An electronic device

Abstract

An embodiment of the present application provides an electronic device. By adding a conductive transition layer around the conductive coating, or setting the outer edge of the conductive coating to a concave-convex serrated shape, or making holes in the conductive coating, the internal stress of the material generated by the metal coating provided on the support layer is gradually reduced, and the resulting arching will gradually decrease to a large flat area, achieving the effect of reducing the degree of die imprinting. Alternatively, the area on the first surface of the support layer opposite to the conductive coating is thinned to form a recessed area, and the recessed area can compensate for the arching deformation, thereby improving the flatness of the surface of the support layer opposite to the conductive coating and avoiding die imprinting when the electronic device is irradiated with light.

Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to an electronic device. Background Art

[0002] With the continuous development of display module technologies for mobile terminal devices such as mobile phones, the trend of the development of display modules towards being thinner and lighter has emerged. However, with the increasing thinness and lightness of display modules, the requirements for display modules have also become higher and higher.

[0003] Currently, a mobile phone mainly includes a display module, a middle frame, and a battery cover. The display module and the battery cover are respectively located on both sides of the middle frame. The display module mainly includes a glass cover plate, a display layer, and a support layer (Mounting Bracket). The display layer is located between the glass cover plate and the support layer. The support layer often uses a metal material to improve the support performance and the anti-impact performance on the back. Among them, in order to reduce signal interference and the risk of electrostatic discharge (ESD), the display module is often grounded through electrical connection between the support layer and the middle frame.

[0004] However, in order to increase the electrical conductivity between the support layer and the middle frame, it is often necessary to coat a conductive material on the side of the support layer facing away from the display layer to improve the electrical conductivity. However, after coating the conductive material on the support layer, the position of the support layer facing the display surface corresponding to the conductive material will be deformed. As a result, after the mobile phone screen is turned off and illuminated by light, the reflected light in the deformed area is uneven, resulting in a moire pattern that can be observed on the appearance of the mobile phone, affecting the appearance of the mobile phone. Summary of the Invention

[0005] The embodiments of this application provide an electronic device, which improves the flatness of the back surface of the electroplated position of the support layer in the electronic device, reduces or avoids the unevenness of light in the electroplated area after the electronic device screen is turned off, and ensures that the moire pattern degree in the electroplated area is reduced or there is no moire pattern when the electronic device is irradiated by light.

[0006] The first aspect of the embodiments of this application provides an electronic device, including: a display module, a middle frame, and a battery cover. The display module and the battery cover are respectively located on both sides of the middle frame;

[0007] The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface. The first surface faces the display layer, and the second surface faces the middle frame;

[0008] A partial area of the second surface of the support layer is provided with a conductive coating, and a conductive transition layer is provided around the outer periphery of the conductive coating;

[0009] The conductive coating is electrically connected to the middle frame.

[0010] By adding a conductive transition layer around the conductive coating or setting the outer edge of the conductive coating to a concave-convex serrated shape, the internal stress of the material generated by the metal coating provided on the support layer gradually decreases from the conductive coating to the conductive transition layer, so that the arching generated on the first surface of the support layer gradually decreases to a large flat area, achieving the effect of reducing the degree of die stamping.

[0011] In a possible implementation manner, the conductive transition layer includes a plurality of first sub-transition layers, and the plurality of first sub-transition layers are arranged in one or more circles at intervals around the outer periphery of the conductive coating;

[0012] And the area of each of the first sub-transition layers is smaller than the area of the conductive coating.

[0013] In a possible implementation manner, the plurality of first sub-transition layers are arranged at intervals between the outer edge of the conductive coating.

[0014] In a possible implementation manner, the conductive transition layer further includes a plurality of second sub-transition layers;

[0015] The plurality of second sub-transition layers are located on the outer periphery of the plurality of first sub-transition layers.

[0016] In a possible implementation manner, the area of the second sub-transition layer is smaller than the area of the first sub-transition layer.

[0017] In a possible implementation manner, each of the second sub-transition layers is located on the center line between two adjacent first sub-transition layers.

[0018] In a possible implementation manner, the shapes of the first sub-transition layer and the second sub-transition layer are any one of a circle, a polygon, and an ellipse.

[0019] In a possible implementation manner, the plurality of first sub-transition layers are arranged at intervals on the outer edge of the conductive coating along the outer periphery of the conductive coating;

[0020] And the partial outer edge of the conductive coating is surrounded by two adjacent first transition layers to form a notch, so that the outer edge of the conductive coating is serrated.

[0021] In a possible implementation manner, the shape of the first sub-transition layer is a semicircle or a polygon.

