Heat spreader

Abstract

A vapor chamber is provided for containing a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover is joined to the first cover and together form a liquid-tight space for containing the cooling fluid. The first capillary structure is located within the liquid-tight space and is stacked on the first cover. The second capillary structure is located within the liquid-tight space and is stacked on the first capillary structure. The second capillary structure is different from the first capillary structure, and the projection of the second capillary structure onto the first cover is smaller than the projection of the first capillary structure onto the first cover.

Description

Technical Field

[0001] This invention relates to a heat spreader, and more particularly to a heat spreader with a composite capillary structure. Background Technology

[0002] The technical principle of a vapor chamber is similar to that of a heat pipe, but the heat conduction method differs. A heat pipe uses one-dimensional linear heat conduction, while heat in a vapor chamber is conducted over a two-dimensional surface, resulting in higher efficiency. Specifically, a vapor chamber mainly consists of a cavity and a capillary structure. The cavity contains a hollow chamber for filling with a working fluid. The capillary structure is arranged within the hollow chamber. The heated portion of the cavity is called the evaporation zone. The heat dissipation portion is called the condensation zone. The working fluid absorbs heat and vaporizes in the evaporation zone, rapidly expanding throughout the cavity. In the condensation zone, it releases heat and condenses into a liquid state. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a cooling cycle.

[0003] However, with the trend towards lighter, thinner, shorter, and smaller electronic products, vapor chambers also need to be redesigned from their traditional square shape to avoid contact with other electronic components, resulting in irregular shapes. If the vapor chamber has narrow sections, when operating against gravity (i.e., the point where the vapor chamber contacts the heat source is on the upper side of the vapor chamber), the working fluid will accumulate in the narrow sections due to the small cross-sectional area of ​​the capillary structures within them, or it will be difficult to pass through the narrow sections and flow back to the point where the vapor chamber contacts the heat source. This will cause the vapor chamber to fail in heat dissipation. Summary of the Invention

[0004] The present invention provides a heat exchanger to improve the cooling circulation capability of the heat exchanger.

[0005] An embodiment of the present invention discloses a heat spreader for containing a cooling fluid. The heat spreader includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover is joined to the first cover and together form a liquid-tight space for containing the cooling fluid. The first capillary structure is located within the liquid-tight space and is stacked on the first cover. The second capillary structure is located within the liquid-tight space and is stacked on the first capillary structure. The second capillary structure is different from the first capillary structure, and the projection of the second capillary structure onto the first cover is smaller than the projection of the first capillary structure onto the first cover.

[0006] Another embodiment of the present invention discloses a heat spreader for containing a cooling fluid. The heat spreader includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first capillary structure are joined to form a liquid-tight space for containing the cooling fluid. The first capillary structure is located within the liquid-tight space and is stacked on the first cover. The second capillary structure is located within the liquid-tight space and is stacked on the first capillary structure, and the water return capacity of the second capillary structure is greater than that of the first capillary structure.

[0007] According to the vapor chamber of the above embodiment, through the composite first and second capillary structures, when the vapor chamber is used vertically and the horizontal height of the evaporation zone is higher than that of the condensation zone, or when the distance between the evaporation zone and the condensation zone is large, the cooling fluid in the vapor chamber will vaporize into gas after absorbing the heat energy generated by the heat source and flow to the condensation zone. When the gas in the condensation zone cools down and liquefies back into liquid, the liquid in the condensation zone can be drawn back to the evaporation zone with the assistance of the first and second capillary structures. In this way, the return flow rate of the liquid in the condensation zone can be increased, thereby improving the heat dissipation capacity of the vapor chamber for the heat source.

[0008] The foregoing description of the invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of the invention, and to provide a further explanation of the scope of protection of the patent application claims. Attached Figure Description

[0009] Figure 1 This is a perspective view of the heat spreader according to the first embodiment of the present invention.

[0010] Figure 2 for Figure 1 A three-dimensional view of the heat spreader from another perspective.

[0011] Figure 3 for Figure 1 A plan view showing the removal of the second cover of the heat spreader.

[0012] Figure 4 for Figure 1 Cross-sectional view.

[0013] Figure 5 This is a cross-sectional view of the second embodiment of the present invention.

[0014] Figure 6 This is a plan view of the second cover of the heat spreader plate removed according to the third embodiment of the present invention.

[0015] Figure 7 This is a plan view of the second cover of the heat spreader plate removed according to the fourth embodiment of the present invention.

[0016] Figure 8This is a plan view of the second cover of the heat spreader plate removed according to the fifth embodiment of the present invention.

[0017] Figure 9 This is a plan view of the second cover of the heat spreader plate removed according to the sixth embodiment of the present invention.

[0018] Figure 10 This is a plan view of the second cover of the heat spreader plate removed according to the seventh embodiment of the present invention.

