Gas supply assembly, components thereof and reactor system including the same
By designing a gas supply assembly suitable for gas phase reactors, the problems of frequent replacement of precursor containers and poor adaptability are solved, and convenient container installation and improved throughput are achieved.
Patent Information
- Application Number
- CN202011578034.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-01-06
- Filing Date
- 2020-12-28
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2040-12-28
AI Technical Summary
When existing gas-phase reactor systems use precursors that are solid or liquid at room temperature and pressure, frequent replacement of precursor containers affects throughput and is difficult to adapt to precursor containers of different sizes.
A gas supply assembly is designed, including a container, a valve plate, a shell and a gas feed-through. The container can hold solid or liquid precursors and is equipped with a removable gas pipeline and a heater. The container allows for changes in size and ensures the convenience and adaptability of container installation through a valve plate leveling device and a gauge.
The convenient installation and removal of precursor containers are achieved, which can adapt to containers of different sizes and improve the throughput and operating efficiency of the reactor system.
Smart Images

Figure CN113069999B_ABST
Abstract
Description
Technical Field
[0001] The present disclosure generally relates to gas-phase reactor systems and components thereof. More specifically, examples of the present disclosure relate to gas supply assemblies for gas-phase reactor systems, components of gas supply assemblies, and reactor systems including gas supply assemblies. Background Art
[0002] Gas phase reactor systems, such as those including chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), other cyclic deposition, and / or similar reactors, can be used for applications including depositing and etching materials on substrate surfaces. For example, gas phase reactor systems can be used to deposit and / or etch layers on substrates to form semiconductor devices, flat panel display devices, photovoltaic devices, micro-electromechanical systems (MEMS), and the like.
[0003] A typical gas phase reactor system includes one or more reactors, each reactor including one or more reaction chambers; one or more precursor and / or reactant gas sources fluidly coupled to the one or more reaction chambers; one or more carrier gas sources and / or purge gas sources fluidly coupled to the one or more reaction chambers; one or more gas distribution systems that deliver gases (e.g., one or more precursor / reactant gases and / or one or more carrier gases or purge gases) to the substrate surface within the reaction chamber; and at least one exhaust source fluidly coupled to the one or more reaction chambers.
[0004] The use of precursors that are solid or liquid at room temperature and pressure in a gas phase reactor system may be desirable because such precursors may be relatively easy to transport, may be relatively safe to transport, may provide desirable film and / or deposition properties, and / or may be relatively inexpensive to use. Typically, such precursors are stored in containers that can be coupled to a reactor as part of the reactor system.
[0005] The use of precursors that are liquid or solid at room temperature and pressure may require frequent changes of precursor containers, which may affect the throughput of the reactor system. Additionally or alternatively, it may be difficult to use precursor containers of different sizes. Therefore, improved reactor systems and gas supply assemblies are desired. Summary of the Invention
[0006] Various embodiments of the present disclosure relate to gas supply assemblies for use with gas phase reactors, to reactor systems including one or more of the gas supply assemblies, and to components of the gas supply assemblies. The gas supply assemblies and gas phase reactor systems can be used, for example, to manufacture electronic devices. Although various embodiments of the present disclosure address the shortcomings of previous assemblies and systems in more detail below, in general, various embodiments of the present disclosure provide improved gas supply assemblies and reactor systems that include relatively large precursor source containers, allow relatively easy removal and / or installation of the precursor source containers, and / or allow the use of precursor source containers of different sizes.
[0007] According to at least one embodiment of the present disclosure, a gas supply assembly includes a container, a valve plate, a housing enclosing the container and the valve plate, a gas feedthrough having a first end inside the housing and a second end outside the housing, one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to the interior of the container, and a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. The container can hold a precursor that is solid or liquid at normal temperature and pressure (NTP). The size of the container can vary depending on the application. For example, for use with a solid precursor, the capacity of the container can be greater than 500g or between about 500g and about 2kg, or between about 500g and about 1.75kg, or between about 750g and about 1.5kg; the volume for holding a solid precursor can be between 0.25L and 1L. For use with liquid precursors, the capacity of the container may be greater than 0.5 L or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L. The gas supply assembly may include one or more valve plate leveling devices coupled to (e.g., in contact with) the valve plate. The removable gas line may include one or more sections that are angled relative to each other (e.g., greater than zero and less than 180 degrees or about 60 to about 120 degrees). The gas feedthrough may include a shell; the shell may include one or more heaters embedded within the shell. An exemplary gas supply assembly may include a heater below the container and one or more heater leveling devices coupled to (e.g., in contact with) the heater.
