Communication device, laminated dielectric filter and manufacturing method thereof

Abstract

The present invention relates to a communication device, a laminated dielectric filter and a manufacturing method thereof, wherein a first dielectric block is provided with a first splicing surface. A first convex block is provided on the first splicing surface. A second dielectric block is provided with a second splicing surface corresponding to the first splicing surface. The first convex block is connected to the second splicing surface. The first dielectric block and the second dielectric block are sintered and formed as a whole. Since the first dielectric block and the second dielectric block are sintered and formed as a whole, that is, the cavity of the first filter monomer is coupled and connected with the cavity of the second filter monomer through the first convex block, the first filter monomer does not need to be welded and connected with the second filter monomer through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer and the second filter monomer, thereby simplifying the process steps, and greatly reducing the insertion loss due to the absence of setting the photolithography area, and greatly improving the consistency of the filter product.

Description

Technical Field

[0001] The present invention relates to the technical field of filters, and in particular to a communication device, a laminated dielectric filter and a manufacturing method thereof. Background Art

[0002] The filter is a frequency-selective device and an indispensable part of communication equipment. With the rapid development of communication systems entering the 5G era, high requirements are placed on product miniaturization. The use of dielectric filters can greatly reduce the size of the original metal filters. For laminated dielectric filters, during production and processing, it is usually first sintered through a ceramic sintering process to obtain a ceramic dielectric block monomer, and then the surface of the ceramic dielectric block monomer is metallized, and the metallized surface needs to be processed by laser lithography to obtain a corresponding pattern to obtain a filter monomer, and then two or more filter monomers are spliced ​​together by soldering with solder paste or silver paste to obtain a laminated dielectric filter. The production process is relatively complicated, the consistency of the obtained filter product is poor, and the insertion loss is large, which makes it difficult to meet user needs. Summary of the invention

[0003] Based on this, it is necessary to overcome the defects of the prior art and provide a communication device, a laminated dielectric filter and a manufacturing method thereof, which can reduce insertion loss and have better product consistency.

[0004] The technical scheme is as follows: a laminated dielectric filter, the laminated dielectric filter comprising: a first filter monomer and a second filter monomer; the first filter monomer comprises a first dielectric block, the first dielectric block is provided with a first splicing surface, and the first splicing surface is provided with a first convex block; the second filter monomer comprises a second dielectric block, the second dielectric block is provided with a second splicing surface corresponding to the first splicing surface, and the first convex block is connected to the second splicing surface; the first dielectric block and the second dielectric block are sintered as one piece.

[0005] In the above-mentioned laminated dielectric filter, since the first dielectric block and the second dielectric block are sintered integrally, that is, the cavity of the first filter monomer is coupled to the cavity of the second filter monomer through the first protrusion, the first filter monomer does not need to be welded to the second filter monomer through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer and the second filter monomer, thereby simplifying the process steps, and greatly reducing the insertion loss due to the need to set a photolithography area, and can greatly improve the consistency of the filter product.

[0006] In one embodiment, the first filter monomer further includes a first metal layer disposed on the outer surface of the first dielectric block, and the second filter monomer further includes a second metal layer disposed on the outer surface of the second dielectric block; the spacing between the first splicing surface and the second splicing surface is S, and S is 1mm-5mm.

[0007] In one embodiment, the first dielectric block and the second dielectric block are both ceramic dielectric blocks; the first metal layer and the second metal layer are both copper layers, silver layers, aluminum layers or gold layers.

[0008] In one embodiment, a first boss is provided at a corner of the first joint surface; the first boss is connected to the second joint surface.

[0009] In one embodiment, a second boss is provided at a corner of the second joint surface; the second boss is connected to the first joint surface.

[0010] In one embodiment, the second joint surface is a plane, and a surface of the first protrusion away from the first joint surface is connected to the second joint surface.

[0011] In one embodiment, a second protrusion is disposed on the second joint surface, and a surface of the second protrusion away from the second joint surface is connected to a surface of the first protrusion away from the first joint surface.

[0012] In one embodiment, a second protrusion is disposed on the second joint surface, a surface of the second protrusion away from the second joint surface is connected to the first joint surface, and a side surface of the second protrusion is connected to a side surface of the first protrusion.

[0013] In one of the embodiments, a recess corresponding to the position of the first protrusion is provided on the second joint surface, and a portion of the first protrusion is embedded in the recess.

