Ultrasonic probe and method of manufacturing an ultrasonic probe

Abstract

An ultrasonic probe and a method of manufacturing an ultrasonic probe are disclosed. The ultrasonic probe includes a piezoelectric layer including one or more cuts such that piezoelectric elements are disposed in a plurality of rows in a height direction, a first electrode formed on an upper side of the piezoelectric layer, a second electrode formed on a lower side of the piezoelectric layer, a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more cuts, and a third electrode formed on an inner surface of the one or more grooves and electrically connected to the first electrode.

Description

[0001] This application is based on and claims priority to Korean Patent Application No. 10-2020-0019463, filed on February 18, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multi-row ultrasonic probe with an improved structure and a method for manufacturing the multi-row ultrasonic probe. Background Technology

[0003] An ultrasound imaging device is a device that radiates ultrasound signals from the surface of a target towards a target part within the target body, and obtains images of a single layer of soft tissue or blood flow without invasiveness by using information from the reflected ultrasound signals (echo ultrasound signals).

[0004] Compared to other imaging devices such as X-ray diagnostic equipment, X-ray CT scanners (computed tomography scanners), MRI (magnetic resonance imaging) and nuclear medicine diagnostic equipment, ultrasound imaging equipment has been widely used for the diagnosis of heart, abdomen, urinary system and obstetrics and gynecology due to its small size, low cost, real-time display, ease of use and high level of safety due to no radiation exposure.

[0005] An ultrasound imaging device includes an ultrasound probe and a body. The ultrasound probe is used to send ultrasound signals to a target object to obtain an ultrasound image of the target object and to receive echo ultrasound signals reflected from the target object. The body is used to generate an image of the interior of the target object by using the echo ultrasound signals received from the ultrasound probe.

[0006] Typically, in an ultrasonic probe, the piezoelectric layer, which includes a piezoelectric material, has a ground electrode and a signal electrode, and a conductive matching layer or a separate ground electrode is used for electrical connection to the ground electrode of the piezoelectric layer.

[0007] However, the conductive matching layer is susceptible to external impacts and may increase the production cost of the probe. Furthermore, when using a separate ground electrode, the thickness of the ground electrode may make it difficult to accurately transmit high-frequency signals. Summary of the Invention

[0008] One aspect of this disclosure is to provide an ultrasonic probe capable of using a non-conductive matching layer to ensure internal electrical connections, and a method for manufacturing the ultrasonic probe.

[0009] Another aspect of this disclosure is to provide an ultrasonic probe with an improved structure, even applicable to structures including multiple rows, and a method for manufacturing the ultrasonic probe.

[0010] Further aspects of this disclosure will be set forth in part in the description which follows, and in part will be obvious from the description or may be learned by practice of this disclosure.

[0011] According to one aspect of this disclosure, an ultrasonic probe includes: a piezoelectric layer including one or more slits such that piezoelectric elements are arranged in multiple rows along a height direction; a first electrode formed on an upper side of the piezoelectric layer; a second electrode formed on a lower side of the piezoelectric layer; a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more slits; and a third electrode formed on an inner surface of the one or more grooves and electrically connected to the first electrode.

[0012] The width of the groove can be greater than or equal to the width of the cut.

[0013] The third electrode can be formed by sputtering.

[0014] The ultrasonic probe may further include a fourth electrode, which is formed on a surface of the matching layer that is in contact with the piezoelectric layer and is electrically connected to the first electrode.

[0015] The third electrode can be electrically connected to the fourth electrode.

[0016] The third electrode and the fourth electrode can be formed simultaneously by sputtering.

[0017] The ultrasonic probe may also include a circuit layer disposed below the piezoelectric layer.

[0018] The circuit layer can be fabricated using a flexible printed circuit board (FPCB) to be electrically connected to the second electrode.

[0019] The cuts formed in the piezoelectric layer can be continuously formed in the reflective layer.

[0020] The portion of each cut formed in the piezoelectric layer and the other portion formed in the reflective layer may be formed at the same location in the height direction.

[0021] The depth of the one or more grooves may be less than the thickness of the matching layer.

[0022] The matching layer may be a first matching layer, and the ultrasound probe may also include a second matching layer disposed above the first matching layer.

[0023] The depth of the one or more grooves may be greater than the thickness of the first matching layer and less than the combined thickness of the first matching layer and the second matching layer.

[0024] The first electrode can be a ground electrode, and the second electrode can be a signal electrode.

[0025] The matching layer can be made of a non-conductive material.

[0026] According to another aspect of this disclosure, an ultrasonic probe includes: a piezoelectric layer including one or more slits such that piezoelectric elements are arranged in multiple rows along a height direction; a first electrode formed on an upper side of the piezoelectric layer; a second electrode formed on a lower side of the piezoelectric layer; a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more slits; and a third electrode made of a conductive material filled in the one or more grooves and electrically connected to the first electrode.

[0027] The width of the groove can be greater than or equal to the width of the cut.

[0028] The ultrasound probe may further include a fourth electrode formed on a surface of the matching layer that is in contact with the piezoelectric layer to be electrically connected to the first electrode, wherein the fourth electrode may be electrically connected to the third electrode.

[0029] According to another aspect of this disclosure, a method of manufacturing an ultrasonic probe includes: forming one or more grooves in a matching layer along a height direction; forming electrodes on the inner surface of the one or more grooves and on the lower surface of the matching layer; bonding a piezoelectric layer to the lower surface of the matching layer; and forming one or more slits in the piezoelectric layer, the width of the one or more slits being less than or equal to the width of the one or more grooves, the positions of the one or more slits corresponding to the positions of the one or more grooves, thereby dividing the piezoelectric layer into multiple rows along the height direction.

[0030] The electrode formed on the matching layer can be electrically connected to the ground electrode of the piezoelectric layer. Attached Figure Description

[0031] These and / or other aspects of this disclosure will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a perspective view of an ultrasonic imaging device including an ultrasonic probe according to an embodiment of the present disclosure;

[0033] Figure 2 This is an external perspective view of an ultrasonic probe according to an embodiment of the present disclosure;

[0034] Figure 3 This is a cross-sectional view of an ultrasonic probe taken along the axial and height directions according to an embodiment of the present disclosure;

[0035] Figure 4 yes Figure 3 A magnified view of a local area.

[0036] Figure 5 This is a block diagram illustrating a method of manufacturing an ultrasonic probe according to an embodiment of the present disclosure;

[0037] Figure 6 This is a cross-sectional view of an ultrasonic probe according to another embodiment of the present disclosure, taken along the axial and height directions;

[0038] Figure 7 yes Figure 6 A magnified view of a local area;

[0039] Figure 8 This is a block diagram illustrating a method for manufacturing an ultrasonic probe according to another embodiment of the present disclosure;

[0040] Figure 9 This is a cross-sectional view of an ultrasonic probe according to another embodiment of the present disclosure, taken along the axial and height directions;

[0041] Figure 10 yes Figure 9 Enlarged view of a local area; and

[0042] Figure 11 This is a block diagram illustrating a method for manufacturing an ultrasonic probe according to another embodiment of the present disclosure. Detailed Implementation

[0043] The embodiments described in this specification and the constructions shown in the accompanying drawings are merely preferred embodiments of this disclosure. Therefore, it should be understood that various modifications to replace the embodiments and drawings described in this specification are feasible when submitting this application.

