Condenser flow stabilization and pressure boosting device
By setting the fourth plate surface in the heat exchange module of the condenser to block the overflow and leakage of water, the problem of unstable water flow is solved, stable cooling and condensation of water and high pressure are achieved, and the stability of water flow is improved.
Patent Information
- Application Number
- CN201911401323.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-12-31
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2039-12-31
AI Technical Summary
In the prior art, the flow path of water inside the condenser is not restricted, resulting in water leaking easily and pressure cannot be properly retained, affecting the stability of the water flow.
A heat exchange module is designed to form a semi-open inner channel through continuous stacking and assembly of a large number of heat exchange elements, and a fourth plate surface is set at both ends of the channel to prevent liquid or gaseous water from directly contacting the chamber and the outer cover to avoid overflow and leakage.
By blocking the overflow and leakage of liquid water or gaseous water, and maintaining the circulation of water in the internal channel, the stable cooling and condensation of water and the formation of high pressure are achieved, and the liquid water is quickly forced to discharge, improving the stability of the water flow.
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Abstract
Description
Technical Field
[0001] The present invention relates to a condenser flow-stabilizing and pressure-boosting device, which is used to convert water evaporated into gas by heat into gas and liquid state inside to achieve heat dissipation effect. The device is suitable for use with an evaporator as a heat dissipation device for electronic components. Background Art
[0002] In recent years, the heat generated by electronic components has been increasing rapidly with the improvement of semiconductor technology. How to improve the heat dissipation capacity of electronic components and maintain the normal operation of components has become a very important engineering issue. The currently widely used direct air cooling technology can no longer meet the heat dissipation needs of many electronic components with high heat flux, and other solutions must be sought.
[0003] In the existing technology, in addition to air cooling technology, there is a method of achieving heat dissipation by converting water into liquid and gaseous state. This technology provides two sets of heat spreaders and two sets of connected pipes. One set of heat spreaders is used to evaporate to take away the absorbed heat, and the other set of heat spreaders is used to condense (i.e., condenser) to cool down and return the output cooling liquid for cooling and heat dissipation. The pressures in the two sets of heat spreaders are different, so water can be automatically transported back and forth to form a circulating loop. However, there is a large amount of water flowing inside the heat spreader. Therefore, when the water flow path is not restricted, the water inside is prone to leakage, and the pressure cannot be properly retained inside, thereby interfering with the flow of water inside and affecting the use efficiency.
[0004] Therefore, a heat exchange module is designed to prevent the water inside the heat exchange module from directly contacting the outer shell, so as to avoid leakage and quickly increase the internal pressure, so that the water can be discharged stably and quickly, thereby improving the stability of the water flow. This is a solution for the steady flow and pressure boosting device of the condenser of the present invention. Summary of the invention
[0005] The flow-stabilizing and pressure-boosting device of the condenser of the present invention comprises a heat exchange module and a shell. The heat exchange module is assembled by stacking a large number of heat exchange elements in succession. Each heat exchange element has a first plate surface, a second plate surface and a third plate surface, so that a semi-open inner channel is formed inside the heat exchange element. A fourth plate surface is respectively provided at both ends of the heat exchange element relative to the inner channel. An air inlet and a water outlet that are not connected to the outside are respectively provided on the heat exchange module. A chamber for placing the heat exchange module is provided in the shell. The shell has an outer cover for covering the chamber. An air inlet and a water outlet are respectively provided on the shell. The air inlet corresponds to the air inlet. , and the water outlet corresponds to the position of the water outlet; thereby, the air inlet can flow into gaseous water, the gaseous water is cooled and condensed into liquid water in each inner channel, and then discharged from the water outlet, and the fourth plate surface can effectively block the two ends of each inner channel, therefore, it can be prevented that the liquid water or gaseous water in each inner channel directly contacts the chamber and the outer cover from the two ends of each inner channel, thereby avoiding overflow and leakage, and the liquid water or gaseous water is retained in each inner channel in large quantities, the gaseous water can be stably cooled and condensed into liquid water, especially blocked at the two ends of each inner channel, the internal pressure can be quickly increased to form high pressure, and the high pressure can quickly force the liquid water to be discharged from the water outlet, so the internal water flow is stabilized by pressurization.
[0006] In a preferred embodiment, both ends of each heat exchange element are tightly attached to the chamber, and the heat exchange module is provided with at least one channel passing through each heat exchange element.
