antenna

Abstract

An antenna includes a first dielectric layer having a first surface and a second surface, a second dielectric layer having a third surface and a fourth surface, and a reinforcement layer disposed between the first dielectric layer and the second dielectric layer and including an insulating material. A first adhesive layer is disposed between the first dielectric layer and the reinforcement layer, and a second adhesive layer is disposed between the second dielectric layer and the reinforcement layer. A first pattern layer is disposed on a surface of the first dielectric layer facing the first adhesive layer, and a second pattern layer is disposed on a surface of the second dielectric layer facing away from the second adhesive layer. The reinforcement layer has a first cavity that penetrates an area between the first dielectric layer and the second dielectric layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0045139, filed on April 14, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The disclosure relates to an antenna, and more particularly, to a patch type patch antenna. BACKGROUND

[0003] Mobile communication data traffic has been increasing year by year. Various technologies have been actively developed to support the rapidly growing demand for real-time data throughput in wireless networks. For example, conversion of data to content based on Internet of Things (IoT), augmented reality (AR), virtual reality (VR), real-time VR / AR linked with social network service (SNS), autonomous driving function, and applications such as a synchronous view (transmission of real-time images from the user's perspective using a compact camera) can require communication (e.g., 5G communication, mmWave communication, etc.) that supports the transmission and reception of a large amount of data. Therefore, research on millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively conducted, and research on commercialization / standardization of an antenna that can smoothly implement such communication has also been actively conducted. SUMMARY

[0004] An aspect of the disclosure is to provide an antenna that can improve antenna performance and can stably obtain improved antenna performance and can have improved reliability.

[0005] Another aspect of the disclosure is to provide an antenna that can improve efficiency and can have a reduced size.

[0006] According to an aspect of the disclosure, an antenna is configured as a patch antenna in which a reinforcing layer having high strength and a bonding layer having a low dielectric constant can be introduced together between dielectric layers having a high dielectric constant, and a cavity can be formed in the reinforcing layer.

[0007] For example, according to an aspect of the disclosure, an antenna includes a first dielectric layer having a first surface and a second surface opposite the first surface, a second dielectric layer having a third surface and a fourth surface opposite the third surface, a reinforcement layer disposed between the first dielectric layer and the second dielectric layer, having a fifth surface and a sixth surface opposite the fifth surface, and including an insulating material. A first adhesive layer is disposed between the second surface of the first dielectric layer and the fifth surface of the reinforcement layer, and a second adhesive layer is disposed between the third surface of the second dielectric layer and the sixth surface of the reinforcement layer. A first pattern layer is disposed on the second surface of the first dielectric layer, and a second pattern layer is disposed on the fourth surface of the second dielectric layer. The reinforcement layer has a first cavity that penetrates a region between the fifth surface and the sixth surface.

[0008] For example, according to an aspect of the disclosure, an antenna includes a main body portion including a plurality of dielectric layers and a plurality of adhesive layers disposed between the plurality of dielectric layers. A pattern portion includes a first pattern layer disposed in the main body portion and a second pattern layer disposed on the main body portion. A dielectric layer of the plurality of dielectric layers, which is disposed between the plurality of adhesive layers, has a cavity that is partially overlapped with each of the first pattern layer and the second pattern layer in a stacking direction of the dielectric layer and the adhesive layer.

[0009] According to another aspect of the disclosure, an antenna includes a first dielectric layer and a second dielectric layer stacked, a third dielectric layer disposed between the first dielectric layer and the second dielectric layer, and a first conductive pattern and a second conductive pattern disposed on different dielectric layers of the first dielectric layer, the second dielectric layer, and the third dielectric layer. A composition of the third dielectric layer is different from compositions of the first dielectric layer and the second dielectric layer, and the third dielectric layer provides a cavity extending between the first dielectric layer and the second dielectric layer. BRIEF DESCRIPTION OF DRAWINGS

[0010] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a block diagram illustrating an example of an electronic device system;

[0012] Figure 2 is a plan view illustrating an example of an electronic device;

[0013] Figure 3 is a perspective view illustrating an example of an antenna module;

[0014] Figure 4 is a perspective view illustrating an example of an antenna;

[0015] Figure 5 is a perspective view showing the internal region of the antenna shown in Figure 4

[0016] Figure 6 is a perspective view showing the internal region of the antenna shown in Figure 4

[0017] Figures 7A-7F is a perspective view showing the internal region of the antenna shown in Figure 6

[0018] Figures 8A-8C is a perspective view showing the internal region of the antenna shown in Figure 6

[0019] Figure 9 is a perspective view showing another example of an antenna;

[0020] Figure 10 is a perspective view showing the internal region of the antenna shown in Figure 9

[0021] Figure 11 is a perspective view showing the internal region of the antenna shown in Figure 9

[0022] Figure 12 is a perspective view showing another example of an antenna;

[0023] Figure 13 is a perspective view showing the internal region of the antenna shown in Figure 12

[0024] Figure 14 is a perspective view showing the internal region of the antenna shown in Figure 12

[0025] Figure 15 is a perspective view showing another example of an antenna;

[0026] Figure 16 is a perspective view showing the internal region of the antenna shown in Figure 15

[0027] Figure 17 is a perspective view showing the internal region of the antenna shown in Figure 15

[0028] Figure 18 is a perspective view showing another example of an antenna;

[0029] Figure 19 is a perspective view showing the internal region of the antenna shown in Figure 18 ​​​​​​​​​​is a perspective view of an internal region of the antenna shown in

[0030] Figure 20 is a perspective view of another example of an antenna; Figure 18 is a cross-sectional view of the antenna shown in

[0031] Figure 21 is a perspective view of another example of an antenna;

[0032] Figure 22 is a perspective view of another example of an antenna; Figure 21 is a perspective view of an internal region of the antenna shown in

[0033] Figure 23 is a perspective view of another example of an antenna; Figure 21 is a cross-sectional view of the antenna shown in

[0034] Figure 24 is a perspective view of another example of an antenna;

[0035] Figure 25 is a perspective view of another example of an antenna; Figure 24 is a perspective view of an internal region of the antenna shown in

[0036] Figure 26 is a perspective view of another example of an antenna; Figure 24 is a cross-sectional view of the antenna shown in

[0037] Figure 27 is a perspective view of another example of an antenna;

[0038] Figure 28 is a perspective view of another example of an antenna; Figure 27 is a perspective view of an internal region of the antenna shown in

[0039] Figure 29 is a perspective view of another example of an antenna; Figure 27 is a cross-sectional view of the antenna shown in DETAILED DESCRIPTION

[0040] Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings. In the drawings, the shape, size, etc. of elements can be exaggerated or schematically shown for the sake of clarity of explanation and description.

[0041] Figure 1 is a block diagram showing an example of an electronic device system.

[0042] Referring to Figure 1The electronic device 1000 can accommodate therein a main board 1010. The main board 1010 can include chip-related components 1020, network-related components 1030, other components 1040, etc. physically or electrically connected thereto. These components can be connected to other components to be described below through various signal lines 1090.

[0043] The chip-related components 1020 can include a memory chip such as a volatile memory (e.g., a dynamic random access memory (DRAM)), a non-volatile memory (e.g., a read only memory (ROM)), a flash memory, etc.; an application processor chip such as a central processing unit (e.g., a central processing unit (CPU)), a graphics processing unit (e.g., a graphics processing unit (GPU)), a digital signal processor, a cryptographic processor, a microprocessor, a microcontroller, etc.; and a logic chip such as an analog-to-digital converter (ADC), an application specific integrated circuit (ASIC), etc. However, the chip-related components 1020 are not limited thereto, but can also include other types of chip-related components. Also, the chip-related components 1020 can be combined with each other.

[0044] The network-related components 1030 can include components compatible with and / or implementing protocols such as, for example, wireless fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 family, etc.), worldwide interoperability for microwave access (WiMAX) (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (LTE), evolved data only (Ev-DO), high speed packet access+ (HSPA+), high speed downlink packet access+ (HSDPA+), high speed uplink packet access+ (HSUPA+), enhanced data GSM environment (EDGE), global system for mobile communications (GSM), global positioning system (GPS), general packet radio service (GPRS), code division multiple access (CDMA), time division multiple access (TDMA), digital enhanced cordless telecommunications (DECT), Bluetooth, 3G protocols, 4G protocols, and 5G protocols, and any other wireless protocol and wired protocol designated after the above protocols. However, the network-related components 1030 are not limited thereto, but can also include components compatible with or implementing various other wireless standards or protocols or wired standards or protocols. Also, the network-related components 1030 can be combined with the above-described chip-related components 1020 together with each other.