[0014] In one embodiment, the first filter monomer is provided with a plurality of first cavities, the second filter monomer is provided with a plurality of second cavities, and the plurality of first cavities are arranged in a one-to-one correspondence with the plurality of second cavities; there are a plurality of first protrusions, and the plurality of first protrusions are arranged in a one-to-one correspondence with the first cavities.

[0015] A communication device comprises the laminated dielectric filter.

[0016] In the above-mentioned communication device, since the first dielectric block and the second dielectric block are sintered integrally, that is, the cavity of the first filter monomer is coupled to the cavity of the second filter monomer through the first bump, the first filter monomer does not need to be welded to the second filter monomer through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer and the second filter monomer, thereby simplifying the process steps, and greatly reducing the insertion loss due to the need to set a photolithography area, and can greatly improve the consistency of the filter product.

[0017] A method for manufacturing a laminated dielectric filter, the method comprising the following steps:

[0018] The provided dielectric material is molded into a first semi-finished product corresponding to the shape of the first dielectric block and a second semi-finished product corresponding to the shape of the second dielectric block by a mold molding method, wherein the first dielectric block is provided with a first splicing surface, the first splicing surface is provided with a first protrusion, and the second dielectric block is provided with a second splicing surface corresponding to the first splicing surface;

[0019] The surface of the first semi-finished product corresponding to the first joint surface and the surface of the second semi-finished product corresponding to the second joint surface are joined and contacted with each other, and placed in a high-temperature furnace for integral sintering to obtain a finished product structure including a first dielectric block and a second dielectric block;

[0020] The finished structure is subjected to a surface metallization process, so that a first metal layer is formed on the surface of the first dielectric block, and a second metal layer is formed on the surface of the second dielectric block.

[0021] In the manufacturing method of the above-mentioned laminated dielectric filter, since the first dielectric block and the second dielectric block are sintered integrally, that is, the cavity of the first filter monomer is coupled to the cavity of the second filter monomer through the first protrusion, the first filter monomer does not need to be welded to the second filter monomer through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer and the second filter monomer, thereby simplifying the process steps, and greatly reducing the insertion loss due to the lack of setting the photolithography area, and can greatly improve the consistency of the filter product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the structure of a dielectric filter obtained by assembling two filter monomers in the conventional technology;

[0025] Figure 2 for Figure 1 The schematic diagram of the structure of the dielectric filter after splicing and assembling;

[0026] Figure 3 for Figure 1 A schematic structural diagram of a splicing surface of one of the filter monomers;

[0027] Figure 4 for Figure 1 A schematic structural diagram of a splicing surface of another filter monomer in FIG.

[0028] Figure 5 A structural diagram of a first dielectric block in a laminated dielectric filter according to an embodiment of the present invention from one viewing angle;

[0029] Figure 6 A structural diagram of a second dielectric block in a laminated dielectric filter according to an embodiment of the present invention from one viewing angle;

[0030] Figure 7 This is a structural schematic diagram of a first dielectric block and a second dielectric block in a laminated dielectric filter according to an embodiment of the present invention being butted and assembled in the direction of arrows;

[0031] Figure 8 It is a side view structural schematic diagram of a first dielectric block and a second dielectric block combined together in a laminated dielectric filter according to an embodiment of the present invention;

[0032] Fig. 9 A structural diagram of a second dielectric block in a laminated dielectric filter according to another embodiment of the present invention from one viewing angle;

[0033] Fig.10 A schematic side view of the structure of a first dielectric block and a second dielectric block combined together in a laminated dielectric filter according to another embodiment of the present invention;

[0034] Fig.11 A structural diagram of a second dielectric block in a laminated dielectric filter according to another embodiment of the present invention from one viewing angle;

[0035] Fig.12A schematic side view of the structure of a first dielectric block and a second dielectric block combined together in a laminated dielectric filter according to another embodiment of the present invention;

[0036] Fig.13 It is a schematic diagram of the insertion loss simulation of the laminated dielectric filter in the conventional technology;

[0037] Fig.14 FIG. 4 is a schematic diagram of an insertion loss simulation of a laminated dielectric filter according to an embodiment of the present invention.

