A photoelectric semiconductor display panel resistant to bending

Abstract

The present invention relates to the technical field of display screens, and in particular to a bend-resistant optoelectronic semiconductor display panel, which includes a circuit substrate, a plurality of curing colloids, and a plurality of luminous bodies arranged on the circuit substrate, wherein the circuit substrate has a conductive circuit, a plurality of conductive contacts, and a first surface and a second surface opposite to each other, wherein the conductive circuit is arranged on the first surface and connected to the conductive contacts, and the conductive contacts are arranged on the first surface and connected to the electrode contacts of the luminous bodies; the curing colloid connects the first surface and the luminous bodies; the first surface faces the light-emitting direction of the plurality of luminous bodies and is concave-convex, so that the optoelectronic semiconductor display panel has a plurality of first blocks and a plurality of second blocks, wherein the first block includes a bearing area of ​​the circuit substrate bearing the luminous bodies, the corresponding luminous bodies, and the corresponding curing colloid, wherein the thickness of the first block is greater than the thickness of the second block, and the first block is located between two adjacent second blocks. The optoelectronic semiconductor display panel is bend-resistant, and the problem of its quality being easily damaged when being bent is solved.

Description

Technical Field

[0001] The invention relates to the technical field of display screens, and in particular to a photoelectric semiconductor display panel that is resistant to bending. Background Art

[0002] Light Emitting Diode (LED) is a photoelectric semiconductor component, which is mostly used as indicator light, display LED board, etc. With the promotion and use of display LED board, i.e. photoelectric semiconductor display board in people's daily life, the application occasions of photoelectric semiconductor display board are increasing, and the requirements for the shape or form change of photoelectric semiconductor display board are getting higher and higher.

[0003] When using an optoelectronic semiconductor display panel, it is often necessary to be bent according to the needs. However, the existing optoelectronic semiconductor display panel is a flat panel. When it is bent, it is easy to bend and stretch at the location of the LED package, causing the connection between the electrode of the LED package and the conductive contact of the wire circuit on the substrate to loosen and break, and the package to be damaged, resulting in the quality of the optoelectronic semiconductor display panel being damaged, thereby limiting its application. Therefore, how to solve this problem is a technical difficulty that the industry urgently needs to solve.

[0004] The Chinese utility model patent with application number CN202020643018.4 and authorization announcement date of November 3, 2020 discloses an LED display unit with splicable LED display screens, which includes an LED display unit body, and the two sides of the back of the LED display unit body are slidably connected with card blocks, two card blocks are provided, and the sides close to the two card blocks are respectively provided with push rods, and two push rods are provided, and the two push rods are respectively inserted in the cavity at one end of the sleeve rod, and a spring is connected between the push rod and the sleeve rod, and the sleeve rod is provided with two sleeve rods, and the two ends of the push-pull rod are respectively inserted in the cavity close to one end of the two sleeve rods, and the push-pull rod and the sleeve rod are threadedly connected. The main body of the LED display unit can be conveniently spliced ​​and fixed on the back frame, and the spacing of the card blocks is adjustable, which can be fixed on the back frame of different sizes, and the installation is more flexible and convenient. This utility model solves the problem of the convenience of installing the LED display unit on the back plate, but does not solve the problem that the quality of the optoelectronic semiconductor display is easily damaged during the bending process. Summary of the invention

[0005] In order to solve the problem of quality damage of the existing optoelectronic semiconductor display panel when being bent mentioned in the background technology, the present invention provides an optoelectronic semiconductor display panel that is resistant to bending, which includes a circuit substrate, a plurality of curing colloids and a plurality of light-emitting bodies arranged on the circuit substrate, the circuit substrate has a conductive circuit, a plurality of conductive contacts and a first surface and a second surface opposite to each other, the conductive circuit is arranged on the first surface and connected to the conductive contacts, the conductive contacts are arranged on the first surface and connected to the electrode contacts of the light-emitting bodies; the curing colloid connects the first surface and the light-emitting bodies;

[0006] The first surface faces the light emitting direction of the plurality of light emitting bodies and is concave-convex, so that the optoelectronic semiconductor display panel has a plurality of first blocks and a plurality of second blocks, the first block includes a supporting area of ​​the circuit substrate supporting the light emitting bodies, the corresponding light emitting bodies and the corresponding curing colloid, the thickness of the first block is greater than the thickness of the second block, and the first block is located between two adjacent second blocks.

