Electronic device with heat diffusion structure

Abstract

Disclosed is an electronic device having a heat diffusion structure, the electronic device comprising: a housing including a first surface, a second surface facing the first surface, and a third surface perpendicular to the first and second surfaces; a display exposed through at least a portion of the first surface; a battery arranged between the first and second surfaces; a heat source arranged between the battery and the third surface in a direction perpendicular to the first and second surfaces; and a first heat diffusion member arranged perpendicular to the first and second surfaces, the first heat diffusion member including a first portion that is in thermal contact with at least a portion of the heat source and diffuses heat provided by the heat source to at least one second portion.

Description

Technical Field

[0001] The present disclosure relates generally to electronic devices, and more particularly, to electronic devices having heat spreading structures. Background Art

[0002] An electronic device such as a mobile terminal, a smart phone, or a wearable device can provide various functions, including basic voice communication functions and other functions such as short-range wireless communication (e.g. (BT), Wireless Fidelity (Wi-Fi), Near Field Communication (NFC)), mobile communications (such as third generation (3G), fourth generation (4G), and fifth generation (5G) functions), music or video playback, shooting, and navigation functions.

[0003] Recent electronic devices may support high-speed data communication (eg, millimeter wave communication), and such electronic devices may separately include an antenna module for high-speed data communication. Summary of the Invention

[0004] Solutions to the problem

[0005] However, conventional antenna modules for high-speed data communications generate excessive heat during operation.

[0006] Furthermore, antenna modules supporting high-speed communication may be mounted on the side surfaces of electronic devices, making it difficult to secure space for applying a heat dissipation structure to the side surfaces of the electronic devices, which tends to be minimal. For example, when applying a conventional heat dissipation structure, the design of the electronic device must be changed to secure additional space for the heat dissipation structure.

[0007] Therefore, there is a need in the art for a method for reducing heat generated by an antenna module and an improved structure for antenna heat dissipation.

[0008] Aspects of the present disclosure are to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below. Therefore, one aspect of the present disclosure is to provide a heat diffusion structure (or heat dissipation structure) that minimizes installation space.

[0009] Another aspect of the present disclosure is to provide a heat dissipation structure that effectively diffuses and dissipates heat.

[0010] According to one aspect of the present disclosure, an electronic device includes: a housing including a first surface, a second surface facing the first surface, and a third surface perpendicular to the first and second surfaces; a display exposed through at least a portion of the first surface; a battery arranged between the first and second surfaces; a heat source arranged between the battery and the third surface in a direction perpendicular to the first and second surfaces; and a first heat diffusion member arranged perpendicular to the first and second surfaces, the first heat diffusion member including a first portion that is in thermal contact with at least a portion of the heat source and diffuses heat provided by the heat source to at least one second portion.

[0011] According to another aspect of the present disclosure, an electronic device includes: a housing; a display exposed through at least a portion of a front surface of the housing; a battery arranged within the housing; an antenna module arranged between the battery and a side surface of the housing, perpendicular to the display, and supporting communication in a frequency band of at least 20 gigahertz (GHz); a conductor plate, at a first end of the conductor plate, thermally contacting at least a portion of an inner side surface of the antenna module; and a heat pipe, at a first end of the heat pipe, contacting a first end of the conductor plate and arranged perpendicular to the display.

[0012] According to another aspect of the present disclosure, an electronic device includes: a housing; a display exposed through at least a portion of a front surface of the housing; a battery arranged within the housing; an antenna module arranged perpendicular to the display, between the battery and a side surface of the housing, and supporting communication in a frequency band of at least 20 GHz; and a heat pipe in thermal contact with at least a portion of an inner side surface of the antenna module at a first portion of the heat pipe and arranged perpendicular to the display. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment;

[0015] Figure 2A shows a front surface of an electronic device according to an embodiment;

[0016] Figure 2B shows a rear surface of an electronic device according to an embodiment;

[0017] Figure 3A A heat dissipation structure of an electronic device according to an embodiment is shown;

[0018] Figure 3B It is along Figure 3A A section taken along line AA';

[0019] Figure 3CA heat diffusion member according to an embodiment is shown;

[0020] Figure 3D FIG. 1 illustrates a heat dissipation path provided by an antenna module according to an embodiment;

[0021] Figure 4A A heat dissipation structure of an electronic device according to an embodiment is shown;

