Hybrid heat sinks for cooling electronic equipment

Abstract

Embodiments of a hybrid heat sink are disclosed. The hybrid heat sink includes a dry base and a wet base spaced apart from the dry base. The wet base includes a fluid inlet and a fluid outlet. A plurality of air channels are formed between the dry base and the wet base; and a plurality of liquid channels are formed between the dry base and the wet base. The plurality of liquid channels are coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels are thermally coupled to the plurality of air channels. Other embodiments are disclosed and claimed.

Description

Technical Field

[0001] The disclosed embodiments relate generally to heat sinks and, more particularly but not exclusively, to hybrid heat sinks that can be used to cool high power density electronic devices. Background Art

[0002] Hardware reliability is a challenge for electronic equipment cooling, especially in cloud service businesses where customer service level agreements (SLAs) require very high reliability levels. The cooling scheme plays a key role in the reliability of the hardware system. Especially in liquid cooling, cooling requires constant coolant recirculation 24 hours a day and 7 days a week (24×7) to keep the system running. But keeping the coolant circulating 24×7 is more challenging and more expensive than circulating air. In the cooling design of high-power density electronic equipment, although more and more technologies have been implemented to improve air cooling efficiency and capacity, as power density increases, liquid cooling may become the only viable solution in some cases, especially in high-performance and high-density computing.

[0003] Existing heat sinks use either cooling air or cooling water to extract heat, but do not support hybrid cooling environments that use both cooling air and cooling liquid. Previous attempts and solutions have only utilized a single cooling source from the deployment environment, which can limit the use cases of servers or systems that use the solution. In addition, for most existing solutions, such as air-cooled heat sinks, design optimizations can be performed to improve efficiency, but not operational energy efficiency optimizations. Similar to liquid-cooled cold plates, operational efficiency optimizations cannot be performed. Summary of the invention

[0004] According to one aspect of the present application, a hybrid heat sink is provided. The hybrid heat sink may include: a dry base; a wet base spaced apart from the dry base, the wet base including a fluid inlet and a fluid outlet; a plurality of air channels formed between the dry base and the wet base; and a plurality of liquid channels through which a working fluid can circulate, the plurality of liquid channels being fluidically coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels being formed between the dry base and the wet base and being separated from the plurality of air channels but thermally coupled to the plurality of air channels.

[0005] According to another aspect of the present application, a system is provided. The system may include: a heat generating electronic component; a hybrid heat sink thermally coupled to the heat generating electronic component. The hybrid heat sink may include: a dry base; a wet base spaced apart from the dry base, the wet base including a fluid inlet and a fluid outlet; a plurality of air channels formed between the dry base and the wet base; and a plurality of liquid channels through which a working fluid can circulate, the plurality of liquid channels being fluidly coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels being formed between the dry base and the wet base and being separated from the plurality of air channels but thermally coupled to the plurality of air channels. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Non-limiting, non-exhaustive embodiments of the present invention are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.

[0007] Figure 1 is an illustration of an embodiment of a cooling system including a hybrid radiator.

[0008] Figure 2 It is basically along the Figure 1 A cross-sectional view of an embodiment of a hybrid heat sink taken along section line AA in FIG.

[0009] Figure 3 is a cross-sectional view of another embodiment of a hybrid heat sink, substantially along Figure 1 The section line AA in is taken.

[0010] Figure 4 is an illustration of an embodiment of a hybrid heat sink thermally coupled to a heat generating electronic component such as a processor.

[0011] Figure 5 is an illustration of an embodiment of multiple hybrid heat sinks thermally coupled to multiple processors in a data center rack or server.

[0012] Figure 6 is an illustration of an embodiment of a hybrid heat sink thermally coupled to multiple processors in a data center rack or server. DETAILED DESCRIPTION

[0013] Embodiments of devices and systems for hybrid heat sinks are described herein. Specific details are described to provide an understanding of the embodiments, but a person skilled in the relevant art will recognize that the invention may be implemented without one or more of the described details or with other methods, components, materials, etc. In some cases, well-known structures, materials, or operations are not shown or described in detail, but are still included within the scope of the invention.

