Sensor device and valve assembly

Abstract

The present application provides a sensor device, comprising a substrate assembly, a housing and a first sealing structure; the substrate assembly includes a substrate body and at least one sensing element; the substrate body has a first side surface and a second side surface which are opposite to each other; the sensing element is located on the side where the second side surface is located; the substrate body includes a second conductive portion, and the second conductive portion includes contact portions located on the first side surface and the second side surface of the substrate body; the sensing element is electrically connected to the contact portion of the second conductive portion on the second side surface; the housing includes a bottom wall portion and a side wall portion; the bottom wall portion is located on the side where the second side surface of the substrate body is located; the side wall portion is at least partially located around the substrate body; the first sealing structure is located between the substrate body and the housing and the first sealing structure is in contact with the substrate body and the housing respectively, and the substrate body and the housing are hermetically fitted through the first sealing structure. The sensor device provided by the present application has few overall sealing positions and a simple structure.

Description

Technical Field

[0001] The present application relates to the technical field of sensors, and in particular to a sensor device and a valve assembly. Background Art

[0002] In some application scenarios, sensors need to be provided to collect relevant parameters of the working medium, such as temperature signals and / or pressure signals. For example, Figure 1 , the sensor assembly 100 in the related art includes a rectangular pressure sensor element 130, a middle plate assembly 140, and a temperature sensor element 170. A tubular element 165 is formed at the end of the middle plate assembly. The wire 160 of the temperature sensor 170 extends within the elongated tubular element 165 and passes through a hole in the middle plate assembly from the side to be connected to the circuit board 120. The pressure sensor element 130 is located above the middle plate assembly 140. The housing of the sensor assembly 100 has an inlet opening 175, which conveys fluid to the surface of the pressure sensor element 130 for sensing pressure to achieve the pressure detection function.

[0003] In the related art, the sensor assembly needs to achieve the sealing between the middle plate assembly 140 and the housing 150 and the sealing between the middle plate assembly and the rectangular pressure sensor element 130. The structure of the sensor device in the related art is complex, there are many sealing positions, and the controllability of the sealing effect is poor. Summary of the Invention

[0004] The purpose of the present application is to provide a sensor device with fewer sealing positions and a simple overall structure.

[0005] The first aspect of the present application provides a sensor device, including a substrate assembly, a housing, and a first sealing structure;

[0006] The substrate assembly includes a substrate body and at least one sensing element; the sensing element is used to directly or indirectly contact the fluid to sense pressure and / or temperature; the substrate body has a first side surface and a second side surface arranged opposite to each other; the sensing element is located on the side where the second side surface of the substrate body is located; the substrate body includes a second conductive part, and the second conductive part includes a plurality of contact parts located on the second side surface of the substrate body; the sensing element is electrically connected to the contact parts of the second conductive part on the second side surface;

[0007] The housing includes a bottom wall part and a side wall part; the bottom wall part is located on the side where the second side surface of the substrate body is located; the side wall part is at least partially located around the substrate body; the first sealing structure is located between the substrate body and the housing, and the first sealing structure is in contact with the substrate body and the housing respectively, and the substrate body and the housing are sealed and matched through the first sealing structure.

[0008] The second aspect of the present application further provides a valve assembly, including a valve body and the above-mentioned sensor device. The sensor device is fixedly connected to the valve body. The valve body is provided with a first channel for fluid flow, and the sensing element can directly or indirectly sense the pressure signal and / or temperature signal of the fluid in the first channel.

[0009] The sensor device provided by the present application realizes the sealing fit relationship between the substrate body and the housing through the first sealing structure, which is beneficial to reducing the sealing positions of the overall product, and the structure of the sensor device is simpler. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic structural diagram of a temperature and pressure sensor in the related art;

[0011] Figure 2 is a three-dimensional structural diagram of the sensor device of the present application;

[0012] Figure 3 For the present application Figure 2 is a three-dimensional exploded view of the sensor device;

[0013] Figure 4 is a schematic cross-sectional structure diagram of the sensor device of the present application;

[0014] Figure 5 is a partially enlarged schematic structural diagram of the sensor device of the present application;

[0015] Figure 6 is a schematic assembly structure diagram of the substrate assembly and the first conductive part of the sensor device of the present application;

