Height-adjustable wafer support and method for adjusting the height of a wafer

Abstract

A height-adjustable semiconductor wafer support is provided. The height-adjustable semiconductor wafer support includes a suction cup, an adjustment mechanism, and a pedestal. The suction cup is used to support a semiconductor wafer. The adjustment mechanism has a top surface for supporting the suction cup. The pedestal is coupled to the adjustment mechanism so that movement of the top surface of the adjustment mechanism relative to the pedestal changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

Description

Technical Field

[0001] An embodiment of the present invention relates to a height-adjustable semiconductor wafer support. Background Art

[0002] During semiconductor fabrication, semiconductor wafers are supported on one or more supports while undergoing one or more processes (eg, fabrication and / or inspection). Summary of the invention

[0003] The present invention is directed to a semiconductor wafer support, which can adjust the height of the semiconductor wafer.

[0004] According to an embodiment of the present invention, a semiconductor wafer support comprises a suction cup, an adjustment mechanism and a pedestal. The suction cup is used to support a semiconductor wafer. The adjustment mechanism has a top surface for supporting the suction cup. The pedestal is coupled to the adjustment mechanism so that the movement of the top surface of the adjustment mechanism relative to the pedestal changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

[0005] According to an embodiment of the present invention, a height-adjustable semiconductor wafer support comprises a suction cup, an adjustment mechanism, and a pedestal. The suction cup is used to support a semiconductor wafer. The adjustment mechanism has a top surface for supporting the suction cup. The pedestal is coupled to the adjustment mechanism so that the movement of the top surface of the adjustment mechanism relative to the pedestal achieved by the motor of the adjustment mechanism changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

[0006] According to an embodiment of the present invention, a method for adjusting the height of a semiconductor wafer includes: placing a suction cup for supporting the semiconductor wafer on the top surface of an adjustment mechanism supporting the suction cup; and starting the adjustment mechanism to change the distance between the top surface of the adjustment mechanism and the top surface of a base supporting the adjustment mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The aspects of the present disclosure will be best understood by reading the following detailed description in conjunction with the accompanying drawings. Note that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0008] Figure 1 A side view of a height adjustable semiconductor wafer support is shown in accordance with some embodiments.

[0009] Figure 2 A top view of a height adjustable semiconductor wafer support is shown in accordance with some embodiments.

[0010] Figure 3A top view of a height adjustable semiconductor wafer support is shown in accordance with some embodiments.

[0011] Figure 4 A perspective view showing a wheel and shaft of a height adjustable semiconductor wafer support according to some embodiments.

[0012] Figure 5 A perspective view showing a wheel and shaft of a height adjustable semiconductor wafer support according to some embodiments.

[0013] Figure 6 A perspective view showing the wheels, shafts, and stage of a height adjustable semiconductor wafer support according to some embodiments.

[0014] Figure 7 A perspective view showing a wheel of a height adjustable semiconductor wafer support according to some embodiments.

[0015] Figure 8 A perspective view showing a wheel of a height adjustable semiconductor wafer support according to some embodiments.

[0016] Fig. 9 A perspective view showing a shaft of a height adjustable semiconductor wafer support according to some embodiments.

[0017] Fig.10 A perspective view of a wheel and a top view of a stage are shown for a height adjustable semiconductor wafer support according to some embodiments.

[0018] Fig.11 Perspective views showing three different states of a height adjustment mechanism according to some embodiments.

[0019] Fig.12 A top view of a height adjustable semiconductor wafer support is shown in accordance with some embodiments.

[0020] Fig.13A A perspective view of a semiconductor device is shown with which a height adjustable semiconductor wafer support is used, according to some embodiments.

[0021] Fig. 13B A cross-sectional view of a semiconductor device is shown with which a height adjustable semiconductor wafer support is used, according to some embodiments.

[0022] Fig.14 Exemplary computer-readable media including processor-executable instructions configured to implement one or more of the clauses described herein are shown in accordance with some embodiments.

[0023] Fig.15An exemplary computing environment is shown in which one or more of the clauses described herein are implemented according to some embodiments.

[0024] [Explanation of Symbols]

[0025] 100: Height-adjustable semiconductor wafer support

[0026] 102: Semiconductor manufacturing equipment

[0027] 104: Semiconductor wafer

[0028] 105: Controller

[0029] 108: Suction Cup

[0030] 109: End wall

[0031] 110: Adjustment mechanism

[0032] 111, 113, 117, 614, 1352c: top surface

[0033] 112: Pedestal

[0034] 114, 115, 116: Distance

[0035] 118: Thickness

[0036] 119, 616: bottom surface

[0037] 120, 706: Depression

[0038] 202: Groove

[0039] 402: Driver component

[0040] 403: Electric Motor

[0041] 404: With

[0042] 406: Wheel

[0043] 408: Axis

[0044] 410: Tensioner

[0045] 412: Slot

[0046] 414: Steering gear

[0047] 502, 922: Second protrusion

[0048] 602, 920: first protrusion

[0049] 604, 910: First groove

[0050] 606: Inner wall

[0051] 704, 912: Second groove

[0052] 802: Upper flange

[0053] 804: Lower flange

[0054] 902: Docking part

[0055] 904: Vertical wheel stop

[0056] 906: Part 1

[0057] 908: Part 2

[0058] 1202: Controller

[0059] 1204: ID reader

[0060] 1206: ID

[0061] 1300: Semiconductor devices

[0062] 1302, G: Gate region

[0063] 1304, S: Source region

[0064] 1306, D: Drain region

[0065] 1308: Fin height

[0066] 1310: Fin width

[0067] 1312: Fin length

[0068] 1314: FinFET devices

[0069] 1316: Line

[0070] 1318: Dielectric layer

[0071] 1352: Channel area

[0072] 1352a: First vertical surface

[0073] 1352b: Second vertical surface

[0074] 1400: Implementation Plan

[0075] 1402: Methods

[0076] 1404: Processor can execute computer instructions

[0077] 1406: Computer readable data

[0078] 1408: Computer readable media

[0079] 1500: System

[0080] 1512, 1530: Computing devices

[0081] 1514: Dashed Line

[0082] 1516: Processing Unit

[0083] 1518: Memory

[0084] 1520: Storage

[0085] 1522: Output device

[0086] 1524: Input Device

[0087] 1526: Communication connection department

[0088] 1528: Network DETAILED DESCRIPTION

[0089] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature on or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may reuse reference numbers and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself represent the relationship between the various embodiments and / or configurations discussed.

[0090] Additionally, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature illustrated in a figure to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0091] According to some embodiments, a height-adjustable semiconductor wafer support is provided. According to some embodiments, the height-adjustable semiconductor wafer support allows for adjusting the height of the semiconductor wafer, for example, relative to the height of an underlying pedestal. In some embodiments, the height-adjustable semiconductor wafer support includes a suction cup, an adjustment mechanism, and a pedestal. The suction cup is used to support the semiconductor wafer. The adjustment mechanism has a top surface for supporting the suction cup. The pedestal is coupled to the adjustment mechanism so that movement of the top surface of the adjustment mechanism relative to the pedestal changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal. According to some embodiments, considering that the semiconductor wafer is supported by the suction cup and the suction cup is supported on the top surface of the adjustment mechanism, the distance between the semiconductor wafer and the pedestal changes as the distance between the top surface of the adjustment mechanism and the top surface of the pedestal changes.

