Inspection device and chuck top position adjustment method

Abstract

The present invention provides an inspection device and a method for adjusting the position of a chuck top that can easily adjust the angle of a chuck top. The present invention provides an inspection device, which includes: a plurality of inspection units that inspect electronic devices as inspected objects on a plurality of chuck tops respectively; a measuring unit that measures the height positions of a plurality of points on the surface of each of the plurality of chuck tops respectively configured corresponding to the plurality of inspection units, or the distances in the height direction from a measurement reference point to the plurality of points; a calculating unit that calculates the adjustment amount in the height direction of the plurality of points on each chuck top based on the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points; and an adjustment mechanism that adjusts the angle of the chuck top for each chuck top based on the adjustment amount.

Description

Technical Field

[0001] The invention relates to an inspection device and a method for adjusting the position of a chuck top. Background Art

[0002] Patent Document 1 discloses a technique in which a shim for adjusting the thickness of a probe card is provided on a surface that contacts a pogo frame of a probe card in a wafer inspection interface used for wafer inspection.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-191736 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technology that can easily adjust the angle of a chuck top.

[0008] Technical solutions for solving technical problems

[0009] According to one embodiment of the present invention, there is provided an inspection device, comprising: a plurality of inspection units, which respectively inspect electronic devices as inspection objects on a plurality of chuck tops; a measuring unit, which measures the height positions of a plurality of points on the surface of each of the plurality of chuck tops respectively arranged corresponding to the plurality of inspection units, or the distances in the height direction from a measurement reference point to the plurality of points; a calculating unit, which calculates the adjustment amount in the height direction of the plurality of points on the top of each chuck based on the height positions of the plurality of points, or the distances in the height direction from the measurement reference point to the plurality of points; and an adjusting mechanism, which adjusts the angle of the top of each chuck based on the adjustment amount.

[0010] Effects of the Invention

[0011] According to one aspect, the angle adjustment of the chuck top can be easily performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a cross-sectional view showing an example of the inspection device 10 according to the embodiment.

[0013] Figure 2 It means Figure 1 FIG. 2 is a diagram showing an example of a cross section of the entire inspection device 10 in a cut plane corresponding to the cross section taken along arrow AA in FIG.

[0014] Figure 3 It is a diagram showing the positioner 19 and the adjustment mechanism 20 of the inspection device 10 .

[0015] Figure 4 It is a diagram showing the adjustment mechanism 20 .

[0016] Figure 5 1 is a flowchart showing the process of the method for adjusting the position of the chuck top according to the embodiment.

[0017] Description of Reference Numerals

[0018] 10 Inspection device

[0019] 15 Tester

[0020] 15A elastic frame

[0021] 15B Chuck Top

[0022] 19 Positioner

[0023] 19X X platform

[0024] 19Y Y platform

[0025] 19Z Z platform

[0026] 20 Adjustment mechanism

[0027] 20A, 20B, 20C Adjustment Department

[0028] 17d Controller

[0029] 171 Control Department

[0030] 172 Computing Department

[0031] 173 Memory. DETAILED DESCRIPTION

[0032] Hereinafter, the mode for implementing the present invention will be described with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, the same reference numerals are attached to substantially the same structures, and repeated descriptions are omitted.

[0033] <Implementation Method>

[0034] Figure 1 It is a cross-sectional view showing an example of the inspection device 10 according to the embodiment. Figure 2 It means Figure 1 FIG. 1 is a diagram showing an example of a cross section of the entire inspection device 10 in a cross section corresponding to the AA arrow cross section in ...

[0035] like Figure 1 and Figure 2As shown, the inspection device 10 includes a housing 11 . The interior space of the housing 11 is an inspection chamber 11A. The inspection chamber 11A includes an inspection area 12 , a conveying area 13 , and a loading area 14 .

[0036] exist Figure 1 and Figure 2 In the figure, a wall (a wall substantially parallel to the XZ plane) partitioning the inspection area 12, the conveying area 13, and the loading area 14, an opening provided in the wall, and the like are omitted.