[0008] According to additional embodiments of the present disclosure, a gas supply assembly includes: a container, a valve plate, a housing enclosing the container and the valve plate, a gas feedthrough having a first end inside the housing and a second end outside the housing, a plurality of valves attached to the valve plate, wherein at least one of the plurality of valves is fluidly coupled to the interior of the container, and one or more valve plate leveling devices coupled to the valve plate. The gas supply assembly according to these embodiments may include a removable gas line having a first end coupled to at least one valve and a second end coupled to the gas feedthrough. The container can hold a precursor that is solid or liquid at normal temperature and pressure (NTP). The capacity of the solid precursor container can be greater than 500g or between about 500g and about 2kg, or between about 500g and about 1.75kg, or between about 750g and about 1.5kg; the volume for holding the solid precursor can be between 0.25L and 1L. The capacity of the liquid precursor container can be greater than 0.5 L or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L. The removable gas line can include one or more segments that are angled relative to each other (e.g., greater than zero and less than 180 degrees or about 60 degrees to about 120 degrees). The gas feedthrough can include a shell; the shell can include one or more heaters embedded within the shell. An exemplary gas supply assembly can include a heater below the container and one or more heater leveling devices coupled to the heater (e.g., in contact with the heater).
[0009] According to further exemplary embodiments of the present disclosure, a gas phase reactor system includes one or more gas supply assemblies as described herein.
[0010] According to another embodiment of the present disclosure, an assembly includes a valve plate, one or more valve plate leveling devices coupled to (e.g., in contact with) the valve plate, a base, and a gauge for leveling the valve plate. The gauge can be used to level the valve plate before coupling a container to the valve plate.
[0011] These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments taken in conjunction with the attached figures; the invention not being limited to any particular embodiment disclosed. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] A more complete understanding of exemplary embodiments of the present disclosure can be obtained by referring to the detailed description and claims when considered in conjunction with the following illustrative drawings.
[0013] Figure 1 A reactor system according to an example of the present disclosure is shown.
[0014] Figure 2 A gas supply assembly according to at least one embodiment of the present disclosure is shown.
[0015] Figure 3 and 4 A portion of a gas supply assembly is shown in accordance with at least one embodiment of the present disclosure.
[0016] Figure 5 A removable gas line is shown in accordance with at least one embodiment of the present disclosure.
[0017] Figure 6A and 6B A solid source container according to at least one embodiment of the present disclosure is shown.
[0018] Figure 7 A gas feedthrough in accordance with at least one embodiment of the present disclosure is shown.
[0019] Figure 8 and 9 A leveling device according to another example of the present disclosure is shown.
[0020] Figure 10 Gauges according to further embodiments of the present disclosure are shown.
[0021] Figure 11 A gas supply assembly according to at least another embodiment of the present disclosure is shown.
[0022] Figure 12 Containers according to further examples of the present disclosure are shown.
[0023] Figure 13 A portion of a gas supply assembly according to at least another embodiment of the present disclosure is shown.
[0024] It should be understood that the elements in the figures are illustrated for simplicity and clarity only and are not necessarily drawn to scale. For example, the dimensions of some elements in the figures may be exaggerated relative to other elements to help improve understanding of the embodiments of the present disclosure illustrated. DETAILED DESCRIPTION
[0025] Although certain embodiments and examples are disclosed below, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments and / or uses of the present invention and obvious modifications and equivalents thereof. Therefore, it is intended that the scope of the present invention disclosed should not be limited to the specific disclosed embodiments described below.