[0019] Figure 11 This is a plan view of the second cover of the heat spreader plate removed according to the eighth embodiment of the present invention.

[0020] Figure 12 This is a plan view of the second cover of the heat spreader plate removed according to the ninth embodiment of the present invention.

[0021] Figure 13 This is a plan view of the second cover of the heat spreader plate in the tenth embodiment of the present invention after removal.

[0022] Figure 14 This is a plan view of the second cover of the heat spreader plate removed according to the eleventh embodiment of the present invention.

[0023] Figure 15 This is a plan view of the second cover of the heat spreader plate removed according to the twelfth embodiment of the present invention.

[0024] In the attached figures, the following labels are used:

[0025] 10... Heat exchanger plate

[0026] 100, 100f, 100g, 100h, 100i, 100j... First cover

[0027] 110...Heat source setting surface

[0028] 200...Second cover

[0029] 250... outer sealing part

[0030] 250'... Joint

[0031] 260...Inner sealing part

[0032] 260'...Joint

[0033] 270... Support column

[0034] 300...First capillary structure

[0035] 400, 400a, 400b, 400c, 400d, 400e, 400f, 400g, 400h, 400i, 400j... Second capillary structure

[0036] 410, 410c, 410f, 410h... First bending section

[0037] 420, 420c, 420f, 420h... Second bending section

[0038] 430, 430c, 430f, 430h... extensions

[0039] 440c, 440h... bridging section

[0040] 460d, 460e, 460i, 460j... curved sections

[0041] 470d, 470e, 470i, 470j, 470k... (Extended series)

[0042] 500... Hollowed-out section

[0043] C... range

[0044] S...Liquid-tight space

[0045] A1...Evaporation Zone

[0046] A2...Condensation Zone

[0047] P1, P2... Projection

[0048] W1, W2... Flow channel width Detailed Implementation

[0049] Please see Figures 1 to 4 . Figure 1 This is a perspective view of the heat spreader according to the first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional view of the heat spreader from another perspective. Figure 3 for Figure 1 A plan view showing the removal of the second cover of the heat spreader. Figure 4 for Figure 1 Cross-sectional view.

[0050] The heat spreader 10 in this embodiment is used to contain a cooling fluid (not shown in the figure). The heat spreader 10 includes a first cover 100, a second cover 200, a first capillary structure 300 and a second capillary structure 400.

[0051] The first cover 100 and the second cover 200 are made of materials such as oxygen-free copper, silicon-containing alloy copper, or phosphorus-containing alloy copper plates. The second cover 200 and the first cover 100 are joined together to form a liquid-tight space S, which is used to contain cooling fluid (not shown in the figure).

[0052] In this embodiment, the heat exchange plate 10 may also include a plurality of support columns 270, which support the first cover 100 and the second cover 200. In addition to maintaining the distance between the first cover 100 and the second cover 200, the support columns 270 can also increase the structural strength of the heat exchange plate 10.

[0053] In this embodiment, the heat spreader 10 further includes a perforated portion 500. The perforated portion 500 is, for example, a slot, and extends through the first cover 100 and the second cover 200. However, the perforated portion 500 does not affect the liquid-tight properties between the first cover 100 and the second cover 200. Furthermore, the joined first cover 100 and second cover 200 have an outer sealing portion 250 and an inner sealing portion 260. The outer sealing portion 250 is the outer contour jointly formed by the first cover 100 and the second cover 200, while the inner sealing portion 260 surrounds the perforated portion 500. In addition, the contour of the outer sealing portion 250 may be irregularly serrated, curved, or uneven to avoid other electronic components, but it is not limited to this. In other embodiments, the outer sealing portion 250 may also be a regular shape such as rectangular, elliptical, or circular. Similarly, in this embodiment, the inner sealing portion 260 is irregularly serrated, curved, or uneven, but is not limited thereto. In other embodiments, the inner sealing portion 260 may also be a regular shape such as rectangular or elliptical.

[0054] In this embodiment, the liquid-tight space S has an evaporation zone A1 and a condensation zone A2. In order to avoid the requirements of other electronic components, it has a hollowed-out portion 500 and an irregular contour design of the outer sealing portion 250, so that the flow channel width W2 of the condensation zone A2 in this embodiment is smaller than the flow channel width W1 of the evaporation zone A1.

[0055] In this embodiment, the first cover 100 has a heat source mounting surface 110 corresponding to the evaporation zone A1, and the heat source mounting surface 110 is used to thermally contact a heat source (not shown in the figure).