[0037] The inspection area 12 is an area for inspecting the electrical characteristics of electronic devices formed on a wafer W as an example of an object to be inspected, and is mainly configured with a plurality of testers 15 for wafer inspection, an elastic frame 15A, a camera 16, a positioner 19, and an adjustment mechanism 20. The tester 15 and the elastic frame 15A are examples of an inspection unit. The elastic frame 15A is set one by one under each tester 15. The camera 16 is an example of a measuring unit and is set on the side of the tester 15. As an example, five testers 15 are arranged in the X direction in the inspection area 12, and three layers are set in the vertical direction. In addition, the camera 16 is set one by one on each layer and can move in the X direction along the guide rail 16A. Figure 1 The structure shown is, as an example, a structure of a portion of the middle layer including the tester 15, and the structure of each layer is the same. A plurality of testers 15 are arranged in the X direction within the inspection area 12, and multiple layers are provided in the vertical direction. In addition, the camera 16 can be provided one by one in each tester 15. In addition, the alignment device 19 and the adjustment mechanism 20 will be described later.

[0038] The conveyance area 13 is an area provided between the inspection area 12 and the loading area 14. A guide rail 18A for guiding the conveyance stage 18 in the X direction is provided in the conveyance area 13. The conveyance stage 18 will be described later.

[0039] The loading area 14 is divided into a plurality of storage spaces 17. As an example, the plurality of storage spaces 17 are divided into five in the X direction and divided into three layers in the vertical direction. Figure 1 5 storage spaces 17 located in the middle layer among the 3 layers are shown. Three storage spaces 17 among the 5 storage spaces 17 in the middle layer are provided with three ports 17a for storing FOUPs, which are containers for storing a plurality of wafers W, and the remaining two storage spaces 17 are provided with a controller 17d for controlling the operation of each part of the inspection device 10. FOUP is an example of a carrier, and the port 17a is an example of a carrier storage chamber.

[0040] Under each tester 15, a pogo frame 15A (not shown) for holding a probe card is provided. The pogo frame 15A is fixed to the housing 11. The pogo frame 15A has pogo pins (not shown) that contact the terminals of the electronic components of the wafer W. The terminals of the electronic components of the wafer W are electrically connected to the tester 15 via the pogo frame 15A.

[0041] The chuck top 15B is a thick plate-shaped component having a flat upper surface. The chuck top 15B is positioned by the alignment device 19 (refer to Figure 2 ) is adsorbed to the elastic frame 15A by a vacuum adsorption mechanism (not shown) in a state where the position of the chuck top 15B is aligned with the elastic frame 15A. In addition, the inspection device 10 includes an adjustment mechanism 20. The adjustment mechanism 20 is provided on the alignment device 19 and adjusts the angle of the chuck top 15B so that the upper surface (surface) of the chuck top 15B becomes horizontal. For details of the adjustment mechanism 20, see Figure 3 Explained later.

[0042] When the chuck top 15B is adsorbed to the elastic frame 15A, the probes of the probe card are pressed to the terminals of the electronic devices of the wafer W. In addition, the aligners 19 are provided one by one in each layer. Figure 1 In the figure, the aligner 19 is located under any one of the five testers 15 and is not shown in the figure.

[0043] The chuck top 15B may include a heating mechanism (heater) for heating the wafer W, and the temperature of the wafer W may be heated to a desired temperature when the tester 15 inspects the electrical characteristics of the electronic device. In addition, the chuck top 15B may include a cooling mechanism (cooling unit) for cooling the chuck top 15B using a cooling liquid.

[0044] The camera 16 moves in the X direction along the guide rail 16A in each layer, and captures the position of the wafer W held on the upper surface of the chuck top 15B and the position of the chuck top 15B. The image data acquired by the camera 16 is used when the position of the wafer W is aligned by the positioner 19, and is used when the position (hereinafter referred to as the height position) of the upper surface of the chuck top 15B in the Z direction is measured. The height position of the chuck top 15B is represented by, for example, a height position relative to a predetermined height reference point determined in the inspection device 10.

