Cutting device and cutting method

Abstract

The present application provides a cutting device and a cutting method, which can inhibit the detection state of a workpiece photographed through a transparent portion from deteriorating. The cutting device includes: a holding table that holds a workpiece, at least a part of a holding surface of which includes a transparent portion composed of a transparent member; a cutting unit that includes a cutting tool that cuts the workpiece held by the holding table and a cutting water nozzle that supplies cutting water in the cutting of the workpiece by the cutting tool; a photographing camera that photographs the workpiece through the transparent portion; and a removal unit that removes liquid adhering to the transparent portion. The removal unit includes: an abutting member that is positioned at an abutting position abutting against the transparent portion and a retreat position; and an X-axis moving unit that relatively moves the abutting member abutting against the transparent portion on the transparent portion.

Description

Technical Field

[0001] This invention relates to cutting apparatus and cutting method. Background Technology

[0002] Machining apparatuses, such as cutting devices, that process a workpiece are sometimes used to align the cutting tool or other machining unit with the workpiece or to confirm the cutting groove, which serves as a machining mark. To enable the workpiece to be photographed from below, machining apparatuses sometimes use a holding table for holding the workpiece that has a transparent portion made of a transparent component (see, for example, Patent Documents 1 and 2).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2010-87141

[0004] Patent Document 2: Japanese Patent Application Publication No. 2010-82644

[0005] In the aforementioned cutting apparatus, the cutting water supplied during cutting may drip from the workpiece and adhere to the holding table when it is removed. When liquid adheres to the transparent part, the water droplets are reflected in the image taken through the transparent part. This makes it impossible to accurately detect patterns or cutting grooves on the workpiece based on the image during alignment or cut inspection, thus requiring improvement. Therefore, the inspection status of the workpiece taken through the transparent part in the aforementioned cutting apparatus may deteriorate. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide a cutting apparatus and a cutting method that can suppress the deterioration of the detection state of a workpiece when photographed through a transparent part.

[0007] According to one aspect of the present invention, a cutting apparatus is provided, comprising: a holding table for holding a workpiece, having at least a portion of a holding surface having a transparent portion made of a transparent member; a cutting unit comprising a cutting tool and a cutting water nozzle, the cutting tool cutting the workpiece held by the holding table, the cutting water nozzle providing cutting water during the cutting of the workpiece by the cutting tool; a photographing camera for photographing the workpiece through the transparent portion; and a removal unit for removing liquid adhering to the transparent portion.

[0008] Preferably, the removal unit includes: an abutting member positioned in an abutting position and a retracting position abutting against the transparent portion; and a moving mechanism that moves the abutting member relative to the transparent portion.

[0009] Preferably, the removal unit includes: a jetting section that jets air toward the transparent section; and a moving mechanism that moves the jetting section on the transparent section.

[0010] According to another aspect of the present invention, a cutting method is provided for processing a workpiece using the cutting device, wherein the cutting method comprises the following steps: a removal step in which liquid is removed from a transparent portion using the removal unit; a holding step in which the workpiece is held using a holding table after the removal step; an imaging step in which the workpiece is photographed through the transparent portion using a photographing camera after the holding step; and a cutting step in which the workpiece held by the holding table is cut using a cutting tool.

[0011] The present invention has the effect of suppressing the deterioration of the detection status of the workpiece when photographed through the transparent part. Attached Figure Description

[0012] Figure 1 This is a perspective view showing a structural example of the cutting device according to the first embodiment.

[0013] Figure 2 It is shown Figure 1 A perspective view of the holding unit of the cutting device and the camera shown.

[0014] Figure 3 yes Figure 1 A perspective view of the removal unit of the cutting device shown.

[0015] Figure 4 It is shown Figure 3 A perspective view of the contacting parts of the removal unit shown.

[0016] Figure 5 It is shown Figure 4 The side view of the contacting parts of the removal unit shown.

[0017] Figure 6 This is a flowchart illustrating the cutting method of the first embodiment.

[0018] Figure 7 It is shown in Figure 6 The side view of the state in which the abutting part abuts against one end of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown.

[0019] Figure 8 It is shown in Figure 6 The side view shows the state in which the contacting part abuts against the center of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown.

[0020] Figure 9 It is shown in Figure 6The side view of the state in which the abutting part abuts against the other end of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown.

[0021] Figure 10 Shown using partial cross-sections Figure 6 A side view of the holding step of the cutting method shown.

[0022] Figure 11 It is Figure 10 The side view of section XI is enlarged and shown in partial cross-section.