[0045] The other components 1040 can include a high frequency inductor, a ferrite inductor, a power inductor, a ferrite bead, a low temperature co-fired ceramic (LTCC), an electromagnetic interference (EMI) filter, a multi-layer ceramic capacitor (MLCC), etc. However, the other components 1040 are not limited thereto, but can also include passive components for various other purposes, etc. Further, the other components 1040 can be combined with each other together with the above-described chip-related components 1020 or network-related components 1030.

[0046] According to the type of the electronic device 1000, the electronic device 1000 can include other components that can or can not be physically and / or electrically connected to the main board 1010. These other components can include, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, an audio codec (not shown), a video codec (not shown), a power amplifier (not shown), a compass (not shown), an accelerometer (not shown), a gyroscope (not shown), a speaker (not shown), a mass storage unit (e.g., a hard disk drive) (not shown), a compact disc (CD) drive (not shown), a digital versatile disc (DVD) drive (not shown), etc. However, these other components are not limited thereto, but can also include other components for various purposes, etc., according to the type of the electronic device 1000, etc.

[0047] The electronic device 1000 can be a smart phone, a personal digital assistant (PDA), a digital camera, a camcorder, a web system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, a car component, etc. However, the electronic device 1000 is not limited thereto, but can be any other electronic device that processes data.

[0048] Figure 2 is a plan view showing an example of an electronic device.

[0049] Referring to Figure 2For example, the electronic device can be a smart phone 1100. In the smart phone 1100, a modem 1101 can be provided, and various types of antenna modules 1102, 1103, 1104, 1105, and 1106 connected to the modem 1101 through a rigid printed circuit board, a flexible printed circuit board, and / or a rigid-flex printed circuit board can be provided. If necessary, a Wi-Fi module 1107 can also be provided. The antenna modules 1102, 1103, 1104, 1105, and 1106 can include antenna modules 1102, 1103, 1104, and 1105 for various frequency ranges for 5G mobile communication (such as an antenna module 1102 for a 3.5 GHz band, an antenna module 1103 for a 5 GHz band, an antenna module 1104 for a 28 GHz band, an antenna module 1105 for a 39 GHz band, etc.), and can also include other antenna modules 1106 for 4G communication, but example embodiments are not limited thereto. The electronic device is not limited to the smart phone 1100, and can be implemented by other electronic devices described above.

[0050] Figure 3 is a perspective view showing an example of an antenna module.

[0051] Referring to Figure 3 , the antenna module 800 in example embodiments can include an antenna substrate 500 and a plurality of antennas 100 mounted on an upper surface of the antenna substrate 500. Each of the antennas 100 can be configured as a chip-type patch antenna. The "chip" in the chip-type antenna can indicate that the antennas 100 can be individually manufactured with respect to the antenna substrate 500 providing a mounting space of the antennas 100 and can be mounted on the substrate. Each of the antennas 100 can be surface-mounted on the antenna substrate 500 using a connection metal member such as solder, etc. As shown in Figure 3 , the antennas 100 can be provided in a 1x4 arrangement, but example embodiments are not limited thereto. If necessary, the antennas 100 can be provided in various forms such as in a 1x2 or 2x2 arrangement. If necessary, electronic components can be mounted on a lower surface of the antenna substrate 500. The electronic components can include a radio frequency integrated circuit (RFIC), a power management integrated circuit (PMIC), etc. For example, the electronic components can further include chip-type passive components such as a chip-type capacitor or a chip-type inductor. The electronic components can be surface-mounted on the antenna substrate 500 using a connection metal member such as solder, etc.

[0052] The antenna substrate 500 can be configured as a multi-layer printed circuit board (PCB) including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers. The antenna substrate 500 can include a first area including a plurality of first insulating layers, a plurality of first wiring layers, and a plurality of first via layers, and a second area including a plurality of second insulating layers, a plurality of second wiring layers, and a plurality of second via layers. In a thickness direction, the first area can be disposed on an upper side of the antenna substrate 500, and the second area can be disposed on a lower side of the antenna substrate 500. The first area can function as an antenna member, and the second area can function as a redistribution member. For example, at least a portion of the plurality of first insulating layers can include a material having a dielectric loss factor (Df) lower than that of at least a portion of the plurality of second insulating layers.

[0053] The plurality of first insulating layers can include a laminate in which thermoplastic resin layers and thermosetting resin layers are alternately stacked. The thermoplastic resin layers can include a material effective for transmission of a radio frequency signal, and the thermosetting resin layers can include a material favorable for transmission of a radio frequency signal and having adhesiveness. By using the multi-layer resin layers, an insulator that can be favorable for transmission of a radio frequency signal and can have improved adhesiveness can be provided. The plurality of first wiring layers can be respectively disposed on the thermoplastic resin layers, and can be embedded in the thermosetting resin layers, and can be connected to each other through the plurality of first via layers. Each of the plurality of first via layers can simultaneously penetrate adjacent thermoplastic resin layers and thermosetting resin layers.

[0054] As the thermoplastic resin layers, in terms of radio frequency signal transmission, liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), polyimide (PI), or the like can be used. The dielectric loss factor (Df) can be adjusted according to the type of resin of the thermoplastic resin layer, the type of filler included in the resin, the content of the filler, or the like. The dielectric loss factor (Df) can be a value related to dielectric loss, and the dielectric loss can refer to a power loss generated when an alternating electric field is formed on a resin layer (dielectric material). The dielectric loss factor (Df) can be proportional to the dielectric loss, and the lower the dielectric loss factor (Df), the smaller the dielectric loss. In terms of radio frequency signal transmission, a thermoplastic resin layer having a low dielectric loss property can be favorable for reducing loss. The dielectric loss factor (Df) of the thermoplastic resin layer can be 0.003 or less, for example, 0.002 or less. In addition, the dielectric constant (Dk) of the thermoplastic resin layer can be 3.5 or less. For example, the dielectric constant (Dk) can be measured by using a vector network analyzer of a dielectric evaluation tool (DAK), but is not limited thereto.

[0055] As the thermosetting resin layer, polyphenylene ether (PPE), modified polyimide (PI), modified epoxy resin, etc. can be used in terms of radio frequency signal transmission. The dielectric loss factor (Df) can be adjusted according to the type of resin of the thermosetting resin layer, the type of filler included in the resin, the content of the filler, etc. The thermosetting resin layer having a low dielectric loss property can be advantageous in terms of radio frequency signal transmission to reduce loss. The dielectric loss factor (Df) of the thermosetting resin layer can be 0.003 or less, for example, 0.002 or less. In addition, the dielectric constant (Dk) of the thermosetting resin layer can be 3.5 or less.

[0056] The thickness of the thermoplastic resin layer can be greater than the thickness of the thermosetting resin layer. It can be desirable to have the above thickness relationship in terms of radio frequency signal transmission. The interface surfaces of the thermoplastic resin layer and the thermosetting resin layer, which are adjacent to each other, can include rough surfaces. The rough surface can refer to a surface having a sawtooth by being roughened. By including the rough surface, the thermoplastic resin layer and the thermosetting resin layer, which are adjacent to each other, can ensure adhesion acting toward each other.

[0057] The plurality of second insulating layers can include an insulating material. As the insulating material, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide resin, a material including a reinforcing material (including braided glass fiber and / or inorganic filler) together with the above-described resin, such as a prepreg, an ABF (Ajinomoto build-up film), a photosensitive dielectric (PID), etc. can be used.

[0058] The plurality of first wiring layers and the plurality of second wiring layers can include a metal material. As the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The plurality of first wiring layers and the plurality of second wiring layers can be formed by an additive process (AP), a semi-additive process (SAP), a modified semi-additive process (MSAP), a via-first method (TT), etc., and thus each of the plurality of first wiring layers and the plurality of second wiring layers can include a seed layer (non-electroplated layer) and an electroplated layer formed based on the seed layer. Each of the plurality of first wiring layers and the plurality of second wiring layers can perform various functions according to the design of the corresponding layer. For example, each of the plurality of first wiring layers and the plurality of second wiring layers can include a feed pattern, and can further include a ground pattern, a power pattern, a signal pattern, etc. Each pattern can include a line pattern, a plane pattern, and / or a pad pattern.

