Antenna

Abstract

The present invention provides an antenna, which comprises: a first dielectric layer having a first surface and a second surface opposite to the first surface; a second dielectric layer having a third surface and a fourth surface opposite to the third surface; a third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; a first adhesive layer disposed between the second surface and the third surface; a second adhesive layer disposed between the fourth surface and the fifth surface; a patch pattern disposed on the second surface and embedded in the first adhesive layer; a first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and a second coupling pattern disposed on the sixth surface. The patch pattern, the first coupling pattern, and the second coupling pattern at least partially overlap each other in a plane.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0045140, filed with the Korean Intellectual Property Office on April 14, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to an antenna, and more particularly, to a chip patch antenna. Background Art

[0003] As the communication technology of portable terminal devices has evolved from 4G to 5G, the frequency bands used for communication have been designed as wide bands and multi-bands. When using millimeter waves (mmWave), the physical size of the receiver should be reduced, and the antennas used in portable terminal devices should have improved efficiency to achieve wide bands and have a reduced size. Summary of the Invention

[0004] One aspect of the present disclosure is to provide an antenna that can improve efficiency and can have a reduced size.

[0005] Another aspect of the present disclosure is to provide an antenna that can cover radio frequency bands.

[0006] Another aspect of the present disclosure is to provide an antenna that can improve the matching characteristics between patterns formed on different layers.

[0007] According to one aspect of the present disclosure, an antenna can be implemented by constructing a main body portion to include a plurality of dielectric layers and a plurality of adhesive layers disposed between the plurality of dielectric layers through a lamination process rather than a matching process, and forming a required number of patch patterns and coupling patterns in the main body portion.

[0008] For example, according to one aspect of the present disclosure, an antenna may include: a first dielectric layer having a first surface and a second surface opposite to the first surface; a second dielectric layer having a third surface and a fourth surface opposite to the third surface; a third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; a first adhesive layer disposed between the second surface and the third surface; a second adhesive layer disposed between the fourth surface and the fifth surface; a patch pattern disposed on the second surface and embedded in the first adhesive layer; a first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and a second coupling pattern disposed on the sixth surface. The patch pattern, the first coupling pattern, and the second coupling pattern at least partially overlap each other in a plane.

[0009] For example, according to one aspect of the present disclosure, an antenna may include: a body portion including a plurality of dielectric layers and a plurality of adhesive layers disposed between the plurality of dielectric layers; and a pattern portion including a patch pattern disposed in the body portion and one or more coupling patterns disposed in or on the body portion. The dielectric constant of each of the uppermost dielectric layer and the lowermost dielectric layer among the plurality of dielectric layers is greater than the dielectric constant of the intermediate dielectric layer disposed between the uppermost dielectric layer and the lowermost dielectric layer among the plurality of dielectric layers.

[0010] For example, according to one aspect of the present disclosure, an antenna may include: a body portion including alternately disposed dielectric layers and adhesive layers; a pattern portion including a patch pattern protruding from a first surface of one of the dielectric layers and embedded in one of the adhesive layers, and including one or more coupling patterns respectively disposed on one or more of the dielectric layers; a pad pattern protruding from a second surface of the one of the dielectric layers opposite to the first surface; and a via hole disposed in the one of the dielectric layers and connecting the patch pattern to the pad pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a block diagram showing an example of an electronic device system;

[0013] Figure 2 is a plan view showing an example of an electronic device;

[0014] Figure 3 is a perspective view showing an example of an antenna module;

[0015] Figure 4 is a perspective view showing an example of an antenna;

[0016] Figure 5 is a cross-sectional view showing the antenna taken along line I-I' Figure 4 shown in

[0017] Figure 6 is a cross-sectional view showing Figure 5 a modified example of the antenna shown in

[0018] Figure 7 is a cross-sectional view showing Figure 5 another modified example of the antenna shown in

[0019] Figure 8 is a cross-sectional view showing another example of the antenna;

[0020] Figure 9 is a cross-sectional view showing an example of a modification of the antenna shown in Figure 8 ;

[0021] Figure 10 is a cross-sectional view showing another example of a modification of the antenna shown in Figure 8 ;

[0022] Figure 11 is a cross-sectional view showing another example of an antenna;

[0023] Figure 12 is a cross-sectional view showing an example of a modification of the antenna shown in Figure 11 ; and

[0024] Figure 13 is a cross-sectional view showing another example of a modification of the antenna shown in Figure 11 ; DETAILED DESCRIPTION

[0025] Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings. In the drawings, for clarity of description, the shapes, sizes, etc. of the elements may be exaggerated or briefly shown.

[0026] Figure 1 is a block diagram showing an example of an electronic device system.

[0027] Referring to Figure 1 , the electronic device 1000 may house a main board 1010 therein. The main board 1010 may include chip-related components 1020, network-related components 1030, other components 1040, etc., physically or electrically connected thereto. These components may be connected to other components to be described below via various signal lines 1090.

[0028] The chip-related components 1020 may include: memory chips, such as volatile memories (e.g., dynamic random access memories (DRAMs)), non-volatile memories (e.g., read-only memories (ROMs)), flash memories, etc.; application processor chips, such as central processors (e.g., central processing units (CPUs)), graphics processors (e.g., graphics processing units (GPUs)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (ADCs), application-specific integrated circuits (ASICs), etc. However, the chip-related components 1020 are not limited thereto, but may also include other types of chip-related components. In addition, the chip-related components 1020 may be combined with each other.

[0029] The network-related components 1030 may include components operating based on protocols such as: Wireless Fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 family, etc.), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 family, etc.), IEEE 802.20, Long Term Evolution (LTE), Evolution-Data Only (Ev-DO), High Speed Packet Access+ (HSPA+), High Speed Downlink Packet Access+ (HSDPA+), High Speed Uplink Packet Access+ (HSUPA+), Enhanced Data rates for GSM Evolution (EDGE), Global System for Mobile Communications (GSM), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, 3G protocols, 4G protocols, and 5G protocols, as well as any other wireless and wired protocols specified after the above-mentioned protocols. However, the network-related components 1030 are not limited thereto, but may also include components operating based on various other wireless or wired standards or protocols. In addition, the network-related components 1030 may be combined with each other together with the above-mentioned chip-related components 1020.

[0030] The other components 1040 may include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, Low Temperature Co-fired Ceramic (LTCC), Electromagnetic Interference (EMI) filters, Multi-Layer Ceramic Capacitors (MLCC), etc. However, the other components 1040 are not limited thereto, but may also include passive components for various other purposes. In addition, the other components 1040 may be combined with each other together with the above-mentioned chip-related components 1020 and / or network-related components 1030.

[0031] Depending on the type of the electronic device 1000, the electronic device 1000 may include other components that may or may not be physically or electrically connected to the main board 1010. These other components may include, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, an audio codec (not shown), a video codec (not shown), a power amplifier (not shown), a compass (not shown), an accelerometer (not shown), a gyroscope (not shown), a speaker (not shown), a mass storage unit (e.g., a hard disk drive) (not shown), a Compact Disc (CD) drive (not shown), a Digital Versatile Disc (DVD) drive (not shown), etc. However, these other components are not limited thereto, but may also include other components for various purposes depending on the type of the electronic device 1000, etc.

[0032] The electronic device 1000 may be a smart phone, a personal digital assistant (PDA), a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, an automotive component, etc. However, the electronic device 1000 is not limited thereto and may be any other electronic device that processes data.

[0033] Figure 2 is a perspective view showing an example of an electronic device.