[0007] Furthermore, the second surface is planar, the first surface forms a plurality of protrusions, the bearing area of ​​the first block is the protrusions, and the plurality of light-emitting bodies are respectively distributed on the plurality of protrusions; the number of the plurality of conductive contacts and the plurality of solidifying colloids are adapted to the number of the plurality of light-emitting bodies, the conductive contacts are arranged on the protrusions and connected to the electrode contacts of the light-emitting bodies; the solidifying colloid connects the protrusions and the light-emitting bodies.

[0008] Furthermore, the second surface is concave-convex following the concave-convex shape of the first surface, a plurality of depressions are formed on the first surface, the bearing area of ​​the first block is the depressions, and the plurality of light-emitting bodies are respectively distributed in the depressions; the number of the plurality of conductive contacts and the plurality of solidifying colloids are adapted to the number of the plurality of light-emitting bodies, the conductive contacts are arranged in the depressions and connected to the electrode contacts of the light-emitting bodies; the solidifying colloid connects the depressions and the light-emitting bodies.

[0009] Furthermore, the upper surface of the solidified colloid faces the light emitting direction of the light emitting body, and the upper surface of the solidified colloid is flush with the light emitting surface of the light emitting body.

[0010] Furthermore, the plurality of light-emitting bodies are arranged in a rectangular array on the circuit substrate to form a plurality of parallel rows of light-emitting bodies; the recesses are strip-shaped, and the plurality of rows of light-emitting bodies are respectively distributed in the plurality of recesses.

[0011] Furthermore, the recess is a quadrangular pyramid structure; the bottom surface of the recess supports the light-emitting body, and the area of ​​the opening of the recess is larger than the area of ​​the bottom surface, and the plane where the opening of the recess is located is parallel to the bottom surface.

[0012] Furthermore, two cross sections of the depression cut along the width and length directions of the circuit substrate are both isosceles trapezoids, and the angle θ between the waist and the lower base of the isosceles trapezoid is 1 The angle is 120°.

[0013] Furthermore, the upper surface of the solidified colloid faces the light emitting direction of the light emitting body, and the upper surface of the solidified colloid is not higher than the light emitting surface of the light emitting body.

[0014] Furthermore, the plurality of light-emitting bodies are arranged in a rectangular array on the circuit substrate to form a plurality of parallel rows of light-emitting bodies; the protrusions are strip-shaped, and the plurality of rows of light-emitting bodies are respectively distributed on the plurality of protrusions.

[0015] Furthermore, the protrusion is a quadrangular pyramid structure; the top surface of the protrusion supports the light-emitting body, and the area of ​​the top surface of the protrusion is smaller than the area of ​​the bottom of the protrusion, and the top surface of the protrusion is parallel to the plane where the bottom is located.

[0016] The bending-resistant optoelectronic semiconductor display panel provided by the present invention has the following beneficial effects compared with the prior art:

[0017] The optoelectronic semiconductor display board is resistant to bending, which prevents the connection between the electrode contact and the conductive contact of the light-emitting body from becoming loose or broken due to bending of the display board, thereby solving the problem that the quality of the optoelectronic semiconductor display board is easily damaged when being bent. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the bending-resistant optoelectronic semiconductor display panel of Example 1;

[0020] Figure 2 for Figure 1 AA section view;

[0021] Figure 3 is a schematic diagram of the three-dimensional structure of the bending-resistant optoelectronic semiconductor display panel of Example 2;

[0022] Figure 4 For Figure 3 BB cross-section diagram;

[0023] Figure 5 is a schematic diagram of the three-dimensional structure of the bending-resistant optoelectronic semiconductor display panel of Example 3;

[0024] Figure 6 for Figure 5 CC profile of ;

[0025] Figure 7 is a schematic diagram of the three-dimensional structure of the bending-resistant optoelectronic semiconductor display panel of Example 4;

[0026] Figure 8 for Figure 7 DD cross-section diagram.

