Thermal test head for integrated circuit devices

Abstract

A thermal test head for integrated circuit devices includes a heat exchanger assembly, a contact assembly configured to contact an integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Description

Technical Field

[0001] This invention generally relates to a thermal test head for maintaining the temperature of an integrated circuit (IC) device under test (DUT). Background Technology

[0002] Typically, IC devices are tested at specified temperatures (e.g., functional testing) before being shipped to customers. For example, microprocessor devices are often subjected to classification testing to determine their effective operating speed. During such testing, the device under test (often called the DUT) is held at a fixed (or specified) temperature while the device is being tested. To maintain the DUT at the specified temperature during testing, a thermal test head (sometimes called a thermal control unit) is typically used. The thermal test head is configured to heat or cool the DUT to the specified temperature during testing and hold the device at that temperature. Such thermal test heads often use thermoelectric heat pumps in the form of Peltier devices to heat or cool the DUT to the desired temperature. A Peltier device is a solid-state heat pump that transfers heat from one side of the device to the other according to the direction of the current flowing through it. Generally, maintaining good thermal contact between the Peltier device and other components of the thermal test head is helpful for effectively transferring heat from or to the DUT. In some applications, a greater force is used to press the components of the thermal test head onto the DUT to reduce interfacial thermal resistance and achieve good thermal contact between the components. However, repeatedly applying large forces with a thermal test probe may reduce its thermal conductivity. This disclosure aims to overcome at least some of the problems described above. However, the scope of this disclosure is not defined by its ability to solve any particular problem. Summary of the Invention

[0003] In one aspect, this invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The test head may include: a heat exchanger assembly; a chip contact member configured to contact the chip; and a thermal control assembly disposed between the heat exchanger assembly and the chip contact member. The thermal control assembly may include a Peltier device in thermal contact with the opposing surfaces of the heat exchanger assembly and the chip contact member, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the chip contact member.

[0004] On the other hand, the present invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The test head may include: a heat exchanger assembly configured to circulate fluid therethrough; a chip contact member including a contact surface; and a thermal control assembly disposed between the heat exchanger assembly and the chip contact member. The contact surface of the chip contact member may be configured to contact the chip. The thermal control assembly may include a Peltier device in thermal contact with the opposing surfaces of the heat exchanger assembly and the chip contact member, and one or more spacers disposed at least partially surrounding the Peltier device. The one or more spacers may be in physical contact with the opposing surfaces of the heat exchanger assembly and the chip contact member. The test head may also include a tilt adjustment device coupled to the heat exchanger assembly and disposed opposite to the thermal control assembly. The tilt adjustment device may be configured to change the angular alignment of the contact surface of the chip contact member when the contact surface contacts the chip.

[0005] On the other hand, the present invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The thermal test head may include: a heat exchanger assembly configured to circulate fluid therethrough; and a thermally conductive chip contact member including a contact surface. The contact surface may be configured to contact the chip. The test head may include a thermal control assembly disposed between a first surface of the chip contact member and a second surface of the heat exchanger assembly. The thermal control assembly may include: a Peltier device; a first thermal interface material disposed between and physically in contact with the first surface of the Peltier device and the chip contact member; a second thermal interface material disposed between and physically in contact with the second surface of the Peltier device and the heat exchanger assembly; and one or more spacers disposed at least partially around the Peltier device and physically in contact with the first surface of the chip contact member and the second surface of the heat exchanger assembly. The height of the one or more spacers is substantially equal to the sum of the height of the Peltier device, the height of the first thermal interface material, and the height of the second thermal interface material.

[0006] On the other hand, the present invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The thermal test head may include a heat exchanger assembly; and a tilt adjustment device disposed above the heat exchanger assembly. The tilt adjustment device may be configured to move closer to or further away from a contact assembly. The contact assembly may be disposed below the heat exchanger assembly and may include: a chip contact member configured to contact the chip and apply pressure to the chip; and a substrate contact member configured to contact the substrate and apply pressure to the substrate. A thermal control assembly may be disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly may include: a Peltier device that is in thermal contact with the opposing surfaces of the heat exchanger assembly and the chip contact member; and a spacer that is in physical contact with the opposing surfaces of the heat exchanger assembly and the chip contact member.

[0007] On the other hand, the present invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The thermal test head may include: a heat exchanger assembly configured to circulate fluid therethrough; and a contact assembly disposed below the heat exchanger assembly. The contact assembly may include: a chip contact member configured to contact the chip; and a substrate contact member constituting a contact with the substrate. A thermal control assembly may be disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly may include: a Peltier device thermally contacting the opposing surfaces of the heat exchanger assembly and the chip contact member; and one or more spacers disposed at least partially surrounding the Peltier device. The one or more spacers may physically contact the opposing surfaces of the heat exchanger assembly and the chip contact member. A tilt adjustment device may be disposed above the heat exchanger assembly. The tilt adjustment device may be configured such that an initial movement of the tilt adjustment device toward the integrated circuit device causes the chip contact member to contact the chip, and a further movement of the tilt adjustment device toward the integrated circuit device causes the substrate contact member to contact the substrate.

