Radar device and mobile platform

Abstract

The present application provides a radar device and mobile platform, relating to the field of radar technology, to address the technical problem of poor performance of radar devices. The radar device provided in the present application includes a housing, an antenna board, and a connector. The antenna board is disposed within the housing, having a first board surface and a second board surface disposed opposite each other, with the first board surface being used for transmitting and receiving signals. The connector is disposed within the housing and is used to connect to other devices outside the housing. The connector includes an electrical connection structure that is electrically connected to the antenna board and is located on one side of the second board surface. In the radar device provided in the present application, disposing the connector's electrical connection structure on one side of the second board surface does not adversely affect the antenna board's signal transmission and reception performance, and can ensure the antenna board's layout area.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 20, 2020, with application number 202010067460.1 and application name “A radar device and mobile platform”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of radar technology, and in particular to a radar device and a mobile platform. Background Art

[0003] Currently, vehicles with autonomous driving capabilities are becoming a major development trend in the automotive industry. To achieve this, radar devices have become an indispensable, key component in vehicles. In practical applications, on-board millimeter-wave radar devices must offer high performance and protection levels, while also possessing a compact and integrated design. Millimeter-wave radar devices primarily rely on antennas to transmit millimeter waves (e.g., electromagnetic waves with frequencies between 30 and 300 GHz and wavelengths between 1 and 10 mm). In practical applications, radar devices require connectors to electrically connect the radar device to other devices, such as onboard computers. However, in current radar devices, the improper placement of connectors can affect the electrical connection structure within the connector, impacting antenna performance. Alternatively, in some radar devices, the connector encroaches on the antenna's layout space, reducing the antenna's size and hindering performance. Summary of the Invention

[0004] The present application provides a radar device and a mobile platform that can effectively ensure antenna operating performance and layout area.

[0005] On the one hand, the present application provides a radar device comprising a housing, a connector, and an antenna board located within the housing; the antenna board can transmit electromagnetic waves to the outside or receive electromagnetic waves from the outside through the housing, and the housing can provide a relatively sealed space for the antenna board to prevent external impurities such as dust and water vapor from affecting the antenna board. The antenna board has a first board surface and a second board surface arranged in opposite directions, and the first board surface is used for transmitting and receiving signals. The connector has an electrical connection structure that is used to establish an electrical connection between other devices outside the housing and the antenna board. When the antenna board assembly is installed in the housing, the electrical connection structure of the connector is located on one side of the second board surface. Since the side of the antenna board used for the first board surface is used for transmitting and receiving signals, arranging the electrical connection structure on one side of the second board surface can prevent the electrical connection structure from obstructing the signal transmission and reception of the antenna board. In addition, there will be no positional interference between the electrical connection structure and the antenna board, which is conducive to increasing the layout area of the antenna board.

[0006] When the electrical connection structure of the connector is specifically configured, the electrical connection structure may be a metal contact, a spring, a PIN, or other structural components that can achieve reliable electrical connection.

[0007] Furthermore, in specific implementations, to facilitate quick connection between the connector and the antenna board, the second surface of the antenna board can be provided with conductive structures such as pads and vias. In specific applications, the type of conductive structure can be adaptively adjusted based on actual needs and is not limited here.

[0008] In specific implementations, the structure of the housing can be diverse.

[0009] For example, the radome, the insulating portion of the bottom shell, and the metal heat sink can be independent components. Connectors (e.g., screws) or welding can be used to assemble the entire shell between the radome and the insulating portion, between the radome and the metal heat sink, and between the insulating portion and the metal heat sink. Alternatively, the radome and the insulating portion of the bottom shell can be integrally molded parts, and the metal heat sink can be fixedly connected to the insulating portion or the radome using connectors to form the entire shell. Alternatively, the metal heat sink and the insulating portion can be formed into an integral structure using a process such as secondary injection molding.

[0010] Specifically, in one embodiment provided herein, the radome, the insulating portion, and the metal heat sink can be independent components. In a specific implementation, the insulating portion can be a frame-like structure, for example, comprising a base plate and side plates located at the edges of the base plate. A through-hole structure can be provided in the base plate, and the metal heat sink can be fixedly connected to the base plate. The metal heat sink can also block the through-hole structure to improve the airtightness of the connection between the insulating portion and the metal heat sink.

