A gallium nitride device and gallium nitride packaging structure

Abstract

The present invention discloses a gallium nitride device and a gallium nitride packaging structure, relating to the field of gallium nitride, comprising a main packaging box, the bottom surface of which is threadedly connected to a supporting bottom block, two sides of which are symmetrically welded with fixed side panels, one side of which is bolted to a push cylinder, two sides of which are symmetrically provided with side slots, the inner sides of which are clamped with a movable push plate, the movable push plate being horizontally welded with an extension rod on a side away from the fixed side panel, the extension rod being horizontally welded with a fixed cross bar at one end away from the movable push plate, and a bottom support plate being vertically welded to one side of the fixed cross bar. The device of the present invention has a simple design structure and is easy to operate. The device is more stable by adopting a heat shrink fixed structure, while the packaging is fast and efficient by adopting a double-sided hot melt structure, and the vacuum treatment makes the operation of the internal components more stable.

Description

Technical Field

[0001] The present invention relates to the technical field of gallium nitride, and in particular to a gallium nitride device and a gallium nitride packaging structure. Background Art

[0002] Gallium nitride (GaN), an inorganic compound with the chemical formula GaN, is a compound of nitrogen and gallium. It is a direct-gap semiconductor and has been commonly used in light-emitting diodes since the 1990s. This compound has a structure similar to wurtzite and is very hard. GaN has a wide bandgap of 3.4 electron volts, enabling its use in high-power, high-speed optoelectronic devices. For example, GaN can be used in violet laser diodes, generating violet (405 nm) laser light without the use of nonlinear semiconductor-pumped solid-state lasers.

[0003] Current GaN devices are installed in plastic boxes, which leads to internal instability and air contamination, which affects the operation of components. Some GaN devices now require packaging equipment when fixed in a plastic-sealed structure. Traditional packaging equipment requires placing the outer skin of the package in a designated position and directly extruding and heating it for plastic sealing, which may cause the hand to be squeezed, posing a certain risk during the operation of the device. At the same time, it is still impossible to perform overall shrinkage during plastic sealing, which creates a risk of damage to the components due to extrusion, which is not conducive to the packaging of GaN devices. Summary of the Invention