[0016] Figure 7 is a schematic structural diagram of the cover body of the sensor device of the present application;

[0017] Figure 8 is a bottom view of a substrate assembly of the sensor device of the present application;

[0018] Figure 9 is a schematic cross-sectional structure diagram of a substrate assembly of the sensor device of the present application;

[0019] Figure 10 is a three-dimensional structural diagram of the valve assembly provided by the present application;

[0020] Figure 11 For the present application Figure 10 is a three-dimensional exploded view of the valve assembly;

[0021] Figure 12 is a schematic cross-sectional structure diagram of the valve assembly of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Please refer toFigures 2 to 12 A sensor device 100 provided by the present application can be integrated with various valve components, such as being separately installed on a valve body to form a valve assembly, or being integrated with an electronic expansion valve, a thermal expansion valve, a solenoid valve, etc. into a valve assembly. The sensor device 100 can be used to detect the pressure parameter and / or temperature parameter of the refrigerant, and of course, it can also be used to detect the pressure parameter and / or temperature parameter of other fluids.

[0023] The sensor device 100 of the present application includes a substrate assembly 1, a housing 3, and a first sealing structure 41.

[0024] The substrate assembly 1 includes a substrate body 11 and at least one sensing element 12. The sensing element 12 is used to directly or indirectly sense the pressure and / or temperature of the fluid. Specifically, the sensing element 12 has a sensing area. This sensing area can be in direct contact with the fluid or in indirect contact with the fluid to achieve the function of sensing relevant signals. The sensing element 12 can integrate both the pressure sensing function and the temperature sensing function, and even more sensing functions. Of course, the sensing element 12 can also separately implement only the sensing function of a certain signal among pressure and temperature.

[0025] The substrate body 11 has a first side 111 and a second side 112 respectively located on both sides of its thickness direction. The sensor device 100 can transmit signals to other external devices that receive or process temperature / pressure signals through a plurality of first conductive parts 10. The first conductive parts 10 are located on the side where the first side 111 of the substrate body 11 is located, and the sensing element 12 is located on the side where the second side 112 of the substrate body 11 is located.

[0026] The substrate body 11 includes a second conductive part 13. The second conductive part 13 includes a plurality of contact parts 131 located on the first side 111 and the second side 112 of the substrate body 11. The sensing element 12 is electrically connected to the contact parts 131 of the second conductive part 13 on the second side 112. Specifically, the sensing element 12 can be directly fixed to the second side 112 of the substrate body 11 and in contact with the contact parts 131.

[0027] The second conductive part 13 and the substrate body 11 form an integral structure. Refer to Figure 9 As shown, the substrate body 11 includes a plurality of second cavities 113. At least part of the second conductive part 13 is accommodated in the second cavities 113. And the second conductive part 13 is sealingly connected to the cavity walls of the second cavities 113 formed by the substrate body 11. The second conductive part 13 is in contact with the sensing element 12 and the first conductive part 10 respectively.

[0028] The sensor device 100 further includes a cover body 2. The cover body 2 is provided with a plurality of first through holes 201 penetrating the cover body 2, and at least a part of the first conductive portion 10 is received in the first through holes 201. In some embodiments, the cover body 2 abuts at least a part of the area of the first side surface 111 of the substrate body 11. The cover body 2 includes a main body portion 20 and a protruding portion 21 located on the periphery of the main body portion 20, and a plurality of first through holes 201 are all provided in the main body portion 20, so that the first through holes 201 penetrate through the main body portion 20.

[0029] The housing 3 is provided with a bottom wall portion 31 and a side wall portion 32. The bottom wall portion 31 is located on the side where the second side surface 111 of the substrate body 11 is located, and at least a part of the side wall portion 32 is located on the periphery of the substrate body 11. The first sealing structure 41 is located between the substrate body 11 and the housing 3 and the first sealing structure 41 is in contact with the substrate body 11 and the housing 3 respectively. The substrate body 11 and the housing 3 are hermetically fitted through the first sealing structure 41. The first sealing structure 41 can be an elastic sealing washer, or a sealant, or a solder structure that melts to achieve sealing, etc.