[0022] Figure 4B It is along Figure 4A A section taken along line BB';

[0023] Figure 4C A heat diffusion member according to an embodiment is shown;

[0024] Figure 5A A heat dissipation structure of an electronic device according to an embodiment is shown;

[0025] Figure 5B shows a heat diffusion member according to an embodiment; and

[0026] Figure 6 FIG. 1 shows a result of measuring heat dissipation of an electronic device according to an embodiment. DETAILED DESCRIPTION

[0027] Embodiments of the present disclosure are described below with reference to the accompanying drawings. In this disclosure, embodiments are described in the accompanying drawings and related detailed descriptions are set forth, but this is not intended to limit the embodiments of the present disclosure. For the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted.

[0028] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0029] Reference Figure 1, the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). The electronic device 101 can communicate with the electronic device 104 via the server 108. The electronic device 101 may include a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) card 196, and an antenna module 197. At least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. Some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0030] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. As at least part of the data processing or calculations, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. The processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or integrated with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or to be specifically configured for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0031] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. The auxiliary processor 123 (e.g., ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0032] The memory 130 may store data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176), which may include software (e.g., the program 140) and input data or output data for commands related to the program 140. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130 , and the program 140 may include an operating system (OS) 142 , middleware 144 , and / or applications 146 .

[0034] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0035] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0037] The audio module 170 can convert sound into an electrical signal, or vice versa. The audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0039] The interface 177 may support one or more specific protocols for connecting the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). The interface 177 may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0040] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). The connection end 178 may include an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[0041] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. The haptic module 179 may include a motor, a piezoelectric element, or an electrical stimulator.

[0042] The camera module 180 can capture still images or moving images. The camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0043] The power management module 188 may manage power supply to the electronic device 101. The power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC).

[0044] The battery 189 may power at least one component of the electronic device 101. The battery 189 may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., AP), and support direct (e.g., wired) communication or wireless communication. The communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (for example, a long-distance communication network such as a cellular network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))). These various types of communication modules may be implemented as a single component (for example, a single chip), or may be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (for example, an International Mobile Subscriber Identity (IMSI)) stored in the SIM card 196.

[0046] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Antenna module 197 may include an antenna having a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Antenna module 197 may include multiple antennas. In this case, communication module 190 (e.g., wireless communication module 192) may select at least one antenna from the multiple antennas that is suitable for the communication scheme used in the communication network (e.g., first network 198 or second network 199). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0047] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0048] Commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to second network 199. Each of electronic device 102 and electronic device 104 can be of the same type as electronic device 101, or a different type. All or some operations that would otherwise be executed on electronic device 101 can be executed on one or more of external electronic device 102, external electronic device 104, or server 108. For example, if electronic device 101 automatically performs a function or service or performs a function or service in response to a request from a user or another device, electronic device 101 can request one or more external electronic devices to perform at least part of the function or service instead of, or in addition to, performing the function or service. Upon receiving the request, the one or more external electronic devices can perform the requested at least part of the function or service, or perform another function or service related to the request, and transmit the result to electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0049] Figure 2A A front surface of an electronic device according to an embodiment is shown. Figure 2B A rear surface of an electronic device according to an embodiment is shown.

[0050] Reference Figure 2A and Figure 2B In an embodiment, an electronic device 200 (e.g., electronic device 101) may be provided with a display 201 (e.g., display device 160) on a front surface (i.e., first surface) 2001 of a housing 250. A receiver 202 for outputting a voice of a counterpart may be provided above the display 201. A microphone 203 for acquiring (or collecting) the voice of a user of the electronic device 2000 for the counterpart may be provided below the display 201.

[0051] The electronic device 200 may be provided with components for performing various functions of the electronic device 200 around the location where the receiver 202 is installed. These components may include at least one sensor module 204. This sensor module 204 may include at least one of an illumination sensor (e.g., an optical sensor), a proximity sensor, an infrared sensor, and / or an ultrasonic sensor. These components may include a front camera 205 and an indicator 206 (e.g., a light emitting diode) for indicating status information of the electronic device 200 to the user.

[0052] The display 201 may be formed as a large screen, wherein the display 201 occupies most of the front surface 2001 of the electronic device 200. A home key 210a, a menu key 210b, and a back key 210c may be formed below the display 201.