[0045] The conveyor table 18 is an example of a conveying mechanism. The conveyor table 18 can move in the X direction along the guide rail 18A in the conveying area 13. The conveyor table 18 has an arm that can move in the Y direction and the Z direction, and can convey the wafer W in the X direction, the Y direction, and the Z direction. The conveyor table 18 receives the wafer W from the end port 17a of the loading area 14, conveys it in the X direction in the conveying area 13, and delivers it to the aligner 19. In addition, the conveyor table 18 receives the wafer W for which the inspection of the electrical characteristics of the electronic device has been completed from the aligner 19, conveys it in the X direction in the conveying area 13, and delivers it to the end port 17a.

[0046] The aligner 19 is an example of a position alignment mechanism, and receives the wafer W from the conveyor stage 18. The aligner 19 conveys the chuck top 15B holding the wafer W to each tester 15, and performs position alignment of the wafer W to the probe card held by the elastic frame 15A. In the state where such position alignment is performed, the chuck top 15B is adsorbed to the elastic frame 15A by a vacuum adsorption mechanism (not shown). The aligner 19 receives the chuck top 15B holding the wafer W for which the inspection of the electrical characteristics of the electronic device has been completed from the elastic frame 15A to the adjustment mechanism 20, and delivers the wafer W to the conveyor stage 18.

[0047] Figure 3 It is a diagram showing the positioner 19 and the adjustment mechanism 20 of the inspection device 10 . Figure 4 2 is a diagram showing the adjustment mechanism 20. Figure 3 In FIG. 1 , the structure around a tester 15 included in one of the three layers in the vertical direction is shown in a YZ cross section. The positioner 19 is provided on the bottom surface 11F of each layer of the housing 11. In addition, Figure 3 The controller 17d is shown in the figure, and the camera 16 is omitted. The positioner 19 and the adjustment mechanism 20 are driven and controlled by the controller 17d.

[0048] The positioner 19 is provided one by one in each of the three layers in the vertical direction. The positioner 19 has a structure in which an X stage 19X, a Y stage 19Y, and a Z stage 19Z are stacked in order from bottom to top. The X stage 19X can move in the X direction, the Y stage 19Y can move in the Y direction relative to the X stage 19X, and the Z stage 19Z can move in the Z direction relative to the Y stage 19Y. An adjustment mechanism 20 is provided on the upper surface of the Z stage 19Z.

[0049] However, the positioning device 19 is on the conveying platform 18 (refer to Figure 1 ) and the tester 15, in order to prevent the position deviation or damage of the wafer W, the wafer W should be kept horizontal. Therefore, the upper surface of the chuck top 15B only needs to be horizontal.

[0050] However, for example, due to the positional deviation of the X stage 19X, Y stage 19Y, and Z stage 19Z of the positioner 19 due to the change over time, the upper surface of the Z stage 19Z may not be horizontal, and the upper surface of the chuck top 15B may not be horizontal. In addition, for example, due to the individual difference and deformation of each chuck top 15B, the upper surface of the chuck top 15B may not be horizontal. In this embodiment, in such a case, the angle of the chuck top 15B is adjusted by the adjustment mechanism 20 so that the upper surface of the chuck top 15B becomes horizontal.

[0051] The adjustment mechanism 20 includes adjustment parts 20A, 20B, and 20C. The adjustment parts 20A, 20B, and 20C are fixed to the upper surface of the Z stage 19Z. Figure 4 As shown in FIG. 1 , as an example, the chuck top 15B is not arranged on a straight line but is arranged at the vertices of a triangle in a plan view. This is to support the chuck top 15B at three points.

[0052] The adjustment parts 20A, 20B, and 20C are actuators that can be extended and retracted in the Z direction, and can adjust the length in the Z direction based on the adjustment amount data input from the controller 17d so that the upper surface of the chuck top 15B becomes horizontal. The positioner 19 holds the chuck top 15B via such an adjustment mechanism 20 and transports each tester 15. In addition, the adjustment amount data will be described later.

