen frame 40 and detachably connected to the screen frame 40.

[0052] In some embodiments, Figure 3 As shown, the screen printing machine body 10 includes a limiting groove 12 , and the screen frame 40 is detachably connected to the screen printing machine body 10 via the limiting groove 12 .

[0053] In some embodiments, Figure 4 As shown, specifically, the screen frame 40 includes a frame 41 and a bottom plate 42 disposed on the frame 41 , and a printing plate hole 420 is provided on the bottom plate 42 , and the printing plate hole 420 is used to place a sub-micron pattern 51 of a printing plate 50 .

[0054] In some embodiments, the area of ​​the printing plate hole 420 matches the area of ​​the sub-micron pattern 51 of the printing plate 50 .

[0055] In some embodiments, Figure 5 As shown, the printing plate 50 includes a submicron pattern 51, wherein the printing plate 50 and the base plate 42 are limitedly matched so that the printing plate 50 is placed on the screen frame 40 and the submicron pattern 51 matches the printing plate hole 420, so that during the imprinting process, the submicron pattern 51 can contact the embossing glue on the substrate through the printing plate hole 420 to achieve imprinting.

[0056] Specifically, Figure 6 As shown, the printing plate hole 420 is located in the middle of the screen frame 40, and the screen frame 40 is an elastic screen frame, so that after the printing is completed, the screen frame 40 can rebound the printing plate 50 to the initial height according to its own elasticity, thereby realizing the separation of the printing plate 50 and the embossing glue. This embossing process continues until the heated embossing head 30 moves from one end of the printing plate 50 to the other end and performs embossing, at which time the pattern 51 on the printing plate 50 is completely transferred to the substrate of the embossing platform 20.

[0057] It should be noted that the area of ​​the printing plate hole 420 is not specifically limited, and can be determined based on the area of ​​the submicron pattern 51 on the printing plate 50. Usually, the area of ​​the printing plate hole 420 is slightly smaller than the area of ​​the screen frame 40, thereby making it easier to fix the printing plate 50 on the screen frame 40.

[0058] The distance between the screen frame 40 and the embossing platform 20 is smaller than the maximum elastic distance of the screen frame 40 , so that after embossing is completed, the screen frame 40 can make the printing plate 50 rebound to the initial position, thereby separating the printing plate 50 from the embossing glue.

[0059] Specifically, the heatable stamping head 30 includes a stamping component 31, a heating component 32, a temperature sensor 33 and a controller 34. The controller 34 can control the heating component 32 to heat and control the temperature sensor 33 to measure the temperature. In some embodiments, the actuator 35 may also be included. Figure 7 As shown, the heating component 32, the temperature sensor 33, the controller 34 and the actuator 35 form a closed-loop system, thereby the temperature of the stamping component 31 can be measured and adjusted in real time. The controller 34 is connected to the actuator 35, and the actuator 35 controls the heating component to heat according to the heating instruction issued by the controller 34, so that the heating component 32 heats the stamping component 31. The stamping component 31 is used to contact the printing plate 50, so that the stamping component 31 presses the submicron pattern 51 on the printing plate 50 in the screen frame 40 onto the thermosetting adhesive on the substrate, and uses the heat emitted by the heating component 32 to thermally cure the thermosetting adhesive on the substrate, so as to achieve heating while scraping and printing, thereby improving production efficiency. The temperature sensor 33 is connected to the controller 34 and the heating component 32, and is used to measure the temperature of the stamping component 31, so as to achieve precise control of the thermosetting temperature.

[0060] In some embodiments, the heating component 32 may be a resistance wire embedded in the stamping component 31, used to provide heat for the stamping component 31, the controller 34 may be a PID controller, which is a common feedback loop component in industrial control applications and can be used to maintain the stability of the above-mentioned closed-loop system, the temperature sensor 33 may be an infrared temperature sensor or a thermocouple temperature sensor, used to measure the temperature of the stamping component 31, and the actuator 35 may be a solid-state relay, which can directly drive a large current load through a tiny control signal.