[0059] The plurality of first via layers and the plurality of second via layers can include a metal material. As the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The plurality of first via layers and the plurality of second via layers can be formed through a plating process such as AP, SAP, MSAP, TT, or the like, and thus each of the plurality of first via layers and the plurality of second via layers can include a seed layer (non-electroplated layer) and an electroplated layer formed based on the seed layer. The plurality of first via layers and the plurality of second via layers can perform various functions according to the design of the respective layers. For example, each of the plurality of first via layers and the plurality of second via layers can include a feed via for feed pattern connection, a signal via for signal connection, a ground via for ground connection, a power via for power connection, or the like. Each via can be completely filled with a metal material, or the metal material can be formed along the wall of the via hole, and can have various shapes such as a tapered shape or the like.

[0060] Figure 4 is a perspective view illustrating an example of an antenna.

[0061] Figure 5 is a perspective view illustrating an example of an antenna. Figure 4 is a perspective view illustrating an internal region of the antenna illustrated in

[0062] Figure 6 is a perspective view illustrating an example of an antenna. Figure 4 is a cross-sectional view taken along line I-I' of the antenna illustrated in

[0063] Referring to Figures 4-6In an example embodiment, the antenna 100A can include a main body part 110 and a pattern part 120. The main body part 110 can include a first dielectric layer 111, a second dielectric layer 112, a reinforcement layer 113 disposed between the first dielectric layer 111 and the second dielectric layer 112, a first adhesive layer 114 disposed between and connecting the first dielectric layer 111 and the reinforcement layer 113 to each other, and a second adhesive layer 115 disposed between and connecting the second dielectric layer 112 and the reinforcement layer 113 to each other. The pattern part 120 can include a first pattern layer 121 disposed on an upper surface of the first dielectric layer 111 and embedded in the first adhesive layer 114, and a second pattern layer 122 disposed on an outer surface (e.g., an upper surface) of the second dielectric layer 112. The first pattern layer 121 can include a patch pattern. The second pattern layer 122 can include a coupling pattern. The patch pattern and the coupling pattern can be partially overlapped with each other in a planar surface. If necessary, the pattern part 120 can further include a third pattern layer 123 disposed on a lower surface of the first dielectric layer 111, and a via hole layer 124 penetrating the first dielectric layer 111. The third pattern layer 123 can include a plurality of pad patterns. The via hole layer 124 can include a feed-through hole connecting at least one of the plurality of pad patterns to the patch pattern.

[0064] As described above, as the communication technology of the portable terminal device has developed from 4G to 5G, the frequency band for communication has been designed as a wide range and a multi-band. With the use of millimeter waves, the physical size of the receiver should be reduced, and the antenna used in the portable terminal device should have improved efficiency in implementing a wide frequency band, and should have a reduced size at the same time. According to this trend, the antenna, which is usually manufactured as a printed circuit board (PCB) having a multi-layer structure, can be manufactured as a chip antenna using a high Dk material to reduce its size, and a rigid-flexible PCB can be employed to improve efficiency, so that the radiation performance can be improved.

[0065] When implementing a patch antenna, the size of the antenna can be reduced by using a layer having a high dielectric constant (Dk), but the introduction of such a layer having a high dielectric constant can reduce the radiation efficiency. To solve the above problem, it can be considered to increase the radiation efficiency by introducing a layer having a low dielectric constant between layers having a high dielectric constant. For example, by introducing a layer having a low dielectric constant (Dk) to a portion that is less important in terms of size reduction, the overall effective dielectric constant (Dk) of the antenna can be reduced, so that the radiation efficiency can be increased. In this case, for example, since an element having the lowest dielectric constant (Dk) in a general environment can be air, it can be considered to form an air cavity in the above-described layer having a low dielectric constant (adhesive layer having a low dielectric constant). However, an adhesive sheet that can be generally used as an adhesive layer can have a relatively low strength, so that the adhesive sheet can have fragile reliability.

[0066] Unlike the above-described example, the antenna 100A in the example embodiment can be configured as a patch antenna including a main body part 110 and a pattern part 120 formed in the main body part 110, the main body part 110 can include first and second dielectric layers 111 and 112 and first and second adhesive layers 114 and 115 disposed between the first and second dielectric layers 111 and 112, and can further include a reinforcing layer 113 disposed between the first and second adhesive layers 114 and 115. A cavity 113H can be formed in the reinforcing layer 113. The reinforcing layer 113 can be configured as a dielectric layer whose dielectric constant (Dk) can be adjusted according to its material, and can have a strength stronger than the strength of the first and second adhesive layers 114 and 115, and can have, for example, an elastic modulus greater than the elastic modulus of the first and second adhesive layers 114 and 115. Accordingly, the antenna 100A configured as above can have improved antenna performance (e.g., gain, bandwidth, directivity, transmission and reception rate, radiation rate, etc.), and can stably obtain the above-described performance, and can further have improved reliability.

[0067] The reinforcing layer 113 can have one or more vent holes 113h connected to the cavity 113H on a plane and exposed to an outer side surface of the reinforcing layer 113. The reinforcing layer 113 can have a plurality of vent holes 113h, and the vent holes 113h can be disposed in different areas. When the antenna 100A receives a stress that changes the volume of the cavity 113H, the vent holes 113h can provide an air movement path of the cavity 113H, thereby reducing the influence of the stress applied to the antenna 100A. Accordingly, in the process of manufacturing the antenna 100A, a phenomenon in which the size or shape of the cavity 113H does not match the designed size or shape can be reduced, or factors that physically affect the first and second adhesive layers 114 and 115 and the reinforcing layer 113 can be reduced. Accordingly, based on the cavity 113H, improved performance (size-related bandwidth and gain) can be stably obtained.

[0068] In the following description, the elements of the antenna 100A of the example embodiment will be described in more detail with reference to the accompanying drawings.

[0069] The first dielectric layer 111, the first adhesive layer 114, the reinforcing layer 113, the second adhesive layer 115, and the second dielectric layer 112 included in the main body part 110, and the first pattern layer 121 and the second pattern layer 122 included in the pattern part 120 can be configured to be laminated in order. For example, the above structure can be implemented by the following lamination process: the first pattern layer 121 and the third pattern layer 123 can be formed on the upper surface and the lower surface of the first dielectric layer 111, respectively; the first adhesive layer 114 can be laminated on the first dielectric layer 111 (e.g., cover the first pattern layer 121 and embed the first pattern layer 121); the reinforcing layer 113 can be laminated on the first adhesive layer 114; the second adhesive layer 115 can be laminated on the reinforcing layer 113; and the second dielectric layer 112 can be laminated on the second adhesive layer 115, and the second pattern layer 122 can be formed on the upper surface of the second dielectric layer 112. In terms of the matching process, the lamination process can improve the matching performance between the pattern layers 121, 122, and 123 formed on different layers, and thus, the antenna performance can be improved.

[0070] The higher the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112, the shorter the wavelength of the radio frequency (RF) signal transmitted or propagated around the first dielectric layer 111 and the second dielectric layer 112 can be. The shorter the wavelength of the RF signal, the smaller the size of the first dielectric layer 111 and the second dielectric layer 112 can be, and thus, the antenna 100A can have a reduced size. The smaller the size of the antenna 100A, the more the number of the antenna 100A that can be arranged in a unit volume on an antenna substrate can be. The larger the number of the antenna 100A that can be arranged in a unit volume, the greater the total gain or maximum output related to a unit volume of a plurality of antennas 100A can be. Accordingly, the higher the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112, the more effectively the size-related performance of the antenna 100A can be improved.

[0071] The first dielectric layer 111 and the second dielectric layer 112 can be spaced apart from each other. Accordingly, a space between the first dielectric layer 111 and the second dielectric layer 112 can be formed with air or a medium having a dielectric constant lower than that of the first dielectric layer 111 and the second dielectric layer 112. Accordingly, the space between the first dielectric layer 111 and the second dielectric layer 112 and the boundary surface between the first dielectric layer 111 can form a first dielectric boundary condition, and the space between the first dielectric layer 111 and the second dielectric layer 112 and the boundary surface between the second dielectric layer 112 can form a second dielectric boundary condition. Since the first dielectric boundary condition and the second dielectric boundary condition can refract an RF signal, radiation through the patch pattern and / or the coupling pattern can be focused in the up-down direction (for example, the Z direction), and thus, the gain of the antenna 100A can be improved.