[0004] The object of the present invention is to provide a gallium nitride device and a gallium nitride packaging structure to solve the problem raised in the above background technology that the current gallium nitride device is installed in a plastic box, which leads to internal instability and air doping, which affects the operation of the components to a certain extent. Some current gallium nitride devices require packaging equipment when fixed in a plastic-sealed structure. Traditional packaging equipment requires placing the outer skin of the package in a specified position and directly performing extrusion, heating and plastic sealing, which may cause the risk of squeezing the hands, posing a certain risk to the operation of the device. At the same time, it is still impossible to perform integral shrinkage during plastic sealing, which poses a risk of extrusion damage to the components, which is not conducive to the packaging of gallium nitride devices.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A gallium nitride device and a gallium nitride packaging structure, comprising a main packaging box, the bottom surface of the main packaging box being threadedly connected to a supporting bottom block, fixed side panels being symmetrically welded on both sides of the main packaging box, a push cylinder being bolted to one side of the fixed side panel, side slots being symmetrically opened on both sides of the main packaging box, a movable push plate being clamped on the inner side of the side slots, an extension support rod being horizontally welded to the side of the movable push plate away from the fixed side panel, a fixed cross bar being horizontally welded to one end of the extension support rod away from the movable push plate, a bottom support plate being vertically welded to one side of the fixed cross bar, and the bottom support plate being horizontally welded to the other side of the fixed cross bar. A heat-conducting frame is horizontally provided on the top surface of one end of the cross bar, a clamping bottom plate is fixedly clamped on the top surface of the bottom support plate, clamping grooves are evenly provided on the top surface of the clamping bottom plate, an extending through-hole is provided on one side of the main packaging box close to the fixed cross bar, a top pressure cylinder is bolted to the top surface of the main packaging box, a control key is inlaid on the top surface of the main packaging box, a sealing cover is horizontally docked on the top surface of the bottom support plate, a plastic sealing frame is welded on the outer side of the sealing cover, a connecting rod is plugged into the side of the plastic sealing frame, a threading hole is provided on the end of the connecting rod away from the plastic sealing frame, and the main packaging box is provided with a through-hole at the end away from the extending through-hole. One side is bolted to a push cylinder, the inner side of the main packaging box is fixedly sleeved with an inner isolation layer, the bottom surface of the main packaging box is evenly provided with bottom screw holes, the side wall of the main packaging box is inlaid with a control mainboard, the output end of the top pressure cylinder is horizontally welded with a top heating frame, the inner bottom surface of the inner isolation layer is vertically welded with a bottom support block, the top surface of the bottom support block is horizontally welded with a top supporting plate, the top surface of the top supporting plate is horizontally provided with a card plate groove, the inner bottom surface of the inner isolation layer is bolted to a temperature box, the output end of the temperature box is electrically connected to a connecting line, and ... fixed with a connecting line, and the inner bottom surface of the inner isolation layer is bolted to a temperature box, the output end of the temperature box is fixed with a connecting line, and the inner bottom surface of the inner isolation layer is bolted to a temperature box, the output end of the temperature box is fixed with a connecting line, and the inner bottom surface of the inner isolation layer is bolted to a temperature box, the output end of the temperature box is fixed with a connecting line, and the inner bottom surface of the inner isolation layer is bolted The pump body is connected, and the output end of the push-back cylinder is fixedly welded with a docking plate, and the docking plate is plugged with a plug-in tube on the side away from the push-back cylinder, and a connecting hose is plugged into the side of the docking plate. The top heating frame and the inner side of the top supporting plate are inlaid with heating wires, and the inner side of the sealing outer cover is fixedly sleeved with an inner support layer. The inner side of the sealing outer cover is horizontally provided with an insulating layer plate, and the two sides of the insulating layer plate are symmetrically and horizontally bonded with conductive layer plates. A silicon chip is welded on the side of one of the insulating layer plates, and a gallium nitride chip is welded on the side of one of the insulating layer plates, and a connecting wire is plugged into the side of the gallium nitride chip.

[0007] As a preferred embodiment of the present invention: the number of the supporting bottom blocks is four, and the four supporting bottom blocks are respectively docked and arranged at the bottom open end positions of the bottom screw holes, the top screws of the four supporting bottom blocks are inserted into the inner side edges of the corresponding bottom screw holes and are threadedly fixedly connected, the number of the fixed side panels is two, and the two fixed side panels are symmetrically and vertically arranged on both sides of the main packaging box near the edge positions.

[0008] As a preferred embodiment of the present invention: the number of the pushing cylinders is set to be consistent with the number of fixed side plates, and the output end of the pushing cylinder horizontally passes through the side wall of the fixed side plate and is vertically welded to one side edge of the movable push plate. The number of movable push plates is set to be consistent with the number of fixed side plates, and the movable push plate and the fixed side plate are set parallel to each other, and one end of the movable push plate is vertically clamped at the inner side edge of the side slot.

[0009] As a preferred embodiment of the present invention: one end of the extended support rod is vertically welded to the center position of one side edge of the movable push plate, and the two extended support rods are parallel and symmetrically arranged on both side edges of the main packaging box, the two ends of the fixed cross bar are vertically welded to the side position between the two extended support rods away from the movable push plate, one end of the bottom support plate is vertically welded to the center position of one side edge of the fixed cross bar close to the main packaging box, and the bottom support plate is horizontally docked at the center position of the extended through hole at the end away from the fixed cross bar, the card bottom plate is made of high-temperature resistant material, and is fixedly arranged near the edge of the heat-conducting frame, and the bottom support plate is made of high-efficiency heat-conducting material.