[0034] Referring to Figure 2 , for example, the electronic device may be a smart phone 1100. In the smart phone 1100, a modem 1101 may be provided, and various types of antenna modules 1102, 1103, 1104, 1105, and 1106 connected to the modem 1101 through a rigid printed circuit board, a flexible printed circuit board, and / or a rigid-flex printed circuit board may be provided. If necessary, a Wi-Fi module 1107 may also be provided. The antenna modules 1102, 1103, 1104, 1105, and 1106 may include antenna modules 1102, 1103, 1104, and 1105 for various frequency ranges for 5G mobile communication (such as an antenna module 1102 for a 3.5 GHz band frequency, an antenna module 1103 for a 5 GHz band frequency, an antenna module 1104 for a 28 GHz band frequency, an antenna module 1105 for a 39 GHz band frequency, etc.), and may also include other antenna modules 1106 for 4G communication that are connected to and / or not connected to the modem 1101, but the example embodiments are not limited thereto. The electronic device is not limited to the smart phone 1100 and may be implemented by the other electronic devices described above.

[0035] Figure 3 is a perspective view showing an example of an antenna module.

[0036] Referring to Figure 3 , in the example embodiment, the antenna module 800 may include an antenna substrate 500 and a plurality of antennas 100 mounted on the upper surface of the antenna substrate 500. Each of the antennas 100 may be configured as a chip patch antenna. The "chip" in the "chip" antenna may mean that the antenna 100 may be manufactured separately from the antenna substrate 500 that provides the installation space for the antenna 100 and may be disposed in the substrate. Each of the antennas 100 may be surface-mounted on the antenna substrate 500 using a connection metal (such as solder, etc.). The antenna 100 may be as Figure 3It is arranged in a 1×4 layout as shown, but the exemplary embodiments are not limited thereto. If necessary, the antenna 100 may be arranged in various forms (such as, in a 1×2 or 2×2 layout). If necessary, electronic components may be mounted on the lower surface of the antenna substrate 500. The electronic components may include a radio frequency integrated circuit (RFIC), a power management IC (PMIC), etc. The electronic components may also include, for example, chip passive components (such as chip capacitors or chip inductors). The electronic components may be surface-mounted on the antenna substrate 500 using a connection metal (such as solder, etc.).

[0037] The antenna substrate 500 may be configured as a multilayer printed circuit board (PCB) including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers. The antenna substrate 500 may include: a first region including a plurality of first insulating layers, a plurality of first wiring layers, and a plurality of first via layers; and a second region including a plurality of second insulating layers, a plurality of second wiring layers, and a plurality of second via layers. In the thickness direction, the first region may be disposed on the upper side of the antenna substrate 500, and the second region may be disposed on the lower side of the antenna substrate 500. The first region may be used as an antenna member, and the second region may be used as a redistribution member. For example, at least a part of the plurality of first insulating layers may include a material having a lower dielectric loss factor (Df) than at least a part of the plurality of second insulating layers.

[0038] The plurality of first insulating layers may include a laminate in which a thermoplastic resin layer and a thermosetting resin layer are alternately laminated. The thermoplastic resin layer may include a material effective for the transmission of radio frequency signals, and the thermosetting resin layer may include a material that is favorable for the transmission of radio frequency signals and has adhesiveness. By using a multilayer resin layer, an insulator that is favorable for the transmission of radio frequency signals and may have improved adhesiveness can be provided. The plurality of first wiring layers may be respectively disposed on the thermoplastic resin layer, may be embedded in the thermosetting resin layer, and may be connected to each other through the plurality of first via layers. Each of the plurality of first via layers may simultaneously penetrate the adjacent thermoplastic resin layer and the adjacent thermosetting resin layer.

[0039] For the transmission of radio frequency signals, liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), polyimide (PI), etc. can be used as the thermoplastic resin layer. The dielectric loss factor (Df) can be adjusted according to the type of resin of the thermoplastic resin layer, the type of filler included in the resin, the content of the filler, etc. The dielectric loss factor (Df) can be a value related to dielectric loss, and dielectric loss can refer to the power loss generated when an alternating electric field is formed on the resin layer (dielectric material). The dielectric loss factor (Df) can be proportional to the dielectric loss, and the lower the dielectric loss factor (Df), the smaller the dielectric loss. The thermoplastic resin layer having low dielectric loss characteristics can be beneficial to reducing the loss in radio frequency signal transmission. The dielectric loss factor (Df) of the thermoplastic resin layer can be 0.003 or lower, for example, it can be 0.002 or lower. In addition, the dielectric constant (Dk) of the thermoplastic resin layer can be 3.5 or lower.

[0040] For the transmission of radio frequency signals, polyphenylene ether (PPE), modified polyimide (PI), modified epoxy resin, etc. can be used as the thermosetting resin layer. The dielectric loss factor (Df) can be adjusted according to the type of resin of the thermosetting resin layer, the type of filler included in the resin, the content of the filler, etc. The thermosetting resin layer having low dielectric loss characteristics can be beneficial to reducing the loss in radio frequency signal transmission. The dielectric loss factor (Df) of the thermosetting resin layer can be 0.003 or lower, for example, it can be 0.002 or lower. In addition, the dielectric constant (Dk) of the thermosetting resin layer can be 3.5 or lower.

[0041] The thickness of the thermoplastic resin layer can be greater than the thickness of the thermosetting resin layer. For the transmission of radio frequency signals, having the above thickness relationship can be desirable. The interface surface between the thermoplastic resin layer and the thermosetting resin layer adjacent to each other up and down can include a rough surface. The rough surface can refer to a surface having serrations by being roughened. By including the rough surface, the thermoplastic resin layer and the thermosetting resin layer adjacent to each other up and down can ensure the adhesion effect towards each other.

[0042] In one example, the thickness of the component can refer to the dimension of the component in the thickness direction of the component, and can be one of the average thickness, the maximum thickness, and the thickness measured at the central part of the component. The thickness direction of the component can refer to the direction in which the main surfaces of the component face each other. In another example, the thickness direction of the component can refer to the direction in which the component is laminated with other component layers.

[0043] In one example, the thickness of the component can be determined based on a cross-sectional cut image scanned by, for example, a scanning electron microscope (SEM) by the following operations: defining a predetermined number (e.g., 5) of points at equal intervals (or optionally, non-equal intervals) to the left from a reference center point of the component and defining a predetermined number (e.g., 5) of points to the right, measuring the thickness at each of the points located at the equal intervals (or optionally, non-equal intervals), and obtaining an average value therefrom. The reference center point may have the same distance or substantially the same distance (taking into account measurement errors) from the opposite sides of the component in the cross-sectional cut image. In this case, the thickness can be the average thickness of the component.

[0044] Optionally, the thickness can be determined based on a cross-sectional cut image scanned by, for example, a scanning electron microscope (SEM) by the following operations: defining a predetermined number (e.g., 5) of points at equal intervals (or optionally, non-equal intervals) to the left from a reference center point of the component and defining a predetermined number (e.g., 5) of points to the right, measuring the thickness at each of the points located at the equal intervals (or optionally, non-equal intervals), and obtaining a maximum value therefrom. In this case, the thickness can be the maximum thickness of the component.

[0045] Optionally, the thickness can be the thickness of the component at the reference center point based on a cross-sectional cut image scanned by, for example, a scanning electron microscope (SEM). The reference center point may have the same distance or substantially the same distance from the opposite sides of the component in the cross-sectional cut image (taking into account measurement errors).

[0046] The plurality of second insulating layers may include an insulating material. A thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as a polyimide resin), a material including a reinforcing material (including woven glass fibers and / or inorganic fillers) and the above resins (such as, a prepreg, Ajinomoto Build-up Film (ABF), a photosensitive dielectric (PID), etc.) can be used as the insulating material.

