Method for preparing sensor core element

Abstract

The present invention relates to a method for preparing a sensor core element. The method for preparing the sensor core element comprises the following steps: providing a sensitive elastomer, the sensitive elastomer comprising an elastic matrix and a sensitive circuit made on the elastic matrix; performing treatments such as equalizing, exposing, developing, vertical filming, and etching on the sensitive elastomer to obtain a sensor core; performing silicon dioxide coating on the sensor core to form a protective film on the surface of the sensor core; using a divalent acid ester solvent to remove the photoresist on the sensor core pad and the silicon dioxide attached to the photoresist to obtain a core element; performing a cleaning treatment on the core element; and performing a drying treatment on the cleaned core element. The use of the above method can avoid the use of highly toxic and environmentally unfriendly hydrofluoric acid and ammonium fluoride in the preparation process of the core element, reduce the damage to human health and the ecological environment during the processing of the core element, and make the preparation of the sensor core element safer.

Description

Technical Field

[0001] The invention relates to the technical field of sensor manufacturing, and in particular to a method for preparing a sensor core element. Background Art

[0002] As a commonly used detection device, sensors are widely used in all walks of life. With the development of economy and technology, people have put forward higher requirements for the processing of sensors, such as higher sensitivity and more environmentally friendly processing. As an important step in sensor processing, the preparation process of sensor core components requires wet etching of pads with hydrofluoric acid. Since hydrofluoric acid is highly toxic and corrosive, the traditional preparation method of sensor core components is extremely environmentally unfriendly and causes great harm to the human body and the environment. Summary of the invention

[0003] Based on this, it is necessary to provide a safer method for preparing sensor core components in view of the problem that the traditional method for preparing sensor core components has great harm to human body and environment.

[0004] A method for preparing a sensor core element comprises the steps of:

[0005] A sensitive elastic body is provided, wherein the sensitive elastic body comprises an elastic substrate and a sensitive circuit fabricated on the elastic substrate;

[0006] Performing coating, exposure, development and film erection processing on the sensitive elastic body to obtain a sensor core body;

[0007] Performing silicon dioxide coating on the sensor core to form a protective film on the surface of the sensor core;

[0008] Using a divalent acid ester solvent to remove the photoresist on the sensor core pad and the silicon dioxide attached to the photoresist to obtain a core element;

[0009] Cleaning the core element;

[0010] The cleaned core element is dried.

[0011] In some embodiments, before the step of performing homogenization treatment on the sensitive elastomer, the following steps are further included:

[0012] Mixing an auxiliary resin in a linear phenolic resin positive photoresist to obtain a photoresist; the auxiliary resin has a mass percentage of 1% to 3.5%;

[0013] The performance of the auxiliary resin is not affected during pre-baking, post-baking, film erection and development.

[0014] In some embodiments, the step of coating the sensor core with silicon dioxide to form a protective film on the surface of the sensor core is:

[0015] At an ambient temperature of 150 degrees Celsius to 200 degrees Celsius, the sensor core is coated with silicon dioxide so that the auxiliary resin expands and bulges.

[0016] In some of the embodiments, the expansion coefficient of the auxiliary resin is 200% to 250%.

[0017] In some embodiments, the step of coating the sensor core with silicon dioxide to form a protective film on the surface of the sensor core is:

[0018] The sensor core is coated with silicon dioxide using a vacuum coating machine.

[0019] In some embodiments, the step of removing the photoresist on the pad of the sensor core and the silicon dioxide attached to the photoresist by using a divalent acid ester solvent is:

[0020] The sensor core is placed in the dibasic acid ester solvent in a soaking container for soaking, and the dibasic acid ester solvent is stirred or shaken.

[0021] In some embodiments, the step of cleaning the core element includes:

[0022] Using anhydrous ethanol to soak and wash the core element;

[0023] The core element after immersion is rinsed with ultrapure water.

[0024] In some embodiments, the step of drying the cleaned core element includes:

[0025] Using inert gas to dry water stains on the surface of the core element;

[0026] The dried core element is dried in an oven.

[0027] In some embodiments, after the step of drying the cleaned core element, the step further includes:

[0028] The dried core element is stored in a sealed environment with constant humidity and temperature.

[0029] In some embodiments, the step of storing the dried core element in a sealed environment with constant humidity and temperature is:

[0030] The dried core element is stored in a constant temperature and humidity sealed nitrogen cabinet.

[0031] In the preparation method of the sensor core element, a divalent acid ester solvent is used to dissolve the pad position to remove the photoresist on the pad position and the silicon dioxide attached to the photoresist. Compared with the method of wet etching the pad position with hydrofluoric acid in the prior art, the divalent acid ester used in the present application has very low toxicity and is very easy to degrade, and is a relatively environmentally friendly material. Therefore, the application of the preparation method of the sensor core element can avoid the use of highly toxic and environmentally damaging hydrofluoric acid and ammonium fluoride in the preparation process of the sensor core element, and use divalent acid esters that are more friendly to the human body and the environment, which is more friendly to human health and the ecological environment, making the preparation of the sensor core element safer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a flow chart of a method for preparing a sensor core element in a preferred embodiment of the present invention;

[0033] Figure 2 for Figure 1 Flow chart of step S500 in the method for preparing the sensor core element;

[0034] Figure 3 for Figure 1 FIG. 1 is a flow chart of step S600 in the method for preparing a sensor core element. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0037] When describing positional relationships, unless otherwise specified, when an element is referred to as being "on" another element, it can be directly on the other element or there can be an intermediate element. It is also understood that when an element is referred to as being "between" two elements, it can be the only one between the two elements, or there can be one or more intermediate elements.