[0026] The present disclosure generally relates to gas supply assemblies, components of such assemblies, and reactor systems including one or more gas supply assemblies. The gas supply assemblies and reactor systems described herein can be used to process substrates, such as semiconductor wafers, to form, for example, electronic devices. For example, the assemblies and reactor systems described herein can be used to form or grow epitaxial layers on the surface of a substrate. However, unless otherwise specified, the reactor systems and gas supply assemblies are not limited thereto.
[0027] Turning now to the accompanying drawings, Figure 1 A reactor system 100 according to an example of the present disclosure is shown. The reactor system 100 includes a reaction chamber 102, a gas distribution system 104, a gas supply assembly 106, an exhaust source 108, and a controller 110. In the example shown, the reactor system 100 also includes a second gas source 112.
[0028] The reaction chamber 102 may be or include a reaction chamber suitable for a gas phase reaction. The reaction chamber 102 may be formed of a suitable material, such as quartz. The reactor system 100 may include any suitable number of reaction chambers 102 and may optionally include one or more substrate handling systems. For example, the reaction chamber 102 may include a cross-flow cold wall epitaxial reaction chamber.
[0029] The gas distribution system 104 can be configured to provide one or more precursors, one or more reactants, and / or one or more purge gases and / or carrier gases to the reaction chamber 102. The gas distribution system 104 can be used to meter and control the gas flow rate of the one or more precursors, reactants, purge gases, and / or carrier gases to the reaction chamber 102. For example, the gas distribution system 104 can be used to meter gases from the gas supply assembly 106 and / or the second gas source 112 to the reaction chamber 102, with or without a carrier gas, respectively.
[0030] Gas supply assembly 106 is configured to hold a solid or liquid precursor at NTP and vaporize the solid or liquid precursor to deliver a gas phase of the precursor to reaction chamber 102. Exemplary gas supply assemblies suitable for gas supply assembly 106 are discussed in more detail below.
[0031] The exhaust source 108 may include, for example, one or more vacuum sources. Exemplary vacuum sources include one or more dry vacuum pumps and / or one or more turbomolecular pumps.
[0032] The controller 110 can be configured to perform various functions and / or steps as described herein. The controller 110 can include one or more microprocessors, memory elements, and / or switching elements to perform various functions. Although depicted as a single unit, the controller 110 can alternatively include multiple devices. For example, the controller 110 can be used to control airflow (e.g., by monitoring flow rates and controlling valves), motors, control the flow of coolant into and / or out of cooling pipes or channels of the gas distribution assembly 104, and / or control heaters, such as one or more of the heaters described herein.
[0033] The second gas source 112 may include any suitable material. For example, the second gas source 112 may include a material that is a gas, liquid, or solid at NTP. The material may be used as an etchant, a carrier gas, or as a precursor or reactant in a deposition process.
[0034] Figure 2 A gas supply assembly 200 suitable for use as the gas supply assembly 106 is shown. The gas supply assembly 200 includes a container 202, a valve plate or support plate 204, a housing 206, a gas feedthrough 208, and valves 210-228. The gas supply assembly 200 also includes Figure 3 The removable gas line 302 is shown in FIG.
[0035] exist Figure 6A (Top view) and Figure 6B The container 202 is shown in greater detail in (side view). In the example shown, the container 202 can hold a solid precursor material. Figure 11 and 12 An alternative container suitable for use with a gas supply assembly 106 configured to hold a liquid precursor is shown in FIG.
[0036] The container 202 can be formed from any suitable material. For example, the container 202 can be formed from stainless steel. In other embodiments, the container 202 or components thereof can be formed from a high nickel alloy, aluminum, or titanium. It should be understood that the container 202 or components thereof can be formed from any other material that allows sufficient heat transfer to vaporize the precursor disposed within the source container 202 while being inert or not reacting to any appreciable degree with the precursor or contents within the container 202.
[0037] In the illustrated example, the container 202 includes a base 602 and an interior section 604 having a recessed area 606 formed therein, and a lid 230 that can be removably attached to the base 602. The lid 230 can include a plurality of openings that fluidly couple to one or more of the valves 214, 222, 226.
