A micro-vibration sensing module and a micro-vibration detection sensor device

Abstract

The present invention discloses a micro-vibration sensing module and a micro-vibration detection sensor device, including a vibration base and a sensing film, wherein the vibration base is a sleeve, and the sleeve includes an upper sleeve section and a lower sleeve section located at different axial positions thereof, and the upper sleeve section is provided with a plurality of opening structures evenly distributed along its circumference, and each opening structure includes a first split opening and a second split opening. In the present invention, the second split opening plays a role similar to a lever when sensing a tiny mechanical force or a vibration signal, so that the mechanical quantity signal can be concentrated at the tail of the second split opening (the second open end), so that the position of the second split opening will produce a corresponding deformation, thereby causing the sensing film to have an obvious back-and-forth "breathing effect" at the tail of the second split opening, and the sensing film located at the tail of the second split opening produces a resistance change, thereby realizing high-precision detection of weak vibration signals.

Description

Technical Field

[0001] The present invention belongs to the technical field of micro sensors, and in particular relates to a micro vibration sensing module and a micro vibration detection sensor device. Background Art

[0002] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to those skilled in the art.

[0003] Traditional large-sized and single-function sensors often cannot meet the high-performance requirements of current high-precision detection, micro-nano control, human-computer interaction, aviation, remote sensing, and medical treatment. Therefore, they have been gradually replaced by various types of high-performance micro-vibration sensors. The research and development of vibration sensors is also gradually developing towards the micro-nano scale. Now the size of sensors is getting smaller and smaller, and the functions are getting more and more powerful. The simplified design and economical preparation of micro-structures with integrated high-precision detection functions of vibration signals are the key to the market application of micro-vibration sensors. The existing design principles and preparation methods need to be further developed. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is how to achieve high-precision detection of tiny vibration signals.

[0005] To solve the above technical problems, the present invention provides 1. a micro-vibration sensing module, comprising a vibration substrate and a sensing film, wherein the sensing film comprises a flexible substrate, a conductive layer and two electrodes, wherein two ends of the flexible substrate are fixed on the vibration substrate, the conductive layer has micro-cracks and is arranged on the surface of the flexible substrate, and the two electrodes are arranged on the conductive layer and are respectively close to the two ends of the flexible substrate.

[0006] The vibration base is a shaft sleeve, and the shaft sleeve includes an upper shaft sleeve section and a lower shaft sleeve section located at different axial positions thereof. The upper shaft sleeve section is provided with a plurality of opening structures evenly distributed along its circumference, and each of the opening structures includes a first split opening and a second split opening, the length direction of the first split opening is parallel to the axial direction of the upper shaft sleeve section, the two ends of the first split opening along its length direction are respectively a first closed end and a first open end penetrating the annular free end face of the upper shaft sleeve section, the first split opening penetrating the inner side face and the outer side face of the upper shaft sleeve section along its depth direction, the length direction of the second split opening is coaxial with the circumferential direction of the upper shaft sleeve section, the two ends of the second split opening along its length direction are respectively a second closed end and a second open end penetrating the side wall of the first split opening, the second split opening penetrating the inner side face and the outer side face of the upper shaft sleeve section along its depth direction, and the two ends of the sensing membrane are respectively fixed to the two sides of the second split opening along its width direction.

[0007] Preferably, the length of the first split opening is 2 / 3 of the axial length of the sleeve.

[0008] Preferably, the width of the second split opening is 1-2 mm, and the length of the second split opening is 1 / 3 of the circumference of the upper shaft sleeve segment.

[0009] Preferably, the upper shaft sleeve section is provided with two opening structures.

[0010] Preferably, the first dividing opening divides the upper sleeve section into a plurality of arc-shaped plate areas, the fan-shaped end surfaces of the plurality of arc-shaped plate areas are centrally symmetrical with respect to the central axis of the sleeve, and the fan-shaped end surface of each arc-shaped plate area includes a fan-shaped plane and a spiral downslope surface located at different positions in the direction of its arc length, the fan-shaped plane is close to the second open end position, and the spiral downslope surface is close to the second closed end position.