[0010] As a preferred embodiment of the present invention: there are multiple card slots, and the multiple card slots are arranged parallel to each other, the extended through hole penetrates the side wall of the main packaging box and extends to the interior, and the interior of the extended through hole is kept in communication with the interior of the inner isolation layer, the output end of the top pressure cylinder vertically downward penetrates the top surface of the main packaging box and extends to the interior, and the top pressure cylinder is fixedly set at the center position of the top surface of the main packaging box, the sealing cover is made of heat shrinkable material, and the sealing cover has two bowl-shaped structures that are buckled with each other and arranged at the top and bottom surfaces of the conductive layer plate, the sealing cover is snap-fitted to the inner side edge of the thermal conductive frame, and the bottom surface of the plastic-sealed frame is butted against the edge of the top opening of the thermal conductive frame.

[0011] As a preferred embodiment of the present invention: there are multiple connecting rods, and the multiple connecting rods are parallel to each other, one end of the multiple connecting rods passes through the plastic frame and extends to the inner side edge of the sealed outer cover, and the extended ends are respectively electrically connected to the silicon chip, the gallium nitride chip and the connecting wires, the output end of the push cylinder horizontally passes through the side wall of the main packaging box and extends to the interior, the bottom screw holes are vertically opened at the four corners of the bottom surface of the main packaging box, the control main board and the control keys are electrically connected to each other, the top heating frame and the top support plate are superimposed and parallel to each other, and the output end of the top pressure cylinder is welded vertically downward to the top surface of the top heating frame near one side edge.

[0012] As a preferred embodiment of the present invention: the top support plate and the center position of the extended through hole are arranged to be maintained at the same horizontal plane position, the specifications and dimensions of the card slot are arranged to be consistent with the specifications and dimensions of the bottom support plate, and the card slot is provided with an opening on one side close to the extended through hole, the connecting wire extends through the side wall of the top support plate and the top heating frame at the end away from the temperature box, and the extended end is electrically connected to the heating wire, one end of the connecting hose is fixedly sleeved on the output end of the pump body, and the other end is connected to the plug-in tube.

[0013] As a preferred embodiment of the present invention: the four sides of the insulating layer plate are horizontally arranged between the plastic packaging frame, the number of the conductive layer plates is two, and the two conductive layer plates are stacked and arranged parallel to each other at the center position of the top and bottom surfaces of the insulating layer plate.

[0014] As a preferred embodiment of the present invention: the silicon chip and the gallium nitride chip are respectively fixedly arranged on the top and bottom surfaces of the two conductive layer plates, and the silicon chip and the gallium nitride chip are electrically connected to the conductive layer plates. One end of the connecting wire is fixedly connected to the conductive end of the gallium nitride chip, and the other end is welded to the side of a conductive layer plate to maintain electrical connection.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention is safer and more reliable by designing an automatic pushing material structure. When the control key is pressed, the control main board controls the pushing cylinder to work. Under the pulling of the pushing cylinder, the movable pushing plate slides inside the side card slot, and under the downward pushing of the top pressure cylinder, the top heating frame moves downward, so that the top heating frame is squeezed on the top surface position of the plastic sealing frame. At the same time, the push of the rear pushing cylinder drives the docking plate to dock with the side position of the plastic sealing frame, so that one end of the plug-in tube passes through the gap between the plastic sealing frames and enters the inner side position of the sealing outer cover. During heating and welding, the pump body draws air through the connecting hose, so that the plug-in tube draws air out of the sealing outer cover. After the air inside the sealing outer cover is completely evacuated, the plastic sealing frame is finally heated and welded on the upper and lower sides in the heat-conducting frame and the card slot. The double-sided heating process makes it faster and more efficient.

[0017] 2. The present invention can complete the packaging of the device by simultaneously connecting the connecting rod to the corresponding clamping groove on the top surface of the clamping base plate to stabilize it during welding. The device has a simple design structure and is easy to operate. The heat shrinkage fixing structure makes the device more stable. The double-sided hot melt structure makes the packaging fast and efficient, and the vacuum treatment makes the operation of the internal components more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0019] Figure 1 A schematic diagram of a three-dimensional structure of a gallium nitride device and a gallium nitride packaging structure;

[0020] Figure 2 A schematic diagram of the three-dimensional structure of a gallium nitride device and a gallium nitride packaging structure;

[0021] Figure 3 A schematic diagram of the structure of a gallium nitride device and a gallium nitride packaging structure showing connection details from a top view;