[0008] On the other hand, the present invention discloses a thermal test head for an integrated circuit device. The integrated circuit device includes a chip mounted on a substrate. The thermal test head may include a heat exchanger assembly configured to circulate fluid therethrough; and a contact assembly disposed below the heat exchanger assembly. The contact assembly may include: a chip contact member configured to contact the chip; and a substrate contact member constituting a contact substrate. A thermal control assembly may be disposed between a first surface of the chip contact member and a second surface of the heat exchanger assembly. The thermal control assembly may include: a Peltier device; a first thermal interface material disposed between and physically in contact with the first surface of the Peltier device and the chip contact member; a second thermal interface material disposed between and physically in contact with the second surface of the Peltier device and the heat exchanger assembly; and one or more spacers disposed at least partially surrounding the Peltier device. The one or more spacers may physically contact the first surface of the chip contact member and the second surface of the heat exchanger assembly. The height of the one or more spacers is substantially equal to the sum of the height of the Peltier device, the height of the first thermal interface material, and the height of the second thermal interface material. The tilt adjustment device may be disposed above the heat exchanger assembly. The tilt adjustment device may include: an alignment plate disposed above the heat exchanger assembly; a locking plate disposed above the alignment plate; one or more first springs disposed between the locking plate and the alignment plate and configured to bias the locking plate away from the alignment plate; and one or more second springs disposed between the alignment plate and the heat exchanger assembly and configured to bias the alignment plate away from the heat exchanger assembly. Attached Figure Description

[0009] Exemplary embodiments of the invention will be described with reference to the accompanying drawings. For simplicity and clarity, the drawings depict the general structure and / or configuration of various embodiments. Features in the drawings are not necessarily drawn to scale. The dimensions of some features may be exaggerated relative to others to aid in understanding the illustrated embodiments. Features of components well-known in the art have not been described to avoid obscuring the broad teachings of the invention.

[0010] Figure 1 This is a schematic cross-sectional view of an exemplary thermal test head of this disclosure;

[0011] Figure 2 yes Figure 1 A perspective view of an exemplary heat exchanger assembly of a medium-temperature test head;

[0012] Figure 3 yes Figure 1 A partial exploded view of the thermal test head;

[0013] Figure 4 yes Figure 1 Another exploded view of the intermediate heat test head;

[0014] Figure 5A yes Figure 1 Exploded view of the heat testing head from below;

[0015] Figure 5B yes Figure 1 Exploded top view of the thermal test head;

[0016] Figure 6A and 6B Is using Figure 1 A schematic diagram of the thermal test head testing the DUT;

[0017] Figure 7 This is a cross-sectional schematic diagram of another exemplary thermal test head of this disclosure;

[0018] Figure 8A yes Figure 7 Exploded view of the thermal test head;

[0019] Figure 8B yes Figure 7 Assembly diagram of the thermal test head;

[0020] Figure 9 yes Figure 7 Exploded view of the thermal control components of the thermal test head;

[0021] Figure 10 yes Figure 7 Exploded view of the fluid block assembly of the intermediate heat test head;

[0022] Figure 11 yes Figure 7 Exploded view of the alignment mechanism of the thermal test head;

[0023] Figure 12 yes Figure 7 Exploded view of the contact components of the thermal test head; and

[0024] Figures 13A to 13C Is using Figure 7 A schematic diagram of a thermal test head testing a DUT. Detailed Implementation

[0025] The following detailed description is illustrative in nature and is not intended to limit the described embodiments. The exemplary embodiments described herein are not necessarily to be construed as preferred or superior to other embodiments. Descriptions and details of known features and techniques have been omitted to avoid obscuring other features. Enumerical terms such as “top,” “bottom,” and “side” are used to distinguish elements and are not necessarily used to describe any spatial order. These terms, as used so, may be interchanged where appropriate. For example, a surface described as the top surface of a component may be the bottom surface, etc., in some orientations of that component. For brevity, conventional techniques, structures, and principles known to those skilled in the art may not be described herein, including, for example, standard test methods and principles for IC devices. In the following description, the description of specific embodiments is intended to provide an understanding of this disclosure. It should be noted that this disclosure may be practiced without all the described features or aspects. Furthermore, the described embodiments may be incorporated into other devices and / or systems.

[0026] Figure 1 This is a schematic diagram of an exemplary thermal test head (also referred to herein as a test head) 300 of the present disclosure. The test head 300 includes a DUT contact assembly 20 coupled to a fluid block assembly 100, with a thermal control assembly 50 located between the two. When the test head 300 is used, the chip contact member 24 of the contact assembly 20 is brought into thermal contact with the surface of the DUT 10 to transfer heat between the DUT 10 and the contact assembly 20. As those skilled in the art will appreciate, the DUT 10 may include an integrated circuit chip 12 attached to a substrate 14. In some embodiments, the substrate 14 may be mounted on a support during testing (e.g., see...). Figure 13A ), support electrical connection test equipment. In some embodiments, such as Figure 1 As shown, the chip contact member 24 of the contact assembly 20 includes a base 26, which is positioned to contact (e.g., press against) the top surface of the chip 12 to ensure good thermal conductivity between the base 26 and the chip 12. For example, as Figure 1 As shown, the bottom surface 25A of the base 26 is configured to contact the top surface of the chip 12. In some embodiments, a suitable thermal interface material (such as thermal paste, thermal foil, etc.) may be placed between the mating surfaces of the base 26 and the chip 12 to reduce interfacial thermal resistance and improve heat transfer between the mating surfaces. As those skilled in the art know, in some applications, some thermal interface materials can be extruded between the mating surfaces, thereby allowing some areas of the mating surfaces to be in direct contact. That is, in some cases, the bottom surface 25A (or a portion thereof) of the base 26 may not necessarily be in direct physical contact with the chip surface. Instead, these surfaces (or portions thereof) may be in thermal contact through a thermal interface material. The chip contact member 24 may include one or more temperature sensors 22 to monitor the temperature of the DUT 10 during testing. Although in Figure 1Two temperature sensors 22 are shown, but in general, the contact assembly 20 may include any number of temperature sensors 22, and these sensors may be arranged anywhere on the contact assembly 20 (e.g., in the chip contact member 24 or in other components). In some embodiments, the temperature sensors 22 may be adapted to measure temperatures, for example, between -70°C and 500°C. Although not shown in Figure 1 As shown, however, wiring extending through the chip contact member 24 can connect the temperature sensor 22 to a test device. In some embodiments, to accurately measure the temperature of the chip 12, the temperature sensor 22 can be positioned at or near the bottom surface 25A of the base 26.