[0038] 10. Filter monomer; 11. Splicing surface; 12. Photolithography area;

[0039] 20. First filter monomer; 21. First dielectric block; 211. First joint surface; 212. First protrusion; 213. First boss; 30. Second filter monomer; 31. Second dielectric block; 311. Second joint surface; 312. Second protrusion; 313. Concave portion. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0041] In order to more clearly understand the improved scheme of the present application and the beneficial effects achieved, the following first describes the specific structure and existing problems of the laminated dielectric filter in the conventional technology in combination with the attached Figure 1 To Attachment Figure 4 In the conventional technology, for the laminated dielectric filter, a plurality of filter monomers are generally spliced ​​together, and the splicing and combination of two filter monomers is taken as an example for explanation.

[0042] See also Figures 1 to 4 , Figure 1 It shows a schematic diagram of the structure of a dielectric filter prepared by splicing and assembling two filter monomers 10 in the conventional technology. Figure 2 Shows Figure 1 The schematic diagram of the structure of the dielectric filter after splicing and assembling. Figure 3 Shows Figure 1 A schematic structural diagram of a splicing surface 11 of one of the filter monomers 10, Figure 4 Shows Figure 1 A schematic structural diagram of a splicing surface 11 of another filter monomer 10 in FIG. Figure 1The manufacturing method of the filter monomer 10 in the invention comprises the following steps: firstly, for example, ceramic powder is processed through a molding die to obtain a semi-finished ceramic dielectric block, then the semi-finished ceramic dielectric block is subjected to high-temperature sintering treatment, and the semi-finished ceramic dielectric block is transformed into a finished ceramic dielectric block after chemical reaction and physical change under high temperature, and then a metallization treatment is performed on the surface of the finished ceramic dielectric block, and then a laser lithography treatment is performed on the joint surface 11 of the metallized ceramic dielectric block to obtain the filter monomer 10, and the laser lithography can make the filter monomer 10 expose the ceramic dielectric block, as shown in the specific example. Figure 3 The four photolithographic regions 12 formed on the splicing surface 11 of one of the filter monomers 10, and Figure 4 Four photolithographic regions 12 are formed on the splicing surface 11 of another filter monomer 10. Figure 1 After the two filter monomers 10 are connected, solder paste or silver paste is coated on the joint surface 11 of at least one of the filter monomers 10, and the photoetching areas 12 of the two filter monomers 10 are aligned with each other simultaneously, and the joint surfaces 11 of the two filter monomers 10 are welded and fixed by welding process.

[0043] However, the traditional production process has the following main shortcomings: On the one hand, in the process of aligning and assembling two filter monomers 10, it is easy to misalign, which can easily lead to the photolithography area 12 on one filter monomer 10 and the photolithography area 12 on the other filter monomer 10 not being completely aligned accurately, affecting the coupling amount between the adjacent cavities of the upper and lower filter monomers 10, and greatly affecting the consistency of the filter product. Usually, in order to ensure the consistency of the coupling amount between the adjacent cavities of the upper and lower filter monomers 10, the size of the photolithography area 12 on one filter monomer 10 is usually made larger than the size of the photolithography area 12 on the other filter monomer 10, that is, for example Figure 3 and Figure 4 In the embodiment, W1>D1, W2>D2, W3>D3, W4>D4 are made to reduce this influence. However, when the photolithography area 12 is larger, the insertion loss of the filter product will be larger. On the other hand, during the welding process, the thickness of the solder paste or silver paste applied on the joint surface 11 of the two filter monomers 10 cannot be well controlled, and the thickness of the metallized layer on the joint surface 11 of the filter monomer 10 will also deviate from the preset thickness of the metallized layer. This will make it difficult to control the consistency of the metal thickness at the joint surface 11 of the two filter monomers 10 (that is, the distance between the ceramic wall surface where the photolithography area 12 of one filter monomer 10 is located and the ceramic wall surface where the photolithography area 12 of the corresponding other filter monomer 10 is located). When the error is controlled outside ±0.01mm, it will have a great impact on the consistency of the filter product.