[0056] Both the first capillary structure 300 and the second capillary structure 400 are located within the liquid-tight space S. The first capillary structure 300 is stacked on the first cover 100, and the second capillary structure 400 is stacked on the first capillary structure 300. The second capillary structure 400 is different from the first capillary structure 300, and the orthogonal projection of the second capillary structure 400 onto the first cover 100 is smaller than the orthogonal projection of the first capillary structure 300 onto the first cover 100. Orthogonal projection, also known as orthographic projection, means that the projection lines of the first capillary structure 300 or the second capillary structure 400 onto the first cover 100 are parallel to each other and perpendicular to the surface of the first cover 100. In this embodiment, the orthogonal projections of the first capillary structure 300 and the second capillary structure 400 onto the first cover 100 are used for illustration, but this is not a limitation. In other embodiments, the oblique projections of the first and second capillary structures onto the first cover can also be used for illustration. The so-called oblique projection refers to the projection line of the first capillary structure or the second capillary structure onto the first cover 100 maintaining an acute or obtuse angle with the first cover.

[0057] In this embodiment, the first capillary structure 300 is exemplified by a metal mesh, and the second capillary structure 400 is exemplified by a powder sintered body, but this is not a limitation. The second capillary structure 400 differs from the first capillary structure 300, for example, in that the material of the second capillary structure 400 differs from that of the first capillary structure 300. For example, the material of the second capillary structure 400 is copper, while the material of the first capillary structure 300 is gold. Alternatively, the materials of the second capillary structure 400 and the first capillary structure 300 are alloys of different compositions. Furthermore, the second capillary structure 400 differs from the first capillary structure 300, for example, in that the form of the second capillary structure 400 differs from that of the first capillary structure 300. For example, the types of capillary structures differ, such as the first capillary structure 300 being one of a grooved, mesh (woven), fiber, or sintered type, and the second capillary structure 400 being another of the same type. Alternatively, the capillary structures may be of the same type but have different porosity levels. For example, both the first capillary structure 300 and the second capillary structure 400 are mesh (woven), but the pore size of the first capillary structure 300 is larger than that of the second capillary structure 400.

[0058] In this embodiment, the first capillary structure 300 is distributed throughout the entire liquid-tight space S. The second capillary structure 400 is distributed in a localized portion of the liquid-tight space S, with one side of the second capillary structure 400 located in the condensation zone A2 and the other side extending towards the evaporation zone A1, such that the orthogonal projection of the second capillary structure 400 onto the first cover 100 is smaller than the orthogonal projection of the first capillary structure 300 onto the first cover 100, but this is not a limitation. In other embodiments, the first capillary structure 300 may not be distributed throughout the entire liquid-tight space S. That is, both the first capillary structure 300 and the second capillary structure 400 are distributed in localized portions of the liquid-tight space S, as long as the orthogonal projection of the second capillary structure 400 onto the first cover 100 is smaller than the orthogonal projection of the first capillary structure 300 onto the first cover 100.

[0059] In this embodiment, the second capillary structure 400, in its orthogonal projection onto the first cover 100, lies outside the range C of the heat source mounting surface 110 of the first cover 100, but is substantially adjacent to the heat source mounting surface 110 of the first cover 100. Specifically, the second capillary structure 400 is annular and has a first curved segment 410 and a second curved segment 420 opposite to each other, as well as two opposite extension segments 430. The first curved segment 410 is located in the condensation zone A2, and the second curved segment 420 is located in the evaporation zone A1. The second curved segment 420, in its orthogonal projection onto the first cover 100, lies outside the range C of the heat source mounting surface 110 of the first cover 100, but is substantially adjacent to the heat source mounting surface 110 of the first cover 100. The two extension segments 430 are respectively connected to opposite sides of the first curved segment 410 and opposite sides of the second curved segment 420. In this way, the cooling fluid from the condensation zone A2 can be returned to the heat source setting surface 110 adjacent to the evaporation zone A1 through the second capillary structure 400, and then the cooling fluid can be returned to the heat source setting surface 110 of the evaporation zone A1 through the first capillary structure 300, thereby improving the heat dissipation capacity of the heat spreader 10 for the heat source.

[0060] In this embodiment, the second capillary structure 400 is annular and located around the periphery of the hollow portion 500. In other words, the second capillary structure 400 surrounds the hollow portion 500. Furthermore, the second capillary structure 400 is relatively close to the inner sealing portion 260 (see...). Figure 1 (As shown) the joint 260' of the first cover 100, so that the second capillary structure 400 is biased inside the liquid-tight space S. "Closer to" refers to the second capillary structure 400 and the inner sealing portion 260 (see...). Figure 1 The spacing of the joint 260' belonging to the first cover 100 (as shown) is much smaller than that of the outer sealing part 250 (see...). Figure 1(As shown) This belongs to the joint 250' of the first cover 100. In this way, the gap on the outside of the liquid-tight space S can be maximized, while the outer gap is reserved for vapor flow. That is to say, the second capillary structure 400 is biased to the inside of the liquid-tight space S, which can avoid the second capillary structure 400 from dividing the liquid-tight space S and thus minimize the reduction of the smoothness of vapor flow on the outside of the liquid-tight space S.