[0038] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0039] As described in the background technology, the preparation of the core element is very important in the sensor processing process. In the preparation process of the core element, hydrofluoric acid and ammonium fluoride, which are extremely unfriendly to the human body and the environment, need to be used to etch the pad position to remove the silicon dioxide at the pad position. Therefore, the traditional sensor preparation process is very harmful to the human body and the environment. To this end, the applicant proposes a method for preparing a sensor core element that is relatively safe for the human body and the environment.

[0040] like Figure 1 As shown, the method for preparing the sensor core element in the preferred embodiment of the present invention includes steps S100 to S600.

[0041] Step S100, providing a sensitive elastic body. The sensitive elastic body includes an elastic substrate and a sensitive circuit fabricated on the elastic substrate.

[0042] Among them, the elastic matrix has reversible deformation properties, and the sensitive circuit will generate an electrical signal when the elastic matrix is ​​deformed to realize the measurement function of the sensor.

[0043] Step S200 , performing processes such as coating, exposure, development, film erection, and etching on the sensitive elastic body to obtain a sensor core.

[0044] Specifically, the sensitive elastomer is subjected to a photoresist treatment to form a photoresist layer on the surface of the sensitive elastomer, thereby protecting the sensitive circuit during the processes of exposure, development, film erection, etching, etc.

[0045] After step S200, the method further includes the step of mixing an auxiliary resin into the linear phenolic resin positive photoresist to obtain a photoresist. The auxiliary resin has a mass percentage content of 1% to 3.5%. The performance of the auxiliary resin is not affected during pre-baking, post-baking, film erection and development.

[0046] Specifically, the auxiliary resin is added to the linear phenolic resin positive photoresist and mixed evenly to obtain the photoresist. Before executing step S300, the photoresist is coated on the surface of the sensitive elastomer through a uniform coating process, and exposure, development, vertical film and other processes are completed, and only the photoresist on the pad is retained.

[0047] Step S300 , coating the sensor core with silicon dioxide to form a protective film on the surface of the sensor core.

[0048] Specifically, the sensor core is coated with silicon dioxide using a vacuum coating machine, that is, the sensor core is placed in the vacuum coating machine to perform sputtering coating of silicon dioxide, thereby forming a protective film on the surface of the sensor core.

[0049] Step S400, using a divalent acid ester solvent to remove the photoresist on the sensor core pad and the silicon dioxide attached to the photoresist to obtain a core element. Therefore, after executing step S400, the photoresist on the sensor core pad and the silicon dioxide attached to the photoresist layer can be removed.

[0050] Among them, divalent acid esters have very low toxicity and are extremely easy to degrade, making them a material that is relatively friendly to the ecological environment and the human body.

[0051] Specifically, the sensor core is placed in a dibasic acid ester solvent in a soaking container for soaking, and the dibasic acid ester solvent is stirred or shaken to quickly remove the photoresist on the sensor core soaked in the dibasic acid ester solvent and the silicon dioxide attached to the photoresist.

[0052] Step S500, cleaning the core element. Thus, after the core element is cleaned, the divalent acid ester solvent and other impurities attached to the surface of the core element can be removed.

[0053] Specifically, Figure 2 As shown, step S500 includes step S510 and step S520.

[0054] Step S510, using anhydrous ethanol to soak the core element to quickly wash away the divalent acid ester solvent and other impurities attached to the surface of the core element.

[0055] Step S520 , using ultrapure water to rinse the washed core element to wash away the residual divalent ester solvent, anhydrous ethanol and residual impurities on the surface of the core element.

[0056] Therefore, step S500 is configured as step S510 and step S520 to improve the cleaning effect on the core element.

[0057] Step S600, drying the cleaned core element. Thus, after the core element is dried, the surface of the core element can be kept dry to facilitate subsequent processing, transportation, storage and use.

[0058] Specifically, Figure 3 As shown, step S600 includes step 610 and step S620.

[0059] Step S610, using an inert gas to blow dry the water stains on the surface of the core element. The inert gas is a gas with relatively high chemical stability such as nitrogen. Using an inert gas to blow dry the water stains on the surface of the core element can not only improve the dryness of the surface of the core element, but also avoid chemical reactions such as oxidation during the drying process of the surface of the core element, thereby improving the product quality of the sensor.

[0060] Step S620, using an oven to dry the dried core element. After the surface of the core element is dried with inert gas, only water stains on the surface of the core element can be removed. At this time, the dryness of the surface of the core element cannot meet the requirements of its storage and use. Step S620 is performed after step S610 to further improve the dryness of the surface of the core element.

