Anisotropic conductive thread and preparation method thereof, and anisotropic conductive film having the conductive thread

Abstract

The present invention discloses an anisotropic conductive wire and a preparation method thereof, and an anisotropic conductive film having the conductive wire. The anisotropic conductive wire comprises: a resin wire and a conductive ball arranged in the resin wire. Compared with the traditional anisotropic conductive glue, the number, type and distribution of the conductive balls in the anisotropic conductive wire are controllable, and the preparation process is simple. The anisotropic conductive wire can be used alone or in combination with an insulating wire or an NCF glue, and has a wide range of applications. With auxiliary equipment, the anisotropic conductive wire can arbitrarily arrange the conductive wire pattern within the electrode conduction area required by the application end product, and after processing, the optimal conduction capture rate of the anisotropic conductive ball is achieved, providing a smaller electrode safety conduction area and an insulation distance between electrodes. The anisotropic conductive wire can also play a role in diversion.

Description

Technical Field

[0001] The invention belongs to the technical field of conduction of electronic devices, and in particular relates to an anisotropic conductive thread and a preparation method thereof, and an anisotropic conductive film having the conductive thread. Background Art

[0002] In the field of electronics industry, anisotropic conductive adhesive is widely used when packaging electronic components such as IC chips and high electrode density on substrates. However, with the semiconductor process and its application, such as mobile phones, notebooks and other small electronic products, high-density wiring is required, and the existing anisotropic conductive adhesive is gradually unable to meet the demand.

[0003] The conductive balls in conventional anisotropic conductive glue are unevenly distributed and have a low capture rate. The conductive balls that are not captured by the electrodes flow out with the glue in the insulation distance between the electrodes, which easily causes conductive ball accumulation and damage and reduces the insulation safety between adjacent electrodes. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides an anisotropic conductive thread and a preparation method thereof, and an anisotropic conductive film having the conductive thread.

[0005] In order to achieve the above object, the technical solution of the present invention is as follows:

[0006] In one aspect, the present invention discloses an anisotropic conductive thread, comprising: a resin thread and one or more conductive balls disposed in the resin thread.

[0007] Based on the above technical solution, the following improvements can be made:

[0008] As a preferred solution, one or more insulating balls are also arranged in the resin filament.

[0009] As a preferred solution, the outer surface of the resin filament is coated with an isolation layer.

[0010] As a preferred solution,

[0011] The types of conductive balls are: conductive balls are solid metal balls;

[0012] Or, the conductive ball includes: a solid metal ball and one or more conductive particles disposed on the solid metal ball;

[0013] Or, the conductive ball comprises: an elastic core and one or more metal layers coated on the surface of the elastic core;

[0014] Or, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and one or more conductive particles arranged on the outermost metal layer;

[0015] Or, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and an insulating layer coated on the surface of the outermost metal layer;

[0016] Alternatively, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, one or more conductive particles arranged on the outermost metal layer, and an insulating layer coated on the outermost side of the conductive ball.

[0017] As a preferred solution, when two adjacent conductive balls are both metal balls, or their outermost sides have metal layers or conductive particles, the distance between the adjacent conductive balls is not less than the maximum diameter of the conductive balls.

[0018] As a preferred solution, a plurality of alloy balls are distributed in the resin wire.

[0019] On the other hand, the present invention also discloses a method for preparing anisotropic conductive yarn, which specifically comprises the following steps:

[0020] Evenly mix the conductive balls and the rubber material to form a mixture;

[0021] Filling the mixture into an extrusion container;

[0022] The mixed material is pressed out of the extrusion container and formed into anisotropic conductive wires after being shaped.

[0023] On the other hand, the present invention also discloses another method for preparing anisotropic conductive yarn, which specifically comprises the following steps:

[0024] Prepare at least two groups of rubber compounds, at least one of which contains conductive balls;

[0025] Each group of rubber materials flows into the corresponding feeding pipe and then enters the mixing pipe for mixing to form a mixture;

[0026] The mixed material is extruded through an extrusion device at the outlet of the mixing pipeline and formed into anisotropic conductive threads.

