A heat dissipation device based on graphene heating chip

Abstract

The present invention relates to a heat dissipation device based on a graphene heating chip, comprising a plurality of layers of heat sinks, and a graphene heating body arranged between two adjacent layers of heat sinks, wherein the graphene heating body comprises a heat-conducting shell in contact with the heat sink, and a graphene chip fixed in the heat-conducting shell, wherein the contacts of the graphene chip are connected with a wire. The present invention increases the heat dissipation area and improves the heat conduction effect by staggering the heat sink and the graphene heating body layer by layer; forms a first layer of protection by arranging a heat-conducting sealing layer on both sides of the graphene chip, and forms a second layer of protection by arranging a heat-conducting insulating plate, thereby improving the sealing effect; and the double safety protection packaging method of ceramic glue plus high-temperature insulating paint prevents leakage and is safe to use, so that the heat conduction on both sides of the graphene chip is more uniform, and the heating film is not easy to burn out, thereby ensuring the effective safety protection of the chip and improving the insulation performance.

Description

Technical Field

[0001] The present invention relates to the field of heat sink technology, and in particular to the packaging application field of graphene heating chips, and specifically refers to a heat sink device based on the graphene heating chip. Background Art

[0002] Radiators are important components in the fields of automotive engine cooling systems and household electric heaters. Their function is to dissipate the absorbed heat into the air to form heat exchange. Current automotive radiators and household electric heaters have high power and consume a lot of electricity. Therefore, a heat dissipation device with low power and high energy is needed to be widely used. The graphene heating chip converts electrical energy into thermal energy when powered on, and can meet the requirements of providing high heat with low power. However, the packaging of the heating chip in the existing heat dissipation device is easy to deform and has poor heat dissipation effect, which makes the graphene heating chip unable to be widely used in the fields of automotive engine cooling systems and household electric heaters. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a heat dissipation device based on a graphene heating chip, which improves the heat dissipation effect and enables the graphene heating chip to be applied to fields such as automobile engine cooling systems and household electric heaters.

[0004] The present invention is achieved through the following technical scheme, which provides a heat dissipation device based on a graphene heating chip, including several layers of heat sinks and a graphene heating body arranged between two adjacent layers of heat sinks, wherein the graphene heating body includes a heat-conducting shell contacting and connected with the heat sink, and a graphene chip fixed in the heat-conducting shell, and the contacts of the graphene chip are connected with wires.

[0005] When in use, the present solution connects the wire to a power source, and the graphene chip dissipates heat after being powered on. The heat is transferred to the heat sink through the heat-conducting shell, and heat is exchanged between the heat sink and the surrounding air, thereby increasing the uniformity of heat conduction. The heat-conducting shell is provided to protect the graphene chip, making it convenient to use with the heat sink, while also improving the heat transfer efficiency.

[0006] As an optimization, two heat-conducting insulating plates are provided in the heat-conducting housing, which are located on both sides of the graphene chip, and a heat-conducting sealing layer covering the surface of the graphene chip is provided between the heat-conducting insulating plates and the graphene chip. This optimization scheme not only achieves heat dissipation by providing a heat-conducting sealing layer, but also forms a first layer of protection for the graphene chip. By providing heat-conducting insulating plates on both sides of the chip, a second layer of protection is formed for the graphene chip, while ensuring safety in use, avoiding obstruction of heat dissipation, and improving uniformity of heat conduction.

[0007] As an optimization, the heat-conducting insulating plate includes a heat-conducting plate and a high-temperature resistant insulating coating applied on the side of the heat-conducting plate, and the high-temperature resistant insulating coating is located between the heat-conducting plate and the heat-conducting sealing layer. The heat-conducting insulating plate of this optimization solution has a simple structure, is easy to manufacture, and has low cost. The high-temperature resistant insulating coating is used as the insulating layer, which not only ensures the insulation effect, but also avoids affecting the heat dissipation, and ensures the firmness of the combination with the heat-conducting plate.

[0008] As an optimization, the thermally conductive sealing layer is ceramic glue, and the thermally conductive sealing layer and the graphene chip, as well as the thermally conductive sealing layer and the thermally conductive insulating plate are all bonded together. This optimization scheme uses ceramic glue as the thermally conductive sealing layer, which not only forms a protection for the graphene chip, but also firmly bonds the thermally conductive insulating plate and the graphene chip together, making it easier to bond the thermally conductive sealing layer and the graphene chip, as well as the thermally conductive sealing layer and the thermally conductive insulating plate. Through the bonding of the three, heat transfer can be better performed, and the heat dissipation efficiency of the graphene chip can be improved.