[0044] The same reference numerals or symbols in the various figures of this application indicate parts or components that perform substantially the same function.

[0045] The terminology used herein is for the purpose of describing embodiments and is not intended to limit and / or restrict this disclosure. For example, singular expressions herein may include plural expressions unless the context clearly indicates otherwise.

[0046] The terms “comprising” and “having” are intended to mean the presence of the features, quantities, steps, operations, elements, components, or combinations thereof described in the specification, and do not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, or combinations thereof.

[0047] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various components, these components should not be limited by these terms, and these terms are only used to distinguish one component from another.

[0048] For example, without departing from the scope of this disclosure, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term "and / or" includes any combination of multiple related items or any one of multiple related items.

[0049] The terms “front,” “rear,” “upper,” “lower,” “upper end,” and “lower end” used in the following description are defined with reference to the accompanying drawings, and the shape and position of each component are not limited by these terms.

[0050] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0051] Figure 1 This is a perspective view of an ultrasonic imaging apparatus including an ultrasonic probe according to an embodiment of the present disclosure.

[0052] Reference Figure 1 The ultrasound imaging device includes an ultrasound probe 100 (see...) Figure 2 The ultrasonic probe 100 is configured to send ultrasonic signals to an object and receive echo ultrasonic signals from the object to convert the echo ultrasonic signals into electrical signals, and the body 200 is configured to generate an ultrasonic image based on the echo ultrasonic signals.

[0053] The main body 200 can be connected to the ultrasound probe 100 via a wired or wireless communication network. The main body 200 can be a workstation including a display 270 and an input device 260.

[0054] The ultrasonic probe 100 may include a transducer module disposed in the housing 170 to radiate ultrasonic waves onto an object, receive echo ultrasonic waves reflected from the object, and convert electrical signals and ultrasonic waves to each other.

[0055] The body 200 may include an inner connector 250 and an insertion connector 190.

[0056] The insertion connector 190 is physically coupled to the inner connector 250 to send signals to and receive signals from the body 200. The body 200 may also include a cable 180 to connect the insertion connector 190 to the housing 170 of the ultrasonic probe 100.

[0057] The object can be a living human or animal, or internal tissues such as blood vessels, bones, and muscles, but is not limited to these. The object can be any object, as long as its internal structure can be imaged by ultrasound imaging device 1.

[0058] The ultrasound probe 100 can be connected to the main body 200 via a wireless communication network to receive various signals required to control the ultrasound probe 100. The ultrasound probe 100 can also transmit analog or digital signals corresponding to the echo ultrasound signals received by the ultrasound probe 100 to the main body 200. The wireless communication network refers to a communication network that can wirelessly send and receive signals.

[0059] Echo ultrasound is ultrasound reflected from an object to which ultrasound is radiated, and it has various frequency bands or energy intensities used to generate various ultrasound images according to diagnostic modes.

[0060] The transducer module inside the ultrasonic probe 100 can generate ultrasonic waves according to the applied AC power. The transducer module can generate ultrasonic waves by receiving AC power from an external power supply or an internal power storage device (such as a battery) and vibrating according to the AC power.

[0061] The three directions perpendicular to each other relative to the center of the ultrasonic probe 100 can be defined as the axial direction A, the transverse direction L, and the height direction E. Specifically, the direction along which the ultrasonic waves are radiated can be defined as the axial direction A, the direction in which the ultrasonic probe 100 forms horizontal rows can be defined as the transverse direction L, and the remaining direction perpendicular to the axial direction A and the transverse direction L can be defined as the height direction E. The ultrasonic probe 100 may also form multiple rows in the height direction E, and in this case, a multi-row array arrangement can be formed.

[0062] One end of the cable 180 is connected to the housing 170 of the ultrasonic probe 100, and the other end of the cable 180 is connected to the insertion connector 190, thereby connecting the housing 170 of the ultrasonic probe 100 and the insertion connector 190.

[0063] The insertion connector 190 sends electrical signals generated by the transducer module inside the ultrasonic probe 100 to the physically coupled inner connector 250, or receives control signals generated by the body 200 from the inner connector 250.

[0064] However, when the ultrasound probe 100 is implemented as a wireless ultrasound probe 100, the cable 180 and the insertion connector 190 can be omitted, and the ultrasound probe 100 and the main body 200 can transmit and receive signals via a separate wireless communication module (not shown) included in the ultrasound probe 100. Therefore, this disclosure is not necessarily limited to... Figure 1 The shape of the ultrasonic probe 100 shown is illustrated.

[0065] The main body 200 can perform wireless communication with the ultrasonic probe 100 through at least one of a short-range communication module and a mobile communication module.

[0066] Display 270 may include an auxiliary display 270-1 and a main display 270-2. When display 270 is implemented as a touch screen, display 270 may also perform input functions. That is, the main unit 200 may receive various commands from the user through at least one of display 270 and input device 260.

[0067] Additionally, although not shown in the accompanying drawings, a voice recognition sensor may be incorporated into the main body 200 to receive voice commands from the user. The construction of the ultrasound probe 100 will be described in more detail below.

[0068] Figure 2 This is an external perspective view of an ultrasonic probe according to an embodiment of the present disclosure.

[0069] Reference Figure 2 The ultrasonic probe 100, as a part in contact with the surface of the object, can transmit and receive ultrasonic signals. Specifically, the ultrasonic probe 100 can be used to transmit ultrasonic signals to a specific part inside the object based on a transmission signal received from the body 200, and to receive echo ultrasonic signals reflected from the specific part inside the object and transmit the echo ultrasonic signals back to the body 200. The echo ultrasonic signal can be, but is not limited to, a radio frequency (RF) signal reflected from the object, and the echo ultrasonic signal can include all signals obtained after the ultrasonic signal transmitted to the object is reflected.

[0070] The ultrasonic probe 100 may include a transducer array for converting electrical signals and ultrasonic signals to each other in order to transmit ultrasonic signals into the interior of an object. The transducer array may consist of a single transducer element or multiple transducer elements.

[0071] The ultrasonic probe 100 can generate ultrasonic signals through a transducer array to send the ultrasonic signals to the target part inside the object as the focus, and can receive the echo ultrasonic signals reflected from the target part inside the object through the transducer array.

[0072] When the echo ultrasonic signal reaches the transducer array, the transducer array can vibrate at a predetermined frequency corresponding to the frequency of the echo ultrasonic signal to output an AC current with a frequency corresponding to the vibration frequency of the transducer array. Therefore, the transducer array can convert the received echo ultrasonic signal into an echo signal (as a predetermined electrical signal).

[0073] Each transducer element in the transducer array can convert ultrasonic signals and electrical signals to each other. For this purpose, the transducer elements can be implemented as magnetostrictive ultrasonic transducers using the magnetostrictive effect of a magnetic body, piezoelectric ultrasonic transducers using the piezoelectric effect of a material, or piezoelectric micromechanical ultrasonic transducers (pMUTs), and can also be implemented as capacitive micromechanical ultrasonic transducers (cMUTs) that use the vibration of hundreds or thousands of finely processed thin films to transmit and receive ultrasonic waves.