[0027] On the other hand, the present invention also discloses an anisotropic conductive film, comprising: a PET substrate and one or more resin layers arranged on the PET substrate, wherein a plurality of any of the above anisotropic conductive filaments are distributed in the resin layer farthest from the PET substrate.

[0028] As a preferred solution, a plurality of anisotropic conductive threads are arranged in parallel, and the distance between adjacent anisotropic conductive threads is not less than the maximum diameter of the conductive balls in the anisotropic conductive threads.

[0029] As a preferred solution, a plurality of insulating filaments are distributed in the resin layer, and the insulating filaments are resin filaments or resin filaments with insulating balls.

[0030] As a preferred solution, the insulating threads and the anisotropic conductive threads are distributed in the same resin layer, and the insulating threads and the anisotropic conductive threads are arranged at intervals.

[0031] As a preferred solution, the insulating threads and the anisotropic conductive threads are distributed in different resin layers, and the insulating threads and the anisotropic conductive threads are arranged in a one-to-one correspondence.

[0032] As a preferred solution, the insulating filaments and the anisotropic conductive filaments are arranged in parallel or staggered.

[0033] As a preferred solution, the angle between the anisotropic conductive yarn and / or insulating yarn and one side of the PET substrate is between 0 and 90 degrees. The anisotropic conductive yarn and the preparation method thereof, and the anisotropic conductive film having the conductive yarn of the present invention have the following beneficial effects:

[0034] First, compared with traditional anisotropic conductive adhesives, the number, type and distribution of conductive balls in anisotropic conductive wires are controllable, and the preparation process is simple.

[0035] Second, anisotropic conductive wire can be used alone or in combination with insulating wire or NCF glue, and has a wide range of applications.

[0036] Third, with the help of auxiliary equipment, the anisotropic conductive wire can be arranged arbitrarily within the electrode conduction area required by the application-end product. After processing, the optimal conduction capture rate of the anisotropic conductive ball can be achieved, providing a smaller electrode safe conduction area and insulation distance between electrodes.

[0037] Fourth, anisotropic conductive fibers can play a role in conducting current. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 A schematic diagram of the structure of anisotropic conductive yarn provided in an embodiment of the present invention.

[0040] Figure 2 for Figure 1 A cross-sectional view of anisotropic conductive yarn.

[0041] Figure 3 A schematic diagram of the structure of anisotropic conductive fibers provided in an embodiment of the present invention when coated with an isolation layer.

[0042] Figure 4 for Figure 3A cross-sectional view of anisotropic conductive yarn.

[0043] Figure 5 A schematic structural diagram of a non-conductive organic resin ball provided in an embodiment of the present invention.

[0044] Figure 6 A schematic diagram of the structure of non-conductive inorganic particles provided in an embodiment of the present invention.

[0045] Figure 7 A schematic structural diagram of a conductive ball (including a resin core and a nickel layer) provided in an embodiment of the present invention.

[0046] Figure 8 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer and an insulating layer) provided in an embodiment of the present invention.

[0047] Fig. 9 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer and a gold layer) provided in an embodiment of the present invention.

[0048] Fig.10 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer, a gold layer and an insulating layer) provided in an embodiment of the present invention.

[0049] Fig.11 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer, a gold layer and conductive particles) provided in an embodiment of the present invention.

[0050] Fig.12 A schematic structural diagram of a conductive ball (including: a resin core, a nickel layer, a gold layer, conductive particles and an insulating layer) provided in an embodiment of the present invention.

[0051] Fig.13 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer and a low-melting-point solder powder coating layer) provided in an embodiment of the present invention.

[0052] Fig.14 A schematic structural diagram of a conductive ball (including a resin core, a nickel layer, a gold layer and a low-melting-point solder powder coating layer) provided in an embodiment of the present invention.