[0009] As an optimization, the graphene chip, the heat-conducting sealing layer and the heat-conducting insulating plate form a heating device, and the gap between the heating device and the heat-conducting shell is filled with a heat-conducting sealing material. This optimization scheme uses a heat-conducting sealing material to fill the gap between the heating device and the heat-conducting shell, making the heating device and the heat-conducting shell a solid, further improving the heat conduction efficiency, while also improving the overall structural strength of the packaging structure.

[0010] As an optimization, the heating device extends out of the heat-conducting housing from the front end of the inner cavity of the heat-conducting housing, the front end of the heat-conducting housing and the heating device are sealed, the connection point between the wire and the graphene chip is located outside the heat-conducting housing, and the part of the heating device extending outside the heat-conducting housing is covered with a protective layer. The setting of this optimization scheme is more convenient to connect to an external power supply, thereby improving the convenience of use, and is more suitable for being set between two heat sinks to form a staggered arrangement with the heat sinks.

[0011] As an optimization, the connection point between the wire and the graphene chip is coated with insulating glue. This optimization solution covers the connection point between the wire and the graphene chip with insulating glue, so that the connection point is isolated from the air and plays an insulating role to ensure safety in use.

[0012] As an optimization, a plug hole adapted to the heating device is provided at the front end of the heat-conducting shell, and a filling process hole is provided at the rear end of the heat-conducting shell. Both the plug hole and the filling process hole are connected to the inner cavity of the heat-conducting shell, and both the plug hole and the filling process hole are sealed. This optimization scheme facilitates the insertion of graphene chips and heat-conducting insulating plates by providing a plug hole, and by providing a filling process hole, when filling the inner cavity of the heat-conducting shell with heat-conducting sealing material, bubbles in the cavity are avoided to affect the flow of the filling material, thereby improving the filling efficiency and ensuring the compactness of the filling. The sealing of the plug hole and the filling process hole refers to the sealing after the heating device is installed.

[0013] As an optimization, both the left and right plates of the heat-conducting housing are provided with inner grooves, which extend along the front-rear direction of the heat-conducting housing. This optimization scheme improves the bending strength of the heat-conducting housing by providing the inner grooves, and facilitates the integral compaction of the heat-conducting housing and the heating device.

[0014] The beneficial effects of the present invention are as follows: the heat dissipation area is increased and the heat conduction effect is improved by staggered arrangement of the heat dissipation body and the graphene heating body layer by layer; the first layer of protection is formed by arranging a heat-conducting sealing layer on both sides of the graphene chip, and the second layer of protection is formed by arranging a heat-conducting insulating plate, thereby improving the sealing effect; and the double safety protection packaging method of ceramic glue plus high-temperature insulating paint prevents leakage and is safe to use, so that the heat conduction on both sides of the graphene chip is more uniform, and the heating film is not easy to burn, thereby ensuring the effective safety protection of the chip and improving the insulation performance; two aluminum sheets filled with environmentally friendly ceramic glue and high-temperature insulating paint are used to squeeze the heating film in the middle position, and then the structure of the aluminum profile packaging is simple, not easy to deform, and easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the present invention;

[0016] Figure 2 for Figure 1 Middle AA section view;

[0017] Figure 3 Schematic diagram of the graphene heating body structure;

[0018] Figure 4 is a cross-sectional view of a graphene heater;

[0019] Figure 5 for Figure 4 Enlarged view at B in the middle;

[0020] As shown in the figure:

[0021] 1. heat sink, 2. graphene heating element, 3. heat-conducting shell, 4. heat-conducting plate, 5. high-temperature resistant insulating coating, 6. heat-conducting sealing layer, 7. graphene chip, 8. sealant, 9. wire, 10. heat-conducting sealing material. DETAILED DESCRIPTION

[0022] In order to clearly illustrate the technical features of this solution, this solution is described below through a specific implementation method.