[0074] The transducer module of the ultrasonic probe 100 can be arranged linearly or as... Figure 2 The ultrasonic probe 100 is arranged in a curved surface, as shown. Although the basic operating principle of the ultrasonic probe 100 is the same in both cases, in the ultrasonic probe 100 where the transducer module is arranged in a curved surface, the ultrasonic signal radiated to the transducer module has a fan shape, so that the generated ultrasonic image can also have a fan shape.

[0075] The transducer module can be configured as a matrix probe. In this case, the transducer module may include a multi-row, multi-dimensional transducer array with multiple rows.

[0076] Figure 3 This is a cross-sectional view of an ultrasonic probe taken along the axial and height directions according to an embodiment of the present disclosure, and Figure 4 yes Figure 3 A magnified view of a local area.

[0077] Reference Figure 3 and Figure 4 The ultrasonic probe 100 includes a piezoelectric layer 130, a sound-absorbing layer 160 disposed below the piezoelectric layer 130, and matching layers 110 and 120 disposed above the piezoelectric layer 130.

[0078] The piezoelectric layer 130 is made of a piezoelectric body (piezoelectric material). When an electrical signal is applied to generate ultrasonic waves, the piezoelectric body converts the electrical signal into mechanical vibrations. The piezoelectric body can be laminated in a single-layer or multi-layer structure.

[0079] The effect of generating voltage when mechanical pressure is applied to a predetermined material and the effect of causing mechanical deformation when voltage is applied are respectively called the piezoelectric effect and the inverse piezoelectric effect.

[0080] In other words, the piezoelectric element (piezoelectric material) may include lead zirconate titanate (PZT) ceramics, PZNT single crystals made using solid solutions of lead magnesium niobate and lead titanate, etc. The piezoelectric layer 130 can also radiate mechanical vibration energy as ultrasonic waves in the direction in which the lens (not shown) is provided and in the direction in which the sound-absorbing layer 160 is provided. In the following text, based on the piezoelectric layer 130, the direction in which the lens is provided is referred to as the front portion, and the direction in which the sound-absorbing layer 160 is provided is referred to as the rear portion.

[0081] The piezoelectric layer 130 can be processed into a multidimensional array in the form of a matrix with multiple rows through a cutting process.

[0082] The sound-absorbing layer 160 (back layer) is disposed below the piezoelectric layer 130 and absorbs the ultrasonic waves generated in the piezoelectric layer 130 and traveling backward, thereby blocking the ultrasonic waves from traveling to the rear of the piezoelectric layer 130. Therefore, image distortion can be prevented.

[0083] The sound-absorbing layer 160 may have an acoustic impedance lower than that of the piezoelectric layer 130. For example, the sound-absorbing layer 160 may be made of a material with an acoustic impedance of 2 MRayl to 5 MRayl. The sound-absorbing layer 160 may be formed using a material including rubber with added epoxy resin, tungsten powder, etc. In addition, the sound-absorbing layer 160 may be formed using multiple layers to improve the attenuation or blocking effect of ultrasonic waves.

[0084] Matching layers 110 and 120 are disposed above piezoelectric layer 130. Matching layers 110 and 120 may include a first matching layer 120 and a second matching layer 110 with different materials. In this embodiment, matching layers 110 and 120 may be made of non-conductive materials.

[0085] A second matching layer 110 may be disposed above the first matching layer 120. The first matching layer 120 and the second matching layer 110 can reduce the loss of ultrasonic waves transmitted to or received from the object by appropriately matching the acoustic impedance of the piezoelectric layer 130 with that of the object. The acoustic impedance of the object and the piezoelectric layer 130 can be matched by adjusting the physical parameters (such as sound velocity, thickness, and acoustic impedance) of the first matching layer 120 and the second matching layer 110. That is, the first matching layer 120 and the second matching layer 110 can suppress the reflection of ultrasonic waves caused by the difference between the acoustic impedance of the object and the acoustic impedance of the piezoelectric layer 130.

[0086] Figure 3 Matching layers 110 and 120, formed by two layers, are shown, but this disclosure is not limited thereto. Matching layers may be formed by a single layer, or by three or more matching layers.

[0087] The ultrasonic probe 100 may include a circuit layer 150 and a reflective layer 140.

[0088] The circuit layer 150 may be disposed below the piezoelectric layer 130. The circuit layer 150 may be formed using a flexible printed circuit board (FPCB).

[0089] The reflective layer 140 (reinforcement layer) may be disposed below the piezoelectric layer 130. Specifically, the reflective layer 140 may be disposed between the piezoelectric layer 130 and the circuit layer 150. However, this disclosure is not limited thereto, and the reflective layer 140 may be disposed at different locations.

[0090] The reflective layer 140 can reflect and scatter ultrasonic waves generated in the piezoelectric layer 130 and can be conductive. Therefore, the reflective layer 140 can reflect ultrasonic waves radiated to the rear of the piezoelectric layer 130 to the front. The reflective layer 140 can be used in broadband environments.

[0091] The piezoelectric layer 130 includes a first electrode 131 and a second electrode 132. According to this embodiment, the first electrode 131 is formed on one side of the piezoelectric body, and the second electrode 132 is formed on the other side of the piezoelectric body. That is, the first electrode 131 is formed on the upper side of the piezoelectric body, and the second electrode 132 is formed on the lower side of the piezoelectric body. The first electrode 131 and the second electrode 132 can be formed using highly conductive metals such as gold, silver, and copper.

[0092] One electrode formed on one side and the other side of the piezoelectric layer 130 corresponds to the anode (or signal electrode) of the piezoelectric layer 130, and the other electrode corresponds to the cathode (or ground electrode) of the piezoelectric layer 130. The one electrode and the other electrode are formed such that the anode and cathode are separated from each other. This embodiment illustrates that a first electrode 131 formed on one side of the piezoelectric layer 130 corresponds to the cathode, and a second electrode 132 formed on the other side of the piezoelectric layer 130 corresponds to the anode.

[0093] The electrodes (i.e., anode and cathode) disposed on the piezoelectric layer 130 can have various shapes; for example, at least one of the anode and cathode can be configured as a circular electrode.

[0094] The piezoelectric layer 130 includes one or more cuts 133. One or more cuts 133 can be formed when the piezoelectric layer 130 is cut in the transverse direction L.

[0095] Since one or more notches 133 are formed in the piezoelectric layer 130, the piezoelectric elements of the piezoelectric layer 130 can be arranged in multiple rows along the height direction E. One or more notches 133 formed in the piezoelectric layer 130 can be continuously formed in the reflective layer 140 along the axial direction A. For example, a portion of each notch 133 formed in the piezoelectric layer 130 and another portion formed in the reflective layer 140 can be formed at the same location in the height direction E.

[0096] The first matching layer 120 includes a third electrode 121 and a fourth electrode 122. The third electrode 121 and the fourth electrode 122 formed on the first matching layer 120 are electrically connected to the piezoelectric layer 130. Specifically, the third electrode 121 and the fourth electrode 122 are electrically connected to the first electrode 131 of the piezoelectric layer 130.