[0053] Fig.15 A schematic diagram of the structure of a conductive ball (solid nickel ball) provided in an embodiment of the present invention.

[0054] Fig.16 A schematic structural diagram of a conductive ball (including a solid nickel ball and conductive particles) provided in an embodiment of the present invention.

[0055] Fig.17 A schematic structural diagram of a conductive ball (including a solid nickel ball and a low-melting-point solder powder coating layer) provided in an embodiment of the present invention.

[0056] Fig.18 A schematic structural diagram of a conductive ball (low melting point metal alloy ball) provided in an embodiment of the present invention.

[0057] Fig.19 A schematic structural diagram of a conductive ball (including a silicon ball and a nickel layer) provided in an embodiment of the present invention.

[0058] Fig. 20 A schematic structural diagram of a conductive ball (including a silicon ball, a nickel layer and conductive particles) provided in an embodiment of the present invention.

[0059] Fig.21 A schematic structural diagram of a conductive ball (including a silicon ball, a nickel layer and a low-melting-point solder powder coating layer) provided in an embodiment of the present invention.

[0060] Fig. 22 A schematic diagram of the structure of a feed pipeline and a mixing pipeline provided in an embodiment of the present invention.

[0061] Fig.23 Schematic diagram of the structure of an anisotropic conductive film (single resin layer) provided in an embodiment of the present invention.

[0062] Fig.24 for Fig.23 AA cross section shown.

[0063] Fig.25 Schematic diagram of the structure of an anisotropic conductive film (two resin layers) provided in an embodiment of the present invention.

[0064] Fig.26 A schematic structural diagram of an anisotropic conductive film (single resin layer with insulating filaments) provided in an embodiment of the present invention.

[0065] Fig. 27 for Fig.26 BB cross section shown.

[0066] Fig.28 A schematic structural diagram of an anisotropic conductive film (two resin layers and insulating filaments) provided in an embodiment of the present invention.

[0067] Fig.29 Another schematic structural diagram of the anisotropic conductive film (two resin layers and insulating filaments) provided in an embodiment of the present invention.

[0068] Among them: 1-resin wire, 2-conductive ball, 3-isolation layer, 41-non-conductive organic resin ball, 42-non-conductive inorganic particle, 51-resin core, 52-nickel layer, 53-insulating layer, 54-gold layer, 55-conductive particle, 56-low melting point solder powder coating layer, 57-solid nickel ball, 58-low melting point metal alloy ball, 59-silicon ball, 61-feeding pipe, 62-mixing pipe, 7-PET substrate, 8-resin layer, 9-anisotropic conductive wire, 10-insulating wire. DETAILED DESCRIPTION

[0069] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0070] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0071] The expression “comprising” an element is an “open” expression which merely means that a corresponding component exists and should not be interpreted as excluding additional components.

[0072] In order to achieve the purpose of the present invention, some embodiments of anisotropic conductive filaments and methods for preparing the same, and anisotropic conductive films having the same, as Figure 1 and 2 As shown, the anisotropic conductive thread includes: a resin thread 1 and a conductive ball 2 arranged in the resin thread 1.

[0073] The length of the resin wire 1 is not limited. The number, size and shape of the conductive balls 2 in the resin wire 1 are not limited.

[0074] In some embodiments, the resin filaments are filaments with uniform thickness, but may also be filaments with uneven thickness. When the resin filaments are filaments with uneven thickness, the diameter of the resin filaments described below is the diameter of the thinnest part of the resin filaments.

[0075] In some embodiments, Figure 1 As shown, the material composition of the resin segment A containing the conductive balls 2 and the resin segment B not containing the conductive balls 2 may be the same or different.

[0076] In some embodiments, the resin segment A and the resin segment B are spaced apart.

