A large-capacity multi-pin bracket capacitor and its preparation method

Abstract

The present invention provides a large-capacity multi-pin bracket capacitor and a preparation method thereof. The capacitor includes two outer frames, at least one middle frame, a high-frequency frame, a plurality of ceramic chips and high-frequency chips. The middle frame includes a plurality of first brackets arranged at intervals in sequence. The outer frame includes a plurality of second brackets arranged at intervals in sequence. The first bracket includes a first pin in a "C" shape. Ceramic chips are welded on both the inner and outer sides of the first bracket. The upper end of the first pin contacts the corresponding ceramic chip to support the ceramic chip. Ceramic chips are welded on the inner side of the second bracket. Both ends of the ceramic chip are respectively welded to two adjacent first brackets or an adjacent first bracket and a second bracket. The high-frequency frame is connected to an outer frame or a middle frame, and the high-frequency chip is welded on the high-frequency frame. The present invention has the characteristics of large capacity, small occupied space, resistance to thermal deformation and good resistance to high-order harmonics.

Description

Technical Field

[0001] The present invention relates to a large-capacity multi-pin bracket capacitor and a preparation method thereof. Background Art

[0002] During the soldering process of ceramic capacitors, due to the material properties of ceramic materials, after reflow soldering, porcelain bodies are prone to cracking due to stress concentration at the end parts, heat deformation of the PCB board, and thermal expansion. To solve the above problems, the existing technical solution is to use bracket capacitors to replace traditional chip ceramic capacitors. However, the pins of existing bracket capacitors are usually rigidly designed. When the PCB is heated and deformed, the buffering effect is very limited. Moreover, bracket capacitors are usually single. In occasions where a large capacity is required, only multiple single bracket capacitors can be soldered on the PCB board. However, bracket capacitors have requirements for the installation spacing, resulting in multiple bracket capacitors unable to be densely arranged, which will cause a large amount of space waste. Summary of the Invention

[0003] The present invention provides a large-capacity multi-pin bracket capacitor and a preparation method thereof. The capacitor has the characteristics of large capacity, small occupied space, good resistance to thermal deformation, and good resistance to high-order harmonics.

[0004] The present invention is realized through the following technical solutions:

[0005] A large-capacity multi-pin bracket capacitor includes two outer frames, at least one middle frame, a high-frequency frame, several ceramic chips, and a high-frequency chip. The middle frame includes several first brackets arranged at intervals in sequence and a plurality of buffer mechanisms respectively arranged between two adjacent first brackets. The outer frame includes several second brackets arranged at intervals in sequence and a plurality of buffer mechanisms respectively arranged between two adjacent second brackets. The first bracket includes a first pin in a "C" shape. Ceramic chips are welded on both the inner and outer sides of the first bracket. The upper end of the first pin contacts the corresponding ceramic chip to support the ceramic chip. Ceramic chips are welded on the inner side of the second bracket. The two ends of the ceramic chip are respectively welded to two adjacent first brackets or an adjacent first bracket and the second bracket. The high-frequency frame is connected to an outer frame or the middle frame. The high-frequency chip is welded on the high-frequency frame.

[0006] Furthermore, the first bracket further includes a vertically arranged first chip pad and two first limiting feet respectively arranged on both sides of the lower end of the first chip pad and extending horizontally inward. The first pin includes a first horizontal plate arranged at the lower end of the first chip pad and extending outward, a first vertical plate arranged at the outer end of the first horizontal plate, and a second horizontal plate arranged at the lower end of the first vertical plate and extending inward.

[0007] Furthermore, the high-frequency frame includes two second chip pads arranged relatively at intervals, one second chip pad is connected to the outer frame or the middle frame, and the high-frequency chip is welded between the two second chip pads.

[0008] Furthermore, the second bracket includes a vertically arranged third chip pad, two second limit feet respectively arranged on both sides of the lower end of the third chip pad and extending horizontally inward, and a third pin arranged at the lower end of the third chip pad, the third pin includes a second vertical plate arranged at the lower end of the third chip and a third horizontal plate arranged at the lower end of the second vertical plate and extending horizontally inward, the third pins of the two outer frames are arranged relatively to each other, and the lower end of the third pin is in the same plane as the lower end of the first pin.

[0009] Furthermore, a second pin is disposed at the lower end of another of the second chip pads, and the lower end of the second pin is in the same plane as the lower end of the first pin.

[0010] Furthermore, the buffer mechanism includes an expansion joint with an arc-shaped cross section.

[0011] Furthermore, both the first chip pad and the third chip pad are provided with exhaust holes, which may be circular, polygonal or cross-shaped.

[0012] Furthermore, two stacked ceramic chips are welded between the two first brackets or between the adjacent first bracket and second bracket.