[0022] Figure 4 A schematic structural diagram of a main packaging box of a gallium nitride device and a gallium nitride packaging structure showing connection details from a front view and cross section;

[0023] Figure 5 A schematic structural diagram showing the side view connection details of a push cylinder of a gallium nitride device and a gallium nitride packaging structure;

[0024] Figure 6 A schematic structural diagram of the front cross-sectional connection details of a gallium nitride device and a gallium nitride packaging structure;

[0025] Figure 7 A schematic structural diagram showing front cross-sectional connection details of a sealed outer cover of a gallium nitride device and a gallium nitride packaging structure;

[0026] Figure 8 The figure is a structural schematic diagram showing the front view and cross-sectional connection details of an insulating layer plate of a gallium nitride device and a gallium nitride packaging structure.

[0027] Figure: 1, main packaging box; 2, supporting bottom block; 3, fixed side plate; 4, pushing cylinder; 5, side slot; 6, movable push plate; 7, extension rod; 8, fixed cross bar; 9, bottom support plate; 10, heat conduction frame; 11, clamping bottom plate; 12, clamping slot; 13, extension through hole; 14, top pressure cylinder; 15, control key; 16, sealing cover; 17, plastic sealing frame; 18, connecting rod; 19, threading hole; 20, rear push cylinder; 2 1. Inner isolation layer; 22. Bottom screw hole; 23. Control main board; 24. Top heating frame; 25. Bottom support block; 26. Top support plate; 27. Card slot; 28. Temperature box; 29. ​​Connecting wire; 30. Pump body; 31. Docking plate; 32. Plug-in tube; 33. Connecting hose; 34. Heating wire; 35. Inner support layer; 36. Insulating layer; 37. Conductive layer; 38. Silicon chip; 39. GaN chip; 40. Connecting wire. DETAILED DESCRIPTION