[0077] It should be noted that the resin segment B may be, but is not limited to, an isolation segment for isolating adjacent resin segments A and / or an initiation segment for curing or initiating a reaction.

[0078] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, except that an insulating ball is further provided in the resin wire 1.

[0079] The types of insulating balls are as follows Figure 5 The non-conductive organic resin balls 41 shown, or insulating balls, are of the type shown. Figure 6 The non-conductive inorganic particles 42 are shown;

[0080] Any number of insulating balls of the same type mentioned above can be arranged in the resin wire 1, or any number of insulating balls of the two types mentioned above can be arranged in the resin wire 1.

[0081] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, except that, Figure 3 and 4 As shown, the outer surface of the resin wire 1 is covered with an isolation layer 3. In a specific embodiment, the thickness of the isolation layer 3 is not limited and can be adjusted according to specific circumstances.

[0082] The anisotropic conductive yarn with the isolation layer 3 has more stable performance and can be stored for a long time.

[0083] In order to further optimize the implementation effect of the present invention, in some other implementations, the remaining characteristic technologies are the same, except that the diameter Φ01 of the resin wire 1 is not less than the maximum diameter of the conductive ball 2 .

[0084] In a specific embodiment, the diameter Φ01 of the resin filament may be, but is not limited to, 0.1um, or 0.2um, or 0.3um, etc., whichever is greater than 0.1um.

[0085] Preferably, the diameter Φ01 of the resin wire is the same as the maximum diameter of the conductive ball.

[0086] Of course, when an insulating ball is arranged in the resin wire 1, the diameter Φ01 of the resin wire 1 is also not less than the maximum diameter of the insulating ball.

[0087] In order to further optimize the implementation effect of the present invention, in some other implementations, the remaining characteristic technologies are the same, except that the plurality of conductive balls 2 are evenly distributed in the resin filament 1 .

[0088] In order to further optimize the implementation effect of the present invention, in some other implementations, the remaining characteristic technologies are the same, except that a plurality of conductive balls 2 are randomly distributed in the resin filament 1 .

[0089] In order to further optimize the implementation effect of the present invention, in some other embodiments, the remaining characteristic technologies are the same, except that one or more conductive balls 2 are arranged in the resin wire 1;

[0090] The conductive ball 2 is a solid metal ball;

[0091] Or, the conductive ball 2 includes: a solid metal ball and one or more conductive particles disposed on the solid metal ball;

[0092] Or, the conductive ball 2 includes: an elastic core and one or more metal layers coated on the surface of the elastic core;

[0093] Or, the conductive ball 2 comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and one or more conductive particles arranged on the outermost metal layer;

[0094] Or, the conductive ball 2 includes: an elastic core, one or more metal layers coated on the surface of the elastic core, and an insulating layer coated on the surface of the outermost metal layer;

[0095] Alternatively, the conductive ball 2 includes: an elastic core, one or more metal layers coated on the surface of the elastic core, one or more conductive particles arranged on the outermost metal layer, and an insulating layer coated on the outermost side of the conductive ball.

[0096] In order to better explain the anisotropic conductive wire disclosed in the present invention, several specific conductive ball structures are first introduced below:

[0097] like Figure 7 As shown, the conductive ball 2 includes a resin core 51 and a nickel layer 52 coated on the surface of the resin core 51 .

[0098] like Figure 8 As shown, the conductive ball 2 includes: a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , and an insulating layer 53 coated on the surface of the nickel layer 52 .

[0099] like Fig. 9 As shown, the conductive ball 2 includes: a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , and a gold layer 54 coated on the surface of the nickel layer 52 .

[0100] like Fig.10 As shown, the conductive ball 2 includes: a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , a gold layer 54 coated on the surface of the nickel layer 52 , and an insulating layer 53 coated on the surface of the gold layer 54 .

[0101] like Fig.11 As shown, the conductive ball 2 includes: a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , a gold layer 54 coated on the surface of the nickel layer 52 , and a plurality of conductive particles 55 disposed on the surface of the gold layer 54 .