[0007] In a preferred embodiment, there is a predetermined space between at least one end of each heat exchange element and the inner side of the container, and a blocking block is provided in the predetermined space. The blocking block can prevent liquid water or gaseous water in each inner channel from directly contacting the container and the outer cover from both ends of each inner channel, thereby overflowing at the joint and leaking.
[0008] In a preferred embodiment, the blocking block is disposed on a surface of the outer cover opposite to the containing chamber.
[0009] In a preferred embodiment, the fourth panel is formed by extending the two ends of the first panel toward the inner channel, and the extension length of the fourth panel is consistent with the second panel and the third panel, so that the fourth panel completely blocks both ends of each inner channel.
[0010] In a preferred embodiment, the fourth plate surface is formed by extending the two ends of the first plate surface toward the middle or the top of the inner channel, and the extension length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface blocks the middle or the top of the two ends of each inner channel, and the lower part of the two ends of the first plate surface can extend toward the outside direction to form a protruding section.
[0011] In a preferred embodiment, the fourth panel is formed by extending the two ends of the first panel toward the inner channel, and the extension length of the fourth panel is shorter than that of the second panel and the third panel, so that the fourth panel does not completely block the two ends of each inner channel.
[0012] In a preferred embodiment, a slot is respectively formed on the upper side of the first board surface near both ends, and the fourth board surface is inserted into the slot.
[0013] In a preferred embodiment, the air inlet and the water outlet are opened near one end of the inner channel, and each channel is opened at a position of the heat exchange module farther from the air inlet and the water outlet.
[0014] In a preferred embodiment, the air inlet and the water outlet are opened near the middle of the inner channel, and each channel is opened at both ends of the heat exchange module. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional exploded schematic diagram of a first embodiment of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0016] Figure 2 It is a three-dimensional schematic diagram of a first embodiment of a heat exchange module of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0017] Figure 3 It is a three-dimensional schematic diagram of a first embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0018] Figure 4 It is an overall schematic diagram of the flow-stabilizing and pressure-boosting device of the condenser of the present invention combined with the evaporator.
[0019] Figure 5 It is a cross-sectional schematic diagram of the operation of the first embodiment of the flow-stabilizing and pressure-boosting device for the condenser of the present invention.
[0020] Figure 6 It is a cross-sectional schematic diagram of the operation of the first embodiment of the flow-stabilizing and pressure-boosting device for the condenser of the present invention.
[0021] Figure 7 It is a cross-sectional schematic diagram of the operation of the first embodiment of the flow-stabilizing and pressure-boosting device for the condenser of the present invention.
[0022] Figure 8 It is a partial cross-sectional schematic diagram of the first embodiment of the flow stabilizing and pressurizing device for the condenser of the present invention.
[0023] Fig.9A It is a three-dimensional schematic diagram of a second embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0024] Fig. 9BIt is a three-dimensional schematic diagram of a third embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0025] Fig. 9C It is a three-dimensional schematic diagram of a fourth embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0026] Fig.9D It is a three-dimensional schematic diagram of a fifth embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0027] Fig.9E It is a perspective schematic diagram of a sixth embodiment of a heat exchange element of a flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0028] Fig.10 It is a perspective exploded schematic diagram of a second embodiment of the flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0029] Fig.11 It is a partial cross-sectional schematic diagram of a second embodiment of the flow stabilizing and pressurizing device for a condenser of the present invention.
[0030] Fig.12 It is a three-dimensional exploded schematic diagram of a third embodiment of the flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0031] Fig.13 It is a perspective exploded schematic diagram of a fourth embodiment of the flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0032] Fig.14 It is a schematic cross-sectional view of the fourth embodiment of the flow-stabilizing and pressure-boosting device for a condenser of the present invention.
[0033] Fig.15 It is a schematic cross-sectional view of the operation of the fifth embodiment of the flow-stabilizing and pressure-boosting device for the condenser of the present invention.
[0034] Description of Reference Numerals
[0035] 1 Heat exchange module
[0036] 11 Heat exchange element
[0037] 111 First Board
[0038] 112 Second board
[0039] 113 Third Board
[0040] 114 Inner Passage
[0041] 115 Fourth Board
[0042] 116 protruding segment
[0043] 117 slots
[0044] 12 Intake
[0045] 13 outlet
[0046] 14 channels
[0047] 2 Housing
[0048] 21 Chamber
[0049] 22 Cover
[0050] 23 Air Inlet
[0051] 24 Water outlet
[0052] 3 Blocks
[0053] 31 Gap
[0054] 4 cooling fins
[0055] 5 pipe
[0056] 6 Evaporator. DETAILED DESCRIPTION
[0057] Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings.