[0023] Figure 12 Shown using partial cross-sections Figure 6 A side view of the photographing steps of the cutting method shown.

[0024] Figure 13 Shown using partial cross-sections Figure 6 A side view of the cutting steps of the cutting method shown.

[0025] Figure 14 This is a perspective view showing the contacting components, etc., of the removal unit of the cutting device according to the second embodiment.

[0026] Figure 15 This is a perspective view showing the spray section of the removal unit of the cutting device according to the third embodiment.

[0027] Figure 16 Viewed from below Figure 15 A three-dimensional view of the jet section is shown.

[0028] Label Explanation

[0029] 1: Cutting device; 12: Holding table; 20: Cutting unit; 21: Cutting tool; 24: Cutting water nozzle; 31: X-axis moving unit (moving mechanism); 50: Camera; 60, 60-2, 60-3: Removal unit; 63, 63-2: Abutting part; 67: Spraying part; 123: Transparent part; 124: Holding surface; 200: Workpiece; ST1: Removal step; ST2: Holding step; ST3: Imaging step; ST4: Cutting step. Detailed Implementation

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the structural elements described below include substantially the same structural elements that are readily conceived by those skilled in the art. In addition, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications to the structure can be made without departing from the spirit of the present invention.

[0031] [First Embodiment]

[0032] The cutting apparatus of the first embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing a structural example of the cutting device according to the first embodiment. Figure 2 It is shown Figure 1 A perspective view of the holding unit of the cutting device and the camera shown. Figure 3 yes Figure 1 A perspective view of the removal unit of the cutting device shown. Figure 4 It is shown Figure 3 A perspective view of the contacting parts of the removal unit shown. Figure 5 It is shown Figure 4 The side view of the contacting parts of the removal unit shown.

[0033] The cutting device 1 of the first embodiment is a processing device for cutting (equivalent to processing) the workpiece 200. Figure 1 The workpiece 200 of the cutting device 1 shown is a wafer such as a disc-shaped semiconductor wafer or optical device wafer with a substrate 201 made of silicon, sapphire, gallium arsenide or SiC (silicon carbide). Devices 204 are formed on the front side 202 of the workpiece 200 in a grid-like area divided by multiple spacers 203.

[0034] Device 204 is, for example, an integrated circuit such as IC (Integrated Circuit) or LSI (Large Scale Integration), or an image sensor such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor). In the first embodiment, a metal film 206 is formed on the back side 205 of the front side 202 of the substrate 201 of the workpiece 200. Because the workpiece 200 has a metal film 206 formed on the back side 205, the spacer 203 cannot be detected even when photographed from the back side 205 using an infrared camera.

[0035] In the first embodiment, the front side 202 of the workpiece 200 is adhered to a strip 211 on which an annular frame 210 is mounted on its outer periphery, supported by the annular frame 210, and with the metal film 206 on the back side 205 facing upward. Alternatively, in the first embodiment, the workpiece 200 has a metal film 206 formed on the back side 205 of the substrate 201. However, in this invention, the metal film 206 may not be formed, and the back side 205 may be adhered to the strip 211 with the front side 202 facing upward.

[0036] Figure 1 The cutting device 1 shown is a machining device that uses the holding table 12 of the holding unit 10 to hold the workpiece 200 and uses the cutting tool 21 to cut along the spacer 203 to divide it into individual components 204. Figure 1 As shown, the cutting device 1 includes a holding unit 10, a cutting unit 20, a moving unit 30, an overhead camera 40, and a control unit 100.

[0037] like Figure 2 As shown, the holding unit 10 includes: a housing 11 that moves along an X-axis direction parallel to the horizontal direction via an X-axis moving unit 31 of the moving unit 30; a holding table 12 that is mounted on the housing 11 in such a way that it can rotate about an axis parallel to the Z-axis direction along the vertical direction; and a frame fixing part 13 that has a plurality of parts around the holding surface 124 of the holding table 12.

[0038] In the first embodiment, the housing 11 has: a lower plate 111 that moves along the X-axis direction via an X-axis moving unit 31 and is parallel to the horizontal direction; a side plate 112 that is erected from the outer edge of the lower plate 111; and an upper plate 113 whose outer edge is connected to the upper end of the side plate 112 and is parallel to the lower plate 111.

[0039] The holding table 12 holds the workpiece 200 on the holding surface 124 and is rotatably supported on the upper plate 113 about an axis. The holding table 12 includes: an annular support member 121 rotatably supported on the upper plate 113 about an axis parallel to the Z-axis; an annular frame 122 disposed on the support member 121; and a circular transparent portion 123 embedded inside the frame 122. The holding table 12 is positioned so that the support member 121, the frame 122, and the transparent portion 123 are coaxial with each other.