[0072] A dielectric constant (Dk) of each of the first dielectric layer 111 and the second dielectric layer 112 can be 6 or more, and the dielectric constants (Dk) of the first dielectric layer 111 and the second dielectric layer 112 can be the same as or different from each other. The first dielectric layer 111 and the second dielectric layer 112 can include a material having a high dielectric constant (Dk). For example, each of the first dielectric layer 111 and the second dielectric layer 112 can include an organic binder and an inorganic filler. As the organic binder, various types of polymers such as PTFE, epoxy resin, etc. can be used, and desirably, PTFE can be used. As the inorganic filler, various types of ceramic fillers such as silicon dioxide (SiO2), titanium dioxide (TiO2), aluminum oxide (Al2O3), etc. can be used. The ceramic filler can have various shapes such as an angular shape, a circular shape, etc., and can have various sizes (having a diameter of 50 µm or less).

[0073] For example, each of the first dielectric layer 111 and the second dielectric layer 112 can include a ceramic-polymer composite material. Such a composite material can have a high dielectric constant property by adjusting the content of the ceramic filler, and can ensure a significant level of processability and machinability. For example, as the processability is improved, large-area processing can be available. In addition, as the machinability is improved, a via process using a computer numerical control (CNC) drill or a laser can be easily performed. Accordingly, design rules can be improved so that, for example, it can be feasible to achieve a fine circuit through a plating process, and a via hole 124v having a reduced diameter can be applied. Accordingly, the advantages of a chip-type patch antenna can be obtained, and various problems caused according to defects in processability and machinability can be addressed.

[0074] Each of the first dielectric layer 111 and the second dielectric layer 112 can further include a reinforcing material. As the reinforcing material, for example, woven glass fiber can be used. For example, each of the first dielectric layer 111 and the second dielectric layer 112 can include a ceramic-polymer composite material impregnated in the woven glass fiber. Such a composite material including the woven glass fiber can have improved strength. Thus, improved handleability and processability can be ensured.

[0075] The materials of the first dielectric layer 111 and the second dielectric layer 112 are not limited to the above-described materials, and the first dielectric layer 111 and the second dielectric layer 112 can be configured as layers having a high dielectric constant formed using different materials. For example, the first dielectric layer 111 and the second dielectric layer 112 can be formed using a material having a relatively high dielectric constant such as a ceramic material including low-temperature co-fired ceramic (LTCC), a material having a relatively high dielectric constant such as a glass material, or a material such as Teflon, and can further include at least one of magnesium (Mg), silicon (Si), aluminum (Al), calcium (Ca), and titanium (Ti), so that the first dielectric layer 111 and the second dielectric layer 112 can have an increased dielectric constant or improved durability. For example, the first dielectric layer 111 and the second dielectric layer 112 can include Mg2SiO4, MgAlO4, or CaTiO3.

[0076] The reinforcing layer 113 can be a dielectric layer and can have strength. When the dielectric constant of at least a portion of the space between the first dielectric layer 111 and the second dielectric layer 112 is lower than the dielectric constant of the first adhesive layer 114 and the second adhesive layer 115, the bandwidth and the gain of the antenna 100A with respect to (or in relation to) the size thereof can be improved. Thus, the reinforcing layer 113 disposed between the first adhesive layer 114 and the second adhesive layer 115 can have a cavity 113H (the cavity 113H penetrates a region between the upper surface and the lower surface of the reinforcing layer 113), and the cavity 113H can be provided with a dielectric (for example, air) having a dielectric constant lower than the dielectric constant of the first adhesive layer 114 and the second adhesive layer 115, and thus, the size-related bandwidth and gain of the antenna 100A can be improved. Since the size and shape of the cavity 113H can affect the resonant frequency or performance of the antenna 100A, the antenna 100A can have a structure that can reduce a phenomenon in which the size or shape of the cavity 113H does not match the designed size or shape, thereby stably obtaining performance. By introducing the reinforcing layer 113, the antenna performance can be improved, and the performance of the antenna can be stably obtained, and reliability can also be improved.

[0077] Compared to the example in which the reinforcement layer 113 is not provided with the cavity 113H, the reinforcement layer 113 can have relatively weak structural stability since the reinforcement layer 113 is provided with the cavity 113H. For example, in a process of manufacturing the antenna 100A, when the first dielectric layer 111 and the second dielectric layer 112 are adhered to the reinforcement layer 113 through the first adhesive layer 114 and the second adhesive layer 115, the antenna 100A can receive stress that can cause a volume change of the cavity 113H, that can distort a size or a shape of the cavity 113H, or that can cause a crack in the first dielectric layer 111 and the second dielectric layer 112. Accordingly, since the antenna 100A can have a structure that can reduce factors that physically affect the reinforcement layer 113 in a process of manufacturing the antenna 100A, the antenna 100A can stably maintain a performance parameter.

[0078] For example, the reinforcement layer 113 can have one or more vent holes 113h connected to the cavity 113H on a plane and exposed to an outer side surface of the reinforcement layer 113. When the antenna 100A receives stress that causes a volume change of the cavity 113H, the vent holes 113h can provide an air movement path into and out of the cavity 113H, thereby reducing an effect of the stress applied to the antenna 100A. Accordingly, in a process of manufacturing the antenna 100A, a phenomenon in which a size or a shape of the cavity 113H does not match a designed size or shape can be reduced, or factors that physically affect the reinforcement layer 113 can be reduced. Accordingly, based on the cavity 113H, improved performance (a size-related bandwidth and gain) can be stably obtained. A plurality of vent holes 113h can be provided, and the plurality of vent holes 113h can be aligned with each other in a vent direction (for example, an X direction and / or a Y direction). Accordingly, an efficiency of air movement related to a width of the plurality of vent holes 113h can be improved.

[0079] The reinforcing layer 113 can include a material having a higher strength than the first adhesive layer 114 and the second adhesive layer 115. Also, the reinforcing layer 113 can include a material having a dielectric constant (Dk) relatively lower than the dielectric constant of the first adhesive layer 114 and the second adhesive layer 115. The reinforcing layer 113 can include an insulating material. For example, the reinforcing layer 113 can include, for example, an insulating material, an organic binder, and an inorganic filler, and by adjusting the content of the inorganic filler, the reinforcing layer 113 can have a dielectric constant (Dk) relatively lower than the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112. As the organic binder, various types of polymers such as PTFE, epoxy resin, etc. can be used, and desirably, PTFE can be used. As the inorganic filler, various types of ceramic fillers such as silicon dioxide (SiO2), titanium dioxide (TiO2), aluminum oxide (Al2O3), etc. can be used. The ceramic filler can have various shapes such as an angular shape, a circular shape, etc., and can have various sizes (having a diameter of 50 μm or less). Also, among the above-described materials, a reinforcing material such as a woven glass fiber can be employed, so that the reinforcing layer 113 can have an elastic modulus higher than the elastic modulus of the first adhesive layer 114 and the second adhesive layer 115. For example, the reinforcing layer 113 can be a ceramic-polymer composite material impregnated in a woven glass fiber.

[0080] The material of the reinforcing layer 113 is not limited to the above-described material, and can be configured as a dielectric layer having a high strength formed using a different material. For example, the reinforcing layer 113 can be formed using a material including a glass-based material such as Teflon, and if necessary, the reinforcing layer 113 can be formed using a substrate material such as a prepreg. The thickness of the reinforcing layer 113 can be smaller than the thickness of the first dielectric layer 111 and the second dielectric layer 112 to achieve improved antenna performance. Also, to achieve improved rigidity, the thickness of the reinforcing layer 113 can be greater than the thickness of the first adhesive layer 114 and the second adhesive layer 115.

[0081] The first adhesive layer 114 and the second adhesive layer 115 can adhere to the first dielectric layer 111, the second dielectric layer 112, and the reinforcement layer 113 between the first dielectric layer 111 and the second dielectric layer 112 and the reinforcement layer 113. Accordingly, a phenomenon in which at least one of the first dielectric layer 111 and the second dielectric layer 112 is separated from the reinforcement layer 113 can be prevented, and a gap between the first dielectric layer 111 and the second dielectric layer 112 and the reinforcement layer 113 can be stably maintained. The dielectric constant of the first adhesive layer 114 and the second adhesive layer 115 can be higher than the dielectric constant of air and less than the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112. The lower the dielectric constant of the space between the first dielectric layer 111 and the second dielectric layer 112, the greater the first dielectric boundary condition and the second dielectric boundary condition of the first dielectric layer 111 and the second dielectric layer 112 can affect an RF signal, the electromagnetic coupling concentration between the patch pattern and the coupling pattern can further increase, and the radiation through the patch pattern and / or the coupling pattern can be more concentrated in the up-and-down direction (for example, the Z direction).