[0097] The first matching layer 120 includes one or more grooves 123. The one or more grooves 123 are connected to one or more cutouts 133 formed in the piezoelectric layer 130. That is, one or more grooves 123 may be formed at corresponding locations and in corresponding numbers to the one or more cutouts 133.

[0098] The third electrode 121 may be formed on the inner surface of one or more grooves 123 of the first matching layer 120 to be electrically connected to the first electrode 131 of the piezoelectric layer 130.

[0099] The width of one or more grooves 123 may be greater than or equal to the width of one or more slits 133, where the width refers to the length in the height direction E. Therefore, when slits 133 are formed on the piezoelectric layer 130 by a cutting process, damage to the third electrode 121 formed on the grooves 123 can be prevented. Details regarding the manufacturing method of the ultrasonic probe 100 will be described later.

[0100] One or more grooves 123 are formed to a depth less than the thickness of the first matching layer 120, where depth and thickness can refer to length in the axial direction A.

[0101] A fourth electrode 122 is formed on one surface of the first matching layer 120. Specifically, the fourth electrode 122 is formed on one surface where the first matching layer 120 and the piezoelectric layer 130 are in contact with each other. In other words, the fourth electrode 122 may be formed below the first matching layer 120. Therefore, the fourth electrode 122 is electrically connected to the first electrode 131 formed above the piezoelectric layer 130.

[0102] The third electrode 121 and the fourth electrode 122 can be formed into essentially the same electrode using the same method. Therefore, the third electrode 121 and the fourth electrode 122 can be electrically connected to each other.

[0103] A second electrode 132 formed beneath the piezoelectric layer 130 can be electrically connected to the circuit layer 150. The circuit layer 150 may include signal electrodes for receiving current, allowing an electrical signal to be applied to the circuit layer 150. A reflective layer 140 may be disposed between the piezoelectric layer 130 and the circuit layer 150. Because the reflective layer 140 is made of a conductive material, an electrical connection between the piezoelectric layer 130 and the circuit layer 150 can be achieved.

[0104] Therefore, the first electrode 131 and the second electrode 132 of the piezoelectric layer 130 can be electrically connected to each other.

[0105] Figure 5 This is a block diagram illustrating a method for manufacturing an ultrasonic probe according to an embodiment of the present disclosure.

[0106] In the following text, reference will be made to Figures 3 to 5A method for manufacturing an ultrasonic probe 100 according to an embodiment of the present disclosure is described.

[0107] In order to manufacture the ultrasonic probe 100 of this embodiment, a groove 123 is formed on the first matching layer 120 (step 510).

[0108] The number of grooves 123 can be set according to the row to be manufactured, corresponding to the number of cuts 133 to be formed. Therefore, one or more grooves 123 can be formed.

[0109] Subsequently, electrodes 121 and 122 are formed on the first matching layer 120 (step 520).

[0110] Specifically, electrodes 121 and 122 may be formed beneath the first matching layer 120. In other words, electrodes 121 and 122 may be formed on the lower surface of the first matching layer 120 and the inner surface of the groove 123. Electrodes 121 and 122 are formed using highly conductive metals such as gold, silver, and copper, and can be fabricated by sputtering. However, this disclosure is not limited thereto, and electrodes 121 and 122 may be fabricated by methods such as deposition, plating, and spraying. Furthermore, electrodes 121 and 122 may be formed simultaneously using the same formation method.

[0111] The electrode formed on the inner surface of the groove 123 of the first matching layer 120 can be a third electrode 121, and the electrode formed on the lower surface of the first matching layer 120 can be a fourth electrode 122. The lower surface of the first matching layer 120 refers to the surface where the first matching layer 120 and the piezoelectric layer 130 are in contact with each other.

[0112] The third electrode 121 can be electrically connected to the first electrode 131 of the piezoelectric layer 130. The fourth electrode 122 can be electrically connected to the first electrode 131 of the piezoelectric layer 130. That is, the third electrode 121 and the fourth electrode 122 can be electrically connected to each other. The third electrode 121 and the fourth electrode 122 are formed on the first matching layer 120 at the same time, so the third electrode 121 and the fourth electrode 122 can be configured as substantially the same electrode.

[0113] Subsequently, the piezoelectric layer 130 and the reflective layer 140 are bonded to the first matching layer 120 (step 530).

[0114] Specifically, the piezoelectric layer 130 can be bonded to the lower surface of the first matching layer 120, and the reflective layer 140 can be bonded to the lower surface of the piezoelectric layer 130.

[0115] Subsequently, the piezoelectric layer 130 and the reflective layer 140 are divided into multiple rows (step 540).

[0116] Specifically, cutouts 133 corresponding to the positions of grooves 123 are formed in the piezoelectric layer 130, such that the piezoelectric layer 130 is divided into multiple rows along the height direction E. The cutouts 133 can be formed by a process of cutting the piezoelectric layer 130 in the transverse direction L.

[0117] One or more grooves 123 and one or more slits 133 formed at their corresponding locations may be connected to each other. The width of the groove 123 may be greater than or equal to the width of the slit 133. Because the ultrasonic probe 100 is small, the third electrode 121 and the fourth electrode 122 formed on the first matching layer 120 may be cut together during the cutting of the piezoelectric layer 130 to form the slits 133. Therefore, by forming the width of the groove 123 as described above, damage to the third electrode 121 and the fourth electrode 122 of the first matching layer 120 during the cutting process can be prevented.

[0118] Subsequently, the circuit layer 150 and the sound-absorbing layer 160 are bonded to the reflective layer 140 (step 550).

[0119] Specifically, the circuit layer 150 can be bonded to the lower surface of the reflective layer 140 to be electrically connected to the second electrode 132 of the piezoelectric layer 130. Because the reflective layer 140 is made of a conductive material, the electrical connection between the second electrode 132 and the circuit layer 150 can be ensured. The circuit layer 150 can be configured as a flexible printed circuit board. Furthermore, the sound-absorbing layer 160 can be bonded to the lower surface of the circuit layer 150.

[0120] According to the manufacturing method of the ultrasonic probe 100 of this embodiment as described above, electrical connection can be easily achieved without using a conductive matching layer, thereby reducing manufacturing costs. Furthermore, conductive matching layers are typically made of carbon and may therefore be susceptible to external impacts, but by using a non-conductive matching layer, a probe resistant to external impacts can be produced.

[0121] In addition, because there is no need to use a separate printed circuit board to electrically connect the ground electrode of the piezoelectric layer 130, the performance of the ultrasonic probe 100 can be ensured even in high-frequency environments.

[0122] In addition, since the piezoelectric layer 130 is cut after the groove 123 and the electrode are formed on the first matching layer 120, an electrical connection method that is even applicable to multi-row probe structures can be provided.

[0123] Figure 6 This is a cross-sectional view of an ultrasonic probe according to another embodiment of the present disclosure, taken along the axial and height directions. Figure 7 yes Figure 6 A magnified view of a local area.

[0124] Reference Figure 6 and Figure 7The ultrasonic probe 300 includes a piezoelectric layer 330, a sound-absorbing layer 360 disposed below the piezoelectric layer 330, and matching layers 310 and 320 disposed above the piezoelectric layer 330.

