Ultrasonic bonding device

Abstract

According to an embodiment of the present invention, an ultrasonic bonding device may include: a pressurizing unit that generates ultrasonic waves vibrating in a first direction; a main body unit disposed on the pressurizing unit and having a lower surface inclined by a predetermined angle with respect to the first direction; a cam unit disposed between the pressurizing unit and the main body unit; and a frame unit connected to the cam unit and the lower surface of the main body unit and moving along the lower surface of the main body unit to control the height of the cam unit. As the frame unit moves, the cam unit may selectively contact the upper surface of the pressurizing unit.

Description

Technical Field

[0001] The present invention relates to an ultrasonic bonding device. Background Art

[0002] Generally, a display device includes a display panel having a plurality of pixels and a driving chip for driving the pixels. The driving chip is disposed on a flexible film, and the flexible film is connected to the display panel. The driving chip is connected to the pixels of the display panel through the flexible film. This connection method is defined as the Chip-On Film method.

[0003] A plurality of pads connected to the driving chip are disposed on the flexible film, and the display panel includes a plurality of connection pads connected to the respective pixels. The pads are respectively in contact with and connected to the connection pads, thereby connecting the driving chip to the pixels.

[0004] The pads and the connection pads can be connected in various ways. For example, the pads and the connection pads can be connected to each other through an ultrasonic bonding device. The ultrasonic bonding device applies ultrasonic waves to the contact surface between the pads and the connection pads to fuse the pads and the connection pads to each other. Summary of the Invention

[0005] An object of the present invention is to provide an ultrasonic bonding device capable of maintaining a certain level of flatness of a pressing tool in contact with a flexible circuit.

[0006] According to an embodiment of the present invention, an ultrasonic bonding device may include: a pressing unit that generates ultrasonic waves vibrating in a first direction; a main body unit disposed on the pressing unit and having a lower surface inclined at a predetermined angle with respect to the first direction; a cam unit disposed between the pressing unit and the main body unit; and a frame unit connected to the cam unit and the lower surface of the main body unit and moving along the lower surface of the main body unit to control the height of the cam unit. As the frame unit moves, the cam unit may selectively contact the upper surface of the pressing unit.

[0007] (Advantages of the Invention)

[0008] According to an embodiment of the present invention, by providing a cam unit that contacts the upper surface of the pressing unit as the frame unit moves, it is possible to maintain a certain level of flatness of the pressing unit in contact with an object. Brief Description of the Drawings

[0009] Figure 1 is a perspective view of an ultrasonic bonding device according to an embodiment of the present invention.

[0010] Figure 2 It shows Figure 1Exploded perspective view of the pressing part shown and the second body part that combines with the main body part of the pressing part.

[0011] Figure 3 It shows Figure 1 Exploded perspective view of the jig part shown and the first body part that combines with the main body part of the jig part.

[0012] Figure 4 It shows the situation of observing the ultrasonic bonding device shown from the side Figure 1 Diagram.

[0013] Figure 5 It shows the situation of observing the ultrasonic bonding device shown from the front Figure 1 Diagram.

[0014] Figures 6 to 12 It is a diagram showing the process of adjusting the levelness of the pressing part in the ultrasonic bonding device according to an embodiment of the present invention.

[0015] Figure 13 It is an exemplary plan view of a display device.

[0016] Figure 14 It is used to show Figure 13 An enlarged view of the chip soft film package showing the detailed structure of the chip soft film package shown.

[0017] Figure 15 It exemplifies the use of the ultrasonic bonding device according to an embodiment of the present invention to Figure 14 Diagram of the process of attaching the chip soft film package shown to the display panel.

[0018] Figure 16 It is a diagram showing the ultrasonic bonding device according to an embodiment of the present invention.

[0019] Figure 17 It shows Figure 16 Diagram of the situation where the cover extension part shown is arranged in the cover hole of the second body part.

[0020] (Reference numerals)

[0021] BD: Ultrasonic bonding device; CP: Pressing part; MP: Main body part; JG: Jig part; DR: Driving part; CV: Cover part; CM: Cam part; FR: Frame part; CY: Cylinder block. Detailed implementation manners

[0022] In this specification, a certain component (or region, layer, part, etc.) being located on, connected to, or combined with another component means that it is directly arranged on the other component / directly connected to / combined with the other component, or a third component may be arranged between them.

[0023] Like reference numerals designate like elements. In addition, in the drawings, the thickness, ratios, and dimensions of the elements are exaggerated for clarity of the technical content.

[0024] “And / or” includes any and all combinations of one or more of the associated listed items.

[0025] The terms first, second, etc. may be used to describe various elements, but the elements are not limited to these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present invention, a first element may be termed a second element, and similarly, a second element may be termed a first element. Singular forms include plural forms unless the context clearly dictates otherwise.

[0026] In addition, the terms “below,” “lower,” “above,” “upper,” etc. are used to describe the connection relationships of the elements shown in the drawings. These terms are relative concepts and are described with reference to the directions shown in the drawings.

[0027] Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Also, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the context of the relevant art and are not to be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0028] The terms “comprises” and “having,” etc. should be understood as referring to the presence of the features, numbers, steps, operations, elements, parts, or combinations thereof as set forth in the specification, and not as precluding the presence or addition of one or more other features, numbers, steps, operations, elements, parts, or combinations thereof.

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0030] Figure 1 is a perspective view of an ultrasonic bonding apparatus according to an embodiment of the present invention. Figure 2 is a view showing Figure 1 an exploded perspective view of a second body portion of a main body portion that combines a pressing portion and a bonding pressing portion shown in the figure. Figure 3 is a view showing Figure 1 an exploded perspective view of a first body portion of a main body portion that combines a jig portion and a bonding jig portion shown in the figure.

[0031] The ultrasonic bonding device BD involved in this embodiment can be used to apply ultrasonic waves to the bonding surfaces of two components (not shown) in contact with each other to bond one component to the other component. For example, the ultrasonic bonding device BD can apply ultrasonic waves to the connection pads of a display panel and the pads of a chip-on-film in contact with the connection pads, so as to attach the chip-on-film to the display panel. This will be described later.