[0011] Preferably, the first closed end and the second closed end are both arc surfaces.

[0012] Preferably, the sensing film further comprises a packaging layer for packaging the conductive layer and the electrode.

[0013] The present invention also provides another technical solution: a micro-vibration detection sensor device, comprising a base, an outer cover, a first stud, a first insulating sleeve, the micro-vibration sensing module, a mass block and a pressure block, wherein the base is installed on the target to be measured, the outer cover is connected to the upper part of the base and forms an installation cavity, the first stud is vertically connected to the upper part of the base and is located in the installation cavity, the lower shaft sleeve section is sleeved and fixed on the first stud, the mass block is sleeved on the first stud and pressed on the annular free end surface of the upper shaft sleeve section, and the pressure block is fixedly connected to the first stud and is located above the mass block;

[0014] The base transfers the vibration force of the target to be measured upward to the vibration base, and the mass block transfers its own weight downward to the vibration base. The vibration base vibrates reciprocatingly, and the reciprocating vibration of the vibration base causes the width of the second split opening to change. The change in the width of the second split opening causes the flexible base to deform. The deformation of the flexible base causes the cracks and resistance of the conductive layer to change. The two electrodes are used to transmit signals.

[0015] Preferably, it also includes a second stud and a second insulating sleeve, the second stud is connected to the side of the base and is located outside the installation cavity, the base is provided with a wire channel A, the second stud is provided with a wire channel B, one end of the wire channel A passes through the upper part of the base, one end of the wire channel B passes through the free end surface of the second stud, the other end of the wire channel A is connected to the other end of the wire channel B, the second insulating sleeve is arranged in the wire channel B, and a wire output terminal is arranged in the second insulating sleeve, and the wire output terminal is connected to the electrode through a wire passing through the wire channel A and the wire channel B.

[0016] Preferably, it further comprises a third stud, wherein the third stud is vertically connected to the lower portion of the base.

[0017] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0018] The micro-vibration sensing module and micro-vibration detection sensor device disclosed in the present invention, by setting the vibration base into a sleeve shape, the second split opening plays a role similar to a lever when sensing tiny mechanical forces or vibration signals, so that the mechanical quantity signal can be concentrated at the tail of the second split opening (the second open end), so that the position of the second split opening will produce a corresponding deformation, thereby causing the sensor film to have an obvious back-and-forth "breathing effect" at the tail of the second split opening, and the sensor film located at the tail of the second split opening produces a resistance change, thereby realizing high-precision detection of weak vibration signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0020] Figure 1 It is a structural schematic diagram of the micro-vibration sensing module disclosed in the present invention;

[0021] Figure 2 It is a schematic diagram of the structure of the vibration substrate disclosed in the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the sensing membrane disclosed in the present invention;

[0023] Figure 4 It is a schematic diagram of the appearance of the micro-vibration detection sensor device disclosed in the present invention;

[0024] Figure 5 It is a schematic diagram of the interior of the micro-vibration detection sensor device disclosed in the present invention (excluding the outer cover);

[0025] Figure 6It is an internal schematic diagram of the micro-vibration detection sensor device disclosed in the present invention (excluding the mass block and the pressure block);

[0026] Figure 7 It is a cross-sectional view of the micro-vibration detection sensor device disclosed in the present invention.

[0027] Among them, 1. micro-vibration sensing module; 11. vibration base; 111. upper shaft sleeve section; 112. lower shaft sleeve section; 113. first split opening; 114. second split opening; 115. fan-shaped plane; 116. spiral downslope surface; 12. sensing film; 121. flexible base; 122. conductive layer; 123. electrode; 124. packaging layer; 125. wire output terminal; 126. wire; 2. base; 21. wire channel A; 3. outer cover; 4. first stud; 5. first insulating sleeve; 6. mass block; 7. pressure block; 8. second stud; 81. wire channel B; 9. second insulating sleeve; 10. third stud. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is further described in detail below in conjunction with the drawings and examples.