[0047] The multiple first wiring layers and the multiple second wiring layers may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used as the metallic material. The multiple first wiring layers and the multiple second wiring layers may be formed by an additive process (AP), semi-AP (SAP), modified SAP (MSAP), a sealing (TT, tenting) process, etc. Thus, each of the multiple first wiring layers and the multiple second wiring layers may include a seed layer (electroless plating layer) and an electrolytic plating layer formed based on the seed layer. Each of the multiple first wiring layers and the multiple second wiring layers may perform various functions according to the design of the corresponding layer. For example, each of the multiple first wiring layers and the multiple second wiring layers may include a power feeding pattern, and may also include a ground pattern, a power pattern, a signal pattern, etc. Each pattern may include a line pattern, a plane pattern, and / or a pad pattern.

[0048] The multiple first via layers and the multiple second via layers may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used as the metallic material. The multiple first via layers and the multiple second via layers may be formed by a plating process such as AP, SAP, MSAP, TT, etc. Thus, each of the multiple first via layers and the multiple second via layers may include a seed layer (electroless plating layer) and an electrolytic plating layer formed based on the seed layer. The multiple first via layers and the multiple second via layers may perform various functions according to the design of the corresponding layer. For example, each of the multiple first via layers and the multiple second via layers may include a power feeding via for power feeding pattern connection, a signal via for signal connection, a ground via for ground connection, a power via for power connection, etc. Each via may be completely filled with a metallic material, or the metallic material may be formed along the wall of the via hole and may have various shapes (such as a tapered shape, etc.).

[0049] Figure 4 is a perspective view showing an example of an antenna.

[0050] Figure 5 is a cross-sectional view of the antenna shown in Figure 4 taken along line I-I'.

[0051] Refer to Figure 4 and Figure 5, the antenna 100A in the exemplary embodiment may include a body portion 110 and a pattern portion 120. The body portion 110 may include a first dielectric layer 111, a second dielectric layer 112, a third dielectric layer 113, a first adhesive layer 114 disposed between the first dielectric layer 111 and the second dielectric layer 112 and connecting the first dielectric layer 111 and the second dielectric layer 112 to each other, and a second adhesive layer 115 disposed between the second dielectric layer 112 and the third dielectric layer 113 and connecting the second dielectric layer 112 and the third dielectric layer 113 to each other. The pattern portion 120 may include: a patch pattern 121 disposed on the upper surface of the first dielectric layer 111 and embedded in the first adhesive layer 114; a first coupling pattern 122 disposed on the upper surface of the second dielectric layer 112 and embedded in the second adhesive layer 115; and a second coupling pattern 123 disposed on the upper surface of the third dielectric layer 113. The patch pattern 121, the first coupling pattern 122, and the second coupling pattern 123 may at least partially overlap each other in a plane. In one example, a first portion overlapping a second portion in a plane may mean that in a plane perpendicular to the direction in which the first portion is stacked on or under the second portion or substantially perpendicular to the direction in which the first portion is stacked on or under the second portion (taking into account measurement errors or process errors), the first portion and the second portion overlap each other. If necessary, the pattern portion 120 may further include: at least one first pad pattern 124 disposed on the lower surface of the first dielectric layer 111; a plurality of second pad patterns 125 disposed on the lower surface of the first dielectric layer 111 and surrounding the first pad pattern 124 in a plane; and a via hole 126 penetrating the first dielectric layer 111 and connecting the patch pattern 121 to the first pad pattern 124.

[0052] As described above, since the communication technology of the portable terminal device has evolved from 4G to 5G, the frequency bands used for communication have been designed as wide bands and multi-bands. When using mmWave, the physical size of the receiver should be reduced, and the antenna used in the portable terminal device should have improved efficiency to achieve a wide band and should also have a reduced size at the same time. According to this trend, an antenna that is usually manufactured as a printed circuit board (PCB) having a multilayer structure can be manufactured as a chip antenna using a material with a high dielectric constant (high k) to reduce its size, and a rigid-flex PCB can be adopted to improve the efficiency, thereby improving the radiation characteristics.

[0053] When implementing a chip-type patch antenna, at least two coupling patterns that can overlap with the patch pattern vertically and can be coupled to the patch pattern may be necessary for covering a radio frequency band. Such a chip-type packaged antenna can be implemented through a matching process (wherein a patch pattern and a pad pattern are respectively formed on the upper surface and the lower surface of a first dielectric layer, coupling patterns are respectively formed on the upper surface and the lower surface of a second dielectric layer, and the first dielectric layer and the second dielectric layer can be bonded to each other using an adhesive layer). However, matching tolerances may occur in the matching process, and thus, it may be difficult to perform a large-area process. Additionally, it may be difficult to use an organic substrate material. In the case of not using an organic substrate material, an inorganic material (such as ceramic) can be considered as a high-k material for the dielectric layer. However, when ceramic is implemented or processed as a thin film, the ceramic may be easily broken, and the processability of the ceramic is poor, making it difficult to form vias for interlayer conduction.

[0054] Different from the above example, the antenna 100A in the exemplary embodiment can be configured as a chip-type patch antenna including a main body portion 110 and a pattern portion 120 formed in the main body portion 110, and can have a structure in which a first dielectric layer 111, a first adhesive layer 114, a second dielectric layer 112, a second adhesive layer 115, and a third dielectric layer 113 included in the main body portion 110 and a patch pattern 121, a first coupling pattern 122, and a second coupling pattern 123 included in the pattern portion 120 are sequentially laminated. This structure can be implemented, for example, through the following lamination process: the patch pattern 121 and pad patterns 124 and 125 can be respectively formed on the upper surface and the lower surface of the first dielectric layer 111, the first adhesive layer 114 can be laminated on the upper surface of the first dielectric layer 111, the second dielectric layer 112 having the first coupling pattern 122 formed on its upper surface can be laminated on the first adhesive layer 114, the second adhesive layer 115 can be laminated on the upper surface of the second dielectric layer 112, and the third dielectric layer 113 having the second coupling pattern 123 formed on its upper surface can be laminated on the second adhesive layer 115. Compared with the above matching process, the lamination process can improve the matching characteristics between the patterns 121, 122, 123, 124, and 125 formed on the layers, and as a result, the performance of the antenna 100A can be improved.

[0055] The first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113 included in the main body 110 may include an organic binder and an inorganic filler. Various types of polymers such as PTFE, epoxy resin, etc. (desirably, PTFE may be used) may be used as the organic binder. Various types of ceramic fillers such as silica (SiO2), titanium dioxide (TiO2), alumina (Al2O3), etc. may be used as the inorganic filler. The ceramic filler may have various shapes such as angular shape, circular shape, etc., and may have various sizes such as having a diameter of 50 μm or less. For example, each of the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113 may include a ceramic-polymer composite. Such a composite may have high-k characteristics and may ensure a significant level of handleability and processability. For example, a large-area process may be available with the improvement of handleability. Additionally, with the improvement of processability, via processes using computer numerical control (CNC) drilling or laser drilling may be easily performed. Therefore, design rules may be improved such that, for example, a fine circuit may be achieved through a plating process, and via holes 125V with a reduced diameter may be applied. Thus, the advantages of a chip patch antenna may be obtained, and various problems caused by defects in handleability and processability may be solved. If necessary, each of the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113 may further include a reinforcing material. For example, woven glass fiber may be used as the reinforcing material. For example, the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113 may include a ceramic-polymer composite impregnated in woven glass fiber. The composite containing the above woven glass fiber may have improved strength. Therefore, improved handleability and processability may be ensured.

