Rinse fixture for a shower head

Abstract

The present disclosure relates to embodiments of a flush fixture for flushing a showerhead assembly. The flush fixture includes two distinct chambers: an inner chamber and an outer chamber that surrounds the inner chamber and is not fluidly connected to the inner chamber. When the flush fixture is installed to the showerhead, the internal orifice is fluidly connected to the inner chamber and the one or more drain holes are fluidly connected to the outer chamber. Separate access to the internal orifice and the one or more drain holes allows for proper flushing of the showerhead.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to a flush fixture for flushing a showerhead assembly that can be used in a vapor distribution system. BACKGROUND

[0002] Vapor phase reactors, such as chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), and the like, can be used for a variety of applications, including depositing materials on a substrate surface and etching. For example, vapor phase reactors can be used to deposit layers on a substrate and / or etch to form semiconductor devices, flat panel display devices, photovoltaic devices, microelectromechanical systems (MEMS), and the like.

[0003] A typical vapor phase reactor system includes a reactor that includes a reaction chamber, one or more precursor vapor sources fluidly coupled to the reaction chamber, one or more carrier gas sources or purge gas sources fluidly coupled to the reaction chamber, a vapor distribution system for delivering the gases (e.g., precursor vapor and / or carrier or purge gas) to a surface of a substrate, and an exhaust source fluidly coupled to the reaction chamber. The system typically also includes a susceptor for holding a substrate in place during processing. The susceptor can be configured to move up and down to receive a substrate and / or can be rotated during processing of the substrate.

[0004] The vapor distribution system can include a showerhead assembly for distributing vapor to a surface of a substrate. The showerhead assembly is typically located above the substrate. During processing of the substrate, vapor flows from the showerhead assembly in a downward direction toward the substrate and then radially outward over the substrate. SUMMARY

[0005] In one aspect, a flush fixture for flushing a showerhead assembly is provided, the flush fixture comprising: a fixture body configured to be mounted to the showerhead assembly, the fixture body having an upper surface and a lower surface opposite the upper surface. The fixture body includes: an inner cavity exposed at the lower surface of the fixture body; an outer cavity exposed at the lower surface of the fixture body and separated from the inner cavity by a partition; one or more internal passages in fluid communication with the inner cavity, the one or more internal passages extending from the inner cavity to the upper surface; and one or more external passages in fluid communication with the outer cavity, the one or more external passages extending from the outer cavity to the upper surface.

[0006] The outer cavity includes an annular cavity at least partially surrounding the inner cavity. The fixture body can include a polymeric material. In another aspect, a system for rinsing a showerhead assembly is provided, the system including: the above-described rinsing fixture; and a showerhead plate including an internal orifice and one or more drain holes, wherein the rinsing fixture is configured to mount to the showerhead such that the internal orifice is in fluid communication with the inner cavity and the one or more drain holes are in fluid communication with the outer cavity. The showerhead can include a metal or metal alloy.

[0007] In some embodiments, the one or more internal channels are fluidly connected to an internal delivery conduit configured to deliver a rinsing fluid into the one or more internal channels. The one or more external channels can be fluidly connected to an external delivery conduit configured to deliver a rinsing fluid into the one or more external channels. The internal delivery conduit and the external delivery conduit can both be connected to the same rinsing fluid source. The internal delivery conduit and the external delivery conduit can be connected to separate rinsing fluid sources. The system can further include an internal gasket positioned between the showerhead and the rinsing fixture, the internal gasket surrounding the inner cavity in a direction parallel to an extension direction of the rinsing fixture so as to keep rinsing fluid delivered into the inner cavity from entering the outer cavity and the one or more drain holes, and so as to keep rinsing fluid delivered into the outer cavity from entering the inner cavity and the internal orifice. The system can further include an external gasket positioned between the showerhead and the rinsing fixture, the external gasket surrounding the outer cavity in a direction parallel to an extension direction of the rinsing fixture so as to direct rinsing fluid delivered into the outer cavity into the one or more drain holes.

[0008] The one or more drain holes are positioned to surround the internal orifice. The one or more drain holes can be positioned radially outward from the bore of the internal orifice relative to a center of the rinsing fixture. A diameter of each drain hole can be greater than each internal orifice. The one or more drain holes and the internal orifice can all include a cylindrical middle portion, and a diameter of the cylindrical middle portion of each drain hole can be greater than the cylindrical middle portion of each internal orifice. The rinsing fixture can be mounted to the showerhead plate by a connector.