[0014] References throughout this specification to "one embodiment" or "an embodiment" mean that the described features, structures, or characteristics may be included in at least one of the described embodiments, so that the appearances of "in one embodiment" or "in an embodiment" do not necessarily refer to the same embodiment. In addition, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0015] An embodiment of a hybrid cooling heat sink design and structure is described below. The hybrid heat sink includes several channels and sections. The liquid recirculated in the liquid channel absorbs heat from the heat sink or directly from the heat source. When the device is cooled with cooling air, the air channel is used to form an air path. The disclosed embodiment is intended to address challenges in cooling high power density processors. In the event of failure of the primary cooling source, a high reliability solution that meets full redundancy requirements is provided to provide 24×7 operation. In addition, the hybrid cooling device can be used for operational efficiency optimization.

[0016] Figure 1 An embodiment of an electronic cooling system 100 is shown. The system 100 includes a hybrid heat sink 102 that is thermally coupled to a heat generating electronic component 104 via a dry pedestal 120, which is shown in phantom to indicate that in the illustrated view, the heat generating electronic component 104 will be below the dry pedestal 120 (see, e.g. Figure 2 ). In one embodiment, the heat generating electronic component 104 may be a microprocessor, but in other embodiments, the heat generating electronic component 104 may be a different type of electronic component or heat generating element. In one embodiment, the electronic component 104 and the cooling system 100 or individual components thereof may be part of an edge computing device or system, but in other embodiments, the component 104 and the cooling system 100 may be part of different types of systems.

[0017] As used herein, the expression "thermally coupled" means coupled in a manner that allows direct or indirect heat transfer between a pair of components. Thus, if component A is thermally coupled to component B, heat may flow in either direction between A and B, either directly if A and B are in direct thermal contact with each other, or indirectly through other heat transfer components or materials.

[0018] The hybrid heat sink 102 is described as "hybrid" because it provides both liquid cooling and air cooling. In order to provide these two types of cooling, the hybrid heat sink 102 includes a plurality of liquid channels through which a working fluid can flow, and a plurality of air channels through which air can flow. In one embodiment, the working fluid can be a single-phase fluid, such as water, but in other embodiments, the working fluid can be a single-phase fluid other than water. In other embodiments, the working fluid can be a multi-phase fluid. The hybrid heat sink 102 includes a fluid inlet 106 and a fluid outlet 108, which are used to circulate the fluid through the liquid channels. The fluid inlet 106 can be connected to a supply line, and the fluid outlet 108 can be connected to a return line using a fluid connector 107, which in one embodiment can be a quick disconnect fitting, but in other embodiments, the fluid connector can be some other type of fluid connector. In one embodiment (see Figure 2 ), a plurality of liquid channels are located in the wet fins 110, and the wet fins 110 transport the working fluid through the liquid channels from the fluid inlet to the fluid outlet. A pump 114 moves the working fluid through the hybrid radiator 102, and additionally, in one embodiment, through an external heat exchanger 116, where heat from the working fluid can be dissipated after the working fluid leaves the hybrid radiator and before the working fluid is recirculated into the hybrid radiator.

[0019] In addition to the plurality of liquid channels, the hybrid heat sink 102 also includes a plurality of air channels 112. As the name implies, the air channels allow air to circulate through the heat sink and remove heat by convection. In one embodiment, the air channels are formed by a dry base, a wet base, a plurality of dry fins, and a plurality of wet fins (see, e.g., Figure 2 ), but in other embodiments, the air passage 112 may be formed differently (see, e.g. Figure 3 ). In the illustrated system 100, convection through the hybrid heat sink 102 may be forced by one or more fans 113 positioned relative to the hybrid heat sink so that they push or draw air through the plurality of air passages 112. In other embodiments, the number of fans and their arrangement may vary from that shown, and other embodiments need not include any fans at all. In embodiments without any fans, the hybrid heat sink 102 may be mounted in a direction that promotes natural convection through the air passages.

[0020] The system 100 includes a controller 118 for providing temperature control for the heat generating electronic components 104. The controller 118 is coupled to the pump 114, one or more fans 113, and a temperature sensor 122. In one embodiment, the temperature sensor 122 may be located within or directly on the heat generating electronic components 104. In other embodiments, the temperature sensor 122 may be placed away from the heat generating electronic components 104, but close enough that its measurements may be considered representative of the temperature of the heat generating electronic components 104. By measuring the temperature of the heat generating electronic components 104, the controller 118 may selectively activate and deactivate or vary the speed of the pump 114 and the fan 113, thereby controlling the amount of heat transferred by the hybrid heat sink 102 and maintaining the temperature of the heat generating electronic components 104 within specified limits.