[0044] See also Figures 5 to 8 , Figure 5 FIG. 1 shows a structural diagram of a first dielectric block 21 in a laminated dielectric filter according to an embodiment of the present invention from one viewing angle. Figure 6 FIG. 1 shows a structural diagram of a second dielectric block 31 in a laminated dielectric filter according to an embodiment of the present invention from one viewing angle. Figure 7 The structure schematic diagram shows a first dielectric block 21 and a second dielectric block 31 in a laminated dielectric filter according to an embodiment of the present invention, which are connected and assembled in the direction of arrows. Figure 8 A schematic diagram of the side view structure of the combination of the first dielectric block 21 and the second dielectric block 31 in a laminated dielectric filter according to an embodiment of the present invention is shown. A laminated dielectric filter provided in an embodiment of the present invention comprises a first filter monomer 20 and a second filter monomer 30. The first filter monomer 20 comprises a first dielectric block 21. The first dielectric block 21 is provided with a first splicing surface 211. A first protrusion 212 is provided on the first splicing surface 211. The second filter monomer 30 comprises a second dielectric block 31. The second dielectric block 31 is provided with a second splicing surface 311 corresponding to the first splicing surface 211. The first protrusion 212 is connected to the second splicing surface 311. The first dielectric block 21 and the second dielectric block 31 are sintered as one piece.

[0045] In the above-mentioned laminated dielectric filter, since the first dielectric block 21 and the second dielectric block 31 are sintered integrally, that is, the cavity of the first filter monomer 20 is coupled with the cavity of the second filter monomer 30 through the first protrusion 212, the first filter monomer 20 does not need to be welded to the second filter monomer 30 through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer 20 and the second filter monomer 30, thereby simplifying the process steps, and greatly reducing the insertion loss due to the lack of setting the photolithography area, and can greatly improve the consistency of the filter product.

[0046] It can be understood that the first splicing surface 211 on the first dielectric block 21 refers to one of the side surfaces of the first dielectric block 21 facing the second dielectric block 31 in the overall structure formed after the first dielectric block 21 and the second dielectric block 31 are stacked; similarly, the second splicing surface 311 on the second dielectric block 31 refers to one of the side surfaces of the second dielectric block 31 facing the first dielectric block 21 in the overall structure formed after the first dielectric block 21 and the second dielectric block 31 are stacked.

[0047] Furthermore, the first filter monomer 20 further includes a first metal layer (not shown in the figure) disposed on the outer surface of the first dielectric block 21, and the second filter monomer 30 further includes a second metal layer (not shown in the figure) disposed on the outer surface of the second dielectric block 31. The spacing between the first splicing surface 211 and the second splicing surface 311 is S, and S is 1mm-5mm. Specifically, S is 1mm-3mm, for example, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, etc., and of course it can also be other values, which are not limited here. Since a spacing S is provided between the first splicing surface 211 and the second splicing surface 311, in the process of processing the metal layer on the outer surface of the laminated dielectric filter, not only is the first metal layer provided on the portion other than the first splicing surface 211 of the first dielectric block 21, but the metal material can also enter into the gap between the first splicing surface 211 and the second splicing surface 311, so that the first metal layer is formed on the first splicing surface 211; similarly, not only is the second metal layer provided on the portion other than the second splicing surface 311 of the second dielectric block 31, but the metal material can also enter into the gap between the first splicing surface 211 and the second splicing surface 311, so that the second metal layer is formed on the second splicing surface 311.

[0048] In one embodiment, the first dielectric block 21 and the second dielectric block 31 are both ceramic dielectric blocks. The first metal layer and the second metal layer are both copper layers, silver layers, aluminum layers or gold layers.

[0049] See also Figures 5 to 8 In one embodiment, a first boss 213 is provided at a corner of the first joint surface 211. The first boss 213 is connected to the second joint surface 311. In this way, under the action of the first boss 213 at the corner of the first joint surface 211, the stability of the first dielectric block 21 and the second dielectric block 31 obtained by sintering is increased, thereby ensuring the performance of the filter product.

[0050] In one embodiment, a second boss (not shown in the figure) is provided at the corner of the second joint surface 311. The second boss is connected to the first joint surface 211. In this way, under the action of the second boss at the corner of the second joint surface 311, the stability of the combination of the first dielectric block 21 and the second dielectric block 31 obtained by sintering is increased, thereby ensuring the performance of the filter product.

[0051] See also Figures 5 to 8 In one embodiment, the second joint surface 311 is a plane, and the surface of the first protrusion 212 away from the first joint surface 211 is connected to the second joint surface 311 .

[0052] See also Figure 5 , Fig. 9 and Fig.10 , Fig. 9FIG. 1 shows a structural diagram of a second dielectric block 31 in a laminated dielectric filter according to another embodiment of the present invention from one viewing angle. Fig.10 The schematic diagram of the side view structure of the first dielectric block 21 and the second dielectric block 31 in the laminated dielectric filter of another embodiment of the present invention is shown. In one embodiment, a second protrusion 312 is provided on the second splicing surface 311. The surface of the second protrusion 312 away from the second splicing surface 311 is connected to the surface of the first protrusion 212 away from the first splicing surface 211.

