Heat dissipation device

Abstract

This application is applicable to the technical field of new energy heat dissipation equipment, and provides a heat dissipation device, including: a heat dissipation main body, a liquid containing groove is arranged inside the heat dissipation main body, a first through hole is arranged at the first end of the liquid containing groove, and a second through hole is arranged at the second end of the liquid containing groove; a first heat dissipation plate, the first heat dissipation plate covers the liquid containing groove to form a liquid containing cavity; a plurality of fins are arranged at the bottom of the first heat dissipation plate, a first fluid drag reduction surface is arranged at the first end of the fin, a second fluid drag reduction surface is arranged at the second end of the fin, the first fluid drag reduction surface faces the first end of the liquid containing groove, and the second fluid drag reduction surface faces the second end of the liquid containing groove. Thereby reducing the resistance loss and the liquid pressure loss, avoiding structural loss, and the reversible design of the inlet hole and the outlet hole can be realized by arranging fluid drag reduction surfaces at both ends, effectively coping with various working condition changes.

Description

Technical Field

[0001] This application belongs to the technical field of new energy heat dissipation equipment. More specifically, it relates to a heat dissipation device. Background Art

[0002] From a global perspective, new energy vehicles are recognized as the mainstream of the future automotive industry, and many countries are actively developing and guiding new energy vehicles. With the development of new energy vehicles, electric drive, electronic control, and batteries, as the three core technologies of new energy vehicles, have also attracted much attention.

[0003] The electronic control and electric drive systems are composed of many power electronic converters and corresponding controllers. The solid-state devices in them transfer a large amount of power energy to the motor input end. The heat generated and dissipated by the electrical components must be dissipated in time to ensure the safe operation of the overall vehicle system. Therefore, the efficient heat dissipation design of the supporting electronic devices is very important.

[0004] The existing traditional heat dissipation methods mainly use air cooling or water cooling. However, air-cooled heat dissipation has a simple structure and few components, but the heat dissipation is uneven, the efficiency is low, the weather resistance is poor, it is easily affected by the environment, and the fan noise is relatively large; water-cooled heat dissipation has a low efficiency and a large local resistance loss. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a heat dissipation device, aiming to solve the technical problems of low heat dissipation efficiency and large local resistance loss in the existing heat dissipation devices.

[0006] To achieve the above purpose, according to one aspect of this application, a heat dissipation device is provided, including: a heat dissipation main body, with a liquid containing groove arranged inside the heat dissipation main body. A first through hole is arranged at the first end of the liquid containing groove, and a second through hole is arranged at the second end of the liquid containing groove. One of the first through hole and the second through hole is a liquid inlet hole, and the other is a liquid outlet hole; a first heat dissipation plate, which covers the liquid containing groove to form a liquid containing cavity; a plurality of fins are arranged at the bottom of the first heat dissipation plate. A first fluid drag reduction surface is arranged at the first end of the fin, and a second fluid drag reduction surface is arranged at the second end of the fin. The first fluid drag reduction surface faces the first end of the liquid containing groove, and the second fluid drag reduction surface faces the second end of the liquid containing groove.

[0007] Optionally, the plurality of fins are divided into at least two fin groups. The extending direction of the fin group is the same as the extending direction of the liquid containing groove. There is a gap between adjacent two fin groups, and a flow guide plate is arranged in the gap along the extending direction of the gap.

[0008] Optionally, the fin group includes a plurality of first fin rows and a plurality of second fin rows. At least one second fin row is provided between every two adjacent first fin rows. Both the first fin rows and the second fin rows are composed of a plurality of fins. The plurality of fins located in the first fin rows and the plurality of fins located in the second fin rows are arranged in an interleaved manner.

[0009] Optionally, the first through hole is an inlet hole. A flow collecting area is provided at the first end of the liquid receiving groove. The flow collecting area gradually decreases in the direction from the second end to the first end of the liquid receiving groove. The inlet hole is located in the flow collecting area.

[0010] Optionally, a plurality of fins at the bottom of the first heat dissipation plate together form a heat exchange part, and the shape of the heat exchange part is adapted to the liquid receiving groove.

[0011] Optionally, a first heat dissipation surface is provided at the top of the first heat dissipation plate for mounting electronic components. A second heat dissipation plate is provided at the side of the heat dissipation main body. The second heat dissipation plate is connected to the heat dissipation main body. A second heat dissipation surface is provided at the upper part of the second heat dissipation plate for mounting capacitor devices.