[0125] The piezoelectric layer 330 can radiate mechanical vibration energy as ultrasonic waves in the direction in which the lens is provided and in the direction in which the sound-absorbing layer 360 is provided. In the following text, based on the piezoelectric layer 330, the direction in which the lens is provided is referred to as the front part, and the direction in which the sound-absorbing layer 360 is provided is referred to as the rear part.

[0126] The piezoelectric layer 330 can be processed into a multidimensional array in the form of a matrix with multiple rows through a cutting process.

[0127] A sound-absorbing layer 360 is disposed below the piezoelectric layer 330 and absorbs ultrasonic waves generated in the piezoelectric layer 330 and traveling backward, thereby blocking the ultrasonic waves from reaching the rear of the piezoelectric layer 330. Therefore, image distortion can be prevented.

[0128] The sound-absorbing layer 360 may have an acoustic impedance lower than that of the piezoelectric layer 330. For example, the sound-absorbing layer 360 may be made of a material with an acoustic impedance of 2 MRayl to 5 MRayl. The sound-absorbing layer 360 may be formed using a material including rubber with added epoxy resin, tungsten powder, etc. In addition, the sound-absorbing layer 360 may be formed using multiple layers to improve the attenuation or blocking effect of ultrasonic waves.

[0129] Matching layers 310 and 320 are disposed above the piezoelectric layer 330. Matching layers 310 and 320 may include a first matching layer 320 and a second matching layer 310 with different materials. In this embodiment, matching layers 310 and 320 may be made of non-conductive materials.

[0130] A second matching layer 310 may be disposed above the first matching layer 320. The first matching layer 320 and the second matching layer 310 can reduce the loss of ultrasonic waves transmitted to or received from the object by appropriately matching the acoustic impedance of the piezoelectric layer 330 with that of the object. The acoustic impedance of the object and the piezoelectric layer 330 can be matched by adjusting the physical parameters (such as sound velocity, thickness, and acoustic impedance) of the first matching layer 320 and the second matching layer 310. That is, the first matching layer 320 and the second matching layer 310 can suppress the reflection of ultrasonic waves caused by the difference between the acoustic impedance of the object and the acoustic impedance of the piezoelectric layer 330.

[0131] The ultrasonic probe 300 may include a circuit layer 350 and a reflective layer 340.

[0132] The circuit layer 350 may be disposed below the piezoelectric layer 330. The circuit layer 350 may be formed using a flexible printed circuit board (FPCB).

[0133] A reflective layer 340 (reinforcement layer) may be disposed below the piezoelectric layer 330. Specifically, the reflective layer 340 may be disposed between the piezoelectric layer 330 and the circuit layer 350. The reflective layer 340 may reflect and scatter ultrasonic waves generated in the piezoelectric layer 330 and may be conductive. Therefore, the reflective layer 340 may reflect ultrasonic waves radiated to the rear of the piezoelectric layer 330 to the front. The reflective layer 340 can be used in broadband environments. However, this disclosure is not limited thereto, and the reflective layer 340 may be disposed at different locations.

[0134] The piezoelectric layer 330 includes a first electrode 331 and a second electrode 332. According to this embodiment, the first electrode 331 is formed on one side of the piezoelectric body, and the second electrode 332 is formed on the other side of the piezoelectric body. That is, the first electrode 331 is formed on the upper side of the piezoelectric body, and the second electrode 332 is formed on the lower side of the piezoelectric body. The first electrode 331 and the second electrode 332 can be formed using highly conductive metals such as gold, silver, and copper.

[0135] One electrode formed on one side and the other side of the piezoelectric layer 330 corresponds to the anode (or signal electrode) of the piezoelectric layer 330, and the other electrode corresponds to the cathode (or ground electrode) of the piezoelectric layer 330. The one electrode and the other electrode are formed such that the anode and cathode are separated from each other. This embodiment illustrates that a first electrode 331 formed on one side of the piezoelectric layer 330 corresponds to the cathode, and a second electrode 332 formed on the other side of the piezoelectric layer 330 corresponds to the anode.

[0136] The electrodes (i.e., anode and cathode) disposed on the piezoelectric layer 330 can have various shapes; for example, at least one of the anode and cathode can be configured as a circular electrode.

[0137] The piezoelectric layer 330 includes one or more cuts 333. One or more cuts 333 can be formed when the piezoelectric layer 330 is cut in the lateral direction L. Because one or more cuts 333 are formed on the piezoelectric layer 330, the piezoelectric elements of the piezoelectric layer 330 can be arranged in multiple rows along the height direction E. One or more cuts 333 formed in the piezoelectric layer 330 can be continuously formed in the reflective layer 340 along the axial direction A.

[0138] The difference between the ultrasound probe 100 according to an embodiment of the present disclosure and the ultrasound probe 300 according to another embodiment is that the first matching layer 320 and the second matching layer 310 include a third electrode 321, and the first matching layer 320 includes a fourth electrode 322. That is, the third electrode 321 may also be formed on the second matching layer 310.

[0139] The third electrode 321 and the fourth electrode 322 formed on the first matching layer 320 and the second matching layer 310 can be electrically connected to the piezoelectric layer 330. Specifically, the third electrode 321 and the fourth electrode 322 can be electrically connected to the first electrode 331 of the piezoelectric layer 330.

[0140] The first matching layer 320 and the second matching layer 310 include one or more grooves 323. The one or more grooves 323 are connected to one or more cuts 333 formed in the piezoelectric layer 330. That is, one or more grooves 323 may be formed at corresponding positions and in corresponding numbers to the one or more cuts 333.

[0141] The third electrode 321 may be formed on the inner surface of one or more grooves 323 to be electrically connected to the first electrode 331 of the piezoelectric layer 330.

[0142] The width of one or more grooves 323 may be greater than or equal to the width of one or more slits 333. Therefore, when slits 333 are formed on the piezoelectric layer 330 by a cutting process, damage to the third electrode 321 formed on the grooves 323 can be prevented. Details regarding the manufacturing method of the ultrasonic probe 300 will be described later.

[0143] Unlike the ultrasonic probe 100 according to an embodiment of the present disclosure, the depth of one or more grooves 323 may be formed to be greater than the thickness of the first matching layer 320 and less than the combined thickness of the first matching layer 320 and the second matching layer 310.

[0144] A fourth electrode 322 is formed on one surface of the first matching layer 320. Specifically, the fourth electrode 322 is formed on one surface where the first matching layer 320 and the piezoelectric layer 330 are in contact with each other. In other words, the fourth electrode 322 may be formed below the first matching layer 320. Therefore, the fourth electrode 322 is electrically connected to the first electrode 331 formed above the piezoelectric layer 330.

[0145] The third electrode 321 and the fourth electrode 322 can be formed into essentially the same electrode using the same method. Therefore, the third electrode 321 and the fourth electrode 322 can be electrically connected to each other.

[0146] Figure 1 and Figure 2 An ultrasound probe 100 according to an embodiment of the present disclosure is shown disposed in an ultrasound imaging device, but the above description of the ultrasound probe 100 may also be applied to an ultrasound probe 300 according to another embodiment of the present disclosure.