[0053] The electronic device 200 may be provided with various electronic components on the lower surface 224. For example, the microphone 203, the speaker hole 208, the interface 207, and the headphone jack 209 may be provided on the lower surface 224. However, the embodiment is not limited thereto, and at least one of the above-mentioned electronic components may also be provided on the left side surface 221, the right side surface 222, or the upper side surface 223 of the housing 250.

[0054] The electronic device 200 may be provided with at least one first side key 211 on the left side surface 221. The at least one first side key 211 may be formed as a pair and may be provided on the left side surface 221 where a portion of the first side key 211 protrudes, and may perform, for example, volume up / down functions, scroll functions.

[0055] The electronic device 200 may be provided with at least one second side key 212 at the right side surface 222. The second side key 212 may, for example, perform a power on / off function, a wake-up and / or sleep function of the electronic device 200.

[0056] The electronic device 200 may be provided with a rear camera 213 on a rear surface (i.e., a second surface) 2002 facing the front surface, and at least one electronic component 214 may be arranged around the rear camera 213. For example, the electronic component 214 may include at least one of an illumination sensor (e.g., an optical sensor), a proximity sensor, an infrared sensor, an ultrasonic sensor, a heart rate sensor, a flash device, or a fingerprint scanning sensor.

[0057] The electronic device 200 may be provided with a heat source on at least one of the left side surface 221 and the right side surface 222. The heat source may be an antenna module for high-speed communication (e.g., millimeter wave communication) in a frequency band of approximately 20 GHz or higher. The antenna module may be arranged perpendicularly (e.g., in the Z-axis direction) to the front surface 2001 and the rear surface 2002 of the electronic device 200 between a battery (e.g., battery 189 (not shown)) and a side surface (i.e., the right side surface or the left side surface) of the electronic device 200.

[0058] The electronic device 200 may include a heat diffusion member for diffusing heat provided by a heat source to the outside of the electronic device. Figures 3A to 5B The heat dissipation structure including the heat diffusion member is described. For the convenience of description, it is assumed that the heat source is the antenna module.

[0059] Figure 3A A heat dissipation structure of an electronic device according to an embodiment is shown. Figure 3B It is along Figure 3A The cross section is taken along the line AA'. Figure 3C A heat diffusion member according to an embodiment is shown. Figure 3D FIG. 4 illustrates a heat dissipation path provided by an antenna module according to an embodiment.

[0060] Reference Figures 3A to 3D An electronic device of an embodiment of the present disclosure (eg, electronic device 101 or electronic device 200 ) may include a display 301 , a bracket 31 , a side housing 32 , an antenna module 310 , a conductor plate 320 , a heat pipe 330 , a thermal interface material 340 , and a battery 350 .

[0061] The display 301 may be exposed through at least a portion of the front surface of the electronic device and may be supported by a bracket 31. At least a portion of the bracket 31 may be formed of metal. A portion of the bracket 31 may be coupled or bonded to a side housing 32, which may be formed of an injection molded product (e.g., plastic).

[0062] The battery 350 may be disposed within the electronic device (eg, between the front and rear surfaces of the electronic device). The antenna module 310 may be located between the battery 350 and the side housing 32. The antenna module 310 may be disposed perpendicular to the front and rear surfaces of the electronic device.

[0063] The antenna module 310 may include at least one communication module 311 for processing high-speed wireless signals, a substrate 313 on which the at least one communication module 311 is mounted, and an antenna pattern 312. The communication module 311 may be arranged on an inner surface 313a of the substrate 313, and the antenna pattern 312 may be arranged on an outer surface 313b of the substrate 313. The communication module 311 may also include a member for shielding electromagnetic waves provided by the communication circuit and external interference signals. For example, a conductive shield or a conductively coated injection molded member may surround at least a portion of the communication module 311.

[0064] At least the communication module 311 on the inner surface of the antenna module 310 can be in thermal contact with the conductor plate 320. For example, the inner surface of the antenna module 310 and the conductor plate 320 can be in contact with each other via a thermal interface material (TIM) 340 (i.e., a first thermal interface material). The TIM 340 can be a single layer or multiple layers and can have thermal conductivity. For example, the TIM 340 can have a thermal conductivity of approximately 1 W / mK or higher (e.g., approximately 4 W / mK). Furthermore, the TIM 340 can be electrically conductive or non-conductive. For example, when the TIM 340 is electrically conductive, it can shield against electrical noise or electromagnetic interference (EMI). The TIM 340 can also have excellent wear resistance or heat resistance and can be made of a thermoplastic material.