[0012] Optionally, the second heat dissipation plate is lower than the first heat dissipation plate, so as to form a stepped structure between the first heat dissipation plate and the second heat dissipation plate.

[0013] Optionally, a plurality of convex bumps are provided on the side wall of the liquid receiving groove. The plurality of convex bumps are arranged along the extending direction of the liquid receiving groove, and the surface of the convex bumps is in smooth transition.

[0014] Optionally, the first heat dissipation plate includes a plate body. A plurality of shafts are provided at the bottom of the plate body. The shafts are perpendicular to the plate body. The plurality of shafts are respectively inserted into a plurality of fins one by one, and the fins can rotate with the shafts as axes.

[0015] Optionally, external threads are provided on the shafts, threaded holes are provided inside the fins, and the fins and the shafts are connected by matching of the external threads and the threaded holes.

[0016] The beneficial effects of the heat dissipation device provided by this application are as follows: Compared with the prior art, the heat dissipation device of this application increases the heat exchange area with the liquid by providing a plurality of fins at the bottom of the first heat dissipation plate. At the same time, a first fluid drag reduction surface is provided at the first end of the fin, and the first fluid drag reduction surface faces the first end of the liquid receiving groove to reduce the resistance to the liquid flowing from the first end to the second end of the liquid receiving groove. A second fluid drag reduction surface is provided at the second end of the fin, and the second fluid drag reduction surface faces the second end of the liquid receiving groove to reduce the resistance to the liquid flowing from the second end to the first end of the liquid receiving groove, thereby reducing the resistance loss and the liquid pressure loss, avoiding structural loss, and the reversible design of the inlet hole and the outlet hole can be realized by providing fluid drag reduction surfaces at both ends, effectively coping with various working condition changes. Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Structural schematic diagram of the first heat dissipation plate and fins provided by the embodiment of the present application;

[0019] Figure 2 Exploded structural schematic diagram of the heat dissipation device provided by the embodiment of the present application;

[0020] Figure 3 Overall structural schematic diagram of the heat dissipation device provided by the embodiment of the present application;

[0021] Figure 4 Left view schematic diagram of the heat dissipation device provided by the embodiment of the present application.

[0022] The label details involved in the above-mentioned drawings are as follows:

[0023] 10. Heat dissipation main body; 11. Liquid containing groove; 12. First through hole; 20. First heat dissipation plate; 21. Fins; 22. Flow guide plate; 23. Fin group; 30. Second heat dissipation plate; 31. Second heat dissipation surface; 40. Pipeline. Detailed Description of the Embodiments

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. Without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and embodiments.

[0026] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means more than two, unless otherwise specifically defined.

[0028] As described in the background art, currently, the electric control and electric drive systems are composed of many power electronic converters and corresponding controllers. The solid-state devices in them transfer a large amount of power supply energy to the motor input end. The heat generated and dissipated by the electrical components must be dissipated in time to ensure the safe operation of the overall vehicle system. Therefore, the efficient heat dissipation design of the supporting electronic devices is very important. The existing traditional heat dissipation methods mainly use air cooling or water cooling. However, the air-cooled heat dissipation structure is simple and has few components, but the heat dissipation is uneven, the efficiency is low, the weather resistance is poor, it is easily affected by the environment, and the fan noise is relatively large; the water-cooled heat dissipation efficiency is relatively low, and the local resistance loss is relatively large.

[0029] See Figures 1 to 4 As shown, to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a heat dissipation device, including a heat dissipation main body 10 and a first heat dissipation plate 20. A liquid containing groove 11 is provided inside the heat dissipation main body 10. A first through hole 12 is provided at the first end of the liquid containing groove 11, and a second through hole is provided at the second end of the liquid containing groove 11. One of the first through hole 12 and the second through hole is a liquid inlet hole, and the other is a liquid outlet hole; both the outside of the first through hole 12 and the second through hole are communicated with a pipeline 40. The first heat dissipation plate 20 is covered on the liquid containing groove 11 to form a liquid containing cavity; a plurality of fins 21 are provided at the bottom of the first heat dissipation plate 20. A first fluid drag reduction surface is provided at the first end of the fin 21, and a second fluid drag reduction surface is provided at the second end of the fin 21. The first fluid drag reduction surface faces the first end of the liquid containing groove 11, and the second fluid drag reduction surface faces the second end of the liquid containing groove 11. Among them, the fin 21 in this embodiment is a flat sheet-like structure.