[0028] See also Figure 1-2In an embodiment of the present invention, a gallium nitride device and a gallium nitride packaging structure include a main packaging box 1, the bottom surface of the main packaging box 1 is threadedly connected to a supporting bottom block 2, and fixed side panels 3 are symmetrically welded on both sides of the main packaging box 1. There are four supporting bottom blocks 2, and the four supporting bottom blocks 2 are respectively connected to the bottom open ends of the bottom screw holes 22. The top screws of the four supporting bottom blocks 2 are inserted into the inner sides of the corresponding bottom screw holes 22 and are fixedly connected by threads. There are two fixed side panels 3, and the two fixed side panels 3 are symmetrically and vertically arranged on both sides of the main packaging box 1 near the edge. One side of the fixed side panel 3 is bolted to a pushing cylinder 4. Side card slots 5 are symmetrically opened on both sides of the main packaging box 1, and the inner sides of the side card slots 5 are clamped with movable pushing cylinders. Plate 6, the number of pushing cylinders 4 is consistent with the number of fixed side plates 3, and the output end of the pushing cylinder 4 horizontally penetrates the side wall of the fixed side plate 3 and is vertically welded to one side position of the movable push plate 6, the number of movable push plates 6 is consistent with the number of fixed side plates 3, and the movable push plate 6 and the fixed side plate 3 are arranged parallel to each other, one end of the movable push plate 6 is vertically clamped in the inner side position of the side card slot 5, the movable push plate 6 is horizontally welded with an extension support rod 7 on a side away from the fixed side plate 3, the extension support rod 7 is horizontally welded with a fixed cross bar 8 at one end away from the movable push plate 6, and a bottom support plate 9 is vertically welded to one side of the fixed cross bar 8, the bottom support plate 9 is horizontally provided with a heat-conducting frame 10 on the top surface of one end away from the fixed cross bar 8, and the top surface of the bottom support plate 9 is fixed It is connected to the card bottom plate 11, one end of the extension support rod 7 is vertically welded to the center position of one side of the movable push plate 6, and the two extension support rods 7 are parallel and symmetrical to each other on both side positions of the main packaging box 1, and the two ends of the fixed cross bar 8 are vertically welded to the side position between the two extension support rods 7 away from the movable push plate 6, one end of the bottom support plate 9 is vertically welded to the center position of one side of the fixed cross bar 8 close to the main packaging box 1, and the bottom support plate 9 is horizontally docked at the center position of the extended through hole 13 at the end away from the fixed cross bar 8. The card bottom plate 11 is made of high-temperature resistant material and is fixedly set near the edge position of the heat-conducting frame 10. The bottom support plate 9 is made of high-efficiency heat-conducting material. The top surface of the card bottom plate 11 is evenly provided with card grooves 12. The main packaging box An extension through-hole 13 is provided on one side near the fixed crossbar 8. A top pressure cylinder 14 is bolted to the top surface of the main packaging box 1. There are multiple material slots 12, and the multiple material slots 12 are arranged parallel to each other. The extension through-hole 13 extends through the side wall of the main packaging box 1 to the interior, and the interior of the extension through-hole 13 is connected to the interior of the inner isolation layer 21. The output end of the pressure cylinder 14 extends vertically downward through the top surface of the main packaging box 1 to the interior, and the pressure cylinder 14 is fixedly set at the center of the top surface of the main packaging box 1. A control key 15 is embedded in the top surface of the main packaging box 1. A sealing cover 16 is horizontally connected to the top surface of the bottom support plate 9. A plastic sealing frame 17 is welded to the outer edge of the sealing cover 16. The sealing cover 16 is made of heat shrinkable material.The sealed outer cover 16 is a pair of bowl-shaped structures that are interlocked and arranged on the top and bottom surfaces of the conductive layer 37. The sealed outer cover 16 is snap-fitted to the inner side of the thermally conductive frame 10, and the bottom surface of the plastic frame 17 is connected to the edge of the top opening of the thermally conductive frame 10. The side of the plastic frame 17 is plugged with connecting rods 18. There are multiple connecting rods 18, and the multiple connecting rods 18 are parallel to each other. One end of the multiple connecting rods 18 passes through the plastic frame 17 and extends to the inner side of the sealed outer cover 16. The extended ends are respectively electrically connected to the silicon chip 38, the gallium nitride chip 39 and the connecting wire 40. The connecting rod 18 is provided with a threading hole 19 at the end away from the plastic frame 17.

[0029] See also Figure 3-5 In an embodiment of the present invention, a gallium nitride device and a gallium nitride packaging structure are provided, wherein a main packaging box 1 is bolted with a push cylinder 20 on a side away from the extension through hole 13, an inner isolation layer 21 is fixedly sleeved on the inner side of the main packaging box 1, bottom screw holes 22 are evenly opened on the bottom surface of the main packaging box 1, a control mainboard 23 is embedded in the side wall of the main packaging box 1, the output end of the top pressure cylinder 14 is horizontally welded with a top heating frame 24, the output end of the push cylinder 20 horizontally penetrates the side wall of the main packaging box 1 and extends to the interior, the bottom screw holes 22 are vertically opened at the four corners of the bottom surface of the main packaging box 1, the control mainboard 23 and the control key 15 are electrically connected to each other, the top heating frame 24 and the top supporting plate 26 are superimposed and arranged in parallel with each other, and the output end of the top pressure cylinder 14 is vertically welded downward to the top surface of the top heating frame 24 near one side, and the inner bottom surface of the inner isolation layer 21 is vertically welded upward. The top surface of the bottom support block 25 is horizontally welded with a top supporting plate 26, and the top surface of the top supporting plate 26 is horizontally provided with a card plate groove 27. The inner bottom surface of the inner isolation layer 21 is bolted to a temperature box 28, and the output end of the temperature box 28 is electrically connected to a connecting line 29. The inner bottom surface of the inner isolation layer 21 is bolted to the pump body 30. The output end of the push-back cylinder 20 is fixedly welded with a docking plate 31. The top supporting plate 26 and the center position of the extension through hole 13 are set to be maintained in the same horizontal plane position. The specifications and dimensions of the card plate groove 27 are consistent with those of the bottom supporting plate 9, and the card plate groove 27 is provided with an opening on one side near the extension through hole 13. The connecting line 29 extends inside the side wall of the top supporting plate 26 and the top heating frame 24 at the end away from the temperature box 28, and the extended end is electrically connected to the heating wire 34. The docking plate 31 is plugged with a plug-in pipe 32 on the side away from the push-back cylinder 20.