[0065] TIM 340 may include a phase change material (PCM) that can change from a solid phase to a liquid phase by heat. A liquid phase PCM may have viscosity and may be compressible or incompressible. TIM 340 may include a material having at least one physical property that changes with heat. For example, a thermal interface material may have high viscosity due to heat.

[0066] The TIM 340 may be molded in a surface treated thermally conductive material such as silicon, silicone polymer, graphite, acrylic, etc.

[0067] The conductor plate 320 may collect and diffuse heat provided from the antenna module 310 and may be formed of a high thermal conductivity material such as copper.

[0068] The conductor plate 320 may have a specific shape (eg, a rectangular shape) and may contact the upper surface of the antenna module 310 (eg, the communication module 311) through the TIM 340. Figure 3C As shown, the conductor plate 320 may be adhered to the TIM 340 near the center of the conductor plate 320 and connected to the heat pipe 330 on both sides of the conductor plate 320. This is merely an example, and the conductor plate 320 may be connected to the heat pipe 330 on only one side of the conductor plate 320. The conductor plate 320 may contact the heat pipe 330 via a second thermal interface material or welding.

[0069] The heat pipe 330 may be a thermal interface member capable of transferring a large amount of heat to a relatively low-temperature area using a fluid having a high specific heat capacity. For example, the heat pipe 330 may control the transfer of heat provided by the antenna module 310 to a relatively low-temperature area, diffuse the heat transfer path to the area surrounding the heat pipe 330, and disperse the heat to areas away from the area surrounding the heat pipe 330. The heat pipe 330 has a known structure, and therefore a detailed description thereof is omitted.

[0070] Heat pipe 330 can be a heat transfer path, a heat transfer diffusion path, or a heat dissipation path. Heat pipe 330 can be configured in various shapes, can have one end in contact with conductor plate 320, and can have an opposite end arranged in a low temperature area. Heat pipe 330 can be configured in a flat cross-sectional shape to maximize the bonding surface of conductor plate 320.

[0071] like Figure 3D As shown, heat provided by the communication module 311 mounted in the substrate 313 can be transferred to the conductor plate 320 via the thermal interface material 340 , and moved and / or diffused to a lower temperature area via the heat pipe 330 connected to the conductor plate 320 .

[0072] The heat diffusion member (eg, the conductor plate 320 and the heat pipe 330 ) may contact the bracket 31 of the metal material. In this way, the heat provided by the antenna module 310 may be diffused through the bracket 31 of the metal material.

[0073] Since the antenna module 310, the conductor plate 320, and the heat pipe 330 are arranged vertically, rather than horizontally, relative to the front and rear surfaces of the electronic device 200, the above embodiment can minimize the lateral (e.g., X-axis) size of the installation space for installing the heat dissipation structure. In turn, the electronic device 200 can ensure the installation space (e.g., lateral length) of the battery 350 and / or can prevent the lateral size of the electronic device 200 from increasing.

[0074] Figure 4A A heat dissipation structure of an electronic device according to an embodiment is shown. Figure 4B It is along Figure 4A The cross section is taken along the line BB'. Figure 4C A heat diffusion member according to an embodiment is shown.

[0075] Reference Figures 4A to 4C , the electronic device may include a display 401 , a bracket 41 , a side housing 42 , an antenna module 410 , a heat pipe 420 , a thermal interface material 440 , and a battery 450 . Figures 4A to 4C The display 401, the bracket 41, the side housing 42, the antenna module 410 including the communication module 411, the antenna pattern 412 and the substrate 413, the thermal interface material 440 and the battery 450 are similar to Figures 3A to 3DThe display 301, the bracket 31, the side housing 32, the antenna module 310, the thermal interface material 340 and the battery 350 are shown in FIG. Therefore, a detailed description thereof is omitted.

[0076] The heat pipe 420 may include a first portion 421 and at least one second portion 422. The first portion 421 is in thermal contact with the antenna module 410 via the thermal interface material 440. The at least one second portion 422 has a height difference from the first portion 421 and extends parallel to the first portion 421. The first portion 421 may have a thinner thickness (e.g., horizontal length) than the second portion 422, which minimizes the lateral direction (e.g., the length of the second portion 422). Figure 2A The thickness of the second portion 422 may be similar to that of the antenna module 410.