[0038] The recessed area 606 can be machined directly into the base 602. Alternatively, the recessed area 606 can be formed in one or more trays that are inserted into the base 602. When the lid 230 is removably attached to the base 602, a seal 608 can be provided between the lid 230 and the base 602 to secure the contents of the container 202 therein. In one embodiment, the base 602 and the lid 230 are formed from the same material, such that both have substantially the same thermal conductivity and the same coefficient of thermal expansion. In another embodiment, the base 602 can be formed from a different material than the material used to form the lid 230.
[0039] The seal 608 may be or include an O-ring that is seated in a groove formed in the base 602. In another embodiment, the seal 608 may be formed as a metal gasket or V-shaped seal that is configured to be positioned between the base 602 and the lid 230. The seal 608 may be formed of any shape, size, or configuration sufficient to provide a seal and secure the contents of the container 202 when the lid 230 is attached to the base 602. In an embodiment, the seal 608 is formed of an elastomer, but those skilled in the art will appreciate that the seal 608 may be formed of any other material sufficient to provide a seal, such as, but not limited to, a polymer or a metal.
[0040] The cover 230 and base 602 can be configured to be mechanically attached to each other using, for example, one or more attachment devices (eg, bolts, screws, etc.) In certain embodiments, the cover 230 and base 602 are mechanically attached in an airtight manner.
[0041] The recessed area 606 may include a channel path 610 and one or more pads 612-616, which may include, for example, an inlet recessed pad 616, an outlet recessed pad 612, and an outlet recessed pad 614. The recessed pads 612-616 may be generally triangular recessed areas extending downward from the contact surface 618 of the base 602. The shape of the recessed pads 612-616 may be substantially the same shape and size as the portion of the corresponding filter device (not shown) extending from the lower surface of the cover 230 into the base 602, so that a portion of each filter device is received within the corresponding recessed pad 612-616. The recessed pads 612-616 extend downward from the contact surface 618 to a predetermined depth. In one embodiment, the depth of all recessed pads 612-616 is the same. In another embodiment, the depth of at least one of the recessed pads 612-616 is different from the depth of the others. When the base 602 is filled with precursor, the volume within each recessed pad 612-616 may not be filled with precursor. When carrier gas is introduced into the base 602, for example, by a filter, the carrier gas may contact and be distributed within the inlet recessed pad 616 before traveling through the remainder of the recessed region 606. Because there is preferably no precursor located within any of the recessed pads 612-616, introducing the carrier gas into the inlet recessed pad 616 prevents the carrier gas from directly contacting the precursor and potentially sieving the precursor or causing precursor particles to intermix with the carrier gas. In the illustrated example, each recessed pad 612-616 of the recessed region 606 is fluidly connected by a channel 610 formed in the body 602.
[0042] A channel 610 may extend from the contact surface 608, wherein the channel 610 is a continuous path along which gas may travel between the inlet recessed pad 616 and the outlet recessed pad 612. In another embodiment, the recessed area 610 may not include a recessed pad. The channel 610 may be formed into the body 602 such that the channel 610 has a depth greater than the depth of the recessed pads 612-616. In one embodiment, the depth of the channel 610 is constant along the entire length of the channel 610. In another embodiment, the depth of the channel 610 varies along the length of the channel 610.
[0043] When the container 202 is filled with a liquid or solid precursor material (not shown), the precursor material is preferably disposed only within the channels 610 of the recessed area 606. The channels 610 can be filled to a depth below the bottom surface of the recessed pads 612-616 to prevent or mitigate any precursor material from being disposed within the recessed pads 612-616. In addition, the bottom surface of the outlet recessed pad 612 can be located above the upper surface of the precursor material so that any precursor material particles tend to remain within the channels 610.
