Semiconductor module automatic assembly device

Abstract

The present invention provides a semiconductor module automatic assembly device, which comprises a clamp mechanism, a blanking rack mechanism, a material conveying rack mechanism, a docking platform, a control mechanism and a device installation base; the clamp mechanism, the blanking rack mechanism and the material conveying rack mechanism are arranged above the device installation base, the docking platform is arranged on one side of the device installation base, the control mechanism is arranged on the other side of the installation base, and the blanking rack mechanism is connected to the material conveying rack mechanism; the present invention can realize the automatic assembly of semiconductor modules and improve work efficiency, and at the same time can assemble semiconductors of different models and specifications, thereby improving the application scope of the automatic assembly device, and the flexible design of the clamp module can enable the mechanical gripper to assemble without being restricted by the environment.

Description

Technical Field

[0001] The invention relates to the field of automatic assembly, in particular to an automatic assembly device for semiconductor modules. Background Art

[0002] Modern automated assembly machinery is developing rapidly, and its mechanical equipment can cooperate with the production of different types of devices. In recent years, the semiconductor industry has developed rapidly, and the demand for automated assembly machinery and equipment for semiconductors has increased significantly.

[0003] However, existing semiconductor automatic assembly machinery and equipment are often single-model devices that cannot achieve co-location assembly of semiconductors of different sizes. Moreover, during assembly, due to the large size of the machinery and equipment, it is inevitable that a large mechanical stress is generated on the semiconductor module, affecting the performance of the semiconductor. At the same time, due to the large size of the equipment, the cost of construction is high, the equipment occupies a large area, and the grabbing equipment in the equipment is in danger of damaging the semiconductor module components due to the lack of coordination with the surrounding environment. Summary of the invention

[0004] In order to overcome the above-mentioned disadvantages of the prior art, an object of the present invention is to provide a semiconductor module automatic assembly device.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A semiconductor module automatic assembly device comprises a clamp mechanism, a material blanking rack mechanism, a material conveying rack mechanism, a docking station and a control mechanism.

[0007] Clamp mechanism: used to clamp materials in the working area;

[0008] Dropping rack mechanism: used to guide the material to slide out of the material tube;

[0009] Material transfer rack mechanism: used to transfer the materials to be assembled to a position convenient for the fixture mechanism to take;

[0010] Docking station: used to connect the main board and position material assembly;

[0011] Control mechanism: used for manual start and stop device and alarm prompts.

[0012] As a further improvement of the present invention: the clamp mechanism, the blanking rack mechanism and the material conveying rack mechanism are arranged above the device mounting base, the docking platform is arranged on one side of the device mounting base, the control mechanism is arranged on the other side of the device mounting base, and the blanking rack mechanism is connected to the material conveying rack mechanism.

[0013] As a further improvement of the present invention: the clamp comprises a first clamp and a second clamp, and both the first clamp and the second clamp have an elastic clip and a soft fixing block.

[0014] As a further improvement of the present invention: the blanking rack mechanism includes a blanking rack movable plate, a blanking rack base, a blanking rack width adjustment handle, a blanking rack positioning rod, a blanking rack rear plate, a blanking rack threaded rod, a blanking rack baffle, a blanking rack push plate, a push plate bracket, a push plate servo motor and a push plate bracket push rod.

[0015] As a further improvement of the present invention: the movable plate of the blanking rack, the blanking rack width adjustment handle, the blanking rack positioning rod, the blanking rack rear plate, the blanking rack threaded rod, the push plate servo motor and the push plate bracket are all installed on the blanking rack base, the blanking rack baffle is bolted to the blanking rack rear plate, the blanking rack push plate is arranged on the push plate bracket, and the two ends of the push rod of the push plate bracket are respectively connected to the push plate servo motor and the push plate bracket.

[0016] As a further improvement of the present invention: the material conveying rack mechanism includes a conveying rack base, a conveying rack support plate, a conveying rack shell, a sensor, an adjustment servo motor, a driving electric servo motor, a pressure block linkage rod, a soft pressure block, a front baffle, a material slide rail, a material rack guide rod, a material rack threaded rod and a height servo motor.