[0092] In some embodiments, the height adjustable semiconductor wafer support allows the use of a single semiconductor wafer support to process semiconductor wafers of different sizes having different dimensions (e.g., thickness, diameter, circumference, etc.), rather than requiring different semiconductor wafer supports (e.g., requiring a different support for each semiconductor wafer of different size). In some embodiments, the height adjustable semiconductor wafer support allows the use of the same semiconductor fabrication equipment to process semiconductor wafers of different sizes having different dimensions (e.g., thickness, diameter, circumference, etc.), rather than requiring different semiconductor fabrication equipment (e.g., requiring a corresponding fabrication equipment for each semiconductor wafer of different size). In some embodiments, a first semiconductor wafer of a first size is moved by the height adjustable semiconductor wafer support so as to be a first distance from a first piece of fabrication equipment (e.g., an inspection tool), and a second semiconductor wafer of a second size is moved by the height adjustable semiconductor wafer support so as to be a second distance (e.g., less than the first distance) from the first piece of fabrication equipment. According to some embodiments, being able to place semiconductor wafers of different sizes at different distances from a fabrication equipment enables the same fabrication equipment to be used for each of the different semiconductor wafers. According to some embodiments, semiconductor fabrication equipment (e.g., semiconductor wafer supports, fabrication tools, inspection tools, etc.) is generally quite expensive, and thus being able to reduce the amount of semiconductor fabrication equipment required (e.g., to process semiconductor wafers of different sizes) can result in significant savings. In some embodiments, being able to use the same semiconductor fabrication equipment to process semiconductor wafers of different sizes allows savings to be achieved by reducing (e.g., reducing to zero) at least one of the time or labor that would otherwise be required to change at least some of the semiconductor fabrication equipment to process semiconductor wafers of different sizes.

[0093] Figure 1A side view of a height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. In some embodiments, the height adjustable semiconductor wafer support 100 includes a suction cup 108 for supporting a semiconductor wafer 104, an adjustment mechanism 110, and a pedestal 112. According to some embodiments, the adjustment mechanism 110 includes a motor 403, at least one wheel 406, at least one shaft 408, and a belt 404, and thus the adjustment mechanism 110 is shown in phantom to encompass these items. Although three wheels 406 and three shafts 408 are shown, in some embodiments, different numbers of wheels 406 and shafts 408 are contemplated. According to some embodiments, the wheels 406 and shafts 408 are spaced any desired distance from each other, which may or may not be equidistant. According to some embodiments, the adjustment mechanism 110 is coupled to the stage 112 so that the movement of the top surface 111 of the adjustment mechanism 110 relative to the stage 112 can change the distance 114 between the top surface 111 of the adjustment mechanism 110 and the top surface 113 of the stage 112. According to some embodiments, considering that the semiconductor wafer 104 is supported by the suction cup 108 and the suction cup 108 is supported on the top surface 111 of the adjustment mechanism 110, the distance 115 between the semiconductor wafer 104 and the stage 112 changes as the distance 114 between the top surface 111 of the adjustment mechanism 110 and the top surface 113 of the stage 112 changes. According to some embodiments, the corresponding top surface of the one or more shafts 408 corresponds to the top surface 111 of the adjustment mechanism 110. According to some embodiments, as further discussed below and shown in other figures, the belt 404 is coupled to the wheel 406 and the motor 403, and the wheel 406 is respectively coupled to the shaft 408. In some embodiments, the motor 403 moves the belt 404, wherein the movement of the belt rotates the wheel, which causes the shaft to move in a vertical direction to change the distance 114 between the top surface 111 of the adjustment mechanism 110 and the top surface 113 of the pedestal 112. In some embodiments, for example when the distance 114 is to be reduced, one or more recesses 706 are formed in the pedestal 112 to accommodate or receive the corresponding shaft 408. In some embodiments, the motor 403 is received in a recess in the pedestal 112. In some embodiments, one or more of the wheels 406 are received in a corresponding recess in the pedestal 112. In some embodiments, the belt 404 is received in a recess in the pedestal 112.

[0094] According to some embodiments, the pedestal 112 is substantially fixed relative to one or more pieces of semiconductor fabrication equipment 102 (e.g., metrology equipment, scanning equipment, inspection tools, processing tools, etc.). According to some embodiments, a change in the distance 115 between the semiconductor wafer 104 and the pedestal 112 changes the distance 116 between the top surface 117 of the semiconductor wafer 104 and the bottom surface 119 of the semiconductor fabrication equipment 102, given the fixed relationship between the pedestal 112 and the semiconductor fabrication equipment 102. According to some embodiments, even though the thickness 118 may vary from one semiconductor wafer 104 to another semiconductor wafer 104, the ability to adjust the distance 115 between the semiconductor wafer 104 and the pedestal 112 allows the distance 116 between the top surface 117 of the semiconductor wafer 104 and the bottom surface 119 of the semiconductor fabrication equipment 102 to be maintained or otherwise adjusted as necessary to obtain desired results from the semiconductor fabrication equipment 102, even though the thickness 118 may vary from one semiconductor wafer 104 to another semiconductor wafer 104.

[0095] In some embodiments, the height adjustable semiconductor wafer support 100 includes a controller 105, such as a computer, a processor, a memory, an application specific integrated circuit (ASIC), etc. In some embodiments, the controller 105 is coupled to at least one of the motor 403 or the semiconductor fabrication equipment 102 to, for example, control the distance 116 to achieve a desired result. According to some embodiments, the semiconductor fabrication equipment 102 represents one or more items for semiconductor fabrication, testing, metrology, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of optical metrology, electron beam metrology, spectral metrology, image processing, imaging inspection, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of patterned wafer inspection, unpatterned wafer inspection, reticle inspection, photomask inspection, film analysis, surface measurement yield analysis, defect classification, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of contamination detection, particle detection, particle count, particle classification, particle characterization, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of pattern defect detection, surface anomaly detection, electrical fault detection, physical fault detection, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of measurements regarding lithography efficiency, etching efficiency, deposition efficiency, chemical mechanical planarization efficiency, etc. According to some embodiments, the semiconductor fabrication equipment 102 facilitates one or more of measurements regarding alignment between layers, high-aspect-ratio features, contact hole profiles, process tool performance, feature / component size, etc. According to some embodiments, the controller 105 controls the operation of at least one of the semiconductor fabrication equipment 102 or the motor 403 to achieve a desired result, such as by adjusting the distance 116, so as to obtain one or more desired measurements. According to some embodiments, the controller 105 performs at least one of the following: generates or implements instructions that facilitate a desired semiconductor fabrication process (e.g., deposition, chemical mechanical planarization, etching, etc.).

[0096] According to some embodiments, the suction cup 108 defines one or more recesses 120 that facilitate at least one of placing the semiconductor wafer 104 onto the suction cup 108 or removing the semiconductor wafer 104 from the suction cup 108. According to some embodiments, the one or more recesses 120 are configured to receive fingers, such as those on a forklift, a robotic arm, etc., that carry the semiconductor wafer 104, for example, to perform at least one of placing the semiconductor wafer 104 onto the suction cup 108 or removing the semiconductor wafer 104 from the suction cup 108.

