Universal Cooling Baseplate Module

Abstract

In one embodiment, a cooling device for providing liquid cooling to an electronic circuit board includes an upper module having a cooling plate forming an upper surface to accommodate an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel. The cooling device also includes a lower module having a second liquid distribution channel embedded therein to receive cooling liquid from an external cooling liquid source, and the cooling device includes a plurality of pipe channels located between the upper module and the lower module to receive cooling liquid from the lower module and supply the cooling liquid upward to the upper module.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to data centers. More specifically, embodiments of the present invention relate to a universal cooling baseplate module. Background Art

[0002] Thermal management of a data center that includes several active electronic racks is critical to ensuring proper performance of the servers and other IT equipment running in the racks. Without proper thermal management, the thermal environment within the rack may exceed the operating threshold, resulting in operational consequences (e.g., server failure, etc.). One way to manage the thermal environment is to use chilled air to cool the IT equipment. Most existing data centers are air cooled. Recently, data centers have deployed higher power density electronic racks, where higher density chips are packed more closely together to provide greater processing power. Cooling these high density racks by maintaining a proper thermal environment can be a problem for existing cooling systems.

[0003] As the power density of high-power density electronic devices increases, liquid cooling becomes a viable solution. In some cases, air cooling may not be a viable solution. First, when the power density of electronic devices is high, it exceeds the limitations of most air cooling devices or systems. Continuous air cooling designs will sacrifice significant costs (initial capital cost and operating costs) and will also challenge reliability. Second, in some of the latest electronic packages, the entire motherboard as well as the electronic devices are packaged in a closed system. This means that the electronic devices may not be close to any air source. Therefore, air cooling cannot be used in this system. Third, edge computing devices may be used in an external environment. Even if cooling air is available for these electronic devices, the air conditions including temperature, humidity, and quality may not be feasible for operating these devices or cooling systems.

[0004] One of the main disadvantages of liquid cooling over air cooling is the complexity of the design. Liquid cooling introduces several additional components into the server including manifolds, hoses, connectors, and cooling devices. These components not only increase the design complexity, but also increase the corresponding cost and reduce reliability. In many recent server designs, multiple high power density processors are packaged on the motherboard. For systems with multiple liquid-cooled high power density processors, the liquid cooling solution design becomes more challenging.

[0005] For cloud service providers, the types of server hardware to be deployed in their data centers can vary significantly, such that some of the server hardware can be customized servers, for example, some of the server hardware can be Scorpio servers or OCP servers, or some of the server hardware can be standard servers. The thermal mechanical and electrical designs of these servers have different forms. Summary of the invention

[0006] According to one aspect of the present application, a cooling device for providing liquid cooling to an electronic circuit board is provided, comprising: an upper module having a cooling plate forming an upper surface to accommodate an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source; and a plurality of pipe channels located between the upper module and the lower module to receive the cooling liquid from the lower module and supply the cooling liquid upward to the upper module.

[0007] According to another aspect of the present application, a data processing system is provided, comprising: one or more electronic devices arranged on a circuit board, the one or more electronic devices including at least one processor; and a cooling device. The cooling device comprises: an upper module having a cooling plate forming an upper surface to accommodate a circuit board on which one or more electronic devices are deposited, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source; and a plurality of pipe channels located between the upper module and the lower module to receive the cooling liquid from the lower module and supply the cooling liquid upward to the upper module.

[0008] According to another aspect of the present application, an electronic rack of a data center is provided, comprising: a plurality of server blades arranged in a stack, each server blade having one or more servers to provide data processing services to a client, wherein each server comprises: one or more electronic devices arranged on a circuit board, the one or more electronic devices comprising at least one processor; and a cooling device. The cooling device comprises: an upper module having a cooling plate forming an upper surface to accommodate a circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source; and a plurality of pipe channels located between the upper module and the lower module to receive the cooling liquid from the lower module and supply the cooling liquid upward to the upper module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the drawings in which like references indicate similar elements.