[0022] In the second aspect of the embodiments of the present application, an electronic device is provided, including: a display module, a middle frame, and a battery cover, and the display module and the battery cover are respectively located on both sides of the middle frame;

[0023] The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface. The first surface faces the display layer, and the second surface faces the middle frame;

[0024] A partial area of the second surface of the support layer is provided with a conductive coating, and the conductive coating has a plurality of openings, and the bottom of the opening extends to the second surface;

[0025] The conductive coating is electrically connected to the middle frame.

[0026] By making holes in the conductive coating, in this way, the internal stress generated on the conductive coating is released at the openings, so that the internal stress of the material generated by the metal coating provided on the support layer is reduced. In this way, the arching generated on the first surface of the support layer will be reduced to a large flat area, achieving the effect of reducing the degree of die imprinting.

[0027] In a possible implementation manner, the plurality of openings are arranged in one or more circles at intervals around the center of the conductive coating.

[0028] In a possible implementation manner, the opening is a round hole, a square hole or an oval hole.

[0029] The third aspect of the embodiments of the present application provides an electronic device, including: a display module, a middle frame and a battery cover. The display module and the battery cover are respectively located on both sides of the middle frame;

[0030] The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface. The first surface faces the display layer, and the second surface faces the middle frame;

[0031] The first surface of the support layer has a recessed area, and a conductive coating is provided at a position on the second surface of the support layer opposite to the recessed area;

[0032] The conductive coating is electrically connected to the middle frame.

[0033] By performing a thinning process on the area of the first surface of the support layer opposite to the conductive coating to form a recessed area, the recessed area can compensate for the arching deformation, thereby improving the flatness of the surface of the support layer opposite to the conductive coating, and avoiding die imprinting when the electronic device is irradiated with light.

[0034] In a possible implementation manner, the positive projection of the recessed area facing the conductive coating completely coincides with the conductive coating.

[0035] In a possible implementation manner, it further includes a conductive member. One end of the conductive member is electrically connected to the conductive coating, and the other end of the conductive member is electrically connected to the metal middle plate of the middle frame.

[0036] In a possible implementation, the conductive member is a conductive elastic sheet or a conductive foam.

[0037] In a possible implementation, the electronic device is a foldable device.

[0038] In a possible implementation, the support layer is a conductive support layer made of a metal alloy or stainless steel.

[0039] In a possible implementation, the thickness of the conductive coating is less than or equal to 0.2 mm.

[0040] A display module provided in the fourth aspect of the embodiments of the present application is applied to an electronic device. The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface opposite to the first surface, and the first surface faces the display layer;

[0041] A conductive coating is provided on a partial area of the second surface of the support layer, and a conductive transition layer is provided around the outer periphery of the conductive coating;

[0042] The conductive coating is used for electrically connecting with the middle frame of the electronic device.

[0043] A display module provided in the fifth aspect of the embodiments of the present application is applied to an electronic device. The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface opposite to the first surface, and the first surface faces the display layer;

[0044] A conductive coating is provided on a partial area of the second surface of the support layer, and the conductive coating has a plurality of openings, and the bottom of the opening extends to the second surface;

[0045] The conductive coating is used for electrically connecting with the middle frame of the electronic device.

[0046] A display module provided in the sixth aspect of the embodiments of the present application is applied to an electronic device. The display module at least includes a display layer and a support layer. The support layer includes a first surface and a second surface opposite to the first surface, and the first surface faces the display layer;

[0047] A concave area is provided on the first surface of the support layer, and a conductive coating is provided at a position on the second surface of the support layer opposite to the concave area;

[0048] The conductive coating is used for electrically connecting with the middle frame of the electronic device. Description of the Drawings

[0049] Figure 1 is a schematic perspective view of an electronic device in an unfolded state provided by an embodiment of the present application;

[0050] Figure 2 It is a schematic diagram of an electronic device in a semi-folded state provided by an embodiment of the present application;

[0051] Figure 3 It is a schematic diagram of an electronic device in a folded state provided by an embodiment of the present application;

[0052] Figure 4 It is an exploded schematic diagram of an electronic device provided by an embodiment of the present application;

[0053] Figure 5 It is a schematic structural diagram of a display module in an electronic device provided by an embodiment of the present application;

[0054] Figure 6 It is along the Figure 1 A-A direction cross-sectional structural schematic diagram of the electronic device;

[0055] Figure 7 It is a cross-sectional structural schematic diagram of a support layer in an electronic device;

[0056] Figure 8 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer in an electronic device;

[0057] Figure 9 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0058] Figure 10 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0059] Figure 11A It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0060] Figure 11B It is Figure 11A An enlarged schematic diagram of the dashed box in;

[0061] Figure 12 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0062] Figure 13 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0063] Figure 14 It is a three-dimensional structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0064] Figure 15 It is a disassembled structural schematic diagram of a support layer and a conductive coating layer of an electronic device provided by an embodiment of the present application;

[0065] Figure 16 It is a schematic diagram of the split structure of the support layer and the conductive coating layer of the electronic device provided by an embodiment of the present application.