[0053] In order to adjust the lengths of the adjustment parts 20A, 20B, and 20C in the Z direction so that the upper surface of the chuck top 15B becomes horizontal, the controller 17d performs the following control processing. Here, the controller 17d is, as an example, implemented by a computer including a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an input / output interface, an internal bus, etc.

[0054] The controller 17d includes a control unit 171, a calculation unit 172, and a memory 173. The control unit 171 and the calculation unit 172 represent the functions (functions) of the program executed by the controller 17d as functional modules. In addition, the memory 173 is a part that functionally represents the memory such as RAM, ROM, HDD, etc. of the controller 17d.

[0055] The control unit 171 is a part of the controller 17d that controls the operation of each unit of the inspection device 10. The control unit 171 controls the camera 16 (see Figure 1 , 2) acquires image data indicating the positions of the wafer W and the chuck top 15B. This is used for the alignment of the wafer W and the chuck top 15B by the aligner 19.

[0056] The position alignment of the wafer W by the aligner 19 is performed by the aligner 19 through a stage (not shown) for adjusting the θ axis provided in addition to the X stage 19X, the Y stage 19Y, and the Z stage 19Z. The position alignment of the chuck top 15B by the aligner 19 is performed by adjusting the positions of the X stage 19X, the Y stage 19Y, and the Z stage 19Z in the X, Y, and Z directions. The control unit 171 generates a command for driving control of the aligner 19 based on the image data indicating the positions of the wafer W and the chuck top 15B, and transmits the command to the aligner 19.

[0057] In addition, the control unit 171 moves the chuck top 15B to the shooting position for measuring the height position of the chuck top 15B through the positioner 19 according to the shooting command, and causes the camera 16 to shoot three points of the upper surface of the chuck top 15B at predetermined positions. At the shooting position for measuring the height position of the chuck top 15B, the X stage 19X and the Y stage 19Y align the position of the chuck top 15B with respect to the elastic frame 15A in the X direction and the Y direction, and the Z stage 19Z aligns the position so that the upper surface of the chuck top 15B is located at the height position for shooting. The three points of the upper surface of the chuck top 15B at predetermined positions are not located on a straight line on the upper surface of the chuck top 15B, and are arranged to form a triangle when viewed from above. Hereinafter, they are referred to as the three points on the upper surface of the chuck top 15B.

[0058] In addition, when photographing, the length of the adjustment parts 20A, 20B, and 20C of the adjustment mechanism 20 in the Z direction is set, as an example, to the length that is not adjusted according to the adjustment amount data (the length when the adjustment amount represented by the adjustment amount data is zero). This is to obtain the height of the three points on the upper surface of the chuck top 15B in the state where the adjustment amount is zero. In addition, when the adjustment amount data has been obtained, in the case of the second and subsequent photographing, it can also be set to the length adjusted according to the adjustment amount data obtained at the time of photographing. This is because, when the height of the three points on the upper surface of the chuck top 15B obtained according to the adjustment amount data obtained at the time of photographing is offset, the adjustment amount data for further adjustment can be obtained.

[0059] The height position for imaging may be any position as long as the chuck top 15B is not in contact with the elastic frame 15A and the camera 16 can image the upper surface of the chuck top 15B, and may be determined in advance.

[0060] The camera 16 obtains data indicating the height positions of the three points on the upper surface of the chuck top 15B in the Z direction (hereinafter, height position data) based on data indicating the focal distance when focusing by the autofocus function when the three points on the upper surface of the chuck top 15B are photographed individually (hereinafter, focal distance data), and outputs the data to the control unit 171. The camera 16 that performs such processing is an example of a measuring unit. For example, when the focal distance is subtracted from the height position of the camera 16 relative to a predetermined height reference point determined in the inspection device 10, the height position data of the three points on the upper surface of the chuck top 15B relative to the height reference point can be obtained. In addition, when photographing the three points on the upper surface of the chuck top 15B individually, the camera 16 can be moved to the top of the three points.