[0029] It should be noted that the following detailed descriptions are exemplary and are intended to provide further improved descriptions for the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those generally understood by those of ordinary skill in the art to which the present application belongs. It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context otherwise clearly indicates, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "include" and / or "include" are used in this specification, it indicates that there are features, steps, operations, devices, components and / or combinations thereof. In the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "side", "bottom" etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only a relationship word determined for the convenience of describing the structural relationship of each component or element of the present disclosure, and does not specifically refer to any component or element in the present disclosure, and cannot be understood as a limitation to the present disclosure. In the present disclosure, terms such as "fixed connection", "connected", "connection", etc. should be understood in a broad sense, indicating that it can be fixedly connected, integrally connected or detachably connected; it can be directly connected or indirectly connected through an intermediate medium. For relevant scientific research or technical personnel in this field, the specific meanings of the above terms in the present disclosure can be determined according to specific circumstances, and they cannot be understood as limitations on the present disclosure.

[0030] The following is a preferred embodiment for illustrating the present invention, but is not intended to limit the scope of the present invention.

[0031] Embodiment 1

[0032] See also Figures 1 to 3 As shown in the figure, a micro-vibration sensing module 1 includes a vibration substrate 11 and a sensing film 12. The sensing film 12 includes a flexible substrate 121, a conductive layer 122 and two electrodes 123. The two ends of the flexible substrate 121 are fixed on the vibration substrate 11. The conductive layer 122 has microcracks and is arranged on the surface of the flexible substrate 121. The two electrodes 123 are arranged on the conductive layer 122 and are respectively close to the two ends of the flexible substrate 121.

[0033] The vibration base 11 is a shaft sleeve, which includes an upper shaft sleeve section 111 and a lower shaft sleeve section 112 located at different axial positions thereof. The upper shaft sleeve section 111 is provided with a plurality of opening structures evenly distributed along its circumference, each opening structure including a first split opening 113 and a second split opening 114. The length direction of the first split opening 113 is parallel to the axial direction of the upper shaft sleeve section 111. The two ends of the first split opening 113 along its length direction are respectively a first closed end and a first open end penetrating the annular free end surface of the upper shaft sleeve section 111. The first split opening 113 is parallel to the axial direction of the upper shaft sleeve section 111. The cut 113 penetrates the inner side surface and the outer side surface of the upper shaft sleeve section 111 along its depth direction, the length direction of the second cut 114 is coaxial with the circumferential direction of the upper shaft sleeve section 111, and the two ends of the second cut 114 along its length direction are respectively a second closed end and a second open end penetrating the side wall of the first cut 113, and the second cut 114 penetrates the inner side surface and the outer side surface of the upper shaft sleeve section 111 along its depth direction, and the two ends of the sensor membrane 12 are respectively fixed to the two sides of the second cut 114 along its width direction.

[0034] In a preferred implementation manner of this embodiment, the length of the first split opening 113 is 2 / 3 of the axial length of the sleeve, and the width of the second split opening 114 is 1-2 mm.

[0035] In a preferred implementation manner in this embodiment, the length of the second split opening 114 is 1 / 3 of the circumference of the upper shaft sleeve section 111 .

[0036] In the preferred implementation of this embodiment, the upper sleeve section 111 is provided with two opening structures.

[0037] In the preferred implementation manner of the present embodiment, a plurality of first dividing openings divide the upper sleeve section into a plurality of arcuate plate areas, and the fan-shaped end surfaces of the plurality of arcuate plate areas are centrally symmetrical with respect to the central axis of the sleeve. The fan-shaped end surface of each arcuate plate area includes a fan-shaped annular plane 115 and a spiral downslope surface 116 located at different positions in the direction of its arc length, the fan-shaped annular plane 115 is close to the second open end position, and the spiral downslope surface 116 is close to the second closed end position.

[0038] In the preferred implementation manner of this embodiment, both the first closed end and the second closed end are arc surfaces.

[0039] In a preferred implementation manner of this embodiment, the sensing film 12 further includes a packaging layer 124 for packaging the conductive layer 122 and the electrode 123 .