[0017] As a further improvement of the present invention: the conveying frame support plate is arranged on the conveying frame base, the conveying frame shell is arranged on the conveying frame support plate, the sensor and the adjustment servo motor are arranged on the conveying frame shell, the pushing servo motor is arranged at the bottom of the conveying frame support plate, the pressure block linkage rod is arranged in the mounting groove of the conveying frame shell, the soft pressure block and the front baffle are arranged in the conveying frame shell, and the soft pressure block is connected to the pressure block linkage rod, the material slide rail, the material rack guide rod and the material rack threaded rod are arranged in the conveying frame shell, and the height servo motor is arranged on the conveying frame base.

[0018] As a further improvement of the present invention: the docking platform includes a platform base, a platform base, a docking platform width adjustment handle, a docking platform movable plate, a docking platform guide rod, a docking platform threaded rod, a front mainboard positioning frame, the docking platform visual inspection system, a rear mainboard positioning frame, and a transmission belt mechanism.

[0019] As a further improvement of the present invention: the platform base is arranged on the platform base foot, the docking platform width adjustment handle is arranged on one side of the platform base, the docking platform guide rod and the docking platform threaded rod are respectively connected to the docking platform movable plate and arranged on the platform base, the transmission belt mechanism is arranged on one side of the platform base, the front main board positioning frame, the rear main board positioning frame and the docking platform visual detection and positioning system are arranged on the platform base, and are arranged on the side of the docking platform movable plate facing the conveyor belt mechanism.

[0020] As a further improvement of the present invention: the control mechanism includes a control panel, an emergency stop switch, a start-stop switch and an alarm light; the control panel, the emergency stop switch, the start-stop switch and the alarm light are arranged on a control mechanism mounting seat.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] It can realize the automatic assembly of semiconductor modules and improve work efficiency. At the same time, it can assemble semiconductors of different models and specifications, which increases the application scope of the automatic assembly device. The flexible design of the fixture module enables the mechanical gripper to assemble without being restricted by the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a front schematic diagram of the device of the present invention.

[0024] Figure 2 It is a side schematic diagram of the device of the present invention.

[0025] Figure 3 It is a schematic diagram of the structure of the robot of the present invention.

[0026] Figure 4 It is a schematic diagram of the clamp structure of the present invention.

[0027] Figure 5 It is a front schematic diagram of the blanking rack mechanism of the present invention.

[0028] Figure 6 It is a side schematic diagram of the blanking rack mechanism of the present invention.

[0029] Figure 7 It is a schematic diagram of the back structure of the material conveying rack mechanism of the present invention.

[0030] Figure 8 It is a front structural schematic diagram of the material conveying rack mechanism of the present invention.

[0031] Fig. 9 It is a schematic diagram of the internal structure of the material conveying rack mechanism of the present invention.

[0032] Fig.10It is a schematic diagram of the docking station structure of the present invention.

[0033] Fig.11 It is a schematic diagram of the control mechanism structure of the present invention. DETAILED DESCRIPTION

[0034] The present invention is further described with reference to the accompanying drawings and embodiments:

[0035] According to the attached Figure 1 As shown, a semiconductor module automatic assembly device includes a clamp mechanism 1, a blanking rack mechanism 2, a material conveying rack mechanism 3, a docking platform 4, a control mechanism 5 and a device mounting base 6; the clamp mechanism 1, the blanking rack mechanism 2 and the material conveying rack mechanism 3 are arranged above the device mounting base 6, the docking platform 4 is arranged on one side of the device mounting base 6, and the control mechanism 5 is arranged on the other side of the device mounting base 6, and the blanking rack mechanism 2 is connected to the material conveying rack mechanism 3.

[0036] The clamp mechanism 1 is arranged above the device mounting base 6 through the mechanical table 11, the blanking rack mechanism 2 is arranged above the device mounting base 6 through the blanking rack supporting feet 7, the material conveying rack mechanism 3 is arranged above the device mounting base 6 through the conveying rack base 31, and the control mechanism 5 is arranged on the other side of the device mounting base 6 through the control mechanism base 55.

[0037] The device mounting base 6 serves to support the clamp mechanism 1, the blanking rack mechanism 2, and the material conveying rack mechanism 3; the control mechanism 5 is a mechanism for manually controlling the automatic assembly device; the clamp mechanism 1 is used to pick up materials; the blanking rack mechanism 2 is used to guide the materials to slide out of the material pipe; the material conveying rack mechanism 3 is used to convey the materials to be assembled, and its structural design facilitates the clamp 137 to pick up; the docking station 4 is used to connect the main board and position the material assembly; an empty material box placement rack 8 is also provided on the device mounting base 6 for placing empty material boxes.