[0061] In addition, such as Figure 4 As shown, in this embodiment, the second capillary structure 400 is separated from the second cover 200. That is, the second capillary structure 400 is not in thermal contact with the second cover 200.

[0062] When the vapor chamber 10 is used vertically and the horizontal height of the evaporation zone A1 is higher than that of the condensation zone A2, or when the distance between the evaporation zone A1 and the condensation zone A2 is large, the cooling fluid in the vapor chamber 10 will vaporize into gas after absorbing the heat energy generated by the heat source and flow towards the condensation zone A2. After the gas in the condensation zone A2 cools down and liquefies back into liquid, the liquid in the condensation zone A2 can be drawn back to the evaporation zone A1 with the assistance of the first capillary structure 300 and the second capillary structure 400. In this way, the return flow rate of the liquid in the condensation zone A2 can be increased, thereby improving the heat dissipation capacity of the vapor chamber 10 for the heat source.

[0063] In this embodiment, the manufacturing process of the heat spreader 10 involves first sintering the first capillary structure 300 on the first cover 100. Then, the pre-sintered second capillary structure 400 is stacked on the first capillary structure 300. Next, the first cover 100 and the second cover 200 are welded together to bond them. However, the second capillary structure 400 does not necessarily need to be pre-sintered. In other embodiments, the material of the second capillary structure 400 can be placed on the first capillary structure 300 first, and then the sintering process can be performed directly on the first capillary structure 300.

[0064] In the above embodiments, the second capillary structure 400 is separated from the second cover 200, but this is not a limitation. In subsequent embodiments, the same name and reference numerals represent similar or identical structures, so they will not be described again; only the differences will be explained below. Please refer to... Figure 5 . Figure 5 This is a cross-sectional view of the second embodiment of the present invention. In this embodiment, the second capillary structure 400a is in thermal contact with the second cover 200 to enhance the thermal conductivity between the first cover 100 and the second cover 200.

[0065] However, the aforementioned second capillary structure 400 is located closer to the inner sealing portion 260 (see...). Figure 1 The design of the joint 260' (shown) belonging to the first cover 100 is not intended to limit the invention. Please refer to... Figure 6 . Figure 6 This is a plan view of the second cover of the heat spreader plate removed according to the third embodiment of the present invention. In this embodiment, the second capillary structure 400b is changed to be closer to the outer sealing portion 250 (see...). Figure 1 (As shown) This belongs to the joint 250' of the first cover 100. In this way, the void inside the liquid-tight space S can be maximized, and the void inside can be used for vapor flow. That is, the second capillary structure 400b is offset to the outside of the liquid-tight space S, which can avoid the second capillary structure 400b dividing the liquid-tight space S and minimize the reduction of the smoothness of vapor flow inside the liquid-tight space S.

[0066] In the above embodiments, a portion of the second capillary structure 400, when projected orthogonally onto the first cover 100, lies outside the range C of the heat source mounting surface 110 of the first cover 100, but is not limited thereto. Please refer to... Figure 7 . Figure 7 This is a plan view of the heat spreader plate of the fourth embodiment of the present invention after the second cover has been removed. In this embodiment, a portion of the second capillary structure 400c is located within the range C of the heat source mounting surface 110 of the first cover 100 in its orthogonal projection. Specifically, the second capillary structure 400 is annular and has a first curved segment 410c and a second curved segment 420c, two opposite extension segments 430c, and a bridging segment 440c. The first curved segment 410c is located in the condensation zone A2, and the second curved segment 420c is located in the evaporation zone A1. The second curved segment 420c is located outside the range C of the heat source mounting surface 110 of the first cover 100 in its orthogonal projection. The two extension segments 430c are respectively connected to opposite sides of the first curved segment 410c and opposite sides of the second curved segment 420c. One end of the bridging section 440c is connected to the second bending section 420c, and the other end of the bridging section 440c is located within the range C of the heat source setting surface 110 of the first cover 100, where its orthogonal projection lies. In this way, the cooling fluid from the condensation zone A2 can be directly returned to the heat source setting surface 110 located in the evaporation zone A1 via the second capillary structure 400c, thereby further enhancing the heat dissipation capacity of the heat spreader for the heat source.