[0032] Referring to Figure 1 and Figure 2 , the ultrasonic bonding device BD can include a pressing part CP, a main body part MP, a cover part CV, a jig part JG, and a driving part DR.

[0033] The pressing part CP can extend in the first direction DR1. The pressing part CP can include a pressing tool CT, an ultrasonic wave transmission part TP, a flange part FL, and an ultrasonic wave generation part GP.

[0034] The pressing tool CT can be the part in the pressing part CP that contacts the object. The pressing tool CT can include a substance with sufficient rigidity. The pressing tool CT can have a substantially rectangular parallelepiped shape. For example, the pressing tool CT can have an upper surface UF defined by the first direction DR1 and a second direction DR2 intersecting the first direction DR1, and a first lower surface BF1. The upper surface UF can be arranged in the upper direction. The first lower surface BF1 can be arranged in the lower direction. The first lower surface BF1 and the upper surface UF can be opposite surfaces to each other.

[0035] Hereinafter, the direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 will be defined as the third direction DR3.

[0036] The pressing tool CT can have a predetermined thickness. For example, the pressing tool CT can have a predetermined thickness in the third direction DR3.

[0037] The pressing tool CT can include a part with a reduced diameter. For example, the pressing tool CT can include a recessed part REC defined near one end of the pressing tool CT at both ends of the pressing tool CT opposite to each other in the first direction DR1. In the pressing tool CT, the part defining the recessed part REC can have a smaller thickness in the third direction DR3 than other parts.

[0038] However, the shape of the pressing tool CT is not limited to the above situation. The pressing tool CT can be different according to the shape of the object.

[0039] The ultrasonic transmission part TP can be connected to the other end of the pressing tool CT. The other end of the pressing tool CT can be defined as the end opposite to one end of the pressing tool CT. The ultrasonic transmission part TP can extend in the first direction DR1. For example, the ultrasonic transmission part TP can have a cylindrical shape extending in the first direction DR1. The ultrasonic transmission part TP can transmit ultrasonic waves to the pressing tool CT. For example, the ultrasonic transmission part TP can change the amplitude of the ultrasonic waves generated by the ultrasonic generation part GP and transmit them to the pressing tool CT.

[0040] The flange part FL can be arranged on the outer peripheral surface of the ultrasonic transmission part TP. For example, the flange part FL can have an annular shape and is arranged to surround the outer peripheral surface of the ultrasonic transmission part TP. The inner side surface of the annular shape can be defined by the inner diameter, and the outer side surface of the annular shape can be defined by the outer diameter. The inner diameter of the flange part FL can be arranged to surround the outer peripheral surface of the ultrasonic transmission part TP.

[0041] The ultrasonic generation part GP can be connected to the ultrasonic transmission part TP. For example, the ultrasonic generation part GP can have a cylindrical shape extending in the first direction DR1. The ultrasonic generation part GP can be connected to the other end of the ultrasonic transmission part TP, and this other end of the ultrasonic transmission part TP is opposite to the one end of the ultrasonic transmission part TP connected to the pressing tool CT.

[0042] The ultrasonic generation part GP can generate ultrasonic waves. For example, the ultrasonic generation part GP can include one or more piezoelectric elements. Therefore, when a voltage is applied to the ultrasonic generation part GP, the ultrasonic generation part GP can generate ultrasonic waves.

[0043] According to an embodiment of the present invention, the pressing part CP can apply the ultrasonic waves generated by the ultrasonic generation part GP to the object through the pressing tool CT. For example, the ultrasonic waves generated by the ultrasonic generation part GP can vibrate in the first direction DR1. Thus, the pressing tool CT can apply ultrasonic waves vibrating in the first direction DR1 to the object.

[0044] The main body part MP can be arranged on the pressing part CP. The main body part MP can include a first body part BO1, a second body part BO2, and a third body part BO3. The first body part BO1 can be arranged on the pressing tool CT. The first body part BO1 and the pressing tool CT can be away from each other in the third direction DR3. When observed in a plane, the pressing tool CT can overlap with the first body part BO1. Hereinafter, "when observed in a plane" refers to the case of observing in the third direction DR3.

[0045] The second body portion BO2 can be disposed on one side surface of the first body portion BO1 among the two side surfaces of the first body portion BO1 that are opposite to each other in the first direction DR1. When observed in a plane, the second body portion BO2 can overlap with the ultrasonic transmission portion TP and the flange portion FL. The second body portion BO2 can extend further downward compared to the first body portion BO1. Therefore, based on the third direction DR3, the length of the second body portion BO2 can be longer than that of the first body portion BO1.

[0046] A coupling hole CHO can be defined in the second body portion BO2. The coupling hole CHO can be defined in a portion of the second body portion BO2 that is disposed more downward than the first body portion BO1. When observed in the first direction DR1, the coupling hole CHO can not overlap with the first body portion BO1. The coupling hole CHO can have a cylindrical shape extending in the first direction DR1.

[0047] The second body portion BO2 can include an upper portion BO2-U and a lower portion BO2-B. The upper portion BO2-U and the lower portion BO2-B are combined to be separable from each other. For example, the lower portion BO2-B can be detachably attached to the upper portion BO2-U by screw coupling. The coupling hole CHO can be formed by the combination of the upper portion BO2-U and the lower portion BO2-B.

[0048] The third body portion BO3 can be disposed on the first body portion BO1 and the second body portion BO2. For example, the upper surface of the first body portion BO1 and the upper surface of the second body portion BO2 can face the lower surface of the third body portion BO3.

[0049] In an embodiment of the present invention, as Figure 1 shown, the first body portion BO1 to the third body portion BO3 can be separately manufactured and combined with each other. However, it is not limited thereto, and the first body portion BO1 to the third body portion BO3 of the main body portion MP can be formed integrally.