[0023] like Figure 1A heat sink based on a graphene heating chip is shown, comprising a bracket, a plurality of heat sinks 1 arranged sequentially from top to bottom, and a graphene heating body 2 arranged between two adjacent heat sinks, wherein the heat sink and the graphene heating body are both fixedly connected to the bracket to form a heat sink as a whole. The heat sink in this embodiment is a corrugated heat sink aluminum strip to ensure smooth heat conduction. In practical applications, different numbers of heat sink aluminum strips are selected according to needs to form heat sinks of different powers.

[0024] The graphene heating body includes a heat-conducting shell 3 that is in contact with the heat sink, and a graphene chip 7 that is fixed in the heat-conducting shell, and the contacts of the graphene chip are connected with a wire 9. The heat-conducting shell of this embodiment is a tubular aluminum profile, and the front end of the heat-conducting shell is provided with a jack that is adapted to the heating device, and the rear end of the heat-conducting shell is provided with a filling process hole that is opposite to the jack, and the jack and the filling process hole are both connected to the inner cavity of the heat-conducting shell, and the jack and the filling process hole are sealed by a sealant 8 after the heating device is installed, and an end sealing layer is formed at both ends, and the jack is used for inserting the heating device, and the filling process hole is used for exhausting when filling the heat-conducting sealing material. The left side plate and the right side plate of the heat-conducting shell are both provided with an inner groove, and the inner groove extends along the front and rear direction of the heat-conducting shell. Aluminum is a relatively soft, durable, lightweight, and ductile metal. Aluminum alloy is a material and a molding structure that are easier to stamp. On the other hand, compared with most metals, aluminum is a very good electrical conductor, and aluminum products have better thermal conductivity and heat dissipation.

[0025] Two heat-conducting insulating plates are arranged in the heat-conducting shell, which are respectively located on both sides of the graphene chip. A heat-conducting sealing layer 6 covering the surface of the graphene chip is arranged between the heat-conducting insulating plate and the graphene chip. The heat-conducting sealing layer is ceramic glue. The heat-conducting sealing layer and the graphene chip, as well as the heat-conducting sealing layer and the heat-conducting insulating plate are all fitted together. The graphene chip, the heat-conducting sealing layer and the heat-conducting insulating plate form a heating device. The gap between the heating device and the heat-conducting shell is densely filled with a heat-conducting sealing material 10. The heating device of this embodiment extends out of the heat-conducting shell from the front end of the inner cavity of the heat-conducting shell. The front end of the heat-conducting shell and the heating device are sealed by a sealant. The two contacts of the graphene chip are welded to the wire, and the connection point between the wire and the graphene chip is located outside the heat-conducting shell. The connection point between the wire and the graphene chip is coated with insulating glue. The part of the heating device extending out of the heat-conducting shell is coated with a sealing protective layer, and the sealing protective layer also uses a sealant. The sealant of this embodiment adopts 14# sealant which has fast curing speed, good moisture-proof and waterproof performance, shock resistance, aging resistance, and good electrical performance and adhesion.

[0026] The heat-conducting insulating plate of this embodiment includes a heat-conducting plate 4 and a high-temperature resistant insulating coating 5 coated on the side of the heat-conducting plate, and the high-temperature resistant insulating coating 5 is located between the heat-conducting plate 4 and the heat-conducting sealing layer 6. The heat-conducting plate is an aluminum plate, and the high-temperature resistant insulating coating is a high-temperature resistant insulating paint layer coated on the heat-conducting plate. The high-temperature resistant insulating paint has the advantages of high temperature resistance, high insulation, acid and alkali resistance, resistance to ultra-large current and resistance to ultra-high voltage. After curing, the coating has a large breakdown strength and has excellent flame retardant and fireproof properties. The heat-conducting sealing layer uses 3# ceramic glue, which is an environmentally friendly structural sealant with the advantages of good waterproofness, good aging resistance, and no pollution, and can effectively protect the chip.