[0058] See also Figures 1 to 3 , respectively, are a three-dimensional schematic diagram of a flow-stabilizing and pressure-boosting device for a condenser of the present invention and a cross-sectional schematic diagram of an internal structure. As shown in the figure, it is a first embodiment of the overall structural configuration of the present invention, comprising at least a heat exchange module 1 and a housing 2;
[0059] The heat exchange module 1 is formed by stacking a large number of heat exchange elements 11 in a row, each heat exchange element 11 having a first plate surface 111, a second plate surface 112 and a third plate surface 113. The first plate surface 111, the second plate surface 112 and the third plate surface 113 are integrally formed or fixed to each other, so that a semi-open inner channel 114 is formed inside the heat exchange element 11. A fourth plate surface 114 is provided at both ends of the heat exchange element 11 relative to the inner channel 114. The heat exchange module 1 is provided with an air inlet 12 and a water outlet 13 which are not communicated with the outside (i.e., part of each heat exchange element 11 is provided with the air inlet 12; part of each heat exchange element 11 is provided with the water outlet 13), and the air inlet 12 and the water outlet 13 are provided near one end of the inner channel 114, and at least one channel 14 which passes through each heat exchange element 11 is provided on the heat exchange module 1 at a position far from the air inlet 12 and the water outlet 13;
[0060] The shell 2 is provided with a chamber 21 for placing the heat exchange module 1, and both ends of each heat exchange element 11 are tightly attached to the chamber 21. The shell 2 also has an outer cover 22 for covering the chamber 21, and the shell 2 is provided with an air inlet 23 and a water outlet 24, the air inlet 23 corresponds to the position of the air inlet 12, and the water outlet 24 corresponds to the position of the water outlet 13.
[0061] See also Figures 4 to 7 The housing 2 is provided with a heat dissipation fin 4 and at least two through-tubes 5, one of which is connected to the air inlet 23, and the other of which is connected to the water outlet 24. The through-tube 5 is also connected to an evaporator 6:
[0062] When the heat exchange is performed, the evaporator 6 is assembled on a heat source (such as an electronic component). The heat energy generated by the heat source passes through the evaporator 6 to evaporate the liquid water inside into gaseous water. The gaseous water then passes through one of the through pipes 5 and enters the air inlet 12 to each inner channel 114.
[0063] After entering each inner channel 114, the gaseous water will automatically pass through each channel 14 to the outlet channel 13 with lower pressure. In the process of the gaseous water going to the outlet channel 13, part of the heat energy will be released by the heat dissipation fins 4, which quickly take away the heat energy, so that the gaseous water is cooled and condensed into liquid water, and then flows from the inner channel 114 to the outlet channel 13, and then flows back to the evaporator 6 through the outlet 24 and another through pipe 5, so that the liquid water is heated and evaporated into gaseous water again, and the cycle is continuous, so as to achieve the purpose of circulating heat dissipation;
[0064] See also Figure 1 and Figure 8 The fourth plate surface 115 is provided at both ends of each inner channel 114 for blocking. Therefore, it is possible to prevent the liquid water or gaseous water in each inner channel 114 from directly contacting the chamber 21 and the outer cover 22 from both ends of each inner channel 114, and then overflowing and leaking at the joints. A large amount of liquid water or gaseous water is retained in each inner channel 114, and the gaseous water can be stably cooled and condensed into liquid water, especially blocked at both ends of each inner channel 114, and the internal pressure is quickly increased to form a high pressure. The high pressure can quickly force the liquid water to be discharged from the outlet 13, so the internal water flow can be stabilized.