[0038] The overall design reduces the footprint of the entire equipment and enables the assembly of semiconductor modules in a narrow space.

[0039] According to the attached Figure 1 To Attachment Figure 4 As shown, the fixture mechanism 1 includes a mechanical platform 11, a mechanical arm 12 and a manipulator 13; the mechanical arm 12 is arranged on the mechanical platform 11, and the manipulator 13 is connected to the mechanical arm 12; the manipulator 13 has a fixture 137 for clamping, a fixture visual detection system 135 for locating the moving position of the fixture 137, and a fixture guide rod 134 for positioning and guiding. The fixture 137 includes a first fixture 1371 and a second fixture 1372, and the first fixture 1371 and the second fixture 1372 both have elastic clips and soft fixing blocks.

[0040] The mechanical arm 12 is used to make the mechanical hand 13 do mechanical extension movement; the mechanical hand 13 is used to pick up materials. The fixture base 131 is connected to the mechanical arm 12 by a bearing, and the mechanical hand 13 can be rotated according to actual operation.

[0041] According to the attached Figure 3 To Attachment Figure 4 As shown, the manipulator 13 includes a fixture base 131, a U-shaped mounting plate 132, a fixture servo motor 133, a fixture guide rod 134, a fixture visual inspection system 135, a fixture support plate 136 and a fixture 137; the fixture servo motor 133 includes a first fixture servo motor 1331, a second fixture servo motor 1332 and a third fixture servo motor 1333, the fixture guide rod 34 includes a first fixture guide rod 1341 and a second fixture guide rod 1342, the fixture visual inspection system 135 includes a first fixture visual inspection system 1351 and a second fixture visual inspection system 1352, the fixture support plate 136 includes a first fixture support plate 1361 and a second fixture support plate 1362, and the fixture 137 includes a first fixture 1371 and a second fixture 1372.

[0042] The first clamp servo motor 1331 is used to provide power for adjusting the material clamping width; the second clamp servo motor 1332 and the third clamp servo motor 1333 are used to provide power for the telescopic clamp; the clamp guide rod 134 has the function of positioning and guiding; the clamp visual inspection system 135 is used to locate the moving position of the clamp; the clamp support plate 136 is used to bear and support the clamp.

[0043] The fixture mounting plate 132 is arranged at the bottom of the fixture base 131, the first fixture servo motor 1331 is arranged on one side of the U-shaped mounting plate 132, the fixture guide rod 134 passes through the fixture support plate 136 and is arranged in the groove of the U-shaped mounting plate 132, the fixture support plate 136 is connected in the groove of the U-shaped mounting plate 132, the first fixture visual inspection system 1351 and the second fixture visual inspection system 1352 are arranged in the groove of the U-shaped mounting plate 132, and are arranged on both sides of the fixture support plate 136, the second fixture servo motor 1332 and the third fixture servo motor 1333 are respectively arranged on the opposite side of the first fixture support plate 1361 and the second fixture support plate 1362; the first fixture 1371 and the second fixture 1372 are respectively arranged on the opposite side of the first fixture support plate 1361 and the second fixture support plate 1362, and are respectively arranged below the second fixture servo motor 1332 and the third fixture servo motor 1333.

[0044] The first clamp 1371 includes a first clamp outer sleeve 13711, a first telescopic rod 13712, a first connecting rod 13713, a second connecting rod 13714, a first elastic clip 13715 and a first soft fixing block 13716; the first clamp outer sleeve 13711 is sleeved on the outside of the first telescopic rod 13712, the bottom of the first telescopic rod 13712 is connected to the first connecting rod 13713, the bottom of the first connecting rod 13713 is connected to the second connecting rod 13714, the bottom of the second connecting rod 13714 is connected to the first elastic clip 13715, and a first soft fixing block 13716 is provided at the bottom of the first elastic clip 13715.