[0010] Figure 1 is a side cross-sectional view of a universal cooling substrate module according to one embodiment.

[0011] Figure 2 is a cross-sectional top view of an upper module of a universal cooling substrate module according to one embodiment.

[0012] Figure 3 is a top view of a universal cooling substrate module according to one embodiment.

[0013] Figure 4 A top view of a universal cooling substrate module according to another embodiment is shown.

[0014] Figure 5 A side view of a universal cooling baseplate module according to another embodiment is shown.

[0015] Figure 6 A system using a universal cooling baseplate module according to another embodiment is shown. DETAILED DESCRIPTION

[0016] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and accompanying drawings are explanations of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a comprehensive understanding of various embodiments of the present invention. However, in some cases, well-known or conventional details are not described to provide a concise discussion of embodiments of the present invention.

[0017] Reference to "one embodiment" or "an embodiment" in this specification means that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in this specification does not necessarily refer to the same embodiment.

[0018] Embodiments of the present invention provide a universal cooling baseplate design. The cooling baseplate is used for server liquid cooling assembly and packaging. The cooling baseplate exchanges cooling liquid from an external cooling liquid source through multiple ports. The internal structure of the cooling baseplate includes multiple fluid channels for distributing and spreading the fluid over the entire cooling surface of the baseplate. The cooling baseplate also includes the function of fluid distribution or liquid circuit extension using internal design and additional components. Multiple fluid sub-ports are designed on the baseplate for distributing the fluid to an external cooling device.

[0019] The liquid supply and return portion and the internal channel design of the cooling base ensure that the cooling liquid from the external cooling liquid source enters the cooling base and is transported to the external cooling device. The internal fluid path structure of the cooling base ensures fluid distribution and effective heat transfer from the heat source to the cooling medium (cooling liquid). The present invention is intended to eliminate the components required when implementing a liquid cooling solution on a server. The cooling base eliminates many of the components required when implementing a liquid cooling solution and is compatible with different rack configurations and rack and facility-level fluid structures. The cooling base design also provides additional flexibility because the design can be customized based on different liquid designs on the motherboard. The present invention is intended to solve the difficulty and complexity of installing a liquid cooling module on a server through its design. The solution can be used to support different liquid cooling devices or their cooling circuits, such as multiple cold plates in a single circuit in series or multiple cold plates in multiple parallel circuits.

[0020] According to one embodiment, a cooling device for providing liquid cooling to an electronic circuit board includes an upper module having a cooling plate forming an upper surface to accommodate an external circuit board having one or more electronic devices deposited thereon. The upper module includes a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel. The lower module includes a second liquid distribution channel embedded therein to receive a cooling liquid from an external cooling liquid source. A plurality of tube channels are located between the upper module and the lower module to receive the cooling liquid from the lower module and supply the cooling liquid upward to the upper module.

[0021] In one embodiment, the cooling device includes an expansion module coupled to the lower module. The expansion module includes a liquid manifold having one or more expansion port connections to provide liquid distribution to the additional liquid cooling device. In one embodiment, the expansion module is removably coupled to the lower module via one or more connection ports. In one embodiment, the cooling device includes an additional cooling device coupled to one or more expansion ports of the liquid manifold of the expansion module. The additional cooling device is located on one or more electronic components on the top surface of the circuit board.

[0022] In one embodiment, the cooling plate includes a plurality of water fins that provide additional contact area between the cooling liquid and the cooling plate to increase conductive heat transfer. In one embodiment, the tube channels are positioned to allow air to flow between the cooling plate and the lower module.

[0023] In one embodiment, the inlet is for receiving cooling liquid from an external cooling liquid source; and the outlet is for returning cooling liquid carrying heat extracted from the circuit board to the external cooling liquid source. In one embodiment, the first thermal pad is located between the cooling plate and the bottom surface of the circuit board. The thermal pad is thermally conductive.