[0050] The cover portion CV can be inserted into the coupling hole CHO of the second body portion BO2. The cover portion CV can surround the outer peripheral surface of the pressurizing portion CP. For example, the cover portion CV can have an annular shape and surround the flange portion FL of the pressurizing portion CP. Therefore, the inner diameter of the cover portion CV can surround the outer diameter of the flange portion FL. Before the lower portion BO2-B of the second body portion BO2 is completely combined with the upper portion BO2-U, the cover portion CV can be combined with the flange portion FL and rotate integrally with the pressurizing portion CP.

[0051] The upper and lower parts of the cover CV can be separated from each other. However, it is not limited to this, and the upper and lower parts of the cover CV can be formed integrally. The cover CV may further include a protruding pin PI disposed on the upper part. For example, the protruding pin PI may extend from the outer peripheral surface of the cover CV in the third direction DR3. The protruding pin PI may be inserted into a hole HO defined in the second body BO2. The hole HO may extend in the second direction DR2.

[0052] Before the lower part BO2 - B of the second body BO2 is completely combined with the upper part BO2 - U, as the pressing part CP and the cover CV rotate, the protruding pin PI may move inside the hole HO.

[0053] According to an embodiment of the present invention, the ultrasonic bonding device BD includes a cover CV disposed between the main body part MP and the pressing part CP, thereby improving the problem of damage to the pressing part CP.

[0054] Refer to Figures 1 to 3 , the second lower surface BF2 of the first body BO1 may be an inclined surface. For example, the second lower surface BF2 may be inclined at a predetermined angle with respect to the first direction DR1. The second lower surface BF2 may form an acute angle with a predetermined angle with the first direction DR1. The second lower surface BF2 may be a surface facing the upper surface UF of the pressing tool CT.

[0055] The jig part JG may maintain the levelness of the pressing tool CT with respect to the second direction DR2. Specifically, the jig part JG may maintain the levelness of the pressing tool CT so that the upper surface UF and the first lower surface BF1 of the pressing tool CT are parallel to the second direction DR2.

[0056] The jig part JG may be disposed between the main body part MP and the pressing part CP. The jig part JG may be connected to the second lower surface BF2 of the first body BO1. The jig part JG may include a frame part FR, a cam part CM, and a cylinder body CY.

[0057] The frame part FR may control the height of the cam part CM. The frame part FR may include a first frame part FR1 and a second frame part FR2 spaced apart from the first frame part FR1 in the second direction DR2. The first frame part FR1 may include a first guide rail GR1, a first fixing part FI1, and a first sub - frame SFR1.

[0058] The first guide rail GR1 may extend along the first direction DR1. The first guide rail GR1 may be connected to the second lower surface BF2. For example, the first guide rail GR1 may be fixed to the second lower surface BF2 by screw connection. The first guide rail GR1 may be configured to be inclined at a predetermined angle with respect to the first direction DR1.

[0059] A guide groove GH can be defined in the first guide rail GR1. The guide groove GH can extend along the length direction of the first guide rail GR1.

[0060] The first fixing portion FI1 can be disposed adjacent to the end of the first guide rail GR1. The first fixing portion FI1 can be fixed to the second lower surface BF2. The cylinder block CY described later can be disposed in the first fixing portion FI1. When viewed in a plane, the first fixing portion FI1 and the first guide rail GR1 do not overlap.

[0061] The first sub-frame SFR1 can be connected to the first guide rail GR1. The first sub-frame SFR1 can move along the first guide rail GR1.

[0062] The first sub-frame SFR1 can include a first horizontal frame HFR1, a sliding body SD, and a first vertical frame VFR1. The first horizontal frame HFR1 can be connected to the first guide rail GR1. For example, the sliding body SD can be disposed on the upper portion of the first horizontal frame HFR1. The sliding body SD can have a shape corresponding to the guide groove GH. The sliding body SD can be inserted into the guide groove GH. The sliding body SD can move along the first guide rail GR1.

[0063] The first vertical frame VFR1 can be disposed on one side surface of the first horizontal frame HFR1. One side surface can be a surface opposite to the surface adjacent to the second frame portion FR2. The first vertical frame VFR1 can extend more downward than the first horizontal frame HFR1.

[0064] The second frame portion FR2 can be away from the first frame portion FR1 in the second direction DR2. The second frame portion FR2 can include a second guide rail GR2, a second fixing portion FI2, and a second sub-frame SFR2.

[0065] The second guide rail GR2 can extend along the first direction DR1. The second guide rail GR2 can be connected to the second lower surface BF2. The second guide rail GR2 can be away from the first guide rail GR1 in the second direction DR2. The second guide rail GR2 can be disposed at a predetermined angle with respect to the first direction DR1. The second guide rail GR2 can be parallel to the first guide rail GR1.

[0066] A guide groove GH can be defined in the second guide rail GR2. The guide groove GH can extend along the length direction of the second guide rail GR2.

[0067] The second fixing portion FI2 can be disposed adjacent to the end of the second guide rail GR2. The second fixing portion FI2 can be fixed to the second lower surface BF2. When viewed in a plane, the second fixing portion FI2 does not overlap with the second guide rail GR2.

[0068] The second sub-frame SFR2 can move away from the first sub-frame SFR1 in the second direction DR2. The second sub-frame SFR2 can be connected to the second guide rail GR2. The second sub-frame SFR2 can include a second horizontal frame HFR2, a sliding body SD, and a second vertical frame VFR2.

[0069] The second horizontal frame HFR2 can be connected to the second guide rail GR2. The second horizontal frame HFR2 can be configured with the sliding body SD at the upper part. For example, the sliding body SD can have a shape corresponding to the guide groove GH. The sliding body SD can be inserted into the guide groove GH. Thus, the second sub-frame SFR2 can move along the second guide rail GR2.

[0070] The second vertical frame VFR2 can be configured on the other side of the second horizontal frame HFR2. The other side can be the side of the second vertical frame VFR2 opposite to the face adjacent to the first frame part FR1. The second vertical frame VFR2 can extend more downward than the second horizontal frame HFR2.