[0027] During production, the heat conducting plate is polished by sandpaper or other methods to improve the surface roughness of both sides of the heat conducting plate. After wiping and cleaning the surface, the inner side of the heat conducting plate is sprayed with insulating paint, and 3# ceramic glue is filled on both sides. The thickness of the ceramic glue is 0.1mm~0.2mm. The force is evenly applied to ensure uniform filling, and then the graphene chip is pasted to achieve the effect of balanced insulation and heat conduction. The whole formed by the graphene chip and the heat conducting plate is inserted into the inner cavity of the heat conducting shell to form an aluminum profile component, and then a certain pressure is applied to the aluminum profile component using a punch press and other equipment to achieve compaction. First, the flowing colloid can fill the internal gaps densely, and second, the graphene chip can better fit with the aluminum plate and aluminum profile to better transfer the heat of the chip. Then, wires are welded on the two contacts of the pressed chip to connect to the external power supply equipment. The weld point position is covered with sealant to isolate it from the air and play an insulating role. L sections are left at the front and tail of the aluminum profile component to fill the sealing layer.

[0028] The heat dissipation device of the present invention increases the heat dissipation area and improves the thermal conductivity effect by staggeredly arranging the heat dissipation body and the graphene heating body layer by layer; the first layer of protection is formed by arranging a thermal conductive sealing layer on both sides of the graphene chip, and the second layer of protection is formed by the arranged thermal conductive insulating plate, thereby improving the sealing effect; and the double safety protection packaging method of ceramic glue plus high-temperature insulating paint prevents leakage and is safe to use, so that the heat conduction on both sides of the graphene chip is more uniform, and the heating film is not easy to burn, thereby ensuring the effective safety protection of the chip and improving the insulation performance; two aluminum sheets filled with environmentally friendly ceramic glue and high-temperature insulating paint are used to squeeze the heating film in the middle position, and then the structure of encapsulation by aluminum profiles is simple, not easy to deform, and easy to operate.

[0029] Of course, the above description is not limited to the above examples. Technical features not described in the present invention can be achieved by or by using existing technologies, which will not be described here. The above embodiments and drawings are only used to illustrate the technical scheme of the present invention and are not limitations of the present invention. The present invention is described in detail with reference to the preferred implementation methods. Ordinary technicians in this field should understand that changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention do not depart from the purpose of the present invention, and should also fall within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation device based on a graphene heating chip, characterized in that: It comprises several layers of heat sinks, and a graphene heating body arranged between two adjacent layers of heat sinks, wherein the graphene heating body comprises a heat-conducting shell in contact with the heat sink, and a graphene chip fixed in the heat-conducting shell, wherein the contacts of the graphene chip are connected with wires; Two heat-conducting insulating plates are arranged in the heat-conducting housing and are respectively located on both sides of the graphene chip. A heat-conducting sealing layer covering the surface of the graphene chip is arranged between the heat-conducting insulating plates and the graphene chip. The graphene chip, the heat-conducting sealing layer and the heat-conducting insulating plate form a heating device, and the gap between the heating device and the heat-conducting shell is filled with a heat-conducting sealing material.

2. A heat dissipation device based on a graphene heating chip according to claim 1, characterized in that: The heat-conducting insulating plate comprises a heat-conducting plate and a high-temperature-resistant insulating coating coated on the side of the heat-conducting plate, and the high-temperature-resistant insulating coating is located between the heat-conducting plate and the heat-conducting sealing layer.

3. The heat dissipation device based on the graphene heating chip according to claim 1, characterized in that: The thermally conductive sealing layer is ceramic glue, and the thermally conductive sealing layer and the graphene chip, as well as the thermally conductive sealing layer and the thermally conductive insulating plate are bonded together.

4. The heat dissipation device based on the graphene heating chip according to claim 1, characterized in that: The heating device extends out of the heat-conducting shell from the front end of the inner cavity of the heat-conducting shell. The front end of the heat-conducting shell and the heating device are sealed. The connection point between the wire and the graphene chip is located outside the heat-conducting shell. The part of the heating device extending outside the heat-conducting shell is covered with a protective layer.

5. The heat dissipation device based on the graphene heating chip according to claim 4, characterized in that: The connection point between the wire and the graphene chip is coated with insulating glue.

6. The heat dissipation device based on the graphene heating chip according to claim 1, characterized in that: The front end of the heat-conducting shell is provided with a socket adapted to the heating device, and the rear end of the heat-conducting shell is provided with a filling process hole. Both the socket and the filling process hole are connected to the inner cavity of the heat-conducting shell, and both the socket and the filling process hole are sealed.

7. The heat dissipation device based on the graphene heating chip according to claim 1, characterized in that: The left side plate and the right side plate of the heat-conducting housing are both provided with inner grooves, and the inner grooves extend along the front-rear direction of the heat-conducting housing.

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