[0097] Figure 2 A top view of a height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. According to some embodiments, the suction cup 108 is generally circular, for example, for supporting a generally circular semiconductor wafer (not shown). According to some embodiments, at least some of the one or more recesses 120 are defined within a portion but not the entire suction cup 108 so as not to extend completely across the suction cup 108. In some embodiments, at least some of the one or more recesses 120 are rectangular or other shapes to accommodate one or more correspondingly shaped fingers (not shown). According to some embodiments, an end wall 109 defines a terminal end or end of the recess. According to some embodiments, the fingers stop advancing when encountering the end wall 109, thereby allowing the semiconductor wafer to be placed centrally on the suction cup 108 or otherwise as desired on the suction cup 108. According to some embodiments, the suction cup 108 defines one or more grooves 202. According to some embodiments, at least some of the one or more grooves 202 are circular. According to some embodiments, at least some of the one or more grooves 202 are concentrically arranged with respect to another groove.

[0098] Figure 3A top view of a height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. In accordance with some embodiments, at least some portion of the adjustment mechanism 110 is located on, in, supported by, integrally formed with, or the like, a pedestal 112. In accordance with some embodiments, the adjustment mechanism 110 includes a drive member 402 (e.g., a gear) coupled to a motor 403 for driving (e.g., rotating) the drive member 402. In some embodiments, the position of the motor 403 relative to the motor 403 may be different than shown (e.g., different from a concentric configuration). In accordance with some embodiments, at least some portion of the motor 403 is located on a top surface 113 of the pedestal 112. In accordance with some embodiments, at least some portion of the motor 403 is located below the top surface 113 of the pedestal 112, e.g., within a recess defined within the pedestal 112. In accordance with some embodiments, the drive member 402 includes a shaft, and the motor 403 rotates the shaft to, for example, rotate other aspects of the drive member 402. According to some embodiments, the motor 403 includes an abutment portion (e.g., teeth) that abuts or otherwise cooperates with a corresponding abutment portion (e.g., teeth) on the drive member 402 to drive the drive member 402. According to some embodiments, at least some portion of the drive member 402 is located on the top surface 113 of the pedestal 112. According to some embodiments, at least some portion of the drive member 402 is located below the top surface 113 of the pedestal 112, such as within a recess defined within the pedestal 112.

[0099] According to some embodiments, the adjustment mechanism 110 includes a belt 404. According to some embodiments, the motor 403 moves the belt 404 in at least one of a first direction (e.g., clockwise) or a second direction (e.g., counterclockwise) via the drive member 402. According to some embodiments, the drive member 402 includes an abutment portion (e.g., teeth) that abuts or otherwise cooperates with a corresponding abutment portion (e.g., slit, grit, etc.) on the belt 404 to move the belt 404. According to some embodiments, the belt 404 does not have an abutment member, so that the drive member 402 cooperates with the surface of the belt 404.

[0100] According to some embodiments, the adjustment mechanism 110 includes one or more wheels 406. According to some embodiments, at least some of the one or more wheels 406 are located on the top surface 113 of the stand 112. According to some embodiments, at least some of the one or more wheels 406 are located below the top surface 113 of the stand 112, such as within a recess defined within the stand 112. According to some embodiments, movement of the belt 404 in a first direction causes the one or more wheels 406 to rotate in a first rotational direction. According to some embodiments, movement of the belt 404 in a second direction causes the one or more wheels 406 to rotate in a second rotational direction. According to some embodiments, at least some of the one or more wheels 406 include an abutment portion (e.g., teeth) that abuts or otherwise cooperates with a corresponding abutment portion (e.g., a slit, a nib, etc.) on the belt 404 to be rotated by the belt 404. According to some embodiments, the belt 404 does not have an abutment member such that a surface of the belt 404 cooperates with the one or more wheels 406.

[0101] According to some embodiments, the adjustment mechanism 110 includes one or more shafts 408. According to some embodiments, at least some of the one or more shafts 408 are located on the top surface 113 of the stand 112. According to some embodiments, at least some of the one or more shafts 408 are located below the top surface 113 of the stand 112, such as within a recess defined within the stand 112. According to some embodiments, the top surface of at least one of the one or more shafts 408 defines a top surface 111 of the adjustment mechanism 110. According to some embodiments, rotation of the wheel 406 in the first rotational direction moves the shaft 408 in the first vertical direction to change the distance 114 ( Figure 1 ), wherein the first vertical direction corresponds to the longitudinal axis of shaft 408. According to some embodiments, rotation of wheel 406 in the second rotational direction moves shaft 408 in a second vertical direction opposite to the first vertical direction to change a distance 114 ( Figure 1 According to some embodiments, at least some of the one or more shafts 408 include a docking portion (e.g., a tab, a groove, etc.) that docks or otherwise cooperates with a corresponding docking portion (e.g., a tab, a groove, etc.) on the wheel 406.

[0102] According to some embodiments, the adjustment mechanism 110 includes a tensioner 410 coupled to the belt 404 to adjust the tension in the belt. According to some embodiments, the tensioner 410 travels within the slot 412 to apply more or less tension on the belt 404, and when the desired amount of tension on the belt 404 is reached, the tensioner 410 locks in position in the slot. According to some embodiments, at least some portion of the tensioner 410 is located on the top surface 113 of the pedestal 112. According to some embodiments, at least some portion of the tensioner 410 is located below the top surface 113 of the pedestal 112, such as within a recess defined within the pedestal 112. In some embodiments, the adjustment mechanism 110 includes a diverter 414 to position the belt 404 at a desired position relative to the pedestal 112, such as away from one or more fingers carrying semiconductor wafers. According to some embodiments, at least some portion of diverter 414 is located on top surface 113 of pedestal 112. According to some embodiments, at least some portion of diverter 414 is located below top surface 113 of pedestal 112, such as within a recess defined within pedestal 112.

[0103] Figure 4 A perspective view of a wheel 406 and shaft 408 of a height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. In accordance with some embodiments, the wheel 406 surrounds or is concentric with the shaft 408. In accordance with some embodiments, the shaft 408 is longer than the wheel 406 and moves up and down in a vertical direction relative to the wheel 406, wherein the vertical direction corresponds to the longitudinal axis of the shaft, and the movement of the shaft 408 is responsive to the rotation of the wheel 406. In accordance with some embodiments, the wheel 406 is oriented relative to the top surface 113 ( Figure 1 ) but has little or no vertical movement relative to the top surface 113 of the pedestal 112. According to some embodiments, considering that shaft 408 moves in a vertical direction relative to wheel 406, but wheel 406 does not move in a vertical direction relative to the top surface 113 of the pedestal 112, shaft 408 moves in a vertical direction relative to the top surface 113 of the pedestal 112 in response to the rotation of wheel 406. Considering that the end of shaft 408 corresponds to the top surface 111 of the adjustment mechanism 110, the vertical movement of shaft 408 changes the distance 114 ( Figure 1 ).