[0021] The system 100 provides several advantages. Because it includes air cooling and liquid cooling, the system 100 provides redundancy. A failure of the liquid cooling system can be compensated by air cooling, and similarly, a failure of air cooling can be compensated by liquid cooling. In addition, because the system 100 can provide liquid cooling, air cooling, or both liquid cooling and air cooling at the same time, the system 100 allows for resource delivery optimization. Another benefit is that when operating in a hybrid mode, system operating efficiency optimization can be performed.

[0022] Figure 2 A cross-sectional view of an embodiment of an assembled hybrid heat sink 200 is shown. The hybrid heat sink 200 includes a dry base 202 having a plurality of dry fins 204 protruding therefrom. The dry base and dry fins are so called because they do not have a liquid working fluid circulated through them. The dry base 202 is thermally coupled to the heat generating electronic component 104.

[0023] The wet base 206 has a plurality of wet fins 208 protruding therefrom. The wet base and wet fins are so called because they have a liquid working fluid circulated through them in one or more liquid channels 210 formed in each wet fin 208. The wet base 206 includes a fluid inlet 205 and a fluid outlet 207, and although not shown in the figure, includes liquid channels in the wet base itself to direct the working fluid to and through the liquid channels 210. In the illustrated embodiment, each wet fin 208 has five circular cross-section liquid channels 210, but other embodiments may have more or fewer liquid channels 210 in each wet fin, and the liquid channels need not have a circular cross-section, nor do they all need to have the same cross-sectional shape.

[0024] The wet base 206 and the dry base 202 are spaced apart from each other. The wet base 206 is positioned so that it abuts the end of the dry fin 204, and the dry base 202 is similarly positioned so that it abuts the end of the wet fin 208. Each dry fin 204 abuts the wet fin 208 along at least a portion of its length so that the fins are thermally coupled to each other in full contact and heat can be transferred from one fin to another. In the illustrated embodiment, the wet fin 208 and the dry fin 204 all have the same height h and abut each other along their entire height h, but in other embodiments, the wet fins and the dry fins do not necessarily all have the same height and do not necessarily abut each other along their entire height. This positioning of the dry base 202, wet base 206, dry fins 204, and wet fins 208 forms a plurality of air channels 212 in the hybrid heat sink 200, wherein each air channel 212 is defined by the dry base 202, wet base 206, wet fins 208, and dry fins 204. Air may flow through the air channels 212 by natural or forced convection, thereby transferring heat from both the wet fins and the dry fins to the passing air and out of the hybrid heat sink 200. Typically, the dry base 202, dry fins 204, wet base 206, and wet fins 208 are formed of a material having a high thermal conductivity; in one embodiment, they may be metal, but in other embodiments, it may be a thermally conductive non-metal.

[0025] In other embodiments, the hybrid heat sink 200 can be assembled in different ways. For example, the dry fins can be connected to the wet fins, or can be designed directly on the wet fins at the beginning. In the figure, the dry part and the wet part are shown as two separate units. In one embodiment, the two units can be manufactured separately and then connected together as shown. In another embodiment, the entire structure can be assembled into multiple vertical layers. The first layer is the dry base, followed by the channel layer, and then the wet base. In other embodiments, different methods can be applied to achieve internal structure optimization.

[0026] In operation of the hybrid heat sink 200, heat from the heat generating electronic components 104 is transferred by conduction to the dry base 202 and the dry fins 204. Due to the thermal coupling of the dry fins 204 to the wet fins 208, the dry fins 204 transfer the heat to the working fluid flowing through the liquid channels 210. The working fluid flowing through the channels 210 then exits the hybrid heat sink 200 through the fluid outlet 207. Individually or simultaneously, heat may be transferred from the dry fins 204 and the wet fins 208 to the air in the air channels 212.

[0027] Figure 3Another embodiment of a hybrid heat sink 300 is shown. The hybrid heat sink 300 includes a dry base 302 thermally coupled to the heat generating electronic component 104 and a wet base 304 spaced apart from the dry base 302. The wet base 304 includes a fluid inlet 303, a fluid outlet 305, and an internal liquid channel (not shown) through which the working fluid is guided to and through the liquid channel 314.