[0030] In use, the staff can install the electronic components that need to be cooled on the first heat dissipation plate 20, and achieve heat exchange with the liquid in the liquid containing cavity through the first heat dissipation plate 20 to achieve heat dissipation. Moreover, the heat dissipation device of the present application increases the heat exchange area with the liquid by arranging a plurality of fins 21 at the bottom of the first heat dissipation plate 20. At the same time, a first fluid drag reduction surface is arranged at the first end of the fin 21, and the first fluid drag reduction surface faces the first end of the liquid containing groove 11 to reduce the resistance to the liquid flowing from the first end of the liquid containing groove 11 to the second end of the liquid containing groove 11. A second fluid drag reduction surface is arranged at the second end of the fin 21, and the second fluid drag reduction surface faces the second end of the liquid containing groove 11 to reduce the resistance to the liquid flowing from the second end of the liquid containing groove 11 to the first end of the liquid containing groove 11, thereby reducing the resistance loss and liquid pressure loss, avoiding structural loss, and the reversible design of the inlet hole and the outlet hole can be realized by arranging fluid drag reduction surfaces at both ends, effectively coping with various working condition changes.

[0031] In a specific embodiment, both ends of the fin 21 are streamlined structures to form the first fluid drag reduction surface and the second fluid drag reduction surface. The streamlined structure can be a streamlined curved surface structure, such as an airfoil type, and of course it can also be other streamlined structures, as long as it is a streamlined structure that can reduce the resistance to the liquid. By setting the fin 21 into the shape of the above embodiment, the formation of a boundary layer on the surface of the fin 21 can be effectively avoided, which affects heat conduction.

[0032] See Figure 1 As shown, in order to centrally guide the liquid and thus increase the liquid flow rate, in this embodiment, the plurality of fins 21 are divided into at least two fin groups 23. The extending direction of the fin group 23 is the same as the extending direction of the liquid containing groove 11, and there is a gap between adjacent two fin groups 23. A flow guide plate 22 is arranged in the gap along the extending direction of the gap. By arranging the flow guide plate 22, on the one hand, it can play a guiding role to increase the flow rate of the liquid passing through each fin group 23, and on the other hand, it can also play the role of a reinforcing rib, effectively improving the overall strength of the heat dissipation device.

[0033] In a preferred embodiment, there are two fin groups 23, and the first through hole 12 and the second through hole are located between the two fin groups 23 to balance the liquid flow rate. In other embodiments, the number of fin groups 23 can also be three, four, five, six, etc., and the staff can select according to the specific situation.

[0034] Such as Figure 1As shown, the flow direction of the fluid in this embodiment is parallel flow, that is, the liquid flowing in from the inlet hole flows to the two fin groups respectively and finally flows out from the outlet hole of the liquid receiving groove. In other embodiments, the length of the flow guide plate can also be adjusted to abut against one end of the liquid receiving groove to form a serpentine channel. In this embodiment, the flow direction of the fluid is in series, and the staff can select according to the specific working conditions.

[0035] In another embodiment, the first heat dissipation plate 20 has multiple models, and the number of fin groups 23 on each model is different. The staff can select according to the specific situation and install the first heat dissipation plate 20 that meets the requirements on the heat dissipation main body 10 to achieve modular production.

[0036] On the one hand, the unnecessary resistance is reduced by the fins 21 with the first fluid drag reduction surface and the second fluid drag reduction surface. On the other hand, the turbulence effect of the fins 21 needs to be ensured to improve the heat exchange efficiency. The fin group 23 in this embodiment includes multiple first fin rows and multiple second fin rows. At least one second fin row is arranged between two adjacent first fin rows. The first fin row and the second fin row are both composed of multiple fins 21. The multiple fins 21 located in the first fin row and the multiple fins 21 located in the second fin row are arranged alternately. Through the fins 21 with the first fluid drag reduction surface and the second fluid drag reduction surface and the alternately arranged fin rows, the smooth turbulence of the coolant is realized while avoiding the formation of a boundary layer on the surface of the fins 21, which affects heat conduction.

[0037] Among them, the arrangement mode of the first fin row and the second fin row can be that one second fin row is sandwiched between every two adjacent first fin rows, that is, 1 first fin row, 1 second fin row, 1 first fin row, 1 second fin row, simply referred to as the 1, 2, 1 arrangement; the arrangement mode of the first fin row and the second fin row can also be that two second fin rows are sandwiched between every two adjacent first fin rows, that is, 1 first fin row, 2 second fin rows, 1 first fin row, 2 second fin rows, simply referred to as the 1, 2, 2, 1 arrangement; the arrangement mode of the first fin row and the second fin row can also be that three second fin rows are sandwiched between every two adjacent first fin rows, that is, 1 first fin row, 3 second fin rows, 1 first fin row, 3 second fin rows, simply referred to as the 1, 2, 2, 2, 1 arrangement. In other embodiments, the arrangement mode can also be 1, 2, 2, 2, 2, 1, etc., which will not be elaborated here.