[0040] See also Figures 4 to 7 As shown in the figure, a micro-vibration detection sensor device includes a base 2, an outer cover 3, a first stud 4, a first insulating sleeve 5, a micro-vibration sensing module 1, a mass block 6 and a pressing block 7. The base 2 includes a mounting plate installed on the target to be measured, the outer cover 3 is connected to the upper part of the base 2 and forms an installation cavity, the first stud 4 is vertically connected to the upper part of the base 2 and is located in the installation cavity, the lower shaft sleeve section 112 is sleeved and fixed on the first stud 4, the mass block 6 is sleeved on the first stud 4 and pressed on the annular free end surface of the upper shaft sleeve section 111, and the pressing block 7 is fixedly connected to the first stud 4 and is located above the mass block 6;

[0041] The base 2 transfers the vibration force of the target to be measured upward to the vibration base 11, and the mass block 6 transfers its own weight downward to the vibration base 11. The vibration base 11 vibrates back and forth. The reciprocating vibration of the vibration base 11 causes the width dimension of the second split opening 114 to change. The change in the width dimension of the second split opening 114 causes the flexible base 121 to deform. The deformation of the flexible base 121 causes the cracks and resistance of the conductive layer 122 to change. The two electrodes 123 are used to transmit signals.

[0042] The preferred implementation manner in this embodiment also includes a second stud 8 and a second insulating sleeve 9, the second stud 8 is connected to the side of the base 2 and is located outside the installation cavity, the base 2 is provided with a wire channel A21, the second stud 8 is provided with a wire channel B81, one end of the wire channel A21 passes through the upper part of the base 2, one end of the wire channel B81 passes through the free end surface of the second stud 8, the other end of the wire channel A21 is connected to the other end of the wire channel B81, the second insulating sleeve 9 is provided in the wire channel B81, and a wire output terminal 125 is provided in the second insulating sleeve 9, and the wire output terminal 125 is connected to the electrode 123 through a wire 126 passing through the wire channel A21 and the wire channel B81.

[0043] A preferred implementation manner in this embodiment further includes a third stud 10 , which is vertically connected to the lower part of the base 2 .

[0044] The present invention provides a method for preparing a vibration detection structure of a micro-vibration sensor, aiming to realize the low-cost, convenient and high-sensitivity production of a sensor element, and to provide a feasible solution for market application. When the fixing stud at the bottom of the sensor is fixed on the measured target, the vibration signal will be transmitted to the vibration sensing structure layer through the base, and the second splitting opening of the sensing layer will produce a corresponding "breathing effect" with the vibration signal under the action of the mass block, so that the flexible film at the tail of the second splitting opening will bend and deform with the change of the crack width, thereby triggering the flexible sensing layer to detect the vibration signal.

[0045] The vibration sensing principle can be summarized as follows: when there is external vibration stimulation, the vibration signal will act on the vibration sensor connected to the object to be measured. Under the action of the vibration signal, the mass block located above the micro-vibration sensing module causes the second split opening on the upper sleeve section to produce a reciprocating distance change, and further induces the metal layer with micro-cracks on the micro-vibration sensing membrane of the tail wing of the second split opening to produce a resistance change, and outputs a voltage signal through a wire and an external conversion circuit to achieve the function of vibration signal detection.

[0046] The above-mentioned sleeve is formed by a mold, the above-mentioned first dividing opening and the above-mentioned second dividing opening are prepared by milling, the above-mentioned sleeve is solidified by liquid material, the material of the sleeve is one of epoxy resin, photoresist, plastic, and silicon wafer, the basic shape structure of the above-mentioned sleeve is made into a hollow cylindrical base by a mold molding method, and the first dividing opening and the second dividing opening are made by milling.

[0047] The spiral downward slope surface is manufactured by grinding, and the slope of the spiral downward slope surface is 1:16.

[0048] The lower sleeve section of the sleeve is tightly fixed at the optical axis of the first stud by the first insulating sleeve.

[0049] The flexible substrate is a polyester resin film, a polypropylene film, a polydimethylsiloxane film, a polyvinylidene chloride film or a polyimide film.