[0066] Description of the reference numerals:

[0067] 100 - Electronic device; 10 - Display module; 10a - First part; 10b - Second part;

[0068] 10c - Third part; 11 - Glass cover plate; 12 - Display layer; 13 - Support layer;

[0069] 131 - Conductive coating; 13a - First surface; 13b - Second surface; 132 - First sub-transition layer;

[0070] 133 - Second sub-transition layer; 134 - Opening; 135 - Concave area; 20 - Middle frame;

[0071] 21 - First middle frame; 211 - First frame; 212 - First metal middle plate;

[0072] 22 - Second middle frame; 221 - Second frame; 222 - Second metal middle plate; 23 - Rotating connection member;

[0073] 30 - Front cover; 40 - Battery cover; 50 - Circuit board; 60 - Battery; 70 - Conductive member. Detailed implementation manners

[0074] An embodiment of the present application provides an electronic device, which may include, but is not limited to, mobile terminals, fixed terminals or foldable terminals with display modules such as mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dash cams, security devices, etc.

[0075] In the embodiment of the present application, a mobile phone is taken as an example of the above-mentioned electronic device for illustration, and specifically a foldable mobile phone is taken as an example for illustration. The foldable mobile phone may be an inward-foldable mobile phone (i.e., the display module folds inward), or an outward-foldable mobile phone (i.e., the display module folds outward). In the embodiment of the present application, an inward-foldable mobile phone is specifically taken as an example for illustration.

[0076] Figure 1 It is a schematic diagram of the mobile phone in the unfolded state. Refer to Figure 1As shown, the electronic device 100 may include: a display module 10, a middle frame 20, a battery cover 40, and a front cover 30. The display module 10 and the front cover 30 are located on one side of the middle frame 20, the battery cover 40 is located on the other side of the middle frame 20, and the front cover 30 is connected to the middle frame 20.

[0077] The front cover 30 is used to shield the connection position between the display module 10 and the middle frame 20. Wherein, there may be a certain gap between the front cover 30 and the surface of the display module 10, or the front cover 30 contacts but is not sealed with the surface of the display module 10. In this way, when the mobile phone is folded, the front cover 30 is not likely to obstruct the bending of the display module 10. Among them, the front cover 30 may be an insulating front cover.

[0078] In the embodiment of the present application, referring to Figure 1 As shown, the middle frame 20 may include a first middle frame 21, a second middle frame 22, and a rotating connection member 23. The first middle frame 21 and the second middle frame 22 rotate relative to the rotating connection member 23. For example, one ends of the first middle frame 21 and the second middle frame 22 are respectively rotatably connected to both sides of the rotating connection member 23, and the other ends of the first middle frame 21 and the second middle frame 22 can rotate around the rotating connection member 23.

[0079] It should be noted that in order to realize the switching between the folded and unfolded states of the mobile phone, when the first middle frame 20 and the second middle frame 20 rotate, the front cover 30, the battery cover 40, and the display module 10 can all be folded and unfolded along with the rotation of the first middle frame 20 and the second middle frame 20.

[0080] For example, referring to Figure 1 As shown, when the mobile phone is in the unfolded state, the first middle frame 21 and the second middle frame 22 rotate relative to the rotating connection member 23 to the maximum state, and the front cover 30, the battery cover 40, and the display module 10 are all in the unfolded state. When the first middle frame 21 and the second middle frame 22 rotate along the Figure 1 direction of the dotted line arrow or the solid arrow in Figure 2 As shown, the mobile phone may be in a semi-folded state, the first middle frame 21 and the second middle frame 22 approach each other, and the front cover 30, the battery cover 40, and the display module 10 are in a bent state. Figure 3 For a schematic diagram of the mobile phone in the folded state, as Figure 3 shown, the first middle frame 21 and the second middle frame 22 are opposite to each other, and the front cover 30, the battery cover 40, and the display module 10 are all in the folded state. Therefore, in the embodiment of the present application, the first middle frame 20, the second middle frame 20, the front cover 30, the battery cover 40, and the display module 10 can be switched between the folded and unfolded states.

[0081] Since the display module 10 also needs to be folded during the folding process of the mobile phone, in the embodiments of the present application, the display module 10 can be an Organic Light-Emitting Diode (OLED) display screen, or other bendable flexible display screens.

[0082] The display module 10 can be used to display images, texts, videos, etc. Refer to Figure 1 As shown, the display module 10 includes a first part 10a, a second part 10b, and a third part 10c. The second part 10b is located between the first part 10a and the third part 10c. The first part 10a, the second part 10b, and the third part 10c are all on the same side of the first middle frame 21 and the second middle frame 22. In addition, the first part 10a is fixed to the first middle frame 21. The second part 10b is fixed to the rotating connection member 23 between the first middle frame 21 and the second middle frame 22. The third part 10c is fixed to the second middle frame 22. When the mobile phone is folded, the second part 10b is bent.