[0011] In a specific implementation, the connection method between the insulating part and the metal heat dissipation part can be various. For example, a first connection part can be provided in the insulating part, and a second connection part can be provided in the metal heat dissipation part. After the first connection part and the second connection part are tightly connected, a tight connection between the insulating part and the metal heat dissipation part can be achieved. Specifically, the first connection part can be a flange or a groove structure provided at the edge of the through-hole structure, and the second connection part can be a groove structure or a flange provided at the edge of the metal heat dissipation part. After the flange or groove structure in the insulating part and the groove structure or flange in the metal heat dissipation part are tightly matched, a tight connection between the insulating part and the metal heat dissipation part can be achieved. In a specific implementation, in order to ensure the connection stability between the insulating part and the metal heat dissipation part, the first connection part in the insulating part can be heated to a molten state by a process such as laser welding, so that the first connection part and the second connection part are bonded, thereby improving the connection stability and tightness between the insulating part and the metal heat dissipation part.

[0012] In some embodiments, the insulating portion and the metal heat dissipation portion may be fixedly connected and sealedly docked by threaded connection, clamping, bonding, or the like.

[0013] For example, in one embodiment provided herein, a snap-fit connection is employed between the radome and the insulating portion. Specifically, protrusions may be provided on the radome, and snaps may be provided on the insulating portion. When the radome and insulating portion are connected, the protrusions in the radome and the snaps in the insulating portion engage with each other, thereby achieving a fixed connection between the radome and the insulating portion. In specific implementations, the number and placement of the protrusions may vary, and the number and placement of the snaps may be adaptively adjusted based on the number and placement of the protrusions. Furthermore, in some embodiments, the radome and insulating portion may be fixedly connected using bonding, threading, welding, or other methods, which are not specifically limited in this application.

[0014] Furthermore, to ensure a tight connection between the radome and the insulating portion, in some embodiments, the upper edge of the insulating portion may be provided with a groove, and the lower edge of the radome may be provided with a flange. When the radome and insulating portion are fastened together, the flange of the radome fits into the groove of the insulating portion and tightly abuts against the inner wall of the groove, ensuring a tight connection between the radome and the insulating portion.

[0015] In some embodiments, in order to improve the airtightness of the connection between the radome and the insulating part, a sealing ring may be provided between the radome and the insulating part. Specifically, the sealing ring may be provided in a groove. When the radome and the insulating part are fastened to each other and fixed, the flange of the radome is embedded in the groove of the insulating part and tightly abuts against the sealing ring. At the same time, the flange squeezes the sealing ring so that the sealing ring is tightly abutted against the inner wall of the groove, thereby improving the airtightness of the connection between the insulating part and the radome. In other embodiments, a sealant or the like may be filled at the joint between the radome and the insulating part (for example, between the flange and the groove) to ensure the airtightness of the connection between the radome and the insulating part. In other embodiments, the flange may also be provided in the insulating part, and the groove may be provided in the radome.

[0016] In addition, during specific implementation, the position and proportion of the metal heat dissipation portion in the bottom shell can be varied.

[0017] For example, the metal heat sink can be positioned directly opposite the rear end of the antenna assembly, allowing heat generated by the antenna assembly to be effectively radiated or transferred to the metal heat sink, thereby effectively improving the metal heat sink's cooling effect on the antenna assembly. In some embodiments, the antenna assembly's contour area can be no larger than the contour area of the metal heat sink, allowing heat generated by the antenna assembly to be effectively radiated or transferred to the metal heat sink, thereby improving the metal heat sink's cooling effect on the antenna assembly.

[0018] In addition, in some embodiments, a heating element (such as a controller, etc.) can be further provided at the rear end of the antenna assembly, and a receiving groove for accommodating the heating element can be further provided on the inner side of the metal heat dissipation portion, thereby facilitating the miniaturization of the radar device. In addition, the distance between the metal heat dissipation portion and the heating element, as well as the distance between the metal heat dissipation portion and the circuit board can be effectively reduced, thereby reducing the heat conduction distance between the circuit board and electronic components and the metal heat dissipation portion, thereby improving the heat dissipation performance of the radar device.

[0019] On the other hand, an embodiment of the present application further provides a mobile platform comprising an information processing system and any of the above-described radar devices. The information processing system is configured to determine characteristic information of a detected object based on the electromagnetic waves generated and received by the radar device. The characteristic information includes, but is not limited to, target distance, position, altitude, speed, attitude, and even shape. Specifically, the information processing system can accurately measure the propagation time from the radar device transmitting the electromagnetic wave to the electromagnetic wave reflected by the target object. Since the speed of light is known, the propagation time can be converted into a distance measurement, thereby determining the distance from the radar device to the target object.