[0147] Figure 8 This is a block diagram illustrating a method for manufacturing an ultrasonic probe according to another embodiment of the present disclosure.

[0148] In the following text, reference will be made to Figures 6 to 8 A method for manufacturing an ultrasonic probe 300 according to another embodiment of the present disclosure is described.

[0149] In order to manufacture the ultrasonic probe 300 of this embodiment, a groove 323 is formed on the first matching layer 320 and the second matching layer 310 (step 610).

[0150] The number of grooves 323 can be set according to the row to be manufactured, corresponding to the number of cuts 333 to be formed. Therefore, one or more grooves 323 can be formed.

[0151] Subsequently, electrodes 321 and 322 are formed on the first matching layer 320 and the second matching layer 310 (step 620).

[0152] Specifically, electrodes 321 and 322 may be formed beneath the first matching layer 320. In other words, electrodes 321 and 322 may be formed on the lower surface of the first matching layer 320 and the inner surface of the groove 323. Electrodes 321 and 322 are formed using highly conductive metals such as gold, silver, and copper, and can be fabricated by sputtering. However, this disclosure is not limited thereto, and electrodes 321 and 322 may be fabricated by methods such as deposition, plating, and spraying.

[0153] The electrode formed on the inner surface of the groove 323 in the first matching layer 320 and the second matching layer 310 can be a third electrode 321, and the electrode formed on the lower surface of the first matching layer 320 can be a fourth electrode 322. The lower surface of the first matching layer 320 refers to the surface where the first matching layer 320 and the piezoelectric layer 330 are in contact with each other.

[0154] The third electrode 321 can be electrically connected to the first electrode 331 of the piezoelectric layer 330. The fourth electrode 322 can be electrically connected to the first electrode 331 of the piezoelectric layer 330. That is, the third electrode 321 and the fourth electrode 322 can be electrically connected to each other. The third electrode 321 is formed on the first matching layer 320 and the second matching layer 310, while the fourth electrode 322 is formed on the first matching layer 320, such that the third electrode 321 and the fourth electrode 322 can be configured as substantially the same electrode.

[0155] Subsequently, the piezoelectric layer 330 and the reflective layer 340 are bonded to the first matching layer 320 (step 630).

[0156] Specifically, the piezoelectric layer 330 can be bonded to the lower surface of the first matching layer 320, and the reflective layer 340 can be bonded to the lower surface of the piezoelectric layer 330.

[0157] Subsequently, the piezoelectric layer 330 and the reflective layer 340 are divided into multiple rows (step 640).

[0158] Specifically, a notch 333 corresponding to the position of the groove 323 is formed on the piezoelectric layer 330, such that the piezoelectric layer 330 is divided into multiple rows along the height direction E. The notch 333 can be formed by a process of cutting the piezoelectric layer 330 in the transverse direction L.

[0159] One or more grooves 323 and one or more slits 333 formed at their corresponding positions may be connected to each other. The width of the groove 323 may be greater than or equal to the width of the slit 333. Because the ultrasonic probe 300 is small, the third electrode 321 and the fourth electrode 322 formed on the first matching layer 320 may be cut together during the cutting of the piezoelectric layer 330 to form the slits 333. Therefore, by forming the width of the groove 323 as described above, damage to the third electrode 321 and the fourth electrode 322 of the first matching layer 320 during the cutting process can be prevented.

[0160] Subsequently, the circuit layer 350 and the sound-absorbing layer 360 are bonded to the reflective layer 340 (step 650).

[0161] Specifically, the circuit layer 350 can be bonded to the lower surface of the reflective layer 340 to be electrically connected to the second electrode 332 of the piezoelectric layer 330. Because the reflective layer 340 is made of a conductive material, the electrical connection between the second electrode 332 and the circuit layer 350 can be ensured. The circuit layer 350 can be configured as a flexible printed circuit board. Furthermore, the sound-absorbing layer 360 can be bonded to the lower surface of the circuit layer 350.

[0162] According to the manufacturing method of the ultrasonic probe 300 of this embodiment as described above, electrical connection can be easily achieved without using a conductive matching layer, thereby reducing manufacturing costs. Furthermore, conductive matching layers are typically made of carbon and may therefore be susceptible to external impacts, but by using a non-conductive matching layer, a probe resistant to external impacts can be produced.

[0163] In addition, because there is no need to use a separate printed circuit board to electrically connect the ground electrode of the piezoelectric layer 330, the performance of the ultrasonic probe 300 can be ensured even in high-frequency environments.

[0164] Furthermore, since the piezoelectric layer 330 is cut after the grooves 323 and electrodes 321 and 322 are formed on the first matching layer 320 and the second matching layer 310, an electrical connection method applicable even to multi-row probe structures can be provided.

[0165] Figure 9 This is a cross-sectional view of an ultrasonic probe according to another embodiment of the present disclosure, taken along the axial and height directions. Figure 10 yes Figure 9 A magnified view of a local area.

[0166] Reference Figure 9 and Figure 10 The ultrasonic probe 400 includes a piezoelectric layer 430, a sound-absorbing layer 460 disposed below the piezoelectric layer 430, and matching layers 410 and 420 disposed above the piezoelectric layer 430.

[0167] The piezoelectric layer 430 can radiate mechanical vibration energy as ultrasonic waves in the direction in which the lens is provided and in the direction in which the sound-absorbing layer 460 is provided. In the following text, based on the piezoelectric layer 430, the direction in which the lens is provided is referred to as the front part, and the direction in which the sound-absorbing layer 460 is provided is referred to as the rear part.

[0168] The piezoelectric layer 430 can be processed into a multidimensional array in the form of a matrix with multiple rows through a cutting process.

[0169] The sound-absorbing layer 460 is disposed below the piezoelectric layer 430 and absorbs the ultrasonic waves generated in the piezoelectric layer 430 and traveling backward, thereby blocking the ultrasonic waves from traveling to the rear of the piezoelectric layer 430. Therefore, image distortion can be prevented.

[0170] The sound-absorbing layer 460 may have an acoustic impedance lower than that of the piezoelectric layer 430. For example, the sound-absorbing layer 460 may be made of a material with an acoustic impedance of 2 MRayl to 5 MRayl. The sound-absorbing layer 460 may be formed using a material including rubber with added epoxy resin, tungsten powder, etc. In addition, the sound-absorbing layer 460 may be formed using multiple layers to improve the attenuation or blocking effect of ultrasonic waves.

[0171] Matching layers 410 and 420 are disposed above the piezoelectric layer 430. Matching layers 410 and 420 may include a first matching layer 420 and a second matching layer 410 with different materials. In this embodiment, matching layers 410 and 420 may be made of non-conductive materials.

[0172] A second matching layer 410 may be disposed above the first matching layer 420. The first matching layer 420 and the second matching layer 410 can reduce the loss of ultrasonic waves transmitted to or received from the object by appropriately matching the acoustic impedance of the piezoelectric layer 430 with that of the object. The acoustic impedance of the object and the piezoelectric layer 430 can be matched by adjusting the physical parameters (such as sound velocity, thickness, and acoustic impedance) of the first matching layer 420 and the second matching layer 410. That is, the first matching layer 420 and the second matching layer 410 can suppress the reflection of ultrasonic waves caused by the difference between the acoustic impedance of the object and the acoustic impedance of the piezoelectric layer 430.