[0061] The control unit 171 acquires the height position data of three points on the upper surface of the chuck top 15B at the shooting position for measuring the height position of the chuck top 15B from the camera 16. The control unit 171 transmits the acquired height position data of the three points to the calculation unit 172. In addition, the three points on the upper surface of the chuck top 15B are preferably, as an example, three points directly above the adjustment parts 20A, 20B, and 20C. This is because the change in the length of the adjustment parts 20A, 20B, and 20C in the Z direction is directly reflected in the change in the height position of the three points at the predetermined positions, and the calculation is easy.

[0062] In addition, here, the method in which the camera 16 obtains the height position data of three points on the upper surface of the chuck top 15B and outputs it to the control unit 171 is described, but the control unit 171 may also perform a part of the processing. For example, the camera 16 may output the focus distance data when focusing by the auto focus function when shooting the three points on the upper surface of the chuck top 15B to the control unit 171, and the control unit 171 may obtain the height position data of the three points on the upper surface of the chuck top 15B based on the focus distance data. In this case, the part of the camera 16 and the control unit 171 that performs the processing of obtaining the height position data is an example of a measuring unit.

[0063] The calculation unit 172 calculates adjustment amount data by comparing the height position data of the three points acquired from the control unit 171. The adjustment amount data is data indicating the adjustment amount of the length of the adjustment parts 20A, 20B, and 20C of the adjustment mechanism 20 in the Z direction.

[0064] In addition, the adjustment amount data represents the adjustment amount for adjusting the angle of the chuck top 15B so that the upper surface of the chuck top 15B becomes horizontal and the height positions of the three points are consistent. The angle of the chuck top 15B is represented by the angle of the normal line of the flat upper surface of the chuck top 15B as an example, and adjusting the angle of the chuck top 15B means adjusting the angle of the normal line. When the normal line is facing the vertical direction, the upper surface of the chuck top 15B becomes horizontal. In order to make the upper surface of the chuck top 15B horizontal, the height positions of the three points on the upper surface of the chuck top 15B are consistent (same). Therefore, the adjustment amount data represents the adjustment amount for making the height positions of the three points on the upper surface of the chuck top 15B consistent.

[0065] In order to make the height positions of the three points on the upper surface of the chuck top 15B consistent, the adjustment amount data may be data indicating the adjustment amount for adjusting the lengths of the adjustment parts 20A, 20B, and 20C in the Z direction so that the height positions of any of the three points are consistent. The adjustment amount data is calculated for each of the adjustment parts 20A, 20B, and 20C.

[0066] The calculation unit 172 calculates the adjustment amount data when the chuck top 15B is conveyed, and stores it in the memory 173. In addition, by photographing each chuck top 15B with the camera 16, the height position data of three points can be acquired for each chuck top 15B. Alternatively, the calculation unit 172 calculates the adjustment amount data for each chuck top 15B, and stores the calculated adjustment amount data in the memory 173.

[0067] Each adjustment amount data can be managed in the memory 173 using an identifier assigned to the combination of the tester 15 and the chuck top 15B, for example. The reason why the identifier is assigned to the combination of the tester 15 and the chuck top 15B is that the elastic frame 15A and the chuck top 15B have individual differences, so they are used by determining the combination. Therefore, when the combination of the tester 15 and the chuck top 15B is replaced, the adjustment amount is recalculated and added to the memory 173. In addition, as described above, when there is no need to consider the combination of the tester 15 and the chuck top 15B, the adjustment amount data can be identified by marking the identifier of the chuck top 15B.

[0068] Here, the calculation unit 172 uses the height position data of three points on the upper surface of the chuck top 15B acquired by the camera 16 to calculate the adjustment amount data for making the height positions of the three points consistent. However, the following may be used.

