Circuit board processing device and circuit board processing method based on the circuit board processing device
By using ultra-high pressure spray and flushing technology in the circuit board processing device, the problem of difficulty in removing ink in small holes in the circuit board development process is solved, and the effect of effectively flushing and protecting the green oil bridge is achieved.
Patent Information
- Application Number
- CN202110674708.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-06-15
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2041-06-15
AI Technical Summary
During the production process of circuit boards, it is difficult for the prior art to effectively flush the green oil in the small holes of the circuit board in the development process, while protecting the fine green oil bridge to prevent it from being damaged or falling off.
A circuit board processing device is designed, including a flushing nozzle assembly and a developing device. By performing ultra-high pressure spraying and rinsing of the circuit board to be processed before developing, the ink in the hole is removed to avoid damage to the green oil bridge.
It realizes the effective flushing of the ink in the circuit board hole without destroying the green oil bridge of the circuit board, and improves the efficiency and quality of the development process.
Smart Images

Figure CN113329562B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit boards, and in particular to a circuit board processing device and a circuit board processing method based on the circuit board processing device. Background Art
[0002] With the development of the electronics industry, circuit boards are also constantly developing in the direction of high density and small aperture. However, in the process of circuit board production, there are more difficult situations in the development process of circuit boards with high aspect ratio green oil (solder mask ink) plugging holes and thin green oil bridges. Some holes on the above-mentioned circuit boards are vias, which need to be plugged with green oil to prevent solder from entering the vias during welding and causing short circuits, and to prevent flux residues; while some holes need to prevent green oil from entering the holes to avoid affecting the welding and installation of components; in addition, in order to prevent solder from flowing from the opening of one component to the opening of another component during welding, the circuit board is provided with a green oil (solder mask) bridge. As the density of circuit board wiring increases, this green oil bridge becomes thinner and thinner.
[0003] If you want to rinse out the green oil in the small holes of the circuit board during the developing process, you need to increase the impact force of the chemical spray during the developing process, but this will also cause impact on the fine green oil bridge, causing the green oil bridge to break or fall off. If you reduce the impact force of the chemical spray to ensure that the green oil bridge is not affected, the ink in the small holes will not be rinsed clean.
[0004] In order to improve the efficiency of circuit board manufacturing, most manufacturers have begun to gradually change the original common "blocking point" ink printing process to the "empty (white) screen" printing method. Among them, the "blocking point" ink printing process is time-consuming and labor-intensive, and it is also easy to cause the problem of ink leaking into the circuit board holes due to inaccurate alignment during production. The "empty screen" printing method does not require the production of blocking points, and the circuit board manufacturing efficiency is high, but because the ink will penetrate into the circuit board holes, it will have a serious impact on the punching capacity of the development process and the side erosion of the green oil bridge of the circuit board. Summary of the invention
[0005] The main purpose of the present invention is to provide a circuit board processing device, which aims to flush out the ink in the holes of the circuit board by flushing the circuit board to be processed before development, while effectively protecting the green oil bridge, thereby solving the technical problem that flushing the ink in the holes of the circuit board in the existing circuit board processing device can easily damage the green oil bridge on the board surface of the circuit board.
[0006] In order to achieve the above-mentioned object, the present invention provides a circuit board processing device, which comprises:
[0007] A box body, the box body is used to accommodate the circuit board to be processed so as to perform flushing processing on the circuit board to be processed;
[0008] A flushing nozzle assembly, which is installed on the box and is used to flush the circuit board to be processed. The flushing nozzle assembly is provided with a plurality of nozzles;
[0009] Main water inlet pipes, the main water inlet pipes are connected to the boxes respectively;
[0010] a water pump connected to the main water inlet pipe;
[0011] A developing device is connected to the housing and is used for developing the circuit board to be processed.
[0012] Optionally, the flushing nozzle assembly includes an upper flushing nozzle and a lower flushing nozzle, which are respectively used to flush the upper side and the lower side of the circuit board to be processed.
[0013] Optionally, the upper flushing nozzle pipe sprays liquid vertically downward through the multiple nozzles, and the lower flushing nozzle pipe sprays liquid vertically upward through the multiple nozzles.
[0014] Optionally, the directions in which the upper flushing nozzles spray liquid through the multiple nozzles all form an angle with the horizontal direction, and the directions in which the lower flushing nozzles spray liquid through the multiple nozzles all form an angle with the horizontal direction.