[0173] The ultrasonic probe 400 may include a circuit layer 450 and a reflective layer 440.

[0174] The circuit layer 450 may be disposed below the piezoelectric layer 430. The circuit layer 450 may be formed using a flexible printed circuit board (FPCB).

[0175] A reflective layer 440 (reinforcement layer) may be disposed below the piezoelectric layer 430. Specifically, the reflective layer 440 may be disposed between the piezoelectric layer 430 and the circuit layer 450. The reflective layer 440 may reflect and scatter ultrasonic waves generated in the piezoelectric layer 430 and may be conductive. Therefore, the reflective layer 440 may reflect ultrasonic waves radiated to the rear of the piezoelectric layer 430 to the front. The reflective layer 440 can be used in broadband environments. However, this disclosure is not limited thereto, and the reflective layer 440 may be disposed at different locations.

[0176] The piezoelectric layer 430 includes a first electrode 431 and a second electrode 432. According to this embodiment, the first electrode 431 is formed on one side of the piezoelectric body, and the second electrode 432 is formed on the other side of the piezoelectric body. That is, the first electrode 431 is formed on the upper side of the piezoelectric body, and the second electrode 432 is formed on the lower side of the piezoelectric body. The first electrode 431 and the second electrode 432 can be formed using highly conductive metals such as gold, silver, and copper.

[0177] One electrode formed on one side and the other side of the piezoelectric layer 430 corresponds to the anode (or signal electrode) of the piezoelectric layer 430, and the other electrode corresponds to the cathode (or ground electrode) of the piezoelectric layer 430. The one electrode and the other electrode are formed such that the anode and cathode are separated from each other. This embodiment illustrates that a first electrode 431 formed on one side of the piezoelectric layer 430 corresponds to the cathode, and a second electrode 432 formed on the other side of the piezoelectric layer 430 corresponds to the anode.

[0178] The electrodes (i.e., anode and cathode) disposed on the piezoelectric layer 430 can have various shapes; for example, at least one of the anode and cathode can be configured as a circular electrode.

[0179] The piezoelectric layer 430 includes one or more cuts 433. One or more cuts 433 can be formed when the piezoelectric layer 430 is cut in the lateral direction L. Because one or more cuts 433 are formed in the piezoelectric layer 430, the piezoelectric elements of the piezoelectric layer 430 can be arranged in multiple rows along the height direction E. One or more cuts 433 formed in the piezoelectric layer 430 can be continuously formed in the reflective layer 440 along the axial direction A.

[0180] In another embodiment of the ultrasonic probe 400 according to the present disclosure, the third electrode 421 is formed by filling the groove 423 formed on the first matching layer 420 with a conductive material.

[0181] The third electrode 421 formed on the groove 423 of the first matching layer 420 and the fourth electrode 422 formed on the lower surface of the first matching layer 420 can be electrically connected to the piezoelectric layer 430. Specifically, the third electrode 421 and the fourth electrode 422 can be electrically connected to the first electrode 431 of the piezoelectric layer 430.

[0182] The first matching layer 420 includes one or more grooves 423. The one or more grooves 423 are connected to one or more cuts 433 formed in the piezoelectric layer 430. That is, one or more grooves 423 may be formed at corresponding positions and in corresponding numbers to the one or more cuts 433.

[0183] The third electrode 421 can be formed by filling one or more grooves 423 with a conductive material. The third electrode 421 can be electrically connected to the first electrode 431 of the piezoelectric layer 430.

[0184] The width of one or more grooves 423 may be greater than or equal to the width of one or more slits 433. Therefore, when slits 433 are formed on the piezoelectric layer 430 by a cutting process, damage to the third electrode 421 formed on the grooves 423 and disconnection of the electrical connection can be prevented. Details regarding the manufacturing method of the ultrasonic probe 400 will be described later.

[0185] The depth of one or more grooves 423 may be formed to be less than or equal to the thickness of the first matching layer 420.

[0186] Figure 9 and Figure 10 It is shown that the groove 423 is formed only on the first mating layer 420. However, this disclosure is not limited thereto, and the depth of one or more grooves 423 may be formed to be greater than the thickness of the first mating layer 420 and less than the combined thickness of the first mating layer 420 and the second mating layer 410. That is, the groove 423 may also be formed on the second mating layer 410.

[0187] A fourth electrode 422 is formed on one surface of the first matching layer 420. Specifically, the fourth electrode 422 is formed on one surface where the first matching layer 420 and the piezoelectric layer 430 are in contact with each other. In other words, the fourth electrode 422 may be formed below the first matching layer 420. Therefore, the fourth electrode 422 is electrically connected to the first electrode 431 formed above the piezoelectric layer 430.

[0188] The third electrode 421 and the fourth electrode 422 can also be electrically connected to each other.

[0189] In another embodiment of the ultrasonic probe 400 according to the present disclosure, because electrodes are formed by filling the groove 423 with conductive material, a wider area can be ensured to be electrically connected to the piezoelectric layer 430.

[0190] Figure 1 and Figure 2An ultrasound probe 100 according to an embodiment of the present disclosure is shown disposed in an ultrasound imaging device, but the above description of the ultrasound probe 100 may also be applied to an ultrasound probe 400 according to another embodiment of the present disclosure.

[0191] Figure 11 This is a block diagram illustrating a method for manufacturing an ultrasonic probe according to another embodiment of the present disclosure.

[0192] In the following text, reference will be made to Figures 9 to 11 A method for manufacturing an ultrasonic probe 400 according to another embodiment of the present disclosure is described.

[0193] In order to manufacture the ultrasonic probe 400 of this embodiment, a groove 423 is formed on the first matching layer 420 (step 710).

[0194] The grooves 423 can be set in a number corresponding to the cuts 433 to be formed, depending on the row to be manufactured. Therefore, one or more grooves 423 can be formed.

[0195] Subsequently, electrodes are formed on the first matching layer 420 (step 720).

[0196] Specifically, the electrode may be formed beneath the first matching layer 420. In other words, the electrode may be formed on the lower surface of the first matching layer 420. The electrode is formed using a highly conductive metal such as gold, silver, and copper, and can be fabricated by sputtering. However, this disclosure is not limited thereto, and the electrode can be fabricated by methods such as deposition, plating, and spraying.

[0197] Subsequently, conductive material is filled into the groove 423 of the first matching layer 420 (step 730).

[0198] The conductive material filling the groove 423 of the first matching layer 420 can be a third electrode 421, and the electrode formed on the lower surface of the first matching layer 420 can be a fourth electrode 422. The lower surface of the first matching layer 420 refers to the surface where the first matching layer 420 and the piezoelectric layer 430 are in contact with each other.

[0199] Therefore, the third electrode 421 and the fourth electrode 422 of the ultrasonic probe 400 according to this embodiment can be formed in different ways.