[0009] The system can further include a reservoir. The reservoir can include a drain; a sensor; and a probe connected to the sensor, wherein the rinsing fixture and the showerhead plate are configured to mount on the reservoir such that when the rinsing fluid is rinsed through the showerhead plate, fluid is drained into the reservoir and an electrical property is sensed by the sensor through the probe.

[0010] In another aspect, a rinse fixture for rinsing a showerhead assembly is provided, the rinse fixture comprising: a fixture body configured to be mounted to the showerhead assembly, the fixture body having an upper surface and a lower surface opposite the upper surface. The fixture body comprises: an inner cavity exposed at the lower surface of the fixture body; and an outer cavity exposed at the lower surface of the fixture body and separated from the inner cavity by a partition, the outer cavity comprising an annular cavity extending around the inner cavity. The rinse fixture can further comprise: one or more internal channels in fluid communication with the inner cavity, the one or more internal channels extending from the inner cavity to the upper surface; and one or more external channels in fluid communication with the outer cavity, the one or more external channels extending from the outer cavity to the upper surface.

[0011] In another aspect, a method of rinsing a showerhead assembly is provided, the method comprising: mounting a rinse fixture to a showerhead plate such that an inner cavity of the rinse fixture is in fluid communication with a plurality of internal orifices of the showerhead plate and such that an outer cavity of the rinse fixture is in fluid communication with one or more drain holes of the showerhead plate; delivering one or more rinse fluids through the inner cavity and the internal orifices; and delivering the one or more rinse fluids through the outer cavity and the one or more drain holes. The method can further comprise: positioning the rinse fixture and the showerhead over a reservoir, wherein the reservoir comprises a resistivity sensor; and measuring a resistivity of the rinse fluids trapped within the reservoir with the resistivity sensor, wherein the rinse fluids are caused to travel through the rinse fixture and the showerhead plate until the measured resistivity stabilizes. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a schematic side cross-sectional view showing an example vapor distribution system.

[0013] Figure 2a is a cross-sectional view showing an embodiment of a rinse fixture.

[0014] Figure 2b is a top view showing an embodiment of a rinse fixture.

[0015] Figure 3 is a cross-sectional view showing an embodiment of a system for rinsing a showerhead assembly.

[0016] Figure 4 is a cross-sectional view showing an embodiment of a system for rinsing a showerhead assembly.

[0017] Figure 5 is a flowchart of an example method for rinsing a showerhead assembly. DETAILED DESCRIPTION

[0018] The description of the example embodiments provided below is merely exemplary and intended for purposes of illustration only; the following description is not intended to limit the scope and range of the present disclosure or claims in any manner. Furthermore, recitation of multiple embodiments having stated features does not indicate that a combination of these

[0019] In some semiconductor processing apparatuses, after manufacturing, servicing, or maintaining a showerhead plate of a showerhead assembly of a vapor distribution system, there can be debris or particulate retained within the orifices and / or drain holes of the showerhead. These debris or particulate can be transferred from the showerhead plate to a wafer during processing and leave particulate on the wafer, causing unwanted defects. These debris or particulate can also negatively affect vapor distribution in many ways, such as blockage of internal supply orifices, which can result in uneven vapor distribution. It should be noted that the internal supply orifices within the showerhead are typically very small, and thus even small pieces of debris or particulate can greatly affect vapor distribution within the system. Debris or particulate can also contaminate the larger external drain orifices of the showerhead plate, which can also degrade performance of the deposition process.

[0020] Vapor distribution systems including showerhead assemblies can be used to process substrates, such as semiconductor wafers, in a vapor phase reactor. Exemplary vapor phase reactors include chemical vapor deposition (CVD) reactors, plasma enhanced CVD (PECVD) reactors, low pressure CVD (LPCVD) reactors, and atomic layer deposition (ALD) reactors. For example, a showerhead assembly can be used in a showerhead type vapor phase reactor system, in which vapor flows generally from the showerhead in a downward direction and toward the substrate.