[0083] It can be understood that when the electronic device 100 is an inward-folded mobile phone, refer to Figure 1 As shown, when the electronic device 100 is in the unfolded state, the first part 10a, the second part 10b, and the third part 10c are approximately 180° (allowing slight deviations, such as 165°, 177°, or 185°). At this time, the display module 10 has a continuous large-area display area, that is, the display module 10 can achieve large-screen display, and the user experience is better. When the electronic device 100 is in the folded state, the display module 10 is located between the first middle frame 21 and the second middle frame 22 (refer to Figure 3 As shown), the second part 10b is bent, and the first part 10a and the third part 10c overlap each other.

[0084] Of course, in some examples, the electronic device 100 is an outward-folded mobile phone (that is, when the electronic device is in the folded state, the display module 10 is exposed outside). At this time, when the electronic device 100 is in the folded state, the first middle frame 21 and the second middle frame 22 are located between the first part 10a and the third part 10c.

[0085] Figure 4 For the explosion schematic diagram of the mobile phone, refer to Figure 4 As shown, the first middle frame 21 can include: a first metal middle plate 212 and a first frame 211 surrounding the outer edge of the first metal middle plate 212. The first frame 211 can include side frames, a top frame, and a bottom frame.

[0086] The second middle frame 22 may include: a second metal middle plate 222 and a second frame 221 surrounding the outer edge of the second metal middle plate 222. The second frame 221 may include: side frames, a top frame, and a bottom frame. The rotating connecting member 23 may be respectively connected to the first metal middle plate 212 and the second metal middle plate 222.

[0087] In the embodiments of the present application, the first frame 211 and the second frame 221 are fixedly connected to the first metal middle plate 212 and the second metal middle plate 222 by injection molding. The first metal middle plate 212 and the second metal middle plate 222 may be aluminum plates, may also be aluminum alloys, or may also be magnesium alloys. The first frame 211 and the second frame 221 may be metal frames, may also be glass frames, or may also be ceramic frames.

[0088] Among them, referring to Figure 4 As shown, the electronic device 100 may further include a circuit board 50 and a battery 60. Among them, the battery 60 may be connected to the charging management module and the circuit board 50 through a power management module. The power management module receives the inputs of the battery 60 and / or the charging management module, and powers the processor, the internal memory, the external memory, the foldable display module 10, the camera module, and the communication module, etc. The power management module may also be used to monitor parameters such as the battery 60 capacity, the battery 60 cycle count, and the battery 60 health status (leakage, impedance). In some other embodiments, the power management module may also be provided in the processor of the circuit board 50. In some other embodiments, the power management module and the charging management module may also be provided in the same device.

[0089] It can be understood that the structure schematically shown in the embodiments of the present application does not constitute a specific limitation on the electronic device 100. In some other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or have different component arrangements. For example, the electronic device 100 may further include devices such as cameras (such as front cameras and rear cameras) and flashlights.

[0090] Referring to Figure 5 As shown, the display module 10 may include: a glass cover 11, a display layer 12, and a support layer 13. The display layer 12 is located between the glass cover 11 and the support layer 13. The support layer 13 is used to support the display layer 12. Among them, in order to ensure that the support layer 13 has support performance, the support layer 13 is often made of a metal material. However, during the overall machine design, in order to reduce signal interference and the risk of electrostatic discharge (ESD), it is necessary to electrically connect the suspended metal (such as the support layer 13) to the middle frame 20 to achieve grounding.

[0091] Among them, the support layer 13 and the middle frame 20 are often electrically connected through a conductive member 70, and the conductive member 70 can be a conductive material such as a spring piece or a conductive foam.

[0092] Among them, the support layer 13 generally selects a copper layer. The copper layer has good electrical conductivity and can achieve good grounding performance with the middle frame 20. However, when the electronic device 100 is a folding device, due to the requirement of the overall weight of the machine, in addition, the support layer 13 used in a folding screen mobile phone must not only meet the support performance but also have a bending function. Therefore, the thickness of the support layer 13 should be relatively thin. However, when the copper layer continues to be used for the support layer 13, when the thickness of the copper layer is relatively thin, the copper layer cannot play a good supporting role for the display layer 12. Therefore, in a folding device, the copper layer is not suitable for the support layer 13. Generally, in a folding device, the support layer 13 is made of an alloy material or stainless steel and other materials with a relatively thin thickness and good support performance.