[0102] like Fig.12As shown, the conductive ball 2 includes: a resin core 51, a nickel layer 52 coated on the surface of the resin core 51, a gold layer 54 coated on the surface of the nickel layer 52, a plurality of conductive particles 55 arranged on the surface of the gold layer 54, and an insulating layer 53 coated on the outermost side of the conductive ball 2.

[0103] like Fig.13 As shown, the conductive ball 2 includes a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , and a low melting point solder powder coating layer 56 coated on the surface of the nickel layer 52 .

[0104] like Fig.14 As shown, the conductive ball 2 includes: a resin core 51 , a nickel layer 52 coated on the surface of the resin core 51 , a gold layer 54 coated on the surface of the nickel layer 52 , and a low melting point solder powder coating layer 56 coated on the surface of the gold layer 54 .

[0105] like Fig.15 As shown, the conductive ball 2 is a solid nickel ball 57 .

[0106] like Fig.16 As shown, the conductive ball 2 includes: a solid nickel ball 57 and a plurality of conductive particles 55 arranged on the surface of the solid nickel ball 57 .

[0107] like Fig.17 As shown, the conductive ball 2 includes: a solid nickel ball 57 and a low melting point solder powder coating layer 56 coated on the surface of the solid nickel ball 57 .

[0108] like Fig.18 As shown, the conductive ball 2 is a low melting point metal alloy ball 58 .

[0109] like Fig.19 As shown, the conductive ball 2 includes: a silicon ball 59 and a nickel layer 52 coated on the surface of the silicon ball 59 .

[0110] like Fig. 20 As shown, the conductive ball 2 includes: a silicon ball 59 , a nickel layer 52 coated on the surface of the silicon ball 59 , and a plurality of conductive particles 55 disposed on the surface of the nickel layer 52 .

[0111] like Fig.21 As shown, the conductive ball 2 includes: a silicon ball 59 , a nickel layer 52 coated on the surface of the silicon ball 59 , and a low melting point solder powder coating layer 56 coated on the surface of the nickel layer 52 .

[0112] In order to further optimize the implementation effect of the present invention, in some other embodiments, the other characteristic technologies are the same, the difference is that when two adjacent conductive balls are metal balls, or their outermost sides have metal layers or conductive particles, the distance S01 between adjacent conductive balls 2 is not less than the maximum diameter of the conductive ball 2.

[0113] The above multiple implementations can be implemented in parallel.

[0114] The resin filament 1 of the anisotropic conductive filament is described below. The resin filament 1 can be made of a thermosetting resin, a thermoplastic resin, or a mixture of the two. When the anisotropic conductive filament has an isolation layer 3, the resin filament 1 can be made of a thermosetting resin, a thermoplastic resin, or a mixture of the two; it can also be made of a component A or a component B that can be arbitrarily adjusted to the properties of a polymer material curing reaction in the presence of the isolation layer 3; it can also be made of a non-reactive resin and one or more materials of a curing agent, an initiator, a promoter, a soldering flux, and a deoxidizer in the presence of the isolation layer 3. The isolation layer 3 can be made of a thermoplastic material, or a chemical reaction isolation layer 3.

[0115] Specifically, the type and number of the conductive balls 2 in the anisotropic conductive yarn are not limited. The conductive balls 2 of the same type may be provided, or the conductive balls 2 of multiple types and numbers may be provided.

[0116] In some embodiments, the spacing between adjacent conductive balls 2 in the anisotropic conductive filament is restricted. When two adjacent conductive balls are metal balls, or both have metal layers or conductive particles on their outermost sides, the distance between adjacent conductive balls 2 is not less than the maximum diameter of the conductive balls 2. However, it is worth noting that when the adjacent conductive balls 2 are conductive balls 2 with insulating layers 53 on their outermost sides, the spacing between adjacent conductive balls 2 is not restricted. Moreover, when an insulating ball is disposed between adjacent conductive balls 2, the spacing between adjacent conductive balls 2 is also not restricted.