[0027] In some embodiments, the base 26 may be an integral part of the chip contact member 24. For example, the base 26 may be a block-shaped protrusion extending from the bottom surface of the chip contact member 24. In some embodiments, the base 26 may be a separate component attached to the bottom surface of the chip contact member 24. The chip contact member 24 and the base 26 may be made of any thermally conductive material. In some embodiments, the base 26 and the chip contact member 24 may be made of one or more of copper, silver, gold, zinc, aluminum nitride, silicon carbide, aluminum, etc., or include one or more of copper, silver, gold, zinc, aluminum nitride, silicon carbide, aluminum, etc. In some embodiments, the base 26 and the chip contact member 24 may be made of copper.

[0028] Continue to refer to Figure 1 A thermal control assembly 50 located between the contact assembly 20 and the fluid block assembly 100 may include a thermoelectric cooler / heater that helps maintain the temperature of the DUT 10 at a desired temperature. The thermal control assembly 50 may include a Peltier device 52 in thermal contact with the chip contact member 24 of the contact assembly 20 and the fluid block assembly 100. As is known to those skilled in the art, when a direct current flows through the Peltier device 52, heat is transferred from one side (e.g., a first side) to another side (e.g., a second side), causing the first side to cool and the second side to heat. In some embodiments, such as Figure 1As shown, a Peltier device 52 is positioned (e.g., sandwiched) between the top surface 25B of the chip contact member 24 and the bottom surface 75A of the fluid block assembly 100. The Peltier device 52 controls the magnitude and direction of heat flow between the chip contact member 24 and the fluid block assembly 100 based on the desired temperature of the DUT 10 (e.g., the specified temperature of the test) and the actual temperature of the DUT 10, for example, as measured by the temperature sensor 22. When the desired DUT temperature is lower than its actual temperature, the direction of the current flowing through the Peltier device 52 is controlled to transfer heat from the top surface 25B of the chip contact member 24 to the bottom surface 75A of the fluid block assembly 100 (i.e., heat removal from the DUT 10). Similarly, when the desired DUT temperature is higher than its actual temperature, the direction of the current in the Peltier device 52 is reversed to transfer heat from the fluid block assembly 100 to the chip contact member 24.

[0029] To improve the thermal coupling between the thermal control component 50, the chip contact member 24, and the fluid block assembly 100, a thermal interface material (TIM) (TIM 32) can be placed between the mating surfaces of these components. For example, as... Figure 1 As shown, the first TIM 32A can be positioned between the mating surfaces of the Peltier device 52 and the chip contact member 24. And the second TIM 32B can be positioned between the mating surfaces of the Peltier device 32 and the fluid block assembly 100. TIM 32A can be the same material as TIM 32B or a different material. TIM 32A and TIM 32B can be soft, pad-like materials that, for example, can fill unevenness on the mating surfaces of the components and improve heat transfer between these surfaces. Any thermal interface material now known or developed hereafter can be used as TIM 32A and TIM 32B. In some embodiments, one or more of thermal paste, thermal foil, thermal adhesive, thermal gap filler, thermal tape, phase change material, thermal pad, etc., can be used as TIM 32A and TIM 32B. For simplicity, in the following discussion, the first TIM 32A and the second TIM 32B will be simply referred to as TIM 32.

[0030] In addition to the Peltier device 52, the thermal control assembly 50 may also include a spacer 30 located between the top surface 25B of the chip contact member 24 and the bottom surface 75A of the fluid block assembly 100. In some embodiments, the spacer 30 may be an annular member with a central opening. For example, as... Figure 5A and 5BAs best shown, in some embodiments, the spacer 30 may be formed as a square or rectangular ring with a square or rectangular central opening. Furthermore, the Peltier device 52 may be positioned in the central opening of the spacer 30, and its electrical leads extend through a channel in the body of the spacer 30 (e.g., see...). Figure 4 In some embodiments, such as Figure 4 As shown, the dimensions of the central opening (e.g., length and width) can be substantially equal to the dimensions of the Peltier device 52, such that the Peltier device 52 is tightly fitted into the central opening of the spacer 30. However, this is not necessary. And, as... Figure 1 As shown, in some embodiments, the size of the central opening of the spacer 30 may be larger than the size of the Peltier device 52.

[0031] Typically, the height of the spacer 30 controls the vertical spacing (gap G) between the top surface 25B of the chip contact member 24 and the bottom surface 75A of the fluid block assembly 100. That is, the top surface of the spacer 30 can physically contact the bottom surface 75A of the fluid block assembly 100, and the bottom surface of the spacer 30 can physically contact the top surface 25B of the chip contact member 24. In some embodiments, before assembling the test head 300, the TIMs 32 located on both sides of the Peltier device 52 can have a height of, for example, 3 mils (1 mil = 0.0254 mm). During assembly, the fluid block assembly 100 and the contact assembly 20 can be pressed together to compress each TIM 32 (i.e., TIM 32A and TIM 32B) to a height of, for example, 1.5 mils, and to bring the spacer 30 into physical contact with the fluid block assembly 100 and the chip contact member 24. That is, after the test head 300 is assembled, the spacer 30 is in physical contact with the bottom surface 75A of the fluid block assembly 100 and the top surface 25B of the chip contact member 24. In this configuration, the Peltier device 52 is in thermal contact with these surfaces via the TIM 32. The vertical gap G between the bottom surface 75A of the fluid block assembly 100 and the top surface 25B of the chip contact member 24 can be the height of the spacer 30 (which can be substantially equal to the height of the Peltier device 52 plus the height of the TIM 32 on both sides of the Peltier device 52). Although the TIM 32 of the assembled test head is described as compressed (or controlled compressed), in some embodiments, these TIM 32 may also be uncompressed.