[0040] The transparent portion 123 is made of transparent components such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride, and its upper surface is a holding surface 124 that holds the workpiece 200. The holding surface 124 has a plurality of suction grooves 125. In the first embodiment, the plurality of suction grooves 125 are formed in concentric circles of different diameters arranged along the outer edge of the holding surface 124. The holding table 12 is located on the holding surface 124, across the side of the front surface 202 where the workpiece 200 is placed, via the strap 211. In the first embodiment, the holding table 12 has a transparent portion 123 made of transparent components throughout the holding surface 124; however, in this invention, a transparent portion 123 made of transparent components may be provided at least in a portion of the holding surface 124.

[0041] The frame fixing part 13 includes: a frame support part 131 disposed on the outer edge of the support member 121, on which an annular frame 210 is mounted on the upper surface; and a vacuum pad 132 that attracts and holds the annular frame 210 mounted on the upper surface of the frame support part 131.

[0042] The suction groove 125 and vacuum pad 132 of the holding table 12 are connected to a vacuum suction source (not shown). The workpiece 200, placed on the holding surface 124, is attracted and held on the holding surface 124 by the vacuum suction source, and the annular frame 210, placed on the upper surface of the frame support portion 131, is attracted and held on the frame fixing portion 13. In the first embodiment, the holding table 12 attracts and holds the front side 202 of the workpiece 200 on the holding surface 124 via the belt 211, and the annular frame 210 is attracted and held on the frame fixing portion 13 via the belt 211. Furthermore, in the first embodiment, the holding unit 10 has a circular through hole 114 on the upper plate 113 of the housing 11. The through hole 114 is positioned coaxially with the support member 121, the frame 122, and the transparent portion 123 of the holding table 12.

[0043] The moving unit 30 includes: an X-axis moving unit 31, which is Figure 2 The machining feed unit shown; Y-axis movement unit 32, which is Figure 1 The indexing feed unit shown; Z-axis movement unit 33, which is Figure 1 The shown cutting-in feed unit; and the rotary movement unit 34, which makes Figure 2 The table 12 shown rotates about an axis parallel to the Z-axis.

[0044] The X-axis moving unit 31 moves the holding table 12 and the cutting unit 20 relative to each other in the X-axis direction by moving the lower plate 111 of the housing 11 of the holding unit 10 along the X-axis direction. The X-axis moving unit 31 moves the holding table 12 within the loading / unloading area 4 where the workpiece 200 is loaded and unloaded onto the holding table 12, and within the machining area 5 where the workpiece 200 is held and cut. The Y-axis moving unit 32 moves the holding table 12 and the cutting unit 20 relative to each other in the Y-axis direction by moving the cutting unit 20 along the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction. The Z-axis moving unit 33 moves the holding table 12 and the cutting unit 20 relative to each other in the Z-axis direction by moving the cutting unit 20 along the Z-axis direction.

[0045] The X-axis moving unit 31, Y-axis moving unit 32, and Z-axis moving unit 33 each have: a known ball screw that is rotatably arranged about an axis; a known electric motor that causes the ball screw to rotate about an axis; and a known guide rail that holds the worktable 12 or cutting unit 20 supported so that it can move freely along the X-axis, Y-axis, or Z-axis.

[0046] The rotary movement unit 34 rotates the holding table 12 about an axis parallel to the Z-axis. The rotary movement unit 34 rotates the holding table 12 about the axis within a range exceeding 180 degrees and less than 360 degrees. The rotary movement unit 34 includes: a motor 341 fixed to a side plate 112 of the housing 11; a pulley 342 connected to the output shaft of the motor 341; and a belt 343 wound around the outer periphery of the support member 121 of the holding table 12 and rotating about the axis via the pulley 342. When the motor 341 is rotated, the rotary movement unit 34 rotates the holding table 12 about the axis via the pulley 342 and the belt 343. Furthermore, in the first embodiment, the rotary movement unit 34 is capable of rotating the holding table 12 by 220 degrees in both one direction about the axis and the opposite direction.

[0047] The cutting unit 20 is a machining unit that uses a cutting tool 21 to cut the workpiece 200 held by the holding table 12. The cutting unit 20 is configured to move freely relative to the workpiece 200 held by the holding table 12 in the Y-axis direction via the Y-axis moving unit 32, and in the Z-axis direction via the Z-axis moving unit 33. The cutting unit 20 is mounted on a support frame 3 that is erected from the main body 2 via the Y-axis moving unit 32 and the Z-axis moving unit 33.