[0082] The first adhesive layer 114 can include a material having a dielectric constant (Dk) lower than the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112 and an adhesive force superior to the adhesive force of the first dielectric layer 111 and the second dielectric layer 112 and the reinforcement layer 113. For example, the first adhesive layer 114 can include a polymer having a dielectric constant (Dk) lower than the dielectric constant of the first dielectric layer 111 and the second dielectric layer 112 and an adhesive force superior to the adhesive force of the first dielectric layer 111 and the second dielectric layer 112. As the polymer, LCP, PI, PTFE, epoxy, or the like can be used, but example embodiments are not limited thereto. In order to achieve improved antenna performance, the thickness of the first adhesive layer 114 can be less than the thickness of the first dielectric layer 111 and the second dielectric layer 112.

[0083] The second adhesive layer 115 can include a material having a dielectric constant (Dk) greater than the dielectric constant of the first adhesive layer 114 and an adhesive force superior to the adhesive force of the first dielectric layer 111 and the second dielectric layer 112 and the reinforcement layer 113. For example, the second adhesive layer 115 can include a polymer having a dielectric constant (Dk) greater than the dielectric constant of the first adhesive layer 114 and an adhesive force superior to the adhesive force of the first dielectric layer 111 and the second dielectric layer 112 and the reinforcement layer 113. As the polymer, LCP, PI, PTFE, epoxy, or the like can be used, but example embodiments are not limited thereto. In order to achieve improved antenna performance, the thickness of the second adhesive layer 115 can be less than the thickness of the first dielectric layer 111 and the second dielectric layer 112.

[0084] The first pattern layer 121 can include a metal material. As the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The first pattern layer 121 can include a patch pattern. When the antenna 100A is mounted on an antenna substrate, the patch pattern can receive an RF signal through a feed pattern and a feed via hole in the antenna substrate, and can transmit an RF signal in a thickness direction (Z direction), and for example, the RF signal received in the thickness direction can be delivered to an electronic component, such as an RFIC, mounted on the antenna substrate through the feed pattern and the feed via hole provided in the antenna substrate. For example, the patch pattern can have an inherent resonance frequency according to inherent elements such as shapes, sizes, heights, and dielectric constants of the dielectric layers 111 and 112, such as 28 GHz, 39 GHz, etc. For example, the patch pattern can be electrically connected to an electronic component, such as an RFIC, through a feed pattern and a feed via hole provided in the antenna substrate, so that the patch pattern can transmit and receive horizontal polar (H polar) RF signals and vertical polar (V polar) RF signals polarized to each other.

[0085] The second pattern layer 122 can also include a metal material. As the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The second pattern layer 122 can include a coupling pattern. The coupling pattern can be disposed on an upper side of the patch pattern, and for example, can be disposed in a thickness direction (Z direction), and can be partially overlapped with the patch pattern on a plane. Through electromagnetic coupling between the patch pattern and the coupling pattern, an additional resonance frequency close to the above-described inherent resonance frequency can be obtained, and thus a widened bandwidth can be obtained.

[0086] The third pattern layer 123 can also include a metal material. As the metal material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The third pattern layer 123 can include a plurality of pad patterns. The plurality of pad patterns can connect the antenna 100A to the antenna substrate. For example, at least one pad pattern (for example, a pad pattern connected to the patch pattern of the first pattern layer 121 through a feed via hole of the via hole layer 124) of the plurality of pad patterns can be connected to a feed pattern of the antenna substrate through a connection metal member such as solder. Further, at least another pad pattern (for example, a pad pattern disposed around the above-described pad pattern) of the plurality of pad patterns can be connected to a ground pattern of the antenna substrate through a connection metal member such as solder.

[0087] The via hole layer 124 can also include a metallic material. As the metallic material, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof can be used. The via hole layer 124 can include a feed-through hole connecting the patch pattern of the first pattern layer 121 to at least one of the plurality of pad patterns of the third pattern layer 123. However, example embodiments thereof are not limited thereto, and the via hole layer 124 can also include a ground-through hole for connecting the patch pattern of the first pattern layer 121 to another one of the plurality of pad patterns of the third pattern layer 123, if necessary.

[0088] Figures 7A-7F is an enlarged sectional view illustrating various examples of the region A shown in Figure 6

[0089] Referring to Figure 7A The first pattern layer 121, the third pattern layer 123, and the via hole layer 124 can be formed by TT or MSAP. In this case, each of the first pattern layer 121 and the third pattern layer 123 can include a first metal layer M1 (i.e., a seed layer formed by an electroless plating process), a second metal layer M2 (i.e., a plated layer formed by an electroplating process), and a third metal layer M3 (i.e., a metal foil), etc. The via hole layer 124 can include the first metal layer M1 (i.e., a seed layer formed by an electroless plating process) and the second metal layer M2 (i.e., a plated layer formed by an electroplating process).

[0090] For example, the first pattern layer 121 can include the first metal layer M1 disposed on the upper surface of the first dielectric layer 111, the second metal layer M2 disposed on the first metal layer M1, and the third metal layer M3 disposed between the upper surface of the first dielectric layer 111 and the first metal layer M1. The third pattern layer 123 can include the first metal layer M1 disposed on the lower surface of the first dielectric layer 111, the second metal layer M2 disposed on the first metal layer M1, and the third metal layer M3 disposed between the lower surface of the first dielectric layer 111 and the first metal layer M1. The via hole layer 124 can include the first metal layer M1 disposed on the wall of the via hole 124v formed in the first dielectric layer 111 and the second metal layer M2 disposed on the first metal layer M1. The thickness of the second metal layer M2 can be greater than the thickness of the first metal layer M1. The thickness of the third metal layer M3 can be greater than the thickness of the first metal layer M1 and less than the thickness of the second metal layer M2. The second metal layer M2 can fill the portion of the via hole 124v formed between the first metal layers M1 formed on the opposite walls of the via hole 124v. For example, the feed-through hole of the via hole layer 124 described above can be a fill-type via hole.

[0091] Referring to Figure 7B ​The first pattern layer 121, the third pattern layer 123, and the via hole layer 124 can be optionally formed through SAP. In this case, each of the first pattern layer 121 and the third pattern layer 123 can include the first metal layer M1 and the second metal layer M2 and can not include the third metal layer M3 described above. In other words, the first pattern layer 121 and the third pattern layer 123 can be formed through the electroless plating process and the electroplating process without a metal foil.

[0092] For example, the first pattern layer 121 can include the first metal layer M1 disposed on the upper surface of the first dielectric layer 111 and the second metal layer M2 disposed on the first metal layer M1. The third pattern layer 123 can include the first metal layer M1 disposed on the lower surface of the first dielectric layer 111 and the second metal layer M2 disposed on the first metal layer M1. The via hole layer 124 can include the first metal layer M1 disposed on the wall of the via hole 124v formed in the first dielectric layer 111 and the second metal layer M2 disposed on the first metal layer M1. The thickness of the second metal layer M2 can be greater than the thickness of the first metal layer M1. The second metal layer M2 can fill the portion of the via hole 124v formed between the first metal layers M1. For example, the feed-through hole of the via hole layer 124 described above can be a fill-type hole.

[0093] In Figure 7C and Figure 7D , the via hole layer 124 can include the first metal layer M1 and the second metal layer M2, and is different from the example embodiment in Figure 7A and Figure 7B in that the second metal layer M2 can be conformally disposed on the first metal layer M1. In this case, the via hole layer 124 can further include an ink layer I disposed on the portion of the via hole 124v between the second metal layers M2 formed on the opposite walls of the via hole 124v to fill the via hole 124v. For example, the feed-through hole of the via hole layer 124 described above can be filled with ink. The ink layer I can be formed through an ink blocking process. As the ink layer I, a thermoplastic or thermosetting insulating material, or a commonly used blocking material such as conductive ink can be used.

[0094] The descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiments, and thus detailed descriptions thereof will not be provided.

[0095] In Figure 7E and Figure 7F , the via hole layer 124 can include the first metal layer M1 and the second metal layer M2, and is different from the example embodiment in Figure 7A and Figure 7BDifferently, the second metal layer M2 can include a first recess G1 and a second recess G2 on the upper surface and the lower surface of the second metal layer M2, respectively. In addition, the via hole layer 124 can further include a fourth metal layer M4 disposed on each of the upper surface and the lower surface of the second metal layer M2. The fourth metal layer M4 of the via hole layer 124 can fill the first recess G1 and the second recess G2. The via hole layer 124 can have a central region and an upper region and a lower region, the central region being between the upper region and the lower region. Each of the upper region and the lower region can include a plurality of regions. The average grain size of the metal (e.g., the average grain size of the metal particles) in the central region can be smaller than the average grain size of the metal (e.g., the average grain size of the metal particles) in the partial regions of the upper region and the partial regions of the lower region. For example, the feed-through hole of the via hole layer 124 described above can be a fill-type via hole. The via hole layer 124 can effectively prevent voids from being generated in the process of filling the via hole 124v by the plating process. Each of the first pattern layer 121 and the third pattern layer 123 can further include the fourth metal layer M4. The thickness of the fourth metal layer M4 can be greater than the thickness of each of the first metal layer M1, the second metal layer M2, and the third metal layer M3.