[0032] Typically, the spacer 30 can be made of a relatively rigid material, such that when the test head 300 applies a force F (see...) Figure 1When applied to the DUT 10, the force is transferred from the fluid block assembly 100 to the chip contact member 24 via the spacer 30. That is, when a force is applied to the DUT 10 using the test head 300, the spacer 30 transfers virtually all the force from the fluid block assembly 100 to the chip contact member 24 and reduces the impact of the force on the TIM 32. In some embodiments, the spacer 30 may be made of a material with relatively low thermal conductivity, such that the Peltier device 52 transfers virtually all the heat between the chip contact member 24 and the fluid block assembly 100. Typically, the spacer 30 can be made of any material having the aforementioned properties (e.g., low thermal conductivity and high rigidity). In some embodiments, the spacer 30 may include materials such as plastics, ceramics, etc. Although not mandatory, in some embodiments, the spacer 30 may be made of engineering plastics (e.g.,... It is composed of semiconductor-grade plastic.

[0033] It should be noted that the annular shape of the spacer 30 (e.g., as shown in the image) Figure 5A and Figure 5B The spacer 30 (as shown) is not required. Typically, the spacer 30 can have any suitable shape to control vertical spacing and transmit force between the fluid block assembly 100 and the chip contact member 24. In some embodiments, the spacer 30 may not be a single component. Instead, the spacer 30 may include multiple components arranged at least partially around the Peltier device 52, which together serve as a support between the chip contact member 24 and the fluid block assembly 100. In some embodiments, the spacer 30 may not extend completely around the Peltier device 52. Instead, the spacer 30 may extend only around two or three sides of the Peltier device 52 (e.g., opposite sides, adjacent sides, etc.). That is, in some embodiments, the spacer 30 may have an L-shaped or U-shaped (or C-shaped) configuration. In some embodiments, multiple spacer elements may be arranged on different sides of the Peltier device 52 to collectively define different configurations (e.g., elongated elements parallel to each other, etc.).

[0034] The fluid block assembly 100 is a fluid circulation assembly that removes or supplies heat to the test head 300. When cooling of the DUT 10 is required, the fluid block assembly 100 removes heat transferred from the top surface 25B of the chip contact member 24 to the bottom surface 75A of the fluid block assembly 100 by the Peltier device 52. Similarly, when increasing the temperature of the DUT 10 is required, the fluid block assembly 100 supplies heat transferred from the Peltier device 52 to the chip contact member 24. The fluid block assembly 100 can be any type of device suitable for its purpose. In some embodiments, the fluid block assembly 100 may include a microfin heat exchanger. Figure 1 As best shown, in some embodiments, the fluid block assembly 100 includes a microfinned cold plate 70 and a manifold 90. For example... Figure 3 and Figure 4 As best shown, the cold plate 70 may comprise a solid body having a bottom surface 75A and a top surface 75B. As previously described, the bottom surface 75A of the cold plate 70 is in thermal contact (via TIM 32) with the Peltier device 52 and in physical contact with the top surface of the spacer 30. The top surface 75B of the cold plate 70 includes a plurality of microfins 72 (see...). Figure 3 The microfins 72 increase the rate of heat transfer from the top surface 75B by increasing their surface area. In some embodiments, the microfins 72 may include a plurality of plate-like or needle-like protrusions projecting from the top surface 75B. Figure 1 As best shown, manifold 90 may be a housing defining a hollow cavity 92 therein. Manifold 90 is positioned (or mounted) on cold plate 70 such that microfins 72 are positioned within (or surrounded by) cavity 92. Manifold 90 includes a fluid inlet 82 that directs fluid into cavity 92 and a fluid outlet 84 that directs fluid out of cavity 92. Although not mandatory, in some embodiments, fluid inlet 82 and fluid outlet 84 are formed on the same side of manifold 90 (see [link to documentation]). Figure 2 , 3 5A and 5B). In some embodiments (e.g., when manifold 90 is made of a relatively soft material such as plastic), fluid inlet 82 and fluid outlet 84 may be pipe adapters that are fastened (e.g., using screws) to port nuts 85 connected to manifold 90 (see 5A and 5B). Figure 5B ).

[0035] Although not visible in the figure, fluid inlet 82 and fluid outlet 84 are fluidly connected to the cavity 92 of manifold 90 via a vertically extending channel extending through manifold 90. During use, fluid entering manifold 90 through fluid inlet 82 enters the cavity 92 above microfins 72. As the fluid flows through microfins 72, heat transfer occurs between microfins 72 and the fluid. The fluid then exits manifold 90 through fluid outlet 84. Typically, any liquid or gaseous fluid can be circulated through manifold 90. In some embodiments, a liquid (e.g., water, a mixture of water and alcohol, etc.) may be used as the fluid. When Peltier device 52 is operated to remove heat from (or cool) DUT 10, the fluid in cavity 92 removes heat from microfinned cold plate 70. In this case, the temperature of the fluid leaving manifold 90 (via fluid outlet 84) may be higher than the temperature of the fluid entering manifold 90 (via fluid inlet 82). Conversely, when the Peltier device 52 is operated to heat the DUT 10, the fluid temperature entering the manifold 90 can be higher than the fluid temperature leaving the manifold 90.

[0036] Typically, components of the fluid block assembly 100 can be made of any suitable material. In some embodiments, the cold plate 70 can be made of a thermally conductive material (e.g., copper, aluminum, etc.), and the manifold 90 can be made of a plastic material (e.g., polyetheretherketone, or "PEEK"). In some embodiments, the cold plate 70 can be made of a thermally conductive material, while the manifold 90 can be made of a plastic material (e.g., PEEK).