[0067] In the above embodiments, the second capillary structure 400 is annular, but this is not a limitation. Please refer to [link / reference]. Figure 8 and Figure 9 . Figure 8 This is a plan view of the second cover of the heat spreader plate removed according to the fifth embodiment of the present invention. Figure 9 This is a plan view of the second cover of the heat spreader plate removed according to the sixth embodiment of the present invention. Figure 8As shown, in this embodiment, the second capillary structure 400d is U-shaped and has a curved section 460d and two opposing extension sections 470d. The curved section 460d is located in the condensation zone A2. The two extension sections 470d are respectively connected to opposite sides of the curved section 460d and extend towards the evaporation zone A1. The ends of the two extension sections 470d away from the curved section 460d are located within the range C of the heat source mounting surface 110 of the first cover 100 in their orthogonal projection on the first cover 100. Figure 9 As shown, the second capillary structure 400e is U-shaped and has a curved section 460e and two opposing extension sections 470e. The curved section 460e is located in the condensation zone A2. The two extension sections 470e are respectively connected to the opposite sides of the curved section 460e and extend toward the evaporation zone A1. The ends of the two extension sections 470e away from the curved section 460e are located outside the range C of the heat source setting surface 110 of the first cover 100 in the orthogonal projection of the first cover 100, but are substantially adjacent to the heat source setting surface 110 of the first cover 100.

[0068] In the above embodiment, the heat spreader 10 has a perforated portion 500 (see...). Figure 1 The design is permissible, but not limited to. The following embodiments do not include the cutout portion 500. Please refer to... Figure 10 , Figure 10 This is a plan view of the heat spreader plate of the seventh embodiment of the present invention after the second cover has been removed. In this embodiment, the orthogonal projection of the second capillary structure 400f onto the first cover 100f is outside the range C of the heat source mounting surface 110 of the first cover 100, but substantially adjacent to the heat source mounting surface 110 of the first cover 100. Specifically, the second capillary structure 400f is annular and has a first curved segment 410f and a second curved segment 420f, and two opposing extension segments 430f. The first curved segment 410f is located in the condensation zone A2, and the second curved segment 420f is located in the evaporation zone A1. The orthogonal projection of the second curved segment 420f onto the first cover 100 is outside the range C of the heat source mounting surface 110f of the first cover 100, but substantially adjacent to the heat source mounting surface 110 of the first cover 100. The two extension segments 430f are respectively connected to the opposite sides of the first curved segment 410 and the opposite sides of the second curved segment 420f. In this way, the cooling fluid from the condensation zone A2 can be returned to the heat source setting surface 110 adjacent to the evaporation zone A1 through the second capillary structure 400, and then the cooling fluid can be returned to the heat source setting surface 110 of the evaporation zone A1 through the first capillary structure 300, thereby improving the heat dissipation capacity of the heat spreader 10 for the heat source.

[0069] Please see Figure 11 , Figure 11 This is a plan view of the second cover of the heat spreader plate removed according to the eighth embodiment of the present invention.

[0070] In this embodiment, the second capillary structure 400g is changed to be closer to the outer sealing portion 250 (see...). Figure 1 (As shown) is the joint 250' of the first cover body 100g. In this way, the void inside the liquid-tight space S can be maximized, and the void inside can be used for vapor flow. That is, the second capillary structure 400g is biased to the outside of the liquid-tight space S, which can avoid the second capillary structure 400g dividing the liquid-tight space S and minimize the reduction of the smoothness of vapor flow inside the liquid-tight space S.

[0071] Please see Figure 12 , Figure 12 This is a plan view of the second cover of the heat spreader plate removed according to the ninth embodiment of the present invention.

[0072] In this embodiment, a portion of the second capillary structure 400h is located within the range C of the heat source mounting surface 110 of the first cover 100h in its orthogonal projection. Specifically, the second capillary structure 400h is annular and has a first curved segment 410h and a second curved segment 420h, two opposing extension segments 430h, and a bridging segment 440h. The first curved segment 410h is located in the condensation zone A2, and the second curved segment 420h is located in the evaporation zone A1. The second curved segment 420h is located outside the range C of the heat source mounting surface 110 of the first cover 100h in its orthogonal projection. The two extension segments 430h are respectively connected to the opposite sides of the first curved segment 410h and the opposite sides of the second curved segment 420h. One end of the bridging section 440h is connected to the second bending section 420h, and the other end of the bridging section 440h is located within the range C of the heat source setting surface 110 of the first cover 100h, as orthogonally projected onto the first cover 100h. In this way, the cooling fluid from the condensation zone A2 can be directly returned to the heat source setting surface 110 located in the evaporation zone A1 through the second capillary structure 400h, thereby further enhancing the heat dissipation capacity of the heat spreader for the heat source.

[0073] Please see Figure 13 and Figure 14 , Figure 13 This is a plan view of the second cover of the heat spreader plate in the tenth embodiment of the present invention after removal. Figure 14 This is a plan view of the second cover of the heat spreader plate removed according to the eleventh embodiment of the present invention.