[0056] The dielectric constant (Dk) of each of the first dielectric layer 111 and the third dielectric layer 113 may be greater than the dielectric constant of the second dielectric layer 112. For example, the dielectric constant Dk of the first dielectric layer 111 provided at the lowermost side of the main body 110 and providing a dielectric region between the patch pattern 121 and the pad patterns 124 and 125, and the dielectric constant Dk of the third dielectric layer 113 provided at the uppermost side of the main body 110 and providing a dielectric region between the first coupling pattern 122 and the second coupling pattern 123 may be greater than the dielectric constant Dk of the second dielectric layer 112 providing a dielectric region between the patch pattern 121 and the first coupling pattern 122. When the above dielectric constant Dk relationship is satisfied, the characteristics of the antenna 100A can be improved. Similarly, the dielectric constant Dk of each of the first dielectric layer 111 and the third dielectric layer 113 may be greater than the dielectric constant Dk of the first adhesive layer 114. Additionally, the dielectric constant Dk of the second adhesive layer 115 may be greater than the dielectric constant Dk of the first adhesive layer 114. In this case, sufficient adhesiveness can be obtained through the first adhesive layer 114 and the second adhesive layer 115, and the first dielectric layer 111 and the third dielectric layer 113 can provide a very high dielectric constant Dk for the main body 110, such that the antenna characteristics can be improved. Additionally, by including a layer having a low dielectric constant Dk in a portion that is not very important for reducing the size, the total effective dielectric constant Dk of the antenna 100A can be reduced, such that the radiation efficiency can be improved. For example, through the patch pattern 121 and the first coupling pattern 122 and the second coupling pattern 123, it is possible to easily radiate RF signals in the thickness direction (z direction). Additionally, in some cases, between the patch pattern 121 and the first coupling pattern 122 and the second coupling pattern 123, the relatively adverse effects related to the realization of the antenna characteristics caused by the first adhesive layer 114 and the second adhesive layer 115 can be significantly reduced. For example, the dielectric constant (Dk) can be measured by a vector network analyzer using a dielectric evaluation kit (DAK), but is not limited thereto.

[0057] The chip pattern 121, the first coupling pattern 122, the second coupling pattern 123, the first pad pattern 124, each of the plurality of second pad patterns 125, and the via-through hole 126 can be formed by a plating process. Since the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113 included in the main body portion 110 can have improved processability and workability, the pattern portion 120 can be easily formed by a plating process. Accordingly, design rules can be improved such that, for example, a fine circuit can be easily realized. The chip pattern 121 can include a larger number of metal layers (greater than the number of metal layers included in the first coupling pattern 122 and the second coupling pattern 123). For example, each of the chip pattern 121, the first pad pattern 124, and the plurality of second pad patterns 125 formed on the first dielectric layer 111 in which the via-through hole 126 is formed can be formed by TT or MSAP. In this case, each of the elements can include a first metal layer M1 (a seed layer formed by an electroless plating process), a second metal layer M2 (a plating layer formed by an electrolytic plating process), and a third metal layer M3 (such as a metal foil). The first coupling pattern 122 and the second coupling pattern 123 respectively formed on the second dielectric layer 112 and the third dielectric layer 113 in which the via-through hole 126 is not formed can be formed by a TT process. In this case, each of the first coupling pattern 122 and the second coupling pattern 123 can include only a fourth metal layer M4 and a fifth metal layer M5 (metal foil).

[0058] The via-through hole 126 can be a filled via. For example, the via-through hole 126 can be formed by TT or MSAP when forming the chip pattern 121, the first pad pattern 124, and the plurality of second pad patterns 125. In this case, the via-through hole 126 can include: a first metal layer M1 disposed on the wall of the via hole 125V formed in the first dielectric layer 111; and a second metal layer M2 disposed on the first metal layer M1. The second metal layer M2 can fill the via hole 125V, and the first metal layer M1 is disposed between the wall of the via hole 125V and the second metal layer M2. As described above, since the first dielectric layer 111 has improved workability, the filled via-through hole 126 can be easily formed.

[0059] In the following description, the elements of the antenna 100A of the exemplary embodiment will be described in more detail with reference to the drawings.

[0060] Each of the first dielectric layer 111 and the third dielectric layer 113 may include a material having a high dielectric constant (Dk). For example, each of the first dielectric layer 111 and the third dielectric layer 113 may include an organic binder and an inorganic filler as described above. Various types of polymers such as PTFE, epoxy resin, etc. (desirably, PTFE may be used) may be used as the organic binder. Various types of ceramic fillers such as silica (SiO2), titanium dioxide (TiO2), alumina (Al2O3), etc. may be used as the inorganic filler. The ceramic filler may have various shapes such as angular shape, circular shape, etc., and may have various sizes such as having a diameter of 50 μm or less. For example, each of the first dielectric layer 111 and the third dielectric layer 113 may include a ceramic-polymer composite. Each of the first dielectric layer 111 and the third dielectric layer 113 may also include a reinforcing material as described above. For example, woven glass fiber may be used as the reinforcing material. For example, each of the first dielectric layer 111 and the third dielectric layer 113 may include a ceramic-polymer composite impregnated in woven glass fiber. The dielectric constant (Dk) of each of the first dielectric layer 111 and the third dielectric layer 113 may be 6 or greater, and the dielectric constants (Dk) of the first dielectric layer 111 and the third dielectric layer 113 may be the same or different.

[0061] The second dielectric layer 112 may include a material having a relatively low dielectric constant (Dk) (lower than the dielectric constants of the first dielectric layer 111 and the third dielectric layer 113). For example, the second dielectric layer 112 may include an organic binder and an inorganic filler as described above, and may have a relatively low dielectric constant (Dk) by adjusting the content of the inorganic filler. Various types of polymers such as PTFE, epoxy resin, etc. (desirably, PTFE may be used) may be used as the organic binder. Various types of ceramic fillers such as silica (SiO2), titanium dioxide (TiO2), alumina (Al2O3), etc. may be used as the inorganic filler. The ceramic filler may have various shapes such as angular shape, circular shape, etc., and may have various sizes such as having a diameter of 50 μm or less. For example, the second dielectric layer 112 may also include a ceramic-polymer composite. The second dielectric layer 112 may further include a reinforcing material as described above. For example, woven glass fiber may be used as the reinforcing material. For example, the second dielectric layer 112 may also include a ceramic-polymer composite impregnated in woven glass fiber. To achieve improved antenna characteristics, the thickness of the second dielectric layer 112 may be less than the thickness of the first dielectric layer 111 and the thickness of the third dielectric layer 113.

[0062] The first adhesive layer 114 may include a material having a dielectric constant lower than that of the first dielectric layer 111 and the third dielectric layer 113 and having an adhesive force stronger than that of the first dielectric layer 111 and the second dielectric layer 112. For example, the first adhesive layer 114 may include a polymer having a dielectric constant lower than that of the first dielectric layer 111 and the third dielectric layer 113 and having an adhesive force stronger than that of the first dielectric layer 111 and the second dielectric layer 112. Polymers such as LCP, PI, PTFE, epoxy resin, etc. may be used as the polymer, but exemplary embodiments thereof are not limited thereto. To achieve improved antenna characteristics, the thickness of the first adhesive layer 114 may be less than the thickness of each of the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113.