[0045] The second clamp 1372 includes a second clamp outer sleeve 13721, a second telescopic rod 13722, a third connecting rod 13723, a fourth connecting rod 13724, a second elastic clip 13725 and a second soft fixing block 13726; the second clamp outer sleeve 13721 is sleeved on the outside of the second telescopic rod 13722, the bottom of the second telescopic rod 13722 is connected to the third connecting rod 13723, the bottom of the third connecting rod 13723 is connected to the fourth connecting rod 13724, the bottom of the fourth connecting rod 13724 is connected to the second elastic clip 13725, and a second soft fixing block 13726 is provided at the bottom of the second elastic clip 13725.

[0046] The first and second clamp outer sleeves both have the function of carrying the clamps and guiding; the first and second telescopic rods are used for telescopic movement; the first and third connecting rods respectively move in linkage with the first and second telescopic rods; the second and fourth connecting rods are used for linkage operation; the first and second elastic clips are used for clamping materials; the first and second soft fixing blocks are used for fixing materials.

[0047] This solution will design the mechanism used for clamping to be flexible and miniaturized, forming a finger-like manipulator 13, and then design the clamping end to be an elastic clip and a soft fixing block, so as to avoid damaging components while effectively clamping the semiconductor module. The manipulator 13 can also avoid the problem of high components on the mainboard interfering with the manipulator 13 and causing the assembly to be impossible.

[0048] According to the attached Figure 5 To Attachment Figure 6 As shown, the blanking rack mechanism 2 includes a blanking rack movable plate 21, a blanking rack base 22, a blanking rack width adjustment handle 23, a blanking rack positioning rod, a blanking rack rear plate 25, a blanking rack threaded rod 26, a blanking rack baffle 27, a blanking rack push plate 28, a push plate bracket 29, a push plate servo motor 30 and a push plate bracket push rod 291.

[0049] The blanking rack width adjustment handle 23 can adjust the blanking area width of the blanking rack mechanism 2; the blanking rack positioning rod is used for positioning and guiding; the blanking rack threaded rod 26 is used to cooperate with the blanking rack width adjustment handle 23 to adjust the distance; the blanking rack push plate 28 is used to push out the empty material box; the push plate bracket 29 is used to support the blanking rack push plate 28; the push plate servo motor 30 provides power for the blanking rack push plate 28.

[0050] The blanking rack movable plate 21, the blanking rack width adjustment handle 23, the blanking rack positioning rod, the blanking rack rear plate 25, the blanking rack threaded rod 26, the push plate servo motor 30 and the push plate bracket 29 are all installed on the blanking rack base 22, the blanking rack baffle 27 is bolted to the blanking rack rear plate 25, the blanking rack push plate 28 is set on the push plate bracket 29, and the two ends of the push plate bracket push rod 291 are respectively connected to the push plate servo motor 30 and the push plate bracket 29.

[0051] The blanking rack baffle 27 is connected and installed with the blanking rack rear plate 25 through the baffle fixing nut 271; the blanking rack push plate 28 is set and installed on the push plate bracket 29 through the push plate fixing nut 281; the blanking rack positioning rod includes a blanking rack first positioning rod 241 and a blanking rack second positioning rod 242.

[0052] According to the attached Figure 7 To Attachment Fig. 9 As shown, the material conveying rack mechanism 3 includes a conveying rack base 31, a conveying rack support plate 311, a conveying rack shell 312, a sensor, an adjustment servo motor, a pushing servo motor, a pressure block linkage rod 34, a soft pressure block 35, a front baffle 36, a material slide rail, a material rack guide rod, a material rack threaded rod and a height servo motor 333.

[0053] The sensor is used to sense the presence of materials, and the adjusting servo motor is used to provide power for adjusting the width; the pushing servo motor is used to provide power for pushing the front baffle 36; the height servo motor 333 is used to provide power for adjusting the height of the material conveying rack mechanism 3; the pressure block linkage rod 34 and the soft pressure block 35 move in conjunction; the material slide rail is used to convey materials; the material rack guide rod is used for positioning and guiding; the material rack threaded rod is used to adjust the width of the material slide rail.

[0054] The conveying frame support plate 311 is set on the conveying frame base 31, the conveying frame shell 312 is set on the conveying frame support plate 311, the sensor and the adjustment servo motor are set on the conveying frame shell 312, the pushing servo motor is set at the bottom of the conveying frame support plate 311, the pressure block linkage rod 34 is set in the installation groove 3121 of the conveying frame shell 312, the soft pressure block 35 and the front baffle 36 are set in the conveying frame shell 312, and the soft pressure block 35 is connected to the pressure block linkage rod 34, the material slide rail, the material rack guide rod and the material rack threaded rod are set in the material conveying frame shell 312, and the height servo motor 333 is set on the conveying frame base 31.