[0020] In practical applications, there is no restriction on the specific type of the above-mentioned mobile platform. For example, it can be a car, a ship, an airplane, a train, a spacecraft, a drone or other mobile platform, all of which are applicable to the technical solution of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A diagram illustrating an application scenario of a millimeter-wave radar device provided in an embodiment of the present application;

[0022] Figure 2 A schematic cross-sectional view of a millimeter-wave radar device according to an embodiment of the present application;

[0023] Figure 3 An exploded view of another millimeter-wave radar device provided in an embodiment of the present application;

[0024] Figure 4 A schematic structural diagram of an antenna board provided in an embodiment of the present application;

[0025] Figure 5 An exploded view of a portion of the structure of another millimeter-wave radar device provided in an embodiment of the present application;

[0026] Figure 6 A top view of a bottom shell provided in an embodiment of the present application;

[0027] Figure 7 A cross-sectional view of a bottom shell provided in an embodiment of the present application;

[0028] Figure 8A partial interface diagram of a bottom shell provided in an embodiment of the present application;

[0029] Figure 9 A structural block diagram of a mobile platform provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0031] To facilitate understanding of the radar device provided in the embodiments of the present application, the following first introduces its application scenarios.

[0032] like Figure 1 As shown, in the field of vehicles (such as passenger vehicles, logistics vehicles, robots, etc.), in order to enable vehicle 10 to detect road conditions or the environment in which it is located, a radar device 20 can be installed in vehicle 10. Radar device 20 can be divided into millimeter wave radar devices, microwave radar devices, etc. based on the wavelength of the electromagnetic waves emitted. Taking a millimeter wave radar device as an example, millimeter wave radar device 20 can emit electromagnetic waves (such as electromagnetic waves with a frequency between 30 and 300 GHz and a wavelength between 1 mm and 10 mm) into the road surface or environment. When the electromagnetic waves detect a target object 01 (such as a road, pedestrian, vehicle, etc.), they are reflected. Millimeter wave radar device 20 receives the reflected electromagnetic waves, thereby achieving the purpose of detecting road conditions or the environment. For example, when the electromagnetic waves emitted by millimeter wave radar device 20 in vehicle 10 detect a human body, the electromagnetic waves are reflected by the human body. Millimeter wave radar device 20 receives the reflected electromagnetic waves and can measure the distance between the human body and vehicle 10 based on the time between the transmission and reception of the electromagnetic waves.

[0033] like Figure 2 As shown, the millimeter-wave radar device 20 may include a housing 21, an antenna board 22 for generating and receiving electromagnetic waves, and electronic components (not shown) such as a drive circuit or controller connected to the antenna board 22. To ensure that the millimeter-wave radar device 20 has good dust and water resistance, the housing 21 of the millimeter-wave radar device 20 can be highly sealed. To prevent the housing 21 from adversely affecting the transmission and reception of electromagnetic waves, the housing 21 in traditional millimeter-wave radar devices is typically made of insulating materials rather than all-metal materials to avoid adverse effects such as shielding or blocking electromagnetic waves. However, as the power of the millimeter-wave radar device 20 continues to increase, the heat generated by the device is also increasing. To ensure the normal operation of the millimeter-wave radar device 20, the heat dissipation requirements are also increasing. However, due to the low thermal conductivity and heat dissipation properties of the plastic housing 21, it can no longer meet the heat dissipation requirements of the millimeter-wave radar device 20.

[0034] Furthermore, in practical applications, the radar device requires a connector to establish electrical connections between the radar device and other devices (such as an onboard computer). Since the connector contains an electrical connection structure, if this electrical connection structure is located above the antenna board 22, it will block electromagnetic waves and affect the signal transmission and reception performance of the antenna board 22. Therefore, the connector's placement must also be appropriately configured.

[0035] To this end, an embodiment of the present application provides a millimeter wave radar device 20 that has good heat dissipation effect and can effectively ensure the working performance of the antenna board 22.