[0071] The cam part CM can be configured between the pressing part CP and the main body part MP. The height of the cam part CM can change as the frame part FR moves.

[0072] The cam part CM can include a first cam part CM1 and a second cam part CM2. The first cam part CM1 can be connected to the first frame part FR1. The first cam part CM1 can include a first roller RO1, a first bolt BT1, and a first nut NU1.

[0073] The first roller RO1 is rotatably coupled to the first bolt BT1. The first roller RO1 can be disposed adjacent to the first inner side surface ISF1 of the first vertical frame VFR1. The first inner side surface ISF1 can be the side surface of the first vertical frame VFR1 adjacent to the second frame part FR2. When viewed in a plane, the first roller RO1 can overlap with the first horizontal frame HFR1.

[0074] The first bolt BT1 can extend in the second direction DR2. The first bolt BT1 can be coupled to the first vertical frame VFR1. For example, the first bolt BT1 can be inserted into the first inner side surface ISF1 of the first vertical frame VFR1 and protrude from the first outer side surface OSF1. The first outer side surface OSF1 can be the surface opposite to the first inner side surface ISF1. The first bolt BT1 can be connected to the first vertical frame VFR1 by the first nut NU1 disposed adjacent to the first outer side surface OSF1 of the first vertical frame VFR1.

[0075] The second cam portion CM2 may be connected to the second frame portion FR2. The second cam portion CM2 may move away from the first cam portion CM1 in the second direction DR2. The second cam portion CM2 may include a second roller RO2, a second bolt BT2, and a second nut NU2.

[0076] The second roller RO2 may be rotatably coupled to the second bolt BT2. In Figure 3 the second bolt and the second nut may not be visible due to an angle problem. In Figure 5 the second bolt and the second nut are shown.

[0077] The second roller RO2 may be disposed adjacent to the second inner side surface ISF2 of the second vertical frame VFR2. The second inner side surface ISF2 may be the side surface of the second vertical frame VFR2 adjacent to the first frame portion FR1. The second inner side surface ISF2 may be a surface facing the first inner side surface ISF1 in the second direction DR2. When viewed in a plane, the second roller RO2 may overlap with the second horizontal frame HFR2.

[0078] The second bolt BT2 may extend in the second direction DR2. The second bolt BT2 may be coupled to the second vertical frame VFR2. For example, the second bolt BT2 may be inserted into the second inner side surface ISF2 of the second vertical frame VFR2 and protrude toward the second outer side surface OSF2. The second bolt BT2 may be connected to the second vertical frame VFR2 by the second nut NU2 disposed adjacent to the second outer side surface OSF2 of the second vertical frame VFR2.

[0079] The cylinder block CY may include a first cylinder block CY1 and a second cylinder block CY2. The first cylinder block CY1 is fixed to the first fixing portion FI1. The first cylinder block CY1 may include a first rod RD1. The first rod RD1 may extend or contract in the longitudinal direction. For example, the first cylinder block CY1 may include a pneumatic cylinder block. By the operation of the pneumatic cylinder block, the first rod RD1 may extend or contract.

[0080] The first rod RD1 may be connected to the first horizontal frame HFR1. Therefore, when the first rod RD1 extends, the first horizontal frame HFR1 may move downward along the first guide rail GR1. When the first rod RD1 contracts, the first horizontal frame HFR1 may move upward along the first guide rail GR1.

[0081] As a result, by the operation of the first cylinder block CY1, the first frame portion FR1 may move along the second lower surface BF2, and the height of the first cam portion CM1 may be controlled.

[0082] The second cylinder block CY2 is fixed to the second fixing portion FI2. The second cylinder block CY2 may include a second rod RD2. The second rod RD2 may extend or contract in the longitudinal direction.

[0083] The second rod RD2 can be connected to the second horizontal frame HFR2. Therefore, when the second rod RD2 extends, the second horizontal frame HFR2 can move downward along the second guide rail GR2. When the second rod RD2 contracts, the second horizontal frame HFR2 can move upward along the second guide rail GR2.

[0084] As a result, by the operation of the second cylinder CY2, the second frame portion FR2 can move along the second lower surface BF2, and the height of the second cam portion CM2 can be controlled.

[0085] The drive unit DR can be arranged on the third body portion BO3. The drive unit DR can move the main body portion MP in the third direction DR3.

[0086] Figure 4 is a view showing the ultrasonic bonding device as viewed from the side Figure 1 as shown. Figure 5 is a view showing the ultrasonic bonding device as viewed from the front Figure 1 as shown.

[0087] Referring to Figure 4 and Figure 5 , the cam portion CM can contact the upper surface of the pressing portion CP to maintain the levelness of the pressing portion CP with respect to the second direction DR2. For example, the first cam portion CM1 and the second cam portion CM2 can contact the upper surface UF of the pressing tool CT. The first roller RO1 of the first cam portion CM1 can contact the first area AE1 of the upper surface UF. The second roller RO2 of the second cam portion CM2 can contact the second area AE2 of the upper surface UF. The first area AE1 and the second area AE2 are areas opposite to each other with respect to the second direction DR2. When the first roller RO1 and the second roller RO2 contact the first area AE1 and the second area AE2 respectively, the first rod RD1 and the second rod RD2 can be in an extended state.

[0088] The height of the first roller RO1 and the height of the second roller RO2 can be the same as each other. Thereby, the height of the first area AE1 in contact with the first roller RO1 and the height of the second area AE2 in contact with the second roller RO2 can be the same as each other. As a result, the first lower surface BF1 of the pressing tool CT can be parallel to the second direction DR2.

[0089] According to an embodiment of the present invention, a first cam portion CM1 and a second cam portion CM2 spaced apart from the first cam portion CM1 in a second direction DR2 may selectively contact the upper surface UF of a pressing tool CT by the movement of a frame portion FR. Thus, even if an external force is applied to the pressing portion CP, since the cam portion CM supports the pressing tool CT, the levelness of the pressing portion CP with respect to the second direction DR2 can be maintained. Accordingly, the ultrasonic bonding device BD can perform a bonding process of higher quality.