[0027] Reference numerals:

[0028] 100 Circuit board 200 Light emitter 300 Curing colloid

[0029] 400 conductive line 500 first block 600 second block

[0030] 210 electrode contact 410 conductive contact 111 bearing area

[0031] 110 first surface 120 second surface 111a protrusion

[0032] 111b Recess 220 Light emitter row DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0035] The present invention provides Figure 1-2 Embodiment 1, as Figure 3-4 Embodiment 2, Figure 5-6 Example 3 and Figure 7-8 The bending-resistant optoelectronic semiconductor display panel shown in Example 4 includes a circuit substrate 100, a plurality of curing colloids 300, and a plurality of luminous bodies 200 disposed on the circuit substrate 100. The circuit substrate 100 has a conductive circuit 400, a plurality of conductive contacts 410, and a first surface 110 and a second surface 120 opposite to each other. The conductive circuit 400 is disposed on the first surface 110 and connected to the conductive contacts 410. The conductive contacts 410 are disposed on the first surface 110 and connected to the electrode contacts 210 of the luminous bodies 200. The curing colloid 300 The first surface 110 and the light emitting body 200 are connected; the first surface 110 faces the light emitting direction of the plurality of light emitting bodies 200 and is concave-convex, so that the optoelectronic semiconductor display panel has a plurality of first blocks 500 and a plurality of second blocks 600, the first block 500 includes a supporting area 111 of a circuit substrate 100 supporting the light emitting body 200, the corresponding light emitting body 200 and the corresponding curing colloid 300, the thickness of the first block 500 is greater than the thickness of the second block 600, and the first block 500 is located between two adjacent second blocks 600.

[0036] The first surface 110 of the circuit substrate 100 is provided with a conductive circuit 400 and a plurality of conductive contacts 410 connected to the conductive circuit 400. A plurality of light-emitting bodies 200 are distributed, preferably in a matrix distribution, and fixedly arranged on the circuit substrate 100, and the electrode contacts 210 of the plurality of light-emitting bodies 200 are respectively electrically connected to the plurality of conductive contacts 410. The electrical connection method between the electrode contacts 210 of the light-emitting body 200 and the conductive contacts 410 is, for example, reflow soldering. An external control system is electrically connected to the conductive circuit 400 for controlling the light emission of the plurality of light-emitting bodies 200 so that the optoelectronic semiconductor display panel emits light and displays patterns. The light-emitting body 200 is, for example, an LED chip or an LED chip package; the circuit substrate 100 is light-transmissive and bendable, and its base material is, for example, transparent and bendable polyimide, polyethylene terephthalate, polycarbonate, glass, etc. The conductive circuit 400 can be provided on the first surface 110 of the circuit substrate 100 by, but not limited to, printing a conductive paste and then curing it; the curing colloid 300 connects the first surface 110 of the circuit substrate 100 and the light-emitting body 200 by, but not limited to, curing after dispensing, so as to strengthen and fix the light-emitting body 200 on the first surface 110, and the material of the curing colloid 300 can be, but not limited to, one of epoxy resin, polyurethane, and silicone.