[0037] To ensure effective heating and cooling of the DUT 10 by the test head 300 during testing, good thermal coupling needs to be maintained between the test head 300 and the DUT 10. (Reference) Figure 1 To increase thermal coupling between the base 26 of the chip contact member 24 and the chip 12 of the DUT 10 during testing, pressure F is applied to the test head 300 to press the bottom surface 25A of the base 26 against the surface of the chip 12. Due to part-to-part variability (and / or non-uniformity of the DUT 10 support structure), the angular alignment of the chip surfaces of different DUTs 10 (which will be tested using the test head 300) relative to the common horizontal plane H may differ (see [link to relevant documentation]). Figure 6A To achieve optimal thermal coupling between the bottom surface 25A of the base 26 and the top surface of the chip 12, these two surfaces are preferably parallel (or aligned) when in contact. To ensure that these two surfaces are aligned (or become parallel) upon engagement, the test head 300 includes a tilt adjustment device (hereinafter referred to as alignment mechanism 150) that rotates or swivels the test head 300 such that the bottom surface 25A of the base 26 is parallel to the surface of the chip 12 when it contacts the surface of the chip 12. That is, the alignment mechanism 150 is configured to change the tilt of the bottom surface 25A of the base 26 to match the tilt of the chip surface when the bottom surface 25A of the base 26 contacts the chip surface. See also Figure 6A and Figure 6BIn some embodiments, the alignment mechanism 150 includes an alignment plate 110 connected to a locking plate 130 via a plurality of springs 120 located between two plates 110, 130. The alignment plate 110 is connected to the top surface 95B of the manifold 90 of the test head 300. The locking plate 130 is connected to the cylinder head 200. The cylinder head 200 is configured to position the test head 300 above the DUT 10, lower the test head 300 so that its base 26 contacts the chip 12 of the DUT 10, and apply pressure F to the DUT 10 during testing. The contact assembly 20 may include one or more locating pins 160 that engage corresponding features (e.g., locating holes) on the DUT 10 (or on a support for mounting the DUT 10) to align the base 26 with the chip 12. After the test is completed, the cylinder head 200 lifts the test head 300 away from the DUT 10 and places it on top of another DUT 10 for testing.

[0038] In some embodiments, such as Figure 1 The best shown (see also) Figure 6A and Figure 6B The bottom surface 110A of the alignment plate 110 is in direct contact with the top surface 95B of the manifold 90. Furthermore, the top surface 110B of the alignment plate 110 includes a centrally located convex protrusion 112 facing the bottom surface 130A of the locking plate 130. See also... Figure 6A and Figure 6B Multiple springs 120 of the alignment mechanism 150 are positioned around the convex protrusion 112 to offset the alignment plate 110 and the locking plate 130 away from each other. That is, when the test head 300 is not in use, the springs 120 maintain physical separation between the top surface 110B of the alignment plate 110 and the bottom surface 130A of the locking plate 130 (see [link to relevant documentation]). Figure 6B When the cylinder head 200 pushes the test head 300 against the surface of the chip 12, the spring 120 compresses until a portion of the bottom surface 130A of the locking plate 130 contacts (or falls to its lowest point) the protrusion 112 on the top surface 110B of the alignment plate 110 (see...). Figure 1 and Figure 6A See also Figure 6AIf the surface of chip 12 is not parallel to the bottom surface 25A of base 26 when it engages with base 26, then multiple springs 120 (located between locking plate 130 and alignment plate 110) are compressed to varying degrees to rotate test head 300 so that bottom surface 25A is parallel to chip surface. Thus, alignment mechanism 150 ensures parallel engagement of mating surfaces of test head 300 and DUT 10. It should be noted that although a specific type of tilt adjustment device (or alignment mechanism 150) has been described, any mechanism configured to change the tilt of test head 300 so that the tilt of contact surface 25A matches the tilt of chip surface when both are in contact can be used. For example, in some embodiments of the test head, one or more ball joints, etc., can be used as tilt adjustment devices.

[0039] Typically, the components of the test head 300 can be connected together in any manner. In some embodiments, such as Figure 2 As best shown, a threaded bushing 170 can be positioned within a through-hole cavity 192 of the manifold 90. These bushings 170 can extend through the aligned cavities on the cold plate 70 and the manifold 90. A bushing head 173 having a larger cross-sectional area than the cavity on the cold plate 70 can engage with the bottom surface of the cold plate 70 and confine the bushing 170 within the cavity 192 (e.g., see...). Figure 2 and Figure 3 A set of screws 174, extending through aligned cavities in the chip contact member 24 and spacer 30, engages with the internal threads at the bottom end of bushing 170 to attach the chip contact member 24 and spacer 30 to the bottom of cold plate 70 (see [link]). Figure 5A and 5B Furthermore, a shoulder screw 172 extending through a cavity on the alignment plate 110 engages with the internal thread at the tip of the bushing 170 to attach the alignment plate 110 to the top of the manifold 90. It should be noted that the described attachment mechanism is merely exemplary, and the components of the test head 300 can be joined together in any suitable manner.

[0040] like Figure 6A and Figure 6B As schematically illustrated, during testing, the cylinder head 200 lowers the test head 300 so that the bottom surface 25A of the base 26 of the chip contact member 24 contacts the surface of the chip 12 under test. Upon surface contact, the cylinder head 200 applies pressure F to the test head 300 to enhance the thermal coupling between the chip contact member 24 and the chip 12. After testing, the cylinder head 200 lifts the test head 300 off the surface of the DUT and places it over another DUT requiring testing. Figure 6A and Figure 6B As shown, the contact assembly 20 includes a locating pin 160 (see...). Figures 5A to 6B), which corresponds to the features on the DUT (e.g., the groove in the support that supports DUT10, see Figure 13A Engage to align the test head 300 with the DUT 10. (As shown) Figure 6A As best illustrated, when the chip contact member 24 contacts the DUT 10, which is inclined relative to the horizontal plane H, the alignment mechanism 150 allows the test head 300 to rotate so that the contact surface of the chip contact member 24 is parallel to the DUT surface. When the test head 300 applies pressure F to the inclined DUT 10, a plurality of springs 120 connecting the locking plate 130 to the alignment plate 110 allow the two plates to remain non-parallel. After testing, when the cylinder head 200 lifts the test head 300 away from the DUT surface, the springs 120 restore the parallel alignment between the locking plate 130 and the alignment plate 110.