[0104] According to some embodiments, to facilitate such vertical movement of shaft 408, shaft 408 has a first shaft interface portion for interface with the first wheel interface portion of wheel 406. According to some embodiments, when wheel 406 rotates, the cooperation between the first shaft interface portion and the first wheel interface portion causes vertical movement of shaft 408. According to some embodiments, the first shaft interface portion includes a first protrusion 602 protruding from shaft 408. According to some embodiments, shaft 408 has a first shaft interface portion for interface with seat 112 ( Figure 1 ) is a second shaft interface portion that interfaces with the second pedestal interface portion of the shaft 408. According to some embodiments, when the shaft moves vertically when the wheel 406 rotates, the cooperation between the second shaft interface portion and the second pedestal interface portion inhibits the rotational movement of the shaft about the longitudinal axis. According to some embodiments, the second shaft interface portion includes a second protrusion 502 that protrudes from the shaft 408.

[0105] Figure 5 A perspective view of the wheel 406 and shaft 408 of the height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. Figure 5 In the embodiment, according to some embodiments, the wheel 406 and the shaft 408 are depicted as uncoupled or the shaft 408 is not in the wheel 406 to at least illustrate the first wheel docking portion. In some embodiments, the first wheel docking portion includes a first groove 604 formed in the inner side wall 606 of the wheel 406.

[0106] According to some embodiments, a vertical measure (e.g., a distance between the top surface 614 of the wheel 406 and the first groove 604) may vary around the inner sidewall 606 of the wheel 406. According to some embodiments, at least some portions of the first groove 604 have a constant non-zero slope, or vary linearly in the vertical direction around the inner sidewall 606 of the wheel 406. According to some embodiments, at least some portions of the first groove 604 have a slope that is zero, or do not vary in the vertical direction around the inner sidewall 606 of the wheel 406.

[0107] According to some embodiments, when the wheel 406 rotates, the first protrusion 602 rides within the first groove 604. According to some embodiments, when the first protrusion 602 rides within the portion of the first groove 604 having a non-zero slope, the shaft 408 moves in the vertical direction. According to some embodiments, when the first protrusion 602 rides within the portion of the first groove 604 having a slope of zero, the shaft 408 does not move in the vertical direction. According to some embodiments, the wheel 406 can be rotated to place the first protrusion 602 within the first horizontal or zero slope portion of the first groove 604 to 'park' the shaft 408 at a first vertical position and place the semiconductor wafer 104 ( Figure 1) is placed a first distance from the top surface 113 of the pedestal 112. According to some embodiments, the wheel 406 can be rotated to transition the first protrusion 602 from the first horizontal portion of the first groove 604 through the non-zero tilt or non-horizontal portion of the first groove 604 to the second horizontal or zero tilt portion of the first groove 604, wherein the second horizontal portion of the first groove 604 is at a different elevation or vertical position than the first horizontal portion of the first groove 604, so as to "park" the shaft 408 at the second vertical position and place the semiconductor wafer 104 ( Figure 1 ) is placed a second distance away from the top surface 113 of the base 112.

[0108] According to some embodiments, the first groove 604 has any number of horizontal portions to achieve a desired granularity or number of vertical positions of the axis and thus the semiconductor wafer 104 ( Figure 1 ) and the top surface 113 of the pedestal 112. According to some embodiments, portions of the first groove 604 have different slopes, such that when the wheel 406 rotates at a constant speed, when the first protrusion 602 rides in a first portion of the first groove 604 having a first non-zero slope, the shaft 408 moves a different amount in the vertical direction than when the first protrusion 602 rides in a second portion of the first groove 604 having a second non-zero slope. According to some embodiments, when measured in the horizontal direction, portions of the first groove 604 having a non-zero slope have different lengths. According to some embodiments, when measured in the horizontal direction, portions of the first groove 604 having a slope of zero have different lengths, such that when the wheel 406 rotates at a constant speed, when the first protrusion 602 rides in a first portion of the first groove 604 having a slope of zero, the shaft 408 lacks movement in the vertical direction for a longer period of time than when the first protrusion 602 rides in a second portion of the first groove 604 having a slope of zero.

[0109] According to some embodiments, the first groove 604 does not extend beyond at least one of the top surface 614 of the wheel 406 or the bottom surface 616 of the wheel 406 so that the wheel 406 does not 'break away' from the shaft 408, or even if the wheel 406 rotates beyond 360 degrees, the first protrusion 602 continues to ride within the first groove 604. According to some embodiments, the first protrusion 602 is spaced apart from the second protrusion 502 so that when the shaft 408 moves up and down as the wheel 406 rotates and the first protrusion 602 rides within the first groove 604, the wheel 406 does not contact the second protrusion 502.

[0110] Figure 6A perspective view of a portion of the wheel 406, shaft 408, and pedestal 112 of the height adjustable semiconductor wafer support 100 is shown in accordance with some embodiments. According to some embodiments, a recess 706 is defined within the pedestal 112 such that when the shaft 408 moves up and down as the wheel 406 rotates, the shaft 408 is inserted downwardly into the recess 706 and extends upwardly from the recess 706. According to some embodiments, the second pedestal docking portion includes a second groove 704 in the pedestal 112 such that when the shaft 408 moves up and down, the second protrusion 502 moves up and down in the second groove 704. According to some embodiments, the second groove 704 is sized relative to the second protrusion 502 to inhibit rotational movement of the shaft 408 about the longitudinal axis when the wheel 406 rotates such that rotation of the wheel 406 is substantially converted into vertical movement of the shaft 408, which is opposite to the rotational movement of the shaft 408. According to some embodiments, wheel 406 experiences little or no vertical movement, but rather is primarily due to the movement of belt 404 ( Figure 3 ) is rotated by the movement of the wheel 406. According to some embodiments, the bottom surface 616 of the wheel 406 contacts or is in close proximity to the top surface 113 of the stand 112.

[0111] Figure 7 1 shows a perspective view of the wheel 406 of the height adjustable semiconductor wafer support 100 according to some embodiments. According to some embodiments, the wheel 406 has at least one of the upper flange 802 or the lower flange 804 to inhibit the belt 404 ( Figure 3 ) is detached from the wheel 406, which detachment may occur, for example, in other circumstances due to the belt 404 moving upward over the top surface 614 of the wheel 406 or moving downward from the bottom surface 616 of the wheel 406.

[0112] Figure 8 1 shows a perspective view of the wheel 406 and vertical wheel stop 904 of the height adjustable semiconductor wafer support 100 according to some embodiments. According to some embodiments, the wheel 406 includes one or more abutment portions 902 (e.g., teeth) that abut with the belt 404 ( Figure 3 ) docks or otherwise engages to facilitate rotation of wheel 460 by belt 404. According to some embodiments, vertical wheel stop 904 has a first portion 906, for example, attached to top surface 113 of stand 112, and a second portion 908 located above wheel 406. According to some embodiments, second portion 908 is proximate to at least one of upper flange 802 or top surface 614 of wheel 406. According to some embodiments, if wheel 406 undergoes vertical movement, wheel 406 encounters second portion 908, thereby terminating or constraining such vertical movement of wheel 406.