[0028] The corrugated structure 306, i.e., a structure formed into alternating ridges 308 and grooves 310, is located between the dry base 302 and the wet base 304. Typically, the dry base 302, the wet base 304, and the corrugated structure 306 are formed of a material having a high thermal conductivity; in one embodiment, it may be a metal, but in other embodiments, it may be a thermally conductive non-metal. The bottom of the grooves 310 abut and are connected to the dry base 302, while the top of the ridges 308 abut and are connected to the wet base 304, so that the corrugated structure 306 forms alternating air channels 312 and liquid channels 314. In the illustrated embodiment, each air channel 312 is defined by the corrugated structure 306 and the dry base 302, while each liquid channel 314 is defined by the corrugated structure 306 and the wet base 304.

[0029] In operation of the hybrid heat sink 300, heat from the heat generating electronic components 104 is transferred by conduction through the dry base 302 and into the corrugated structure 306 and the air channels 312. The corrugated structure 306 is thermally coupled to the air moving through the air channels 312 and the working fluid moving through the liquid channels 314, so that the heat transferred into the corrugated structure 306 is then transferred into the working fluid flowing through the liquid channels 314, and into the air flowing through the air channels 312. Depending on the relative temperatures of the air in the air channels 312 and the working fluid in the liquid channels 314, heat may also be transferred from the working fluid to the air, or from the air to the working fluid, through the corrugated structure 306.

[0030] Figure 4 shows that using Figures 1 to 3 1 and 10. In order to simplify the drawings and descriptions, some elements associated with the hybrid radiator 102 in the cooling system 100 - fluid inlet and outlet, pump, heat exchanger, fan, controller, temperature sensor, etc. are not shown in the figure, but some or all of these elements will exist in the actual implementation of the cooling system 400.

[0031] The cooling system 400 includes a steam chamber 402 thermally coupled to the heat generating electronic component 104. The steam chamber 402 is thermally coupled to one or more vertically oriented heat pipes or vertical steam chambers 404, and the heat pipes 404 are thermally coupled to a hybrid heat sink 406, which, as described above, can be any hybrid heat sink embodiment shown and described above. The illustrated embodiment can also be considered to be a device assembled with a vertical steam chamber. In this embodiment, both the dry fins and the wet fins are in direct contact with the heat pipes and in direct contact with each other, with the air channel located in the middle. Because the heat pipes can pass through the liquid channel, the result may be a higher design complexity and cost. In another embodiment, the dry fins are used to connect to the heat pipes, and the wet fins are designed into multiple parts and are only coupled to the fins. In this design, no mounting holes are required on the liquid channel portion.

[0032] In operation of cooling system 400, heat from heat generating electronic components 104 is transferred to vapor chamber 402 by conduction. Heat is transferred from vapor chamber 402 to heat pipe 404. Hybrid heat sink 406 may be Figures 2 to 3 One of the embodiments shown is thermally coupled to the heat pipe 404 so that heat transferred to the heat pipe is subsequently transferred to the working fluid flowing through the liquid channel and to the air flowing through the air channel in the hybrid heat sink 406. Heat can be transferred from the dry fins and the wet fins to the air in the air channel either individually or simultaneously.

[0033] Figure 5 Shown include such Figures 1 to 3 1 and 1. In order to simplify the drawings and description, the embodiment of the server 500 with one or more hybrid heat sinks is not shown in this figure. Figure 1 Some elements associated with the hybrid radiator 102 in FIG. 5 are shown—fluid inlets and outlets, pumps, heat exchangers, fans, controllers, temperature sensors, etc.—but some or all of these elements will be present in an actual implementation of the cooling system 500 .

[0034] The server 500 is housed in a server chassis or housing 502 and includes a motherboard 504 on which one or more heat generating electronic components 104 are mounted. In one embodiment, the heat generating electronic components 104 may be processors, but in other embodiments, the heat generating electronic components 104 may be different types of electronic components. Each electronic component 104 is thermally coupled to a cooling system using a hybrid heat sink 510 so that the entire server can be air cooled and / or liquid cooled. In the illustrated embodiment, each electronic component 104 is coupled to a cooling system similar to the cooling system 400. Each electronic component 104 is thermally coupled to a vapor chamber 506, which is thermally coupled to one or more vertically oriented heat pipes 508. The heat pipes 508 are in turn thermally coupled to a hybrid heat sink 510, which may be any hybrid heat sink embodiment shown and described above. In other embodiments, the electronic components 104 may be thermally coupled to the hybrid heat sink differently, and in other embodiments, not every electronic component needs to be coupled to the same type of heat transfer mechanism or the same type of hybrid heat sink. In operation of the illustrated embodiment, each individual cooling system operates substantially as described above with respect to system 400 .