[0030] See also Figure 6-8In an embodiment of the present invention, a gallium nitride device and a gallium nitride packaging structure are provided, wherein a connecting hose 33 is plugged into the side of a docking plate 31, one end of the connecting hose 33 is fixedly sleeved on the output end of the pump body 30, and the other end is connected to the plug-in tube 32. A heating wire 34 is embedded in the inner side of the top heating frame 24 and the top supporting plate 26, an inner support layer 35 is fixedly sleeved on the inner side of the sealing outer cover 16, an insulating layer 36 is horizontally provided on the inner side of the sealing outer cover 16, and the sides of the insulating layer 36 are horizontally provided between the plastic sealing frame 17. There are two conductive layers 37, and the two conductive layers 37 are stacked and arranged in parallel on the insulating layer. At the center position of the top and bottom surfaces of the insulating layer plate 36, the two sides of the insulating layer plate 36 are symmetrically and horizontally bonded with conductive layer plates 37, a silicon chip 38 is welded on the side of one insulating layer plate 36, a gallium nitride chip 39 is welded on the side of another insulating layer plate 36, and a connecting wire 40 is inserted into the side of the gallium nitride chip 39. The silicon chip 38 and the gallium nitride chip 39 are respectively fixed on the top and bottom surfaces of the two conductive layer plates 37, and the silicon chip 38 and the gallium nitride chip 39 are electrically connected to each other with the conductive layer plates 37. One end of the connecting wire 40 is fixedly connected to the conductive end of the gallium nitride chip 39, and the other end is welded to the side of a conductive layer plate 37 to maintain electrical connection.

[0031] The components are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0032] The working principle of the present invention is:

[0033] The bottom surface of the sealing cover 16 is placed horizontally on the inside of the heat-conducting frame 10 on the top surface of the bottom support plate 9, the insulating layer plate 36 is placed horizontally to the top surface position of the sealing cover 16, and the other half of the sealing cover 16 is buckled on the top surface position of the insulating layer plate 36, and the control key 15 is pressed to make the control main board 23 control the pushing cylinder 4 to work, and the movable push plate 6 is pulled by the pushing cylinder 4 to slide inside the side card slot 5, and the sliding of the movable push plate 6 makes the extension support rod 7 and the fixed cross bar 8 move toward the direction of the main packaging box 1, thereby driving the bottom support plate 9 to horizontally penetrate the extension through hole 13 into the interior, and continue to run after entering the interior, and be plugged into the inside of the card slot 27 on the top surface of the top support plate 26, and under the downward push of the top pressure cylinder 14, the top heating frame 24 moves downward, so that the top heating frame 24 is squeezed on the top surface position of the plastic sealing frame 17, and at the same time, the rear push cylinder The push of 20 makes it possible to drive the docking plate 31 to dock with the side position of the plastic packaging frame 17, so that one end of the plug-in tube 32 passes through the gap between the plastic packaging frames 17 and enters the inner side position of the sealed outer cover 16. Under the control of the temperature box 28, the heating wire 34 is heated to a specified stability, so that the plastic packaging frame 17 is heated and welded. During the heating and welding, the pump body 30 draws air through the connecting hose 33, so that the plug-in tube 32 draws out the air inside the sealed outer cover 16. After the air inside the sealed outer cover 16 is completely evacuated, the contraction of the push cylinder 20 causes the plug-in tube 32 to be slowly withdrawn from the position between the plastic packaging frames 17. Finally, the plastic packaging frame 17 is heated and welded from top to bottom by the heat-conducting frame 10 and the card slot 27. At the same time, the connecting rod 18 is correspondingly clamped in the internal of the card slot 12 on the top surface of the card bottom plate 11 to stabilize the device packaging process.