[0030] At least a part of the area of the bottom wall portion 31 can indirectly support the substrate body 11. The bottom wall portion 31 has a first cavity 310, and the first cavity 310 is at least partially opposite to the sensing area of the sensing element 12. The projection of the sensing area of the sensing element 12 in a plane perpendicular to the thickness direction of the substrate body 11 is at least partially within the projection range of the first cavity 310 in this plane. At least a part of the side wall portion 32 is located on the periphery of the substrate body 11. The side wall portion 32 can be integrally connected to the bottom wall portion 31 or the two are directly welded and fixed into an integral structure.

[0031] The side wall portion 32 is provided with a limiting convex portion 321. At least a part of the cover body 2 is closer to the substrate body 11 than the limiting convex portion 321. The projection of the limiting convex portion 321 in a plane perpendicular to the thickness direction of the substrate body 11 coincides at least partially with the projection of the cover body 11 in this plane. Specifically, the limiting convex portion 321 is located on the side of the protruding portion 21 away from the substrate body 11, and at least a part of the surface of the limiting convex portion 321 and the protruding portion 21 along the thickness direction of the substrate body 11 away from the first side surface 111 can be in contact to achieve limiting, that is, to limit the cover body 2 from moving away from the substrate body 11 along the thickness direction of the substrate body 11.

[0032] The bottom wall portion 31 of the housing 3 and the cover body 2 of the sensor device 100 are respectively located on both sides of the substrate body 11. The limiting protrusion 321 of the side wall portion 32 of the housing 3 limits the cover body 2 from moving away from the substrate body 11. This is beneficial to realizing the fixation among the substrate body 11, the housing 3 and the cover body 2, thereby correspondingly reducing the overall welding steps and lowering the processing and assembly complexity of the sensor device 100.

[0033] The side wall portion 32 includes a first wall segment 322 and a second wall segment 323. The first wall segment 322 is connected between the bottom wall portion 31 and the second wall segment 323. The second wall segment 323 is connected between the first wall segment 322 and the limiting convex portion 321. The side wall portion 32 is vertically arranged relative to the bottom wall portion 31 at both the first wall segment 322 and the second wall segment 323. The first wall segment 322 is located at the periphery of the substrate body 11, and the second wall segment 323 is located at the periphery of the protruding portion 21.

[0034] A specific assembly and molding process among the cover body 2, the substrate assembly 1, the first conductive portion 10, and the outer shell 3 is as follows: The side wall portion 32 first extends longitudinally while maintaining a vertical state, and the substrate assembly 1, the first conductive portion 10, and the cover body 2 are sequentially inserted into the cylindrical space surrounded by the side wall portion 32 and the bottom wall portion 31. At this time, the free end of the side wall portion 32 is bent inward by a tooling to form the limiting convex portion 321. Therefore, the cover body 1 can be stably installed relative to the substrate assembly 1 and is not easily dropped.

[0035] The wall thickness of the side wall portion 32 at the first wall segment 322 is greater than the wall thickness of the side wall portion 32 at the second wall segment 323. Thus, a support step 33 is formed at the connection between the first wall segment 322 and the second wall segment 323 of the side wall portion 32, and the protruding portion 21 of the cover body 2 is clamped and fixed between the support step 33 and the limiting convex portion 321.

[0036] The support step 33 has a support plane 331 that contacts the protruding portion 21. The thickness of the substrate body 11 is equal to the height of the support plane 331 relative to the bottom wall portion 31. Thus, the first side surface 111 of the substrate body 11 is flush with the support plane 331, and the substrate body 11 is clamped and fixed between the main body portion 20 of the cover body 2 and the bottom wall portion 31.

[0037] In other embodiments, the edge of the protruding portion 21 can be aligned with the edge of the substrate body 11, and the substrate body 11 and the protruding portion 21 are jointly clamped and fixed between the limiting convex portion 321 of the outer shell 3 and the bottom wall portion 31.