[0021] It is advantageous to have a system to clean a showerhead after manufacture in order to remove debris and particles that can remain due to the above reasons. A typical showerhead assembly includes a showerhead having a chamber adjacent to one surface of the showerhead and a plurality of internal orifices through the chamber between the distribution surface of the showerhead (substrate side) and the chamber. A typical showerhead can also include a drain hole on the outside of the internal orifices for allowing exhaust vapor to escape from the inside of the chamber. The drain hole is typically larger in diameter than each of the internal orifices. Debris and particles within the internal orifices and the external drain hole of the showerhead can be detrimental to deposition and thus it can be beneficial to thoroughly and effectively remove the debris and particles from the internal orifices and the external drain hole. The internal orifices are typically much smaller than the drain hole. Due at least in part to the size difference between the internal orifices and the drain hole, a flush fixture connected to a showerhead assembly having a single common chamber in fluid communication with both the internal orifices and the drain hole does not properly flush the showerhead assembly. The drain hole creates a pressure differential that draws liquid away from the internal orifices due to the drain hole being larger than the internal orifices. Thus, a greater amount of flush liquid passes through the drain hole while the internal orifices draw less flush fluid, which results in uneven flushing. Thus, in various embodiments disclosed herein, a system having an outer chamber fluidly connected to the drain hole and a separate inner chamber fluidly connected to the internal orifices can advantageously provide for uniform, thorough, and effective cleaning of the showerhead plate during manufacture or maintenance. Such a system allows for separate flush fluids to be provided to the internal orifices and the drain hole and thus mitigates the problem of having a pressure differential due to the unequal size of the internal orifices and the drain hole.

[0022] Figure 1 An exemplary vapor distribution system using a showerhead assembly is shown. Figure 1A semiconductor processing apparatus 10 is shown, which is also shown in and described in connection with FIG. 8B of U.S. Patent Publication No. US 2017-0350011, the entirety of which is incorporated by reference herein in its entirety and for all purposes. Manifold 100 is part of the overall semiconductor processing apparatus 10. Manifold 100 can include a hole 130 that injects steam downward toward a dispersion apparatus including a showerhead assembly 820. It should be appreciated that manifold 100 can include multiple blocks connected together as shown, or can include one monolith. Manifold 100 can be connected upstream of a reaction chamber 810. In particular, the outlet of hole 130 can be in communication with a reactant injector, particularly a dispersion mechanism in the form of a showerhead assembly 820. Showerhead assembly 820 includes a showerhead 822 that defines a showerhead plenum 824 or chamber above the plate 822. Showerhead assembly 820 conveys steam from manifold 100 to a reaction space 826 below showerhead 820. Reaction chamber 810 includes a substrate support 828 configured to support a substrate 829 (e.g., a semiconductor wafer) in reaction space 826. The reaction chamber also includes an exhaust opening 830 connected to a vacuum source. While a single wafer, showerhead-type reaction chamber is shown, the skilled artisan will appreciate that the manifold can also be connected to other types of reaction chambers having other types of injectors (e.g., batch or furnace-type, horizontal or cross-flow reactors, cluster reactors, etc.).

[0023] Any suitable number or type of reactants can be supplied to reaction chamber 810. Various embodiments disclosed herein can be configured to deposit a metal oxide layer onto a substrate. In some embodiments, one or more reactant sources can include natural gaseous ALD reactants, such as nitrogen and oxygen precursors, such as H2, NH3, N2, O2, or O3. Additionally or alternatively, one or more reactant sources can include an evaporator for evaporating a reactant that is solid or liquid at room temperature and atmospheric pressure. The evaporator can be, for example, a liquid bubbler or a solid sublimation vessel. Examples of solid or liquid reactants that can be held and evaporated in the evaporator include various HfO and TiN reactants. For example, solid or liquid reactants that can be held and evaporated can include, but are not limited to, evaporated metal or semiconductor precursors, such as liquid organometallic precursors, such as trimethylaluminum (TMA), TEMA Hf, or TEMA Zr; liquid semiconductor precursors, such as dichlorosilane (DCS), trichlorosilane (TCS), propylsilane, organosilanes, or TiCl4; and powdered precursors, such as ZrCl4or HfCl4. The skilled artisan will appreciate that embodiments can include any desired combination and arrangement of natural gaseous, solid, or liquid reactant sources.

[0024] The semiconductor processing apparatus 10 can also include at least one controller 860 comprising a processor and a memory having programming for controlling the various components of the apparatus 10. While shown schematically connected to the reaction chamber 810, the skilled artisan will appreciate that the controller 860 is in communication with the various components of the reactor, such as vapor control valves, heating systems, gate valves, robotic wafer carriers, etc., to carry out the deposition process. In operation, the controller 860 can be arranged to load a substrate 829, such as a semiconductor wafer, onto the substrate support 828, and to close, purge, and generally pump down the reaction chamber 810 in preparation for a deposition process, particularly atomic layer deposition (ALD). The controller 829 can further be configured to control the sequence of the deposition. For example, the controller 829 can send control instructions to the reactant valves to cause the reactant valves to open and supply reactant vapor to the manifold 100. The controller 829 can also send control instructions to the inert gas valve to cause the inert gas valve to open and supply inert purge gas to the manifold 100. The controller 829 can be configured to also control other aspects of the process.