[0036] In order to clearly understand the millimeter wave radar device 20 provided in this application, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0037] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification of the present application and the appended claims, the singular expressions "a", "an", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one, two or more. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist; for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0038] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0039] like Figure 3 As shown, in one embodiment provided in the present application, the millimeter wave radar device 20 may include a housing 21 and an antenna board 22 installed in the housing 21. Specifically, as Figure 4As shown, the antenna board 22 can be a radio frequency board, which can include a circuit board 221 and an antenna element 222 disposed on the surface of the circuit board 221. In a specific implementation, the circuit board 221 can be a printed circuit board (PCB) or a flexible printed circuit (FPC). The antenna element 222 can be disposed on the circuit board 221 using processes such as surface mounting or laser welding. Furthermore, the antenna board 22 can include one antenna element 222 or multiple antenna elements 222. The multiple antenna elements 222 can be disposed on the circuit board 221 in a rectangular array, a circular array, or other arrangements, which are not specifically limited in this application. Furthermore, the front end of the antenna board 22 mentioned below can be the transmitting end or the receiving end of the antenna board 22. For example, the antenna element 222 can be disposed on the upper surface of the circuit board 221. The first surface (upper side) of the circuit board 221 can be the front end of the antenna board 22, and the second surface (lower side) and the left and right sides of the circuit board 221 can be the rear end of the antenna board 22.

[0040] like Figure 3 As shown, the housing 21 may include a bottom shell 212 and an antenna cover 211. The antenna cover 211 and the bottom shell 212 enclose a receiving space for installing the antenna board 22, thereby providing good protection for the antenna board 22 and preventing external impurities such as dust and water vapor from entering the receiving cavity. In addition, in order to improve the heat dissipation performance of the millimeter wave radar device 20, please refer to Figure 6 In one embodiment provided herein, the bottom housing 212 may include an insulating portion 2121 and a metal heat dissipation portion 2122. In a specific implementation, the insulating portion 2121 of the bottom housing 212 may be located at either the front or rear end of the antenna board 22, while the metal heat dissipation portion 2122 may be located at the rear end of the antenna board 22. When the insulating portion 2121 of the bottom housing 212 is located at the front end of the antenna board 22, the electromagnetic waves generated by the antenna can be transmitted to the external environment through the radome 211 or the insulating portion 2121. Simultaneously, electromagnetic waves in the external environment can be received by the antenna after passing through the radome 211 or the insulating portion 2121. By arranging the metal heat dissipation portion 2122 at the rear end of the antenna plate 22, the metal heat dissipation portion 2122 can be prevented from blocking or shielding the electromagnetic waves generated by the antenna plate 22. At the same time, since the metal heat dissipation portion 2122 (which can be made of metal materials such as copper, iron, and aluminum) has better thermal conductivity than the plastic antenna cover 211 and the insulating portion 2121, the heat dissipation of the millimeter wave radar device 20 can be improved.

[0041] In specific implementations, the structural form of the housing 21 can be various.

[0042] For example, Figure 3 As shown, in one embodiment provided in the present application, the radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 can be independent components. Specifically, the radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 can be molded separately, and then the molded radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 can be assembled into the housing 21.

[0043] In a specific implementation, the insulating portion 2121 may be a frame-shaped structure, and the bottom of the insulating portion 2121 may be provided with a through hole (not shown in the figure). The metal heat sink 2122 may be fixedly connected to the bottom of the insulating portion 2121 and seal the through hole to ensure a tight connection between the insulating portion 2121 and the metal heat sink 2122. The radome 211 is fixedly connected to the insulating portion 2121, and the lower edge of the radome 211 is tightly coupled to the upper edge of the insulating portion 2121 to ensure a tight connection between the insulating portion 2121 and the radome 211.

[0044] In specific implementation, the connection between the antenna cover 211 and the insulating portion 2121 can be in various forms. For example, Figure 3 As shown, in one embodiment provided herein, a snap-fit structure is used to connect the radome 211 to the insulating portion 2121. Specifically, a protrusion 2111 may be provided on the radome 211, and a buckle 2123 may be provided on the insulating portion 2121. When the radome 211 and the insulating portion 2121 are connected, the protrusion 2111 in the radome 211 and the buckle 2123 in the insulating portion 2121 engage with each other, thereby achieving a fixed connection between the radome 211 and the insulating portion 2121. In a specific implementation, the number and arrangement of the protrusions 2111 can be varied, and the number and arrangement of the buckles 2123 can be adaptively adjusted based on the number and position of the protrusions 2111. Furthermore, in some embodiments, the radome 211 and the insulating portion 2121 can also be fixedly connected using bonding, threading, welding, or other methods, which are not specifically limited in this application.

[0045] In addition, in order to ensure the tightness of the connection between the antenna cover 211 and the insulating part 2121, as shown in FIG. Figure 3 As shown, in the embodiment provided in this application, a groove 2127 is provided on the upper edge of the insulating portion 2121, and a flange 2112 is provided on the lower edge of the radome 211. When the radome 211 and the insulating portion 2121 are fastened together, the flange 2112 of the radome 211 is embedded in the groove 2127 of the insulating portion 2121, and the flange 2112 can tightly abut against the inner wall of the groove 2127, thereby ensuring a tight connection between the radome 211 and the insulating portion 2121.