[0038] The substrate assembly 1 further includes a cover cylinder portion 14. At least a part of the cover cylinder portion 14 is located in the first cavity 310, so that at least a part of the cover cylinder portion 14 can be received in the first cavity 310. The cover cylinder portion 14 is disposed around the sensing element 12. The cover cylinder portion 14 and the substrate body 11 form a third cavity 141 for receiving the sensing element 12. The cover cylinder portion 14 itself can be a hollow cylindrical structure. When the cover cylinder portion 14 is connected to the substrate body 11, the substrate body 11 blocks one opening of the hollow structure of the cover cylinder portion 14, so that the cover cylinder portion 14 and the substrate body 11 jointly enclose the third cavity 141. The substrate assembly 1 further includes a fluorosilicone 15 filled in the third cavity 141. The fluorosilicone 15 coats the sensing element 12 so that the sensing element 12 does not directly contact the fluid. The inner side wall of the cover cylinder portion 14 can provide strong adhesion for the fluorosilicone 15. The fluorosilicone 15 coating the sensing element 12 makes the sensing element not directly contact the fluid. This can prevent the fluid from corroding the pins of the sensing element 12 and provide a certain buffer between the sensing element 12 and the fluid to protect the sensing element 12. The fluorosilicone 15 has a certain flexibility. When the sensing element 12 is used to measure the fluid pressure, when the fluid pressure acts on the fluorosilicone 15 first, the fluorosilicone 15 can then transfer the fluid pressure to the sensing element 12 for sensing the pressure. And the fluorosilicone 15 has better thermal conductivity than ordinary silicone materials. When the sensing element 12 is used to measure the fluid temperature, due to the presence of the fluorosilicone 15, the fluorosilicone 15 can improve the accuracy of the sensing element 12 in detecting the temperature signal.

[0039] The bottom wall portion 31 can be provided with a groove or a notch, and at least a part of the first sealing structure 41 is received in the groove or the notch. When the fluid temperature is relatively high, the first sealing structure 41 may be deformed. The groove or the notch positions the first sealing structure 41, which can improve the sealing effect of the first sealing structure 41. The first sealing structure 41 can be an elastic sealing gasket.

[0040] In some embodiments, the substrate body 11 is a PCB board. The second conductive portion 13 includes a metal connection portion 130 located in the second cavity 113, and contact portions 131 respectively located on both sides of the substrate body 11. The contact portions 131 can specifically be exposed metal pads located on the first side surface 111 and the second side surface 112. The metal connection portion 130 is in a hollow cylindrical shape, and the hollow part of the metal connection portion 130 forms a via hole of the PCB board. The metal connection portion 130 is connected to the metal pad. This is beneficial to realizing the electrical connection relationship between the components located on both sides in the thickness direction of the substrate body 11.

[0041] The substrate assembly 1 includes a first sensing element 121 and a second sensing element 122. Among them, the first sensing element 121 is a MEMS (Micro Electromechanical System) pressure integrated chip. The size of the MEMS pressure integrated chip is relatively small. The common product size of the MEMS pressure integrated chip is generally in the millimeter level or even smaller. The pressure sensor integrated chip prepared by the MEMS technology has a Wheatstone bridge with 4 resistors made on the surface of the silicon cup thin film. When connected to a circuit, when there is no pressure acting on the silicon cup thin film, the Wheatstone bridge is balanced and the output voltage is 0. When there is pressure acting on the silicon cup thin film, the balance of the Wheatstone bridge is broken and a voltage is output. Therefore, by detecting the change of the electrical signal in the circuit, the change of the pressure can be reflected, so as to realize the pressure detection function.

[0042] The second sensing element 122 is a surface-mounted thermistor. The resistance of the thermistor-type temperature sensor decreases as the temperature increases. The size of the temperature sensor corresponding to the surface-mounted thermistor is relatively small, and some products are about 1.0 mm × 0.5 mm in size.

[0043] The sensor device 100 made of the above-mentioned first sensing element 121 and second sensing element 122 is more conducive to the miniaturization of the product. The MEMS pressure integrated chip and the surface-mounted thermistor are respectively welded and fixed to the metal pad 131 based on their respective pins. In some embodiments, the substrate assembly 1 may further include a conditioning chip 123, whose function is to perform processing such as denoising, signal amplification, and signal compensation on the pressure signal or temperature signal to improve the quality of the signal. The related functions of the above-described MEMS pressure integrated chip, surface-mounted thermistor, and conditioning chip and other components are all correspondingly disclosed in the prior art, and the present application will not elaborate on the functions of each component too much.