[0025] The manifold 100 can inject multiple reactants (e.g., a first reactant vapor and a second reactant vapor) simultaneously to induce mixing, or sequentially to circulate between the reactants. In some processes, a purge gas can be injected from the apertures 130 to the showerhead assembly 820 to purge the first reactant vapor so that the first reactant does not contaminate or mix with a second reactant vapor injected subsequently. Similarly, after deposition of the second reactant vapor and before deposition of another reactant (e.g., the first reactant vapor or a different reactant vapor), an additional purge step is performed in which inert gas is delivered downward through the inlets 120 to the showerhead assembly 820 and the reaction chamber 826. Although the embodiments disclosed herein are described in connection with the apparatus 10 and showerhead assembly 820 of Figure 1 It is recognized that the embodiments of the flush fixture described herein can be used with any suitable showerhead assembly that can be installed in any suitable type of semiconductor processing apparatus or system.

[0026] Figure 2a A showerhead assembly for use in a semiconductor processing apparatus is shown in FIG. 1. The showerhead assembly 820 includes a plurality of apertures 130 for injecting a reactant vapor into a reaction chamber 826. The showerhead assembly 820 is mounted to a support 828 that is configured to be moved by a robot (not shown) into and out of a reaction chamber 826 of a semiconductor processing apparatus 10. The semiconductor processing apparatus 10 includes a manifold 100 that is configured to supply a reactant vapor to the showerhead assembly 820. The manifold 100 includes a plurality of inlets 120 for receiving a reactant vapor from a plurality of sources 110. The manifold 100 is configured to supply the reactant vapor to the showerhead assembly 820 through the apertures 130. Figure 1FIG. 2A is a cross-sectional view of an embodiment of a flush fixture 202 of a showerhead assembly 820. The flush fixture 202 includes a fixture body 200 having an inner cavity 206 and an outer cavity 204 (which can include, for example, a cylindrical base material). The fixture body 200 can have an upper surface 201 and a lower surface 203 opposite the upper surface 201. The inner cavity 206 and the outer cavity 204 can be distinct cavities that are not fluidically connected. For example, as shown in FIG. 2A, the inner cavity 206 can be separated from the outer cavity 204 by a partition 205. The partition 205 can include a portion of the fixture body 200, such as a protrusion extending downward from the fixture body between the cavities 206, 204. Further, the inner cavity 206 and the outer cavity 204 can be exposed (or can be open) at the lower surface 203 of the fixture body 200. In Figures 2a-2b In embodiments, the outer cavity 204 can at least partially surround the inner cavity 204. For example, the outer cavity 204 can include an annular cavity that surrounds (e.g., completely surrounds) the inner cavity 204. In other embodiments, the outer cavity 204 can only partially surround the inner cavity 206. As shown in the side cross-section (see FIG. 2A), the lateral width of the inner cavity 206 can be wider than the lateral width of the outer cavity 204. Figure 2a

[0027] One or more inner channels 206a can be fluidically connected to the inner cavity 206. As shown, the inner channels 206a can extend upward from the inner cavity 206 to the upper surface 201 of the fixture body 200. While four inner channels are shown in FIG. 2A, there can be more or less than four inner channels. There can be any suitable number of inner channels. As shown in FIG. 2A, the respective widths or diameters of the inner channels 206a can be less than the inner cavity 206. As explained herein, the size and arrangement of the inner channels 206a can be set to deliver a flush fluid to the inner cavity 206. The major lateral dimension (e.g., width or diameter) of each inner channel can be about 1.5 inches. In some embodiments, the inner channels can have a major lateral dimension of greater than or less than 1.5 inches in diameter, depending on, for example, the size of the showerhead assembly to be flushed. Figure 2b Figure 2a One or more outer channels 204a can be connected to the outer cavity 204. For example, as shown, the one or more outer channels 204a can extend upward from the outer cavity 204 to the upper surface 201 of the fixture body 200. While four outer channels are shown in FIG. 2A, there can be more or less than four outer channels. There can be any suitable number of outer channels. As shown in FIG. 2A, the respective widths or diameters of the outer channels 204a can be less than the outer cavity 204. As explained herein, the size and arrangement of the outer channels 204a can be set to deliver a flush fluid to the outer cavity 204. The major lateral dimension (e.g., width or diameter) of each outer channel can be about 1.5 inches. In some embodiments, the outer channels can have a major lateral dimension of greater than or less than 1.5 inches in diameter, depending on, for example, the size of the showerhead assembly to be flushed.