[0041] See Figure 1 When the cylinder head 200 applies pressure F to the test head 300, any pressure generated on the TIM 32 (located at the interface between the fluid block assembly 100 and the Peltier device 52, and at the interface between the Peltier device 52 and the chip contact member 24) improves the thermal coupling between the components of the test head 300. Simultaneously, the support provided by the spacer 30 between the chip contact member 24 and the fluid block assembly 100 allows forces to be transferred between these components without applying excessive pressure to the TIM 32. Without the spacer 30, repeatedly applying large pressure to the TIM 32 could sometimes cause material of the TIM 32 to be extruded from the interface, creating voids (when the pressure is removed). These voids can increase the thermal resistance of the test head 300. Therefore, the additional load path provided by the spacer 30 prevents an increase in the thermal resistance of the test head 300 during repeated use.

[0042] In the embodiment of the test head 300 described above (for example, see...), Figure 1The pressure F applied by the cylinder head 200 to the test head 300 is applied to the surface of the chip 12 (of the DUT) via the chip contact member 24 of the contact assembly 20. In some embodiments, the contact assembly 20 may also include a component that applies additional pressure to another portion of the DUT 10 (e.g., the substrate 14) during testing. As appreciated by those skilled in the art, the chip 12 and the substrate 14 (of the DUT 10) have different coefficients of thermal expansion (CTE), and therefore their expansion and contraction differ with temperature changes. Since the chip 12 and the substrate 14 (e.g., using solder material) are attached together, the difference in thermal expansion between them may cause the DUT 10 to deform upon heating or cooling. Deformation of the DUT 10 causes bending of the surfaces of the chip and the substrate. Therefore, the surfaces of the chip and the substrate may bend during testing. Applying pressure to the substrate during testing can help test a deformed DUT.

[0043] Figure 7 This is a schematic diagram of an embodiment of the test head 1300, which applies pressure to the substrate 14 of the DUT 10 in addition to the pressure on the chip 12. Figure 8A An exploded view of the test head 1300 is shown. Figure 8B An assembly drawing of the test head 1300 is shown. The following discussion will refer to... Figures 7 to 8B Just like Figure 1 Test head 300, Figure 7 The test head 1300 includes a DUT contact assembly 20 coupled to the fluid block assembly 100, with a thermal control assembly 50 located between them. The test head 1300 is coupled to the cylinder head 200 via an alignment mechanism 150 configured to rotate the test head 1300 to align the DUT 10 at an angle. Components of the test head 1300, similar to their counterparts in the test head 300, are numbered in a similar manner. The descriptions made for these components of the test head 300 also apply to the test head 1300, and vice versa.

[0044] The thermal control assembly 50 of the test head 1300 includes a Peltier device 52, a TIM 32 located on the opposite side of the Peltier device 52, and a spacer 30 disposed at least partially around the Peltier device 52. Figure 9 An exploded view of the thermal control assembly 50 in an exemplary embodiment is shown. The Peltier device 52 is in thermal contact with the contact assembly 20 and the fluid block assembly 100 via TIM 32 located on both sides of the Peltier device 52. A spacer 30, which is in physical contact with the top surface of the chip contact member 24 of the contact assembly 20 and the bottom surface of the fluid block assembly 100, controls the vertical spacing between the fluid block assembly 100 and the contact assembly 20. As... Figure 1When pressure is applied to the test head 300, the spacer 30 transmits force from the fluid block assembly 100 to the chip contact member 24. The bottom surface 25A of the base 26 (of the chip contact member 24) that contacts the chip of the DUT 10 applies pressure to the chip. As explained with respect to the test head 300, the effect of the force on the TIM 32 is reduced because the spacer 30 transmits force from the fluid block assembly 100 to the chip contact member 24. As previously explained, the shape and configuration of the spacer 30 shown in the figures are merely exemplary, and in general, the spacer 30 may have any suitable shape.

[0045] The fluid block assembly 100 of the test head 1300 can also be a fluid circulation heat exchanger. Figure 10 An exploded view of a fluid block assembly 100 in an exemplary embodiment is shown. The fluid block assembly 100 includes a cold plate 70 on which microfins 72 are formed on its top surface. A manifold 90 having a cavity 92 is positioned on the cold plate 70 such that the microfins 72 are surrounded within the cavity 92. A fluid inlet 82 and a fluid outlet 84 guide fluid into and out of the cavity 92 for heat exchange with the microfins 72. During use, fluid introduced into the cavity 92 through the fluid inlet 82 exchanges heat with the microfins 72 and exits the manifold 90 through the fluid outlet 84. Although not required, in some embodiments, the fluid inlet 82 and the fluid outlet 84 are formed on the same side of the manifold 90. In some embodiments, fluid entering the manifold 90 may flow through a downwardly extending channel (not shown) in the manifold 90 into the cavity 92 above the microfins 72. The fluid then flows over the microfins 72 and transfers heat with them. The microfins 72 may have any size and shape. Typically, the shape, size, and configuration of the microfins 72 can be designed to enhance heat transfer between the fluid and the microfins 72. Components of the fluid block assembly 100 can be made of any suitable material (or materials). In some embodiments, the cold plate 70 can be made of a thermally conductive material (e.g., copper, aluminum, etc.). Furthermore, the manifold 90 can be made of a plastic material (e.g., polyetheretherketone, or "PEEK"). In some embodiments (e.g., when the manifold 90 is made of plastic), the fluid inlet 82 and fluid outlet 84 can be fluid conduits or pipe adapters connected to the manifold 90 via metal (e.g., stainless steel) port nuts 85.

[0046] See Figure 8A and Figure 8BManifold 90 includes through-hole cavities 192 sized to accommodate bushings 170. These bushings 170 may extend through aligned cavities 192 in the cold plate 70 and manifold 90, and may include internal threads. Bushing heads 173 having a cross-sectional area larger than that of the cavities in the cold plate 70 may engage with the bottom surface of the cold plate 70 and confine the bushings 170 within the cavities 192. Threads on opposite ends of the bushings 70 may be used to attach upper and lower components to the fluid block assembly 100. A set of screws 174 extending through aligned cavities in the chip contact member 24 (of contact assembly 20) and spacer 30 (of thermal control assembly 50) may engage with internal threads at the bottom end of the bushings 170 to connect the contact assembly 20 and the thermal control assembly 50 to the bottom of the fluid block assembly 100. Furthermore, a shoulder screw 172 extending through the cavity on the alignment plate 110 (of the alignment mechanism 150) engages with the internal thread at the top of the bushing 170 to connect the alignment mechanism 150 to the top of the fluid block assembly 100.