[0046] In some embodiments, to enhance the airtightness of the connection between the radome 211 and the insulating portion 2121, a sealing ring may be disposed between the radome 211 and the insulating portion 2121. Specifically, the sealing ring may be disposed within the groove 2127. When the radome 211 and the insulating portion 2121 are fastened together, the flange 2112 of the radome 211 engages with the groove 2127 of the insulating portion 2121 and tightly abuts the sealing ring. Simultaneously, the flange 2112 compresses the sealing ring, causing it to tightly abut against the inner wall of the groove 2127, thereby enhancing the airtightness of the connection between the insulating portion 2121 and the radome 211. In other embodiments, a sealant or the like may be filled at the interface between the radome 211 and the insulating portion 2121 (e.g., between the flange 2112 and the groove 2127) to ensure the airtightness of the connection between the radome 211 and the insulating portion 2121. In other embodiments, a flange 2112 may be provided on the upper edge of the insulating portion 2121 , and a groove 2127 may be provided on the lower edge of the antenna cover 211 .

[0047] Additionally, in some embodiments, the radome 211 and insulating portion 2121 may be integrally formed. Specifically, the radome 211 and insulating portion 2121 may be integrally formed using a process such as injection molding. For example, the radome 211 and insulating portion 2121 may be injection molded using materials such as resin, acrylonitrile, polyethylene, polypropylene, and polycarbonate. In practice, the radome 211 and insulating portion 2121 may be made of the same insulating material or different insulating materials.

[0048] In specific implementation, the connection between the insulating portion 2121 and the metal heat dissipation portion 2122 can also be various. Figure 7 As shown, in one embodiment provided by the present application, the insulating portion 2121 may include a first connecting portion 2124, and the metal heat dissipation portion 2122 may include a second connecting portion 2125. The insulating portion 2121 and the metal heat dissipation portion 2122 may be sealedly connected via the first connecting portion 2124 and the second connecting portion 2125. Figure 8In one embodiment provided in the present application, the first connecting portion 2124 may be a flange structure, and the second connecting portion 2125 may be a groove structure that is engaged with the flange structure. Specifically, the flange structure may be arranged at the edge of the through hole (not shown) at the bottom of the insulating portion 2121 and arranged upward; the groove structure may be arranged at the edge of the metal heat dissipation portion 2122 and arranged downward. When the insulating portion 2121 and the metal heat dissipation portion 2122 are fixedly connected, the metal heat dissipation portion 2122 may be placed in the insulating portion 2121 so that the flange structure is embedded in the groove structure, and then the flange structure or the groove structure is heated by a process such as laser welding so that the flange structure gradually melts. After cooling, a sealed connection between the insulating portion 2121 and the metal heat dissipation portion 2122 (flange structure and groove structure) can be achieved. In some embodiments, the flange structure may also be arranged on the metal heat dissipation portion 2122, and the groove structure may be arranged on the insulating portion 2121. In addition, in some embodiments, the gap between the flange structure and the groove structure may be filled with hot melt adhesive, a sealing ring, etc. to ensure the airtightness of the connection between the insulating portion 2121 and the metal heat dissipation portion 2122 .

[0049] In addition, in some embodiments, other connection structures may be used to achieve a sealed connection between the insulating portion 2121 and the metal heat dissipation portion 2122. For example, the insulating portion 2121 and the metal heat dissipation portion 2122 may adopt the connection structure between the antenna cover 211 and the insulating portion 2121 in the above-mentioned embodiment, or may be connected in the form of a threaded connection (such as a screw). For example, a protrusion may be provided in the insulating portion 2121, and a buckle may be provided in the metal heat dissipation portion 2122. When the insulating portion 2121 and the metal heat dissipation portion 2122 are connected, the protrusion in the insulating portion 2121 and the buckle in the metal heat dissipation portion 2122 are engaged with each other, thereby achieving a fixed connection between the insulating portion 2121 and the metal heat dissipation portion 2122. In addition, the antenna cover 211 and the insulating portion 2121 may also adopt the connection structure between the insulating portion 2121 and the metal heat dissipation portion 2122 described above to achieve a sealed connection, or may adopt other connection methods to achieve a sealed connection. For example, a groove and flange structure can be set at the contact position between the insulating part 2121 and the metal heat dissipation part 2122. When the insulating part 2121 and the metal heat dissipation part 2122 are buckled and fixed to each other, the groove (or flange) of the insulating part 2121 and the flange (or groove) of the metal heat dissipation part 2122 are embedded in each other, thereby realizing a sealed connection between the insulating part 2121 and the metal heat dissipation part 2122.