[0113] Fig. 9 and Fig.101 shows a portion of the wheel 406, shaft 408, and pedestal 112 of a height adjustable semiconductor wafer support 100 according to some embodiments. According to some embodiments, the first shaft interface portion includes a first groove 910 in the shaft 408, and the first wheel interface portion includes a first protrusion 920 on the wheel 406. According to some embodiments, the first shaft interface portion and the first wheel interface portion cooperate as previously described to facilitate vertical movement of the shaft 408, and thus facilitate the semiconductor wafer 104 ( Figure 1 ) relative vertical positioning. According to some embodiments, the second shaft interface portion includes a second groove 912 located in the shaft 408, and the second pedestal interface portion includes a second protrusion 922 located on the pedestal 112. According to some embodiments, the second shaft interface portion and the second pedestal interface portion cooperate as described above to inhibit movement of the shaft 408.

[0114] Fig.11 1 shows perspective views of three different states of a height adjustable semiconductor wafer support 100 according to some embodiments. Although three shafts 408 and three wheels 406 are shown, any number of shafts and wheels are contemplated according to some embodiments. The shafts 408 are shown at three different heights, such that the distance 114 between the top surface 111 of the shafts 408 and the top surface 113 of the pedestal 112 has three different values, thereby allowing the semiconductor wafer 104 ( Figure 1 ) are placed in three different vertical positions.

[0115] Fig.12 1 shows a top view of a height adjustable semiconductor wafer support 100 according to some embodiments. According to some embodiments, a controller 1202 is coupled to the motor 403 to control the operation of the motor 403. According to some embodiments, the controller 1202 corresponds to Figure 1105 in. According to some embodiments, an identification (ID) reader 1204 is adjacent to the semiconductor wafer 104 to read an ID 1206 of the semiconductor wafer 104. According to some embodiments, the ID 1206 is a bar code or the like, or is a measurement of the size, dimensions, etc. of the semiconductor wafer 104, for example, acquired by the ID reader 1204 to characterize or identify the semiconductor wafer 104. According to some embodiments, the ID reader 1204 is coupled to the controller 1202 so that the controller 1202 controls the operation of the motor 403 based on the ID, size, characterization, etc. of the semiconductor wafer 104. According to some embodiments, in view of the reading acquired by the ID reader 1204, the controller 1202 controls the motor 403 to move the belt and rotate the wheel 406 to move the shaft 408 as desired to place the semiconductor wafer 104 at a desired elevation, for example, adjacent to a piece of semiconductor fabrication equipment (e.g. Figure 1 According to some embodiments, the height adjustable semiconductor wafer support 100 further provides flexibility by moving semiconductor wafers of different sizes (eg, thickness, diameter, etc.) to a desired position relative to the semiconductor manufacturing equipment.

[0116] Fig.13A and Fig. 13B According to some embodiments, a semiconductor wafer (eg Figure 1 In some embodiments, a piece of semiconductor fabrication equipment (e.g., Figure 1 At least some portion of the semiconductor fabrication equipment 102 in the semiconductor fabrication equipment 102) operates on the semiconductor device 1300. According to some embodiments, the semiconductor device 1300 includes a fin-type field effect transistor (FinFET) device 1314, wherein Fig. 13B Shown along Fig.13A 13. A cross-sectional view of a FinFET device 1314 is shown with line 1316 passing through a gate region (G) 1302 and a channel region 1352 of the FinFET device 1314. According to some embodiments, the FinFET device 1314 includes a source region (S) 1304 and a drain region (D) 1306. According to some embodiments, the channel region 1352 is located between the source region 1304 and the drain region 1306. According to some embodiments, Fig. 13BAs shown in FIG. 1 , the gate region 1302 of the FinFET device 1314 wraps around one or more surfaces (e.g., first vertical surface 1352a, second vertical surface 1352b, and top surface 1352c) of the channel region 1352. According to some embodiments, a dielectric layer 1318 is located between the gate region 1302 and the channel region 1352. According to some embodiments, the source region 1304, the channel region 1352, and the drain region 1306 are included in a fin of the FinFET device 1314, wherein the FinFET device 1314 includes one or more fins. According to some embodiments, the gate region 1302 electrically controls the FinFET device 1314 by controlling the channel region 1352. According to some embodiments, in response to a voltage applied to the gate region 1302 or a lack of voltage, the gate region 1302 modifies properties of the channel region 1352 so that current flows through the channel region 1352 between the source region 1304 and the drain region 1306, thereby placing the FinFET device 1314 in an on state. According to some embodiments, control of the channel region 1352 is based on at least one of the fin width 1310, the fin length 1312, or the fin height 1308. According to some embodiments, increasing the fin height 1308 improves electrical characteristics (e.g., speed or responsiveness) of the FinFET device 1314. According to some embodiments, a semiconductor wafer or a portion thereof includes a plurality of FinFET devices. According to some embodiments, variations in fin height between different fins or between different FinFET devices or between both result in variations in voltage thresholds and mismatched electrical indicators. According to some embodiments, as at least with reference to Figure 1 The generally adjusted distance 116 facilitates a desired measurement of a physical property of the FinFET device 1314, such as at least one of the following: fin width 1310, fin length 1312, fin height 1308, variation of fin width between different fins, variation of fin length between different fins, variation of fin height between different fins, variation of fin width between different FinFET devices, variation of fin length between different FinFET devices, or variation of fin height between different FinFET devices. According to some embodiments, as at least with reference to Figure 1 The generally adjusted distance 116 facilitates a desired measurement of an electrical property of the FinFET device 1314, such as at least one of: a current through the channel region 1352 in response to a particular voltage applied to the gate region 1302, a change in the current through the channel region 1352 of different fins in response to a particular voltage applied to the gate region 1302 of the different fins, or a change in the current through the channel region 1352 of different FinFET devices in response to a particular voltage applied to the gate region 1302 of the different FinFET devices. According to some embodiments, as at least with reference to Figure 1The generally adjusted distance 116 facilitates adjusting one or more fabrication processes (e.g., deposition, etching, chemical mechanical planarization, etc.) to obtain a desired result (e.g., adjusting one or more of the fin width 1310, the fin length 1312, the fin height 1308, etc.). According to some embodiments, during or after fabrication of the semiconductor device 1300 (e.g., iteratively, in real time, in situ, etc.), one or more of the aforementioned measurements, adjustments, etc. may be performed by the controller 105 ( Figure 1 ) and be promoted.

[0117] Fig.14 According to some embodiments, an exemplary computer-readable medium is shown, wherein the exemplary computer-readable medium includes processor-executable instructions for implementing one or more of the provisions described herein. In some embodiments, Fig.14 The embodiment 1400 shown in the figure includes a computer-readable medium 1408 having computer-readable data 1406 encoded thereon, such as a compact disk-recordable (CD-R), a digital versatile disk-recordable (DVD-R), a flash drive, a platter of a hard drive, etc. According to some embodiments, the computer-readable data 1406 (e.g., binary data including at least one of zeros or ones) in turn includes a set of processor-executable computer instructions 1404, which are used to operate according to one or more of the principles described herein. In some embodiments, the processor-executable computer instructions 1404 are used to perform the method 1402, such as the method described herein for Figure 1 The controller 105 or Fig.12 In some embodiments, the processor may execute computer instructions 1404 to implement at least some of the operations described in at least one of the controllers 1202 in the embodiment of the present invention. In some embodiments, the processor may execute computer instructions 1404 to implement at least some portions of a system, such as the height adjustable semiconductor wafer support 100. Many such computer readable media are designed by those of ordinary skill in the art to operate in accordance with the techniques presented herein.