[0069] Alternatively, the camera 16 outputs the focal distance data when shooting three points on the upper surface of the chuck top 15B individually to the control unit 171, and the calculation unit 172 uses the focal distance data obtained from the control unit 171 to calculate the adjustment amount data that makes the focal distances when shooting the three points consistent. In order to make the focal distances when shooting the three points consistent, it is sufficient to calculate the adjustment amount data for adjusting the lengths of the adjustment units 20A, 20B, and 20C in the Z direction so that the focal distances of any of the three points are consistent. The adjustment amount data is calculated for each of the adjustment units 20A, 20B, and 20C. By adjusting the lengths of the adjustment units 20A, 20B, and 20C in the Z direction according to the three adjustment amount data, the height positions of the three points on the upper surface of the chuck top 15B are consistent.

[0070] When the adjustment amount data is calculated as described above, it is not necessary to obtain the height position data of the three points on the upper surface of the chuck top 15B relative to the height reference point based on the focal distance data, so the calculation is completed with a small amount of calculation. Here, the positions of the three locations of the camera 16 when the camera 16 is moved to the three locations directly above the three points in order to capture the three points on the upper surface of the chuck top 15B are examples of measurement reference points.

[0071] The control unit 171 uses the identifier to read the adjustment amount data stored in the memory 173, and adjusts the lengths in the Z direction of the adjustment parts 20A, 20B, and 20C of the adjustment mechanism 20 on which the chuck top 15B corresponding to the identifier is placed. As a result, the adjustment parts 20A, 20B, and 20C adjust their lengths in the Z direction based on the adjustment amount data, and the angle of the chuck top 15B is adjusted so that the upper surface of the chuck top 15B becomes horizontal.

[0072] Here, the adjustment mechanism 20 includes three adjustment parts 20A, 20B, and 20C formed of actuators, and the calculation part 172 calculates three adjustment amount data in order to adjust the lengths of the three adjustment parts 20A, 20B, and 20C in the Z direction.

[0073] However, one of the adjustment parts 20A, 20B, and 20C can be a fixed part whose length in the Z direction is fixed. In this case, the control unit 171 obtains the height position data of three points on the upper surface of the chuck top 15B from the camera 16, and the calculation unit 172 calculates the adjustment amount data for the two adjustment parts other than the fixed parts in the adjustment parts 20A, 20B, and 20C. Then, the lengths of the two adjustment parts other than the fixed parts in the adjustment parts 20A, 20B, and 20C in the Z direction are adjusted so that the upper surface of the chuck top 15B becomes horizontal. As described above, when one of the adjustment parts 20A, 20B, and 20C is a fixed part, the amount of calculation can be reduced, and the height position of the upper surface of the chuck top 15B can be easily managed.

[0074] In addition, when calculating the adjustment amount data based on the focal distance data so that the focal distance when shooting three points is consistent, when one of the adjustment units 20A, 20B, and 20C is a fixed unit, for the two adjustment units other than the fixed units among the adjustment units 20A, 20B, and 20C, the adjustment amount data of the two adjustment units that can make the focal distance of the three points consistent are calculated respectively.

[0075] The memory 173 stores not only programs and data used when the controller 17 d controls the operation of the inspection device 10 , but also adjustment amount data and the like.

[0076] Figure 5 As a prerequisite, the length of the adjustment parts 20A, 20B, and 20C in the Z direction arranged on the positioning device 19 is set to the length when the adjustment amount data is not adjusted (the length when the adjustment amount represented by the adjustment amount data is zero), or according to the length of the adjustment amount data when the adjustment amount data is zero. Figure 5 The adjustment amount data obtained at the time of the processing shown (the adjustment amount data acquired in the previous processing) has been adjusted.

[0077] First, the control unit 171 controls the driving of the positioner 19 according to the command for imaging, and moves the chuck top 15B to an imaging position for measuring the height position of the chuck top 15B (step S1 ).

[0078] The control unit 171 causes the camera 16 to capture images of three points on the upper surface of the chuck top 15B, and acquires height position data from the camera 16 (step S2). The height positions of the three points on the upper surface of the chuck top 15B are acquired by the processing of step S2.