[0050] Additionally, in some embodiments, the metal heat sink 2122 and the insulating portion 2121 may also be an integral structure. Specifically, the radome 211 and the insulating portion 2121 may be integrally formed using a process such as injection molding. For example, the metal heat sink 2122 may be first formed using a process such as injection molding or stamping. The formed metal heat sink 2122 may then be placed in an injection mold, and insulating material may be injected into the mold to form the insulating portion 2121 and simultaneously bond the insulating portion 2121 to the metal heat sink 2122.

[0051] In some embodiments, the specific shape and location of the metal heat dissipation portion 2122 can be adjusted accordingly according to actual heat dissipation requirements.

[0052] For example, in the embodiment provided herein, the circuit board 221 in the antenna board 22 has a rectangular structure. In a specific implementation, to minimize the volume of the housing 21, the housing 21 may be a rectangular cube. Furthermore, to ensure that the metal heat sink 2122 effectively dissipates heat for the antenna board 22, the metal heat sink 2122 may also be configured as a rectangular plate. In a specific implementation, the metal heat sink 2122 may be positioned directly below the circuit board 221, allowing heat generated by the antenna board 22 to be effectively radiated or transferred to the metal heat sink 2122, thereby effectively improving the heat dissipation effect of the metal heat sink 2122 on the antenna board 22. In some embodiments, the outline area of the antenna board 22 may be no larger than the outline area of the metal heat sink 2122, allowing heat generated by the antenna board 22 to be effectively radiated or transferred to the metal heat sink 2122, thereby improving the heat dissipation effect of the metal heat sink 2122 on the antenna board 22. In other embodiments, to more efficiently transfer heat generated by the antenna board 22 to the metal heat sink 2122, the distance between the antenna board 22 and the metal heat sink 2122 can be minimized, or a thermal conductor can be provided between the antenna board 22 and the metal heat sink 2122. For example, a material such as thermally conductive silicone can be provided between the bottom side of the circuit board 221 and the top side of the metal heat sink 2122 to efficiently transfer heat generated by the antenna board 22 to the metal heat sink 2122, thereby improving the heat dissipation performance of the millimeter-wave radar device 20. Furthermore, to enhance the heat dissipation performance of the metal heat sink 2122, in some embodiments, the metal heat sink 2122 can be provided with structures such as heat dissipation fins to increase the heat exchange area between the metal heat sink 2122 and the outside world, thereby effectively improving the heat dissipation performance of the metal heat sink 2122. Specifically, sheet-like, prismatic, or columnar structures can be provided on the outside of the metal heat sink 2122 to form heat dissipation fins, thereby increasing the heat exchange area between the metal heat sink 2122 and the outside world.

[0053] In addition, in actual application, some electronic components or heating components (such as controllers, etc.) can be set on the lower surface of the circuit board 221. Figure 3 To effectively improve the heat dissipation performance of the millimeter-wave radar device 20, in one embodiment provided herein, a receiving groove 2126 can be provided in the metal heat dissipation portion 2122. Electronic components located on the lower surface of the circuit board 221 can be accommodated within the receiving groove 2126, thereby facilitating the miniaturization of the millimeter-wave radar device 20. Furthermore, this effectively reduces the distance between the metal heat dissipation portion 2122 and the electronic components, as well as the distance between the metal heat dissipation portion 2122 and the circuit board 221, thereby reducing the heat conduction distance between the circuit board 221 and the electronic components, and the metal heat dissipation portion 2122, thereby improving the heat dissipation performance of the millimeter-wave radar device 20. In specific implementations, the shape, size, and number of the receiving grooves 2126 can be adjusted according to actual needs and are not specifically limited in this application.

[0054] In some embodiments, some electronic components may be mounted on an additional circuit board 221. For example, the millimeter-wave radar device 20 may include a multi-layer board structure. Specifically, a separate circuit board may be provided on the underside of the antenna board 22 to accommodate electronic components while also preventing the circuit board from blocking or interfering with the electromagnetic waves emitted by the antenna board 22. In a specific implementation, the circuit board may include components such as a drive circuit and a controller. The circuit board may be electrically connected to the antenna board 22 to drive the antenna element 222 to emit electromagnetic waves or to process and calculate electromagnetic waves received by the antenna element 222.