[0028] One or more outer channels 204a can be connected to the outer cavity 204. For example, as shown, the one or more outer channels 204a can extend upward from the outer cavity 204 to the upper surface 201 of the fixture body 200. While four outer channels are shown in FIG. 2A, there can be more or less than four outer channels. There can be any suitable number of outer channels. As shown in FIG. 2A, the respective widths or diameters of the outer channels 204a can be less than the outer cavity 204. As explained herein, the size and arrangement of the outer channels 204a can be set to deliver a flush fluid to the outer cavity 204. The major lateral dimension (e.g., width or diameter) of each outer channel can be about 1.5 inches. In some embodiments, the outer channels can have a major lateral dimension of greater than or less than 1.5 inches in diameter, depending on, for example, the size of the showerhead assembly to be flushed. Figure 2b ​​Two external channels are shown, but more than two external channels may exist. Alternatively, only one external channel may be connected to the outer cavity 204. The primary lateral dimension (e.g., width or diameter) of each internal channel may be approximately 0.5 inches. In some embodiments, depending on, for example, the size of the spray head assembly, the diameter of the primary lateral dimension of each external channel may be greater than or less than 0.5 inches. The primary lateral dimension of the internal channel relative to the external channel may be adjusted based on the amount of internal and external channels and the required flushing volume of the spray head's internal orifices and drain holes (in combination). Figure 3 (To be described in more detail). In one specific embodiment, there may be four (4) internal channels, each with a diameter of 1.5 inches, and two (2) external channels, each with a diameter of 0.5 inches.

[0029] In some embodiments, the inner cavity 206 may include a cylindrical cavity (e.g., having an elliptical or circular profile as seen from a bottom plan view). The outer cavity 204 may include an annular shape surrounding the inner cavity (e.g., a circular or elliptical racetrack shape). In some embodiments, the inner cavity 206 may be divided into separate cavities connected to separate internal orifices of the shower head. Furthermore, the outer cavity may be divided into separate cavities connected to separate drain orifices. In some embodiments, the flushing retainer 202 may be made of a material softer than the material of the shower head. For example, when the shower head is made of metal, the flushing retainer body 200 may be made of a polymer or plastic such as polypropylene. In other embodiments, the retainer body 200 may include metal. A softer material may allow the flushing retainer 202 to avoid damaging the shower head during installation.

[0030] Figure 2b It shows Figure 2a A top view of the flushing fixture 202. Figure 2b and Figure 2a Shared reference numerals, and the description of shared reference numerals applies to... Figure 2b For ease of illustration, the inner cavity 206 and the outer cavity 204 are shown as follows. Figure 2b The dotted lines in the figure indicate separation. As shown, the inner channel 206a and the outer channel 204a may have a circular (e.g., circular) cross-sectional shape. The flushing fixture 202 may also include a hole 208 for housing a connector or screw. The connector or screw enables the shower head to be separated from the flushing fixture 202. The flushing fixture may also include a hole 210 for the insertion of a connector or screw (e.g., ...). Figure 3 (As shown in the diagram) the spray head is fixed to the rinsing fixture 202. Figure 2a Or the flushing fixture of 2b can be connected to, for example Figure 3 The spray head of the spray head assembly shown.

[0031] Figure 3A showerhead plate 302 mounted to a showerhead assembly is shown Figure 2a and 2b a rinse fixture 202. Details of the rinse fixture 202 are described in connection with Figure 2a or 2b and are not repeated. The one or more internal passages 206a are connected to an internal delivery conduit 312 that is configured to deliver a rinse fluid into the one or more internal passages 206a. The one or more external passages 204a are connected to an external delivery conduit 310 that is connected to deliver a rinse fluid into the one or more external passages 206a. Both the internal delivery conduit 312 and the external delivery conduit 310 can be connected to the same rinse fluid source or separate rinse fluid sources. The same type of rinse fluid or different types of rinse fluid can be delivered to the internal passages 206 or the external passages 204.