[0044] The top surface of the main body 20 of the cover 2 away from the first side surface 111 is higher than the top surface of the protruding portion 21 away from the first side surface 111. The cover 2 is in contact with at least a partial area of the first side surface 111 of the substrate body 11. The orifice size of the first through hole 201 on the side of the cover 2 close to the substrate body 11 is larger than the orifice size on the side away from the substrate body 11. In some embodiments, in the direction away from the substrate body 11 along the axis of the first through hole 201, the first through hole 201 is a tapered hole with a gradually decreasing aperture, and the first conductive portion 10 is a tapered spring adapted to the aperture of the first through hole 201. Refer to Figure 3 , the embodiment of the present application provides five first conductive portions 10 in the form of tapered springs. The functions of these five first conductive portions 10 are respectively used to provide a temperature signal output point, a pressure signal output point, a protection ground output point, an input voltage position, and a ground position.

[0045] The first conductive part 10 includes a first sub-part 101 located within the first through-hole 201 and a second sub-part 102 connected to the side of the first sub-part 101 away from the substrate body 11. The second sub-part 102 is located outside the first through-hole 201. The first sub-part 101 abuts or is welded to the metal pad 131 on the first side surface 111 of the substrate body 11. The end of the second sub-part 102 exposed outside the first through-hole 201 can abut or be welded to an external circuit board. When the first conductive part 10 in the shape of a conical spring is working, it can be in a compressed state, which is beneficial to improving the connection stability between the first conductive part 10 and the substrate body 11 and with the external circuit board.

[0046] Based on the same inventive concept, the present application also provides a valve assembly 200, which includes a valve body 60 and the sensor device 100 in the foregoing embodiment. The sensor device 100 is fixedly connected to the valve body 60. The valve body 60 is provided with a first channel 601 for fluid flow. The sensing element 12 can directly or indirectly sense the pressure signal and / or temperature signal of the fluid in the first channel 601.

[0047] Take Figures 10 to 12 the sensor device 100 in [[]] as an example and set it on the valve body 60 for illustration. The valve body 60 has a central axis along the first direction (i.e., Figure 12 the lateral direction shown in [[]]). In some embodiments of the present application, a valve assembly 200 is also provided. The valve assembly 200 further includes a flow rate adjustment unit 300. The valve body 60 is further provided with a second channel 602. The flow rate adjustment unit 300 is fixedly connected to the valve body 60, and the flow rate adjustment unit 300 can adjust the flow rate of the second channel 602. The second channel 602 is not communicated with the first channel 601.

[0048] The flow rate adjustment unit 300 can specifically be an electronic expansion valve. The flow rate adjustment unit 300 includes a coil assembly 301 and a valve component 302, etc. The coil assembly 301 includes a stator coil. The valve component 302 includes a valve seat, a valve core, and a rotor assembly. The valve seat is fixed to the valve body 60, and the stator coil is sleeved on the outer periphery of the rotor assembly. The rotor assembly can drive the valve core to move, so that the valve core can move relative to the valve seat. The valve seat has a valve port. The valve core changes the flow cross-sectional area of the second channel 602 at the valve port by approaching and moving away from the valve port, and thus can form a throttle at the valve port. The valve body 60 has a first cavity 601, and the sensor device 100 is at least partially accommodated in the first cavity 603. An installation part 604 is formed on the cavity wall of the valve body 60 corresponding to the first cavity 603. A second sealing part 42 is provided between the bottom wall part 31 and the installation part 604, and the second sealing part 42 is pressed between the bottom wall part 31 and the installation part 604.

[0049] The valve assembly 200 further includes a compression nut 400. A part of the bottom wall portion 31 protrudes radially outward relative to the side wall portion 32, and the protruding part cooperates with the compression nut 400. The compression nut 400 is pressed against the side of the bottom wall portion 31 away from the mounting portion 604. The outer periphery of the compression nut 400 is threadedly connected to the valve body 60 to fix the sensor device 100 and the valve body 60 together.

[0050] Reference Figure 12 , the first channel 601 includes a first sub-channel 6011 and a second sub-channel 6012 that intersect axially. One of the openings formed in the valve body 60 on both axial sides of the second sub-channel 6012 serves as a fluid inlet, and the other serves as a fluid outlet. The axial direction of the first sub-channel 6011 and the axial direction of the second sub-channel 6012 can be set perpendicular to each other.