[0035] Figure 6 An embodiment of a server 600 including a local and remote hybrid heat sink is shown. Figure 1 Some elements associated with the hybrid radiator 102 in FIG. 6 are shown—fluid inlets and outlets, pumps, heat exchangers, fans, controllers, temperature sensors, etc.—but some or all of these elements will be present in an actual implementation of the cooling system 600 .

[0036] The server 600 is housed in a server chassis 602 and includes a motherboard 504 on which heat generating electronic components 104a and 104b are mounted. In one embodiment, the heat generating electronic components 104a and 104b may be processors, but in other embodiments, the heat generating electronic components 104a and 104b may be different types of electronic components. The electronic component 104a is directly thermally coupled to a hybrid heat sink 510, which in the illustrated embodiment is a hybrid heat sink 300 (see FIG. 1 ). Figure 3 ), but may have different structures in other embodiments.

[0037] In contrast, electronic component 104b is indirectly thermally coupled to hybrid heat sink 614. Electronic component 104b is thermally coupled to cooling plate or thermally conductive plate 606, which in turn is thermally coupled to vapor chamber 610 via heat pipe 608. Vapor chamber 610 is thermally coupled to one or more vertically oriented heat pipes 612, and heat pipe 612 is thermally coupled to hybrid heat sink 614, which, as described above, can be any hybrid heat sink embodiment shown and described above. Fan 616 provides forced convection through hybrid heat sink 614 to enhance its air heat transfer. In one operating scenario, when liquid supply fails, air cooling will be used for the entire server. In another case, by adjusting the cooling air and cooling fluid for multiple devices, cooling energy consumption and IT power consumption can be optimized.

[0038] In addition to the above embodiments, other embodiments are also possible. For example:

[0039] The current solution can be used as a condenser in a thermosyphon loop.

[0040] • Different types of hybrid cooling channels and structures can be considered, such as custom hybrid cooling channels for pin-fin structures.

[0041] The current device can be assembled into a complete module with axial or radial fans.

[0042] Air channels and liquid channels can be designed in different configurations.

[0043] The unit can be assembled in different ways with different types of phase change thermal management devices (heat pipes, vapor chambers).

[0044] The above description of embodiments is not intended to be exhaustive or to limit the invention to the form described. Specific embodiments and implementations of the invention are described herein for purposes of illustration, but various modifications are possible.

Claims

1. A hybrid radiator, comprising: a stem base having a plurality of stem fins protruding therefrom; a wet base spaced apart from the dry base, the wet base comprising a fluid inlet, a fluid outlet, and a plurality of wet fins protruding therefrom; each of the dry fins being adjacent to the wet fin; a plurality of air passages formed by the plurality of dry fins and the plurality of wet fins extending between the dry base and the wet base; as well as a plurality of liquid passages through which a working fluid can circulate, the plurality of liquid passages being fluidly coupled to the fluid inlet and the fluid outlet, and the plurality of liquid passages being formed in the wet base and the wet fins and being separate from but thermally coupled to the plurality of air passages; wherein the working fluid is distributed from the fluid inlet to one or more liquid channels in the plurality of wet fins; The dry fins transfer heat to the working fluid flowing through the liquid channels in the wet fins.

2. The hybrid heat sink according to claim 1, wherein: Each wet fin has one or more of the liquid passages therein.

3. The hybrid heat sink according to claim 1, wherein: Each dry fin is thermally coupled to a corresponding wet fin.

4. The hybrid heat sink according to claim 1, wherein: Each of the air channels is defined by a dry base, a wet base, a dry fin and a wet fin. 5 . The hybrid heat sink of claim 1 , further comprising a fluid connector coupled to the fluid inlet, the fluid outlet, or both the fluid inlet and the fluid outlet.

6. The hybrid heat sink according to claim 1, wherein: The working fluid is a single-phase fluid or a multi-phase fluid.

7. A hybrid heat sink comprising: dry base; a wet base spaced apart from the dry base, the wet base comprising a fluid inlet, a fluid outlet, and an internal fluid passage; a plurality of air passages formed between the dry base and the wet base; as well as a plurality of liquid channels through which a working fluid can circulate, the plurality of liquid channels being fluidly coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels being formed between the dry susceptor and the wet susceptor and being separate from but thermally coupled to the plurality of air channels; a corrugated structure extending between the dry base and the wet base to form a plurality of channels including alternating air channels and liquid channels; The wet base guides the working fluid into the liquid channel formed by the corrugated structure through the internal fluid channel of the wet base.