[0038] In order to further improve the turbulence effect, in other embodiments, the fin rows at both ends of the entire fin group 23 are first fin rows. The thickness of the second fin row in this embodiment is greater than the thickness of the first fin row. Among them, the above thickness refers to the dimension perpendicular to the liquid flow direction, that is, the thickness of the fin 21 itself as a sheet structure.

[0039] See Figure 2 As shown, in order to guide the liquid flowing into the inflow hole so that it can flow to the outflow hole, a current collecting area is provided in this application. Specifically, the first through hole 12 in this embodiment is the inflow hole, and a current collecting area is provided at the first end of the liquid receiving groove 11. The current collecting area gradually decreases along the direction from the second end of the liquid receiving groove 11 to the first end of the liquid receiving groove 11, and the inflow hole is located in the current collecting area.

[0040] In order to make full use of the space, a plurality of fins 21 at the bottom of the first heat dissipation plate 20 in this embodiment jointly form a heat exchange part, and the shape of the heat exchange part is adapted to the liquid receiving groove 11. By allowing the plurality of fins 21 to occupy each corner of the liquid receiving groove 11, the space is fully utilized for heat exchange of the fins 21, effectively improving the heat dissipation efficiency of the heat dissipation device of this application.

[0041] A first heat dissipation surface is provided at the top of the first heat dissipation plate 20 of this embodiment, and the first heat dissipation surface is used for installing electronic components. A second heat dissipation plate 30 is provided on the side of the heat dissipation main body 10, and the second heat dissipation plate 30 is connected to the heat dissipation main body 10. A second heat dissipation surface 31 is provided at the upper part of the second heat dissipation plate 30, and the second heat dissipation surface 31 is used for installing a capacitor device. Among them, in one embodiment, the electronic component is a silicon carbide module, and surface treatment can be performed on the first heat dissipation surface, such as metal treatment with silver, etc., and the silicon carbide module can be welded on it by silver brazing, avoiding the failure risk and maintenance difficulties brought by using thermal grease and screws for installation; in another embodiment, the first heat dissipation surface can also be adhered to other electronic components with better thermal conductivity. In a preferred embodiment, a plurality of reinforcing ribs are provided at the bottom of the second heat dissipation plate 30, and the extending direction of the reinforcing ribs is parallel to the extending direction of the flow guiding plate 22.

[0042] See Figure 3 As shown, in order to save materials, in another embodiment of this application, the second heat dissipation plate 30 is lower than the first heat dissipation plate 20, so as to form a stepped structure between the first heat dissipation plate 20 and the second heat dissipation plate 30. The stepped structure can also facilitate the positioning and installation of the capacitor device.

[0043] In order to further improve the flow disturbance effect, in another embodiment of this application, a plurality of convex bumps are provided on the side wall of the liquid receiving groove 11, the plurality of convex bumps are arranged along the extending direction of the liquid receiving groove 11, and the surface of the convex bumps is smoothly transitioned.

[0044] In each of the above embodiments, the fins 21 are all fixed to the plate body of the first heat dissipation plate 20. In order to adjust the flow rate and direction of the liquid in the liquid containing groove 11, in another embodiment of the present application, the first heat dissipation plate 20 includes a plate body, and a plurality of shaft bodies are provided at the bottom of the plate body. The shaft bodies are perpendicular to the plate body, and a plurality of shaft bodies are respectively inserted into a plurality of fins 21 one by one, and the fins 21 can rotate around the shaft bodies. During installation, the staff can rotate a certain fin 21 or several fins 21 to achieve targeted heat dissipation for a specific area of the first heat dissipation plate 20.

[0045] In one embodiment, specifically, external threads are provided on the shaft bodies, threaded holes are provided inside the fins 21, and the fins 21 and the shaft bodies are connected by matching the external threads and the threaded holes.

[0046] In another embodiment, the angle of the rotated fin 21 can also be fixed by using a pin, as long as it can achieve the angle fixation of the fin 21.

[0047] In a preferred embodiment, the heat dissipation device of the present application itself has a temperature measurement function. The heat dissipation device of this embodiment includes a temperature measurement element, which is installed on the first heat dissipation plate 20. The temperature measurement element can share the power supply with the electronic components installed on the first heat dissipation plate 20 and perform data transmission to detect the temperature change of the heat dissipation device itself.