[0090] Figures 6 to 12 FIG. is a diagram showing a process of adjusting the levelness of a pressing portion in an ultrasonic bonding device according to an embodiment of the present invention. Hereinafter, with reference to Figures 6 to 12 , a process of adjusting the levelness of the pressing tool CT with respect to the second direction DR2 will be described in detail. For ease of explanation, in Figure 7 , Figure 9 , Figure 11 and Figure 12 , other configurations except for the second body portion and the pressing portion of the pressing tool are omitted.

[0091] Referring to Figure 6 and Figure 7 , the first cam portion CM1 and the second cam portion CM2 may be spaced apart from the upper surface UF of the pressing tool CT. A lower portion BO2-B of the second body portion BO2 may be spaced apart from an upper portion BO2-U in a third direction DR3. Accordingly, the pressing portion CP may rotate with respect to the second body portion BO2. For example, the pressing tool CT may rotate in a clockwise or counterclockwise direction about a first axis AX1. The first axis AX1 may be a virtual line parallel to the first direction DR1 and passing through the center of the pressing portion CP.

[0092] Referring to Figure 8 and Figure 9 , a table jig SJ may contact a first lower surface BF1 of the pressing tool CT. The table jig SJ may be disposed on a table (not shown) and move in the first direction DR1 to the third direction DR3. An object may be disposed on the table.

[0093] The table jig SJ may have a width greater than or equal to that of the pressing tool CT with respect to the second direction DR2. The upper surface of the table jig SJ may be parallel to the second direction DR2. Accordingly, the lower surface of the pressing tool CT may be parallel to the second direction DR2.

[0094] Referring to Figures 10 to 11 , a first cylinder CY1 and a second cylinder CY2 may extend a first rod RD1 and a second rod RD2. As the first rod RD1 and the second rod RD2 extend, a first sub-frame SFR1 and a second sub-frame SFR2 may move along corresponding guide rails (GR1, GR2).

[0095] The first roller RO1 connected to the first sub-frame SFR1 can contact the first area AE1 of the upper surface UF. The second roller RO2 connected to the second sub-frame SFR2 can contact the second area AE2 of the upper surface UF. As a result, the levelness of the pressing tool CT with respect to the second direction DR2 can be maintained by the first roller RO1 and the second roller RO2.

[0096] The first cylinder CY1 and the second cylinder CY2 can further extend the corresponding rods (RD1, RD2) so that after the corresponding rollers (RO1, RO2) contact the upper surface UF, a predetermined pressure is also applied to the upper surface UF through the rollers (RO1, RO2). At this time, the rollers (RO1, RO2) can rotate while in contact with the upper surface UF.

[0097] According to this embodiment, since the cam portion CM applies a predetermined pressure to the pressing tool CT, the levelness of the pressing tool CT with respect to the second direction DR2 can be maintained more stably. In addition, since the rollers (RO1, RO2) of the cam portion CM rotate with respect to the upper surface UF, the phenomenon of wear of the pressing tool CT can be minimized.

[0098] Refer to Figure 12 , the measuring unit SP can measure the levelness of the pressing tool CT with respect to the second direction DR2. At this time, the workbench fixture SJ can move away from the pressing tool CT.

[0099] The measuring unit SP can be arranged on the workbench. The measuring unit SP can move along the first direction DR1 to the third direction DR3 on the workbench.

[0100] The measuring unit SP can include a laser sensor. The measuring unit SP can measure the height of the first position point P1 of the first lower surface BF1 overlapping the first area AE1. Then, the measuring unit SP moves in the second direction DR2, so that the height of the second position point P2 of the first lower surface BF1 overlapping the second area AE2 can be measured.

[0101] When the heights of the first position point P1 and the second position point P2 measured by the measuring unit SP are the same, the lower part BO2-B of the second body portion BO2 can be completely combined with the upper part BO2-U. Thus, the pressing tool CT can be fixed.

[0102] Figure 13 is an exemplary plan view of a display device.

[0103] Refer to Figure 13, the display device DD according to an embodiment of the present invention may include a display panel DP, a scan driver SDV, a chip on film COF, an emission driver EDV, a printed circuit board PCB, and a timing control unit T-CON.

[0104] In an embodiment of the present invention, various image display panels capable of displaying images, such as a liquid crystal display panel, an electro-wetting display panel, an electrophoretic display panel, or a light-emitting display panel, may be used as the display panel DP.

[0105] In addition, the display panel DP according to an embodiment of the present invention may be a light-emitting display panel, without particular limitation. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum carriers, etc. Hereinafter, the display panel DP will be described by taking the organic light-emitting display panel as an example.

[0106] The display panel DP may be a flexible display panel. For example, the display panel DP may include a plurality of electronic components disposed on a flexible substrate. The display panel DP may have a rectangular shape including a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1.

[0107] The display panel DP may have a plane defined by the first direction DR1 and the second direction DR2. The display panel DP may include a display area DA and a non-display area NDA surrounding the display area DA.

[0108] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, and a plurality of light-emitting lines EL1 to ELm. m and n are natural numbers. Each pixel PX may be arranged in a matrix form, but is not limited thereto and may be arranged in various forms. Each pixel PX is disposed in the display area DA and may be connected to the scan lines SL1 to SLm, the data lines DL1 to DLn, and the light-emitting lines EL1 to ELm.

[0109] The scan driver SDV and the emission driver EDV may be disposed in the non-display area NDA. The scan driver SDV may be disposed in the non-display area NDA adjacent to one of the long sides of the display panel DP. The emission driver EDV may be disposed in the non-display area NDA adjacent to the other long side of the display panel DP. The scan driver SDV and the emission driver EDV are disposed with the display area DA sandwiched therebetween.

[0110] The scanning lines SL1 to SLm can extend in the second direction DR2 and be connected to the scanning driving unit SDV. The light emitting lines EL1 to Elm can extend in the second direction DR2 and be connected to the light emitting driving unit EDV.