[0024] Figure 1 Detailed fluid structure of a cooling plate module design for a cooling substrate module according to one embodiment is shown. The cooling plate module includes a lower module / channel and an upper channel. There are multiple tube channels connecting the lower channel and the upper channel. Thus, the lower channel, the tube channel, and the upper channel form a fluid path within the cooling plate module for the cooling substrate module. Within the upper module, multiple fins (such as Figure 2 ) for cooling surface extension. Figure 1 As shown, it can be seen that the fluid first enters the cooling substrate and then enters the upper channel after passing through the lower channel and the tube channel.

[0025] The design is used to maximize the contact area of ​​the water and the cooling plate. This improves the conductive heat transfer of the main board and the cooling plate and the heat transfer between the water and the cooling plate. The tube channel is used as a structure for more uniform fluid distribution within the upper module. The tube channel is also used as a liquid-air cooling structure for different cooling applications.

[0026] In one embodiment, reference Figure 1 , the cooling plate module includes a cooling plate 102, a lower module 104, and a plurality of tube channels 106 connecting the cooling plate 102 and the lower module 104. The lower module 104 can receive cooling liquid from an external cooling liquid source. The cooling liquid then flows along the fluid path 110A of the lower module and upward through the tube channel 106 to the cooling plate 102. The cooling liquid then flows along the fluid path 110B of the cooling plate 102, thereby extracting heat from the circuit board, motherboard, or other electronic device in contact with the cooling plate 102. The cooling liquid then returns to the external cooling source. In addition, as described below with reference to Figure 3 and Figure 4 It is further described that the cooling liquid can also be provided by the cold plate module to one or more expansion modules, and the one or more expansion modules are used to provide cooling liquid to additional cooling devices (such as cold plates, server coolers, etc.).

[0027] The tube channels 106 may be microchannels or microtubes to carry the cooling liquid from the lower module 104 to the cooling plate 102. The tube channels 106 may be spaced a sufficient distance to allow air to flow between them. Thus, the air passing between the lower module 104 and the cooling plate 102 may be cooled by contact with the tube channels 106 carrying the cooling liquid. The cooled air may then be recirculated and used to air cool the electronic devices within the same enclosure as the cooling plate module 100.

[0028] The cooling plate 102 also includes a plurality of water fins 108. The water fins 108 increase the amount of heat transferred from the cooling plate 102 to the cooling fluid flowing in the fluid path 110B. Figure 2As further described, the water fins 108 may be spaced throughout the cooling plate 102 to optimize the heat transfer area design of the cooling fluid using the water fins 108. Figure 1 The fluid paths 110A-110B shown in FIG. 1 are representative, and other fluid paths may be used depending on the application.

[0029] Figure 2 A top view of the internal structural design of a cooling plate module according to one embodiment is shown. It can be seen that the upper channel is connected to the tube channel and the water fins are assembled in the upper channel. It should be noted that a more detailed internal fluid structure design should be based on multiple experimental tests and engineering design cycles for the final product based on actual usage.

[0030] In one embodiment, referring to Figure 2 The cooling plate module includes a cooling plate 102, a tube channel 106 and a water fin 108. Figure 1 The cooling plate module also includes an inlet port 202 and an outlet port 204. The inlet port 202 receives cooling fluid from a source external to the cooling plate module and provides the cooling fluid to the lower module (e.g., Figure 1 The cooling liquid flows from the lower module upwardly through the tube channels 106 into the cooling plate 102. The tube channels 106 are spaced apart from one another to provide cooling fluid distribution throughout the cooling plate 102. The cooling liquid can flow through the entire cooling plate 102, during which time heat is extracted into the cooling liquid by the cooling plate 102.