[0053] In one embodiment, a second protrusion 312 (not shown in the figure) is provided on the second joint surface 311, the surface of the second protrusion 312 away from the second joint surface 311 is connected to the first joint surface 211, and the side surface of the second protrusion 312 is connected to the side surface of the first protrusion 212. In this way, during the sintering process, the surface of the first protrusion 212 away from the first dielectric block 21 is in conflict with the second joint surface 311, the surface of the second protrusion 312 away from the second dielectric block 31 is in conflict with the first joint surface 211, and the side surface of the first protrusion 212 is in conflict with the side surface of the second protrusion 312, so that the first dielectric block 21 and the second dielectric block 31 can be firmly combined, and the obtained filter product has better stability. Specifically, the side surface of the first protrusion 212 and the side surface of the second protrusion 312 are consistent with each other in shape. For example, the side surface of the first protrusion 212 is a first arc shape, and the side surface of the second protrusion 312 is a second arc shape adapted to the first arc shape. In this way, the first protrusion 212 and the second protrusion 312 can be tightly combined and have better stability.

[0054] It should be noted that the side surface of the first bump 212 refers to the surface of the first bump 212 that is perpendicular or substantially perpendicular to the first joining surface 211 , and the side surface of the second bump 312 refers to the surface of the second bump 312 that is perpendicular or substantially perpendicular to the second joining surface 311 .

[0055] See also Figure 5 , Fig.11 and Fig.12 , Fig.11 FIG. 1 shows a structural diagram of a second dielectric block 31 in a laminated dielectric filter according to another embodiment of the present invention from one viewing angle. Fig.12 The schematic diagram of the side view structure of the first dielectric block 21 and the second dielectric block 31 in the laminated dielectric filter of another embodiment of the present invention is shown. In one embodiment, a recess 313 corresponding to the position of the first protrusion 212 is provided on the second joint surface 311, and a part of the first protrusion 212 is embedded in the recess 313. In this way, the first dielectric block 21 and the second dielectric block 31 are more firmly combined, and the finished product formed by sintering the first dielectric block 21 and the second dielectric block 31 has better structural stability.

[0056] In one embodiment, the first filter monomer 20 is provided with a plurality of first cavities, and the second filter monomer 30 is provided with a plurality of second cavities, and the plurality of first cavities are arranged in a one-to-one correspondence with the plurality of second cavities; there are a plurality of first protrusions 212, and the plurality of first protrusions 212 are arranged in a one-to-one correspondence with the first cavities. In this way, the plurality of first cavities of the first filter monomer 20 are coupled and connected in a one-to-one correspondence with the plurality of second cavities of the second filter monomer 30 through a plurality of first protrusions 212, respectively. For example, when the first filter monomer 20 has four first cavities, the second filter monomer 30 has four second cavities, and the plurality of first protrusions 212 has four first protrusions, and the four first protrusions 212 are arranged in a one-to-one correspondence with the four first cavities, so that the four first cavities can be coupled and connected in a one-to-one correspondence with the four second cavities through the four first protrusions 212.

[0057] It should be noted that the number of first cavities of the first filter monomer 20 is not limited here, and can be set according to actual needs, such as one, two, three or other numbers. Similarly, the number of second cavities of the second filter monomer 30 is also not limited, such as one, two, three or other numbers.

[0058] It should also be noted that the laminated dielectric filter in this embodiment is not limited to the first filter monomer 20 and the second filter monomer 30 mentioned above, and may also be a combination of three, four or other numbers of filter monomers.

[0059] It should also be noted that the specific shapes of the first protrusion 212, the second protrusion 312, the first boss 213 and the second boss can be, for example, square blocks, triangular blocks, circular blocks, elliptical blocks, etc. The specific structural shape is not limited here and can be set according to actual needs.

[0060] In one embodiment, a communication device includes the laminated dielectric filter according to any one of the above embodiments.

[0061] In the above-mentioned communication device, since the first dielectric block 21 and the second dielectric block 31 are sintered integrally, that is, the cavity of the first filter monomer 20 is coupled with the cavity of the second filter monomer 30 through the first bump 212, the first filter monomer 20 does not need to be welded to the second filter monomer 30 through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer 20 and the second filter monomer 30, thereby simplifying the process steps, and greatly reducing the insertion loss due to the need to set a photolithography area, and can greatly improve the consistency of the filter product.