[0065] The condenser flow-stabilizing and pressure-boosting device of the present invention can be found in Figure 3, which is a first embodiment of the heat exchange element 11. The fourth plate surface 115 of the heat exchange element 11 is formed by extending the two ends of the first plate surface 111 toward the inner channel 114, and the extension length of the fourth plate surface 115 is consistent with the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 completely blocks the two ends of each inner channel 114; please refer to Fig.9A , which is a second embodiment of the heat exchange element 11, the fourth plate surface 115 is formed by extending the two ends of the first plate surface 111 upward toward the inner channel 114, and the extension length of the fourth plate surface 115 is consistent with the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 only blocks the upper ends of each inner channel 114; please refer to Fig. 9B , which is a third embodiment of the heat exchange element 11, the fourth plate surface 115 is formed by extending the two ends of the first plate surface 111 toward the middle of the inner channel 114, and the extension length of the fourth plate surface 115 is consistent with the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 is only blocked in the middle of the two ends of each inner channel 114; please refer to Fig. 9C , which is a fourth embodiment of the heat exchange element 11, the fourth plate surface 115 is formed by extending the two ends of the first plate surface 111 toward the inner channel 114, and the extension length of the fourth plate surface 115 is shorter than that of the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 does not completely cover the two ends of each inner channel 114; please refer to Fig.9D , which is the fifth embodiment of the heat dissipation element 11, the fourth plate surface 115 is formed by the two ends of the first plate surface 111 extending upward toward the inner channel 114, and the lower part of the two ends of the first plate surface 111 extends toward the outer side to form a protruding section 116, and the extension length of the fourth plate surface 115 is consistent with that of the second plate surface 112 and the third plate surface 113, and the fourth plate surface 115 only blocks the upper part of the two ends of each inner channel 114; please refer to Fig.9EThis is the sixth embodiment of the heat exchange element 11. A slot 117 is respectively provided above the two ends of the first plate surface 111, and the fourth plate surface 115 is inserted into the slot 117, and the fourth plate surface 115 only blocks the upper sides of the two ends of each inner channel 114; the first embodiment described above belongs to the full-block form, and the second to fifth embodiments all belong to the half-block form. The user can selectively choose one of each embodiment of the heat exchange element 11 described above to use in combination. In terms of manufacturing, not only are the two ends of each inner channel 114 symmetrical, but one end can also be selectively designed to be a full-block form and the other end to be a half-block form. Therefore, with the first embodiment, For example, the end of each inner channel 114 close to the air inlet 12 and the water outlet 13 can be in a full-block form, and the other end away from the air inlet 12 and the water outlet 13 can be in a full-block or half-block form. This can ensure that liquid water or gaseous water is lost when flowing through the air inlet 12 and the water outlet 13, so that a large amount of liquid water or gaseous water is retained in each inner channel 114 for heat exchange. If the heat exchange element 11 is used in a full-block form, the heat dissipation module 1 must be provided with at least one channel 14 that passes through each heat exchange element 11. Conversely, if the heat exchange element 11 is used in a half-block form, the heat dissipation module 1 can selectively open or not open the channel 14.
[0066] See also Fig.10 and Fig.11 , which is a second embodiment of the overall structural configuration of the present invention. In this embodiment, a predetermined space is provided between one end of each heat exchange element 11 away from the air inlet 12 and the water outlet 13 and the inner side surface of the chamber 21. A blocking block 3 is provided between one end of the heat exchange element 11 away from the air inlet 12 and the water outlet 13 and the inner side surface of the chamber 21. The blocking block 3 can prevent the liquid water or gaseous water in each inner channel 114 from directly contacting the chamber 21 and the outer cover 22 through each inner channel 114, thereby overflowing and leaking at the joint. A large amount of liquid water or gaseous water is retained in each inner channel 114. The gaseous water can be stably cooled and condensed into liquid water, especially blocked at both ends of each inner channel 114, and the internal pressure is quickly increased to form a high pressure. The high pressure can quickly force the liquid water to be discharged from the water outlet 13, and each heat exchange element 11 uses the half-block form of the second to sixth embodiments (equivalent to Fig.9A , Fig. 9B , Fig. 9C , Fig.9D , Fig.9E , the second embodiment is used in the figure), and a notch 31 is formed at one end of the blocking block 3 relative to each inner channel 114, and the notch 31 retains space for liquid water or gaseous water to flow.
[0067] See also Fig.12, which is a third embodiment of the overall structural configuration of the present invention. This embodiment continues the second embodiment. In this embodiment, there is a predetermined space between one end of each heat exchange element 11 away from the air inlet 12 and the water outlet 13 and the inner side of the chamber 21, and each blocking block 3 is arranged on a side of the outer cover 22 opposite to the chamber 21. When the outer cover 22 is covered on the housing 2, each blocking block 3 is placed between one end of each heat exchange element 11 away from the air inlet 12 and the water outlet 13 and the inner side of the chamber 21, and each heat exchange element 11 uses the half-block form of the second to sixth embodiments (equivalent to Fig.9A , Fig. 9B , Fig. 9C , Fig.9D , Fig.9E , the second embodiment is used in the figure), and the blocking block 3 is provided with a notch 31 at both ends relative to each inner channel 114, and the notch 31 retains space for liquid water or gaseous water to flow.