[0032] The showerhead plate 302 includes both internal orifices 306 and drain holes 304. The drain holes 304 are positioned around the internal orifices 306 and are positioned radially outward from the internal orifices 306 relative to the center of the showerhead 302. The internal orifices 306 can be substantially cylindrical holes or they can have a flared input and / or output. The internal orifices 306 can have any suitable profile. Similarly, the external drain holes 304 can be substantially cylindrical holes or they can have a flared input and / or output. The external drain holes 304 can have any suitable profile. Each of the internal orifices 306 is substantially smaller than each of the drain holes 304. For example, when the internal orifices 306 and the drain holes 304 are substantially cylindrical holes, the drain holes 304 have a larger diameter than the internal orifices 306. Further, when the internal orifices 306 have a flared input and / or output and the drain holes 304 have a flared input and / or output, each of the internal orifices 306 and each of the drain holes 304 can include a cylindrical middle portion. The cylindrical middle portion of the drain holes 304 can be larger than the cylindrical middle portion of the internal orifices 306. When the showerhead plate 302 and the showerhead assembly are used in a semiconductor processing apparatus, a gas (e.g., a reactant and / or an inert gas) can be delivered through the internal orifices 306 to a reactor. The gas can be removed or exhausted from the reactor through the drain holes 304.

[0033] The flush fixture 202 can be mounted to the showerhead plate 302 such that the interior orifice 306 is in fluid communication with the inner lumen 206 and the drain hole 304 is in fluid communication with the outer lumen 204. As shown, the flush fixture 202 can be mounted to the showerhead 302 by one or more connectors 308 (e.g., one or more screws, bolts, or other suitable fasteners). The flush fixture 202 can be mounted to the showerhead plate 302 by other fasteners such as clamps. By providing separate access to the interior orifice 306 and the drain hole 304, the inner lumen 206 can provide a flush fluid to the interior orifice 306 that is independent of the flush fluid provided to the drain hole 304 by the outer lumen 204. Thus, the larger size of the drain hole 304 will not affect the amount of flush fluid that passes through the interior orifice 306, which allows both the interior orifice 306 and the drain hole 304 to be properly flushed.

[0034] An interior gasket 314 can be positioned between the flush fixture 202 and the showerhead 302 and surround the inner lumen 206 in a direction parallel to the direction of extension of the flush fixture. When the flush fixture 202 is mounted to the showerhead 302, the interior gasket 314 keeps flush fluid delivered into the inner lumen from entering the outer lumen and the one or more drain holes. In addition, the interior gasket keeps flush fluid delivered into the outer lumen from entering the inner lumen and the interior orifice. An exterior gasket 316 can also be positioned between the flush fixture 202 and the showerhead 302 and surround the outer lumen 204 in a direction parallel to the direction of extension of the flush fixture. When the flush fixture 202 is mounted to the showerhead 302, the exterior gasket 316 seals flush fluid from exiting the showerhead 302 and the flush fixture 202.

[0035] Figure 4 A system 400 for flushing a showerhead assembly is shown. The system 400 includes a flush fixture 202 mounted on a showerhead plate 302 of a showerhead 300. Figure 3 Figure 3 ​The features of the system 400 are not repeated here. The reservoir 404 is positioned below the rinse fixture 202 mounted on the showerhead 206. The reservoir 404 can be secured to the rinse fixture 202 or the showerhead plate 302 by one or more clamps 402. The reservoir 404 can also be secured to the rinse fixture 202 or the showerhead plate 302 by screws or bolts, or the rinse fixture 202 mounted to the showerhead plate 302 can be placed over the reservoir 404 without being secured. The reservoir 404 includes a sensor 406 connected to a probe 408. The sensor 406 can be external to the reservoir 404, and the probe 408 can be internal to the reservoir 404. Alternatively, the sensor 406 can be located within the reservoir 404, and can transmit measurements wirelessly. As the rinse fluid flows through the rinse fixture 202 and the showerhead plate 302, rinse fluid 410 collects at the bottom of the reservoir 404. The reservoir 404 includes a drain 412 that can be used to drain the rinse fluid 410 after the rinse fluid has been rinsed through the showerhead 302.