[0037] By setting the first surface 110 of the circuit substrate 100 to face the light emitting direction of the plurality of light emitting bodies 200 and to be concave-convex, the optoelectronic semiconductor display panel has a plurality of first blocks 500 and a plurality of second blocks 600; since the thickness of the first block 500 located between two adjacent second blocks 600 is greater than the thickness of the second block 600, when the optoelectronic semiconductor display panel is bent, the second block 600 with a relatively thin thickness forms an easy-to-bend area, including the bearing area 111 of the circuit substrate 100 bearing the light emitting bodies 200, the bearing area 112 of the circuit substrate 100 bearing the light emitting bodies 200, and the second block 600 of the circuit substrate 100 bearing the light emitting bodies 200. The corresponding light emitting body 200 and the first block 500 of the corresponding curing colloid 300 are not easily bent, so that the light emitting body 200 installed in the first block 500 is located in the non-bending area, and the electrode contact 210 of the light emitting body 200 and the conductive contact 410 electrically connected thereto are also located in the non-bending area, thereby avoiding the connection between the electrode contact 210 and the conductive contact 410 of the light emitting body 200 becoming loose or broken due to the bending of the display panel, thereby solving the problem that the quality of the optoelectronic semiconductor display panel is easily damaged when bent.

[0038] In this article, “several” means more than 1.

[0039] Preferably, providing Figure 1-2 In the bendable optoelectronic semiconductor display panel shown in Example 1, the second surface 120 of the circuit substrate 100 is planar, and the planar second surface 120 is easy to be attached to an external carrier, for example, the optoelectronic semiconductor display panel is easy to be attached to an external transparent carrier with its back side, the first surface 110 forms a plurality of protrusions 111a, the supporting area 111 of the first block 500 is the protrusions 111a, and the plurality of light-emitting bodies 200 are respectively distributed on the plurality of protrusions 111a; the number of the plurality of conductive contacts 410 and the plurality of curing colloids 300 are both adapted to the number of the plurality of light-emitting bodies 200, the conductive contacts 410 are arranged on the protrusions 111a and connected to the electrode contacts 210 of the light-emitting bodies 200; the curing colloid 300 is located on the protrusions 111a, connecting the protrusions 111a and the light-emitting bodies 200.

[0040] Since the first surface 110 of the circuit substrate 100 forms a plurality of protrusions 111a and the second surface 120 is planar, and the plurality of luminous bodies 200 are respectively distributed on the plurality of protrusions 111a, the thickness of the first block 500 including the protrusions 111a, the corresponding luminous bodies 200 and the corresponding curing colloid 300 is greater than the thickness of the non-protruding block on the first surface 110 of the circuit substrate 100, i.e., the second block 600; when the optoelectronic semiconductor display panel is bent, the second block 600 with a relatively thin thickness forms an easy-to-bend area, and the first block 500 is thinner than the first block 500. 00 is located between the two second blocks 600, and the first block 500 including the protrusion 111a, the corresponding light-emitting body 200 and the corresponding curing colloid 300 is not easily bent, so that the light-emitting body 200 mounted on the protrusion 111a is located in the non-bending area, and the electrode contact 210 of the light-emitting body 200 and the conductive contact 410 electrically connected thereto are also located in the non-bending area, thereby avoiding the occurrence of damage to the quality of the optoelectronic semiconductor display panel caused by loosening or breaking of the connection between the electrode contact 210 and the conductive contact 410 of the light-emitting body 200 due to bending.

[0041] Among them, the number of the plurality of conductive contacts 410 and the number of curing colloids 300 are adapted to the number of the plurality of light-emitting bodies 200, which means that the original design purpose is that the number of the plurality of conductive contacts 410 and the number of curing colloids 300 are set according to the number of the plurality of light-emitting bodies 200 and are used in combination with each other.

[0042] Preferably, providing Figure 3-4 In the bendable optoelectronic semiconductor display panel shown in Example 2, the second surface 120 of the circuit substrate 100 is concave-convex following the concave-convex shape of the first surface 110, the first surface 110 forms a plurality of depressions 111b, the bearing area 111 of the first block 500 is the depression 111b, and the plurality of light-emitting bodies 200 are respectively distributed in the plurality of depressions 111b; the number of the plurality of conductive contacts 410 and the plurality of curing colloids 300 are both adapted to the number of the plurality of light-emitting bodies 200, the conductive contacts 410 are arranged in the depressions 111b and connected to the electrode contacts 210 of the light-emitting bodies 200; the curing colloid 300 connects the depressions 111b and the light-emitting bodies 200.