8. The hybrid heat sink according to claim 7, wherein: The corrugated structure is a structure formed into alternating ridges and grooves, with the bottoms of the grooves abutting and connecting to the dry base and the tops of the ridges abutting and connecting to the wet base, so that the corrugated structure forms alternating air channels and liquid channels.

9. The hybrid heat sink of claim 7, further comprising a fluid connector coupled to the fluid inlet, the fluid outlet, or both the fluid inlet and the fluid outlet.

10. The hybrid heat sink according to claim 7, wherein: The working fluid is a single-phase fluid or a multi-phase fluid.

11. A cooling system comprising: Heat-generating electronic components; A hybrid heat sink is thermally coupled to the heat generating electronic component, the hybrid heat sink comprising: a stem base having a plurality of stem fins protruding therefrom; a wet base spaced apart from the dry base, the wet base comprising a fluid inlet, a fluid outlet, and a plurality of wet fins protruding therefrom; each of the dry fins being adjacent to the wet fin; a plurality of air passages formed by the plurality of dry fins and the plurality of wet fins extending between the dry susceptor and the wet susceptor; and a plurality of liquid passages through which a working fluid can circulate, the plurality of liquid passages being fluidly coupled to the fluid inlet and the fluid outlet, and the plurality of liquid passages being formed in the wet base and the wet fins and being separate from but thermally coupled to the plurality of air passages; The working fluid is distributed from the fluid inlet to one or more liquid channels in the plurality of wet fins; and the dry fins transfer heat to the working fluid flowing through the liquid channels in the wet fins.

12. The system of claim 11, further comprising a pump coupled to the fluid inlet and the fluid outlet, wherein: The pump circulates the working fluid into the fluid inlet, through the plurality of fluid channels, and into the fluid outlet.

13. The system of claim 12, further comprising a fan to force convection through the air passages in the hybrid heat sink.

14. The system of claim 13, further comprising a controller coupled to the pump, the fan, and the temperature sensor, wherein: The controller regulates the temperature of the heat generating electronic components by selectively activating, deactivating, or varying the speed of the pump and the fan.

15. The system of claim 14, wherein: The heat generating electronic component is thermally coupled to a vapor chamber, one or more heat pipes are thermally coupled to the vapor chamber, and the hybrid heat sink is thermally coupled to the one or more heat pipes.

16. The system according to claim 11, wherein: The heat generating electronic component and the hybrid heat sink are part of an edge computing device.

17. A cooling system comprising: Heat-generating electronic components; A hybrid heat sink is thermally coupled to the heat generating electronic component, the hybrid heat sink comprising: dry base; a wet base spaced apart from the dry base, the wet base comprising a fluid inlet, a fluid outlet, and an internal fluid passage; a plurality of air passages formed between the dry base and the wet base; and a plurality of liquid channels through which a working fluid can circulate, the plurality of liquid channels being fluidly coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels being formed between the dry susceptor and the wet susceptor and being separate from but thermally coupled to the plurality of air channels; A corrugated structure extends between the dry base and the wet base to form a plurality of channels including the air channels and the liquid channels alternately; the wet base guides the working fluid into the liquid channels formed by the corrugated structure through its internal fluid channels.

18. The system of claim 17, further comprising a pump coupled to the fluid inlet and the fluid outlet, wherein: The pump circulates the working fluid into the fluid inlet, through the plurality of fluid channels, and into the fluid outlet.

19. The system of claim 18, further comprising a fan to force convection through the air passages in the hybrid heat sink.

20. The system of claim 19, further comprising a controller coupled to the pump, the fan, and the temperature sensor, wherein: The controller regulates the temperature of the heat generating electronic components by selectively activating, deactivating, or varying the speed of the pump and the fan.

21. The system of claim 20, wherein: The heat generating electronic component is thermally coupled to a vapor chamber, one or more heat pipes are thermally coupled to the vapor chamber, and the hybrid heat sink is thermally coupled to the one or more heat pipes.

22. The system of claim 17, wherein: The heat generating electronic component and the hybrid heat sink are part of an edge computing device.

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