[0062] In one embodiment, a method for manufacturing a laminated dielectric filter comprises the following steps:

[0063] Step S10, forming the provided dielectric material into a first semi-finished product corresponding to the shape of the first dielectric block 21 and a second semi-finished product corresponding to the shape of the second dielectric block 31 by a mold forming method, wherein the first dielectric block 21 is provided with a first splicing surface 211, the first splicing surface 211 is provided with a first protrusion 212, and the second dielectric block 31 is provided with a second splicing surface 311 corresponding to the first splicing surface 211;

[0064] Specifically, the dielectric material is, for example, ceramic powder or ceramic glue, and after being molded, a first semi-finished product and a second semi-finished product can be obtained. Since the first joint surface 211 of the first dielectric block 21 is provided with a first protrusion 212, a protrusion corresponding to the shape of the first protrusion 212 will be provided on the surface corresponding to the first joint surface 211 of the first semi-finished product.

[0065] Step S20, the surface of the first semi-finished product corresponding to the first splicing surface 211 and the surface of the second semi-finished product corresponding to the second splicing surface 311 are spliced ​​and contacted with each other, and placed in a high-temperature furnace for integral sintering to obtain a finished product structure including the first dielectric block 21 and the second dielectric block 31;

[0066] Specifically, the sintering temperature in the high temperature furnace is 1000°C or higher, for example, 1300°C.

[0067] In this way, the first semi-finished product is sintered in a high-temperature furnace to obtain the first dielectric block 21, and the second semi-finished product is sintered in a high-temperature furnace to obtain the second dielectric block 31. Since the first semi-finished product and the second semi-finished product are assembled and collided with each other during the sintering process, the dielectric materials at the contact surface penetrate each other during the sintering process, so that the first dielectric block 21 and the second dielectric block 31 obtained by sintering are an integrated structure, and the first dielectric block 21 and the second dielectric block 31 have good combination stability.

[0068] Step S30 , performing surface metallization treatment on the finished structure, so that a first metal layer is formed on the surface of the first dielectric block 21 , and a second metal layer is formed on the surface of the second dielectric block 31 .

[0069] Thus, the first dielectric block 21 and the first metal layer on its outer surface are equivalent to the first filter monomer 20, and the second dielectric block 31 and the second metal layer on its outer surface are equivalent to the second filter monomer 30. That is, the first filter monomer 20 and the second filter monomer 30 are obtained by metallizing the surfaces of the first dielectric block 21 and the second dielectric block 31 simultaneously, without using the photolithography step and the welding step in the conventional technology.

[0070] In the manufacturing method of the above-mentioned laminated dielectric filter, since the first dielectric block 21 and the second dielectric block 31 are sintered integrally, that is, the cavity of the first filter monomer 20 is coupled with the cavity of the second filter monomer 30 through the first protrusion 212, the first filter monomer 20 does not need to be welded to the second filter monomer 30 through solder paste or silver paste as in the traditional technology, and there is no need to set a photolithography area on the first filter monomer 20 and the second filter monomer 30, thereby simplifying the process steps, and greatly reducing the insertion loss due to the lack of setting the photolithography area, and can greatly improve the consistency of the filter product.

[0071] Furthermore, the manufacturing method of the laminated dielectric filter further includes the step of determining the shape and quantity of the filter monomers according to the laminated dielectric filter to be obtained, and determining the shape and quantity of the semi-finished products according to the shape and quantity of the filter monomers. For example, when the laminated dielectric filter includes two filter monomers, such as the first filter monomer 20 and the second filter monomer 30, there are two semi-finished products, namely the first semi-finished product corresponding to the shape of the first dielectric block 21 of the first filter monomer 20, and the second semi-finished product corresponding to the shape of the second dielectric block 31 of the second filter monomer 30; when the laminated dielectric filter includes three filter monomers, such as the first filter monomer 20, the second filter monomer 30 and the third filter monomer, there are three semi-finished products, namely the first semi-finished product corresponding to the shape of the first dielectric block 21 of the first filter monomer 20, the second semi-finished product corresponding to the shape of the second dielectric block 31 of the second filter monomer 30, and the third semi-finished product corresponding to the shape of the third dielectric block of the third filter monomer, and in the subsequent step, the first semi-finished product, the second semi-finished product and the third semi-finished product are sintered together to obtain the finished product structure.