[0117] In some embodiments, the anisotropic conductive wire is anisotropic conductive welding wire capable of being welded, and the conductive balls 2 provided in the anisotropic conductive welding wire are conductive balls 2 whose outermost surfaces can be welded, such as the following conductive balls 2:

[0118] 1) Solid metal ball;

[0119] 2) comprising: a solid metal ball and one or more conductive particles 55 disposed on the solid metal ball;

[0120] 3) comprising: an elastic core and one or more metal layers coated on the surface of the elastic core;

[0121] 4) It comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and one or more conductive particles 55 arranged on the outermost metal layer.

[0122] In some embodiments, when a plurality of alloy balls are further distributed in the resin wire, the anisotropic conductive wire is an anisotropic conductive welding wire capable of being welded.

[0123] On the other hand, the present invention also discloses a method for preparing anisotropic conductive yarn, which specifically comprises the following steps:

[0124] Evenly mix the conductive balls and the rubber material to form a mixture;

[0125] Filling the mixture into an extrusion container;

[0126] The mixed material is pressed out of the extrusion container and formed into anisotropic conductive wires after being shaped.

[0127] Of course, in some embodiments, insulating balls may be added into the above-mentioned mixture to produce anisotropic conductive wires with insulating balls.

[0128] The preparation method of the anisotropic conductive yarn disclosed in the present invention has a simple process, does not require complicated devices, has low cost, and is suitable for wide-scale promotion and application.

[0129] On the other hand, the present invention also discloses another method for preparing anisotropic conductive yarn, which specifically comprises the following steps:

[0130] Prepare at least two groups of rubber compounds, at least one of which contains conductive balls;

[0131] Each group of rubber materials flows into the corresponding feed pipe 61 and then enters the mixing pipe 62 for mixing to form a mixture;

[0132] The mixed material is extruded through an extrusion device at the outlet of the mixing pipeline and formed into anisotropic conductive threads.

[0133] It is worth noting that the components of different rubber compounds can be the same or different.

[0134] In the preparation method of anisotropic conductive yarn disclosed in the present invention, it is worth noting that the diameter R1 of the feed pipe containing the conductive ball rubber material and the pipe diameter R2 of the mixing pipe have the following relationship with the maximum diameter r of the conductive ball:

[0135] r≤R1<2r, r≤R2<2r;

[0136] Therefore, at a certain moment, the feeding pipe and the mixing pipe only allow one conductive ball to pass through, ensuring that the spacing between adjacent conductive balls in the conductive wire is controllable, thereby achieving control of the number and distribution of conductive balls in the conductive wire.

[0137] The preparation method of the anisotropic conductive thread disclosed in the present invention can be carried out as follows: Fig. 22 The Y-shaped pipe with two inlets and one outlet shown can also be a pipe with three inlets and one outlet, and the pipe equipment is adjusted according to the specific amount of rubber materials.

[0138] In some other embodiments, insulating balls may be added into one of the groups of adhesives to produce anisotropic conductive wires having insulating balls.

[0139] In some other embodiments, a switch may be provided on each feed pipe or on the mixing pipe to switch the flow rate of the corresponding rubber in the feed pipe or the mixing pipe, thereby quickly adjusting the spacing between adjacent conductive balls.

[0140] By adopting the above-mentioned method for preparing anisotropic conductive yarns, each section of the same or different conductive yarns can be continuously prepared, and the number, type and distribution of the conductive balls and / or insulating balls in each section of the conductive yarn can be controlled.

[0141] like Figure 23-24 As shown, an embodiment of the present invention further discloses an anisotropic conductive film, comprising: a PET substrate 7 and a resin layer 8 disposed on the PET substrate 7, wherein a plurality of anisotropic conductive filaments 9 disclosed in any of the above embodiments are distributed in the resin layer 8 farthest from the PET substrate 7.