[0061] Please refer to Figure 8 , Figure 8The present invention is a schematic diagram of the working principle of a submicron imprinting device based on screen printing provided in an embodiment of the present application. When the device is working and in the heat curing mode, a substrate is placed on the imprinting platform 20, and an imprinting glue is pre-coated on the substrate. At this time, the imprinting glue is a heat curing glue. The temperature of the heatable imprinting head 30 is controlled within a preset temperature range, and the control system of the screen printing machine body 10 controls the imprinting component 31 of the heatable imprinting head 30 to apply pressure to the printing plate 50, so that the printing plate 50 is imprinted on the substrate on the imprinting platform 20, and the heatable imprinting head 30 is used to heat the printing plate 50, so that the pattern of the contact part between the heatable imprinting head 30 and the printing plate 50 is imprinted on the heat curing glue on the substrate, and the heat curing glue is heat cured, thereby controlling the movement of the heatable imprinting head 30 through the control system of the screen printing machine body 10 to achieve scraping, so that the submicron pattern 51 on the printing plate 50 is imprinted on the imprinting glue on the substrate. The specific working process is as follows: Figure 8 shown.

[0062] The preset temperature range is a temperature range in which the heated stamping head 30 can perform thermal curing during stamping of the sub-micron pattern on the printing plate 50 . For example, the preset temperature range may be 80° C.-300° C., which is not specifically limited herein.

[0063] Exemplarily, the controller 34 controls the heating component 32 to heat the stamping component 31 to a preset temperature, wherein the preset temperature is within a preset temperature range, such as the preset range is 80°C-300°C, and the controller 34 controls the heating component 32 to heat the stamping component 31 to 275°C.

[0064] Exemplarily, the controller 34 controls the heating component 32 to heat the stamping component 31 to a preset temperature. If the preset range is 80°C-300°C, the controller 34 controls the heating component 32 to heat the stamping component 31 to 300°C, thereby compensating for heat loss during heat transfer and avoiding insufficient temperature for thermal curing, resulting in poor curing effect.

[0065] In some embodiments, the temperature sensor 33 measures the temperature of the stamping component 31 to determine whether the temperature of the stamping component 31 is within a preset temperature range. If the temperature of the stamping component 31 is not within the preset temperature range, the controller 34 executes a corresponding heating strategy on the heating component 32, wherein the heating strategy includes the controller 34 executing a heating strategy of reducing the heating temperature or increasing the heating temperature on the heating component 32. In this way, the temperature of the stamping component 31 can be detected in real time to avoid the temperature of the stamping component 31 being too high or too low, which may cause the thermal curing effect to deteriorate.

[0066] Exemplarily, when the temperature sensor 33 detects that the temperature of the stamping component 31 is too high, it sends a signal indicating that the temperature is too high to the controller 34 , and the controller 34 executes a heating strategy of lowering the heating temperature on the heating component 32 to make the heating temperature reach the most suitable heating temperature.

[0067] In some embodiments, the screen printer body 10 is used to provide the pressure required for printing. The control system of the screen printer body 10 can adjust printing parameters such as printing pressure, printing speed, and printing time, and perform scraping according to the adjusted printing parameters.

[0068] For example, since different embossing adhesives have different requirements for embossing parameters such as embossing pressure, embossing speed and embossing time, the embossing device 100 first obtains the embossing parameters pre-set by the user before starting work, and the control system of the screen printing machine body 10 controls the embossing device 100 to work according to the embossing parameters.

[0069] In some embodiments, Fig. 9 As shown, the stamping component 31 includes a contact portion 310, which is used to contact the printing plate 50, wherein the contact portion is set at a preset inclination angle, thereby enabling the stamping component to achieve better contact with the printing plate, improving the scraping effect, and improving the stamping efficiency. Specifically, the preset inclination angle can be 5° or 10°, which is not specifically limited here.

[0070] In some embodiments, the contact portion 310 is a linear contact portion, and the contact between the stamping component 31 and the printing plate 50 is a linear contact. The linear contact portion is the contact portion between the heatable stamping head 30 and the printing plate 50, and the contact portion between the heatable stamping head 30 and the printing plate 50 is in linear contact.

[0071] In some embodiments, the heatable stamping head 30 further includes a heat insulating member 36, which is disposed at one end of the stamping component 31 away from the stamping platform 20. Fig.10 and Fig.11 As shown, the stamping component 31 and the heat insulating component 36 are threadedly connected to the sliding component 11 arranged on the screen printing machine body 10, so that the heated stamping head 30 is fixed on the sliding component 11, wherein the sliding component 11 can slide on the screen printing machine body 10, thereby driving the heated stamping head 30 to move to achieve scraping.

[0072] Specifically, the stamping component 31 can be made of a material with good thermal conductivity such as a copper plate, and the thermal insulation component 36 can be made of a material such as mica that is resistant to high temperatures and has good thermal resistance. The provision of the thermal insulation component 36 can prevent the heat on the stamping component 31 from being transferred to the sliding component 11 to cause heat loss, and also facilitate the transfer of heat to the stamping glue.