[0063] The second adhesive layer 115 may include a material having a dielectric constant greater than that of the first adhesive layer 114 and having an adhesive force stronger than that of the second dielectric layer 112 and the third dielectric layer 113. For example, the second adhesive layer 115 may include a polymer having a dielectric constant greater than that of the first adhesive layer 114 and having an adhesive force stronger than that of the second dielectric layer 112 and the third dielectric layer 113. Polymers such as LCP, PI, PTFE, epoxy resin, etc. may be used as the polymer, but exemplary embodiments thereof are not limited thereto. To achieve improved antenna characteristics, the thickness of the second adhesive layer 115 may be less than the thickness of each of the first dielectric layer 111, the second dielectric layer 112, and the third dielectric layer 113.

[0064] The patch pattern 121 may include a metallic material. Metals such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may be used as the metallic material. The patch pattern 121 may be formed by a plating process such as TT or MSAP. Thus, the patch pattern 121 may include a first metal layer M1 (a seed layer formed by electroless plating), a second metal layer M2 (a plating layer formed by electrolytic plating), and a third metal layer M3 (such as a metal foil). The first metal layer M1 may be disposed on the upper surface of the first dielectric layer 111. The second metal layer M2 may be disposed on the first metal layer M1, and the thickness of the second metal layer M2 may be greater than the thickness of the first metal layer M1. The third metal layer M3 may be disposed on the upper surface of the first dielectric layer 111 before forming the seed layer. Thus, the third metal layer M3 may be disposed between the upper surface of the first dielectric layer 111 and the first metal layer M1. The thickness of the third metal layer M3 may be greater than the thickness of the first metal layer M1 and less than the thickness of the second metal layer M2.

[0065] When the antenna 100A is mounted on the antenna substrate, the patch pattern 121 can receive an RF signal through the feed pattern and the feed via in the antenna substrate and can transmit the RF signal in the thickness direction (z-direction), and can transmit the RF signal received in the thickness direction to, for example, an electronic component (such as an RFIC) mounted on the antenna substrate through the feed pattern and the feed via provided in the antenna substrate. For example, the patch pattern 121 can have an inherent resonance frequency (such as 28 GHz, 39 GHz, etc.) according to inherent factors (such as the shape, size, height, and dielectric constant of the dielectric layers 111 and 112). For example, the patch pattern 121 can be electrically connected to an electronic component (such as an RFIC) through the feed pattern and the feed via provided in the antenna substrate, so that the patch pattern 121 can transmit and receive horizontally polarized (H-polarized) RF signals and vertically polarized (V-polarized) RF signals that are polarized with respect to each other.

[0066] The first coupling pattern 122 can include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used as the metallic material. The first coupling pattern 122 can be formed by a plating process such as TT, and thus, the first coupling pattern 122 can include only the fourth metal layer M4 (such as a metal foil). The fourth metal layer M4 can be disposed on the upper surface of the second dielectric layer 112. For example, the fourth metal layer M4 can include a single metal (such as rolled copper or electrolytic copper).

[0067] The first coupling pattern 122 can be disposed on the upper side of the patch pattern 121, for example, can be disposed on the upper side of the patch pattern 121 in the thickness direction. The first coupling pattern 122 can be disposed to at least partially overlap the patch pattern 121 in a plane. Through the electromagnetic coupling between the first coupling pattern 122 and the patch pattern 121, an additional resonance frequency close to the above-mentioned inherent resonance frequency can be obtained, and thus, a wide bandwidth can be achieved.

[0068] The second coupling pattern 123 can include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used as the metallic material. The second coupling pattern 123 can be formed by a plating process such as TT, and thus, the second coupling pattern 123 can include only the fifth metal layer M5 (such as a metal foil). The fifth metal layer M5 can be disposed on the upper surface of the third dielectric layer 113. For example, the fifth metal layer M5 can include a single metal (such as rolled copper or electrolytic copper).

[0069] The second coupling pattern 123 may be disposed on the upper side of the first coupling pattern 122. For example, it may be disposed on the upper side of the first coupling pattern 122 along the thickness direction. The second coupling pattern 123 may be disposed to at least partially overlap the first coupling pattern 122 in a plane. Through the electromagnetic coupling between the first coupling pattern 122 and the second coupling pattern 123, the radio frequency bandwidth can be easily covered.

[0070] The pad patterns 124 and 125 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or their alloys may be used as the metallic material. The pad patterns 124 and 125 may be formed by plating processes such as TT, MSAP, etc. Thus, the pad patterns 124 and 125 may include a first metal layer M1 (a seed layer formed by electroless plating), a second metal layer M2 (a plating layer formed by electrolytic plating), and a third metal layer M3 (such as a metal foil). The first metal layer M1 may be disposed on the lower surface of the first dielectric layer 111. The second metal layer M2 may be disposed on the first metal layer M1, and the thickness of the second metal layer M2 may be greater than the thickness of the first metal layer M1. The third metal layer M3 may be disposed on the lower surface of the first dielectric layer 111 before forming the seed layer. Thus, the third metal layer M3 may be disposed between the lower surface of the first dielectric layer 111 and the first metal layer M1. The thickness of the third metal layer M3 may be greater than the thickness of the first metal layer M1 and less than the thickness of the second metal layer M2.

[0071] The pad patterns 124 and 125 may connect the antenna 100A to an antenna substrate or the like. For example, the upper surface of the first pad pattern 124 may be connected to the patch pattern 121 through a through hole 126 that penetrates the first dielectric layer 111, and the lower surface of the first pad pattern 124 may be connected to the feed pattern of the antenna substrate through a connecting metal, a feed through hole, etc. In addition, a plurality of second pad patterns 125 may be disposed to surround the first pad pattern 124 in a plane, and the lower surface of each of the plurality of second pad patterns 125 may be connected to the ground pattern of the antenna substrate through a connecting metal, a connecting through hole, etc.

[0072] The via-through hole 126 may include a metallic material. Copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof may be used as the metallic material. The via-through hole 126 may be formed by a plating process such as MASP, TT, etc. Thus, the via-through hole 126 may include a first metal layer M1 disposed on the wall of the via hole 125V formed in the first dielectric layer 111 and a second metal layer M2 disposed on the first metal layer M1. The second metal layer M2 may fill the via hole 125V, and the first metal layer M1 is disposed between the wall of the via hole 125V and the second metal layer M2. The via-through hole 126 may be used as a feed-through hole in the antenna 100A.

[0073] Figure 6 is a cross-sectional view showing Figure 5 a modified example of the antenna shown in

[0074] Referring to Figure 6 , different from the antenna 100A described in the foregoing exemplary embodiment, in the antenna 100B of the modified example, the first coupling pattern 122 and the second coupling pattern 123 may be formed by an MSAP process. Thus, the first coupling pattern 122 may include a fourth metal layer M4 (such as a metal foil, etc.) disposed on the upper surface of the second dielectric layer 112, and may further include a sixth metal layer M6 disposed on the fourth metal layer M4. The sixth metal layer M6 may be formed by an electroplating process, and the thickness of the sixth metal layer M6 may be greater than the thickness of the fourth metal layer M4. Additionally, the second coupling pattern 123 may include a fifth metal layer M5 (such as a metal foil, etc.) disposed on the upper surface of the third dielectric layer 113, and may further include a seventh metal layer M7 disposed on the fifth metal layer M5. The seventh metal layer M7 may be formed by an electroplating process, and the thickness of the seventh metal layer M7 may be greater than the thickness of the fifth metal layer M5. The description of other elements is substantially the same as that in the foregoing exemplary embodiment, and thus their detailed description will not be provided.