[0034] The above is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A gallium nitride device and a gallium nitride packaging structure, comprising a main packaging box (1), characterized in that: The bottom surface of the main packaging box (1) is threadedly connected to a supporting bottom block (2), and fixed side panels (3) are symmetrically welded on both sides of the main packaging box (1), and a push cylinder (4) is bolted to one side of the fixed side panel (3). Side slots (5) are symmetrically opened on both sides of the main packaging box (1), and a movable push plate (6) is clamped on the inner side of the side slot (5). The movable push plate (6) is horizontally welded with an extension rod (7) on the side away from the fixed side panel (3), and the extension rod (7) is horizontally welded with a fixed cross bar (8) at one end away from the movable push plate (6). A bottom support plate (9) is vertically welded to one side of the fixed cross bar (8), and the bottom support plate (9) is horizontally welded to the top surface of the end away from the fixed cross bar (8). A heat-conducting frame (10) is provided horizontally, the top surface of the bottom support plate (9) is fixedly connected with a clamping bottom plate (11), the top surface of the clamping bottom plate (11) is evenly provided with clamping grooves (12), the main packaging box (1) is provided with an extended through hole (13) on one side close to the fixed cross bar (8), the top surface of the main packaging box (1) is bolted with a top pressure cylinder (14), the top surface of the main packaging box (1) is inlaid with a control key (15), the top surface of the bottom support plate (9) is horizontally connected with a sealing cover (16), the outer side of the sealing cover (16) is welded with a plastic sealing frame (17), the side of the plastic sealing frame (17) is plugged with a connecting rod (18), and the connecting rod (18) is opened at the end away from the plastic sealing frame (17). A threading hole (19) is provided, the main packaging box (1) is bolted with a push cylinder (20) on the side away from the extension through hole (13), the inner side of the main packaging box (1) is fixedly sleeved with an inner isolation layer (21), the bottom surface of the main packaging box (1) is evenly provided with bottom screw holes (22), the side wall of the main packaging box (1) is embedded with a control main board (23), the output end of the top pressure cylinder (14) is horizontally welded with a top heating frame (24), the inner bottom surface of the inner isolation layer (21) is vertically welded with a bottom support block (25), the top surface of the bottom support block (25) is horizontally welded with a top support plate (26), the top surface of the top support plate (26) is horizontally provided with a card slot (27), the inner isolation layer (21 ) is bolted to the inner bottom surface of the temperature box (28), the output end of the temperature box (28) is electrically connected to a connecting line (29), the inner bottom surface of the inner isolation layer (21) is bolted to the pump body (30), the output end of the push-back cylinder (20) is fixedly welded with a docking plate (31), the docking plate (31) is plugged with a plug-in tube (32) on the side away from the push-back cylinder (20), the side of the docking plate (31) is plugged with a connecting hose (33), the inner side of the top heating frame (24) and the top supporting plate (26) are inlaid with a heating wire (34), the inner side of the sealing outer cover (16) is fixedly sleeved with an inner support layer (35), and the inner side of the sealing outer cover (16) is horizontally provided with an insulating layer plate (36),Conductive layers (37) are symmetrically bonded to both sides of the insulating layer (36), a silicon chip (38) is welded to the side of one insulating layer (36), a gallium nitride chip (39) is welded to the side of another insulating layer (36), and a connecting wire (40) is plugged into the side of the gallium nitride chip (39).

2. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The number of the supporting bottom blocks (2) is four, and the four supporting bottom blocks (2) are respectively connected to the bottom opening end of the bottom screw hole (22), and the top screws of the four supporting bottom blocks (2) are inserted into the inner side edges of the corresponding bottom screw holes (22) to be fixedly connected by threads. The number of the fixed side panels (3) is two, and the two fixed side panels (3) are respectively symmetrically and vertically arranged on both sides of the main packaging box (1) near the edge.

3. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The number of the pushing cylinders (4) is set to be consistent with the number of the fixed side plates (3), and the output end of the pushing cylinder (4) horizontally penetrates the side wall of the fixed side plate (3) and is vertically welded to a side edge position of the movable push plate (6). The number of the movable push plates (6) is set to be consistent with the number of the fixed side plates (3), and the movable push plates (6) and the fixed side plates (3) are set parallel to each other. One end of the movable push plate (6) is vertically clamped to the inner side edge position of the side clamping groove (5).

4. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: One end of the extension support rod (7) is vertically welded to the center position of one side of the movable push plate (6), and the two extension support rods (7) are parallel and symmetrically arranged on the two side sides of the main packaging box (1). The two ends of the fixed cross bar (8) are vertically welded to the side position between the ends of the two extension support rods (7) away from the movable push plate (6). One end of the bottom support plate (9) is vertically welded to the center position of one side of the fixed cross bar (8) close to the main packaging box (1), and the end of the bottom support plate (9) away from the fixed cross bar (8) is horizontally docked at the center position of the extension through hole (13). The clamping bottom plate (11) is made of high-temperature resistant material and is fixedly arranged at the edge position close to the heat-conducting frame (10). The bottom support plate (9) is made of high-efficiency heat-conducting material.

5. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The number of the clamping slots (12) is multiple, and the multiple clamping slots (12) are arranged parallel to each other. The extended through hole (13) penetrates the side wall of the main packaging box (1) and extends to the interior, and the interior of the extended through hole (13) is kept in communication with the interior of the inner isolation layer (21). The output end of the top pressure cylinder (14) vertically penetrates the top surface of the main packaging box (1) and extends to the interior, and the top pressure cylinder (14) is fixedly set at the center position of the top surface of the main packaging box (1). The sealing outer cover (16) is made of heat shrinkable material, and the sealing outer cover (16) is in the form of two bowl-shaped structures that are buckled and arranged on the top and bottom surfaces of the conductive layer (37). The sealing outer cover (16) is clamped and arranged at the inner side edge of the heat-conducting frame (10), and the bottom surface of the plastic-sealed frame (17) is connected to the edge of the top opening of the heat-conducting frame (10).

6. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: There are multiple connecting rods (18), and the multiple connecting rods (18) are parallel to each other. One end of the multiple connecting rods (18) passes through the plastic packaging frame (17) and extends to the inner side of the sealing cover (16), and the extended ends are respectively electrically connected to the silicon chip (38), the gallium nitride chip (39) and the connecting wire (40). The output end of the rear push cylinder (20) horizontally passes through the side wall of the main packaging box (1) and extends to the inside. The bottom screw holes (22) are vertically opened at the four corners of the bottom surface of the main packaging box (1). The control main board (23) and the control key (15) are electrically connected to each other. The top heating frame (24) and the top support plate (26) are arranged in parallel with each other in a superimposed manner, and the output end of the top pressure cylinder (14) is vertically welded downward to the top surface of the top heating frame (24) near one side.

7. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The center positions of the top support plate (26) and the extension hole (13) are arranged to be in the same horizontal plane, the specifications and dimensions of the card slot (27) are arranged to be consistent with the specifications and dimensions of the bottom support plate (9), and the card slot (27) is provided with an opening on one side close to the extension hole (13). The connecting wire (29) extends through the top support plate (26) and the side wall of the top heating frame (24) at the end away from the temperature box (28), and the extension end is electrically connected to the heating wire (34). One end of the connecting hose (33) is fixedly sleeved on the output end of the pump body (30), and the other end is connected to the plug-in tube (32).

8. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The four sides of the insulating layer plate (36) are horizontally arranged between the plastic packaging frame (17), and the number of the conductive layer plates (37) is two, and the two conductive layer plates (37) are arranged in parallel and stacked on each other at the center positions of the top and bottom surfaces of the insulating layer plate (36).

9. The gallium nitride device and gallium nitride packaging structure according to claim 1, characterized in that: The silicon chip (38) and the gallium nitride chip (39) are fixedly arranged on the top and bottom surfaces of the two conductive layers (37), respectively, and the silicon chip (38) and the gallium nitride chip (39) are electrically connected to the conductive layers (37). One end of the connecting wire (40) is fixedly connected to the conductive end of the gallium nitride chip (39), and the other end is welded to the side of a conductive layer (37) to maintain electrical connection.

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