[0055] A pressure block limit rod 3122 is also provided on the conveyor frame housing 312, and the sensors include a first sensor 1, a second sensor 2 and a third sensor 3. The first sensor 1 and the second sensor 2 are respectively arranged at two ends of one side of the conveyor frame housing 312, and the third sensor 3 is arranged next to the pressure block limit rod 3122 and close to the pressure block limit rod 3122. The adjusting servo motor includes a first adjusting servo motor 3311 and a second adjusting servo motor 3312, and the pushing servo motor includes a first pushing servo motor 3321 and a second pushing servo motor 3322.

[0056] The soft pressing block 35 is movably arranged in the straight hole on the pressing block linkage rod 34 through the pressing block fixing nut 351 .

[0057] The material slide rail includes a first material slide rail 371 and a second material slide rail 372 , the material rack guide rod includes a first material rack guide rod 381 and a second material rack guide rod 382 , and the material rack threaded rod includes a first material rack threaded rod 391 and a second material rack threaded rod 392 .

[0058] The integrated design of the blanking rack mechanism 2 and the material conveying rack mechanism 3 is based on the natural gravity, and a universal semiconductor module blanking and feeding device is designed. It not only uses the natural gravity for feeding and blanking, but also combines various adjustable pushing structures to realize the automatic ejection of empty material tubes.

[0059] According to the attached Fig.10 As shown, the docking platform 4 includes a platform base 411, a platform base 412, a docking platform width adjustment handle 42, a docking platform movable plate 43, a docking platform guide rod 44, a docking platform threaded rod 45, a front mainboard positioning frame 47, a docking platform visual inspection system 48, a rear mainboard positioning frame 49, and a transmission belt mechanism 46.

[0060] The platform base 411 serves as a supporting component; the docking platform width adjustment handle 42 can adjust the moving position of the docking platform movable plate 43 through the docking platform threaded rod 45; the front mainboard positioning frame 47 and the rear mainboard positioning frame 49 are used to position the mainboard; the docking platform visual inspection system 48 is used to position the mainboard and inspect the material assembly effect; the transmission belt mechanism 46 is used to transport the mainboard.

[0061] The platform base 412 is set on the platform foot 411, the docking platform width adjustment handle 42 is set on one side of the platform base 412, the docking platform guide rod 44 and the docking platform threaded rod 45 are respectively connected to the docking platform movable plate 43 and set on the platform base 412, the transmission belt mechanism 46 is set on one side of the platform base 412, the front main board positioning frame 47, the rear main board positioning frame 49 and the docking platform visual inspection system 48 are set on the platform base 412, and are set on the side of the docking platform movable plate 43 facing the transmission belt mechanism 46.

[0062] The docking platform guide rod 44 includes a first docking platform guide rod 441 and a second docking platform guide rod 442 .

[0063] According to the attached Fig.11 As shown, the control mechanism 5 includes a control panel 51 , an emergency stop switch 52 , a start-stop switch 53 and an alarm light 54 ; the control panel 51 , the emergency stop switch 52 , the start-stop switch 53 and the alarm light 54 are arranged on a control mechanism base 55 .

[0064] The emergency stop switch 52 is used to control the emergency stop of the device; the start-stop switch 53 is used to start and stop the equipment; and the warning light 54 is used for warning prompts.

[0065] Detailed description of the working process of the present invention:

[0066] First, the semiconductor module is installed in a tubular material box. The tubular material boxes designed for semiconductor modules of different widths and heights also have different widths and heights.

[0067] Secondly, adjust the device to the desired state:

[0068] First, the operator adjusts the width between the blanking rack movable plate 21 and the blanking rack rear plate 25 to be consistent with the width of the semiconductor module material tube through the blanking rack width adjustment handle 23, and then adjusts the height of the blanking rack baffle 27 through the baffle fixing nut 271 until it meets the requirements and then locks it, so that the height of the lower through-hole is consistent with the thickness of the semiconductor module material tube; adjusts the extension width of the blanking rack push plate 28 so that it can just push the module empty material tube out of the square material box slot of the blanking rack rear plate 25, and locks it through the push plate fixing nut 281.