[0074] like Figure 13As shown, in this embodiment, the second capillary structure 400i is U-shaped and has a curved section 460i and two opposing extension sections 470i. The curved section 460i is located in the condensation zone A2. The two extension sections 470i are respectively connected to opposite sides of the curved section 460i and extend towards the evaporation zone A1. The ends of the two extension sections 470i away from the curved section 460i are orthogonally projected onto the heat source mounting surface 110 of the first cover 100i within the range C. Figure 14 As shown, the second capillary structure 400j is U-shaped and has a curved section 460j and two opposing extension sections 470j. The curved section 460j is located in the condensation zone A2. The two extension sections 470j are respectively connected to the opposite sides of the curved section 460j and extend toward the evaporation zone A1. The ends of the two extension sections 470j away from the curved section 460j are located outside the range C of the heat source setting surface 110 of the first cover 100j in the orthogonal projection of the first cover 100j, but are substantially adjacent to the heat source setting surface 110 of the first cover 100j.

[0075] The two extension segments in the above embodiment are separate, but this is not a limitation. Please refer to... Figure 15 , Figure 15 This is a plan view of the second cover of the heat spreader plate removed according to the twelfth embodiment of the present invention. In this embodiment, the two extension sections 470k abut against each other.

[0076] It is worth noting that, provided the water return capacity of the second capillary structure 400 is greater than that of the first capillary structure 300, the distribution area of ​​the second capillary structure 400 can also be greater than or equal to the distribution area of ​​the first capillary structure 300. In other words, provided the water return capacity of the second capillary structure 400 is greater than that of the first capillary structure 300, the temperature distribution plate 10 is not limited to the orthogonal projection of the second capillary structure 400 onto the first cover 100 being smaller than the orthogonal projection of the first capillary structure 300 onto the first cover 100. The distribution area of ​​the first capillary structure 300 may be equal to the distribution area of ​​the second capillary structure 400, or the distribution area of ​​the first capillary structure 300 may be smaller than the distribution area of ​​the second capillary structure 400. The so-called water return capacity is directly proportional to the degree of capillary force or capillary phenomenon of the capillary structure.

[0077] Furthermore, in the above embodiments, only the first cover body is stacked with the first capillary structure, but this is not a limitation. In other embodiments, the second cover body may also be stacked with the first capillary structure.

[0078] According to the vapor chamber of the above embodiment, through the composite first and second capillary structures, when the vapor chamber is used vertically and the horizontal height of the evaporation zone is higher than that of the condensation zone, or when the distance between the evaporation zone and the condensation zone is large, the cooling fluid in the vapor chamber will vaporize into gas after absorbing the heat energy generated by the heat source and flow to the condensation zone. When the gas in the condensation zone cools down and liquefies back into liquid, the liquid in the condensation zone can be drawn back to the evaporation zone with the assistance of the first and second capillary structures. In this way, the return flow rate of the liquid in the condensation zone can be increased, thereby improving the heat dissipation capacity of the vapor chamber for the heat source.

Claims

1. A heat spreader, characterized in that, The vapor chamber is used to contain a cooling fluid, and the vapor chamber comprises: The first cover body; A second cover body is joined with the first cover body to form a liquid-tight space. The liquid-tight space is used to contain the cooling fluid. The liquid-tight space has an evaporation zone and a condensation zone. The condensation zone is located at one end of the heat spreader plate. The flow channel width of the condensation zone is smaller than the flow channel width of the evaporation zone. A first capillary structure, located within the liquid-tight space and stacked on the first cover; and A second capillary structure is located within the liquid-tight space and is stacked on top of the first capillary structure. The second capillary structure is different from the first capillary structure, and the projection of the second capillary structure onto the first cover is smaller than the projection of the first capillary structure onto the first cover. One side of the second capillary structure is located in the condensation zone, and the other side of the second capillary structure extends toward the evaporation zone. The second capillary structure is biased in the liquid-tight space, and the first capillary structure is distributed throughout the liquid-tight space. The projection of all the second capillary structures on the first cover falls within the projection of the first capillary structure on the first cover. It also includes a hollow section that extends through the first cover and the second cover, and the second capillary structure is located around the hollow section.

2. The temperature distribution plate as described in claim 1, characterized in that, The first cover has a heat source mounting surface corresponding to the evaporation zone, the heat source mounting surface being used to thermally contact a heat source, and the projection of a portion of the second capillary structure onto the first cover is within the range of the heat source mounting surface of the first cover.

3. The temperature distribution plate as described in claim 2, characterized in that, The second capillary structure is ring-shaped.

4. The temperature distribution plate as described in claim 3, characterized in that, The second capillary structure has a first curved section and a second curved section, two opposite extension sections, and a bridging section. The first curved section is located in the condensation zone, the second curved section is located in the evaporation zone, and the projection of the second curved section on the first cover is outside the range of the heat source mounting surface of the first cover. The two extension sections are respectively connected to opposite sides of the first curved section and opposite sides of the second curved section. One end of the bridging section is connected to the second curved section, and the projection of the other end of the bridging section on the first cover is within the range of the heat source mounting surface of the first cover.