[0044] The capacity of the container 202 (e.g., the channel 610) can vary depending on the application. According to examples of the present disclosure, the capacity of the container 202 (e.g., the channel 610) is greater than 500 g, or between about 500 g and about 2 kg, or between about 500 g and about 1.75 kg, or between about 750 g and about 1.5 kg; the volume for holding the solid precursor can be between 0.25 L and 1 L. The depth of the channel 610 can be, for example, greater than 30 mm, greater than 40 mm, or between about 30 mm and about 120 mm, or between about 40 mm and about 80 mm, or between about 50 mm and about 70 mm.
[0045] The valve plate or support plate 204 is configured to hold one or more of the valves 210 - 228 . According to an example of the present disclosure, the valve plate 204 resides above the centerline axis 232 of the gas feedthrough 208 to accommodate the container 202 .
[0046] The valves 210-228 may include any suitable valves, such as controllable valves. For example, the valves 210-228 may be or include solenoid valves.
[0047] According to an exemplary embodiment of the present disclosure, the removable gas line 302 allows the container 202 to be relatively easily and configurably installed within the housing 206. Figure 3-5 , the removable gas line 302 may include a first end 502, a second end 504, and a conduit 506 therebetween. The first end 502 may be configured to fluidically couple to the first end 304 of the gas feedthrough 208. The second end 504 may be configured to couple to one or more valves 210-228, such as to the inlet of the valve 210. The first end 502 may be sealably coupled to the first end 304 using a sealing member such as an O-ring, a metal gasket, or the like. The second end 504 may similarly be sealed to the valve using a sealing member such as an O-ring, a metal gasket, or the like. In addition, the angle between the first end 502 and the conduit 506 may be greater than zero and less than 180 degrees or between about 60 degrees and about 120 degrees. Similarly, the angle between the second end 504 and the conduit 506 may be greater than zero and less than 180 degrees or between about 60 degrees and about 120 degrees.
[0048] The conduit 506 spans at least a portion of the distance between the first end 502 and the second end 504 and is sealably coupled to the first end 502 and the second end 504. The length of the conduit 506 can be selected based on, for example, the size or height of the container 202 (the depth of the container can at least partially determine the capacity of the container and the length of the conduit 506). Thus, the assembly 200 can easily accommodate containers 202 of different sizes. According to examples of the present disclosure, the height of the conduit 506 can range from about 10 mm to about 100 mm, about 25 mm to about 100 mm, about 20 mm to about 80 mm, or about 25 mm to about 50 mm. In the illustrated example, the conduit 506 is coupled to the second end 504 using a coupler 508 and a second conduit 510, the length of which can also vary to accommodate containers 202 of different sizes.
[0049] The housing 206 may be formed of any suitable material. For example, the housing 206 may be formed of stainless steel, titanium, or the like.
[0050] The gas feedthrough 208 includes a first end 304 located inside the housing 206 and a second end 306 located outside the housing 206. Figure 7 , and a second end 702 is shown in FIG. In the example shown, the gas feedthrough 208 includes a coupler 704 to couple the gas feedthrough 208 to, for example, a coupler 236 attached to the housing 206. The gas feedthrough 208 also includes a shell 706 enclosing the tube 708. The gas feedthrough 208 may also include one or more heaters 710 enclosed between the tube 708 and the shell 706.
[0051] The gas supply assembly 200 may include a gas line hood 306 to reduce heat loss in the removable gas line 302 .
[0052] The gas supply assembly 200 may further include one or more valve plate leveling devices 802, 902, such as Figure 8 and 9 In some cases, the valve plate 204 may be leveled using one or more valve plate leveling devices 802, 902 prior to installation of the container 202.
[0053] The valve plate leveling device 802 may include, for example, a fixing pin 804 and a bracket 806 for receiving the fixing pin 804. The bracket 806 may include a threaded area 810 for threadably receiving the fixing pin 804. In addition, an end 812 of the bracket 806 may be coupled to the valve plate 204. The fixing pin 804 may be used to set the leveling of the valve plate 204 in the X direction. When the desired leveling is achieved, the end 808 of the fixing pin 804 may contact the gas feedthrough 208.