[0013] Furthermore, the second chip pad is integrally connected to the outer frame or the middle frame.

[0014] The present invention is also achieved through the following technical solutions:

[0015] A method for preparing a large-capacity multi-pin bracket capacitor comprises the following steps:

[0016] A. First, apply solder paste on the inner side of an outer frame;

[0017] B. Arrange several ceramic chips in sequence, and make one end of each ceramic chip contact with the inner side of the outer frame;

[0018] C. Then apply solder paste on both sides of the inner and outer sides of the middle frame;

[0019] D. Make the other end of each ceramic chip in step B contact the inner side of the middle frame in step C, then arrange several ceramic chips in sequence, and make one end of each ceramic chip contact the outer side of the middle frame, and the first pin of the middle frame is arranged opposite to the third pin of the outer frame described in step A;

[0020] E. Continue to place the required number of middle frames and ceramic chips with reference to step C and step D, with the first pins of each middle frame having the same direction;

[0021] F. Apply solder paste on the inner side surface points of another outer frame and make it contact with the ceramic chip. The third pin of this outer frame has the same direction as the first pin.

[0022] G. Apply solder paste inside the high-frequency frame and place the high-frequency chip into the high-frequency frame.

[0023] H. Enter the reflow soldering for welding.

[0024] The present invention has the following beneficial effects:

[0025] 1. Through two outer frames and at least one middle frame, the present invention densely arranges and welds a plurality of ceramic chips into one body. When in use, it is welded to the PCB board through multiple first pins and multiple third pins, which not only meets the large-capacity requirement but also greatly saves space, and the number of ceramic chips to be welded can be selected according to customer requirements; the first pin of the middle frame has a special structure. During the welding process, when the PCB is heated and deformed, the first pin and each buffer mechanism can effectively offset the deformation amount, thus avoiding the damage of the ceramic chip; by setting the high-frequency chip, it can form a low-impedance path for the high-order harmonics generated during the use of the capacitor, achieving the effect of effectively suppressing high-order harmonics and inrush current, thereby preventing the phenomena of overheating of the capacitor, aging of the insulating medium, decline of self-healing performance, and reduction of service life, and improving the reliability and stability of the capacitor; the high-frequency frame is connected to the outer frame or the middle frame, making the structure simpler and more reliable.

[0026] 2. The first pin is formed into a "C"-shaped structure by the first horizontal plate, the first vertical plate and the second horizontal plate. When the PCB board is highly deformed due to heat, the first pin deforms synchronously, thus effectively offsetting the stress received by the ceramic chip in the height direction. Each buffer mechanism can offset the stress received in the direction perpendicular to the frame through deformation; the first pin can also be used to support the corresponding ceramic chip, thereby realizing the splicing of multiple middle frames and ceramic chips. Description of the Drawings

[0027] The following further describes the present invention in detail with reference to the drawings.

[0028] Figure 1 It is a schematic structural diagram of the present invention.

[0029] Figure 2 It is a schematic structural diagram of the outer frame of the present invention.

[0030] Figure 3 It is a schematic structural diagram of the middle frame of the present invention.

[0031] Figure 4 It is a schematic structural diagram of the middle frame from another angle of the present invention.

[0032] Figure 5 Schematic diagram of the structure of a second chip pad of the high-frequency frame of the present invention.

[0033] Wherein, 1. Outer frame; 11. Second bracket; 12. Third chip pad; 13. Second limiting foot; 14. Third pin; 141. Second vertical plate; 142. Third horizontal plate; 2. Middle frame; 21. First bracket; 22. First chip pad; 23. First limiting foot; 24. First pin; 241. First horizontal plate; 242. First vertical plate; 243. Second horizontal plate; 31. Second chip pad; 32. Second pin; 4. Ceramic chip; 5. High-frequency chip; 6. Exhaust hole; 7. Buffer mechanism. Detailed implementation mode

[0034] As Figures 1 to 5 shown, the large-capacity multi-pin bracket capacitor includes two outer frames 1, eight middle frames 2, a high-frequency frame, a plurality of ceramic chips 4 and high-frequency chips 5. The two outer frames 1 are arranged opposite to each other, and the eight middle frames 2 are arranged at intervals between the two outer frames 1. The high-frequency frame is connected to the end of one outer frame 1. There are two layers of stacked ceramic chips 4 between the outer frame 1 and the adjacent middle frame 2, and there are also two layers of stacked ceramic chips 4 between two adjacent middle frames 2. The outer frame 1 includes a plurality of second brackets 11 arranged at intervals in sequence and a plurality of buffer mechanisms 7 respectively arranged between two adjacent second brackets 11. The middle frame 2 includes a plurality of first brackets 21 arranged at intervals in sequence and a plurality of buffer mechanisms 7 respectively arranged between two adjacent first brackets 21. The buffer mechanism 7 is specifically an expansion joint with an arc-shaped cross section.