[0093] However, when the support layer 13 is made of an alloy material (such as aluminum alloy or copper alloy) or stainless steel and other materials, due to the weak conductivity of the alloy material or stainless steel, when the support layer 13 is grounded to the middle frame 20 through the conductive member 70, in order to improve the conductivity of the surface of the support layer 13, therefore, referring to Figure 6 and Figure 7 as shown, the support layer 13 includes a first surface 13a and a second surface 13b. The first surface 13a faces the display layer 12, and the second surface 13b faces the first metal middle plate 212 and the second metal middle plate 222 of the middle frame 20. A nickel / gold or other conductive material is plated at the grounding position on the second surface 13b of the support layer 13 to form a conductive coating 131. The conductive coating 131 can improve the conductivity of the grounding position of the support layer 13 and ensure stable and effective electrical connection between the support layer 13 and the middle frame 20 through the conductive member 70 and the conductive coating 131.

[0094] Referring to Figure 7 and Figure 8 as shown, the conductive coating 131 is provided in a partial area on the second surface 13b of the support layer 13. The conductive coating 131 can be provided with two (referring to Figure 8 ) or more. When the number of the conductive coatings 131 is two, referring to Figure 6 as shown, one of the conductive coatings 131 can be electrically connected to the first metal middle plate 212 of the first middle frame 20 to ground one side of the support layer, and the other conductive coating 131 can be electrically connected to the second metal middle plate 222 of the second middle frame 20 to ground the other side of the support layer.

[0095] It should be noted that the shape of the conductive coating 131 includes but is not limited to the Figure 8 circular shape shown. In some examples, the shape of the conductive coating 131 can also be a polygon, an ellipse or other irregular shapes.

[0096] However, after the conductive plating layer 131 is provided on the second surface 13b of the support layer 13, uneven internal metal stress is generated, resulting in arching deformation in the area of the first surface 13a of the support layer 13 opposite to the position of the conductive plating layer 131. See Figure 7 as shown). In this way, when the electronic device is in normal use, the arching deformation is not easily observed on the electronic device due to the function of the display layer 12. However, when the electronic device is turned off and light is irradiated, the reflection of light by the arched area is uneven, resulting in a moire pattern that can be observed visually. For example, there is a concavo-convex feeling at the position of the display module 10 opposite to the conductive plating layer 131, thereby affecting the appearance of the electronic device.

[0097] To solve the above problems, in the electronic device provided by the embodiments of the present application, by adding a conductive transition layer around the conductive plating layer 131, or setting the outer edge of the conductive plating layer 131 to a concavo-convex serrated shape, or making holes in the conductive plating layer 131, the internal stress of the material generated by the metal plating layer provided on the support layer 13 is gradually reduced, and the resulting arching will gradually decrease to a large flat area, achieving the effect of reducing the degree of moire pattern. Alternatively, the area of the first surface 13a of the support layer 13 opposite to the conductive plating layer 131 is thinned to form a concave area, and the concave area can compensate for the arching deformation, thereby improving the flatness of the surface of the support layer 13 opposite to the conductive plating layer 131 and avoiding the appearance of moire patterns when the electronic device is irradiated with light.

[0098] It should be noted that the large flat area specifically refers to the planar area on the first surface of the support layer except for the arched deformation area.

[0099] Several solutions provided by the embodiments of the present application will be elaborated in detail through several embodiments below.

[0100] Embodiment 1

[0101] In the embodiments of the present application, see Figure 9 as shown, a conductive plating layer 131 is provided in a partial area of the second surface 13b of the support layer 13, and a conductive transition layer is provided around the outer periphery of the conductive plating layer 131. Among them, see Figure 9 as shown, the conductive transition layer includes a plurality of first sub-transition layers 132, and the plurality of first sub-transition layers 132 are arranged at intervals around the outer periphery of the conductive plating layer 131 for one or more circles. For example, Figure 9 in, the plurality of first sub-transition layers 132 are arranged at intervals around the outer periphery of the conductive plating layer 131 for one circle. Of course, in some examples, the plurality of first sub-transition layers 132 are arranged at intervals around the outer periphery of the conductive plating layer 131 for multiple circles.

[0102] In the embodiments of the present application, the conductive coating layer 131 is electrically connected to the middle frame 20 to ground the support layer 13. Of course, in some examples, the conductive transition layer can also be electrically connected to the middle frame 20 to ground the support layer 13. Alternatively, both the conductive coating layer 131 and the conductive transition layer can be electrically connected to the middle frame 20, thus achieving the effect of grounding the support layer 13 at multiple positions.

[0103] In the embodiments of the present application, a plurality of first sub-transition layers 132 are arranged at intervals from the outer edge of the conductive coating layer 131. For example, Figure 9 As shown, there is an interval between the plurality of first sub-transition layers 132 and the outer edge of the conductive coating layer 131. In this way, the two coating layers are separated, thereby achieving the effect of reducing the internal stress of the metal.