[0200] The third electrode 421 can be electrically connected to the first electrode 431 of the piezoelectric layer 430. The fourth electrode 422 can be electrically connected to the first electrode 431 of the piezoelectric layer 430. That is, the third electrode 421 and the fourth electrode 422 can be electrically connected to each other.

[0201] Subsequently, the piezoelectric layer 430 and the reflective layer 440 are bonded to the first matching layer 420 (step 740).

[0202] Specifically, the piezoelectric layer 430 can be bonded to the lower surface of the first matching layer 420, and the reflective layer 440 can be bonded to the lower surface of the piezoelectric layer 430.

[0203] Subsequently, the piezoelectric layer 430 and the reflective layer 440 are divided into multiple rows (step 750).

[0204] Specifically, a cut 433 corresponding to the position of the groove 423 is formed on the piezoelectric layer 430, such that the piezoelectric layer 430 is divided into multiple rows along the height direction E. The cut 433 can be formed by a process of cutting the piezoelectric layer 430 in the transverse direction L.

[0205] One or more grooves 423 and one or more slits 433 formed at their corresponding positions may be connected to each other. The width of the groove 423 may be greater than or equal to the width of the slit 433. Because the ultrasonic probe 400 is small, the third electrode 421 and the fourth electrode 422 formed on the first matching layer 420 may be cut together during the cutting of the piezoelectric layer 430 to form the slits 433. Therefore, by forming the width of the groove 423 as described above, damage to the third electrode 421 and the fourth electrode 422 of the first matching layer 420 during the cutting process can be prevented.

[0206] However, according to another embodiment of the manufacturing method of the ultrasonic probe 400 of this disclosure, since the third electrode 421 is formed by filling the groove 423 with conductive material, the electrical connection with the piezoelectric layer 430 can be more reliably ensured even if a part of the third electrode 421 is damaged by the above-described cutting process.

[0207] Subsequently, the circuit layer 450 and the sound-absorbing layer 460 are bonded to the reflective layer 440 (step 760).

[0208] Specifically, the circuit layer 450 can be bonded to the lower surface of the reflective layer 440 to be electrically connected to the second electrode 432 of the piezoelectric layer 430. Because the reflective layer 440 is made of a conductive material, the electrical connection between the second electrode 432 and the circuit layer 450 can be ensured. The circuit layer 450 can be configured as a flexible printed circuit board. Furthermore, the sound-absorbing layer 460 can be bonded to the lower surface of the circuit layer 450.

[0209] According to the manufacturing method of the ultrasonic probe 400 of this embodiment as described above, electrical connection can be easily achieved without using a conductive matching layer, thereby reducing manufacturing costs. Furthermore, conductive matching layers are typically made of carbon and may therefore be susceptible to external impacts, but a probe resistant to external impacts can be produced by using a non-conductive matching layer.

[0210] In addition, because there is no need to use a separate printed circuit board to electrically connect the ground electrode of the piezoelectric layer 430, the performance of the ultrasonic probe 400 can be ensured even in high-frequency environments.

[0211] In addition, since the piezoelectric layer 430 is cut after the groove 423 and the electrode are formed on the first matching layer 420, an electrical connection method that is even applicable to multi-row probe structures can be provided.

[0212] Figures 9 to 11 The third electrode 421 is shown to be formed by filling the groove 423 formed in the first matching layer 420 with a conductive material. However, the present disclosure is not limited thereto, and the third electrode 421 can also be formed by filling the groove 423 formed in both the first matching layer 420 and the second matching layer 410 with a conductive material.

[0213] As can be clearly seen above, the electrodes are formed on a matching layer that acts as a thin film, enabling accurate transmission of signals from the ultrasonic probe even in high-frequency environments.

[0214] In addition, grooves are formed inside the matching layer to prevent damage to the electrodes of the matching layer during the cutting process of the multi-row probe.

[0215] Furthermore, the manufacturing cost of ultrasound probes can be reduced by using a common non-conductive matching layer.

[0216] Specific embodiments have been described and illustrated above. However, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and various changes and modifications can be made without departing from the technical concept of this disclosure as described in the appended claims.

Claims

1. An ultrasonic probe, comprising: A piezoelectric layer, including one or more cutouts, such that piezoelectric elements are arranged in multiple rows along the height direction; The first electrode is formed on the upper side of the piezoelectric layer; A second electrode is formed on the lower side of the piezoelectric layer; A matching layer is disposed above the piezoelectric layer and includes one or more grooves connected to the one or more cutouts; as well as A third electrode is formed on the inner surface of one or more of the grooves and is electrically connected to the first electrode. The groove is wider than the cut, such that the separation distance of the third electrode in the groove in the height direction is greater than the width of the cut.

2. The ultrasonic probe according to claim 1, wherein, The third electrode is formed by sputtering.

3. The ultrasonic probe according to claim 1, further comprising: A fourth electrode is formed on a surface of the matching layer that is in contact with the piezoelectric layer to be electrically connected to the first electrode.

4. The ultrasonic probe according to claim 3, wherein, The third electrode and the fourth electrode are electrically connected to each other.

5. The ultrasonic probe according to claim 3, wherein, The third electrode and the fourth electrode are formed simultaneously by sputtering.

6. The ultrasonic probe according to claim 1, further comprising: The circuit layer is disposed below the piezoelectric layer.

7. The ultrasonic probe according to claim 6, wherein, The circuit layer is made using a flexible printed circuit board to be electrically connected to the second electrode.

8. The ultrasonic probe according to claim 6, wherein, The cuts formed in the piezoelectric layer are continuously formed in the reflective layer.

9. The ultrasonic probe according to claim 8, wherein, Each of the cuts is formed in the same location in the height direction, with one portion in the piezoelectric layer and another portion in the reflective layer.

10. The ultrasonic probe according to claim 1, wherein, The depth of the one or more grooves is formed to be less than the thickness of the matching layer.

11. The ultrasonic probe according to claim 1, wherein, The matching layer is the first matching layer, and The ultrasound probe also includes a second matching layer disposed above the first matching layer.

12. The ultrasonic probe according to claim 11, wherein, The depth of the one or more grooves is formed to be greater than the thickness of the first matching layer and less than the combined thickness of the first matching layer and the second matching layer.

13. The ultrasonic probe according to claim 1, wherein, The first electrode is a ground electrode, and the second electrode is a signal electrode.

14. The ultrasonic probe according to claim 1, wherein, The matching layer is made of a non-conductive material.

15. An ultrasonic probe, comprising: A piezoelectric layer, including one or more cutouts, such that piezoelectric elements are arranged in multiple rows along the height direction; The first electrode is formed on the upper side of the piezoelectric layer; A second electrode is formed on the lower side of the piezoelectric layer; A matching layer is disposed above the piezoelectric layer and includes one or more grooves connected to the one or more cutouts; as well as The third electrode is made of a conductive material filled in one or more of the grooves and is electrically connected to the first electrode. The groove is wider than the cut, such that the separation distance of the third electrode in the groove in the height direction is greater than the width of the cut.

16. The ultrasonic probe of claim 15, further comprising a fourth electrode formed on a surface of the matching layer in contact with the piezoelectric layer to be electrically connected to the first electrode, wherein, The fourth electrode is electrically connected to the third electrode.

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