[0035] The first bracket 21 includes a vertically arranged first chip pad 22, two first limiting feet 23 respectively arranged on both sides of the lower end of the first chip pad 22 and extending horizontally inward, and a first pin 24 arranged at the lower end of the first chip pad 22 and in a "C" shape. More specifically, the first pin 24 includes a first horizontal plate 241 arranged at the lower end of the first chip pad 22 and extending outward, a first vertical plate 242 arranged at the outer end of the first horizontal plate 241, and a second horizontal plate 243 arranged at the lower end of the first vertical plate 242 and extending inward. The length of the second horizontal plate 243 is greater than that of the first horizontal plate 241, and the end of the first horizontal plate 241 and the end of the first limiting foot 23 are located in the same plane. Ceramic chips 4 are welded on both the inner and outer sides of the first bracket 21. Specifically, the inner side is welded to the end of one ceramic chip 4, and the two first limiting feet 23 are in contact with the ceramic chip 4 to support it. The outer side is welded to the end of the other ceramic chip 4, and the first horizontal plate 241 of the first pin 24 is in contact with the ceramic chip 4 to support it.

[0036] The second bracket 11 includes a third chip pad 12 arranged vertically, two second limit pins 13 respectively arranged on both sides of the lower end of the third chip pad 12 and extending horizontally inward, and a third pin 14 arranged at the lower end of the third chip pad 12, the third pin 14 includes a second vertical plate 141 arranged at the lower end of the third chip and a third horizontal plate 142 arranged at the lower end of the second vertical plate 141 and extending horizontally inward, the third pins 14 of the two outer frames 1 are arranged oppositely, and the lower end of the third pin 14 is in the same plane as the lower end of the first pin 24. One end of the ceramic chip 4 is welded to the inner side of the second bracket 11, and the other end of the ceramic chip 4 is welded to the first bracket 21 adjacent to and corresponding to the second bracket 11.

[0037] The first chip pad 22 and the third chip pad 12 are both rectangular, and are provided with cross-shaped exhaust holes 6, which are used to exhaust the solder paste when the ceramic chip 4 is welded, so as to avoid the generation of pores after welding and ensure the welding quality. An expansion joint is provided between two adjacent first chip pads 22 and two adjacent third chip pads 12.

[0038] The high-frequency frame includes two second chip pads 31 arranged at a relative interval, and the high-frequency chip 5 is welded between the two second chip pads 31. One second chip pad 31 is connected to the third chip pad 12 at the edge of the outer frame 1. The lower end of the other second chip pad 31 is provided with a second pin 32, and the lower end of the second pin 32 is in the same plane as the lower end of the first pin 24. Among them, the high-frequency chip 5 is the prior art.

[0039] In this embodiment, the first chip pad 22, the two first limiting pins 23 and the first pin 24 of the first bracket 21 are integrally formed. The third chip pad 12, the two second limiting pins 13 and the third pin 14 of the second bracket 11 are integrally formed. A second chip pad 31 of the high-frequency frame is integrally formed with the third chip pad 12 at the edge of the second bracket 11.

[0040] The preparation method of a large-capacity multi-pin bracket capacitor comprises the following steps:

[0041] A. First, solder paste is applied to the inner side of an outer frame 1, and the outer frame 1 is placed in a jig. The jig mainly serves as a fixation device. The subsequent ceramic chip 4, the middle frame 2 and the other outer frame 1 are all placed in the jig before welding. The specific structure of the jig is the prior art.

[0042] B. Arrange several ceramic chips 4 in sequence, and make one end of each ceramic chip 4 contact and fit with the inner side surface of the outer frame 1. In this process and the subsequent welding process, the second limiting foot 13 of the outer frame 1 plays the role of supporting and limiting the ceramic chip 4;

[0043] C. Then apply solder paste on both the inner and outer sides of the middle frame 2;

[0044] D. Make the other end of each ceramic chip 4 in step B contact and fit with the inner side surface of the middle frame 2 in step C, then arrange several ceramic chips 4 in sequence, and make one end of each ceramic chip 4 contact and fit with the outer side surface of the middle frame 2, and the first pin 24 of the middle frame 2 is arranged opposite to the third pin 14 of the outer frame 1 described in step A;

[0045] E. Continue to place the required number of middle frames 2 and ceramic chips 4 with reference to step C and step D, with the first pins 24 of each middle frame 2 in the same direction;

[0046] F. Apply solder paste on the inner side of another outer frame 1 and make it contact and fit with the ceramic chip 4. The third pin 14 of the outer frame 1 is in the same direction as the first pin 24;

[0047] G. Apply solder paste inside the high-frequency frame and place the high-frequency chip 5 inside the high-frequency frame;

[0048] H. Enter the reflow soldering process for soldering. During the soldering process, a certain compressive stress needs to be added at the two outer frames 1 to ensure the soldering quality. The process of adding compressive stress is an existing technology.