[0043] Since the second surface 120 of the circuit substrate 100 follows the concavo-convex shape of the first surface 110 and is concavo-convex, that is, the circuit substrate 100 is bent as a whole to form a concavo-convex shape, and the plurality of light emitters 200 are respectively distributed in the plurality of depressions 111b formed on the first surface 110 in a one-to-one correspondence, the thickness of the first block 500 including the depressions 111b, the corresponding light emitters 200, and the corresponding curing colloid 300 is greater than the thickness of the non-concave block on the first surface 110 of the circuit substrate 100, that is, the second block 600; the second surface 120 follows the concavo-convex shape of the first surface 110 and is in a concavo-convex structure, which makes it easy for the first surface 110 to be attached to an external carrier, for example, making it easy for the optoelectronic semiconductor display panel to be attached to an external carrier with its front side. The first block 500 is located between the two second blocks 600, and the first block 500 including the recess 111b, the corresponding light-emitting body 200 and the corresponding curing colloid 300 is not easily bent, so that the light-emitting body 200 arranged in the recess 111b is located in the non-bending area, and the electrode contact 210 of the light-emitting body 200 and the conductive contact 410 electrically connected thereto are also located in the non-bending area, thereby avoiding the situation in which the quality of the optoelectronic semiconductor display panel is damaged due to loosening or breaking of the connection between the electrode contact 210 and the conductive contact 410 of the light-emitting body 200 due to bending.

[0044] Preferably, if Figure 3-4 As shown in Embodiment 2, the solidified colloid 300 is located in the recess 111 b , the upper surface of the solidified colloid 300 faces the light emitting direction of the light emitting body 200 , and the upper surface of the solidified colloid 300 is flush with the light emitting surface of the light emitting body 200 .

[0045] Since there is a difference in refractive index between the solidified colloid 300 and the light-emitting surface of the light-emitting body 200 and the air, by setting the upper surface of the solidified colloid 300 to be flush with the light-emitting surface of the light-emitting body 200, the light is directly emitted into the air after being emitted from the light-emitting surface of the light-emitting body 200, thereby reducing light loss and improving the light-emitting efficiency of the light-emitting body 200. In addition, this structure will enable the solidified colloid 300 to be combined with the surface of the recess 111b to the greatest extent, thereby enhancing the overall structural strength of the first block 500.

[0046] Preferably, providing Figure 5-6 The optoelectronic semiconductor display panel shown in the third embodiment includes a circuit substrate 100, a plurality of curing colloids 300 and a plurality of luminous bodies 200, most of which are similar to those in the second embodiment. Figure 5-6As shown, the circuit substrate 100 is the same as the second embodiment: the second surface 120 of the circuit substrate 100 follows the concavo-convex shape of the first surface 110 and is concavo-convex, and the first surface 110 forms a plurality of depressions 111b; the difference is that in the third embodiment, the depressions 111b are strip-shaped, and a plurality of light emitters 200 are arranged in a rectangular array on the circuit substrate 100, and the formed plurality of rows of light emitters 220 are respectively distributed in a plurality of strip-shaped convexities 111b, and the solidified colloid 300 connects the strip-shaped depressions 111b and the light emitters 200. Among them, the length and width of the strip-shaped depressions 111b are set according to the length and width of the light emitter rows 220, so that the entire row of light emitter rows 220 is arranged in the strip-shaped depressions 111b.