[0015] Optionally, the flushing nozzle assembly includes a left flushing nozzle and a right flushing nozzle, which are respectively used to flush the left side and the right side of the circuit board to be processed.
[0016] Optionally, the circuit board processing device further includes a high-pressure gas source, and the high-pressure gas source is connected to the box.
[0017] Optionally, the circuit board processing device further includes a filter assembly, and the filter assembly is connected to the water pump.
[0018] Optionally, the filter assembly includes a relay pump and a filter, wherein the relay pump is connected to an external water inlet pipe and to the filter.
[0019] Optionally, the nozzles are evenly distributed at equal intervals.
[0020] Optionally, the spray pressure and spray flow rate of the nozzle are adjustable.
[0021] The present invention also proposes a circuit board processing method based on a circuit board processing device, which is applied to the circuit board processing device. The circuit board processing method based on the circuit board processing device includes:
[0022] Flushing the circuit board to be processed by using the flushing nozzle assembly;
[0023] The circuit board to be processed is developed by the developing device.
[0024] The technical solution of the present invention is to set a flushing nozzle assembly and a developing device so that the circuit board to be processed is first flushed before the developing process. In the actual circuit board processing process, before the circuit board to be processed is developed, the flushing nozzle assembly is first used to spray water, and the surface of the circuit board to be processed is sprayed and flushed with ultra-high pressure to flush the ink in the holes of the circuit board, and then the developing process of the circuit board to be processed is completed by the developing device. Because the ink in the holes of the circuit board to be processed is first flushed before the circuit board to be processed is developed, there is no need to use excessive spraying pressure when developing the circuit board to be processed, and the green oil bridge on the board surface of the circuit board will not be damaged. In this way, the circuit board processing device of the technical solution of the present invention can flush out the ink in the board hole of the circuit board to be processed, and at the same time can effectively protect the green oil bridge of the circuit board to be processed, solving the technical problem that the existing circuit board processing device is easy to damage the green oil bridge on the board surface of the circuit board when flushing the ink in the circuit board hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0026] Figure 1 It is a structural schematic diagram of an embodiment of a circuit board processing device of the present invention;
[0027] Figure 2 The figure is a schematic diagram of the assembly of the filter assembly in one embodiment of the circuit board processing device of the present invention.
[0028] Description of Figure Numbers:
[0029]
[0030]
[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0035] The present invention provides a circuit board processing device 100, and the circuit board processing device 100 includes:
[0036] A box 10, wherein the box 10 is used to accommodate a circuit board to be processed so as to perform flushing processing on the circuit board to be processed;
[0037] A flushing nozzle assembly 40, which is installed on the box 10 and is used to flush the circuit board to be processed. The flushing nozzle assembly is provided with a plurality of nozzles 43;
[0038] A main water inlet pipe 20, wherein the main water inlet pipe 20 is installed on the box body 10;
[0039] A water pump 30, wherein the water pump 30 is connected to the main water inlet pipe 20;
[0040] A developing device is connected to the housing 10 and is used for developing the circuit board to be processed.
[0041] The technical solution of the present invention provides a flushing nozzle assembly 40 and a developing device so that the circuit board to be processed is firstly flushed before the developing process.
[0042] In one embodiment, if Figure 1 As shown, before the circuit board to be processed is developed, water is first sprayed using the flushing nozzle assembly 40 to spray and flush the surface of the circuit board to be processed at an ultra-high pressure that is dozens of times higher than the conventional flushing pressure to flush the ink in the holes of the circuit board. The circuit board to be processed is then developed by the developing device. Since the spray pressure of the developing device does not need to be too high at this time, the green oil bridge of the circuit board will not be affected. Therefore, the development of the circuit board to be processed is completed without damaging the green oil bridge of the circuit board and flushing the ink in the holes of the circuit board.
[0043] In order to improve the water delivery efficiency of the main water inlet pipe 20 , the main water inlet pipe 20 may also be connected to a high-pressure pump.
[0044] In this way, the circuit board processing device 100 of the technical solution of the present invention can flush out the ink in the hole of the circuit board to be processed, and at the same time effectively protect the green oil bridge of the circuit board to be processed, thereby solving the technical problem that the existing circuit board processing device 100 is prone to damaging the green oil bridge on the board surface of the circuit board when flushing the ink in the hole of the circuit board.