5. The temperature distribution plate as described in claim 2, characterized in that, The second capillary structure is U-shaped.

6. The temperature distribution plate as described in claim 5, characterized in that, The second capillary structure has a curved section and two opposing extension sections. The curved section is located in the condensation zone, and the two extension sections are respectively connected to opposite sides of the curved section and extend toward the evaporation zone. The projection of the two extension sections away from the curved section onto the first cover is within the range of the heat source setting surface of the first cover.

7. The temperature distribution plate as described in claim 6, characterized in that, The two extensions abut against each other.

8. The temperature distribution plate as described in claim 6, characterized in that, The two extensions are separated.

9. The temperature distribution plate as described in claim 1, characterized in that, The first cover has a heat source mounting surface corresponding to the evaporation zone, the heat source mounting surface being used to thermally contact a heat source, and the projection of the second capillary structure on the first cover is located outside the range of the heat source mounting surface of the first cover, adjacent to the heat source mounting surface of the first cover.

10. The temperature distribution plate as described in claim 9, characterized in that, The second capillary structure is ring-shaped.

11. The temperature distribution plate as described in claim 10, characterized in that, The second capillary structure has a first curved section and a second curved section opposite to each other, and two opposite extension sections. The first curved section is located in the condensation zone, the second curved section is located in the evaporation zone, and the projection of the second curved section on the first cover is outside the range of the heat source setting surface of the first cover. The two extension sections are respectively connected to the opposite sides of the first curved section and the opposite sides of the second curved section.

12. The temperature distribution plate as described in claim 9, characterized in that, The second capillary structure is U-shaped.

13. The temperature distribution plate as described in claim 12, characterized in that, The second capillary structure has a curved section and two opposing extension sections. The curved section is located in the condensation zone, and the two extension sections are respectively connected to opposite sides of the curved section and extend toward the evaporation zone. The projection of the two extension sections away from the curved section is outside the range of the heat source mounting surface of the first cover and adjacent to the heat source mounting surface of the first cover.

14. The temperature distribution plate as described in claim 13, characterized in that, The two extensions abut against each other.

15. The temperature distribution plate as described in claim 13, characterized in that, The two extensions are separated.

16. The heat spreader as described in any one of claims 1 to 15, characterized in that, The second capillary structure is in thermal contact with the second cover.

17. The heat spreader as described in any one of claims 1 to 15, characterized in that, The second capillary structure is separated from the second cover.

18. The temperature distribution plate as described in claim 1, characterized in that, The second capillary structure abuts against an inner sealing portion of the first cover near the perforated portion.

19. The temperature distribution plate as described in claim 1, characterized in that, The second capillary structure abuts against an outer sealing portion of the first cover away from the perforated portion.

20. The temperature distribution plate as described in claim 1, characterized in that, The material of the second capillary structure is different from the material of the first capillary structure.

21. The temperature distribution plate as described in claim 1, characterized in that, The form of the second capillary structure differs from that of the first capillary structure.

22. The temperature distribution plate as described in claim 21, characterized in that, The first capillary structure is a network, and the second capillary structure is a sintered body.

23. The temperature distribution plate as described in claim 21, characterized in that, The first capillary structure is a metal mesh, and the second capillary structure is a powder sintered body.

24. The temperature distribution plate as described in claim 1, characterized in that, The first capillary structure is a metal mesh, and the second capillary structure is a metal mesh.

25. The temperature distribution plate as described in claim 1, characterized in that, The first capillary structure is distributed throughout the liquid-tight space, and the second capillary structure is distributed locally within the liquid-tight space.

26. The temperature distribution plate as described in claim 1, characterized in that, The orthogonal projection of the second capillary structure onto the first cover is smaller than the orthogonal projection of the first capillary structure onto the first cover.

27. A heat spreader, characterized in that, The vapor chamber is used to contain a cooling fluid, and the vapor chamber comprises: The first cover body; A second cover body is joined with the first cover body to form a liquid-tight space. The liquid-tight space is used to contain the cooling fluid. The liquid-tight space has an evaporation zone and a condensation zone. The condensation zone is located at one end of the heat spreader plate. The flow channel width of the condensation zone is smaller than the flow channel width of the evaporation zone. A first capillary structure, located within the liquid-tight space and stacked on the first cover; and A second capillary structure is located within the liquid-tight space and is stacked on top of the first capillary structure. The water return capacity of the second capillary structure is greater than that of the first capillary structure. One side of the second capillary structure is located in the condensation zone, and the other side of the second capillary structure extends toward the evaporation zone. The second capillary structure is biased in the liquid-tight space, and the first capillary structure is distributed throughout the liquid-tight space. The projection of all the second capillary structures on the first cover falls within the projection of the first capillary structure on the first cover. It also includes a hollow section that extends through the first cover and the second cover, and the second capillary structure is located around the hollow section.