[0047] Since the second surface 120 of the circuit substrate 100 follows the concavo-convex shape of the first surface 110 and is concavo-convex, and the rows of light-emitting body rows 220 are respectively distributed in the strip-shaped recesses 111b formed on the first surface 110 in a one-to-one correspondence, the interval area between two adjacent parallel strip-shaped recesses 111b on the circuit substrate 100 forms a second block 600, and the thickness of the first block 500 including the bearing area 111 (i.e., the strip-shaped recess 111b), the corresponding light-emitting body row 220 and the corresponding curing colloid 300 is greater than the thickness of the second block 600. Therefore, similar to the above, the second block 600 with a thinner thickness forms an easy-to-bend area, and the first block 500 located between the two second blocks 600 forms a non-bending area, thereby preventing the connection between the electrode contact 210 and the conductive contact 410 of the light-emitting body 200 from loosening or breaking due to bending, thereby damaging the quality of the optoelectronic semiconductor display panel.

[0048] In addition, each row of light-emitting bodies 220 is correspondingly arranged in each strip-shaped recess 111b. Compared with the solution in Example 2 in which each light-emitting body 200 is correspondingly arranged in each recess 111b, the processing complexity and difficulty of the circuit substrate 100 are reduced, the structure is simpler, and the optoelectronic semiconductor display panel is suitable for bending along the width direction of the long strip recess 111.

[0049] The light-emitting body row 220 is composed of a plurality of light-emitting bodies 200 ; the “plurality” mentioned herein means greater than 1.

[0050] Preferably, if Figure 3-4 Example 2 and Figure 5-6 As shown in Example 3, the recess 111b is a quadrangular pyramid structure; the bottom surface of the recess 111b supports the light emitting body 200, and the area of ​​the opening of the recess 111b is larger than the area of ​​the bottom surface, and the plane where the opening of the recess 111b is located is parallel to the bottom surface.

[0051] By designing the recess 111b to be a quadrangular pyramid structure and the opening area of ​​the recess 111b is larger than the area of ​​the bottom surface, the structure of being wide at the top and narrow at the bottom facilitates the light emitting body 200 to enter the recess 111b through the opening of the recess 111b and be installed, which is convenient for use. Figure 5-6 As shown in the third embodiment, the optoelectronic semiconductor display panel is provided with a strip-shaped recess 111b of a quadrangular pyramid structure. During the printing process, the conductive circuit 400 can be printed on the flat bottom surface of the strip-shaped recess 111b, which is easy to handle.

[0052] Preferably, if Figure 3-4 As shown in Example 2, the two cross sections of the recess 111b cut along the width and length directions of the circuit substrate 100 are both isosceles trapezoids, and the angle θ between the waist and the lower base of the isosceles trapezoid is 1 The angle is 120°. By setting the angle θ between the waist and the lower base of the isosceles trapezoid 1 The angle is 120°, which limits the opening size of the recess 111b, ensuring that when the light-emitting body 200 is installed in the recess 111b, the opening of the recess 111b provides sufficient space for the light-emitting body 200 to pass through, making it easy for the light-emitting body 200 to be placed and installed.

[0053] This article provides Figure 4 What is shown is a cross section along the width direction of the circuit substrate 100. It should be understood that the cross section of the recess 111b cut along the length direction of the circuit substrate 100 is similar to the cross section along the width direction of the circuit substrate 100. Both are isosceles trapezoids and the angle θ1 between the waist and the lower base of the isosceles trapezoid is 120°. Therefore, the illustration of the cross section cut along the length direction of the circuit substrate 100 is no longer provided.

[0054] Preferably, if Figure 1-2 Embodiment 1, Figure 3-4 As shown in Example 2, Figure 5-6 Example 3 and Figure 7-8 As shown in Embodiment 4, the upper surface of the solidified colloid 300 faces the light emitting direction of the light emitting body 200 , and the upper surface of the solidified colloid 300 is not higher than the light emitting surface of the light emitting body 200 .

[0055] Since there is a refractive index difference between the solidified colloid 300 and the light-emitting surface of the light-emitting body 200 and the air, by setting the upper surface of the solidified colloid 300 not higher than the light-emitting surface of the light-emitting body 200, the light is directly emitted into the air after being emitted from the light-emitting surface of the light-emitting body 200, thereby reducing light loss and improving the light-emitting efficiency of the light-emitting body 200.