[0069] Second, the width between the docking platform movable plate 43 and the platform base 412 is adjusted by the docking platform width adjustment handle 42 to make it consistent with the width of the PCB board.

[0070] Third, the position of the soft pressing block 35 of the material conveying rack mechanism 3 is adjusted by moving forward and backward so that it can press the semiconductor module material to prevent it from sliding down, and is locked by the pressing block fixing nut 351 .

[0071] Fourth, the operator inputs the model code corresponding to the semiconductor material on the control panel 51 of the control mechanism 5, and the equipment automatically adjusts the track height of the material conveying rack mechanism 3 through the height servo motor 333 according to the preset parameters to make it consistent with the discharge height of the blanking rack mechanism 2; adjusts the width between the first clamp support plate 1361 and the second clamp support plate 1362 through the first clamp servo motor 1331 to make it consistent with the width of the clamped semiconductor module; adjusts the position of the first material slide rail 371 through the first adjustment servo motor 3311, and adjusts the position of the second material slide rail 372 through the second adjustment servo motor 3312, so that the position and width of the two can reach the required position and width for the semiconductor material at the discharge port of the blanking rack mechanism 2 to slide smoothly to the material conveying rack mechanism 3.

[0072] After the equipment is debugged as described above, the operator presses the start-stop switch 53 to start the equipment, and stacks all the material tubes with semiconductor modules into the blanking rack mechanism 2. At this time, the equipment starts to work, and the working process is as follows:

[0073] The semiconductor module material automatically slides down into the material conveying rack mechanism 3 according to gravity and stops in front of the front baffle 36. At this time, the third sensor 3 detects that the semiconductor module material has slid down to this position, and the second push servo motor 3322 is started to make the soft pressing block 35 press down the semiconductor module material to prevent it from sliding down. When the first sensor 1 does not sense that the semiconductor module material has slid into place, the first push servo motor 3321 is started to make the front baffle 36 rise upward, and the semiconductor module material slides down to the track at the first sensor 1. The first sensor 1 senses that the semiconductor module material has slid into place. When the semiconductor module material slides into place, the first push servo motor 3321 is started to make the front baffle 36 block the subsequent module material downward. At this time, the third sensor 3 does not sense the semiconductor module material, and the second push servo motor 3322 is started to make the soft pressing block 35 rise, so that the semiconductor module material behind slides down to the third sensor 3. When the third sensor 3 senses the semiconductor module material, the second push servo motor 3322 is started to make the soft pressing block 35 press the semiconductor module material downward to prevent it from sliding downward, thereby forming a circular process.

[0074] When the second sensor 2 does not sense the semiconductor module material, the push plate servo motor 30 starts, pushing the push plate bracket 29 to move, driving the blanking rack push plate 28 to push the empty material box out of the square material box slot of the blanking rack rear plate 25, so that the empty material box automatically falls into the empty material box placement rack 8, and then the push plate servo motor 30 starts again to return to the initial state, and the semiconductor module material box is automatically filled downward, and the semiconductor module material slides downward to the material conveying rack mechanism 3. When the second sensor 2 does not detect the semiconductor module material for more than 30 seconds, the alarm light 54 is always on to prompt the operator to add semiconductor module material to the blanking rack mechanism 2, otherwise the equipment operates normally.

[0075] When the first sensor 1 senses the semiconductor module material normally, the robot arm 12 is started to move the clamp 137 to the end of the material conveying rack mechanism 3 to clamp the semiconductor module material. After the clamp 137 is in place, the first clamp visual detection system 1351 and the second clamp visual detection system 1352 accurately detect the position of the semiconductor module material to be clamped and control the clamp 137 to be accurately in place. After the clamp 137 is in place, the second clamp servo motor 1332 and the third clamp servo motor 1333 are started to make the first telescopic rod 13712 and the second telescopic rod 13722 telescopic movement, and drive the first connecting rod 13713, the third connecting rod 13723, the second connecting rod 13714, and the fourth connecting rod 13724 to move accordingly. An elastic clip 13715 and a second elastic clip 13725 clamp the semiconductor module material in the middle, and cooperate with the first soft fixing block 13716 and the second soft fixing block 13726 to clamp the semiconductor module material at both ends. After the first fixture visual inspection system 1351 and the second fixture visual inspection system 1352 detect that the clamp is in place, the robot arm 12 starts to move the fixture 137 to the position where it needs to be inserted. When the first fixture visual inspection system 1351 and the second fixture visual inspection system 1352 detect that it has moved to the position to be inserted, the robot arm 13 starts to move the fixture 137 downward to insert the semiconductor module material into the position to be inserted, and then insert the semiconductor module pin into the corresponding insertion hole of the PCB board.