[0048] The cutting unit 20 can position the cutting tool 21 at any position on the holding surface 124 of the holding table 12 via the Y-axis moving unit 32 and the Z-axis moving unit 33. The cutting unit 20 includes: the cutting tool 21; a spindle housing 22, which is configured to move freely along the Y-axis and Z-axis directions via the Y-axis moving unit 32 and the Z-axis moving unit 33; a spindle 23, which is rotatably mounted on the spindle housing 22 about its axis and rotated by a motor, and the cutting tool 21 is mounted on the front end of the spindle 23; and a cutting water nozzle 24.

[0049] The cutting tool 21 is an extremely thin cutting abrasive tool with a generally annular shape, used to cut the workpiece 200 held by the holding table 12. In the first embodiment, the cutting tool 21 is a so-called hub-shaped tool, which has: an annular circular base; and an annular cutting edge disposed on the outer periphery of the circular base and used to cut the workpiece 200. The cutting edge is formed of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. Alternatively, in this invention, the cutting tool 21 may also be a so-called washer tool consisting only of a cutting edge.

[0050] The spindle 23 rotates around its axis via a motor, thereby causing the cutting tool 21 to rotate around its axis. Furthermore, the axes of the cutting tool 21 and the spindle 23 in the cutting unit 20 are parallel to the Y-axis direction. A cutting water nozzle 24 is located at the front end of the spindle housing 22, providing cutting water to the workpiece 200 and the cutting tool 21 during cutting.

[0051] The overhead camera 40 is fixed to the cutting unit 20 in a manner that allows it to move integrally with the cutting unit 20. The overhead camera 40 has an imaging element for capturing images of the workpiece 200 held by the holding table 12 from above. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal-Oxide-Semiconductor) imaging element. The overhead camera 40 captures images of the workpiece 200 held by the holding table 12 and outputs the resulting images to the control unit 100.

[0052] In addition, such as Figure 2 As shown, the cutting device 1 has a camera 50 that takes pictures of the workpiece 200 through a transparent part 123. The camera 50 takes pictures of the workpiece 200 held by the holding table 12 from below the workpiece 200 through the transparent part 123.

[0053] In the first embodiment, the camera 50 is positioned adjacent to the holding unit 10 in the Y-axis direction. Furthermore, the camera 50 is configured to be freely movable in the Y-axis direction via a second Y-axis moving unit 35 provided on the device body 2, and freely movable in the Z-axis direction via a second Z-axis moving unit 38 provided on a standing column 37, which is erected from a moving plate 36 that moves in the Y-axis direction via the second Y-axis moving unit 35. In the first embodiment, the camera 50 is mounted at the other end of a horizontal extension member 39, one end of which is mounted to a lifting member that is freely movable in the Z-axis direction via the second Z-axis moving unit 38.

[0054] The second Y-axis moving unit 35 and the second Z-axis moving unit 38 include: a known ball screw that is rotatably arranged about an axis; a known electric motor that causes the ball screw to rotate about an axis; and a known guide rail that supports the moving plate or camera 50 for free movement along the Y-axis or Z-axis direction.

[0055] The camera 50 has an imaging element that captures images of the workpiece 200 held by the holding stage 12 from below through a transparent portion 123. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal-Oxide-Semiconductor) imaging element. The camera 50 captures images of the workpiece 200 held by the holding stage 12 and outputs the resulting images to the control unit 100.

[0056] In addition, the cutting device 1 includes: an X-axis position detection unit 51 ( Figure 2 As shown, the X-axis position detection unit 51 is used to detect the position of the holding table 12 in the X-axis direction; the Y-axis position detection unit (not shown) is used to detect the position of the cutting unit 20 in the Y-axis direction; and the Z-axis position detection unit is used to detect the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit 51 and the Y-axis position detection unit can be composed of a linear scale and a reading head parallel to the X-axis or Y-axis direction. The Z-axis position detection unit uses pulses from a motor to detect the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit 51, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 12 in the X-axis direction, and the position of the cutting unit 20 in the Y-axis or Z-axis direction to the control unit 100.

[0057] Additionally, the cutting device 1 includes a second Y-axis position detection unit 55 for detecting the position of the camera 50 in the Y-axis direction. Figure 2 (As shown). The second Y-axis position detection unit 55 can be composed of a linear scale parallel to the Y-axis direction and a reading head. The second Y-axis position detection unit 55 outputs the position of the camera 50 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. In addition, the positions of the holding table 12, the cutting unit 20, and the camera in each axis detected by each position detection unit 51, 55 are determined based on a predetermined reference position of the cutting device 1.