[0036] As the rinse fluid passes through the showerhead plate 302, the rinse fluid removes particles and / or debris from the showerhead plate 302 (e.g., from the internal orifices 306 and the drain holes 304). The combination of the rinse fluid and the particles and / or debris has different properties than the rinse fluid itself. Thus, by measuring the properties of the rinse fluid 410 after it has been rinsed through the showerhead plate 302, the amount of particles and / or debris removed from the showerhead plate 302 can be monitored. Through the probe 408, the sensor 406 can monitor one or more properties of the rinse fluid 410 collected within the reservoir 404 to determine the amount of particles and / or debris removed from the showerhead plate 302. The one or more properties can be one or more electrical properties, such as resistivity, conductivity, inductance, capacitance, or magnetic permeability. For example, when the particles and / or debris are metal, the resistivity of the rinse fluid 410 including the particles and / or debris can be lower than the resistivity of the rinse fluid 410 without the particles and / or debris. The sensor 406 can be configured to monitor the resistivity of the rinse fluid 410 through the probe 408. When the rinse fluid first begins to rinse the particles and / or debris from the showerhead 302, the resistivity of the rinse fluid 410 can be relatively low due to the large amount of particles and / or debris within the rinse fluid 410. As the particles and / or debris are rinsed from the showerhead 302, the resistivity of the rinse fluid 410 can increase as the rinse fluid exiting the showerhead plate 302 will include relatively less particles and / or debris. When this measured resistivity substantially levels off or substantially stops increasing, the rinse can stop as there are no more particles and / or debris exiting the showerhead 302.

[0037] Figure 5 A flowchart illustrating an example method 500 for rinsing a showerhead assembly is shown. The method can use components of the system 400 to rinseFigure 4 The shower head assembly is described in section 502. In section 502, a flushing fixture is mounted to the shower head. The flushing fixture may include the flushing fixture 202 and shower head plate 302 described above in Figures 2-4. In section 504, the flushing fixture and the shower head are positioned above the reservoir. The reservoir may include a combination of... Figure 4 The described memory 402 may include a sensor 406 connected to the probe 408.

[0038] In frame 506, flushing fluid is delivered to reservoir 402 via flushing fixture and spray head. As explained above, flushing fluid can be delivered from a common source or two separate sources. Flushing fluid can be delivered to inner cavity 206 via one or more internal channels 206a. Flushing fluid can be simultaneously delivered to outer cavity 204 via one or more external channels 204a. Fluid from inner cavity 206 can drive through internal orifice 306 of spray head plate 302. Fluid from outer cavity 204 can drive through external drain hole 304. Because inner cavity 206 and outer cavity 204 can be substantially sealed to each other, the pressure of flushing fluid within cavities 206, 204 can be controlled independently, allowing sufficient fluid flow to be driven separately through internal orifice 306 and drain hole 304. Advantageously, as explained above, using fixture 202 to independently flush internal orifice 306 and external drain hole 304 ensures thorough and effective cleaning of internal orifice 306 and drain hole 304.

[0039] like Figure 4 As shown, the flushing fluid 410 is collected in a reservoir 402 and exits through a drain 412. In block 508, the resistivity of the flushing fluid collected in the reservoir 402 is measured. Sensor 406 is configured to sense the resistivity of the flushing fluid 410 via a probe. When the particles and / or debris are metallic, the resistivity of the flushing fluid 410 will be low as the flushing fluid initially begins to wash the particles and / or debris from the spray head 302. However, as fewer particles and / or debris leave the spray head 302, the resistivity of the flushing fluid 410 will be higher. Therefore, flushing can stop when the resistivity of the flushing fluid 410 substantially levels off or substantially stops increasing, because substantially no particles and / or debris are leaving the spray head 302.

[0040] Although the foregoing description has been detailed with illustrations and examples for clarity and understanding, those skilled in the art will recognize that certain variations and modifications can be practiced. Therefore, the descriptions and examples should not be construed as limiting the scope of the invention to the specific embodiments and examples described herein, but rather encompass all modifications and alternatives that fall within the true scope and spirit of the invention. Furthermore, practicing the invention does not necessarily require all the features, aspects, and advantages described above.

Claims

1. A rinse fixture for rinsing a component of a showerhead assembly of a semiconductor processing apparatus, comprising: a fixture body configured to be mounted to a component of the showerhead assembly, the fixture body having an upper surface defined by an upper surface outer edge, a lower surface defined by a lower surface outer edge, wherein the lower surface is opposite the upper surface, and an outer side surface connected and spanning between the upper surface outer edge and lower surface outer edge, the fixture body comprising: an inner cavity exposed at the lower surface of the fixture body; an outer cavity exposed at the lower surface of the fixture body and separated from the inner cavity by a partition; one or more internal channels in fluid communication with the inner cavity, the one or more internal channels extending from the inner cavity to the upper surface; and one or more external channels in fluid communication with the outer cavity, the one or more external channels extending from the outer cavity to the upper surface.