[0045] In addition, the technical solution of the present invention simplifies the nozzle structure of the circuit board processing device 100 and reduces the difficulty of production and processing.
[0046] Furthermore, if Figure 1 As shown, the flushing nozzle assembly 40 includes an upper flushing nozzle 41 and a lower flushing nozzle 42, which are respectively used to flush the upper side and the lower side of the circuit board to be processed.
[0047] In this way, since the flushing nozzle assembly 40 of the circuit board processing device 100 includes an upper nozzle and a lower nozzle, in this embodiment, the circuit board to be processed is horizontally placed and transported during the flushing process, and the upper nozzle and the lower nozzle can respectively spray the upper side and the lower side of the circuit board to be processed to ensure the processing effect of the upper side and the lower side of the circuit board to be processed.
[0048] Specifically, Figure 1 As shown, the upper flushing nozzle 41 sprays liquid vertically downward through the plurality of nozzles 43, and the lower flushing nozzle 42 sprays liquid vertically upward through the plurality of nozzles 43. That is, in this embodiment, the flushing nozzle assembly 40 sprays the circuit board to be processed in the vertical direction, wherein the water sprayed onto the surface of the circuit board to be processed stays on the surface of the circuit board for a relatively long time.
[0049] In another embodiment, the directions in which the upper flushing nozzle 41 sprays liquid through the multiple nozzles 43 form an angle with the horizontal direction, and the directions in which the lower flushing nozzle 42 sprays liquid through the multiple nozzles 43 form an angle with the horizontal direction.
[0050] In this embodiment, the spray direction of the flushing nozzle assembly 40 to the circuit board to be processed forms a certain inclination angle with the horizontal direction, so that the sprayed liquid stays on the surface of the circuit board to be processed for a relatively short time and does not affect other processes. The inclination angle can be set and adjusted according to actual needs and is not specifically limited here.
[0051] In yet another embodiment, the flushing nozzle assembly 40 includes a left flushing nozzle and a right flushing nozzle, which are respectively used to flush the left side and the right side of the circuit board to be processed.
[0052] In this embodiment, the circuit board to be processed is placed vertically for transportation during the flushing process, and the left nozzle and the right nozzle of the flushing nozzle assembly 40 can spray the left side and the right side of the circuit board to be processed respectively to ensure the processing effect of the left side and the right side of the circuit board to be processed. In this embodiment, the liquid sprayed by the flushing nozzle assembly 40 on the circuit board to be processed stays on the surface of the circuit board to be processed for the shortest time compared with other embodiments.
[0053] In one embodiment, the circuit board processing device 100 further includes a high-pressure gas source, which is connected to the box 10. Thus, by connecting the box 10 to the high-pressure gas source, the high-pressure gas source delivers compressed gas to the flushing nozzle assembly 40, and a gas-liquid mixture is formed in the flushing nozzle assembly 40, thereby increasing the spray pressure of the flushing nozzle assembly 40 when flushing the circuit board to be processed, thereby improving the punching capacity and punching effect of the circuit board processing device 100.
[0054] Furthermore, if Figure 2 As shown, the circuit board processing device 100 further includes a filter assembly 50, and the filter assembly 50 is connected to the water pump 30. In this way, the water delivered to the main water inlet pipe 20 can be filtered, thereby preventing the performance of the main water inlet pipe 20 and the flushing nozzle assembly 40 from being affected by impurities in the water.
[0055] Specifically, the filter assembly 50 includes a relay pump 51 and a filter 52, wherein the relay pump 51 is connected to an external water inlet pipe and to the filter 52. In actual application, the relay pump 51 pumps water from the external water inlet pipe to the filter 52 for filtering, and then the water pump 30 in the circuit board processing device 100 pumps the water in the filter 52 to the main water inlet pipe 20 in the circuit board processing device 100.
[0056] Furthermore, if Figure 1 As shown, the nozzles 43 are evenly distributed at equal intervals. In this way, the circuit board to be processed can be sprayed as evenly as possible through the nozzles 43 to ensure the processing effect of the circuit board to be processed.
[0057] Furthermore, the spray pressure and spray flow rate of the nozzle 43 are adjustable. Specifically, in the actual processing process, the spray pressure and spray flow rate of the nozzle 43 can be adjusted according to the type of the circuit board to be processed to improve the processing yield of the circuit board. For example, if the circuit board to be processed is provided with a dry film, a nozzle 43 with high pressure and low flow rate is used to increase the spray pressure of the circuit board processing device 100; if the circuit board to be processed is provided with a wet film, a nozzle 43 with low pressure and high flow rate is used to avoid affecting the wet film.