[0104] It should be noted that the area of each first sub-transition layer 132 is smaller than the area of the conductive coating layer 131. In this way, it is ensured that the internal stress of the first sub-transition layer 132 is smaller than the internal stress of the conductive coating layer 131. Thus, the arching deformation generated by the first sub-transition layer 132 is smaller than the arching deformation generated by the conductive coating layer 131.

[0105] Therefore, in the embodiments of the present application, by arranging a plurality of first sub-transition layers 132 around the outer periphery of the conductive transition layer, and the area of each first sub-transition layer 132 is smaller than the area of the conductive coating layer 131, the internal stress at the position of the first sub-transition layer 132 on the support layer 13 is smaller than the internal stress at the position of the conductive coating layer 131, so that the arching deformation generated by the first sub-transition layer 132 is smaller than the arching deformation generated by the conductive coating layer 131. Therefore, in the embodiments of the present application, the internal stress of the material generated on the support layer 13 gradually decreases from the conductive coating layer 131 to the first sub-transition layer 131, and the arching generated in this way will gradually decrease to the large flat area. In this way, after the electronic device is turned off the screen and irradiated by the optical fiber, under the transition effect of the first sub-transition layer 132, the unevenness of the light reflection gradually decreases from large to small, thus playing a role in gradually reducing the stamping degree. Therefore, visually, the stamping degree is gradually weakened, making the stamping on the electronic device not very obvious visually.

[0106] In the embodiments of the present application, as Figure 9 shown, the shape of the first sub-transition layer 132 can be circular, or, as Figure 10 shown, the shape of the first sub-transition layer 132 can be polygonal.

[0107] Of course, in some examples, the shape of the first sub-transition layer 132 can also be oval, triangular or other shapes.

[0108] In a possible implementation manner, refer to Figure 11AAs shown, the conductive transition layer further includes a plurality of second sub-transition layers 133, and the plurality of second sub-transition layers 133 are located on the outer periphery of the plurality of first sub-transition layers 132.

[0109] Among them, referring to Figure 11A As shown, the area of the second sub-transition layer 133 is smaller than the area of the first sub-transition layer 132. In this way, the areas of the conductive coating layer 131, the first sub-transition layer 132, and the second sub-transition layer 133 gradually decrease. Thus, the internal stress in the material generated from the conductive coating layer 131, the first sub-transition layer 132 to the second sub-transition layer 133 gradually decreases, and the arching generated on the first surface 13a of the support layer 13 will gradually decrease to a large flat area. In this way, after the electronic device turns off the screen and is irradiated by the optical fiber, the unevenness of the light reflection gradually decreases from large to small further, thereby playing a role in gradually reducing the imprinting degree.

[0110] In the embodiment of the present application, when the plurality of second sub-transition layers 133 are distributed on the outer periphery of the plurality of first sub-transition layers 132, referring to Figure 11B As shown, each second sub-transition layer 133 is located on the center line L between two adjacent first sub-transition layers 132. In this way, it is ensured that the arching generated on the first surface 13a of the support layer 13 will gradually decrease uniformly to the flat area, and the imprinting on the electronic device is evenly distributed, and uneven distribution of the imprinting is not likely to occur.

[0111] Of course, in some examples, the second sub-transition layer 133 can also be arranged deviating from the center line L between two adjacent first sub-transition layers 132.

[0112] In the embodiment of the present application, as Figure 11A shown, the shape of the second sub-transition layer 133 can be circular, or the shape of the second sub-transition layer 133 can also be polygonal. For example, it can be square as shown in Figure 10 .

[0113] Of course, in some examples, the shape of the second sub-transition layer 133 can also be oval, triangular or other shapes.

[0114] It should be noted that the shapes of the first sub-transition layer 132 and the second sub-transition layer 133 can be the same or different. When two conductive coating layers 131 are provided on the first surface 13a of the support layer 13, the first sub-transition layers 132 and the second sub-transition layers 133 on the outer periphery of the two conductive coating layers 131 can be the same or different.

[0115] It should be noted that when the shapes of the first sub-transition layer 132 and the second sub-transition layer 133 are polygons (such as triangles or polygons), due to the presence of sharp corners in the metal plating layer of the polygon, the internal stress concentration is more obvious. When the shapes of the first sub-transition layer 132 and the second sub-transition layer 133 are circular, the internal stress is more dispersed. Therefore, the degree of arching deformation generated is less than that caused by the polygon metal plating layer.

[0116] In a possible implementation manner, as shown in Figure 12 As shown, a plurality of first sub-transition layers 132 are arranged at intervals along the outer periphery of the conductive plating layer 131 on the outer edge of the conductive plating layer 131. For example, a plurality of first sub-transition layers 132 are adjacent to the outer edge of the conductive plating layer 131, and a notch 131a is formed between the adjacent two first transition layers and a part of the outer edge of the conductive plating layer 131, so that the outer edge of the conductive plating layer 131 is serrated. In this way, the outer edge of the conductive plating layer 131 has an uneven serrated structure, and there is a notch 131a between the serrated structures, so that the internal stress of the material generated by the metal plating layer provided on the support layer 13 is reduced, and the arching generated in this way will be reduced to a large flat area, achieving the effect of reducing the die stamping degree.