[0111] The chip on film COF can include a base film BA and a driving chip D-IC disposed on the base film BA. The driving chip D-IC can be defined as a data driver. The driving chip D-IC can be fabricated in the form of an integrated circuit chip and mounted on the base film BA.

[0112] Hereinafter, one side of the base film BA among the two opposite sides in the first direction DR1 is defined as one side of the base film BA, and the other side is defined as the other side of the base film BA.

[0113] The base film BA can have a rectangular shape including a short side in the first direction DR1 and a long side in the second direction DR2. One side of the base film BA can be connected to a non-display area NDA adjacent to one of the short sides of the display panel DP. The other side of the base film BA can be connected to the printed circuit board PCB.

[0114] Although not shown, a plurality of wirings connected to the driving chip D-IC can be disposed on the base film BA. Hereinafter, reference will be made to Figure 14 The wirings disposed on the base film BA will be described in detail. The data lines DL1 to DLn can extend in the first direction DR1 and be connected to the wirings disposed on the base film BA. Therefore, the data lines DL1 to DLn can be connected to the driving chip D-IC through the base film BA.

[0115] The scanning driving unit SDV can generate a plurality of scanning signals, and each scanning signal can be applied to each pixel PX through the scanning lines SL1 to SLm. Each scanning signal can be sequentially applied to each pixel PX.

[0116] The driving chip D-IC can generate a plurality of data voltages, and each data voltage can be applied to each pixel PX through the data lines DL1 to DLn. The light emitting driving unit EDV can generate a plurality of light emitting signals, and each light emitting signal can be applied to each pixel PX through the light emitting lines EL1 to Elm.

[0117] The timing control unit T-CON can be disposed on the printed circuit board PCB. The timing control unit T-CON can be fabricated in the form of an integrated circuit chip and mounted on the printed circuit board PCB. Although not shown, various circuits such as a power generation circuit and an interface circuit can be disposed on the printed circuit board PCB in addition to the timing control unit T-CON.

[0118] The timing control unit T-CON can control the operations of the scan driver unit SDV, the driving chip D-IC, and the emission driver unit EDV. For example, the timing control unit T-CON can generate a scan control signal, a data control signal, and an emission control signal in response to a control signal received from the outside. The timing control unit T-CON can receive an image signal from the outside and transform the data format of the image signal into a specification suitable for the interface with the driving chip D-IC and provide it to the driving chip D-IC.

[0119] The scan control signal and the emission control signal can be respectively provided to the scan driver unit SDV and the emission driver unit EDV through the driving chip D-IC. The scan control signal and the emission control signal can be respectively provided to the scan driver unit SDV and the emission driver unit EDV through the control signal wiring CSL. The control signal wiring CSL can be connected to the wiring disposed on the base film BA. The data control signal can be provided to the driving chip D-IC.

[0120] The scan driver unit SDV can generate a scan signal in response to the scan control signal, and the emission driver unit EDV can generate an emission signal in response to the emission control signal. The driving chip D-IC receives the provision of the image signal with the transformed data format and can generate a data voltage corresponding to the image signal in response to the data control signal.

[0121] Each pixel PX can receive the provision of the data voltage in response to the scan signal. Each pixel PX can emit light with a brightness corresponding to the data voltage in response to the emission signal, thereby displaying an image. The emission time of each pixel PX can be controlled by the emission signal.

[0122] Figure 14 is used to represent Figure 13 an enlarged view of the chip-on-film package showing the detailed structure of the chip-on-film package shown.

[0123] For ease of explanation, in Figure 14 a part of the display panel DP connected to the chip-on-film package COF and a part of the printed circuit board PCB connected to the chip-on-film package COF are separately shown from the chip-on-film package COF.

[0124] Referring to Figure 14 , the chip-on-film package COF can include a plurality of first pads PD1, a plurality of second pads PD2, a plurality of first signal wirings SL1, and a plurality of second signal wirings SL2. The first pads PD1, the second pads PD2, the first signal wirings SL1, and the second signal wirings SL2 can be disposed on the base film BA.

[0125] The first pad PD1 can be disposed adjacent to one side of the base film BA. The first pad PD1 can extend in the first direction DR1 and can be arranged in the second direction DR2. The first pad PD1 can have a rectangular shape including a long side in the first direction DR1 and a short side in the second direction DR2. One side of the base film BA can extend parallel to the second direction DR2. The first pad PD1 can be arranged along one side of the base film BA.

[0126] The second pad PD2 can be disposed adjacent to the other side of the base film BA. The second pad PD2 can extend in the first direction DR1 and be arranged in the second direction DR2. The second pad PD2 can have a rectangular shape including a long side in the first direction DR1 and a short side in the second direction DR2. The other side of the base film BA can extend parallel to the second direction DR2. The second pad PD2 can be arranged along the other side of the base film BA.

[0127] The gap between adjacent first pads PD1 can be smaller than the gap between adjacent second pads PD2. The number of first pads PD1 disposed on the base film BA can be larger than the number of second pads PD2.

[0128] The driving chip D-IC can be disposed between the first pad PD1 and the second pad PD2. The driving chip D-IC can have a rectangular shape including a long side in the second direction DR2 and a short side in the first direction DR1.

[0129] The first pad PD1 and the second pad PD2 can be connected to the driving chip D-IC through the first signal wiring SL1 and the second signal wiring SL2. For example, the first signal wiring SL1 can be disposed between the first pad PD1 and the driving chip D-IC and connected to the first pad PD1 and the driving chip D-IC. The second signal wiring SL2 can be disposed between the second pad PD2 and the driving chip D-IC and connected to the second pad PD2 and the driving chip D-IC.

[0130] A plurality of first connection pads CPD1 can be disposed on the display panel DP. The first connection pads CPD1 can extend in the first direction DR1 and be arranged in the second direction DR2. The first connection pads CPD1 can have a rectangular shape including a long side in the first direction DR1 and a short side in the second direction DR2.