[0055] In addition, in some embodiments, the metal heat dissipation portion 2122 may not only be provided at the bottom of the bottom case 212, but may also be provided at the side of the bottom case 212 (or the insulating portion 2121). For example, part of the side panel of the bottom case 212 may be made of metal.

[0056] On the other hand, in order to facilitate signal transmission and power transmission between the millimeter wave radar device 20 and external equipment, a connector 2128 can also be provided in the shell 21.

[0057] like Figure 3 As shown, in one embodiment provided in the present application, the connector 2128 is disposed on the side of the bottom housing 212. Specifically, the connector 2128 may include a plastic housing and an electrical connection structure (such as metal contacts, springs, PIN pins, etc.) disposed in the plastic housing.

[0058] In order to prevent the metal parts in the connector 2128 from interfering with the normal operation of the antenna board 22, the connector 2128 can be set at the rear end of the antenna board 22. In addition, setting the connector 2128 at the rear end of the antenna board 22 can also avoid opening a gap in the antenna board 22 to avoid the connector 2128, thereby effectively increasing the layout area of the antenna board 22 (such as the circuit board 221) and achieving the purpose of miniaturization of the overall plane size. Figure 4 , the front and rear ends of the antenna board 22 can be distinguished by the dotted line in the figure; that is, the part above the dotted line can be the front end of the antenna board 22, and the part below the dotted line (including the lower side and the left and right sides) can be the rear end of the antenna board 22. The connector 2128 can be set at the rear end of the antenna board 22. Specifically, the connector 2128 can be set on the left side or the lower side of the bottom shell 212. In a specific implementation, in order to improve the airtightness of the connection between the connector 2128 and the bottom shell 212, the connector 2128 and the bottom shell 212 can be made into an integral structure using an injection molding process. For ease of production, the connector 2128 and the insulating part 2121 in the bottom shell 212 can be integrally injection molded. For example, the finished connector 2128 can be placed in an injection mold, and then the insulating material can be injected into the mold to achieve the molding of the insulating part 2121 and the connection between the insulating part 2121 and the connector 2128. In this way, the airtightness of the connection between the connector 2128 and the bottom shell 212 can be effectively increased. At the same time, it is also convenient for mass production, which is conducive to reducing production costs.

[0059] In addition, in a specific implementation, the connector 2128 can be electrically connected to the antenna board 22 via a cable. Alternatively, the connector 2128 and the antenna board 22 can also be directly connected.

[0060] Take direct connection as an example. Figure 3 As shown, in one embodiment provided herein, the electrical connection structure 2129 of the connector 2128 is a spring. The lower surface of the antenna board 22 is provided with conductive structures such as solder pads or metal contacts (not shown). When the antenna board 22 is downwardly mounted within the housing 21, the spring (electrical connection structure 2129) elastically contacts the solder pads or metal contacts on the lower surface of the antenna board 22, thereby establishing an electrical connection between the connector 2128 and the antenna board 22.

[0061] Alternatively, please refer to Figure 5 In another embodiment provided herein, the electrical connection structure 2129 of the connector 2128 is a PIN. The lower surface of the antenna board 22 is provided with a via (not shown). When the antenna board 22 is downwardly mounted within the housing 21, the PIN (electrical connection structure 2129) engages with the via on the lower surface of the antenna board 22, thereby establishing an electrical connection between the connector 2128 and the antenna board 22.

[0062] It is understood that in other embodiments, the type and shape of the electrical connection structure of the connector 2128 can be flexibly set according to different requirements. Accordingly, the type and shape of the conductive structure in the antenna board 22 can also be flexibly set according to different requirements, and this application does not limit this.

[0063] Furthermore, in a specific implementation, the distribution of the insulating portion 2121 and the metal heat sink 2122 within the bottom case 212 can be varied. For example, a portion of the bottom and side of the bottom case 212 can be the insulating portion 2121, or the left side or a portion of the left side of the bottom case 212 can be the insulating portion 2121, while the remaining portion can be the metal heat sink 2122. The arrangement of the insulating portion 2121 and the metal heat sink 2122 allows the connector 2128 to be combined with the bottom case 212 (insulating portion 2121) through an injection molding process. Furthermore, the connector 2128 can also be hermetically connected to the metal heat sink 2122 via the insulating portion 2121, thereby ensuring the airtightness of the bottom case 212.