[0031] The water fins 108 are distributed throughout the cooling plate 102. The water fins 108 may be pin-shaped structures that span from the top of the interior of the cooling plate 102 to the bottom of the interior of the cooling plate 102. Heat extracted from the electronic devices in contact with the surface of the cooling plate 102 is extracted from the surface into the cooling liquid. Heat is also transferred downward through the water fins 108. The heat transferred to the water fins 108 is then extracted to the cooling liquid flowing through the cooling plate 102 in contact with the water fins 108. Thus, the water fins 108 provide an additional heat transfer area from the cooling plate 102 to the cooling liquid. It should be noted that the structure of the water fins 108 may vary and is not limited to Figure 2 The pin-like structure shown.

[0032] Figure 3A top view of a simplified schematic diagram of a cooling module according to one embodiment is shown. The main part of the cooling module consists of a cooling plate module. The cooling plate module will serve as a bottom base where the server motherboard will be attached on top of the bottom base. The side of the cooling module is designed as a fluid extension module. The module can also be understood as a fluid distribution module. No motherboard will be attached on top of these modules. These modules are used to extend the fluid supply and return to additional devices or other component-level liquid cooling devices. Fluid inlets and fluid outlets are assembled on the cooling module. These ports are used to connect to an external cooling source. It should be noted that in actual design situations, the number of ports can vary depending on different usage scenarios. The port can be a drip-free quick disconnect connection. The port can also be a blind-fit quick disconnect connection.

[0033] Figure 3 The fluid channel structure design is also shown in . It can be seen that the fluid enters the cooling module and is distributed to multiple modules, including parallel cooling plate modules and expansion modules. Here, in the current design, a parallel mode is drawn, which may be a more efficient method. However, a series fluid device can also be used. The fluid is evenly distributed over the entire volume of the cooling plate. The supply and return fluid channels are included in two fluid expansion modules. Once the cooling loop is assembled on the server, its loop supply and return ports are connected to these expansion modules through predefined fluid connectors. It should be mentioned that the cooling loop can be connected to the fluid supply port of one fluid expansion module, and the return loop can be connected to the fluid return port of another fluid expansion module. This means that the internal fluid channel enables multiple fluid expansion modules to act as a single unit. This will significantly improve its compatibility with different server liquid cooling loops, as well as the implementation of liquid cooling loops on different electronic layouts on the motherboard. For example, cold plates are connected in parallel in one loop, while some cold plates are connected in series in one loop.

[0034] In one embodiment, reference Figure 3 , the cooling substrate 300 includes Figure 1 The cooling plate module 100 includes an inlet port 202 and an outlet port 204. Fluid expansion modules 302A-302B are attached to the cooling plate module 100 on each side. The cooling plate module 100 is designed to attach electronic devices or systems such as circuit boards or motherboards to the cooling plate surface of the cooling plate module 100. However, the device does not cover the fluid expansion modules 302A-302B. The cooling plate module 100 can use fluid that flows through the cooling plate (e.g., Figure 1 and Figure 2 The cooling liquid of the cooling plate 102 (of the cooling plate 102) extracts heat from the circuit boards attached to the surface of the cooling plate module 100. The cooling plate module 100 receives the cooling liquid from the external cooling liquid source through the inlet port 202.

[0035] The fluid expansion modules 302A-302B may be permanently attached to the cooling plate module 100, as shown, or may be removable. The fluid expansion modules 302A-302B may include one or more fluid expansion ports for providing cooling liquid to additional cooling circuits and cooling devices. The fluid expansion modules 302A-302B may receive cooling liquid from the cooling plate module 100 and provide the cooling liquid to the cooling circuit to be attached. In one example, the cooling circuit may be attached to two fluid expansion modules such that one end of the circuit is attached to the supply of one fluid expansion module 302A and the other end of the circuit is attached to the return of another fluid expansion module 302B. In another example, both ends of the cooling circuit are attached to the supply and return of the same fluid expansion module. Once the cooling liquid passes through the fluid expansion modules 302A-302B and any additional cooling circuits attached to the fluid expansion modules 302A-302B, the cooling liquid returns to the cooling plate module 100. The coolant then returns from the cold plate module 100 through the outlet port 204 to the external coolant source.