2. The rinse fixture of claim 1, wherein the outer cavity comprises an annular cavity at least partially encircling the inner cavity.

3. The rinse fixture of claim 1, wherein the fixture body comprises a polymeric material.

4. A system for rinsing a showerhead assembly, comprising: a rinse fixture according to claim 1; a showerhead plate comprising internal orifices and one or more drain holes; and an internal delivery conduit fluidly connected to the one or more internal channels, the internal delivery conduit configured to deliver a rinse fluid into the one or more internal channels, wherein the rinse fixture is mounted to the showerhead plate such that the internal orifices are in fluid communication with the inner cavity and the one or more drain holes are in fluid communication with the outer cavity.

5. The system of claim 4, further comprising an external delivery conduit fluidly connected to the one or more external channels, the external delivery conduit configured to deliver a rinse fluid into the one or more external channels. a showerhead plate comprising internal orifices and one or more drain holes, wherein the rinse fixture is configured to be mounted to the showerhead such that the internal orifices are in fluid communication with the inner cavity and the one or more drain holes are in fluid communication with the outer cavity.

6. The system of claim 4, further comprising:

7. The system of claim 4, wherein the showerhead plate comprises a metal or metal alloy.

8. The system of claim 5, wherein both the internal delivery conduit and the external delivery conduit are connected to a same rinse fluid source, the internal delivery conduit and the external delivery conduit configured to independently deliver a rinse fluid to the respective one or more internal channels and one or more external channels.

9. The system of claim 5, wherein the internal delivery conduit and the external delivery conduit are connected to separate rinse fluid sources. ​ 10. The system of claim 6, further comprising an inner gasket positioned between the showerhead plate and the rinse fixture, the inner gasket horizontally encircling the inner cavity so as to prevent rinse fluid delivered into the inner cavity from entering the outer cavity and the one or more drain holes, and so as to prevent rinse fluid delivered into the outer cavity from entering the inner cavity and the inner orifices.

11. The system of claim 10, further comprising an outer gasket positioned between the showerhead plate and the rinse fixture, the outer gasket encircling the outer cavity so as to direct the rinse fluid delivered into the outer cavity into the one or more drain holes.

12. The system of claim 6, wherein the one or more drain holes are positioned encircling the inner orifices.

13. The system of claim 12, wherein the one or more drain holes are positioned radially outward from the orifices of the inner orifices relative to a center of the rinse fixture.

14. The system of claim 6, wherein a diameter of each drain hole is greater than a diameter of each of the inner orifices.

15. The system of claim 6, wherein the one or more drain holes and the inner orifices all comprise a cylindrical middle portion, and wherein a diameter of the cylindrical middle portion of each drain hole is greater than the cylindrical middle portion of each inner orifice.

16. The system of claim 6, wherein the rinse fixture is mounted to the showerhead plate by a connector.

17. The system of claim 6, further comprising: a reservoir, the reservoir comprising: a drain; a sensor; and a probe connected to the sensor, wherein the rinse fixture and showerhead plate are configured to be mounted on the reservoir such that when rinse fluid is rinsed through the showerhead plate, the fluid is drained into the reservoir and an electrical property is sensed by the sensor through the probe.

18. A rinse fixture for rinsing a showerhead plate of a semiconductor processing apparatus, the rinse fixture comprising: a fixture body configured to be mounted to the showerhead assembly, the fixture body having an upper surface defined by an upper surface outer edge, a lower surface defined by a lower surface outer edge, wherein the lower surface is opposite the upper surface, and an outer side surface connected and spanning between the upper surface outer edge and the lower surface outer edge, the fixture body comprising: an inner cavity exposed at the lower surface of the fixture body; an outer cavity exposed at the lower surface of the fixture body and separated from the inner cavity by a partition, the outer cavity comprising an annular cavity extending at least partially around the inner cavity; and one or more outer channels in fluid communication with the outer cavity, the one or more outer channels extending from the outer cavity to the upper surface.

19. The rinse fixture of claim 18, the fixture body further comprising: one or more internal passageways in fluid communication with the interior cavity, the one or more internal passageways extending from the interior cavity to the upper surface, wherein the upper surface is flat. one or more internal passageways in fluid communication with the interior cavity, the one or more internal passageways extending from the interior cavity to the upper surface, wherein the upper surface is flat.

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