[0096] For example, the second metal layer M2 can be formed by a pulse periodic reversal (PPR) plating process in which the direction of the pulse current is periodically reversed. For example, the second metal layer M2 can be formed on the first metal layer M1 by applying a current by a PPR method. For example, the waveform condition of the PPR can include more than one phase (e.g., five or more phases), and the current density and the time in each phase can be the same as or different from each other. In terms of maintaining control over the growth speed of the plating grains described above, it can be desirable to maintain the average value Iavg of the current density, which is closely related to the plating speed, to be 1.5 ASD or less. In this case, the growth speed of the plating grains can be easily controlled to form a plurality of regions having the average grain size described above, and thus, a phenomenon in which metal ions are insufficiently supplied in the process of forming the bridge layer by the plating process can be prevented, so that the formation of voids can be prevented. The fourth metal layer M4 can be formed by a direct current (DC) plating process. For example, the fourth metal layer M4 can be formed on the second metal layer M2 by a plating process by a DC method.

[0097] The descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiments, and thus detailed descriptions thereof will not be provided.

[0098] Figures 8A-8C is an enlarged sectional view illustrating Figure 6 each example of the region B illustrated in FIG. 10.

[0099] Referring to Figure 8AThe second pattern layer 122 can be formed by a plating process such as TT, and thus, the second pattern layer 122 can include only the fifth metal layer M5, i.e., a metal foil. The fifth metal layer M5 can be disposed on the upper surface of the second dielectric layer 112. For example, the fifth metal layer M5 can include a single metal element such as rolled copper or electrolytic copper.

[0100] Referring to Figure 8B , the second pattern layer 122 can also be formed by MSAP, and thus, the second pattern layer 122 can include the fifth metal layer M5, i.e., a metal foil, disposed on the upper surface of the second dielectric layer 112, and can further include the sixth metal layer M6 disposed on the fifth metal layer M5 based on the fifth metal layer M5 by an electroplating process, the thickness of the sixth metal layer M6 being greater than the thickness of the fifth metal layer M5.

[0101] Referring to Figure 8C , the second pattern layer 122 can be formed by SAP, and thus, the second pattern layer 122 can include the seventh metal layer M7, i.e., a seed layer formed on the upper surface of the second dielectric layer 112 by an electroless plating process, and the sixth metal layer M6 disposed on the seventh metal layer M7 based on the seventh metal layer M7 by an electroplating process and having a thickness greater than the thickness of the seventh metal layer M7.

[0102] Figures 7A-7F Each of the examples of the area A shown in FIG. 10 can be combined with each of the examples of the area B shown in FIG. 11 in various forms, and in the combinations, there can be no particular limitation. Figures 8A-8C

[0103] Figure 9 is a perspective view showing another example of an antenna.

[0104] Figure 10 is a perspective view showing an internal area of the antenna shown in Figure 9

[0105] Figure 11 is a cross-sectional view taken along line II-II' of the antenna shown in Figure 9

[0106] Referring to Figures 9-11 ​​​Unlike the antenna 100A described in the foregoing example embodiment, in the antenna 100B in another example embodiment, the first pattern layer 121 can include one or more feed patterns, desirably, a plurality of feed patterns. In addition, the second pattern layer 122 can include a patch pattern. In addition, the via hole layer 124 can include one or more feed vias (e.g., desirably, a plurality of feed vias) respectively connecting the one or more feed patterns (e.g., desirably, a plurality of feed patterns) to one or more pad patterns (e.g., desirably, a plurality of pad patterns) of the third pattern layer 123. A planar area (i.e., an area on a plane perpendicular to a thickness direction) of each of the one or more feed patterns of the first pattern layer 121 can be smaller than a planar area of the patch pattern of the second pattern layer 122, and each of the one or more feed patterns of the first pattern layer 121 can be partially overlapped with the patch pattern of the second pattern layer 122 in a planar view in an up-down direction (e.g., a Z direction).

[0107] Since the relatively large upper surface of the patch pattern of the second pattern layer 122 can focus a radiation pattern in the up-down direction (e.g., the Z direction), the patch pattern of the second pattern layer 122 can remotely transmit and / or receive an RF signal in the up-down direction, and can remotely transmit and / or receive an RF signal having a frequency within a bandwidth based on a resonant frequency of the patch pattern. The feed via of the via hole layer 124 can serve as a feed path of the patch pattern of the second pattern layer 122. In other words, the feed via of the via hole layer 124 can provide a path in which a surface current flowing in the patch pattern of the second pattern layer 122 can flow when the patch pattern remotely transmits and / or receives an RF signal. The feed pattern of the first pattern layer 121 can be electrically connected to the feed via of the via hole layer 124, and can be spaced apart from the patch pattern of the second pattern layer 122. The feed pattern of the first pattern layer 121 can also serve as a feed path of the patch pattern of the second pattern layer 122.

[0108] Since the feeding pattern of the first pattern layer 121 is spaced apart from the patch pattern of the second pattern layer 122, the patch pattern can be fed in a non-contact manner, and by using the non-contact feeding method, inductance based on the feeding pattern and capacitance formed by the feeding pattern and the patch pattern can be used as an additional resonance frequency of the patch pattern, and thus, a bandwidth of the patch pattern can be widened. The non-contact feeding space in the general non-contact feeding method can cause a leakage of radio wave energy. However, in another example embodiment, the first dielectric boundary condition and the second dielectric boundary condition formed by the first dielectric layer 111 and the second dielectric layer 112 can increase electromagnetic coupling concentration between the patch pattern of the second pattern layer 122 and the feeding pattern of the first pattern layer 121, and thus, energy loss caused by using the non-contact feeding method can be significantly reduced, and degradation of gain can be reduced. Accordingly, the antenna 100B can have a widened bandwidth and increased gain with respect to its size.

[0109] The patch pattern of the second pattern layer 122 can be disposed such that edges of a quadrangular shape thereof are disposed obliquely with respect to edges of the cavity 113H (for example, the edges of the second pattern layer 122 can not be parallel to the edges of the dielectric layer 112). Surface currents flowing in the patch pattern of the second pattern layer 122 can flow from one edge of the quadrangular shape toward another edge. In addition, when a plurality of antennas 100B are disposed close to each other, electromagnetic interference between elements of the plurality of antennas 100B can further increase when directions of surface currents of the plurality of antennas 100B overlap each other. In this case, when the edges of the quadrangular shape of the patch pattern of the second pattern layer 122 are disposed obliquely with respect to the edges of the cavity 113H, electromagnetic interference from the surface currents of the patch pattern to adjacent antennas 100B can be prevented.

[0110] If necessary, the patch pattern of the second pattern layer 122 can have a quadrangular shape with vertices being chamfered, and edges of the quadrangular shape can be disposed obliquely with respect to edges of the cavity 113H. For the quadrangular shape of the patch pattern of the second pattern layer 122 with the vertices being chamfered, the vertices of the patch pattern can be disposed adjacent to central portions of the respective edges, such that the vertices of the patch pattern can not be disposed to protrude beyond the cavity 113H (for example, any portion of the patch pattern of the second pattern layer 122 can not be superposed on the reinforcement layer 113). Accordingly, electromagnetic coupling concentration between the patch pattern of the second pattern layer 122 and the feeding pattern of the first pattern layer 121 can be improved.

[0111] If necessary, the second pattern layer 122 can further include a quadrangular shape arranged along the edges of the patch pattern of the second pattern layer 122 to surround the plurality of coupling patterns of the patch pattern. The plurality of coupling patterns of the second pattern layer 122 can be electromagnetically coupled to the patch pattern of the second pattern layer 122, and thus can contribute to the addition of the resonance frequency and the expansion of the bandwidth of the patch pattern, and can form a capacitance with the feed pattern of the first pattern layer 121, thereby effectively expanding the bandwidth of the patch pattern. The capacitance formed by the plurality of coupling patterns and the patch pattern of the second pattern layer 122 and the feed pattern of the first pattern layer 121 can be precisely adjusted according to the adjustment of the length of the feed pattern. The relatively high dielectric constant of the second dielectric layer 112 can widen the adjustment range of the capacitance formed by the plurality of coupling patterns and the patch pattern of the second pattern layer 122 and the feed pattern of the first pattern layer 121. Accordingly, the antenna 100B can effectively widen the bandwidth, and can have a widened bandwidth in relation to its size.