[0054] The valve plate leveling device 902 may include a fixing pin 904 and a bracket 906. The bracket 906 may be attached to the valve plate 204. The fixing pin 904 may be threadedly received by a support flange 908, which may be directly or indirectly coupled to the housing 206. The leveling of the valve plate 204 (e.g., in the X-direction) may be adjusted using the fixing pin 904 and then set, for example, by causing an end 910 of the fixing pin 904 to apply a force to the bracket 906 to thereby fix the position of the valve plate 204 in the X-direction.
[0055] Now refer to Figure 10 , shows a gauge 1000 for leveling the valve plate 204 in the Y direction prior to installing a container. Specifically, the gauge 1000 can be used to align the valve plate 204 relative to the heater plate 1002. In the illustrated example, the gauge 1000 includes a first portion 1004 (e.g., a U-shaped bracket) and a second portion 1006 (e.g., another U-shaped bracket). A bubble level 1008 on the heater plate 1002 and a bubble level 1010 on the second portion 1006 can be used for leveling measurements, for example, using one or more heater leveling devices 1012. For example, the leveling of the heater plate 1002 can be adjusted until flat contact between the first portion 1004 and the heater plate 1002 is established.
[0056] Figure 11 Another gas supply assembly 1100 suitable for use with system 100 is shown in accordance with additional embodiments of the present disclosure. Gas supply assembly 1100 is similar to gas supply assembly 200, except that gas supply assembly 1100 is configured to store liquid precursors rather than solid precursors.
[0057] The gas supply assembly 1100 includes a container 1102, a valve plate or support plate 1104, a housing 1106, a gas feedthrough 1108, valves 1110-1122, and a liquid inlet 1124. The gas supply assembly 200 also includes Figure 3 The removable gas line 302 is shown in FIG.
[0058] The container 1102 can be formed from any suitable material. For example, the container 1102 can be formed from, for example, stainless steel, a high nickel alloy, aluminum, titanium, etc. It should be understood that the container 1102 or components thereof can be formed from any other material that is sufficient to allow sufficient heat transfer to vaporize the precursor disposed within the container 1102 while being inert or not reacting to any appreciable extent with the precursor or contents within the container 1102.
[0059] In the illustrated example, the container 1102 includes a base 1202 including an interior section 1204 having a recessed area 1206 formed therein, and a lid 1208 that can be removably attached to the base 1202. The lid 1208 can include a plurality of openings that are fluidly coupled to one or more of the valves 1112, 1120.
[0060] The recessed area 1206 can be machined directly into the base 1202. Additionally or alternatively, the recessed area 1206 can be substantially cylindrical in shape. The capacity of the container 1202 can be greater than 0.5 L or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L.
[0061] A seal 1210 can be provided between the lid 1208 and the base 1202 to secure the contents of the container 1102 therein. In one embodiment, the base 1202 and the lid 1208 are formed from the same material, such that they have substantially the same thermal conductivity and the same coefficient of thermal expansion. In another embodiment, the base 1202 can be formed from a different material than the material used to form the lid 1208.
[0062] The seal 1210 may be or include an O-ring that is seated in a groove 1212 formed (e.g., machined) in the base 1202. In another embodiment, the seal 1210 may be formed as a metal gasket or V-shaped seal configured to be positioned between the base 1202 and the lid 1208. The seal 1210 may be formed of any shape, size, or configuration sufficient to provide a seal and secure the contents of the container 1102 when the lid 1208 is attached to the base 1202. In an embodiment, the seal 1210 is formed of an elastomer, but those skilled in the art will appreciate that the seal 1210 may be formed of any other material sufficient to provide a seal, such as, but not limited to, a polymer or a metal.
[0063] The housing 1106 , gas feedthrough 1108 , and valves 1110 - 1122 may be the same as or similar to the housing 206 , gas feedthrough 208 , and valves 210 - 228 .
[0064] Gas supply assembly 1100 may include the same or similar valve plate leveling apparatus illustrated in connection with gas supply assembly 200. Additionally, gas supply assembly 200 may include a removable gas line, such as removable gas line 302 coupled between valve 1110 and gas feedthrough 1108, for example.