[0079] The calculation unit 172 compares the height positions of the three points acquired by the control unit 171 and calculates three adjustment amount data for making the height positions of the three points coincide with each other (step S3 ). The calculation unit 172 stores the adjustment amount data in the memory 173 .

[0080] Here, when the height position data is acquired in step S2 in a state where the length of the adjustment parts 20A, 20B, 20C in the Z direction is not adjusted according to the adjustment amount data, the length of the adjustment parts 20A, 20B, 20C in the Z direction may be adjusted using the adjustment amount data calculated in step S3 as it is. In addition, when the height position data is acquired in step S2 in a state where the length of the adjustment parts 20A, 20B, 20C in the Z direction is adjusted according to the adjustment amount data calculated in the previous process, the length of the adjustment parts 20A, 20B, 20C in the Z direction may be adjusted using the adjustment amount data obtained by adding the adjustment amount calculated in step S3 to the adjustment amount calculated in the previous process.

[0081] The control unit 171 reads the adjustment amount data stored in the memory 173, and adjusts the lengths in the Z direction of the adjustment parts 20A, 20B, and 20C of the adjustment mechanism 20 on which the chuck top 15B corresponding to the identifier associated with the adjustment amount data is placed (step S4). As a result, the adjustment parts 20A, 20B, and 20C adjust the lengths in the Z direction based on the adjustment amount data, and the angle of the chuck top 15B is adjusted so that the upper surface of the chuck top 15B becomes horizontal.

[0082] As described above, the adjustment amount is calculated for each chuck top 15B, and the length of the adjustment parts 20A, 20B, and 20C in the Z direction is adjusted using the adjustment amount data stored in the memory 173 for each chuck top 15B, thereby making it easy to adjust the angle of the chuck top 15B.

[0083] Therefore, it is possible to provide the inspection device 10 and the method for adjusting the position of the chuck top 15B, which can easily adjust the angle of the chuck top 15B. When the adjustment mechanism 20 is used, the upper surface of the chuck top 15B can be easily adjusted to be horizontal.

[0084] In addition, in the case where the angle of the chuck top 15B is not adjusted by the adjustment mechanism 20 or the inspection device 10 does not include the adjustment mechanism 20, in order to adjust the angle of the chuck top 15B, a shim or a spacer is inserted, for example, on the lower surface side of the chuck top 15B, between the positioner 19 and the chuck top 15B, etc. However, the angle adjustment using a shim or a spacer is very time-consuming and labor-intensive, and adjustment is required every time the angle of the chuck top 15B is offset. In addition, there are multiple chuck tops 15B, and when the adjustment amount of the angle of each chuck top 15B is different, it is necessary to use a shim or a spacer to adjust each chuck top 15B.

[0085] In this regard, the inspection apparatus 10 of the embodiment calculates the adjustment amount according to the individual difference or deformation of each chuck top 15B, or the positional deviation between the X stage 19X, the Y stage 19Y, and the Z stage 19Z, and can adjust the surface of the chuck top 15B to be horizontal by the adjustment mechanism 20 using the adjustment amount data stored in the memory 173. Therefore, the angle adjustment for making the upper surface of the chuck top 15B horizontal can be performed very easily.

[0086] Furthermore, when the adjustment mechanism 20 is used, the angle adjustment can be performed in a short time, so that the inspection device 10 capable of performing inspection with high productivity can be provided.

[0087] In addition, the adjustment mechanism 20 is fixed on the Z stage 19Z of the positioner 19, so it is easy to correct the tilt caused by the aging of the positioner 19 or the tilt caused by individual differences in the chuck top 15B, and can easily adjust the angle so that the upper surface of the chuck top 15B becomes horizontal.

[0088] In addition, the aligners 19 are provided one by one at each layer in the vertical direction of the inspection area 12 in the inspection device 10, and the adjustment mechanism 20 is provided on each layer of the aligners 19. Therefore, the adjustment mechanism 20 can move together with the aligners 19, and the upper surfaces of the plurality of chuck tops 15B can be adjusted to be horizontal in each layer by one adjustment mechanism 20.