[0051] First openings 71 and second openings 72 are respectively formed in the valve body 60 on both axial sides of the first sub-channel 6011. Among them, the first sub-channel 6011 communicates with the second sub-channel 6012 through the first opening 71. The second opening 72 of the first sub-channel 6011 faces the sensing element 12, and the size of the first opening 71 is larger than the size of the second opening 72. Correspondingly, the bottom end surface of the bottom wall portion 31 can be set as a plane. The bottom wall portion 31 is arranged at the second opening 71, and the first cavity 310 or the through hole 141 can communicate with the first sub-channel 6011. The first opening 71 at the lower end of the first sub-channel 6011 forms a flared opening relative to the second opening 72 at the upper end. When the fluid enters the first channel 601 from the port at one end of the second sub-channel 6012, at the flared opening position, the high-speed flowing fluid can reach the vicinity of the sensing element 12 more quickly through the flared opening. This is beneficial to reducing the temperature difference of the fluid reaching the vicinity of the sensing element 12 and improving the accuracy of the sensing element 12 in sensing the fluid temperature.

[0052] The above embodiments are only used to illustrate the present application and do not limit the technical solutions described in the present application. The understanding of this specification should be based on those skilled in the art of the relevant technical field. For example, for the description of directions such as "front", "rear", "left", "right", "upper", and "lower", although this specification has described the present application in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the relevant technical field can still modify the present application or make equivalent replacements. All technical solutions and their improvements that do not depart from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A sensor device (100), characterized in that, It includes a substrate assembly (1), a housing (3) and a first sealing structure (41); The substrate assembly (1) includes a substrate body (11) and at least one sensing element (12); the sensing element (12) is used to directly or indirectly contact with a fluid to sense pressure and / or temperature; the substrate body (11) has a first side surface (111) and a second side surface (112) arranged opposite to each other; the sensing element (12) is located on the side where the second side surface (112) of the substrate body (11) is located; the substrate body (11) includes a first conductive part (10) and a second conductive part (13), the first conductive part (10) is electrically connected to the second conductive part (13), and the second conductive part (13) includes a plurality of contact parts (131) located on the second side surface (112) of the substrate; the sensing element (12) is electrically connected to the contact parts (131) of the second conductive part (13) on the second side surface (112); The housing (3) includes a bottom wall part (31) and a side wall part (32); the bottom wall part (31) is located on the side where the second side surface (111) of the substrate body (11) is located; the side wall part (32) is at least partially located around the substrate body (11); the first sealing structure (41) is located between the substrate body (11) and the housing (3), and the first sealing structure (41) is in contact with the substrate body (11) and the housing (3) respectively, and the substrate body (11) and the housing (3) are hermetically fitted through the first sealing structure (41).

2. The sensor device (100) according to claim 1, characterized in that, The substrate assembly (1) includes a cover cylinder part (14), and the cover cylinder part (14) is connected to the second side surface (112) of the substrate body (11); the bottom wall part (31) is further provided with a first cavity (310) capable of accommodating at least a part of the cover cylinder part (14); The cover cylinder part (14) is arranged around the sensing element (12); the cover cylinder part (14) and the substrate body (11) form a third cavity (141) for accommodating the sensing element (12); the substrate assembly (1) further includes fluorosilicone rubber (15) filled in the third cavity (141); the fluorosilicone rubber (15) covers the sensing element (12) so that the sensing element (12) does not directly contact with the fluid.

3. The sensor device (100) according to claim 1, characterized in that, The sensor device (100) further includes a cover body (2), and the cover body (2) is at least partially located on the side where the first side surface (111) of the substrate body (11) is located; The side wall part (32) includes a limiting convex part (321) that restricts the cover body (2) from moving away from the substrate body (11) in the thickness direction of the substrate body (11), at least a part of the cover body (2) is closer to the substrate body (11) than the limiting convex part (321), and the projection of the limiting convex part (321) on a plane perpendicular to the thickness direction of the substrate body (11) at least partially coincides with the projection of the cover body (2) on this plane; the substrate body (11) is clamped and fixed between the cover body (2) and the bottom wall part (31).

4. The sensor device (100) according to claim 3, characterized in that, The cover body (2) includes a main body portion (20) and a protruding portion (21) located on the periphery of the main body portion (20); The surface of the protruding portion (21) that is away from the first side surface (111) along the thickness direction of the substrate body (11) is in contact with the limiting convex portion (321); The main body portion (20) is provided with a plurality of first through holes (201) penetrating the main body portion (20); The sensor device (100) further includes a plurality of first conductive portions (10), the first conductive portions (10) are located on the side where the first side surface (111) of the substrate body (11) is located, and the second conductive portion (13) further includes a plurality of contact portions (131) located on the first side surface (111) of the substrate body (11); the first conductive portion (10) is electrically connected to the contact portion (131) of the second conductive portion (13) on the first side surface (112); at least a part of the first conductive portion (10) is received in the first through hole (201).