[0058] In addition, the cutting device 1 includes: a box lift 91, which holds a box 90 containing multiple workpieces 200 before and after cutting, and moves the box 90 along the Z-axis; a cleaning unit 92, which cleans the workpieces 200 after cutting; and a conveying unit (not shown), which takes out and puts the workpieces 200 relative to the box 90, and conveys the workpieces 200.

[0059] The control unit 100 controls each of the aforementioned structural elements of the cutting device 1, causing the cutting device 1 to perform machining operations on the workpiece 200. Furthermore, the control unit 100 is a computer, comprising: an arithmetic processing unit having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as ROM (read-only memory) or RAM (random access memory); and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to the aforementioned structural elements of the cutting device 1 via the input / output interface.

[0060] Furthermore, the cutting device 1 is connected to a display unit (not shown) and an input unit. The display unit is connected to the control unit 100 and is composed of a liquid crystal display device or the like that that displays the status and images of the machining operation. The input unit is connected to the control unit 100 and is used when the operator registers machining content information. In the first embodiment, the input unit is composed of at least one of an external input device such as a touch panel and a keyboard provided on the display unit.

[0061] Additionally, the cutting device 1 includes: an outer cover (not shown) that covers the upper part of the device body 2, namely the holding unit 10, the cutting unit 20, the cleaning unit 92, and the conveying unit; and a partition wall 6 that divides the space inside the outer cover into a conveying in / out area 4 and a processing area 5. The partition wall 6 is disposed inside the outer cover. The partition wall 6 has a worktable inlet / outlet 7 at its lower end, which allows the holding worktable 12 to pass inward and to move freely within the conveying in / out area 4 and the processing area 5.

[0062] Additionally, the cutting device 1 includes a removal unit 60. The removal unit 60 removes liquid adhering to the transparent portion 123 of the holding table 12. For example... Figure 3 , Figure 4 as well as Figure 5As shown, the removal unit 60 has a unit body 61. The unit body 61 has: a flat plate portion 611, which is fixed to the partition wall 6 in a state of closing the upper end of the workbench inlet 7; and a box-shaped portion 612, which is mounted on the flat plate portion 611 and has an opening at the bottom. In addition, in the first embodiment, a rubber sheet 613 for preventing cutting water from entering is installed at the lower end of the box-shaped portion 612 of the unit body 61.

[0063] In addition, such as Figure 4 and Figure 5 As shown, the removal unit 60 includes a lifting mechanism 62 and an abutting member 63. The abutting member 63 is housed within a box-shaped portion 612 and supported on the underside of a support plate 64 that is movably disposed within the box-shaped portion 612 along the Z-axis direction. The abutting member 63 is made of a porous synthetic resin (i.e., sponge) with numerous tiny pores inside, and in this embodiment, it is formed into a cylindrical shape. The abutting member 63 is supported by the support plate 64 and is rotatable about an axis parallel to the Y-axis direction. The total length of the abutting member 63 is longer than the outer diameter of the transparent portion 123.

[0064] The lifting mechanism 62 causes the abutment member 63 to move up and down along the Z-axis. In the first embodiment, the lifting mechanism 62 is a so-called cylinder having a cylinder body 621 and a telescopic rod 622. The cylinder body 621 is fixed to the unit body 61, and the telescopic rod 622 is freely extendable from the cylinder 621 and its front end is mounted on the support plate 64. When the lifting mechanism 62 extends the telescopic rod 622, as... Figure 5 As shown by the dashed line, the abutting member 63 is positioned to abut against the retaining surface 124 of the transparent portion 123 of the retaining worktable 12 within the worktable inlet / outlet 7. When the telescopic rod 622 is shortened, as... Figure 5 As shown by the solid line, the abutting member 63 is located above the holding surface 124 of the transparent portion 123 of the holding table 12 within the workbench entrance 7, and is positioned in a retracted position that retracts from the holding surface 124. Thus, in the first embodiment, the abutting member 63 is positioned in both the abutting position and the retracted position.

[0065] Additionally, the removal unit 60 has an X-axis moving unit 31 of the moving unit 30. The X-axis moving unit 31 is a moving mechanism that moves the holding table 12 along the X-axis direction, causing the abutting member 63, which is positioned at the abutting position and abuts against the holding surface 124 of the transparent part 123, to move relative to the transparent part 123.