[0065] The gas supply assembly 1100 may also include Figure 13 The assembly may include a stopper 1304 attached to the drip pan 1302.
[0066] The exemplary embodiments of the present disclosure described above do not limit the scope of the present invention, as these embodiments are merely examples of embodiments of the present invention. For example, although illustrated as having a solid precursor source container, some embodiments may not include a solid source precursor container. Any equivalent embodiments are intended to be within the scope of the present invention. In fact, various modifications of the present disclosure beyond those shown and described herein, such as alternative applicable combinations of the described elements, will be readily apparent to those skilled in the art based on the specification. Such modifications and embodiments are also intended to fall within the scope of the appended claims.
Claims
1. A gas supply assembly comprising: container; Valve plate; a valve plate leveling device coupled to the valve plate; a housing enclosing the container and the valve plate; a gas feedthrough having a first end inside the housing and a second end outside the housing; one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to an interior of the container; as well as A removable gas line, the removable gas line comprising: connected to a first end of at least one valve with a first seal; directly connected to the second end of the gas feedthrough with a second seal; a first conduit connected to the first end of a removable gas line; and a second conduit connected between the first conduit and said second end of the removable gas line, wherein the second conduit is perpendicular to the first conduit; wherein the valve plate leveling device comprises a fixing pin and a bracket, the bracket being attached to the valve plate, and the fixing pin being threadably received by a support flange coupled to the housing; and The end of the fixing pin abuts against the bracket to adjust the flatness of the valve plate. 2 . The gas supply assembly of claim 1 , further comprising a cover between the container and the valve plate.
3. The gas supply assembly of claim 1, wherein the container holds a solid precursor. The gas supply assembly according to claim 3 , wherein the capacity of the container is greater than 500 g.
5. A gas supply assembly according to claim 4, wherein the capacity of the container is between 500g and 2kg.
6. The gas supply assembly of claim 4, wherein the capacity of the container is between 500 g and 1.75 kg.
7. The gas supply assembly according to claim 4, wherein: The capacity of the container is between 750g and 1.5kg.
8. The gas supply assembly of claim 1, wherein the container holds a liquid precursor.
9. The gas supply assembly of claim 8, wherein the capacity of the container is greater than 0.5L.
10. The gas supply assembly according to claim 9, wherein The capacity of the container is between 0.5L and 2L. The gas supply assembly of claim 9 , wherein the capacity of the container is between 0.75 L and 2 L.
12. The gas supply assembly of claim 9, wherein the capacity of the container is between 0.75L and 1.5L.
13. The gas supply assembly of claim 1, further comprising a drip pan and a stopper attached to the drip pan.
14. The gas supply assembly of claim 1, wherein an angle between the first end of the removable gas line and the conduit is greater than zero and less than 180 degrees.
15. The gas supply assembly of claim 1, further comprising a coupling between the first and second ends of the removable gas line.
16. The gas supply assembly of claim 1, further comprising a gas line cover covering at least a portion of the removable gas line.
17. The gas supply assembly of claim 1, wherein the gas feedthrough comprises a shell.
18. The gas supply assembly of claim 17, wherein the gas feedthrough further comprises a heater embedded in the housing.
19. A gas supply assembly comprising: container; Valve plate; a housing enclosing the container and the valve plate; a gas feedthrough having a first end inside the housing and a second end outside the housing; a plurality of valves attached to the valve plate, wherein at least one valve of the plurality of valves is fluidly coupled to an interior of the container; as well as one or more valve plate leveling devices coupled to the valve plate, wherein the valve plate leveling devices each include a fixing pin and a bracket, the bracket being attached to the valve plate, and the fixing pin being threadably received by a support flange coupled to the housing; and The end of the fixing pin abuts against the bracket to adjust the flatness of the valve plate.
20. The gas supply assembly of claim 19, further comprising a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough.
21. The gas supply assembly of claim 19, further comprising a heater plate below the container.
22. The gas supply assembly of claim 21, further comprising one or more heater leveling devices coupled to the heater plate.
23. The gas supply assembly of claim 19, further comprising: Gauge for leveling valve discs.
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