[0118] The terms "component", "module", "system", "interface", etc. used in this application are generally intended to refer to a computer-related entity: hardware, a combination of hardware and software, software, or software in execution. For example, a component may include a process running on a processor, a processor, an object, an executable file, a thread of execution, a program, or a computer. For example, both an application running on a controller and the controller can be components. One or more components can reside in an execution process or execution thread, and a component can be located on one computer or distributed between two or more computers.

[0119] In addition, the claimed subject matter may be implemented as a method, apparatus, or article of manufacture using standard programming or engineering techniques to produce software, firmware, hardware, or any combination thereof to control a computer to implement the disclosed subject matter. The term "article of manufacture" as used herein is intended to include a computer program accessible from any computer-readable device, carrier, or media. Of course, many modifications may be made to this configuration without departing from the scope or spirit of the claimed subject matter.

[0120] Fig.15 An exemplary computing environment is shown in which one or more of the clauses described herein are implemented according to some embodiments. Fig.15 The illustrated operating environment is only one example of a suitable operating environment and is not intended to provide any limitation on the scope of use or functionality of the operating environment. Exemplary computing devices include, but are not limited to, personal computers, server computers, handheld or laptop devices, mobile devices (e.g., mobile phones, personal digital assistants (PDAs), media players, etc.), multiprocessor systems, consumer electronics, mini computers, mainframe computers, distributed computing environments including any of the above systems or devices, etc.

[0121] In general, embodiments are described in the general context of "computer readable instructions" being executed by one or more computing devices. As discussed below, computer readable instructions are distributed via computer readable media. Computer readable instructions are implemented as program modules, such as functions, objects, application programming interfaces (APIs), data structures, etc., that perform specific tasks or implement specific abstract data types. Typically, the functionality of the computer readable instructions is combined or distributed as needed in various environments.

[0122] Fig.15 An example of a system 1500 including a computing device 1512 is shown, and the computing device 1512 is used to implement one or more embodiments provided herein, such as Figure 1 The controller 105 or Fig.12 In one configuration, the computing device 1512 includes at least one processing unit 1516 and a memory 1518. In some embodiments, depending on the exact configuration and type of the computing device, the memory 1518 is volatile (e.g., random access memory (RAM)), non-volatile (e.g., read-only memory (ROM), flash memory, etc.), or some combination of the two. Fig.15 As shown by dashed line 1514.

[0123] In some embodiments, computing device 1512 includes additional features or functions. For example, computing device 1512 also includes additional storage such as removable storage or non-removable storage, including but not limited to magnetic storage, optical storage, etc. Such additional storage is Fig.15 1518 is shown by storage 1520. In some embodiments, computer readable instructions implementing one or more embodiments provided herein are located in storage 1520. Storage 1520 also stores other computer readable instructions implementing an operating system, application programs, etc. The computer readable instructions are loaded into memory 1518 to be executed, for example, by processing unit 1516.

[0124] As used herein, the term "computer-readable media" includes computer storage media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology to store information such as computer-readable instructions or other data. Memory 1518 and storage 1520 are examples of computer storage media. Computer storage media include, but are not limited to, RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory or other storage technology, compact disk-readonly memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other media that can be used to store the desired information and can be accessed by computing device 1512. Any such computer storage media is part of computing device 1512.

[0125] In some embodiments, the computing device 1512 includes a communication connection 1526 that enables the computing device 1512 to communicate with other devices. The communication connection 1526 includes, but is not limited to, a modem, a network interface card (NIC), an integrated network interface, a radio frequency transmitter / receiver, an infrared port, a universal serial bus (USB) connection, or other interfaces for connecting the computing device 1512 to other computing devices. In some embodiments, the communication connection 1526 includes a wired connection or a wireless connection. In some embodiments, the communication connection 1526 transmits and / or receives communication media.

[0126] The term "computer-readable media" includes communication media. Communication media typically includes computer-readable instructions or other data in a "modulated data signal" such as a carrier wave or other transport mechanism, and includes any information delivery media. The term "modulated data signal" includes a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal.

[0127] The computing device 1512 includes an input device 1524 such as a keyboard, a mouse, a pen, a voice input device, a touch input device, an infrared camera, a video input device, or any other input device. Also included in the computing device 1512 are output devices 1522 such as one or more displays, speakers, a printer, or any other output devices. The input devices 1524 and the output devices 1522 are connected to the computing device 1512 via wired connections, wireless connections, or any combination thereof. In some embodiments, an input device or an output device from another computing device is used as an input device 1524 or an output device 1522 of the computing device 1512. The computing device 1512 also includes a communication connection 1526 to facilitate communication with one or more other devices.

[0128] The components of the computing device 1512 are connected through various internal connections such as buses. Such internal connections include peripheral component interconnect (PCI) (e.g., PCI Express), universal serial bus (USB), FireWire (Institute of Electrical and Electronic Engineers (IEEE) 13104), optical bus structures, etc. In another embodiment, the components of the computing device 1512 are connected through a network. For example, the memory 1518 is composed of multiple physical storage units located in different physical locations that are connected through a network.

[0129] In some embodiments, storage devices for storing computer-readable instructions are distributed over a network. For example, a computing device 1530 accessible via network 1528 stores computer-readable instructions to implement one or more embodiments provided herein. Computing device 1512 accesses computing device 1530 and downloads a portion or all of the computer-readable instructions for execution. Alternatively, computing device 1512 downloads multiple computer-readable instructions as needed, or some instructions are executed at computing device 1512 and some are executed at computing device 1530.

[0130] According to some embodiments, a height-adjustable semiconductor wafer support is provided, which includes: a suction cup for supporting a semiconductor wafer; an adjustment mechanism having a top surface for supporting the suction cup; and a pedestal coupled to the adjustment mechanism so that movement of the top surface of the adjustment mechanism relative to the pedestal changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

[0131] According to some embodiments, the adjustment mechanism includes a wheel, a belt, and a shaft. The belt is coupled to the wheel. The shaft is coupled to the wheel, wherein: a first end of the shaft defines the top surface of the adjustment mechanism, movement of the belt in a first direction causes the wheel to rotate in a first rotational direction, and rotation of the wheel in the first rotational direction causes the shaft to move in a first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the stand, wherein the first vertical direction corresponds to a longitudinal axis of the shaft.

[0132] According to some embodiments, movement of the belt in the second direction causes the wheel to rotate in a second rotational direction, and rotation of the wheel in the second rotational direction causes the shaft to move in a second vertical direction opposite to the first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the platform.

[0133] According to some embodiments, the adjustment mechanism comprises a motor to move the belt in at least one of the first direction or the second direction.