[0073] In some embodiments, Fig.12 As shown, the stamping platform 20 includes a supporting plate 21, and the stamping device 100 also includes a light-emitting lamp 60 and a driving component 70. The light-emitting lamp 60 is installed on the driving component 70 and is located under the supporting plate 21 of the stamping platform 20. The supporting plate 21 is a light-transmitting plate. The driving component 70 is used to drive the light-emitting lamp 60 to move relative to the stamping platform 20.

[0074] The light tube 60 can be any light tube for realizing light curing, for example, a UV curing tube can be used. When a UV curing tube is used, the embossed adhesive on the substrate should be a corresponding UV curing adhesive. The UV curing tube can emit ultraviolet rays of a specific wavelength, and can realize UV ​​curing within 0.5-2 seconds, with the advantages of instant curing, time and power saving, space saving, easy control, no need for high temperature baking, wide adaptability to substrates, and no pollution.

[0075] When the device is working, that is, when light curing is used, the heating component 32 of the heatable stamping head 30 does not need to be heated. The control system of the screen printing machine body 10 controls the stamping component 31 of the heatable stamping head 30 to apply pressure to the printing plate 50 and move to achieve scraping. At the same time, the control system of the screen printing machine body 10 controls the driving component 70 to drive the light-emitting lamp 60 to move, so that the light emitted by the light-emitting lamp 60 can pass through the carrier plate 21 and irradiate the substrate to cure the ultraviolet curing glue with the pattern 51 printed on the substrate, thereby printing the submicron pattern 51 on the printing plate 50 onto the ultraviolet printed glue on the substrate.

[0076] In some embodiments, when the device is working and in UV curing mode, the light tube 60 and the heatable stamping head 30 both move in the same direction, wherein the movement rate of the light tube 60 is the same as the movement rate of the heatable stamping head 30. Thus, simultaneous stamping and curing can be achieved, simplifying the stamping steps and improving the stamping efficiency.

[0077] Specifically, the light emitting lamp 60 and the stamping component 31 of the heated stamping head 30 both move in the same direction and at the same speed, that is, the light emitting lamp 60 and the stamping component 31 of the heated stamping head 30 remain relatively stationary in the vertical direction during the stamping process.

[0078] In some embodiments, Fig.13 As shown, the light-emitting lamp 60 includes a light-emitting portion 61, wherein the light-emitting portion 61 is a linear light-emitting portion, and the shape of the light-emitting portion 61 matches the shape of the contact portion 310 of the stamping component 31. In this way, the light-emitting lamp 60 can maintain linear light emission, and light curing can be performed while stamping, which greatly improves the stamping efficiency.

[0079] In some embodiments, Fig.14As shown, a plurality of through-hole portions 210 are provided on the carrier plate 21 , and the through-hole portions 210 are used to fix the substrate on the imprinting platform 20 by utilizing the adsorption force of the gas.

[0080] In some embodiments, the through holes 210 are arranged at equal intervals on the carrier plate 21 , thereby improving the adsorption effect of the substrate.

[0081] An embodiment of the present application provides a control method for a submicron imprinting device based on screen printing. The control method is applied in a submicron imprinting device 100 based on screen printing.

[0082] like Fig.15 As shown, Fig.15 1 is a schematic flow chart of the steps of a control method of a submicron imprinting device based on screen printing provided in an embodiment of the present application, the control method comprising:

[0083] S101, controlling a heating component to heat the stamping component through a controller so that the temperature of the heatable stamping head is within a preset temperature range;

[0084] S102, controlling the heated stamping head to apply pressure to the printing plate through the control system of the screen printing machine body, and controlling the movement of the heated stamping head to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate.

[0085] In some embodiments, the control method also includes: obtaining an imprint mode selected by a user, the imprint mode including a thermal curing mode and a light curing mode; wherein the thermal curing mode is: controlling the temperature of the heatable imprint head within a preset temperature range, and controlling the heatable imprint head to apply pressure to the printing plate and move to achieve scraping through the control system of the screen printing machine body, so as to imprint the submicron pattern on the printing plate onto the imprinted glue on the substrate; the light curing mode is: controlling the heatable imprint head to apply pressure to the printing plate and move to achieve scraping through the control system of the screen printing machine body, and at the same time controlling the driving component to drive the light-emitting lamp to move, so that the light emitted by the light-emitting lamp is irradiated on the substrate through the carrier plate to cure the ultraviolet curing glue with the pattern imprinted on the substrate, thereby imprinting the submicron pattern on the printing plate onto the imprinted glue on the substrate.