28. The temperature distribution plate as described in claim 27, characterized in that, The first cover has a heat source mounting surface corresponding to the evaporation zone, the heat source mounting surface being used to thermally contact a heat source, and a portion of the second capillary structure having its orthogonal projection onto the first cover within the range of the heat source mounting surface of the first cover.

29. The temperature distribution plate as described in claim 28, characterized in that, The second capillary structure is ring-shaped.

30. The temperature distribution plate as described in claim 29, characterized in that, The second capillary structure has a first curved section and a second curved section, two opposite extension sections, and a bridging section. The first curved section is located in the condensation zone, the second curved section is located in the evaporation zone, and the orthogonal projection of the second curved section onto the first cover is outside the range of the heat source mounting surface of the first cover. The two extension sections are respectively connected to opposite sides of the first curved section and opposite sides of the second curved section. One end of the bridging section is connected to the second curved section, and the other end of the bridging section is within the range of the heat source mounting surface of the first cover when its orthogonal projection onto the first cover is within the range of the heat source mounting surface of the first cover.

31. The temperature distribution plate as described in claim 28, characterized in that, The second capillary structure is U-shaped.

32. The temperature distribution plate as described in claim 31, characterized in that, The second capillary structure has a curved section and two opposing extension sections. The curved section is located in the condensation zone, and the two extension sections are respectively connected to opposite sides of the curved section and extend toward the evaporation zone. The orthogonal projection of the two extension sections away from the curved section onto the first cover body is within the range of the heat source setting surface of the first cover body.

33. The temperature distribution plate as described in claim 32, characterized in that, The two extensions abut against each other.

34. The temperature distribution plate as described in claim 32, characterized in that, The two extensions are separated.

35. The temperature distribution plate as described in claim 27, characterized in that, The first cover has a heat source mounting surface corresponding to the evaporation zone, the heat source mounting surface being used to thermally contact a heat source, and the second capillary structure having its orthogonal projection on the first cover located outside the range of the heat source mounting surface of the first cover, adjacent to the heat source mounting surface of the first cover.

36. The temperature distribution plate as described in claim 35, characterized in that, The second capillary structure is ring-shaped.

37. The temperature distribution plate as described in claim 36, characterized in that, The second capillary structure has a first curved section and a second curved section opposite to each other, and two opposite extension sections. The first curved section is located in the condensation zone, the second curved section is located in the evaporation zone, and the orthogonal projection of the second curved section onto the first cover is outside the range of the heat source mounting surface of the first cover. The two extension sections are respectively connected to the opposite sides of the first curved section and the opposite sides of the second curved section.

38. The temperature distribution plate as described in claim 35, characterized in that, The second capillary structure is U-shaped.

39. The temperature distribution plate as described in claim 38, characterized in that, The second capillary structure has a curved section and two opposing extension sections. The curved section is located in the condensation zone, and the two extension sections are respectively connected to opposite sides of the curved section and extend toward the evaporation zone. The ends of the two extension sections away from the curved section are located outside the range of the heat source mounting surface of the first cover when projected orthogonally onto the first cover, but adjacent to the heat source mounting surface of the first cover.

40. The temperature distribution plate as described in claim 39, characterized in that, The two extensions abut against each other.

41. The temperature distribution plate as described in claim 39, characterized in that, The two extensions are separated.

42. The heat spreader as described in any one of claims 27 to 41, characterized in that, The second capillary structure is in thermal contact with the second cover.

43. The heat spreader as described in any one of claims 27 to 41, characterized in that, The second capillary structure is separated from the second cover.

44. The temperature distribution plate as described in claim 27, characterized in that, The second capillary structure abuts against an inner sealing portion of the first cover near the perforated portion.

45. The temperature distribution plate as described in claim 27, characterized in that, The second capillary structure abuts against an outer sealing portion of the first cover away from the perforated portion.

46. ​​The temperature distribution plate as described in claim 27, characterized in that, The material of the second capillary structure is different from that of the first capillary structure.

47. The temperature distribution plate as described in claim 27, characterized in that, The form of the second capillary structure differs from that of the first capillary structure.

48. The temperature distribution plate as described in claim 47, characterized in that, The first capillary structure is a network, and the second capillary structure is a sintered body.

49. The temperature distribution plate as described in claim 27, characterized in that, The first capillary structure is a metal mesh, and the second capillary structure is a powder sintered body.

50. The temperature distribution plate as described in claim 27, characterized in that, The first capillary structure is a metal mesh, and the second capillary structure is a metal mesh.

51. The temperature distribution plate as described in claim 27, characterized in that, The first capillary structure is distributed throughout the liquid-tight space, and the second capillary structure is distributed locally within the liquid-tight space.

Images