[0036] Figure 4 Some additional internal fluid structure designs of a cooling base plate according to one embodiment and a modular concept of a cooling base plate are provided. It can be seen that the cooling plate module and the expansion module exist in separate parts. The cooling plate module and the expansion module are connected using connection ports, such as blind-mate connectors. This increases the flexibility of configuring the cooling base plate for different server platforms. It should be mentioned that additional fluid expansion ports (both supply and return) are designed on the expansion module. Similarly, in terms of fluid channel connection, any one of the supply expansion ports of one of the expansion modules is the same as another supply on the same expansion module or a different expansion module. However, different types of expansion port connectors can be assembled on the expansion module because different server loops can use connectors of different types or sizes.

[0037] In one embodiment, reference Figure 4 The cooling substrate 400 includes an inlet port 202 and an outlet port 204. Figure 1 The cooling plate module 100 includes a plurality of connection ports 404A-404B for connecting the expansion modules 302A-302B to the cooling plate module. The expansion modules 302A-302B include a plurality of expansion ports 402 to connect the cooling circuit to the expansion modules 302A-302B. Figure 3 , the circuit board can be attached to the surface of the cooling plate module 100. The cooling liquid flowing through the cooling plate module 100 extracts heat from the circuit board. The cooling plate module 100 receives the cooling liquid from an external cooling liquid source through the inlet port 202.

[0038] The fluid expansion modules 302A-302B can be modular components that can be attached to the cooling plate module using connection ports 404A-404B. The fluid expansion modules 302A-302B can include one or more expansion ports 402, which are used to provide cooling liquid to additional cooling circuits and cooling devices. The ports can be equipped with different types of connectors, such as drip-free quick disconnect connections. The expansion port module can be configured with ports of different sizes thereon. The fluid expansion modules 302A-302B can receive cooling liquid from the cooling plate module 100 and provide the cooling liquid to the cooling circuit to be attached. Each expansion module 302A can include a liquid supply path and a liquid return path. In one example, the cooling circuit can be attached to two fluid expansion modules so that one end of the circuit is attached to the supply portion of one fluid expansion module 302A, and the other end of the circuit is attached to the return portion of another fluid expansion module 302B. In another example, both ends of the cold circuit are attached to the supply portion and the return portion of the same fluid expansion module. Once the cooling liquid passes through the fluid expansion modules 302A-302B and any additional cooling circuits attached to the fluid expansion modules 302A-302B, the cooling liquid returns to the cold plate module 100. The cooling liquid then returns from the cold plate module 100 through the outlet port 204 to an external liquid cooling source.

[0039] Figure 5 A side view of a cooling module design is shown. According to one embodiment, the cooling substrate can be arranged in multiple layers. It can be seen that the cooling plate module is located on the top of the cooling plate module and the fluid expansion module is located at the bottom of the cooling plate module. In some applications, additional expansion modules can be added to the cooling substrate. These additional expansion modules will receive cooling fluid and return fluid through the same inlet and outlet as the cooling plate module and the fluid expansion module.

[0040] In one embodiment, reference Figure 5 , the cooling base plate 500 includes a cooling plate module 100, a fluid expansion module 302, and a supply and return module 510. The fluid expansion module 302 can be attached to the bottom side of the cooling plate module (ie, Figure 1The supply and return module 510 includes an inlet port 202 and an outlet port 204. The fluid expansion module 302 includes a plurality of expansion ports 402. The supply and return module 510 receives cooling liquid from an external cooling liquid source through the inlet port 202. The supply and return module 510 directs the cooling liquid from the inlet port 202 to both the cooling plate module 100 and the fluid expansion module 302 in parallel. The supply and return module 510 also receives cooling fluid flowing through the cooling plate module 100 and the fluid expansion module 302, and returns the cooling fluid to the external cooling liquid source through the outlet port 204. The expansion port 402 of the fluid expansion module 302 provides a connection for an additional liquid cooling circuit.