[0047] Similar to the tilt adjustment device or the alignment mechanism 150 of the test head 300, the alignment mechanism 150 of the test head 1300 is also configured to rotate the test head 1300 so that the bottom surface 25A of the base 26 (of the chip contact member 24) that contacts the chip 12 during testing can be parallel to the surface of the chip 12 when it engages with the surface of the chip 12. Figure 11 An exploded view of the alignment mechanism 150 of the test head 1300 in an exemplary embodiment is shown. The alignment mechanism 150 includes an alignment plate 110 coupled to a locking plate 130, and a plurality of springs 120 located between the two plates 110 and 130. As in the test head 300, the locking plate 130 is coupled to the cylinder head 200, and the alignment plate 110 is coupled to the top surface 95B of the manifold 90 (see [link to documentation]). Figure 7 In the test head 300, shoulder screws 172 secure the alignment plate 110 to the manifold, such that the bottom surface 110A of the alignment plate 110 is in direct physical contact with the top surface 95A of the manifold 90 (see...). Figure 1 and 5B In the test head 1300, a plurality of springs 220 are positioned between the manifold 90 and the alignment plate 110 such that the bottom surface 110A of the alignment plate 110 is biased away from the top surface 95B of the manifold 90. A cavity 95C formed on the top surface 95B of the manifold 90 positions these springs 220 appropriately between these surfaces (see [link to test head 1300]). Figure 8B and 10The top surface 110B of the alignment plate 110 includes a centrally located convex protrusion 112 facing the bottom surface 130A of the locking plate 130. Springs 120 of the alignment mechanism 150 are positioned around the convex protrusion 112 to offset the top surface 110B of the alignment plate 110 from the bottom surface 130A of the locking plate 130. These springs 120 are mounted on countersunk shoulder screws 176, which secure the locking plate 130 and the alignment plate 110 together. When the test head 1300 is not in use, the springs 120 space the top surface 110B of the alignment plate 110 from the bottom surface 130A of the locking plate 130, and springs 220 space the bottom surface 110A of the alignment plate 110 from the top surface 95B of the manifold 90 (see [link to relevant documentation]). Figure 7 ).

[0048] The test head 1300 also includes a pair of support members 250 that connect the alignment mechanism 150 to the contact assembly 20. For example... Figure 7 As best shown, the top end of the support member 250 is attached to the alignment plate 110. And the bottom end of the support member 250 is attached to the substrate contact member 224 of the contact assembly 20. Figure 12 This is an exploded view of the contact assembly 20 of the test head 1300. In addition to the chip contact member 24 having a base 26 that contacts and applies pressure to the chip 12 during testing, the contact assembly 20 of the test head 1300 includes a substrate contact member 224 that contacts and applies pressure to the substrate 14 (of the DUT 10) during testing. See also... Figure 7 and 12 In the contact assembly 20, the substrate contact member 224 is located below the chip contact member 24. A guide pin 260 on the bottom surface of the chip contact member 24 engages with a corresponding groove formed on the substrate contact member 224 to ensure accurate alignment of the two contact members. When accurately aligned, the base 26 of the chip contact member 24, which contacts the chip 12, protrudes downward from the bottom surface of the chip contact member 24 through a cavity 228 formed on the substrate contact member 224. During testing, a support 226 extending around the cavity 228 protrudes downward from the bottom surface of the substrate contact member 224 to contact the substrate 14 (of the DUT 10). A locating pin 160 on the substrate contact member 224 engages with a corresponding feature on the DUT 10 (e.g., a mount for the DUT 10) to align the base 26 and the support 226 with the DUT 10. Figure 7 In the embodiment shown, the test head 1300 has a support 226 in contact with the substrate 14 in a square (or rectangular) annular region surrounding the chip 12. However, this is merely exemplary. Typically, the support 226 can be configured to contact any area of ​​the substrate 14 and apply pressure to that area.

[0049] Figures 13A to 13CThis is a schematic diagram of testing DUT 10 using test head 1300. See also... Figure 13A and 13B In order to test DUT 10 using test head 1300, cylinder head 200 (see...) Figure 7 The test head 1300 is lowered onto the DUT 10, causing the bottom surface 25A of the base 26 to contact the surface of the chip 12 and apply pressure to the surface of the chip 12. As the cylinder head 200 pushes the test head 1300 against the surface of the chip 12, the springs 120 and 220 of the alignment mechanism 150 are compressed until the bottom surface 130A of the locking plate 130 contacts the protrusion 112 on the top surface 110B of the alignment plate 110. If the surface of the chip 12 is not parallel to the bottom surface 25A when engaging, the spring 120 is compressed to varying degrees, thereby rotating the test head 1300 so that the bottom surface 25A is parallel to the chip surface. Thus, as in the test head 300, the alignment mechanism 150 ensures that the mating surfaces of the test head 1300 and the DUT 10 are engaged in parallel. As the cylinder head 200 applies further pressure to the test head 1300, the spring 220 of the alignment mechanism 150 compresses to move the substrate support member 250 toward the DUT 10, thereby causing the bracket 226 to contact the substrate 14 and apply pressure to the substrate 14. In some embodiments, the total stiffness (i.e., effective stiffness) of the spring 220 may be greater than the total stiffness of the spring 120, such that when pressure is initially applied to the DUT 10 using the test head 1300, the compression of the spring 120 is greater than that of the spring 220. That is, when the individual values ​​of springs 220 and 120 are n 220 and n 120 And the stiffness of each spring, 220 and 120, is k respectively. 220 and k 120 At that time, the effective stiffness of spring 220 (i.e., n) 220 ×k 220 The effective stiffness of the spring can be greater than that of spring 120 (i.e., n). 120 ×k 120 It is also conceivable that in some embodiments, the effective stiffness of spring 220 may be substantially equal to that of spring 120, and in some embodiments, the effective stiffness of spring 120 may be greater than that of spring 220. Typically, the stiffness of springs 120 and 220 allows the test head 1300 to apply the desired force to the chip 12. The maximum pressure applied to the substrate 14 can be controlled by a pressure regulator in the cylinder head 200.