[0142] The material of the resin layer 8 can be but is not limited to thermosetting resin, thermoplastic resin or a mixture of the two.

[0143] Furthermore, the plurality of anisotropic conductive threads 9 are arranged in parallel, and the distance between adjacent anisotropic conductive threads 9 is not less than the maximum diameter of the conductive ball in the anisotropic conductive thread 9 .

[0144] The angle R01 between the anisotropic conductive thread 9 and one side of the PET substrate 7 is between 0 and 90 degrees. The thickness of the resin layer 8 is greater than the maximum diameter of the conductive ball in the anisotropic conductive thread 9 .

[0145] like Fig.25 As shown, based on the above implementation, the difference is that the anisotropic conductive film includes: two resin layers 8, and a plurality of anisotropic conductive filaments 9 disclosed in any of the above embodiments are distributed in the resin layer 8 farthest from the PET substrate 7.

[0146] The resin layer 8 close to the PET substrate 7 is an NCF layer.

[0147] The number of the anisotropic conductive film resin layer 8 of the present invention is not limited, and it can be a multi-layer film structure or a single-layer film structure.

[0148] like Figure 26-27 As shown, an embodiment of the present invention further discloses another anisotropic conductive film, comprising: a PET substrate 7 and a resin layer 8 arranged on the PET substrate 7, wherein a plurality of anisotropic conductive filaments 9 and insulating filaments 10 disclosed in any of the above embodiments are distributed in the resin layer 8 farthest from the PET substrate 7, and the insulating filaments 10 are resin filaments or resin filaments with insulating balls.

[0149] Furthermore, the insulating filaments 10 are arranged parallel to and spaced from the anisotropic conductive filaments 9. The distance between adjacent insulating filaments 10 and the anisotropic conductive filaments 9 is preferably greater than zero.

[0150] Furthermore, an included angle R02 between the anisotropic conductive filament 9 and one side of the PET substrate is between 0 and 90 degrees, and an included angle R01 between the insulating filament 10 and one side of the PET substrate is between 0 and 90 degrees.

[0151] like Fig.28 As shown, based on the above-mentioned implementation mode, the difference is that the anisotropic conductive film includes: two resin layers 8, in which a plurality of anisotropic conductive threads 9 and insulating threads 10 disclosed in any of the above-mentioned embodiments are distributed in the resin layer 8 farthest from the PET substrate 7, and the insulating threads 10 are parallel to the anisotropic conductive threads 9 and are arranged at intervals.

[0152] The resin layer 8 close to the PET substrate 7 is an NCF layer.

[0153] like Fig.29 As shown, an embodiment of the present invention further discloses another anisotropic conductive film, comprising: a PET substrate 7 and two resin layers 8 arranged on the PET substrate 7, wherein a plurality of anisotropic conductive filaments 9 disclosed in any of the above embodiments are distributed in the resin layer 8 farthest from the PET substrate 7, and a plurality of insulating filaments 10 are distributed in the resin layer 8 close to the PET substrate 7, and the insulating filaments 10 are resin filaments or resin filaments with insulating balls.

[0154] Furthermore, the insulating wires 10 and the anisotropic conductive wires 9 are arranged in a one-to-one correspondence.

[0155] Furthermore, the angle between the anisotropic conductive filament 9 and one side of the PET substrate is between 0 and 90 degrees, and the angle between the insulating filament 10 and one side of the PET substrate is between 0 and 90 degrees.

[0156] In this embodiment, the insulating filaments 10 and the anisotropic conductive filaments 9 may be arranged in parallel or in an alternating manner.

[0157] The anisotropic conductive thread and the preparation method thereof, and the anisotropic conductive film having the conductive thread of the present invention have the following beneficial effects:

[0158] First, compared with traditional anisotropic conductive adhesives, the number, type and distribution of conductive balls in anisotropic conductive wires are controllable, and the preparation process is simple.