[0064] On the other hand, Figure 9 As shown, an embodiment of the present application further provides a mobile platform 10, comprising an information processing system 30 and the millimeter-wave radar device 20 of any of the above-described embodiments. The information processing system 30 is configured to determine characteristic information of the detected object based on the electromagnetic waves generated and received by the millimeter-wave radar device 20. The characteristic information includes, but is not limited to, target distance, orientation, altitude, speed, attitude, and even shape. Specifically, the information processing system 30 can accurately measure the propagation time from the millimeter-wave radar device 20 transmitting the electromagnetic wave to the electromagnetic wave reflected by the target object. Since the speed of light is known, the propagation time can be converted into a distance measurement, thereby determining the distance from the millimeter-wave radar device 20 to the target object.

[0065] In a specific implementation, the information processing system 30 can be various forms of hardware devices such as a processor, a microprocessor (such as a digital signal processor, DSP), an AI chip (such as a Field Programmable Gate Array, FPGA), or an application-specific integrated circuit (such as an Application Specific Integrated Circuit, ASIC).

[0066] For example, the mobile platform 10 is an autonomous vehicle. The autonomous vehicle includes the millimeter-wave radar device 20, an information processing system 30, and an electronic control unit 40. The electronic control unit 40 (ECU) can be an onboard computer. When the millimeter-wave radar device 20 identifies an obstacle ahead and the information processing system 30 calculates characteristic information of the obstacle, the electronic control unit 40 can control the autonomous vehicle's drive system to slow down, stop, or turn based on the obstacle's characteristic information and navigation information (e.g., a map). Alternatively, when the millimeter-wave radar device 20 and the information processing system 30 determine that there are no obstacles, the electronic control system 40 can control the autonomous vehicle's drive system to travel at a constant speed or accelerate based on the obstacle-free information.

[0067] In an optional embodiment, the specific type of the above-mentioned mobile platform 10 is not limited. For example, it can be a mobile platform such as a car, a ship, an airplane, a train, a spacecraft, a drone, etc., all of which are applicable to the technical solution of this application.

[0068] The above is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the protection scope of the present application.

Claims

1. A radar device, characterized in that: include: A housing having a receiving space; an antenna plate, disposed in the accommodation space; The antenna board has a first board surface and a second board surface disposed opposite to each other, and the first board surface is used for transmitting and receiving signals; A connector, provided on the housing, for connecting to other devices outside the housing; The connector has an electrical connection structure, the electrical connection structure is electrically connected to the antenna board, and the electrical connection structure is located on one side of the second board surface; The housing comprises: A bottom shell, comprising an insulating portion and a metal heat dissipation portion; A radome is fixedly connected to the bottom shell, and the bottom shell and the radome form a closed accommodation space; The first plate surface of the antenna plate is arranged toward the antenna cover, the metal heat dissipation portion is located on one side of the second plate surface, and the metal heat dissipation portion is exposed on the outer surface of the insulating portion; Wherein, the inner side of the metal heat dissipation portion has a receiving groove; The accommodating groove is used to accommodate the heating element of the antenna board; The insulating portion includes a first connecting portion, the metal heat dissipation portion includes a second connecting portion, and the first connecting portion is tightly connected to the second connecting portion; The first connecting portion includes a groove or a flange structure, and the second connecting portion includes a flange or a groove structure that fits with the first connecting portion; The insulating portion includes a bottom plate, a through hole is provided in the bottom plate, and the first connecting portion is provided at an edge of the through hole; The second connecting portion is located at an edge of the metal heat dissipation portion, and the metal heat dissipation portion blocks the through hole.

2. The radar device according to claim 1, wherein The electrical connection structure is a metal contact, a spring or a PIN needle.

3. The radar device according to claim 1 or 2, characterized in that The second board surface has a pad or a via for connecting with the electrical connection structure.

4. The radar device according to claim 1 or 2, characterized in that The housing of the connector and the insulating portion are integrally formed.

5. The radar device according to claim 1, wherein The insulating portion includes a side plate located at an edge of the bottom plate.

6. The radar device according to any one of claims 1 to 5, characterized in that The metal heat dissipation portion is arranged facing the second board surface of the antenna board.

7. The radar device according to claim 6, characterized in that The outline area of the antenna plate is not larger than the outline area of the metal heat dissipation portion.

8. The radar device according to any one of claims 1 to 7, characterized in that A heat conductor is provided between the metal heat dissipation portion and the antenna assembly.

9. A mobile platform, characterized in that: comprising an information processing system and a radar device according to any one of claims 1 to 8; The information processing system is connected to the radar device signal and is used to calculate the characteristic information of the detected object based on the signal of the radar device.

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