[0131] The first connection pads CPD1 can be disposed in a non-display area NDA adjacent to a short side of the display panel DP. The control signal wiring CSL and the data lines DL1 to DLn can be connected to the first connection pads CPD1.

[0132] The number of the first connection pads CPD1 may be the same as the number of the first pads PD1. Each of the first connection pads CPD1 may be connected to each of the first pads PD1 respectively. By connecting the first connection pads CPD1 to the first pads PD1, one side of the base film BA is connected to the display panel DP, and the control signal wiring CSL and the data lines DL1 to DLn may be connected to the driving chip D-IC through the first signal wiring SL1.

[0133] A plurality of second connection pads CPD2 may be disposed on the printed circuit board PCB. The second connection pads CPD2 may extend in the first direction DR1 and be arranged in the second direction DR2. The second connection pads CPD2 may have a rectangular shape including a long side in the first direction DR1 and a short side in the second direction DR2.

[0134] The second connection pads CPD2 may be adjacent to one side of the printed circuit board PCB. The second connection pads CPD2 may be connected to the third signal wiring SL3. Although not shown, the third signal wiring SL3 may be connected to the timing control unit T-CON.

[0135] The number of the second connection pads CPD2 may be the same as the number of the second pads PD2. Each of the second connection pads CPD2 may be connected to each of the second pads PD2 respectively. By connecting the second connection pads CPD2 to the second pads PD2, the other side of the base film BA is connected to the printed circuit board PCB, and thus the timing control unit T-CON may be connected to the driving chip D-IC.

[0136] Figure 15 FIG. is an example showing the process of attaching the Figure 14 chip soft film package shown to the display panel by using the ultrasonic bonding device according to an embodiment of the present invention.

[0137] Referring to Figure 15 , in a state where the lower surface of the first pad PD1 is in contact with the upper surface of the first connection pad CPD1, the pressing tool CT may be in contact with the upper surface of the base film BA. The pressing tool CT may press the base film BA in the third direction DR3 through the driving unit DR (refer to Figure 1 ).

[0138] The pressing tool CT may apply ultrasonic waves having a predetermined frequency to the first pad PD1 and the first connection pad CPD1.

[0139] Due to the ultrasonic vibration, the first pad PD1 may vibrate in the first direction DR1, and the energy based on the ultrasonic vibration is transmitted to the contact surface between the first pad PD1 and the first connection pad CPD1. The principle of the ultrasonic vibration is as follows.

[0140] If a solid is subjected to an external force, the solid can be deformed. When the external force is small, if the external force is removed, the solid can return to its original shape. However, if the external force reaches a specific critical value, the solid will not return to its original shape and the solid may undergo permanent deformation. This kind of deformation can be defined as plastic deformation.

[0141] If the external force increases, the stress within the solid can also gradually increase. However, if the external force reaches the critical value, the permanent deformation may increase sharply. This boundary value of the stress (the critical value mentioned above) can be defined as the yield value (yield point).

[0142] The energy based on ultrasonic vibration can be transmitted to the contact surface (or contact interface) between the first pad PD1 and the first connection pad CPD1. The first pad PD1 and the first connection pad CPD1 can include metals as solids. The energy based on ultrasonic vibration can be defined as an external force.

[0143] The energy based on ultrasonic vibration is transmitted to the first pad PD1 and the first connection pad CPD1, so that the stress of the first pad PD1 and the first connection pad CPD1 can increase. If the stress reaches the yield value, plastic deformation can occur in the first pad PD1 and the first connection pad CPD1. In addition, the oxide layers on the contact surfaces (metal surfaces) of the first pad PD1 and the first connection pad CPD1 are removed, so that the first pad PD1 and the first connection pad CPD1 can be in direct contact.

[0144] Due to the continuous friction and plastic deformation of the contact surface between the first pad PD1 and the first connection pad CPD1, heat will be generated and the temperature can rise. In this case, at the contact surface between the directly contacted first pad PD1 and the first connection pad CPD1, the atoms of the first pad PD1 and the first connection pad CPD1 can diffuse into each other.

[0145] For example, the atoms on the contact surface of the first pad PD1 can diffuse towards the first connection pad CPD1, and the atoms on the contact surface of the first connection pad CPD1 can diffuse towards the first pad PD1. As a result, the first pad PD1 and the first connection pad CPD1 can be directly bonded to each other.

[0146] The rollers (RO1, RO2) in contact with the upper surface UF of the pressing tool CT can rotate as the pressing tool CT vibrates in the first direction DR1. For example, the rollers (RO1, RO2) can rotate a certain angle in the clockwise direction and then rotate a certain angle in the counterclockwise direction again. During the process of applying ultrasonic waves by the pressing part CP, as the rollers (RO1, RO2) rotate, the problem that the upper surface UF of the pressing tool CT is worn can be further improved. Thereby, the service life of the pressing tool CT can be increased.

[0147] Figure 16 This is a diagram showing an ultrasonic bonding device related to an embodiment of the present invention. Figure 17 This is showing Figure 16 a diagram of a case where the shown lid extension portion is disposed in the lid hole of the second body portion.

[0148] In Figure 16 and Figure 17 the same reference numerals are used to illustrate the same components as those in the foregoing embodiment. Hereinafter, the description of the same components as those in the foregoing embodiment will be omitted, and the components different from the foregoing embodiment will be mainly described in detail.

[0149] Referring to Figure 16 and Figure 17 the lid portion CV-1 may further include a lid main body portion CV-MP surrounding the outer peripheral surface of the pressing portion CP and a lid extension portion CV-EP extending from the lid main body portion CV-MP toward the second direction DR2.

[0150] For example, the lid main body portion CV-MP may have the shape of the English letter "C". The lid extension portion CV-EP may include a first extension portion EP1 and a second extension portion EP2 extending from the lid main body portion CV-MP. The first extension portion EP1 and the second extension portion EP2 may extend in the second direction DR2 respectively. The first extension portion EP1 and the second extension portion EP2 may be away from each other in the third direction DR3.