[0112] The other elements are substantially the same as those of the other elements of the aforementioned example embodiment, and thus detailed descriptions thereof will not be provided.

[0113] Figure 12 is a perspective view illustrating another example of an antenna.

[0114] Figure 13 is a perspective view illustrating Figure 12 is a perspective view illustrating an inner region of the antenna illustrated in

[0115] Figure 14 is a perspective view illustrating Figure 12 is a cross-sectional view taken along line III-III' of the antenna illustrated in

[0116] Referring to Figures 12-14 Unlike the antenna 100A described in the aforementioned example embodiment, in the antenna 100C in another example embodiment, the first adhesive layer 114 and the second adhesive layer 115 can respectively have a second cavity 114H and a third cavity 115H that pass through the first adhesive layer 114 and the second adhesive layer 115 in the thickness direction (Z direction). The second cavity 114H and the third cavity 115H can be adjacent to and connected to the cavity 113H in the thickness direction (Z direction). Accordingly, the region between the first dielectric layer 111 and the second dielectric layer 112 occupied by air can increase, and thus the radiation through the patch pattern and / or the coupling pattern can be more focused in the up-and-down direction (e.g., the Z direction), and thus the gain of the antenna 100C can be improved. At least a portion of the first pattern layer 121 can be disposed in the second cavity 114H and can be surrounded by the first adhesive layer 114 in a plane.

[0117] The first adhesive layer 114 and the second adhesive layer 115 can have one or more second vent holes 114h and third vent holes 115h connected to the second cavity 114H and the third cavity 115H, respectively, in the plan and exposed to (e.g., extended to) the outer side surfaces of the first adhesive layer 114 and the second adhesive layer 115, respectively. The first adhesive layer 114 and the second adhesive layer 115 can have a plurality of second vent holes 114h and a plurality of third vent holes 115h, respectively, and the second vent holes 114h and the third vent holes 115h can be disposed in different regions. In each region, the first vent hole 113h, the second vent hole 114h, and the third vent hole 115h can be adjacent to and connected to each other in the thickness direction (Z direction). Accordingly, in the process of manufacturing the antenna 100C, a phenomenon in which the size or shape of each of the second cavity 114H and the third cavity 115H does not match the designed size or shape, or a factor physically affecting the first adhesive layer 114 and the second adhesive layer 115 can be reduced, and thus, the performance obtained by the second cavity 114H and the third cavity 115H can be stably obtained.

[0118] In Figures 12-14 , for the structure in which the first cavity 113H and the first vent hole 113h are formed in the reinforcing layer 113, the second cavity 114H and the third cavity 115H and the second vent hole 114h and the third vent hole 115h are additionally formed in the first adhesive layer 114 and the second adhesive layer 115, but example embodiments thereof are not limited thereto. In other examples, only the second cavity 114H can be formed in the first adhesive layer 114 among the first adhesive layer 114 and the second adhesive layer 115, or only the third cavity 115H can be formed in the second adhesive layer 115 among the first adhesive layer 114 and the second adhesive layer 115. Further, only the second vent hole 114h can be formed in the first adhesive layer 114 among the first adhesive layer 114 and the second adhesive layer 115, or only the third vent hole 115h can be formed in the second adhesive layer 115 among the first adhesive layer 114 and the second adhesive layer 115.

[0119] Descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiments, and thus detailed descriptions thereof will not be provided.

[0120] Figure 15 is a perspective view illustrating another example of an antenna.

[0121] Figure 16 is a perspective view illustrating Figure 15 an internal region of the antenna illustrated in

[0122] Figure 17 is a perspective view illustrating Figure 15 a cross-sectional view of the antenna illustrated in along line IV-IV'.

[0123] Reference Figures 15-17 Unlike the antenna 100C described in the foregoing example embodiment, in the antenna 100D of another example embodiment, the first pattern layer 121 may include one or more feed patterns, preferably, such as multiple feed patterns. Furthermore, the second pattern layer 122 may include a patch pattern. Additionally, the via layer 124 may include one or more feed vias (preferably, multiple feed vias) that respectively connect one or more feed patterns (e.g., preferably, multiple feed patterns) to one or more pad patterns (e.g., preferably, multiple pad patterns) of the third pattern layer 123. The planar area of ​​each of the one or more feed patterns (e.g., preferably, multiple feed patterns) in the first pattern layer 121 may be smaller than the planar area of ​​the patch pattern of the second pattern layer 122, and each of the one or more feed patterns (e.g., preferably, multiple feed patterns) in the first pattern layer 121 may be planarly superimposed on a portion of the patch pattern of the second pattern layer 122.

[0124] The patch pattern of the second pattern layer 122 may be configured such that the sides of its quadrilateral shape are obliquely disposed relative to the sides of the cavity 113H (e.g., the sides of the quadrilateral second pattern layer 122 may not be parallel to and orthogonal to the sides of the cavity 113H). If desired, the patch pattern of the second pattern layer 122 may have a quadrilateral shape with chamfered vertices, and the sides of the quadrilateral may be obliquely disposed relative to the sides of the cavity 113H. Furthermore, the second pattern layer 122 may also include a plurality of coupling patterns arranged along the sides of the quadrilateral shape of the patch pattern of the second pattern layer 122 to surround the patch pattern.

[0125] The descriptions of other components are substantially the same as those of other components in the foregoing example embodiments, and therefore will not be provided in detail.

[0126] Figure 18 This is a perspective view showing another example of an antenna.

[0127] Figure 19 It is shown Figure 18 A perspective view of the internal region of the antenna shown in the image.

[0128] Figure 20 It is shown Figure 18 The image shows a cross-sectional view of the antenna along line V-V'.

[0129] Reference Figures 18-20Unlike the antenna 100C described in the foregoing example embodiment, in the antenna 100E in another example embodiment, only the second adhesive layer 115 can have the third vent hole 115h. For example, when the first cavity 113H, the second cavity 114H, and the third cavity 115H are formed in the reinforcing layer 113, the first adhesive layer 114, and the second adhesive layer 115, respectively, only the second adhesive layer 115 can have the third vent hole 115h, and each of the reinforcing layer 113 and the first adhesive layer 114 can not have the first vent hole 113h and the second vent hole 114h, respectively. As described above, the vent holes can be selectively formed.

[0130] In Figures 18-20 the example embodiment, when the first cavity 113H, the second cavity 114H, and the third cavity 115H are formed in the reinforcing layer 113, the first adhesive layer 114, and the second adhesive layer 115, respectively, only the second adhesive layer 115 can have the third vent hole 115h, but example embodiments thereof are not limited thereto. Alternatively, only the first adhesive layer 114 can have the second vent hole 114h. As another alternative, only the reinforcing layer 113 can have the first vent hole 113h.

[0131] Descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiment, and thus detailed descriptions thereof will not be provided.

[0132] Figure 21 is a perspective view showing another example of an antenna.

[0133] Figure 22 is a perspective view showing an internal region of the antenna shown in Figure 21 .

[0134] Figure 23 is a sectional view taken along the line VI-VI' of the antenna shown in Figure 21 .

[0135] Referring to Figures 21-23Unlike the antenna 100E described in the foregoing example embodiments, in the antenna 100F of another example embodiment, the pattern layer 121 may include one or more feed patterns, preferably such as multiple feed patterns. Furthermore, the second pattern layer 122 may include patch patterns. Additionally, the via layer 124 may include one or more feed vias (preferably such as multiple feed vias) that respectively connect one or more feed patterns (preferably such as multiple feed patterns) to one or more pad patterns (preferably such as multiple pad patterns) of the third pattern layer 123. The planar area of ​​each of one or more feed patterns in the first pattern layer 121 (e.g., preferably each of the plurality of feed patterns) may be smaller than the planar area of ​​the patch pattern of the second pattern layer 122, and each of one or more feed patterns in the first pattern layer 121 (e.g., preferably each of the plurality of feed patterns) may be stacked with a portion of the patch pattern of the second pattern layer 122 in the stacking direction (e.g., the Z direction).