[0066] Next, the cutting method of the first embodiment will be described with reference to the accompanying drawings. Figure 6This is a flowchart illustrating the cutting method of the first embodiment. The cutting method of the first embodiment is a method of cutting a workpiece 200 using the cutting device 1 described above, and is also the processing operation of the cutting device 1. First, the operator registers the processing content information in the control unit 100, and places the box 90 containing multiple workpieces 200 before cutting in the box lift 91. Then, when the control unit 100 receives a start instruction from the operator for the processing operation, the cutting device 1 begins the cutting method of the first embodiment. Figure 6 As shown, the cutting method of the first embodiment includes a removal step ST1, a holding step ST2, a shooting step ST3, and a cutting step ST4.

[0067] (Removal Steps)

[0068] Figure 7 It is shown in Figure 6 The side view of the state in which the abutting part abuts against one end of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown. Figure 8 It is shown in Figure 6 The side view shows the state in which the contacting part abuts against the center of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown. Figure 9 It is shown in Figure 6 The side view of the state in which the abutting part abuts against the other end of the holding surface of the holding table in the X-axis direction during the removal step of the cutting method shown.

[0069] Step ST1 is a step in which liquid is removed from the holding surface 124 of the transparent portion 123 of the holding table 12 using the removal unit 60. In the first embodiment, in step ST1, after the control unit 100 of the cutting device 1 controls the X-axis movement unit 31 to position the holding table 12 in the loading / unloading area 4, the lifting mechanism 62 is controlled to lower the abutting member 63 and position it in the abutting position. In step ST1, the control unit 100 of the cutting device 1 controls the X-axis movement unit 31 to move the holding table 12 toward the processing area 5. Thus, as Figure 7 , Figure 8 as well as Figure 9 As shown, the abutting member 63 abuts against one end, the central part and the other end of the holding table 12 in the X-axis direction in sequence, and the abutting member 63 rolls on the holding surface 124 together with the movement of the holding table 12, thereby removing the liquid adhering to the holding surface 124.

[0070] In the first embodiment, in the removal step ST1, after the control unit 100 of the cutting device 1 moves the holding table 12 from the loading / unloading area 4 toward the processing area 5, the lifting mechanism 62 is controlled to raise the abutting member 63 and position it in the retracted position, and the X-axis movement unit 31 is controlled to move the holding table 12 to the loading / unloading area 4, and then the process proceeds to the holding step ST2. Alternatively, in this invention, in the removal step ST1, after the control unit 100 of the cutting device 1, with the abutting member 63 positioned in the abutting position, controls the X-axis movement unit 31 to move the holding table 12 between the loading / unloading area and the processing area a predetermined number of times, the abutting member 63 is positioned in the retracted position, and after the holding table 12 is moved to the loading / unloading area 4, the process proceeds to the holding step ST2.

[0071] (Keep the steps)

[0072] Figure 10 Shown using partial cross-sections Figure 6 A side view of the holding step of the cutting method shown. Figure 11 It is Figure 10 The side view of section XI is enlarged and shown in partial cross-section.

[0073] The holding step ST2 is a step in which the workpiece 200 is held using the holding table 12 after the removal step ST1. In the holding step ST2, the control unit 100 of the cutting device 1 controls the conveying unit to remove a workpiece 200 from the cassette 90 and place it on the holding surface 124 of the holding table 12, which is positioned in the conveying-in / conveying area 4. In the holding step ST2, the control unit 100 of the cutting device 1 controls the vacuum suction source, such as... Figure 10 and Figure 11 As shown, the workpiece 200 is attracted and held on the holding surface 124 with the belt 211 in between, and the annular frame 210 is attracted and held on the frame support portion 131 with the belt 211 in between, and then the shooting step ST3 is entered.

[0074] (Filming steps)

[0075] Figure 12 Shown using partial cross-sections Figure 6 The side view of the photographing steps of the cutting method shown. The photographing step ST3 is the step of photographing the workpiece 200 through the transparent part 123 using the photographing camera 50 after the holding step ST2 is performed.

[0076] In the first embodiment, during the shooting step ST3, the control unit 100 of the cutting device 1 controls the X-axis moving unit 31 and the second Y-axis moving unit 35, such as... Figure 12As shown, the camera 50 is positioned below the holding table 12. In the imaging step ST3, the control unit 100 of the cutting device 1 uses the camera 50 to capture images of a predetermined part of the workpiece 200 from below through the transparent part 123, obtaining images for alignment of the workpiece 200 and the cutting tool 21. In the imaging step ST3, the control unit 100 of the cutting device 1 performs alignment based on the images acquired by the camera 50, and proceeds to the cutting step ST4.