[0058] The present invention also proposes a circuit board processing method based on a circuit board processing device, which is applied to the circuit board processing device. The circuit board processing method based on the circuit board processing device includes:
[0059] Flushing the circuit board to be processed by using the flushing nozzle assembly;
[0060] The circuit board to be processed is developed by the developing device.
[0061] The present invention relates to a circuit board processing method based on a circuit board processing device, which is provided with a flushing nozzle assembly and a developing device so that the circuit board to be processed is first flushed before the developing process. Before the circuit board to be processed is developed, the flushing nozzle assembly is first used to spray water, and the surface of the circuit board to be processed is sprayed and flushed at an ultra-high pressure that is dozens of times higher than the conventional flushing pressure to flush the ink in the holes of the circuit board, and then the circuit board to be processed is developed by the developing nozzle assembly. Since the spraying pressure of the developing nozzle assembly does not need to be too high at this time, it will not affect the green oil bridge of the circuit board, so that the developing process of the circuit board to be processed is completed on the basis of not damaging the green oil bridge of the circuit board and flushing the ink in the holes of the circuit board.
[0062] Among them, the spray pressure and flow rate of the flushing nozzle assembly in the flushing processing stage can be adjusted according to the actual specifications and dimensions of the circuit board to be processed, thereby improving the quality of circuit board processing.
[0063] In this way, the circuit board processing method based on the circuit board processing device involved in the technical solution of the present invention can flush out the ink in the board hole of the circuit board to be processed, and at the same time effectively protect the green oil bridge of the circuit board to be processed, thereby solving the technical problem that the green oil bridge on the board surface of the circuit board is easily damaged when flushing the ink in the hole of the circuit board in the existing developing process.
[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A circuit board processing device, characterized in that: The circuit board processing device comprises: A box body, the box body is used to accommodate the circuit board to be processed so as to perform flushing processing on the circuit board to be processed; A flushing nozzle assembly, the flushing nozzle assembly is installed on the box body, and is used to flush the circuit board to be processed. The flushing nozzle assembly is provided with a plurality of nozzles, and the flushing nozzle assembly includes an upper flushing nozzle and a lower flushing nozzle, which are respectively used to flush the upper side and the lower side of the circuit board to be processed. The directions in which the upper flushing nozzle sprays liquid through the plurality of nozzles all form an angle with the horizontal direction, and the directions in which the lower flushing nozzle sprays liquid through the plurality of nozzles all form an angle with the horizontal direction; Main water inlet pipes, the main water inlet pipes are connected to the boxes respectively; a water pump connected to the main water inlet pipe; A developing device is connected to the housing and is used to perform developing processing on the circuit board to be processed. Before the circuit board to be processed is developed, the flushing nozzle assembly is used to flush the ink in the holes of the circuit board to be processed.
2. The circuit board processing device according to claim 1, characterized in that: The upper flushing nozzle pipe sprays liquid vertically downward through the plurality of nozzles, and the lower flushing nozzle pipe sprays liquid vertically upward through the plurality of nozzles.
3. The circuit board processing device according to claim 1, characterized in that: The circuit board processing device also includes a high-pressure gas source, which is connected to the box.
4. The circuit board processing device according to any one of claims 1 to 3, characterized in that: The circuit board processing device also includes a filter assembly, and the filter assembly is connected to the water pump.
5. The circuit board processing device according to claim 4, characterized in that: The filter assembly comprises a relay pump and a filter. The relay pump is connected to an external water inlet pipe and is also connected to the filter.
6. The circuit board processing device according to any one of claims 1 to 3, characterized in that: The nozzles are evenly distributed with equal intervals, and the spraying pressure and spraying flow rate of the nozzles are adjustable.
7. A circuit board processing method based on a circuit board processing device, characterized in that: The circuit board method based on the circuit board processing device is applied to the circuit board processing device according to any one of claims 1 to 6, and the circuit board processing method includes: Flushing the circuit board to be processed by using the flushing nozzle assembly; The circuit board to be processed is developed by the developing device.
Citation Information
Patent Citations
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CN203673220U
Circuit board processing device
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