[0056] Preferably, providing Figure 7-8The bending-resistant optoelectronic semiconductor display panel shown in Example 4 includes a circuit substrate 100, a plurality of curing colloids 300 and a plurality of light-emitting bodies 200, most of which are similar to those in the above-mentioned Example 1. Figure 7-8 As shown, the circuit substrate 100 is the same as in Example 1: the second surface 120 of the circuit substrate 100 is planar and the first surface 110 forms a plurality of protrusions 111a, the difference being that in this Example 4, the protrusions 111a are strip-shaped, and a plurality of light emitters 200 are arranged in a rectangular array on the circuit substrate 100, and a plurality of rows of light emitter rows 220 are formed, which are respectively distributed on a plurality of strip-shaped protrusions 111a, and the solidified colloid 300 connects the strip-shaped protrusions 111a and the light emitters 200. Among them, the length and width of the strip-shaped protrusions 111a are set according to the length and width of the light emitter rows 220, so that the entire row of light emitter rows 220 is arranged on the top surface of the strip-shaped protrusions 111a.

[0057] Since the second surface 120 of the circuit substrate 100 is planar and the first surface 110 forms a plurality of strip-shaped protrusions 111a, the plurality of rows of light-emitting body rows 220 are respectively distributed on the plurality of strip-shaped protrusions 111a in a one-to-one correspondence, and the interval area between two adjacent parallel strip-shaped protrusions 111a on the circuit substrate 100 forms a second block 600, and the thickness of the first block 500 including the bearing area 111 (i.e., the strip-shaped protrusions 111a), the corresponding light-emitting body rows 220, and the corresponding curing colloid 300 is greater than the thickness of the second block 600. Therefore, similar to the above, the second block 600 with a relatively thin thickness forms an easy-to-bend area, and the first block 500 located between the two second blocks 600 forms a non-bending area, thereby preventing the connection between the electrode contact 210 and the conductive contact 410 of the light-emitting body 200 from loosening or breaking due to bending, thereby damaging the quality of the optoelectronic semiconductor display panel.

[0058] In addition, each row of light-emitting bodies 220 is correspondingly arranged on each strip-shaped protrusion 111a. Compared with the solution in Example 1 in which each light-emitting body 200 is correspondingly arranged on each protrusion 111a, the processing complexity and difficulty of the circuit substrate 100 are reduced, the structure is simpler, and the optoelectronic semiconductor display panel is suitable for bending along the width direction of the strip-shaped protrusion 111a.

[0059] Preferably, if Figure 1-2 Embodiment 1, Figure 7-8 As shown in Example 4, the protrusion 111a is a quadrangular pyramid structure; the top surface of the protrusion 111a supports the light-emitting body 200, and the area of ​​the top surface of the protrusion 111a is smaller than the area of ​​the bottom of the protrusion 111a, and the top surface of the protrusion 111a is parallel to the plane where the bottom is located.

[0060] By setting the protrusion 111a to be a quadrangular pyramid structure and the area of ​​the top surface thereof is smaller than the area of ​​the bottom surface, when the optoelectronic semiconductor display panel is bent, the connection between the protrusion 111a of the quadrangular pyramid structure and the non-protrusion area on the first surface 110 of the circuit substrate 100 is stable, and has a stabilizing and reinforcing effect similar to a triangular reinforcing rib; in addition, if Figure 7-8 As shown in Embodiment 4, the conductive circuit 400 can be printed on the top surface of the flat strip-shaped protrusion 111 a, which is easy to handle.