[0076] At this time, when the docking station visual inspection system 48 on the docking station 4 detects that the semiconductor material insertion pins are in place, the second clamp servo motor 1332 and the third clamp servo motor 1333 are started, causing the first telescopic rod 13712 and the second telescopic rod 13722 to retract, and drive the first connecting rod 13713, the third connecting rod 13723, the second connecting rod 13714, and the fourth connecting rod 13724 to move accordingly, causing the first elastic clip 13715 and the second elastic clip 13725 to open outward respectively to loosen the semiconductor module material. When the first clamp visual inspection system 1351 and the second clamp visual inspection system 1352 detect that the insertion pins are in place, the robot 13 is started to move, so that the clamp 137 moves to the track at the first sensor 1 to clamp the semiconductor module material, and this cycle is repeated.

[0077] During this process, when the first fixture visual inspection system 1351, the second fixture visual inspection system 1352 and the docking station visual inspection system 48 detect an abnormality, the alarm light 54 is always on to prompt the operator to handle the abnormal situation.

[0078] The working process of the docking station 4 is that when the PCB board moves to the rear mainboard positioning frame 49 and stops, that is, it is blocked by the rear mainboard positioning frame 49, when the docking station visual inspection system 48 detects the existence of the PCB, the front mainboard positioning frame 47 starts to block the front end of the PCB board, and clamps the PCB board with the rear mainboard positioning frame 49, so that the PCB board is effectively positioned to facilitate the insertion of semiconductor module materials. When the insertion is completed, the rear mainboard positioning frame 49 opens to move the PCB board to the back process. When the docking station visual inspection system 48 detects that the PCB is moved out, the front mainboard positioning frame 47 retracts and the rear mainboard positioning frame 49 extends. When the next PCB board moves to the rear mainboard positioning frame 49, the above-mentioned operation process begins again, thus forming a cycle.

[0079] The main function of the present invention is to be applied to various automatic assembly production processes, especially the automatic assembly of high-precision and high-density semiconductor modules.

[0080] In summary, after reading the present invention document, ordinary technicians in this field can make various other corresponding transformation schemes based on the technical scheme and technical concept of the present invention without creative mental work, which all fall within the scope of protection of the present invention.

Claims

1. A semiconductor module automatic assembly device, characterized in that: It includes a clamp mechanism, a material drop rack mechanism, a material transfer rack mechanism, a docking station and a control mechanism; Clamp mechanism: used to clamp materials in the working area; Blanking rack mechanism: used to guide the material to slide out of the material pipe; the blanking rack mechanism includes a blanking rack base and a blanking rack movable plate arranged on the blanking rack base, a blanking rack rear plate, a blanking rack threaded rod, a blanking rack width adjustment handle and a blanking rack baffle. The blanking rack base is tilted downward, the blanking rack threaded rod is connected to the blanking rack width adjustment handle, the blanking rack width adjustment handle is used to adjust the width between the blanking rack movable plate and the blanking rack rear plate, the blanking rack baffle is connected and installed with the blanking rack rear plate through a baffle fixing nut, the blanking rack baffle is arranged at the discharging end of the blanking rack movable plate, and a material passage is formed between the lower end of the blanking rack baffle and the blanking rack base; Material conveying rack mechanism: used for conveying the materials to be assembled to a position convenient for the clamp mechanism to pick up; the material conveying rack mechanism includes a conveying rack shell, an adjusting servo motor, a first pushing servo motor, a second pushing servo motor, a soft pressure block, a front baffle, a pressure block linkage rod, a first material slide rail, a second material slide rail, a first sensor, a second sensor and a third sensor, the conveying rack shell is tilted downward, the first material slide rail and the second material slide rail are arranged in parallel inside the conveying rack shell, the first material slide rail is connected to the first material rack threaded rod, the second material slide rail is connected to the second material rack threaded rod, the first material rack threaded rod and the second material rack threaded rod are respectively connected to the adjusting servo motor, the adjusting servo motor is arranged on the conveying rack shell, the adjusting servo motor is used to provide power to drive the first material slide rail and the second material slide rail to move closer to or away from each other, and the pressure block linkage rod The rod is arranged in the mounting groove of the conveyor frame shell, the soft pressure block is movably arranged on the straight hole on the pressure block linkage rod through the pressure block fixing nut, the soft pressure block and the front baffle are arranged above the first material slide rail and the second material slide rail, the soft pressure block is located between the front baffle and the blanking rack mechanism, the first pushing servo motor is used to provide power to drive the front baffle to rise and fall to block or release the material, the second pushing servo motor is used to provide power to drive the soft pressure block to rise and fall to press or release the material, the first sensor and the second sensor are respectively arranged at the two ends of one side of the conveyor frame shell, the third sensor is arranged next to the pressure block limit rod and close to the pressure block limit rod, the first sensor is used to detect whether the material reaches the discharge end of the conveyor frame shell, the second sensor is used to detect whether the material reaches the feed end of the conveyor frame shell, and the third sensor is used to detect whether the material reaches the front baffle; Docking station: used for connecting the main board and positioning material assembly; Control mechanism: used for manual start and stop device and alarm prompts.