[0075] Figure 7 is a cross-sectional view showing Figure 5 another modified example of the antenna shown in

[0076] Referring to Figure 7, different from the antenna 100A described in the foregoing exemplary embodiment, in the antenna 100C in the modified example, the patch pattern 121 can be formed by the SAP process. Therefore, the patch pattern 121 can include a first metal layer M1 and a second metal layer M2, and may not include the third metal layer M3. In other words, the patch pattern 121 can be formed using electroless plating layers and electrolytic plating layers without a metal foil. Similarly, the pad patterns 124 and 125 can include a first metal layer M1 and a second metal layer M2, and may not include the above-mentioned third metal layer M3. Additionally, the first coupling pattern 122 and the second coupling pattern 123 can be formed by the SAP process. Therefore, the first coupling pattern 122 can include a fourth metal layer M4 (a seed layer formed on the upper surface of the second dielectric layer 112 by an electroless plating process instead of a metal foil) and a sixth metal layer M6 formed on the fourth metal layer M4 by an electrolytic plating process based on the fourth metal layer M4. The thickness of the sixth metal layer M6 can be greater than the thickness of the fourth metal layer M4. The second coupling pattern 123 can include a fifth metal layer M5 (a seed layer formed on the upper surface of the third dielectric layer 113 by an electroless plating process instead of a metal foil) and a seventh metal layer M7 formed on the fifth metal layer M5 by an electrolytic plating process based on the fifth metal layer M5. The thickness of the seventh metal layer M7 can be greater than the thickness of the fifth metal layer M5. The descriptions of other elements are substantially the same as those in the foregoing exemplary embodiment, and thus their detailed descriptions will not be provided.

[0077] Figure 8 is a cross-sectional view showing another example of the antenna.

[0078] Refer to Figure 8 , compared with the antenna 100A described in the foregoing exemplary embodiment, in the antenna 100D in another exemplary embodiment, the through-hole 126 can include the first metal layer M1 and the second metal layer M2 as described above, and the second metal layer M2 can be conformally disposed on the first metal layer M1. In this case, the through-hole 126 can further include an ink layer I that fills the via hole 125V, and the second metal layer M2 is disposed between the ink layer I and the first metal layer M1. The ink layer I can be formed by an ink plugging process. A thermoplastic insulating material or a thermosetting insulating material or a commonly used plugging material (such as a conductive ink) can be used as the ink layer I. The descriptions of other elements are substantially the same as those in the foregoing exemplary embodiment, and thus their detailed descriptions will not be provided.

[0079] Figure 9 is a view showing Figure 8 a modified example of the antenna shown in

[0080] Refer to Figure 9, different from the antenna 100D described in the foregoing exemplary embodiment, in the antenna 100E of the modified example, the first coupling pattern 122 and the second coupling pattern 123 can be formed by the MSAP process. Accordingly, the first coupling pattern 122 can include a fourth metal layer M4 (such as a metal foil) disposed on the upper surface of the second dielectric layer 112, and can also include a sixth metal layer M6 disposed on the fourth metal layer M4. The sixth metal layer M6 can be formed by an electrolytic plating process, and the thickness of the sixth metal layer M6 can be greater than the thickness of the fourth metal layer M4. The second coupling pattern 123 can include a fifth metal layer M5 (such as a metal foil) disposed on the upper surface of the third dielectric layer 113, and can also include a seventh metal layer M7 disposed on the fifth metal layer M5. The seventh metal layer M7 can be formed using an electrolytic plating layer, and the thickness of the seventh metal layer M7 can be greater than the thickness of the fifth metal layer M5. Descriptions of other elements are substantially the same as those in the foregoing exemplary embodiment, and thus their detailed descriptions will not be provided.

[0081] Figure 10 is a cross-sectional view showing Figure 8 another modified example of the antenna shown in

[0082] Referring to Figure 10 , different from the antenna 100D described in the foregoing exemplary embodiment, in the antenna 100F of the modified example, the patch pattern 121 can be formed by the SAP process. Accordingly, the patch pattern 121 can include a first metal layer M1 and a second metal layer M2 and can exclude the above-mentioned third metal layer M3. In other words, the patch pattern 121 can be formed using an electroless plating layer and an electrolytic plating layer without a metal foil. Similarly, the pad patterns 124 and 125 can include a first metal layer M1 and a second metal layer M2, and can exclude the above-mentioned third metal layer M3. Additionally, the first coupling pattern 122 and the second coupling pattern 123 can be formed by the SAP process. Accordingly, the first coupling pattern 122 can include a fourth metal layer M4 (a seed layer formed on the upper surface of the second dielectric layer 112 by an electroless plating process rather than a metal foil) and a sixth metal layer M6 formed on the fourth metal layer M4 by an electrolytic plating process based on the fourth metal layer M4. The thickness of the sixth metal layer M6 can be greater than the thickness of the fourth metal layer M4. The second coupling pattern 123 can include a fifth metal layer M5 (a seed layer formed on the upper surface of the third dielectric layer 113 by an electroless plating process rather than a metal foil) and a seventh metal layer M7 formed on the fifth metal layer M5 by an electrolytic plating process based on the fifth metal layer M5. The thickness of the seventh metal layer M7 can be greater than the thickness of the fifth metal layer M5. Descriptions of other elements are substantially the same as those in the foregoing exemplary embodiment, and thus their detailed descriptions will not be provided.

[0083] Figure 11 is a cross-sectional view showing another example of the antenna.

[0084] Referring to Figure 11 , in the antenna 100G in another exemplary embodiment, the through-hole 126 may include the first metal layer M1 and the second metal layer M2 as described above, and the second metal layer M2 may include a first dimple G1 and a second dimple G2 located on the upper surface and the lower surface of the second metal layer M2, respectively. Additionally, the through-hole 126 may further include an eighth metal layer M8 disposed on each of the upper surface and the lower surface of the second metal layer M2. The eighth metal layer M8 of the through-hole 126 may fill the first dimple G1 and the second dimple G2. The through-hole 126 may include a central region R1, and an upper region R2 and a lower region R3, and the central region R1 is interposed between the upper region R2 and the lower region R3. The upper region R2 may include a plurality of regions R2-1 and R2-2, and the lower region R3 may include a plurality of regions R3-1 and R3-2. The average grain size of the metal in the central region R1 may be smaller than the average grain size of the metal in the partial region R2-1 of the upper region R2 and the partial region R3-1 of the lower region R3. The through-hole 126 configured as above can effectively prevent voids formed in the process of filling the via hole 125V by the plating process. Each of the patch pattern 121, the first pad pattern 124, and the plurality of second pad patterns 125 may include the first metal layer M1, the second metal layer M2, and the third metal layer M3, and may further include the eighth metal layer M8. The eighth metal layer M8 of the patch pattern 121 and the eighth metal layer M8 of the first pad pattern 124 may be connected to the eighth metal layer M8 that fills the first dimple G1 and the second dimple G2 of the through-hole 126. The thickness of the eighth metal layer M8 may be greater than the thickness of each of the first metal layer M1, the second metal layer M2, and the third metal layer M3.

[0085] The second metal layer M2 may be formed by a pulse periodic reverse (PPR) electroplating process in which the direction of the pulse current is periodically reversible. For example, the second metal layer M2 may be formed on the first metal layer M1 by applying a current by the PPR method. The waveform conditions of the PPR may include more than one step (e.g., five or more steps), and the current density and time of each of the steps may be the same or may be different. In terms of controlling the growth rate of the plated grains as described above, it may be desirable to keep the average value Iavg of the current density, which is closely related to the plating rate, at 1.5 ASD or lower. In this case, the growth rate of the plated grains can be easily controlled to form the plurality of regions R1, R2, and R3 having the above average grain size. Therefore, the phenomenon of insufficient supply of metal ions in the process of forming the bridge layer by the plating process can be prevented, so that the formation of voids can be prevented. The eighth metal layer M8 may be formed by a direct current (DC) electroplating process. For example, the eighth metal layer M8 may be formed on the second metal layer M2 by the DC method through the plating process.