[0061] Thus, by performing the above steps S100 to S600, the core element of the sensor can be obtained. After performing step S400, the photoresist on the pad and the silicon dioxide attached to the photoresist can be quickly dissolved to expose the pad for subsequent processing.

[0062] Compared with the prior art which uses highly toxic and environmentally damaging hydrofluoric acid and ammonium fluoride to dissolve the silicon dioxide on the pad, the use of the above-mentioned sensor core element preparation method can avoid the use of hydrofluoric acid and ammonium fluoride in the sensor core element preparation process, thereby reducing the damage to human health and the ecological environment in the core element preparation process, and effectively improving the safety performance in the core element preparation process.

[0063] In some embodiments, step S300 is: at an ambient temperature of 150 degrees Celsius to 200 degrees Celsius, the sensor core is coated with silicon dioxide so that the auxiliary resin expands and bulges. Specifically, the expansion coefficient of the auxiliary resin is 200% to 250%, so during the silicon dioxide coating process, the special resin in the photoresist expands by 200% to 250% at a temperature of 150 degrees Celsius to 200 degrees Celsius.

[0064] Therefore, when the sensor core is coated with silicon dioxide, the temperature of the sensor core can be maintained at 150 degrees Celsius to 200 degrees Celsius, and the auxiliary resin in the photoresist layer will expand and bulge in an environment of 150 degrees Celsius to 200 degrees Celsius, thereby causing the protective film at the pad position to become loose and forming a discontinuous film with pinholes. When step S400 is executed, the divalent acid ester solvent can penetrate into the gaps in the protective film to dissolve the underlying photoresist, thereby facilitating the removal of the photoresist at the pad position and the silicon dioxide attached to the photoresist, thereby greatly improving the removal effect of the photoresist at the pad position and the silicon dioxide attached to the photoresist.

[0065] In some embodiments, after step S600, the step of storing the dried core element in a sealed environment with constant temperature and humidity is further included. The temperature and humidity in the sealed environment for storing the core element are maintained within a constant temperature range and humidity range. For example, in order to ensure the quality of the core element, the temperature of the sealed environment can be maintained at 20 degrees Celsius to 25 degrees Celsius, and the humidity can be maintained at about 45%.

[0066] Specifically, the dried core components are stored in a sealed nitrogen cabinet with constant temperature and humidity. The sealed nitrogen cabinet with constant temperature and humidity provides a constant temperature and humidity and closed storage environment for the storage of the core components, so as to avoid chemical reactions such as oxidation when some parts of the core components come into contact with air during the storage process, thereby affecting the quality of the core components.

[0067] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a sensor core element, characterized in that: Includes steps: A sensitive elastic body is provided, wherein the sensitive elastic body comprises an elastic substrate and a sensitive circuit fabricated on the elastic substrate; An auxiliary resin is mixed in a linear phenolic resin positive photoresist to obtain a photoresist; the weight percentage of the auxiliary resin is 1% to 3.5%; wherein the use performance of the auxiliary resin is not affected during pre-baking, post-baking, film hardening and development; The sensitive elastic body is subjected to coating, exposure, development, hardening and etching processes to obtain a sensor core body; The sensor core is coated with silicon dioxide to form a protective film on the surface of the sensor core; specifically, the sensor core is coated with silicon dioxide at an ambient temperature of 150 degrees Celsius to 200 degrees Celsius, so that the auxiliary resin expands and bulges; Using a divalent acid ester solvent to remove the photoresist on the sensor core pad and the silicon dioxide attached to the photoresist to obtain a core element; Cleaning the core element; The cleaned core element is dried.

2. The method for preparing a sensor core element according to claim 1, characterized in that: The expansion coefficient of the auxiliary resin is 200% to 250%.

3. The method for preparing a sensor core element according to claim 1, characterized in that: The step of coating the sensor core with silicon dioxide to form a protective film on the surface of the sensor core is as follows: The sensor core is coated with silicon dioxide using a vacuum coating machine.

4. The method for preparing a sensor core element according to claim 1, characterized in that: The steps of removing the photoresist on the pad of the sensor core and the silicon dioxide attached to the photoresist by using a divalent acid ester solvent are as follows: The sensor core is placed in the dibasic acid ester solvent in a soaking container for soaking, and the dibasic acid ester solvent is stirred or shaken.

5. The method for preparing a sensor core element according to claim 1, characterized in that: The step of cleaning the core element comprises: Using anhydrous ethanol to soak and wash the core element; The core element after immersion is rinsed with ultrapure water.

6. The method for preparing a sensor core element according to claim 1, characterized in that: The step of drying the cleaned core element comprises: Using inert gas to dry water stains on the surface of the core element; The dried core element is dried in an oven.

7. The method for preparing a sensor core element according to claim 1, characterized in that: After the step of drying the cleaned core element, the method further comprises the steps of: The dried core element is stored in a sealed environment with constant humidity and temperature.

8. The method for preparing a sensor core element according to claim 7, characterized in that: The steps of storing the dried core element in a sealed environment with constant humidity and temperature are as follows: The dried core element is stored in a constant temperature and humidity sealed nitrogen cabinet.

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