5. The sensor device (100) according to claim 4, characterized in that, The cover body (2) is in abutment with at least a partial area of the first side surface (111) of the substrate body (11); The aperture size of the first through hole (201) on the side of the cover body (2) close to the substrate body (11) is larger than the aperture size on the side away from the substrate body (11); The first conductive portion (10) includes a first sub-portion (101) located in the first through hole (201) and a second sub-portion (102) connected to the side of the first sub-portion (101) away from the substrate body (11), and the second sub-portion (102) is located outside the first through hole (201); the first sub-portion (101) is in abutment with or welded to the contact portion (131) of the second conductive portion (13) on the first side surface (112).

6. The sensor device (100) according to claim 4, characterized in that, The side wall portion (32) includes a first wall segment (322) and a second wall segment (323), the first wall segment (322) is connected between the bottom wall portion (31) and the second wall segment (323); the second wall segment (323) is connected between the first wall segment (322) and the limiting convex portion (321); the first wall segment (322) is located on the periphery of the substrate body (11), and the second wall segment (323) is located on the periphery of the protruding portion (21); The side wall portion (32) extends perpendicularly with respect to the bottom wall portion (31) at both the first wall segment (322) and the second wall segment (323); the wall thickness of the side wall portion (32) at the first wall segment (322) is greater than the wall thickness of the side wall portion (32) at the second wall segment (323), so that a support step (33) is formed at the connection between the first wall segment (322) and the second wall segment (323) of the side wall portion (32), and the protruding portion (21) of the cover body (2) is clamped and fixed between the support step (33) and the limiting convex portion (321).

7. The sensor device (100) according to claim 1, characterized in that, The first sealing structure (41) is an elastic annular gasket, and the first sealing structure (41) is pressed between the second side surface (112) of the substrate body (11) and the bottom wall portion (31).

8. The sensor device (100) according to claim 1, characterized in that The substrate body (11) has a plurality of second cavities (113), and the second conductive part (13) further includes a metal connection part (130) at least partially located in the second cavities (113); the metal connection part (130) is hermetically connected to the substrate body (11) at the second cavities (113), and the metal connection part (130) is respectively connected to the contact parts (131) located on the first side (111) and the second side (112) of the substrate body (11).

9. The sensor device (100) according to claim 1, characterized in that, The substrate body (11) is a PCB board, and the substrate assembly (1) includes a first sensing element (121) and a second sensing element (122). Among them, the first sensing element (121) is a MEMS pressure integrated chip, and the second sensing element (122) is a patch type thermistor; the MEMS pressure integrated chip and the patch type thermistor are respectively welded and fixed to the contact parts (131) based on their respective pins.

10. A valve assembly (200), characterized in that, It includes a valve body (60) and the sensor device (100) according to any one of claims 1 to 9. The sensor device (100) is fixedly connected to the valve body (60). The valve body (60) is provided with a first channel (601) for fluid to flow through, and the sensing element (12) can directly or indirectly sense the pressure and / or temperature of the fluid in the first channel (601).

11. The valve assembly (200) according to claim 10, wherein, The valve assembly (200) further includes a flow rate adjustment unit (300). The valve body (60) is further provided with a second channel (602) for fluid to flow through. The flow rate adjustment unit (300) is fixedly connected to the valve body (60), and the flow rate adjustment unit (300) can adjust the flow rate of the second channel (602).

12. The valve assembly (200) according to claim 11, characterized in that, The first channel (601) includes a first sub-channel (6011) and a second sub-channel (6012) intersecting in the axial direction; first openings (71) and second openings (72) are respectively formed on both axial sides of the first sub-channel (6011) on the valve body (60). Among them, the first sub-channel (6011) communicates with the second sub-channel (6012) through the first opening (71). The second opening (72) of the first sub-channel (6011) faces the sensing element (12), and the size of the first opening (71) is larger than the size of the second opening (72).

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