[0048] In summary, implementing the heat dissipation device provided by this embodiment has at least the following beneficial technical effects:

[0049] During use, the staff can install the electronic components that need to be cooled on the first heat dissipation plate, and through the first heat dissipation plate, heat exchange with the liquid in the liquid containing cavity is achieved to realize heat dissipation. Moreover, the heat dissipation device of the present application increases the heat exchange area with the liquid by providing a plurality of fins at the bottom of the first heat dissipation plate. At the same time, a first fluid drag reduction surface is provided at the first end of the fin, and the first fluid drag reduction surface faces the first end of the liquid containing groove to reduce the resistance to the liquid flowing from the first end of the liquid containing groove to the second end of the liquid containing groove. A second fluid drag reduction surface is provided at the second end of the fin, and the second fluid drag reduction surface faces the second end of the liquid containing groove to reduce the resistance to the liquid flowing from the second end of the liquid containing groove to the first end of the liquid containing groove, thereby reducing the resistance loss and liquid pressure loss, avoiding structural loss, and the reversible design of the inlet hole and the outlet hole can be realized by providing fluid drag reduction surfaces at both ends, effectively coping with various working condition changes.

[0050] The above are only the preferred embodiments of the present application, and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that, Comprising: A heat dissipation body, inside which there is a liquid containing groove. A first through hole is provided at the first end of the liquid containing groove, and a second through hole is provided at the second end of the liquid containing groove. One of the first through hole and the second through hole is a liquid inflow hole, and the other is a liquid outflow hole. Wherein, the first end of the liquid containing groove and the second end of the liquid containing groove are oppositely arranged; A first heat dissipation plate, which covers the liquid containing groove to form a liquid containing cavity; a plurality of fins are provided at the bottom of the first heat dissipation plate. A first fluid drag reduction surface is provided at the first end of the fin, and a second fluid drag reduction surface is provided at the second end of the fin. The first fluid drag reduction surface faces the first end of the liquid containing groove, and the second fluid drag reduction surface faces the second end of the liquid containing groove; The plurality of fins are divided into at least two fin groups. The extending direction of the fin group is the same as the extending direction of the liquid containing groove. There is a gap between two adjacent fin groups, and a flow guide plate is arranged in the gap along the extending direction of the gap; The fin group includes a plurality of first fin rows and a plurality of second fin rows. At least one second fin row is arranged between two adjacent first fin rows. Both the first fin row and the second fin row are composed of a plurality of fins. The plurality of fins located in the first fin row and the plurality of fins located in the second fin row are arranged in an interleaved manner; Both ends of the fin are of a streamline structure to form the first fluid drag reduction surface and the second fluid drag reduction surface; a plurality of convex protrusions are provided on the side wall of the liquid containing groove. The plurality of convex protrusions are arranged along the extending direction of the liquid containing groove, and the surface of the convex protrusion has a smooth transition; the first heat dissipation plate includes a plate body, and a plurality of shafts are provided at the bottom of the plate body. The shafts are perpendicular to the plate body, and the plurality of shafts are respectively inserted into the plurality of fins. The fins can rotate around the shafts; 2. The heat dissipation device according to claim 1, wherein The first through hole is an inflow hole. A flow collecting area is provided at the first end of the liquid containing groove. The flow collecting area gradually decreases along the direction from the second end of the liquid containing groove to the first end of the liquid containing groove. The inflow hole is located in the flow collecting area; 3. The heat dissipation device according to claim 1, characterized in that, The plurality of fins at the bottom of the first heat dissipation plate together form a heat exchange part, and the shape of the heat exchange part is adapted to the liquid containing groove; 4. The heat dissipation device according to claim 1, characterized in that, A first heat dissipation surface is provided at the top of the first heat dissipation plate for installing electronic components. A second heat dissipation plate is provided at the side of the heat dissipation body. The second heat dissipation plate is connected to the heat dissipation body. A second heat dissipation surface is provided at the upper part of the second heat dissipation plate for installing capacitor devices; 5. The heat dissipation device according to claim 4, wherein The second heat dissipation plate is lower than the first heat dissipation plate, so as to form a stepped structure between the first heat dissipation plate and the second heat dissipation plate; 6. The heat dissipation device according to claim 1, wherein External threads are provided on the shafts, and threaded holes are provided inside the fins. The fins and the shafts are connected by matching the external threads and the threaded holes.

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