[0086] In some embodiments, an imprint instruction is obtained; an imprint mode of the imprint machine and imprint parameters corresponding to the imprint mode are determined according to the imprint instruction; and the imprint machine is controlled to perform imprinting according to the imprint parameters.

[0087] Specifically, the imprint mode of the imprinting machine is determined according to the imprinting instruction; if the imprinting mode is a thermal curing mode, the imprinting parameters corresponding to the thermal curing mode are determined; if the imprinting mode is an ultraviolet curing mode, the imprinting parameters corresponding to the ultraviolet curing mode are determined.

[0088] It should be noted that the specific control mode and technical effects achieved by the control method are the same as those of the submicron imprinting device based on screen printing provided in the above embodiment. For details, please refer to the above embodiment and no detailed introduction will be given here.

[0089] The serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

[0090] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A submicron imprinting device based on screen printing, characterized in that: include: Screen printing machine body; An imprinting platform, arranged on the screen printing machine body, for carrying a substrate to be imprinted; A heatable stamping head is arranged on the screen printing machine body; A screen frame, arranged on the screen printer body and located above the imprinting platform; A printing plate, disposed on the screen frame, wherein the printing plate includes a submicron-scale pattern; Luminous tubes; A driving component, the light-emitting lamp is mounted on the driving component and is located under a bearing plate of the imprinting platform, the bearing plate is a light-transmitting plate, and the driving component is used to drive the light-emitting lamp to move relative to the imprinting platform; The heatable stamping head comprises a stamping component, a heating component, a temperature sensor and a controller, wherein the controller is connected to the heating component and is used to control the heating component to heat the stamping component, the stamping component is used to contact the printing plate, and the temperature sensor is connected to the controller and is used to measure the temperature of the heatable stamping head; When the device is working, the temperature of the heatable stamping head is controlled within a preset temperature range, and the control system of the screen printer body controls the heatable stamping head to apply pressure to the printing plate and move to achieve scraping, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate; When the equipment is working, the control system of the screen printing machine body can also control the heated stamping head to apply pressure to the printing plate and move it to achieve scraping, and at the same time control the driving component to drive the light-emitting tube to move, so that the light emitted by the light-emitting tube can be irradiated on the substrate through the supporting plate, so as to imprint the submicron pattern on the printing plate onto the embossing glue on the substrate.

2. The embossing device according to claim 1, characterized in that When the device is working, the light-emitting lamp and the heatable stamping head both move in the same direction; Wherein, the movement speed of the light-emitting lamp is the same as the movement speed of the heated stamping head.

3. The imprinting device according to claim 1, characterized in that The stamping component comprises: A contact portion, wherein the contact portion is used to contact the printing plate, wherein the contact portion is arranged at a preset inclination angle.

4. The embossing device according to claim 3, characterized in that The contact portion is a linear contact portion, and the contact between the stamping component and the printing plate is linear contact.

5. The imprinting device according to claim 1, characterized in that The light emitting lamp comprises: The light emitting portion is a linear light emitting portion and matches the shape of the contact portion of the stamping component.

6. The imprinting device according to claim 1, characterized in that The screen printing machine body comprises: The screen frame is detachably connected to the screen printing machine body through the limiting groove.

7. The imprinting device according to claim 1, characterized in that The heatable stamping head also includes: A heat insulating member is arranged at one end of the stamping component away from the stamping platform.

8. A control method, characterized in that: Applied to the imprinting device according to any one of claims 1 to 7, the control method comprises: Controlling the heating component to heat the stamping component by a controller so that the temperature of the heatable stamping head is within a preset temperature range; The control system of the screen printer body controls the heatable stamping head to apply pressure to the printing plate and controls the movement of the heatable stamping head to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate.

9. The control method according to claim 8, characterized in that: The control method further comprises: Acquire an imprint mode selected by a user, wherein the imprint mode includes a thermal curing mode and a light curing mode; The thermal curing mode is as follows: controlling the temperature of the heatable stamping head within a preset temperature range, and controlling the heatable stamping head to apply pressure to the printing plate and move to achieve scraping through the control system of the screen printer body, so as to stamp the submicron pattern on the printing plate onto the stamping glue on the substrate; The photocuring mode is: the control system of the screen printer body controls the heated stamping head to apply pressure to the printing plate and move it to achieve scraping, and at the same time controls the driving component to drive the light tube to move, so that the light emitted by the light tube is irradiated on the substrate through the carrier plate, so as to imprint the submicron pattern on the printing plate onto the embossing glue on the substrate.

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