[0041] Figure 6 An example is shown when a universal cooling base plate module is implemented on a server rack according to one embodiment. It can be seen that the cooling base plate is mounted at the bottom of the motherboard. The motherboard is attached to the cooling base plate through a thermal pad. The thermal pad provides a better connection between the surfaces of the two items. At the bottom of the cooling base plate, an anti-vibration structure is used to enhance the packaging reliability and the cooling base plate reliability in an impact vibration environment. The cooling base plate is used to cool the bottom of the motherboard and the entire environment. An additional cooling device, such as a cold plate, is used on top of the GPU or CPU. The cold plate ring is then connected to the expansion module on the cooling base plate. The cooling base plate provides a basic base plate module based on which most cooling solutions can be assembled.

[0042] Note that Figure 6 The system shown may represent any data processing system, such as a planning and control system for an autonomous vehicle or an edge computing system. Figure 6 The system shown may be one of the servers in an electronic rack of a data center, wherein the electronic rack includes an array of server blades. Each server blade includes one or more servers that provide data processing services to clients, and each server may include one or more electronic devices (e.g., processors).

[0043] In one embodiment, reference Figure 6, a cooling baseplate 300 is included within a server chassis 612 to cool a motherboard 606 and electronic devices, such as a processor 604. The cooling baseplate 300 is attached to the server chassis 612 via an anti-vibration structure 610 located between the cooling baseplate 300 and the server chassis 612. The server chassis 612 may be located in an edge computing environment such as an autonomous vehicle, requiring the electronic devices to be attached to the chassis in a manner to avoid damage due to vibration. The anti-vibration structure 610 protects the components attached to the server chassis 612 from movement that may cause damage to the components. The motherboard 606 is attached to the cooling baseplate 300. A thermally conductive heat pad 608 is placed between the cooling baseplate 300 and the motherboard 606. The heat pad provides uniform contact and conductive heat transfer from the motherboard 606 to the cooling baseplate 300. The cooling baseplate 300 may include a cold plate to which the motherboard 606 is attached. The cold plate may include a liquid distribution channel through which a coolant flows to extract heat from the motherboard 606.

[0044] The processor 604 attached to the motherboard 606 may require additional cooling, such as when the processor 604 is a high-performance processor with a high power density. The cold plate 602 is attached to the processor 604 to extract heat generated by the processor 604. The cold plate 602 may include a liquid distribution channel through which a cooling liquid flows to extract heat from the processor 604. The cold plate loop 614 couples the cold plate 602 to the cooling baseplate 300. The cooling baseplate 300 can provide cooling liquid to the cold plate through the cold plate loop 614. For example, the cold plate loop 614 can be attached to a fluid expansion module (e.g., Figure 3 602 ), which includes a connection for a cold plate loop 614 and provides cooling liquid to an additional cooling device such as the cold plate 602.

[0045] In the above description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. It will be apparent that various modifications may be made to the present invention without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, the present description and the accompanying drawings should be understood in an illustrative rather than a restrictive sense.

Claims

1. A cooling device for providing liquid cooling to an electronic circuit board, the cooling device comprising: an upper module having a cooling plate forming an upper surface to accommodate an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive said coolant from an external coolant source; as well as a plurality of pipe channels located between the upper module and the lower module to receive cooling liquid from the lower module and supply the cooling liquid upward to the upper module; An expansion module is coupled to the lower module, the expansion module having a liquid manifold including one or more expansion port connections to provide liquid distribution to additional liquid cooling devices.

2. The cooling device according to claim 1, wherein: The additional liquid cooling device includes one or more cold plates attached to a top surface of the one or more electronic devices.