[0151] The first extension portion EP1 and the second extension portion EP2 may protrude outside the main body portion MP through a lid hole CVH defined on the side surface of the second body portion BO2. The first extension portion EP1 and the second extension portion EP2 may be rotated by a certain angle in a state of being inserted into the lid hole CVH.

[0152] An ultrasonic bonding device BD-1 related to an embodiment of the present invention may further include an angle adjustment portion AC. The angle adjustment portion AC may include an auxiliary frame CFR, a displacement measurement portion DSP, and a propulsion bolt portion PBT.

[0153] The auxiliary frame CFR may be coupled to the side surface of the second body portion BO2. The auxiliary frame CFR may cover the lid extension portion CV-EP. For example, the auxiliary frame CFR may have a shape that is reversed left and right. Specifically, the auxiliary frame CFR may include a first horizontal portion HP1, a vertical portion VP, and a second horizontal portion HP2.

[0154] The first horizontal portion HP1 can be connected to the side surface of the second body portion BO2 and extend in the second direction DR2. The first horizontal portion HP1 can be disposed at a position higher than the cover extension portion CV-EP in the third direction DR3. The vertical portion VP can extend from the end of the first horizontal portion HP1 toward the lower direction. The vertical portion VP can be configured to be away from the cover extension portion CV-EP in the second direction DR2. The second horizontal portion HP2 can extend from the vertical portion VP toward the second body portion BO2 again in the second direction DR2. The second horizontal portion HP2 can be disposed at a position lower than the cover extension portion CV-EP in the third direction DR3. When observed in a plane, the first horizontal portion HP1 and the second horizontal portion HP2 overlap each other.

[0155] The displacement measurement unit DSP can be combined with the auxiliary frame CFR. The displacement measurement unit DSP can measure the height or angle of the cover extension portion CV-EP. For example, the displacement measurement unit DSP can measure the height of the first extension portion EP1 or measure the angle formed by the first extension portion EP1 and the second direction DR2, etc.

[0156] The propulsion bolt portion PBT can include a first propulsion bolt PBT1 and a second propulsion bolt PBT2. The first propulsion bolt PBT1 can be connected to the first horizontal portion HP1. The end of the first propulsion bolt PBT1 can be connected to the first extension portion EP1. The first propulsion bolt PBT1 can rotate the cover extension portion CV-EP in the clockwise direction.

[0157] The second propulsion bolt PBT2 can be connected to the second horizontal portion HP2. The end of the second propulsion bolt PBT2 can be connected to the second extension portion EP2. The second propulsion bolt PBT2 can rotate the cover extension portion CV-EP in the counterclockwise direction.

[0158] As the cover extension portion CV-EP rotates in the clockwise direction or the counterclockwise direction, the cover portion CV-1 and the pressing portion CP can rotate.

[0159] According to an embodiment of the present invention, since the ultrasonic bonding device BD-1 further includes an angle adjustment unit AC for controlling the rotation angle of the cover portion CV-1, the levelness of the pressing portion CP with respect to the second direction DR2 can be more precisely controlled.

[0160] As described above, the present invention has been described with reference to the embodiments. However, those skilled in the art should be able to understand that the present invention can be variously modified and deformed without departing from the spirit and scope of the present invention described in the claims. Each embodiment disclosed in the present invention does not limit the technical idea of the present invention, and it should be interpreted that all technical ideas within the scope of the claims and their equivalents are included in the scope of the present invention.

Claims

1. An ultrasonic bonding device, comprising: a pressurizing part that generates ultrasonic waves vibrating in a first direction; a main body part disposed on the pressurizing part and having a lower surface inclined at a predetermined angle with respect to the first direction; a cam part disposed between the pressurizing part and the main body part; a frame part connected to the cam part and the lower surface of the main body part, and moving along the lower surface of the main body part to control the height of the cam part; and a cylinder connected to the lower surface of the main body part and moving the frame part along the lower surface of the main body part, wherein as the frame part moves, the cam part selectively contacts the upper surface of the pressurizing part.

2. The ultrasonic bonding device according to claim 1, wherein the cam part includes: a first cam part; and a second cam part spaced apart from the first cam part in a second direction intersecting the first direction, and the first cam part and the second cam part arranged in the second direction contact the upper surface of the pressurizing part.

3. The ultrasonic bonding device according to claim 2, wherein the frame part includes: a first frame part connected to the first cam part to move the first cam part; and a second frame part spaced apart from the first frame part in the second direction and connected to the second cam part to move the second cam part.

4. The ultrasonic bonding device according to claim 3, wherein the first frame part and the second frame part each include: a guide rail coupled to the lower surface of the main body part; and a sub-frame connected to the corresponding cam part of the first cam part and the second cam part and moving along the guide rail.

5. The ultrasonic bonding device according to claim 4, wherein the sub-frame includes: a horizontal frame connected to the guide rail; and a vertical frame disposed on one side of the horizontal frame and connected to the corresponding cam part.

6. The ultrasonic bonding device according to claim 4, wherein the first cam part and the second cam part each include: a bolt connected to the corresponding vertical frame of the vertical frames of the first frame part and the second frame part; and a roller rotatably coupled to the bolt and selectively contacting the upper surface of the pressurizing part as the sub-frame moves, and the rollers of the first cam part and the second cam part are disposed on opposite side surfaces of the vertical frames of the first frame part and the second frame part facing each other in the second direction.

7. The ultrasonic bonding device according to claim 1, wherein the pressurizing part includes: an ultrasonic wave generating part that generates ultrasonic waves; and a pressurizing tool that applies the ultrasonic waves generated by the ultrasonic wave generating part to an object.

8. The ultrasonic bonding device according to claim 7, wherein the pressurizing part further includes: an ultrasonic wave transmission part disposed between the ultrasonic wave generating part and the pressurizing tool and having a cylindrical shape extending along the first direction.

9. The ultrasonic bonding device according to claim 8, wherein The pressing portion further includes: a flange portion that surrounds a part of the outer peripheral surface of the ultrasonic transmission portion.

Images