[0077] The first portion 421 may not have a structure for heat diffusion (eg, a capillary structure), or may have a smaller structure than the second portion 422. The first portion 421 may have a certain strength so that it can support the antenna module 410.

[0078] A portion of the heat pipe 420 (eg, the first portion 421) may have Figures 3A to 3D The role / function of the conductor plate 320.

[0079] In the above-mentioned heat dissipation structure, the heat provided by the communication module 411 can be transferred to the first part 421 of the heat pipe 420 through the thermal interface material 440, and the heat transferred to the first part 421 can be moved and / or diffused to a low temperature area through the second part 422 of the heat pipe 420.

[0080] Figure 5A A heat dissipation structure of an electronic device according to an embodiment is shown. Figure 5B A heat diffusion member according to an embodiment is shown.

[0081] Reference Figure 5A and Figure 5B An electronic device of an embodiment of the present disclosure (eg, electronic device 101 or electronic device 200 ) may include a display 501 , a bracket 51 , a side housing 52 , an antenna module 510 , a conductor plate 520 , a heat pipe 530 , a thermal interface material 540 , and a battery 550 . Figure 5A and Figure 5B The display 501, the bracket 51, the side housing 52, the antenna module 510 including the communication module 511, the antenna pattern 512 and the substrate 513, the heat pipe 530, the thermal interface material 540 and the battery 550 are similar to those described above. Figures 3A to 3D The display 301, the bracket 31, the side housing 32, the antenna module 310, the heat pipe 330, the thermal interface material 340 and the battery 350 are shown in FIG.

[0082] The conductor plate 520 may have The antenna module 510 may be shaped and may include a contact surface 522 and a support surface 521. The contact surface 522 contacts the communication module 511 of the antenna module 510 through the thermal interface material 540. The support surface 521 extends perpendicular to the contact surface 522 and supports the contact surface 522. For example, the support surface 521 may be coupled to the bracket 51 to more stably support the antenna module 510.

[0083] The support surface 521 may be located at a lower end of the display 501 and may contact another heat diffusion member (eg, a vapor chamber) that diffuses heat of the display 501 .

[0084] In the above heat dissipation structure, heat provided by the communication module 511 can be transferred to the contact surface 522 of the conductor plate 520 via the thermal interface material 540, and can be moved / diffused to a lower temperature area via the heat pipe 530 connected to the contact surface 522. The heat transferred to the contact surface 522 can be moved / diffused to a lower temperature area via the bracket 51 connected to the support surface 521 and / or another heat diffusion member.

[0085] Figure 6 FIG. 1 shows a result of measuring heat dissipation of an electronic device according to an embodiment.

[0086] Reference Figure 6 When the electronic device of various embodiments of the present disclosure (e.g., electronic device 101 or electronic device 200) does not have a heat dissipation structure, as shown by reference numeral 610, an area 601 where an antenna module (e.g., antenna module 310, antenna module 410, or antenna module 510) is located may have a relatively higher temperature (e.g., 39.5 degrees) than the surrounding environment because the antenna module consumes high current during high-speed communication, and the consumed current is converted into heat.

[0087] In an electronic device applying the heat dissipation structure of the present disclosure, as shown by reference numeral 620, the area 601 where the antenna module is located can have a temperature similar to that of the surrounding environment (for example, 36.7 degrees) because the heat provided by the antenna module has been diffused to the surrounding environment through the heat dissipation structure.

[0088] The electronic device as described above (e.g., electronic device (101), electronic device (200)) includes: a housing including a first surface (e.g., front surface (2001)), a second surface facing the first surface (e.g., rear surface (2002)), and a third surface perpendicular to the first and second surfaces (e.g., left side surface (221), right side surface (222), upper side surface (223), lower side surface (224)); a display (e.g., display device (160), display (201), display (301), display (401), display (501)) exposed through at least a portion of the first surface; a battery (e.g., battery (189), battery (350), battery (450), battery (550)) arranged between the first and second surfaces; a heat source arranged between the battery and the third surface in a direction perpendicular to the first and second surfaces; and a heat diffusion member arranged perpendicular to the first and second surfaces and having a portion that is in thermal contact with at least a portion of the heat source and diffuses heat provided by the heat source to another portion.

[0089] The heat generating source may include an antenna module (eg, antenna module (310), antenna module (410), antenna module (510)) configured to communicate in a frequency band of 20 GHz or higher.