[0077] (Cutting steps)

[0078] Figure 13 Shown using partial cross-sections Figure 6 The side view of the cutting steps of the cutting method shown. Cutting step ST4 is the step of cutting the workpiece 200 held by the holding table 12 using the cutting tool 21. In cutting step ST4, the control unit 100 of the cutting device 1 controls the X-axis moving unit 31 to move the holding table 12 to the machining area 5. The control unit 100 controls the moving unit 30 and the cutting unit 20 to move the cutting tool 21 of the holding table 12 and the cutting unit 20 relative to each other along the spacer 203. Cutting water is supplied from the cutting water nozzle 24, and the cutting tool 21 cuts into the spacer 203 until it reaches the belt 211 to form a cutting groove.

[0079] In cutting step ST4, when the cutting unit 20 of the cutting device 1 cuts all the spacers 203 of the workpiece 200 held by the holding table 12 to form cutting grooves, the control unit 100 controls the X-axis movement unit 31 to move the holding table 12 to the loading / unloading area 4, controls the conveying unit to convey the workpiece 200 to the cleaning unit 92, and after being cleaned by the cleaning unit 92, it is stored in the box 90, thereby ending the cutting method of the first embodiment. The cutting device 1 repeats this process. Figure 6 The cutting method shown continues until all workpieces 200 within the box 90 are cut.

[0080] The cutting apparatus 1 of the first embodiment described above includes a removal unit 60 for removing liquid adhering to the transparent portion 123 of the holding table 12, thus enabling the removal of liquid from the holding table 12 before holding the workpiece 200. As a result, the cutting apparatus 1 has the effect of reducing the possibility of water droplets being reflected in the image of the workpiece 200 obtained by photographing it through the transparent portion 123, thereby suppressing the deterioration of the detection state of the workpiece 200 photographed through the transparent portion 123.

[0081] In addition, the cutting device 1 includes: an abutting member 63, which positions the removal unit 60 in an abutting position and a retracting position; and an X-axis moving unit 31, which is a moving mechanism that moves the abutting member 63 relative to the transparent portion 123. Therefore, the abutting member 63, which is in the abutting position against the transparent portion 123, can be moved on the transparent portion 123 by the X-axis moving unit 31, thereby removing liquid from the transparent portion 123.

[0082] The cutting method of the first embodiment is a method of cutting the workpiece 200 using the cutting device 1 described above. After the liquid removal step ST1 on the transparent part 123 is removed, the holding step ST2 and the imaging step ST3 are performed. Therefore, the following effect is achieved: the possibility of water droplets being reflected in the image of the workpiece 200 obtained by imaging the workpiece 200 through the transparent part 123 is reduced, thereby suppressing the deterioration of the detection state of the workpiece 200.

[0083] [Second Implementation]

[0084] The cutting device of the second embodiment of the present invention will be described with reference to the accompanying drawings. Figure 14 This is a perspective view showing the contacting components, etc., of the removal unit of the cutting apparatus according to the second embodiment. Figure 14 In this document, parts that are the same as those in the first embodiment are marked with the same reference numerals and their descriptions are omitted.

[0085] like Figure 14 As shown, in the second embodiment, the abutting member 63-2 of the removal unit 60-2 of the cutting device 1 is a plate-shaped scraper made of synthetic resin such as rubber. Except that the upper end of the abutting member 63-2 is supported by the support plate 64-2, it is the same as in the first embodiment. The abutting member 63-2 in the second embodiment is formed as a rectangle whose total length is longer than the outer diameter of the transparent portion 123. The length direction of the abutting member 63-2 is parallel to the Y-axis direction, one end in the width direction is supported by the support plate 64-2, and the other end abuts against the transparent portion 123 of the holding worktable 12, thereby removing liquid from the transparent portion 123.

[0086] The cutting apparatus 1 of the second embodiment includes a removal unit 60-2 for removing liquid adhering to the transparent portion 123 of the holding table 12, thus enabling the removal of liquid from the holding table 12 before holding the workpiece 200. As a result, similar to the first embodiment, the cutting apparatus 1 has the effect of reducing the possibility of water droplets being reflected in the image of the workpiece 200 obtained by photographing it through the transparent portion 123, thereby suppressing the deterioration of the detection state of the workpiece 200 photographed through the transparent portion 123.