[0134] According to some embodiments, the height adjustable semiconductor wafer support includes a first shaft docking portion and a first wheel docking portion, wherein the first shaft docking portion docks with the first wheel docking portion when the wheel rotates to move the shaft in the first vertical direction.

[0135] According to some embodiments, the height-adjustable semiconductor wafer support includes a second shaft docking portion and a second pedestal docking portion, wherein when the shaft moves in the first vertical direction, the second shaft docking portion docks with the second pedestal docking portion to inhibit rotational movement of the shaft around the longitudinal axis.

[0136] According to some embodiments, at least one of the following situations exists: the first shaft docking portion includes a first protrusion located on the shaft, and the first wheel docking portion includes a first groove located in the wheel; the first shaft docking portion includes a first groove located in the shaft, and the first wheel docking portion includes a first protrusion located on the wheel; the second shaft docking portion includes a second protrusion located on the shaft, and the second pedestal docking portion includes a second groove located in the pedestal; or the second shaft docking portion includes a second groove located in the shaft, and the second pedestal docking portion includes a second protrusion located on the pedestal.

[0137] According to some embodiments, the height adjustable semiconductor wafer support includes a tensioner coupled to the strap to adjust tension in the strap.

[0138] According to some embodiments, a height-adjustable semiconductor wafer support is provided, which includes: a suction cup for supporting a semiconductor wafer; an adjustment mechanism having a top surface for supporting the suction cup; and a pedestal coupled to the adjustment mechanism, so that movement of the top surface of the adjustment mechanism relative to the pedestal achieved by a motor of the adjustment mechanism changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

[0139] According to some embodiments, the adjustment mechanism includes a shaft coupled to the motor, wherein a first end of the shaft defines the top surface of the adjustment mechanism.

[0140] According to some embodiments, the height adjustable semiconductor wafer support includes a belt coupled to the motor and the shaft, wherein the motor moves the belt, and movement of the belt in a first direction moves the shaft in a first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the pedestal, wherein the first vertical direction corresponds to the longitudinal axis of the shaft.

[0141] According to some embodiments, the height adjustable semiconductor wafer support includes a wheel coupled to the belt and the shaft, wherein the movement of the belt in the first direction rotates the wheel in a first rotational direction, and the rotation of the wheel in the first rotational direction moves the shaft in the first vertical direction.

[0142] According to some embodiments, movement of the belt in the second direction causes the wheel to rotate in a second rotational direction, and rotation of the wheel in the second rotational direction causes the shaft to move in a second vertical direction opposite to the first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the platform.

[0143] According to some embodiments, the height adjustable semiconductor wafer support includes a first shaft docking portion and a first wheel docking portion, wherein the first shaft docking portion docks with the first wheel docking portion when the wheel rotates to move the shaft in the first vertical direction.

[0144] According to some embodiments, the height-adjustable semiconductor wafer support includes a second shaft docking portion and a second pedestal docking portion, wherein when the shaft moves in the first vertical direction, the second shaft docking portion docks with the second pedestal docking portion to inhibit rotational movement of the shaft around the longitudinal axis.

[0145] According to some embodiments, at least one of the following situations exists: the first shaft docking portion includes a first protrusion located on the shaft, and the first wheel docking portion includes a first groove located in the wheel; the first shaft docking portion includes a first groove located in the shaft, and the first wheel docking portion includes a first protrusion located on the wheel; the second shaft docking portion includes a second protrusion located on the shaft, and the second pedestal docking portion includes a second groove located in the pedestal; or the second shaft docking portion includes a second groove located in the shaft, and the second pedestal docking portion includes a second protrusion located on the pedestal.

[0146] According to some embodiments, the height-adjustable semiconductor wafer support includes a controller and an identification (ID) reader. The controller is coupled to the motor. The identification (ID) reader is coupled to the controller, wherein the identification reader reads an identification of the semiconductor wafer, and the controller controls the motor based on the identification of the semiconductor wafer to change the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

[0147] According to some embodiments, a method for adjusting the height of a semiconductor wafer is provided, the method comprising: placing a suction cup for supporting the semiconductor wafer on a top surface of an adjustment mechanism supporting the suction cup; and starting the adjustment mechanism to change the distance between the top surface of the adjustment mechanism and a top surface of a platform supporting the adjustment mechanism.

[0148] According to some embodiments, the top surface of the adjustment mechanism is defined by a first end of a shaft of the adjustment mechanism, wherein activating the adjustment mechanism includes: moving a belt coupled to the shaft to move the shaft in a first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the platform, wherein the first vertical direction corresponds to the longitudinal axis of the shaft.

[0149] According to some embodiments, the method includes inhibiting rotational movement of the shaft about the longitudinal axis when the shaft moves in the first vertical direction.

[0150] The features of several embodiments are summarized above so that a person of ordinary skill in the art may better understand the various aspects of the present disclosure. A person of ordinary skill in the art should know that he or she may easily use the present disclosure as a basis for designing or modifying other processes and structures to implement the same purposes and / or achieve the same advantages as the various embodiments described herein. A person of ordinary skill in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and modifications thereto without departing from the spirit and scope of the present disclosure.

[0151] Although the subject matter has been described in language specific to structural features or methodological acts, it is to be understood that the subject matter of the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing at least some of the claims.

[0152] Various operations of the embodiments are provided herein. The order in which some or all of the operations are described should not be construed as implying that the operations must be performed in order. It will be understood that alternative orders also have the beneficial effects of this description. In addition, it will be understood that not all operations must be present in each embodiment provided herein. In addition, it will be understood that in some embodiments, not all operations are necessary.

[0153] It will be understood that in some embodiments, for example, for the purpose of simplicity and ease of understanding, the layers, features, elements, etc. depicted herein are illustrated with specific sizes relative to each other (e.g., structural size or orientation), and the actual sizes of the layers, features, elements, etc. are substantially different from the sizes illustrated herein. In addition, for example, there are various techniques such as at least one of the following to form the layers, regions, features, elements, etc. mentioned herein: etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques (e.g., chemical vapor deposition (CVD)).

[0154] In addition, "exemplary" is used herein to refer to serving as an example, instance, illustration, etc., and not necessarily to be advantageous. "Or" used in this application is intended to refer to an inclusive "or" rather than an exclusive "or". In addition, unless otherwise specified or clearly indicated from the context to refer to a singular form, "a and an" used in this application and the appended claims are generally deemed to refer to "one or more". In addition, at least one of A and B and / or similar expressions generally refer to A or B, or both A and B. In addition, to the extent that "includes", "having, has", "with" or variations thereof are used, such terms are intended to indicate inclusion in a manner similar to the term "comprising". In addition, unless otherwise specified, "first", "second", etc. are not intended to imply time aspects, spatial aspects, order, etc. Specifically, such terms are used only as identifiers, names, etc. of features, elements, items, etc. For example, a first element and a second element generally correspond to element A and element B, or two different elements, or two identical elements, or the same element.