[0050] The above-mentioned conductive layer is prepared by magnetron sputtering coating or electron beam evaporation coating or deposition or suspension coating, the cracks on the above-mentioned conductive layer are nanoscale cracks, the cracks on the above-mentioned conductive layer are prepared by mechanical bending or organic solvent induced expansion or light induced expansion, and the above-mentioned conductive layer is a metal layer, for example, one of gold, silver, platinum, copper, graphite, carbon nanotubes, and conductive ink.

[0051] The electrodes are copper foils, which fix the conductors on both sides of the metal layer that has not yet been micro-cracked.

[0052] The encapsulation layer is polydimethylsiloxane, POE, EVA, EPDM, rubber, etc.

[0053] The following is a method for preparing a micro-vibration detection sensor device, which includes the following steps:

[0054] Step S1, spray the mold with a release agent in advance and leave it for 1-3 minutes, then put the liquid material for making the sleeve into the mold to cool and solidify;

[0055] Step S2, drilling the solidified body to form a through hole with a diameter of 7 mm, and boring a circular hole with a diameter of 10 mm and a depth of 2 / 3 of the axial dimension of the solidified body;

[0056] Step S3, performing milling on the workpiece obtained above to make two first splitting openings in the axial direction of the upper sleeve segment;

[0057] Step S4, grinding the workpiece obtained above to produce a slope of 1:16 in a direction perpendicular to the joint surface of the mass block;

[0058] Step S5, performing milling processing on the workpiece obtained above, processing the curved surface of the workpiece, and making two second splitting cuts that are centrally symmetrical, and the second splitting cuts completely penetrate the thickness direction of the substrate layer, the width of the second splitting cuts is controlled between 1-2 mm, the length is controlled to be 2 / 3 of the arc length of the semicircular arc, and the tip of the second splitting cut retains an arc-shaped structure;

[0059] Step S6, laying the pre-processed sensing film flat at the end of the second split opening, with the side processed with the output wire facing outwards;

[0060] Step S7: wiring the wires, leading the wires to the wire output terminals, and assembling them to finally form a micro-vibration detection sensor device.

[0061] The preparation method of the above-mentioned sensing film is as follows: first, a conductive layer is plated on a flexible substrate, and electrodes are processed on both sides for signal transmission; then, a PDMS encapsulation layer of about 10 microns is coated on the surface of the flexible substrate, and a nanoscale crack structure is prepared; finally, the vibration substrate prepared above is cut.

[0062] In a preferred embodiment of the present invention, the through hole diameter of the lower sleeve section should be equal to the outer diameter of the first insulating sleeve, and the inner diameter of the first insulating sleeve should be equal to the outer diameter of the optical axis portion of the first stud. In this embodiment, the through hole diameter of the lower sleeve section is 7mm; the outer diameter of the first insulating sleeve is 7mm, and the inner diameter is 6mm; the unmarked linear dimension tolerance is processed according to GB / T1804-2000-m.

[0063] In a preferred embodiment of the present invention, epoxy resin material is used as the material of the shaft sleeve. When epoxy resin material is used, epoxy resin A and B glue are prepared in a weight ratio of 2.5:1, and the sample liquid can be heated at 30°C-50°C for 1-5 hours to make the epoxy resin in a semi-cured state.

[0064] In a preferred embodiment of the present invention, polydimethylsiloxane is used as a flexible substrate material for illustration. When polydimethylsiloxane material is used, it is heated for 4 hours to obtain the best state for preparing a thin film. Before preparing the polydimethylsiloxane substrate, the surface of the glass substrate is cleaned with acetone and ethanol, and then the cleaned glass substrate is hydroxylated, and polydimethylsiloxane is suspended and coated. After curing, a polydimethylsiloxane film substrate can be obtained. In addition, before using polydimethylsiloxane to prepare the encapsulation layer, the substrate needs to be sprayed with a metal layer and wires are arranged, and cracks are induced after the encapsulation is completed.