[0117] In the embodiment of the present application, as shown in Figure 12 As shown, the shape of the first sub-transition layer 132 can be a polygon, or, as shown in Figure 13 As shown, the shape of the first sub-transition layer 132 can be a semi-circle. Of course, in some examples, the shape of the first sub-transition layer 132 can also be a polygon, a triangle or a sector. In this embodiment, the shapes of the plurality of first sub-transition layers 132 can be the same or different, and the shapes of the plurality of second sub-transition layers 133 can be the same or different. In the embodiment of the present application, the shape of the first sub-transition layer 132 is not limited.

[0118] It should be noted that in Figure 11A and Figure 12 Second sub-transition layers 133 can also be arranged at positions opposite to the respective notches 131a. In this way, the first sub-transition layer 132 is arranged adjacent to the outer edge of the conductive plating layer 131, and the second sub-transition layer 133 is arranged at intervals from the outer edge of the conductive plating layer 131.

[0119] Embodiment 2

[0120] The difference from the above embodiment is that in this embodiment, as shown in Figure 14As shown, the conductive coating layer 131 has a plurality of through holes 134, and the bottom of the through holes 134 extends to the second surface 13b of the support layer 13. In this way, the conductive coating layer 131 is a non-connected coating layer. The conductive coating layer 131 has through holes 134. The arrangement of the through holes 134 enables the release of the internal stress of the material generated by the conductive coating layer 131, thereby reducing the stress of the conductive coating layer 131. In this way, the generated arching will gradually decrease to the large flat area, achieving the effect of reducing the degree of die imprinting.

[0121] In the embodiment of the present application, the plurality of through holes 134 are arranged at intervals around the center of the conductive coating layer 131 in one or more circles. For example, referring to Figure 14 As shown, the plurality of through holes 134 are arranged at intervals around the center of the conductive coating layer 131 in one circle. Among them, the plurality of through holes 134 can be close to the outer edge of the conductive coating layer 131, which is beneficial to reducing the internal stress of the conductive coating layer 131. Of course, in some examples, the plurality of through holes 134 can also be located at any position between the center and the outer edge of the conductive coating layer 131.

[0122] In the embodiment of the present application, referring to Figure 14 As shown, the through hole 134 can be a round hole, or the through hole 134 can also be a square hole or an oval hole. In the embodiment of the present application, the shape of the through hole 134 is not limited.

[0123] Embodiment Three

[0124] In the embodiment of the present application, referring to Figure 15 As shown, the first surface 13a of the support layer 13 has a recessed area 135, and a conductive coating layer 131 is provided at a position on the second surface 13b of the support layer 13 opposite to the recessed area 135. In this way, when internal stress is generated in the conductive coating layer 131 on the second surface 13b of the support layer 13, the recessed area 135 on the first surface 13a of the support layer 13 arches and deforms, compensating for the arching deformation through the recessed area 135. In this way, referring to Figure 16 As shown, no arching deformation appears on the first surface 13a of the support layer 13, improving the flatness of the first surface 13a of the support layer 13, thereby avoiding die imprinting when the electronic device is irradiated with light.

[0125] Therefore, for the electronic device provided in the embodiment of the present application, by forming a recessed area 135 in the area on the first surface 13a of the support layer 13 opposite to the conductive coating layer 131, the recessed area 135 can compensate for the arching deformation, thereby improving the flatness of the surface of the support layer 13 opposite to the conductive coating layer 131 and avoiding die imprinting when the electronic device is irradiated with light.

[0126] In the embodiment of the present application, when the concave region 135 is formed on the first surface 13a of the support layer 13, specifically, the first surface 13a of the support layer 13 can be thinned, for example, by etching or other means to thin the position on the first surface 13a of the support layer 13 opposite to the conductive electroplating. It should be noted that the depth of the concave region 135 is specifically determined according to Figure 7 the height of the arching deformation in

[0127] In a possible implementation manner, the positive projection of the concave region 135 facing the conductive coating 131 completely coincides with the conductive coating 131, so as to ensure that the arching deformation caused by the conductive coating 131 can be compensated in the concave region 135, and to ensure that when the conductive coating 131 is provided on the second surface 13b of the support layer 13, there is no arching deformation on the first surface 13a of the support layer 13.