3. The cooling device according to claim 2, wherein: The expansion module is configured to supply a portion of the cooling liquid upward to the cold plate and receive the supplied portion of the cooling liquid downward from the cold plate, the supplied portion carrying heat exchanged from the one or more electronic devices.

4. The cooling device according to claim 2, wherein: The expansion module operates as a manifold having a plurality of pairs of supply ports and return ports, which are respectively coupled to a plurality of cold plates using flexible tubes.

5. The cooling device of claim 2, further comprising a main supply and return module coupled to the upper module, the lower module and the expansion module, wherein: The main supply and return module operates as a main manifold to the upper module, the lower module, and the expansion module.

6. The cooling device according to claim 5, wherein: The main supply and return module includes a pair of upstream transmission liquid supply and return ports and multiple pairs of downstream transmission liquid supply and return ports, the pair of upstream transmission liquid supply and return ports are connected to the external cooling liquid source, and the multiple pairs of downstream transmission liquid supply and return ports are connected to the upper module, the lower module and the expansion module.

7. The cooling device according to claim 1, wherein: The expansion module is detachably coupled to the lower module by using one or more connection ports of a connector.

8. The cooling device according to claim 1 further includes an additional cooling device, which is connected to one or more expansion ports of the liquid manifold of the expansion module, and the additional cooling device is located on one or more electronic components on the upper surface of the circuit board.

9. The cooling device according to claim 1, wherein: The cooling plate also includes a plurality of fins to provide additional contact area between the cooling liquid and the cooling plate, thereby increasing the conductive surface for heat transfer.

10. The cooling device according to claim 1, wherein: The tube channels of the plurality of tube channels are positioned to allow air to flow in air spaces between the cooling plate, the lower module, and the tube channels.

11. The cooling device according to claim 1, further comprising: an inlet port for receiving coolant from an external coolant source; as well as An outlet port is provided for returning the cooling fluid carrying the heat extracted from the circuit board to the external cooling fluid source.

12. The cooling device according to claim 1, further comprising a first thermal pad disposed between the cooling plate and a bottom surface of the circuit board, wherein: The first thermal pad is thermally conductive.

13. A data processing system comprising: One or more electronic devices disposed on the circuit board, the one or more electronic devices including at least one processor; as well as Cooling device, comprising: an upper module having a cooling plate forming an upper surface to accommodate the circuit board having the one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source; and a plurality of pipe channels located between the upper module and the lower module to receive cooling liquid from the lower module and supply the cooling liquid upward to the upper module; An expansion module is coupled to the lower module, the expansion module having a liquid manifold including one or more expansion port connections to provide liquid distribution to additional liquid cooling devices.

14. The data processing system according to claim 13, wherein: The additional liquid cooling device includes one or more cold plates attached to a top surface of the one or more electronic devices.

15. The data processing system according to claim 14, wherein: The expansion module is configured to supply a portion of the cooling liquid upward to the cold plate and receive the supplied portion of the cooling liquid downward from the cold plate, the supplied portion carrying heat exchanged from the one or more electronic devices.

16. An electronic rack for a data center, comprising: A plurality of server blades are arranged in a stack, each server blade having one or more servers to provide data processing services to a client, wherein each server comprises: one or more electronic devices disposed on the circuit board, the one or more electronic devices including at least one processor; and Cooling device, comprising: an upper module having a cooling plate forming an upper surface to accommodate the circuit board having the one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel; a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source; and a plurality of pipe channels located between the upper module and the lower module to receive cooling liquid from the lower module and supply the cooling liquid upward to the upper module; An expansion module is coupled to the lower module, the expansion module having a liquid manifold including one or more expansion port connections to provide liquid distribution to additional liquid cooling devices.

17. The electronic rack according to claim 16, wherein: The additional liquid cooling device includes one or more cold plates attached to a top surface of the one or more electronic devices.

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