[0089] The frequency of calculating the adjustment amount data to adjust the angle of the chuck top 15B may be appropriately determined according to the use status of the inspection apparatus 10 , the accuracy of obtaining the angle of the chuck top 15B, and the like.

[0090] In the above description, the adjustment mechanism 20 has three adjustment parts 20A, 20B, and 20C to support the chuck top 15B at three points, but the number of adjustment parts may be four or more.

[0091] The above describes the embodiments of the inspection device and the method for adjusting the position of the top of the chuck of the present invention, but the present invention is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions and combinations can be made within the scope of the claims. These also belong to the technical scope of the present invention.

Claims

1. An inspection device, characterized in that: include: A plurality of inspection sections for respectively inspecting the electronic devices as inspection objects on the tops of the plurality of chucks; a measuring unit configured to measure height positions of a plurality of points on the surface of each of the plurality of chuck tops respectively arranged corresponding to the plurality of inspection units, or distances in a height direction from a measurement reference point to the plurality of points; a calculation unit that calculates the adjustment amount in the height direction of the plurality of points on the top of each chuck based on the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points; A memory for storing the calculated adjustment amount of each chuck top; and an adjustment mechanism, which adjusts the angle of the top of each chuck based on the adjustment amount, The adjustment mechanism includes a plurality of adjustment parts, each of which is an actuator that can be extended and retracted in a Z direction, which is a height direction. The adjustment amount is an amount by which the length of the adjustment portion in the Z direction is adjusted so that the height positions of the plurality of points are the same, and the adjustment amount is calculated for each of the plurality of adjustment portions. The adjustment amount is an adjustment amount for adjusting the angle so that the surface of the top of the chuck becomes horizontal. Based on the adjustment amount of each chuck top stored in the memory, the length of the adjustment portion in the Z direction is adjusted to adjust the angle of each chuck top.

2. The inspection device according to claim 1, characterized in that: The adjustment amount is an adjustment amount for making the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points uniform for each chuck top portion.

3. The inspection device according to claim 1 or 2, characterized in that: It also includes a position alignment mechanism for aligning the top of each chuck of each inspection part. The adjustment mechanism is arranged on the position alignment mechanism. Each chuck top is held by the positioning mechanism via the adjustment mechanism that adjusts the height positions of the plurality of points according to the adjustment amount, and the positioning is performed.

4. The inspection device according to claim 3, characterized in that: The adjustment mechanism and the positioning mechanism are provided one by one for each of the plurality of inspection sections, and are movable to the positions of the plurality of inspection sections.

5. A method for adjusting the position of a chuck top, characterized in that: The method for adjusting the position of the top of the chuck is a method for adjusting the position of the top of the chuck in the inspection device. The inspection device has a plurality of inspection sections, which inspect the electronic devices as the inspected objects on the top of the plurality of chucks respectively. The method for adjusting the position of the top of the chuck comprises: A step of measuring the height positions of a plurality of points on the surface of each of the plurality of chuck tops respectively arranged corresponding to the plurality of inspection parts, or the distances in the height direction from a measurement reference point to the plurality of points; A step of calculating the height adjustment amount of the plurality of points on each chuck top based on the height positions of the plurality of points or the height distances from the measurement reference point to the plurality of points; The step of saving the calculated adjustment amount of each chuck top; and Based on the adjustment amount, the step of adjusting the angle of the top of each chuck using an adjustment mechanism including a plurality of adjustment parts, wherein the adjustment part is an actuator that can be extended and retracted in a Z direction as a height direction, The adjustment amount is an amount by which the length of the adjustment portion in the Z direction is adjusted so that the height positions of the plurality of points are the same, and the adjustment amount is calculated for each of the plurality of adjustment portions. The adjustment amount is an adjustment amount for adjusting the angle so that the surface of the top of the chuck becomes horizontal. Based on the adjustment amount of each chuck top stored in the memory, the lengths of the plurality of adjustment portions in the Z direction are adjusted to adjust the angle of each chuck top.

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