[0128] It should be noted that the above technical solution provided by the present application is described by taking a folding mobile phone as an example. In some examples, the above technical solution provided by the present application can also be applied to non-folding mobile phones. For example, the solution provided by the present application can also be used in a straight mobile phone. In this way, when the above solution is adopted in a straight mobile phone, since the support layer 13 uses a material with a relatively thin thickness such as alloy or stainless steel, the thickness of the display module 10 can be reduced, so that the thickness of the straight mobile phone is reduced, or the space saved in the straight mobile phone can be used to set other devices.

[0129] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0130] The device or component referred to in the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically and precisely specified.

[0131] The terms "first", "second", "third", "fourth", etc. (if any) in the description, claims and the above-mentioned drawings of this application are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of this application described herein can be implemented, for example, in an order different from those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, it comprises: a display module, a middle frame and a battery cover, wherein the display module and the battery cover are respectively located on two sides of the middle frame; the display module at least comprises a display layer and a support layer, the support layer comprises a first surface and a second surface, the first surface faces the display layer, and the second surface faces the middle frame; a partial area of the second surface of the support layer is provided with a conductive coating, and a conductive transition layer is arranged around the outer periphery of the conductive coating; the conductive transition layer comprises a plurality of first sub-transition layers, and the plurality of first sub-transition layers are arranged at intervals around the outer periphery of the conductive coating, and the area of each first sub-transition layer is smaller than the area of the conductive coating; the conductive coating is electrically connected to the middle frame.

2. The electronic device according to claim 1, characterized in that, the plurality of first sub-transition layers are arranged at intervals around the outer periphery of the conductive coating for one or more circles.

3. The electronic device according to claim 2, characterized in that, the plurality of first sub-transition layers are arranged at intervals between the outer edge of the conductive coating.

4. The electronic device according to claim 2 or 3, characterized in that, the conductive transition layer further comprises a plurality of second sub-transition layers; the plurality of second sub-transition layers are located on the outer periphery of the plurality of first sub-transition layers.

5. The electronic device according to claim 4, characterized in that, the area of the second sub-transition layer is smaller than the area of the first sub-transition layer.

6. The electronic device according to claim 5, characterized in that, each second sub-transition layer is located on the center line between two adjacent first sub-transition layers.

7. The electronic device according to any one of claims 5-6, characterized in that, the shapes of the first sub-transition layer and the second sub-transition layer are any one of a circle, a polygon and an ellipse.

8. The electronic device according to claim 2, characterized in that, the plurality of first sub-transition layers are arranged at intervals along the outer periphery of the conductive coating on the outer edge of the conductive coating; and a notch is formed by the partial outer edge of two adjacent first transition layers and the conductive coating, so that the outer edge of the conductive coating is serrated.

9. The electronic device according to claim 8, characterized in that, the shape of the first sub-transition layer is a semi-circle or a polygon.

10. An electronic device, characterized in that, it comprises: a display module, a middle frame and a battery cover, wherein the display module and the battery cover are respectively located on two sides of the middle frame; the display module at least comprises a display layer and a support layer, the support layer comprises a first surface and a second surface, the first surface faces the display layer, and the second surface faces the middle frame; a partial area of the second surface of the support layer is provided with a conductive coating, and the conductive coating has a plurality of openings, and the bottom of the openings extends to the second surface; the conductive coating is electrically connected to the middle frame.

11. The electronic device according to claim 10, characterized in that, the plurality of openings are arranged at intervals around the center of the conductive coating for one or more circles.

12. The electronic device according to claim 11, characterized in that, The opening is a round hole, a square hole or an oval hole.

13. An electronic device, characterized in that, comprising: a display module, a middle frame and a battery cover, the display module and the battery cover are respectively located on two sides of the middle frame; the display module at least includes a display layer and a support layer, the support layer includes a first surface and a second surface, the first surface faces the display layer, and the second surface faces the middle frame; a concave area is provided on the first surface of the support layer, and a conductive coating is provided at a position on the second surface of the support layer opposite to the concave area; the conductive coating is electrically connected to the middle frame.

14. The electronic device according to claim 13, characterized in that, the orthographic projection of the concave area facing the conductive coating completely coincides with the conductive coating.

15. The electronic device according to any one of claims 1-3, 5-6, 8-14, characterized in that, further comprising a conductive member, one end of the conductive member is electrically connected to the conductive coating, and the other end of the conductive member is electrically connected to the metal middle plate of the middle frame.

16. The electronic device according to claim 15, characterized in that, the conductive member is a conductive elastic sheet or a conductive foam.

17. The electronic device according to any one of claims 1-3, 5-6, 8-14, 16, characterized in that, the electronic device is a folding device.

18. The electronic device according to any one of claims 1-3, 5-6, 8-14, 16, characterized in that, the support layer is a conductive support layer made of metal alloy or stainless steel.

19. The electronic device according to any one of claims 1-3, 5-6, 8-14, 16, characterized in that, the thickness of the conductive coating is less than or equal to 0.2 mm.

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