[0159] Second, anisotropic conductive wire can be used alone or in combination with insulating wire or NCF glue or NCP glue, and has a wide range of applications.

[0160] Third, with the help of auxiliary equipment, the anisotropic conductive wire can be arranged arbitrarily within the electrode conduction area required by the application-end product. After processing, the optimal conduction capture rate of the anisotropic conductive ball can be achieved, providing a smaller electrode safe conduction area and insulation distance between electrodes.

[0161] Fourth, anisotropic conductive wire can play a role in conducting current. Specifically, when anisotropic conductive wire is used together with NCF glue, when connecting the electrodes of electronic devices, the melting point of the conductive wire can be controlled to be higher than the melting point of NCF glue, so that under heating conditions, NCF glue melts and excess colloid flows out along the conductive wire, playing a role in conducting current and preventing the colloid from overflowing randomly and causing electrode short circuit.

[0162] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable ordinary technicians in the field to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. Anisotropic conductive film, including: A PET substrate and one or more resin layers arranged on the PET substrate, characterized in that a plurality of anisotropic conductive threads are distributed in the resin layer farthest from the PET substrate, the anisotropic conductive threads include: resin threads and one or more conductive balls arranged in the resin threads, and the anisotropic conductive threads can conduct excess NCF glue.

2. The anisotropic conductive film according to claim 1, wherein: A plurality of the anisotropic conductive threads are arranged in parallel, and a distance between adjacent anisotropic conductive threads is not less than a maximum diameter of a conductive ball in the anisotropic conductive thread.

3. The anisotropic conductive film according to claim 1, wherein: A plurality of insulating filaments are also distributed in the resin layer, and the insulating filaments are resin filaments or resin filaments with insulating balls.

4. The anisotropic conductive film according to claim 3, characterized in that: The insulating threads and the anisotropic conductive threads are distributed in the same resin layer, and the insulating threads and the anisotropic conductive threads are arranged at intervals.

5. The anisotropic conductive film according to claim 3, characterized in that: The insulating threads and the anisotropic conductive threads are distributed in different resin layers, and the insulating threads and the anisotropic conductive threads are arranged in a one-to-one correspondence.

6. The anisotropic conductive film according to claim 5, characterized in that: The insulating threads and the anisotropic conductive threads are arranged in parallel or in an alternating manner.

7. The anisotropic conductive film according to any one of claims 3 to 6, characterized in that: The angle between the anisotropic conductive filaments and / or insulating filaments and one side of the PET substrate is between 0 and 90 degrees.

8. The anisotropic conductive film according to claim 1, wherein: One or more insulating balls are also arranged in the resin filaments.

9. The anisotropic conductive film according to claim 1, wherein: The outer surface of the resin filament is covered with an isolation layer.

10. The anisotropic conductive film according to any one of claims 1, 8 and 9, characterized in that: The types of the conductive balls are: the conductive balls are solid metal balls; Or, the conductive ball comprises: a solid metal ball and one or more conductive particles disposed on the solid metal ball; Or, the conductive ball comprises: an elastic core and one or more metal layers coated on the surface of the elastic core; Or, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and one or more conductive particles arranged on the outermost metal layer; Or, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, and an insulating layer coated on the surface of the outermost metal layer; Alternatively, the conductive ball comprises: an elastic core, one or more metal layers coated on the surface of the elastic core, one or more conductive particles arranged on the outermost metal layer, and an insulating layer coated on the outermost side of the conductive ball.

11. The anisotropic conductive film according to claim 10, characterized in that: When two adjacent conductive balls are both metal balls, or their outermost sides have metal layers or conductive particles, the distance between the adjacent conductive balls is not less than the maximum diameter of the conductive balls.

12. The anisotropic conductive film according to claim 10, characterized in that: A plurality of alloy balls are distributed in the resin wire.

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