[0050] As mentioned above, refer to Figure 1 The description of test head 300 provided in Figure 6 is applicable to Figure 7 Test head 1300; and refer to Figures 7 to 13C The provided description of test head 1300 is applicable to Figure 1The test head 300 is described herein. It will be apparent to those skilled in the art that various modifications and variations can be made to the test head disclosed herein. Other embodiments of the test head will be apparent to those skilled in the art upon consideration of the specification and practice of the test head disclosed herein. This specification and examples are intended to be illustrative only.

Claims

1. A thermal test head for an integrated circuit device, the integrated circuit device comprising a chip mounted on a substrate, characterized in that, The thermal test head includes: Heat exchanger assembly; A chip contact member configured to contact the chip; and A thermal control assembly is disposed between the heat exchanger assembly and the chip contact member, the thermal control assembly comprising: A Peltier device that is in thermal contact with the opposing surfaces of the heat exchanger assembly and the chip contact member; and A spacer that is in physical contact with the opposing surfaces of the heat exchanger assembly and the chip contact member; A tilt adjustment device, which is coupled to the surface of the heat exchanger assembly and disposed opposite to the thermal control assembly, wherein the tilt adjustment device includes: Alignment plate, which is attached to the surface of the heat exchanger assembly; A locking plate, disposed above the alignment plate and configured to move toward or away from the alignment plate; and Multiple springs are disposed between the locking plate and the alignment plate; The plurality of springs bias the locking plate away from the alignment plate. The tilt adjustment device further includes one or more springs, which are disposed between the alignment plate and the heat exchanger assembly and configured to bias the alignment plate away from the heat exchanger assembly. A substrate contact member and at least one support member connecting the substrate contact member to the alignment plate, the substrate contact member being configured to contact the substrate and apply pressure to the substrate.

2. The thermal testing head according to claim 1, characterized in that, The spacer is arranged at least partially around the Peltier device.

3. The thermal testing head according to claim 1 or 2, characterized in that, The heat exchanger assembly is configured to allow fluid to circulate through it.

4. The thermal testing head according to claim 3, characterized in that, The heat exchanger assembly includes: A manifold, which defines a cavity; A cold plate, comprising microfins located on a first surface of the cold plate; and The channel body defines a fluid flow channel; the microfins and the channel body are disposed in the cavity of the manifold; The cold plate comprises thermally conductive metal, and / or The manifold comprises a plastic material, and / or The main body of the channel is made of either metal or plastic.

5. The thermal testing head according to claim 4, characterized in that, One or more springs between the alignment plate and the heat exchanger assembly are disposed in one or more grooves on the surface of the manifold.

6. The thermal testing head according to claim 1 or 2, characterized in that, The spacer has an annular structure defining a central opening, and the Peltier device is disposed in the central opening of the spacer.

7. The thermal testing head according to claim 6, characterized in that, The spacer includes a body having at least one channel for allowing the corresponding electrical leads of the Peltier device to extend through the corresponding channel of the at least one channel when the Peltier device is located in the central opening of the spacer.

8. The thermal testing head according to claim 1 or 2, characterized in that, The spacer may be made of plastic or ceramic material.

9. The thermal testing head according to claim 1 or 2, characterized in that, Also includes: A first layer of thermal interface material is disposed between the Peltier device and the chip contact member, and A second thermal interface material is disposed between the Peltier device and the heat exchanger assembly. The height of the spacer is equal to the sum of the height of the Peltier device, the height of the first thermal interface material, and the height of the second thermal interface material.

10. The thermal testing head according to claim 9, characterized in that, The first thermal interface material is in physical contact with the Peltier device and the chip contact member, and the second thermal interface material is in physical contact with the Peltier device and the heat exchanger assembly.

11. The thermal testing head according to claim 1, characterized in that, The alignment plate includes a convex protrusion extending toward the locking plate; the plurality of springs of the tilt adjustment device are arranged around the convex protrusion.

12. The thermal testing head according to claim 1 or 11, characterized in that, The tilt adjustment device is configured to change the angular alignment of the contact surface of the chip contact member; The contact surface is configured to contact the chip.

13. The thermal testing head according to claim 1, characterized in that, The chip contact member includes a base extending through an opening in the substrate contact member, the base having a contact surface configured to contact the chip, and... The substrate contact member includes a flange that extends at least partially around the opening and has a contact surface configured to contact the substrate.

14. The thermal testing head according to claim 13, characterized in that, The flange is shaped to form a square or rectangular annulus.

15. The thermal testing head according to claim 13 or 14, characterized in that, The chip contact member includes one or more guide pins configured to engage with one or more corresponding recesses within the substrate contact member when the chip contact member moves closer to the substrate contact member. as well as The substrate contact member includes one or more positioning pins configured to engage with one or more corresponding positioning holes in the integrated circuit device when the substrate contact member moves closer to the integrated circuit device.

16. The thermal testing head according to claim 1 or 2, characterized in that, The tilt adjustment device is configured such that an initial movement of the tilt adjustment device toward the integrated circuit device causes the chip contact member to contact the chip, and a further movement of the tilt adjustment device toward the integrated circuit device causes the substrate contact member to contact the substrate.

17. The thermal testing head according to claim 1 or 2, characterized in that, The effective stiffness of one or more springs between the alignment plate and the heat exchanger assembly is greater than the effective stiffness of multiple springs between the locking plate and the alignment plate.

18. The thermal testing head according to claim 1 or 2, characterized in that, The chip contact member includes one or more temperature sensors configured to monitor the temperature of the integrated circuit device.

Images