[0072] Please refer to Fig.13 and Fig.14 , Fig.13 The figure shows a schematic diagram of the insertion loss simulation of the laminated dielectric filter in the conventional technology. Fig.14 FIG. 1 is a schematic diagram showing the insertion loss simulation of a laminated dielectric filter according to an embodiment of the present invention. Fig.13 and Fig.14 The following conclusion can be drawn: compared with the traditional solution, the insertion loss of the laminated dielectric filter in this embodiment is improved by more than 0.2 dB.

[0073] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

[0075] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0076] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0077] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0078] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0079] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

Claims

1. A laminated dielectric filter, characterized in that: The laminated dielectric filter comprises: A first filter monomer and a second filter monomer; the first filter monomer includes a first dielectric block, the first dielectric block is provided with a first splicing surface, and the first splicing surface is provided with a first protrusion; the second filter monomer includes a second dielectric block, the second dielectric block is provided with a second splicing surface corresponding to the first splicing surface, and the first protrusion is connected to the second splicing surface; the first dielectric block and the second dielectric block are sintered as one piece, and the cavity of the first filter monomer is coupled and connected with the cavity of the second filter monomer through the first protrusion; the first filter monomer also includes a first metal layer arranged on the outer surface of the first dielectric block, and the second filter monomer also includes a second metal layer arranged on the outer surface of the second dielectric block; the spacing between the first splicing surface and the second splicing surface is S, and S is 1mm-5mm.

2. The laminated dielectric filter according to claim 1, characterized in that: The first dielectric block and the second dielectric block are both ceramic dielectric blocks; the first metal layer and the second metal layer are both copper layers, silver layers, aluminum layers or gold layers.

3. The laminated dielectric filter according to claim 1, characterized in that: A first boss is provided at a corner portion of the first joint surface; the first boss is connected to the second joint surface.

4. The laminated dielectric filter according to claim 1, characterized in that: A second boss is provided at a corner portion of the second joint surface; the second boss is connected to the first joint surface.

5. The laminated dielectric filter according to claim 1, characterized in that: The second joint surface is a plane, and a surface of the first protrusion away from the first joint surface is connected to the second joint surface.

6. The laminated dielectric filter according to claim 1, characterized in that: A second protrusion is disposed on the second joint surface, and a surface of the second protrusion away from the second joint surface is connected to a surface of the first protrusion away from the first joint surface.

7. The laminated dielectric filter according to claim 1, characterized in that: A second protrusion is disposed on the second joint surface, a surface of the second protrusion away from the second joint surface is connected to the first joint surface, and a side surface of the second protrusion is connected to a side surface of the first protrusion.

8. The laminated dielectric filter according to claim 1, characterized in that: The second joint surface is provided with a recess corresponding to the position of the first protrusion, and a part of the first protrusion is embedded in the recess.

9. The laminated dielectric filter according to claim 1, characterized in that: The first filter monomer is provided with a plurality of first cavities, the second filter monomer is provided with a plurality of second cavities, and the plurality of first cavities are arranged in a one-to-one correspondence with the plurality of second cavities; there are a plurality of first protrusions, and the plurality of first protrusions are arranged in a one-to-one correspondence with the first cavities.

10. A communication device, characterized in that: The communication device includes the laminated dielectric filter according to any one of claims 1 to 9.

11. A method for manufacturing a laminated dielectric filter, characterized in that: The manufacturing method of the laminated dielectric filter comprises the following steps: The provided dielectric material is molded into a first semi-finished product corresponding to the shape of the first dielectric block and a second semi-finished product corresponding to the shape of the second dielectric block by a mold molding method, wherein the first dielectric block is provided with a first splicing surface, the first splicing surface is provided with a first protrusion, and the second dielectric block is provided with a second splicing surface corresponding to the first splicing surface; The surface of the first semi-finished product corresponding to the first joint surface and the surface of the second semi-finished product corresponding to the second joint surface are joined and contacted with each other, and placed in a high-temperature furnace for integral sintering to obtain a finished product structure including a first dielectric block and a second dielectric block; The finished structure is subjected to a surface metallization process, so that a first metal layer is formed on the surface of the first dielectric block, and a second metal layer is formed on the surface of the second dielectric block.

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