2. The semiconductor module automatic assembly device according to claim 1, characterized in that: The clamp mechanism, the blanking rack mechanism and the material conveying rack mechanism are arranged above the device installation base, the docking platform is arranged on one side of the device installation base, the control mechanism is arranged on the other side of the device installation base, and the blanking rack mechanism is connected to the material conveying rack mechanism.

3. The semiconductor module automatic assembly device according to claim 1, characterized in that: The clamp mechanism includes a mechanical platform, a mechanical arm and a manipulator; the mechanical arm is arranged on the mechanical platform, and the manipulator is connected to the mechanical arm; the manipulator has a clamp for clamping, a clamp visual detection system for locating the clamp movement position, and a clamp guide rod for positioning guidance.

4. The semiconductor module automatic assembly device according to claim 2, characterized in that: The clamp comprises a first clamp and a second clamp, and both the first clamp and the second clamp have an elastic clip and a soft fixing block.

5. The semiconductor module automatic assembly device according to claim 1, characterized in that: The blanking rack mechanism also includes a blanking rack positioning rod, a blanking rack push plate, a push plate bracket, a push plate servo motor and a push plate bracket push rod. The blanking rack positioning rod, the push plate servo motor and the push plate bracket are all installed on the blanking rack base. The blanking rack push plate is arranged on the push plate bracket. The push plate servo motor is connected to the push plate bracket through the push plate bracket push rod. The blanking rack positioning rod is used for positioning and guiding the push plate bracket. The lower end of the blanking rack movable plate and the lower end of the blanking rack rear plate respectively form a spacing with the blanking rack base to accommodate the blanking rack push plate to push the material tube.

6. The semiconductor module automatic assembly device according to claim 1, characterized in that: The material conveying rack mechanism also includes a conveying rack base, a conveying rack support plate, a material rack guide rod and a height servo motor. The height servo motor is arranged on the conveying rack base, the conveying rack housing is arranged on the conveying rack support plate, the height servo motor is connected to the conveying rack support plate, and the material rack guide rod is passed through the first material slide rail and the second material slide rail.

7. The semiconductor module automatic assembly device according to claim 1, characterized in that: The docking platform includes a platform foot, a platform base, a docking platform width adjustment handle, a docking platform movable plate, a docking platform guide rod, a docking platform threaded rod, a front mainboard positioning frame, the docking platform visual inspection system, a rear mainboard positioning frame, and a transmission belt mechanism.

8. The semiconductor module automatic assembly device according to claim 7, characterized in that: The platform base is arranged on the platform base foot, the docking platform width adjustment handle is arranged on one side of the platform base, the docking platform guide rod and the docking platform threaded rod are respectively connected to the docking platform movable plate and arranged on the platform base, the transmission belt mechanism is arranged on one side of the platform base, the front main board positioning frame, the rear main board positioning frame and the docking platform visual detection and positioning system are arranged on the platform base and on the side of the docking platform movable plate facing the transmission belt mechanism.

Images