[0086] The description of other components is substantially the same as that in the foregoing exemplary embodiment, and thus detailed description thereof will not be provided.

[0087] Figure 12 is a diagram showing Figure 11 a cross-sectional view of a modified example of the antenna shown in

[0088] Referring to Figure 12 , different from the antenna 100G described in the foregoing exemplary embodiment, in the antenna 100H in the modified exemplary embodiment, the first coupling pattern 122 and the second coupling pattern 123 can be formed by an MSAP process. Accordingly, the first coupling pattern 122 can include a fourth metal layer M4 (such as a metal foil) disposed on the upper surface of the second dielectric layer 112, and can further include a sixth metal layer M6 disposed on the fourth metal layer M4. The sixth metal layer M6 can be formed by an electrolytic plating process, and the thickness of the sixth metal layer M6 can be greater than the thickness of the fourth metal layer M4. Additionally, the second coupling pattern 123 can include a fifth metal layer M5 (metal foil) disposed on the upper surface of the third dielectric layer 113, and can further include a seventh metal layer M7 disposed on the fifth metal layer M5. The seventh metal layer M7 can be formed by an electrolytic plating process, and the thickness of the seventh metal layer M7 can be greater than the thickness of the fifth metal layer M5. The description of other components is substantially the same as that in the foregoing exemplary embodiment, and thus detailed description thereof will not be provided.

[0089] Figure 13 is a diagram showing Figure 11 a cross-sectional view of another modified example of the antenna shown in

[0090] Referring to Figure 13, different from the antenna 100G described in the foregoing exemplary embodiment, in the antenna 100I in the modified exemplary embodiment, the patch pattern 121 can be formed by the SAP process. Accordingly, the patch pattern 121 can include a first metal layer M1, a second metal layer M2, and an eighth metal layer M8, and may not include a third metal layer M3. In other words, the patch pattern 121 can be formed using electroless plating layers and electrolytic plating layers without metal foils. Similarly, the pad patterns 124 and 125 can include a first metal layer M1, a second metal layer M2, and an eighth metal layer M8, and may not include the above-described third metal layer M3. Additionally, the first coupling pattern 122 and the second coupling pattern 123 can be formed by the SAP process. Accordingly, the first coupling pattern 122 can include a fourth metal layer M4 (a seed layer formed on the upper surface of the second dielectric layer 112 by an electroless plating process rather than a metal foil) and a sixth metal layer M6 formed on the fourth metal layer M4 by an electrolytic plating process based on the fourth metal layer M4. The thickness of the sixth metal layer M6 can be greater than the thickness of the fourth metal layer M4. The second coupling pattern 123 can include a fifth metal layer M5 (a seed layer formed on the upper surface of the third dielectric layer 113 by an electroless plating process rather than a metal foil) and a seventh metal layer M7 formed on the fifth metal layer M5 by an electrolytic plating process based on the fifth metal layer M5. The thickness of the seventh metal layer M7 can be greater than the thickness of the fifth metal layer M5. The descriptions of other elements are substantially the same as those in the foregoing exemplary embodiment, and thus their detailed descriptions will not be provided.

[0091] According to the foregoing exemplary embodiment, an antenna that can improve efficiency and can have a reduced size can be provided.

[0092] Additionally, an antenna that can cover a radio frequency band can be provided.

[0093] Furthermore, an antenna that can improve the matching characteristics between patterns formed in different layers can be provided.

[0094] In the exemplary embodiment, for ease of description, terms such as "side", "side surface", etc. can be used to indicate a surface formed by cutting along the left / right direction with respect to a cross-section in the drawing, terms such as "upper side", "upper part", "upper surface", etc. can be used to indicate a surface formed along the upward direction with respect to a cross-section in the drawing, and terms such as "lower side", "lower part", "lower surface", etc. can be used to indicate a surface formed along the downward direction with respect to a cross-section in the drawing. The concept that an element is disposed on a side region, upper side, upper region, or lower region can include a configuration in which the element is in direct contact with an element configured as a reference in the corresponding direction and a configuration in which the element is not in direct contact with the element configured as a reference. However, the terms can be defined as above for ease of description, and the scope of rights of the exemplary embodiment is not specifically limited to the above terms.

[0095] In an exemplary embodiment, the term "connected" may not only indicate "directly connected", but may also include "indirect connection" by means of an adhesive layer or the like. Additionally, the term "electrically connected" may include both cases where elements are "physically connected" and cases where elements are "not physically connected". Further, terms such as "first", "second", etc. may be used to distinguish one element from another element, and may not limit the order and / or importance or others related to the element. In some cases, without departing from the scope of the claims of the exemplary embodiment, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0096] In an exemplary embodiment, the term "exemplary embodiment" may not indicate one and the same exemplary embodiment, but may be provided to describe and emphasize the different unique features of each exemplary embodiment. The exemplary embodiments proposed above may be implemented without excluding the possibility of combining the features with other exemplary embodiments. For example, unless otherwise indicated, even if the features described in one exemplary embodiment are not described in another exemplary embodiment, the description may be understood as being related to another exemplary embodiment.

[0097] Parameters for describing 1-D specifications of elements (including but not limited to "length", "width", "thickness", "diameter", "distance", "gap", and / or "size"), 2-D specifications of elements (including but not limited to "area" and / or "size"), 3-D specifications of elements (including but not limited to "volume" and / or "size"), and characteristics of elements (including but not limited to "roughness", "density", "weight", "weight ratio", and / or "mole ratio") may be obtained by the methods and / or tools described in the present disclosure. However, the present disclosure is not limited thereto. Other methods and / or tools understood by those of ordinary skill in the art may be used even if not described in the present disclosure.

[0098] Although the exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the invention defined by the appended claims.

Claims

1. An antenna, comprising: A first dielectric layer having a first surface and a second surface opposite to the first surface; A second dielectric layer having a third surface and a fourth surface opposite to the third surface; A third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; A first adhesive layer disposed between the second surface and the third surface; A second adhesive layer disposed between the fourth surface and the fifth surface; A patch pattern disposed on the second surface and embedded in the first adhesive layer; A first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and A second coupling pattern disposed on the sixth surface, wherein the patch pattern, the first coupling pattern, and the second coupling pattern at least partially overlap each other in a plane, and wherein the dielectric constant of each of the first dielectric layer and the third dielectric layer is greater than the dielectric constant of the second dielectric layer.

2. The antenna according to claim 1, wherein, The dielectric constant of each of the first dielectric layer and the third dielectric layer is also greater than the dielectric constant of the first adhesive layer.

3. The antenna according to claim 2, wherein The dielectric constant of the second adhesive layer is greater than the dielectric constant of the first adhesive layer.

4. The antenna according to claim 1, wherein, Each of the first dielectric layer, the second dielectric layer, and the third dielectric layer includes an organic binder and an inorganic filler.

5. The antenna according to claim 4, Among them, wherein the organic binder includes polytetrafluoroethylene, and wherein the inorganic filler includes a ceramic filler.

6. The antenna according to claim 4, wherein Each of the first dielectric layer, the second dielectric layer, and the third dielectric layer further includes woven glass fibers.

7. The antenna according to claim 1, Among them, wherein the thickness of each of the first dielectric layer and the third dielectric layer is greater than the thickness of the second dielectric layer, and wherein the thickness of the second dielectric layer is greater than the thickness of each of the first adhesive layer and the second adhesive layer.