[0065] The above is a description of the embodiments of the present invention. Through the above description of the disclosed embodiments, professionals and technicians in the field can implement or use the present invention. Various modifications to these embodiments will be obvious to professionals and technicians in the field. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A micro-vibration sensing module, comprising a vibration substrate and a sensing film, wherein the sensing film comprises a flexible substrate, a conductive layer, two electrodes and a packaging layer for packaging the conductive layer and the electrodes, wherein two ends of the flexible substrate are fixed on the vibration substrate, the conductive layer has microcracks and is arranged on the surface of the flexible substrate, and the two electrodes are arranged on the conductive layer and are respectively close to the two ends of the flexible substrate. It is characterized in that The vibration base is a sleeve, and the sleeve includes an upper sleeve section and a lower sleeve section located at different axial positions thereof. The upper sleeve section is provided with a plurality of opening structures evenly distributed along its circumference, and each of the opening structures includes a first split opening and a second split opening, the length direction of the first split opening is parallel to the axial direction of the upper sleeve section, the two ends of the first split opening along its length direction are respectively a first closed end and a first open end penetrating the annular free end face of the upper sleeve section, the first split opening penetrating the inner side face and the outer side face of the upper sleeve section along its depth direction, the length direction of the second split opening is coaxial with the circumferential direction of the upper sleeve section, the two ends of the second split opening along its length direction are respectively a second closed end and a second open end penetrating the side wall of the first split opening, the second split opening penetrating the inner side face and the outer side face of the upper sleeve section along its depth direction, the width of the second split opening is 1-2mm, and the two ends of the sensing membrane are respectively fixed to the two sides of the second split opening along its width direction.

2. The micro-vibration sensing module according to claim 1, It is characterized in that The length of the first split opening is 2 / 3 of the axial length of the sleeve.

3. The micro-vibration sensing module according to claim 1, It is characterized in that The length of the second split opening is 1 / 3 of the circumference of the upper shaft sleeve segment.

4. The micro-vibration sensing module according to claim 1, It is characterized in that The upper shaft sleeve section is provided with two opening structures.

5. The micro-vibration sensing module according to claim 1, It is characterized in that The first dividing opening divides the upper sleeve section into a plurality of arcuate plate areas, the fan-shaped end surfaces of the plurality of arcuate plate areas are centrally symmetrical with respect to the central axis of the sleeve, and the fan-shaped end surface of each arcuate plate area includes a fan-shaped plane and a spiral downslope surface located at different positions in the arc length direction thereof, the fan-shaped plane is close to the second open end position, and the spiral downslope surface is close to the second closed end position.

6. The micro-vibration sensing module according to claim 1, It is characterized in that The first closed end and the second closed end are both arc surfaces.

7. A micro-vibration detection sensor device, comprising a base, an outer cover, a first stud, a first insulating sleeve, a micro-vibration sensing module according to any one of claims 1 to 6, a mass block and a pressure block, wherein the base is installed on a measured target, the outer cover is connected to the upper part of the base and forms an installation cavity, the first stud is vertically connected to the upper part of the base and is located in the installation cavity, the lower shaft sleeve section is sleeved and fixed on the first stud, the mass block is sleeved on the first stud and pressed on the annular free end surface of the upper shaft sleeve section, and the pressure block is fixedly connected to the first stud and is located above the mass block; The base transfers the vibration force of the target to be measured upward to the vibration base, and the mass block transfers its own weight downward to the vibration base. The vibration base vibrates reciprocatingly, and the reciprocating vibration of the vibration base causes the width of the second split opening to change. The change in the width of the second split opening causes the flexible base to deform. The deformation of the flexible base causes the cracks and resistance of the conductive layer to change. The two electrodes are used to transmit signals.

8. The micro-vibration detection sensor device according to claim 7, It is characterized in that It also includes a second stud and a second insulating sleeve, the second stud is connected to the side of the base and is located outside the installation cavity, the base is provided with a wire channel A, the second stud is provided with a wire channel B, one end of the wire channel A passes through the upper part of the base, one end of the wire channel B passes through the free end surface of the second stud, the other end of the wire channel A is connected to the other end of the wire channel B, the second insulating sleeve is arranged in the wire channel B, and the second insulating sleeve is provided with a wire output terminal, and the wire output terminal is connected to the electrode through a wire passing through the wire channel A and the wire channel B.

9. The micro-vibration detection sensor device according to claim 7, It is characterized in that Also included is a third stud, which is vertically connected to the lower portion of the base.

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