[0155] In addition, although the present disclosure has been shown and described for one or more embodiments, a person of ordinary skill in the art will think of equivalent changes and modified forms after reading and understanding this specification and the drawings. The present disclosure includes all such modifications and modified forms, and is limited only by the scope of the above claims. In particular, for the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function (e.g., functionally equivalent) of the component, even if the component is not structurally equivalent to the disclosed structure. In addition, although the specific features of the present disclosure may be disclosed only with respect to one embodiment of several embodiments, such features may be combined with one or more other features of other embodiments when it may be desirable and advantageous for any given or specific application.

Claims

1. A height-adjustable semiconductor wafer support, comprising: A suction cup for supporting a semiconductor wafer; an adjustment mechanism having a top surface for supporting the suction cup, wherein the adjustment mechanism includes a shaft and a belt coupled to the shaft, and the shaft includes a second shaft interface portion; as well as a pedestal coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the pedestal changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal, movement of the belt in a first direction moves the shaft in a first perpendicular direction to change the distance, and the pedestal includes a second pedestal abutment portion, wherein when the shaft moves in the first perpendicular direction, the second shaft abutment portion abuts against the second pedestal abutment portion to inhibit rotational movement of the shaft about the longitudinal axis.

2. The height-adjustable semiconductor wafer support according to claim 1, wherein the adjustment mechanism comprises: a wheel, the belt and the shaft being coupled to the wheel, wherein: The first end of the shaft defines the top surface of the adjustment mechanism, Movement of the belt in the first direction causes the wheel to rotate in a first rotational direction, and Rotation of the wheel in the first rotational direction moves the shaft in the first vertical direction, wherein the first vertical direction corresponds to the longitudinal axis of the shaft.

3. The height-adjustable semiconductor wafer support according to claim 2, wherein: Movement of the belt in the second direction causes the wheel to rotate in the second rotational direction, and Rotation of the wheel in the second rotational direction moves the shaft in a second vertical direction opposite the first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

4. The height adjustable semiconductor wafer support according to claim 3, wherein the adjustment mechanism comprises: A motor moves the belt in at least one of the first direction or the second direction.

5. The height-adjustable semiconductor wafer support according to claim 2, comprising: The first shaft docking part; as well as A first wheel interface portion, wherein the first axle interface portion interfaces with the first wheel interface portion when the wheel rotates to move the axle in the first vertical direction.

6. The height adjustable semiconductor wafer support of claim 5, wherein at least one of the following conditions exists: The first shaft-interfacing portion comprises a first protrusion on the shaft and the first wheel-interfacing portion comprises a first groove in the wheel, The first shaft-interfacing portion comprises a first groove in the shaft and the first wheel-interfacing portion comprises a first protrusion on the wheel, The second shaft-interfacing portion comprises a second protrusion on the shaft and the second pedestal-interfacing portion comprises a second recess in the pedestal, or The second shaft-interfacing portion includes a second groove in the shaft, and the second pedestal-interfacing portion includes a second protrusion on the pedestal.

7. The height-adjustable semiconductor wafer support according to claim 1, comprising: A tensioner is coupled to the belt to adjust the tension in the belt.

8. A height-adjustable semiconductor wafer support, comprising: A suction cup for supporting a semiconductor wafer; an adjustment mechanism having a top surface for supporting the suction cup, wherein the adjustment mechanism includes a shaft and a belt coupled to the shaft, and the shaft includes a second shaft interface portion; as well as a pedestal coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the pedestal by a motor of the adjustment mechanism changes the distance between the top surface of the adjustment mechanism and the top surface of the pedestal, movement of the belt in a first direction moves the shaft in a first perpendicular direction to change the distance, and the pedestal includes a second pedestal abutment portion, wherein when the shaft moves in the first perpendicular direction, the second shaft abutment portion abuts against the second pedestal abutment portion to inhibit rotational movement of the shaft about the longitudinal axis.

9. The height adjustable semiconductor wafer support of claim 8, wherein the shaft is coupled to the motor, wherein a first end of the shaft defines the top surface of the adjustment mechanism.

10. The height-adjustable semiconductor wafer support according to claim 9, comprising: The belt is coupled to the motor and the shaft, wherein the motor moves the belt, and movement of the belt in the first direction moves the shaft in the first perpendicular direction, wherein the first perpendicular direction corresponds to the longitudinal axis of the shaft.

11. The height-adjustable semiconductor wafer support according to claim 10, comprising: A wheel is coupled to the belt and the shaft, wherein the movement of the belt in the first direction rotates the wheel in a first rotational direction, and rotation of the wheel in the first rotational direction moves the shaft in the first perpendicular direction.

12. The height adjustable semiconductor wafer support according to claim 11, wherein: Movement of the belt in the second direction causes the wheel to rotate in the second rotational direction, and Rotation of the wheel in the second rotational direction moves the shaft in a second vertical direction opposite the first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the pedestal.

13. The height-adjustable semiconductor wafer support according to claim 11, comprising: The first shaft docking part; as well as A first wheel interface portion, wherein the first axle interface portion interfaces with the first wheel interface portion when the wheel rotates to move the axle in the first vertical direction.

14. The height adjustable semiconductor wafer support according to claim 13, comprising: The second shaft docking part; as well as A second pedestal abutment portion, wherein the second shaft abutment portion abuts against the second pedestal abutment portion when the shaft moves in the first vertical direction to inhibit rotational movement of the shaft about the longitudinal axis.

15. The height adjustable semiconductor wafer support of claim 14, wherein at least one of the following conditions exists: The first shaft-interfacing portion comprises a first protrusion on the shaft and the first wheel-interfacing portion comprises a first groove in the wheel, The first shaft-interfacing portion comprises a first groove in the shaft and the first wheel-interfacing portion comprises a first protrusion on the wheel, The second shaft-interfacing portion comprises a second protrusion on the shaft and the second pedestal-interfacing portion comprises a second recess in the pedestal, or The second shaft-interfacing portion includes a second groove in the shaft, and the second pedestal-interfacing portion includes a second protrusion on the pedestal.

16. The height adjustable semiconductor wafer support according to claim 8, comprising: a controller coupled to the motor; as well as an identification (ID) reader coupled to the controller, wherein the identification reader reads an identification of the semiconductor wafer, and the controller controls the motor based on the identification of the semiconductor wafer to change the distance between the top surface of the adjustment mechanism and the top surface of the stage.

17. A method for adjusting the height of a semiconductor wafer, comprising: placing a suction cup for supporting the semiconductor wafer on a top surface of an adjustment mechanism supporting the suction cup, wherein the adjustment mechanism includes a shaft and a belt coupled to the shaft, and the shaft includes a second shaft docking portion; and The adjustment mechanism is activated, and the movement of the belt in the first direction causes the shaft to move in the first vertical direction to change the distance between the top surface of the adjustment mechanism and the top surface of the base supporting the adjustment mechanism, and the base includes a second base docking portion, wherein when the shaft moves in the first vertical direction, the second shaft docking portion docks with the second base docking portion to inhibit the rotational movement of the shaft around the longitudinal axis.

18. The method of claim 17, wherein the top surface of the adjustment mechanism is defined by a first end of the shaft of the adjustment mechanism, wherein the first vertical direction corresponds to the longitudinal axis of the shaft.

19. The method according to claim 18, comprising: When the shaft moves in the first perpendicular direction, rotational movement of the shaft about the longitudinal axis is inhibited.

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