[0090] The antenna module may include: a substrate arranged in a vertical direction (e.g., substrate (313), substrate (413), substrate (513)); a communication module (e.g., communication module (311), communication module (411), communication module (511)) installed in the inner surface of the substrate; and an antenna pattern (e.g., antenna pattern (312), antenna pattern (412), antenna pattern (512)) installed in the outer surface of the substrate.

[0091] The heat diffusion member may include a conductor plate (e.g., conductor plate (320), conductor plate (520)) for collecting heat from a heat source, a thermal interface material (e.g., first thermal interface material (340), thermal interface material (540)) arranged between the conductor plate and the heat source, and at least one heat pipe (e.g., heat pipe (330), heat pipe (530)) contacting or welded to the conductor plate.

[0092] The conductor plate may include a contact surface (eg, contact surface (522)) that contacts the heat source and a support surface (eg, support surface (521)) that extends perpendicular to the contact surface and supports the contact surface.

[0093] The support surface may contact another heat diffusion member that diffuses heat provided by the display.

[0094] The heat diffusion member may include a heat pipe (e.g., a heat pipe (420)) and a thermal interface material (e.g., a thermal interface material (440)) disposed between the heat pipe and the heat source. The heat pipe may include a first portion (e.g., a first portion (421)) in thermal contact with the heat source via the thermal interface material, and at least one second portion (e.g., a second portion (422)) having a height difference from the first portion and extending parallel to the first portion.

[0095] The horizontal length (eg, thickness) of the first portion may be smaller (eg, thinner) than the horizontal length of the second portion.

[0096] The electronic device may further include a metal bracket (eg, bracket (31), bracket (41), bracket (51)) for supporting the display.

[0097] The heat diffusion member may contact the metal bracket.

[0098] The electronic device as described above (e.g., electronic device (101), electronic device (200)) includes: a housing; a display (e.g., display device (160), display (201), display (301), display (401), display (501)) exposed through at least a portion of the front surface of the housing; a battery (e.g., battery (189), battery (350), battery (450), battery (550)) arranged in the housing; an antenna module (e.g., antenna module (310), antenna module (410), antenna module (510)) arranged perpendicular to the display between the battery and the side surface of the housing and supporting communication in a frequency band of 20 GHz or higher; a conductor plate (e.g., conductor plate (320), conductor plate (520)) in thermal contact at one end with at least a portion of the inner surface of the antenna module; and a heat pipe (e.g., heat pipe (330), heat pipe (530)) in contact with the conductor plate at one end and arranged perpendicular to the display.

[0099] The antenna module may include: a substrate arranged in a vertical direction (e.g., substrate (313), substrate (413)); a communication module (e.g., communication module (311), communication module (411), communication module (511)) installed in the inner surface of the substrate; and an antenna pattern (e.g., antenna pattern (312), antenna pattern (412), antenna pattern (512)) installed in the outer surface of the substrate.

[0100] The electronic device may further include a first thermal interface material (eg, thermal interface material (340), thermal interface material (540)) disposed between the communication module and the conductor plate, and a second thermal interface material disposed between the conductor plate and the heat pipe.

[0101] The conductor plate may include: a contact surface (eg, contact surface (522)) contacting the antenna module; and a support surface (eg, support surface (521)) extending perpendicular to the contact surface and supporting the contact surface.

[0102] The support surface may contact a further heat diffusion member that diffuses heat provided by the display.

[0103] The electronic device may further include a bracket (eg, bracket (31), bracket (41), bracket (51)) made of a metal material for supporting the display.

[0104] The heat pipe may be in contact with the support of the metal material at a portion thereof.

[0105] The electronic device as described above (e.g., electronic device (101), electronic device (200)) includes: a housing; a display (e.g., display device (160), display (201), display (301), display (401), display (501)) exposed through at least a portion of the front surface of the housing; a battery (e.g., battery (189), battery (350), battery (450), battery (550)) arranged in the housing; an antenna module (e.g., antenna module (310), antenna module (410), antenna module (510) arranged perpendicular to the display between the battery and the side surface of the housing and supporting communication in a frequency band of 20 GHz or higher; and a heat pipe (e.g., heat pipe (420)) in thermal contact with at least a portion of the inner surface of the antenna module at a portion and arranged perpendicular to the display.