[0087] [Third Implementation]

[0088] The cutting apparatus of the third embodiment of the present invention will be described with reference to the accompanying drawings. Figure 15 This is a perspective view showing the spray section of the removal unit of the cutting device according to the third embodiment. Figure 16 Viewed from below Figure 15 A three-dimensional view of the jet section is shown.

[0089] The cutting device 1 of the third embodiment, except that the removal unit 60-3 does not have a lifting mechanism 62, and instead of a contacting member 63, has... Figure 15 and Figure 16 Except for the fact that the jet section 67 and the X-axis moving unit 31 move the jet section 67 relative to the transparent section 123, the process is the same as in the first embodiment. The jet section 67 jets pressurized air toward the transparent section 123.

[0090] In the third embodiment, the ejection section 67 of the removal unit 60-3 is formed into a quadrangular prism shape, with its total length longer than the outer diameter of the transparent section 123. The ejection section 67 is housed within a box-shaped portion 612 of the unit body 61 and is arranged parallel to the Y-axis direction. Pressurized air is supplied to the ejection section 67 by an air supply source (not shown), such as... Figure 16 As shown, a plurality of air jet ports 68 for injecting pressurized air are provided on the lower surface 69 opposite to the holding table 12. In the first embodiment, the air jet ports 68 are arranged at intervals along the length of the injection section 67.

[0091] The cutting apparatus 1 of the third embodiment includes a removal unit 60-3 for removing liquid adhering to the transparent portion 123 of the holding table 12, thus enabling the removal of liquid from the holding table 12 before holding the workpiece 200. As a result, similar to the first embodiment, the cutting apparatus 1 has the effect of reducing the possibility of water droplets being reflected in the image of the workpiece 200 obtained by photographing it through the transparent portion 123, thereby suppressing the deterioration of the detection state of the workpiece 200 photographed through the transparent portion 123.

[0092] Furthermore, in the cutting device 1 of the third embodiment, since the removal unit 60-3 has a jetting part 67 that sprays pressurized air toward the transparent part 123, the liquid adhering to the transparent part 123 can be removed without the removal unit 60-3 coming into contact with the transparent part 123 of the holding table 12.

[0093] Furthermore, the present invention is not limited to the embodiments described above. That is, it can be implemented in various modifications without departing from the spirit of the present invention. In addition, in the above embodiments, the imaging step ST3 is performed for alignment, but in the present invention, it is not limited to alignment. For example, it may be performed during cut inspection by using a camera 50 to photograph the workpiece 200 from below through the transparent portion 123. The cut inspection determines whether the offset of the cutting groove formed on the workpiece 200 relative to the desired position and the size of the chipping at both edges of the cutting groove are within a specified range.

Claims

1. A cutting apparatus, wherein the cutting apparatus has: a holding table that holds a workpiece, at least a part of a holding surface of which has a transparent portion composed of a transparent member; a cutting unit that includes a cutting tool that cuts the workpiece held by the holding table and a cutting water nozzle that supplies cutting water in the cutting of the workpiece by the cutting tool; a photographing camera that photographs the workpiece from below the holding table through the transparent portion; and a removal unit that removes liquid adhering to the transparent portion to reduce the possibility of liquid being reflected in an image of the workpiece taken by the photographing camera from below the holding table through the transparent portion.

2. The cutting apparatus according to claim 1, wherein the removal unit includes: an abutting member that is positioned at an abutting position at which the abutting member abuts against the transparent portion and a retracted position; and a moving mechanism that relatively moves the abutting member abutting against the transparent portion on the transparent portion.

3. The cutting apparatus according to claim 1, wherein the removal unit includes: an air jet portion that jets air toward the transparent portion; and a moving mechanism that moves the air jet portion on the transparent portion.

4. A cutting method of processing a workpiece with a cutting apparatus, the cutting apparatus has: a holding table that holds the workpiece, at least a part of a holding surface of which has a transparent portion composed of a transparent member; a cutting unit that includes a cutting tool that cuts the workpiece held by the holding table and a cutting water nozzle that supplies cutting water in the cutting of the workpiece by the cutting tool; a photographing camera that photographs the workpiece from below the holding table through the transparent portion; and a removal unit that removes liquid adhering to the transparent member to reduce the possibility of liquid being reflected in an image of the workpiece taken by the photographing camera from below the holding table through the transparent portion, wherein the cutting method has steps of: a removal step of removing liquid on the transparent portion with the removal unit; a holding step of holding the workpiece with the holding table after the removal step is performed; a photographing step of photographing the workpiece through the transparent portion with the photographing camera after the holding step is performed; and a cutting step of cutting the workpiece held by the holding table with the cutting tool. ​

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