8. The antenna according to claim 1, wherein The patch pattern includes a first metal layer disposed on the second surface and a second metal layer disposed on the first metal layer, and the thickness of the second metal layer is greater than the thickness of the first metal layer.

9. The antenna according to claim 8, wherein, The patch pattern further includes a third metal layer disposed between the second surface and the first metal layer, and the thickness of the third metal layer is greater than the thickness of the first metal layer and less than the thickness of the second metal layer.

10. The antenna according to claim 1, Among them, wherein the first coupling pattern only includes a fourth metal layer disposed on the fourth surface, and wherein the second coupling pattern only includes a fifth metal layer disposed on the sixth surface.

11. The antenna according to claim 1, Among them, wherein the first coupling pattern includes a fourth metal layer disposed on the fourth surface and a sixth metal layer disposed on the fourth metal layer, and the thickness of the sixth metal layer is greater than the thickness of the fourth metal layer, and wherein the second coupling pattern includes a fifth metal layer disposed on the sixth surface and a seventh metal layer disposed on the fifth metal layer, and the thickness of the seventh metal layer is greater than the thickness of the fifth metal layer.

12. The antenna according to claim 1, wherein the antenna further comprises: A first pad pattern disposed on the first surface; A via hole penetrating through the first dielectric layer and connecting the patch pattern to the first pad pattern; And A plurality of second pad patterns disposed on the first surface and surrounding the first pad pattern in a plane.

13. The antenna according to claim 12, wherein The via hole comprises: a first metal layer disposed on the wall of a via hole formed in the first dielectric layer; and a second metal layer disposed on the first metal layer and within the via hole, and the first metal layer is disposed between the wall of the via hole and the second metal layer.

14. The antenna according to claim 13, Among them, The second metal layer has a first recess and a second recess respectively on one surface and the other surface of the second metal layer, wherein an average grain size of the metal in a central region of the via hole of the second metal layer is smaller than an average grain size of the metal in a partial region on one side of the via hole and an average grain size of the metal in a partial region on the other side of the via hole, the central region of the via hole is disposed between the one side and the other side of the via hole, and wherein the via hole further comprises an eighth metal layer disposed on the one surface and the other surface of the second metal layer and filling the first recess and the second recess.

15. The antenna according to claim 12, wherein, The via hole comprises: a first metal layer disposed on the wall of a via hole formed in the first dielectric layer; a second metal layer conformally disposed on the first metal layer; and an ink layer disposed within the via hole, and the second metal layer is disposed between the ink layer and the first metal layer.

16. An antenna, comprising: A main body portion including a plurality of dielectric layers and a plurality of adhesive layers disposed between the plurality of dielectric layers; And A pattern portion including a patch pattern disposed in the main body portion and one or more coupling patterns disposed in or on the main body portion, wherein a dielectric constant of each of the uppermost dielectric layer and the lowermost dielectric layer among the plurality of dielectric layers is greater than a dielectric constant of an intermediate dielectric layer disposed between the uppermost dielectric layer and the lowermost dielectric layer among the plurality of dielectric layers.

17. An antenna, comprising: A main body portion including alternately disposed dielectric layers and adhesive layers; A pattern portion including a patch pattern protruding from a first surface of one of the dielectric layers and embedded in one of the adhesive layers, and including one or more coupling patterns respectively disposed on other dielectric layers among the dielectric layers; A pad pattern protruding from a second surface of the one of the dielectric layers opposite to the first surface; And A via hole disposed in the one of the dielectric layers and connecting the patch pattern to the pad pattern, and Among them, the dielectric constant of each of the uppermost dielectric layer and the lowermost dielectric layer in the dielectric layer is greater than the dielectric constant of the intermediate dielectric layer disposed between the uppermost dielectric layer and the lowermost dielectric layer in the dielectric layer.

18. The antenna according to claim 17, Among them, One of the dielectric layers in the dielectric layer is the lowermost dielectric layer.

19. The antenna according to claim 18, wherein, The dielectric constant of one adhesive layer in which the patch pattern is embedded in the adhesive layer is less than the dielectric constant of the other adhesive layer in the adhesive layer.

20. The antenna according to claim 18, wherein Each of the uppermost dielectric layer and the lowermost dielectric layer includes an organic binder and ceramic fillers.

21. An antenna, comprising: A first dielectric layer having a first surface and a second surface opposite to the first surface; A second dielectric layer having a third surface and a fourth surface opposite to the third surface; A third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; A first adhesive layer disposed between the second surface and the third surface; A second adhesive layer disposed between the fourth surface and the fifth surface; A patch pattern disposed on the second surface and embedded in the first adhesive layer; A first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and A second coupling pattern disposed on the sixth surface, wherein the patch pattern, the first coupling pattern, and the second coupling pattern overlap at least partially with each other in a plane, wherein the patch pattern includes a first metal layer disposed on the second surface and a second metal layer disposed on the first metal layer, and the thickness of the second metal layer is greater than the thickness of the first metal layer, and wherein the patch pattern further includes a third metal layer disposed between the second surface and the first metal layer, and the thickness of the third metal layer is greater than the thickness of the first metal layer and less than the thickness of the second metal layer.

22. An antenna, comprising: A first dielectric layer having a first surface and a second surface opposite to the first surface; A second dielectric layer having a third surface and a fourth surface opposite to the third surface; A third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; A first adhesive layer disposed between the second surface and the third surface; A second adhesive layer disposed between the fourth surface and the fifth surface; A patch pattern disposed on the second surface and embedded in the first adhesive layer; A first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and A second coupling pattern disposed on the sixth surface, wherein the patch pattern, the first coupling pattern, and the second coupling pattern overlap at least partially with each other in a plane, and wherein the first coupling pattern includes a fourth metal layer disposed on the fourth surface and a sixth metal layer disposed on the fourth metal layer, and the thickness of the sixth metal layer is greater than the thickness of the fourth metal layer, and Wherein, the second coupling pattern includes a fifth metal layer disposed on the sixth surface and a seventh metal layer disposed on the fifth metal layer, and the thickness of the seventh metal layer is greater than the thickness of the fifth metal layer.

23. An antenna, comprising: A first dielectric layer having a first surface and a second surface opposite to the first surface; A second dielectric layer having a third surface and a fourth surface opposite to the third surface; A third dielectric layer having a fifth surface and a sixth surface opposite to the fifth surface; A first adhesive layer disposed between the second surface and the third surface; A second adhesive layer disposed between the fourth surface and the fifth surface; A patch pattern disposed on the second surface and embedded in the first adhesive layer; A first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and A second coupling pattern disposed on the sixth surface, Wherein, the patch pattern, the first coupling pattern and the second coupling pattern overlap at least partially with each other in a plane, The antenna further comprises: A first pad pattern disposed on the first surface; A through hole penetrating the first dielectric layer and connecting the patch pattern to the first pad pattern; and A plurality of second pad patterns disposed on the first surface and surrounding the first pad pattern in a plane, Wherein, the through hole comprises: a first metal layer disposed on the wall of a via hole provided in the first dielectric layer; and a second metal layer disposed on the first metal layer and disposed in the via hole, and the first metal layer is disposed between the wall of the via hole and the second metal layer, Wherein, the second metal layer has a first recess and a second recess on one surface and the other surface of the second metal layer respectively, Wherein, the average grain size of the metal in the central region of the via hole is smaller than the average grain size of the metal in a partial region on one side of the via hole and the average grain size of the metal in a partial region on the other side of the via hole, the central region of the via hole is disposed between the one side of the via hole and the other side of the via hole, and Wherein, the through hole further comprises an eighth metal layer, and the eighth metal layer is disposed on the one surface and the other surface of the second metal layer and fills the first recess and the second recess.

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