[0106] The heat pipe may include a first portion (e.g., first portion (421)) in thermal contact with the antenna module through a thermal interface material, and at least one second portion (e.g., second portion (422)) having a height difference with the first portion and extending parallel to the first portion.

[0107] A horizontal length of the first portion may be smaller than a horizontal length of the second portion.

[0108] By minimizing the installation space for heat dissipation components, the electronic device of the present disclosure addresses the limitations of structural changes in electronic devices, battery size reduction, and terminal size increase. Furthermore, the present disclosure can effectively dissipate heat provided by the antenna module, thereby providing stable high-speed data communication. For example, embodiments of the present disclosure can reduce the frequency at which high-speed data communication is restricted by the communication module or access point due to high temperatures.

[0109] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0110] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0111] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "portion," or "circuit." A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0112] The embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0113] The method according to the embodiment of the present disclosure may be included and provided in a computer program product, which may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0114] Each component in the above-mentioned components (for example, module or program) can comprise single entity or multiple entities.One or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (for example, module or program) can be integrated into a single component. In this case, the integrated component can still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. The operation performed by module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operation can be run or omitted in different orders, or one or more other operations can be added.

Claims

1. An electronic device comprising: a housing comprising a first surface, a second surface facing the first surface, and a third surface perpendicular to the first surface and the second surface; a display exposed through at least a portion of said first surface; a battery disposed between the first surface and the second surface; a heat source disposed between the battery and the third surface; as well as a first heat diffusion member arranged perpendicular to the first surface and the second surface, the first heat diffusion member including a first portion in thermal contact with at least a portion of the heat source and diffusing heat provided by the heat source to at least one second portion; The heat source includes an antenna module. The antenna module comprises: substrate; a communication module mounted in a first surface of the substrate facing the battery; and An antenna pattern is installed in a second surface of the substrate opposite to the first surface of the substrate.

2. The electronic device according to claim 1, The heat generating source includes the antenna module configured to communicate in a frequency band of at least 20 gigahertz (GHz). The electronic device according to claim 1 , further comprising a metal bracket supporting the display.

4. The electronic device according to claim 3, The heat diffusion member contacts the metal bracket.

5. An electronic device comprising: case; a display exposed through at least a portion of the front surface of the housing; a battery disposed within the housing; an antenna module disposed perpendicular to the display and between the battery and a side surface of the housing and supporting communication in a frequency band of at least 20 gigahertz (GHz); a conductor plate in thermal contact with at least a portion of an inner side surface of the antenna module at a first end of the conductor plate; as well as a heat pipe, contacting the first end of the conductor plate at a first end of the heat pipe and arranged perpendicular to the display, The antenna module comprises: substrate; a communication module mounted in a first surface of the substrate facing the battery; and An antenna pattern is installed in a second surface of the substrate opposite to the first surface of the substrate.

6. The electronic device according to claim 5, further comprising: a first thermal interface material disposed between the communication module and the conductor board; and A second thermal interface material is disposed between the conductor plate and the heat pipe.

7. The electronic device according to claim 5, wherein the conductive plate comprises: contacting a contact surface of the antenna module; and A supporting surface extends perpendicularly to the contact surface and supports the contact surface. 8 . The electronic device according to claim 7 , wherein the support surface contacts a heat diffusion member that diffuses heat provided by the display.

9. The electronic device according to claim 5, further comprising a bracket made of a metal material for supporting the display.

10. The electronic device according to claim 9, The heat pipe contacts the bracket made of metal material at the second end of the heat pipe.

11. An electronic device comprising: case; a display exposed through at least a portion of the front surface of the housing; a battery disposed within the housing; an antenna module disposed perpendicular to the display and between the battery and a side surface of the housing and supporting communication in a frequency band of at least 20 gigahertz (GHz); as well as a heat pipe that thermally contacts at least a portion of an inner surface of the antenna module at a first portion of the heat pipe and is arranged perpendicular to the display, The antenna module comprises: substrate; a communication module mounted in a first surface of the substrate facing the battery; and An antenna pattern is installed in a second surface of the substrate opposite to the first surface of the substrate.

12. The electronic device according to claim 11, wherein the heat pipe comprises: The first portion is in thermal contact with the antenna module via a thermal interface material; and At least one second portion is different in height from the first portion and extends parallel to the first portion.

13. The electronic device according to claim 12, The thickness of the first portion is thinner than that of the second portion.

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