[0068] See also Fig.13 and Fig.14 , which is the fourth embodiment of the overall structural configuration of the present invention, the air inlet 12 and the water outlet 13 are opened near the middle of the inner channel 114, and each channel 14 is opened at both ends of the heat exchange module 1 relative to each inner channel 114. The difference between this embodiment and the first embodiment is that the flow path of liquid water or gaseous water is different. This embodiment enters from the middle and exits from the side. Therefore, the fifth plate surface 115 at both ends of each inner channel 114 of this fourth embodiment can be in the form of full block or half block.
[0069] See also Fig.15 , which is the fifth embodiment of the overall structural configuration of the present invention. In this embodiment, there is a predetermined space between the two ends of each heat dissipation element 11 and the inner side of the chamber 21, and each heat dissipation element 11 uses a Fig.9D In the half-block form of the fifth embodiment, the protruding section 116 can be located between the two ends of the heat dissipation element 11 and the inner side surface of the chamber 21, and each fourth plate surface 115 is blocked above the two ends of each inner channel 114, and the water outlet 13 is arranged at a position corresponding to the top of each protruding section 116, the air inlet 12 and the air inlet port 23 are both located above, and the water outlet 24 is located on the side of the outer shell 2, and the liquid water passes through the air inlet port 23 and the air inlet 12 in sequence and enters each inner channel 114 through the bottom of each fourth plate surface 115, and then flows through each channel 14 to various places in the heat dissipation module 1, so that the liquid water evaporates into gaseous water after being heated once.
[0070] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
Claims
1. A flow-stabilizing and pressure-boosting device for a condenser, characterized in that: It includes: A heat exchange module is formed by stacking and assembling a large number of heat exchange elements in a row, each heat exchange element has a first plate surface, a second plate surface and a third plate surface, so that a semi-open inner channel is formed inside the heat exchange element, and a fourth plate surface is respectively provided at both ends of the heat exchange element relative to the inner channel, and an air inlet and a water outlet that are not communicated with the outside are respectively opened on the heat exchange module; a housing, wherein a chamber for placing the heat exchange module is disposed in the housing, the housing has an outer cover for covering the chamber, and an air inlet and a water outlet are respectively disposed on the housing, the air inlet corresponds to the position of the air inlet, and the water outlet corresponds to the position of the water outlet; The air inlet can flow into gaseous water, and the gaseous water is cooled and condensed into liquid water in each inner channel, and then discharged from the water outlet. The fourth plate surface can block the two ends of each inner channel to prevent the liquid water or gaseous water in each inner channel from directly contacting the chamber and the outer cover from the two ends of each inner channel, thereby preventing overflow and leakage, so that a large amount of liquid water or gaseous water is retained in each inner channel, so that the gaseous water can be stably cooled and condensed into liquid water.
2. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: Both ends of each heat exchange element are respectively closely attached to the containing chamber, and the heat exchange module is also provided with at least one channel passing through each heat exchange element.
3. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: There is a predetermined space between at least one end of each heat exchange element and the inner side of the container, and a blocking block is provided in the predetermined space. The blocking block is used to prevent liquid water or gaseous water in each inner channel from directly contacting the container and the outer cover from the two ends of each inner channel, so as to prevent overflow and leakage at the joint.
4. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The fourth plate surface is formed by extending the two ends of the first plate surface toward the inner channel. The extension length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface completely blocks the two ends of each inner channel.
5. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The fourth plate surface is formed by extending from both ends of the first plate surface toward the middle or top of the inner channel. The extension length of the fourth plate surface is consistent with that of the second plate surface and the third plate surface, so that the fourth plate surface is blocked in the middle or top of both ends of each inner channel.
6. The flow-stabilizing and pressure-boosting device for a condenser according to claim 5, characterized in that: The lower parts of the two ends of the first plate surface extend outward to form a protruding section.
7. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The fourth plate surface is formed by extending the two ends of the first plate surface toward the inner channel. The extension length of the fourth plate surface is shorter than that of the second plate surface and the third plate surface, so that the fourth plate surface does not completely cover the two ends of each inner channel.
8. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The first board surface is provided with a slot at the upper part near both ends, and the fourth board surface is inserted into the slot.
9. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The air inlet and the water outlet are opened near one end of the inner channel, and each channel is opened at a position of the heat exchange module far from the air inlet and the water outlet.
10. The flow-stabilizing and pressure-boosting device for a condenser according to claim 1, characterized in that: The air inlet and the water outlet are opened near the middle of the inner channel, and each channel is opened at two ends of the heat exchange module.
Citation Information
Patent Citations
Steady-flow supercharging device of condenser
CN211210319U