[0061] Although the terms such as circuit substrate, curing colloid, luminous body, conductive circuit, first block, second block, electrode contact, conductive contact, bearing area, protrusion, depression, etc. are used more frequently in this article, the possibility of using other terms is not excluded. The use of these terms is only for more convenient description and explanation of the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A bend-resistant optoelectronic semiconductor display panel, comprising a circuit substrate, a plurality of curing colloids and a plurality of luminous bodies arranged on the circuit substrate, characterized in that: The circuit substrate has a conductive circuit, a plurality of conductive contacts, and a first surface and a second surface opposite to each other. The conductive circuit is arranged on the first surface and connected to the conductive contacts. The conductive contacts are arranged on the first surface and connected to the electrode contacts of the light-emitting body. The solidified colloid connects the first surface and the luminous body; The first surface faces the light emitting direction of the plurality of light emitting bodies and is concave-convex, so that the optoelectronic semiconductor display panel has a plurality of first blocks and a plurality of second blocks, the first block includes a bearing area of ​​the circuit substrate bearing the light emitting body, the corresponding light emitting body and the corresponding curing colloid, the thickness of the first block is greater than the thickness of the second block, and the first block is located between two adjacent second blocks; The second surface follows the concave-convex shape of the first surface and is concave-convex, the first surface forms a plurality of depressions, the bearing area of ​​the first block is the depression, and the plurality of the light emitters are respectively distributed in the plurality of the depressions; The number of the conductive contacts and the number of the solidified colloids are adapted to the number of the luminous bodies. The conductive contacts are arranged in the recesses and connected to the electrode contacts of the luminous bodies. The solidified colloids connect the recesses and the luminous bodies.

2. The bending-resistant optoelectronic semiconductor display panel according to claim 1, characterized in that: The second surface is planar, the first surface forms a plurality of protrusions, the bearing area of ​​the first block is the protrusion, and the plurality of luminous bodies are respectively distributed on the plurality of protrusions; The number of the conductive contacts and the number of the solidified colloids are adapted to the number of the luminous bodies. The conductive contacts are arranged on the protrusions and connected to the electrode contacts of the luminous bodies. The solidified colloids connect the protrusions and the luminous bodies.

3. The bending-resistant optoelectronic semiconductor display panel according to claim 1, characterized in that: The upper surface of the solidified colloid faces the light emitting direction of the light emitting body, and the upper surface of the solidified colloid is flush with the light emitting surface of the light emitting body.

4. The bending-resistant optoelectronic semiconductor display panel according to claim 1, characterized in that: The plurality of light-emitting bodies are arranged in a rectangular array on the circuit substrate to form a plurality of rows of light-emitting bodies parallel to each other; The depressions are in strip shape, and a plurality of rows of the light emitting bodies are respectively distributed in a plurality of the depressions.

5. The bending-resistant optoelectronic semiconductor display panel according to claim 1, characterized in that: The depression is a quadrangular pyramid structure; The bottom surface of the depression carries the light-emitting body, and the area of ​​the opening of the depression is larger than the area of ​​the bottom surface, and the plane where the opening of the depression is located is parallel to the bottom surface.

6. The bending-resistant optoelectronic semiconductor display panel according to claim 5, characterized in that: Two cross sections of the recess cut along the width and length directions of the circuit substrate are both isosceles trapezoids, and the angle θ1 between the waist and the lower base of the isosceles trapezoid is 120°.

7. The bend-resistant optoelectronic semiconductor display panel according to any one of claims 1 or 2, characterized in that: The upper surface of the solidified colloid faces the light emitting direction of the luminous body, and the upper surface of the solidified colloid is not higher than the light emitting surface of the luminous body.

8. The bending-resistant optoelectronic semiconductor display panel according to claim 2, characterized in that: The plurality of light-emitting bodies are arranged in a rectangular array on the circuit substrate to form a plurality of rows of light-emitting bodies parallel to each other; The protrusions are in strip shape, and a plurality of rows of the light emitting bodies are respectively distributed on a plurality of the protrusions.

9. The bend-resistant optoelectronic semiconductor display panel according to any one of claims 2 or 8, characterized in that: The protrusion is a quadrangular pyramid structure; The top surface of the protrusion carries the light-emitting body, and the area of ​​the top surface of the protrusion is smaller than the area of ​​the bottom of the protrusion, and the top surface of the protrusion is parallel to the plane where the bottom is located.

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