[0049] When the large-capacity multi-pin bracket capacitor is used, each first pin 24, second pin 32 and third pin 14 are welded to the corresponding position of the PCB board. Since each pin is in the same plane, welding can be conveniently performed.

[0050] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the specification should still fall within the scope covered by the patent of the present invention.

Claims

1. A large-capacity multi-pin bracket capacitor, characterized in that: It includes two outer frames, at least one middle frame, a high-frequency frame, several ceramic chips and high-frequency chips. The middle frame includes several first brackets arranged at intervals in sequence and a plurality of buffer mechanisms respectively arranged between two adjacent first brackets. The outer frame includes several second brackets arranged at intervals in sequence and a plurality of buffer mechanisms respectively arranged between two adjacent second brackets. The first bracket includes a first lead in a "C" shape. Ceramic chips are welded on both the inner and outer sides of the first bracket. The upper end of the first lead contacts the corresponding ceramic chip to support the ceramic chip. Ceramic chips are welded on the inner side of the second bracket. The two ends of the ceramic chip are respectively welded to two adjacent first brackets or an adjacent first bracket and the second bracket. The high-frequency frame is connected to an outer frame or the middle frame, and the high-frequency chip is welded on the high-frequency frame.

2. A large-capacity multi-pin bracket capacitor according to claim 1, characterized in that: The first bracket further includes a first chip pad arranged vertically and two first limiting feet respectively arranged on both sides of the lower end of the first chip pad and extending horizontally inwards. The first lead includes a first horizontal plate arranged at the lower end of the first chip pad and extending outwards, a first vertical plate arranged at the outer end of the first horizontal plate, and a second horizontal plate arranged at the lower end of the first vertical plate and extending inwards.

3. A large-capacity multi-pin bracket capacitor according to claim 2, characterized in that: The high-frequency frame includes two second chip pads arranged at intervals relatively. One second chip pad is connected to the outer frame or the middle frame, and the high-frequency chip is welded between the two second chip pads.

4. A large-capacity multi-pin bracket capacitor according to claim 2 or 3, characterized in that: The second bracket includes a third chip pad arranged vertically, two second limiting feet respectively arranged on both sides of the lower end of the third chip pad and extending horizontally inwards, and a third lead arranged at the lower end of the third chip pad. The third lead includes a second vertical plate arranged at the lower end of the third chip and a third horizontal plate arranged at the lower end of the second vertical plate and extending horizontally inwards. The third leads of the two outer frames are arranged relatively, and the lower ends of the third leads and the lower ends of the first leads are in the same plane.

5. A large-capacity multi-pin bracket capacitor according to claim 3, characterized in that: A second lead is arranged at the lower end of the other second chip pad, and the lower end of the second lead is in the same plane as the lower end of the first lead.

6. A large-capacity multi-pin bracket capacitor according to claim 1, 2 or 3, characterized in that: The buffer mechanism includes an expansion joint with an arc-shaped cross section.

7. A large-capacity multi-pin bracket capacitor according to claim 4, characterized in that: Exhaust holes are formed on both the first chip pad and the third chip pad, and the exhaust holes are circular, polygonal or cross-shaped.

8. A large-capacity multi-pin bracket capacitor according to claim 1, 2 or 3, characterized in that: Two ceramic chips arranged in layers are welded between the two first brackets or an adjacent first bracket and the second bracket.

9. A large-capacity multi-pin bracket capacitor according to claim 3, characterized in that: The second chip pad is integrally connected to the outer frame or the middle frame.

10. A method for preparing a large-capacity multi-pin bracket capacitor according to any one of claims 1 to 9, characterized in that: It includes the following steps: A. First, apply solder paste on the inner side of an outer frame. B. Then arrange several ceramic chips in sequence and make one end of each ceramic chip contact the inner side of the outer frame. C. Then apply solder paste on both the inner and outer sides of a middle frame. D. Make the other end of each ceramic chip in step B contact the inner side of the middle frame in step C, then arrange several ceramic chips in sequence and make one end of each ceramic chip contact the outer side of the middle frame. The first leads of the middle frame and the third leads of the outer frame described in step A are arranged relatively. E. Continue to place the required number of middle frames and ceramic chips with reference to steps C and D, and the directions of the first leads of each middle frame are the same. F. Apply solder paste on the inner side of another outer frame and make it contact with the ceramic chip. The third pin of the outer frame has the same direction as the first pin. G. Apply solder paste inside the high-frequency frame and place the high-frequency chip inside the high-frequency frame; H. Enter reflow soldering for soldering.

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