[0136] The patch pattern of the second pattern layer 122 may be configured such that the sides of its quadrilateral shape are obliquely disposed relative to the sides of the cavity 113H (e.g., the sides of the second pattern layer 122 may not be parallel and orthogonal to the sides of the cavity 113H, and / or the sides of the second pattern layer 122 may not be parallel and orthogonal to the sides of the dielectric layer 112). If desired, the patch pattern of the second pattern layer 122 may have a quadrilateral shape with chamfered vertices, and the sides of the quadrilateral may be obliquely disposed relative to the sides of the cavity 113H. Furthermore, the second pattern layer 122 may also include a plurality of coupling patterns arranged along the sides of the quadrilateral shape of the patch pattern of the second pattern layer 122 to surround the patch pattern.

[0137] The descriptions of other components are substantially the same as those of other components in the foregoing example embodiments, and therefore will not be provided in detail.

[0138] Figure 24 This is a perspective view showing another example of an antenna.

[0139] Figure 25 It is shown Figure 24 A perspective view of the internal region of the antenna shown in the image.

[0140] Figure 26 It is shown Figure 24 The image shows a cross-sectional view of the antenna along line VII-VII'.

[0141] Reference Figures 24-26Unlike the antenna 100C described in the foregoing example embodiment, in the antenna 100G in another example embodiment, the first dielectric layer 111 can have a first through-hole 111h that penetrates the first dielectric layer 111. Further, the second dielectric layer 112 can have a second through-hole 112h that penetrates the second dielectric layer 112. The first through-hole 111h and the second through-hole 112h can be connected to the second cavity 114H and the third cavity 115H, respectively, in the thickness direction (Z direction). The first vent hole 113h, the second vent hole 114h, and the third vent hole 115h can not be provided. The first through-hole 111h and the second through-hole 112h can function as the first vent hole 113h, the second vent hole 114h, and the third vent hole 115h. For example, by including the first through-hole 111h and the second through-hole 112h, in the process of manufacturing the antenna 100C, a phenomenon in which the size or shape of each of the first cavity 113H, the second cavity 114H, and the third cavity 115H does not match the designed size or shape, or a factor that physically affects the first adhesive layer 114 and the second adhesive layer 115 can be reduced, and thus, the performance obtained by the first cavity 113H, the second cavity 114H, and the third cavity 115H can be stably obtained.

[0142] The patch pattern of the first pattern layer 121 can have a first pattern hole 121h that is aligned with the first through-hole 111h in the thickness direction (Z direction) and connected to the first through-hole 111h. Further, the coupling pattern of the second pattern layer 122 can have a second pattern hole 122h that is aligned with the second through-hole 112h in the thickness direction (Z direction) and connected to the second through-hole 112h. Thus, the effects obtained by the first through-hole 111h and the second through-hole 112h can be effectively achieved. The via hole layer 124 can include a feed-through hole and a ground-through hole, and the feed-through hole and the ground-through hole of the via hole layer 124 can be connected to the patch pattern of the first pattern layer 121. The feed-through hole and the ground-through hole of the via hole layer 124 can be connected to the pad pattern for feeding and the pad pattern for grounding of the third pattern layer 123, respectively.

[0143] The descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiment, and thus detailed descriptions thereof will not be provided.

[0144] Figure 27 is a perspective view illustrating another example of an antenna.

[0145] Figure 28 is a perspective view illustrating Figure 27 an internal region of the antenna illustrated in

[0146] Figure 29 is a perspective view illustrating Figure 27 a cross-sectional view of the antenna illustrated in

[0147] Referring toFigures 27-29 Unlike the antenna 100G described in the foregoing example embodiments, in an antenna 100H in another example embodiment, the first pattern layer 121 can include one or more feed patterns, desirably, a plurality of feed patterns. In addition, the second pattern layer 122 can include a patch pattern. Further, the via hole layer 124 can include one or more feed vias, desirably, a plurality of feed vias, connecting the one or more feed patterns, desirably, the plurality of feed patterns, to one or more pad patterns, desirably, a plurality of pad patterns, of the third pattern layer 123, respectively. A planar area of each of the one or more feed patterns, desirably, the plurality of feed patterns, of the first pattern layer 121 can be smaller than a planar area of the patch pattern of the second pattern layer 122, and each of the one or more feed patterns, desirably, the plurality of feed patterns, of the first pattern layer 121 can be partially overlapped with the patch pattern of the second pattern layer 122 in plan.

[0148] The patch pattern of the second pattern layer 122 can be disposed such that edges of a quadrangular shape thereof are disposed obliquely with respect to edges of the cavity 113H. If necessary, the patch pattern of the second pattern layer 122 can have a quadrangular shape with vertices being chamfered, and edges of the quadrangle can be disposed obliquely with respect to edges of the cavity 113H. In addition, the second pattern layer 122 can further include a plurality of coupling patterns arranged along edges of the quadrangular shape of the patch pattern of the second pattern layer 122 to surround the patch pattern.

[0149] Descriptions of other elements are substantially the same as those of the other elements in the foregoing example embodiments, and thus detailed descriptions thereof will not be provided.

[0150] However, example embodiments of the present disclosure are not limited thereto, and the main body part 110 of the antenna can include an additional dielectric layer in addition to the three dielectric layers (i.e., the first dielectric layer 111, the second dielectric layer 112, and the reinforcing layer 113), and a plurality of adhesive layers can be disposed between the dielectric layers. In addition, the composition of the dielectric layer disposed between the plurality of adhesive layers is different from that of the dielectric layer disposed above the uppermost adhesive layer and that of the dielectric layer disposed below the lowermost adhesive layer.

[0151] In addition, the cavity is not limited to being connected to the outer surface of the antenna through the vent hole, the through hole, and the pattern hole, and can be connected to the outer surface of the antenna by forming at least one through hole extending from the cavity to the outer surface of the antenna in any other manner. In addition, the at least one through hole can extend through at least one of the dielectric layers.

[0152] According to the foregoing example embodiments, an antenna that can improve antenna performance and can stably obtain improved antenna performance and can have improved reliability can be provided.

[0153] Furthermore, an antenna that can improve efficiency and can have a reduced size can be provided.

[0154] In example embodiments, the terms "side", "side surface", and the like can be used to refer to a surface formed in a right / left direction with reference to a cross section of a figure for ease of description, the terms "upper side", "upper portion", "upper surface", and the like can be used to refer to a surface formed in an upward direction with reference to a cross section of a figure for ease of description, and the terms "lower side", "lower portion", "lower surface", and the like can be used to refer to a surface formed in a downward direction. The concept that an element is disposed on a side region, an upper side, an upper region, or a lower region can include a configuration in which the element is in direct contact with an element configured as a reference in each direction, as well as a configuration in which the element is not in direct contact with the reference element. However, for ease of description, the terms can be defined as above, and the scope of the rights of the example embodiments is not particularly limited to the above terms.

[0155] In example embodiments, the term "connection" can refer not only to "direct connection", but also can include "indirect connection" via an adhesive layer or the like. Furthermore, the term "electrical connection" can include both cases in which elements are "physically connected" and cases in which elements are "not physically connected". Furthermore, the terms "first", "second", and the like can be used to distinguish one element from another, and can not limit the order and / or importance or other in relation to the elements. In some cases, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element, without departing from the scope of the rights of the example embodiments.

[0156] In example embodiments, the term "example embodiment" can not refer to one identical example embodiment, but can be provided to describe and emphasize different unique features of each example embodiment. The example embodiments presented above can be implemented without excluding the possibility of combination with features of other example embodiments. For example, even if a feature described in one example embodiment is not described in another example embodiment, the description can be understood to be related to another example embodiment, unless otherwise indicated.

[0157] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes can be made without departing from the scope of the present application as defined by the appended claims.

Claims

1. An antenna, comprising: A first dielectric layer has a first surface and a second surface opposite to the first surface; The second dielectric layer has a third surface and a fourth surface opposite to the third surface; A reinforcing layer is disposed between the first dielectric layer and the second dielectric layer, has a fifth surface and a sixth surface opposite to the fifth surface, and includes an insulating material; A first adhesive layer is disposed between the second surface of the first dielectric layer and the fifth surface of the reinforcing layer; A second adhesive layer is disposed between the third surface of the second dielectric layer and the sixth surface of the reinforcing layer; A first patterned layer is disposed on the second surface of the first dielectric layer; as well as A second patterned layer is disposed on the fourth surface of the second dielectric layer. The reinforcing layer has a first cavity that extends through the region between the fifth surface and the sixth surface. The dielectric constant of each of the first adhesive layer and the second adhesive layer is less than the dielectric constant of each of the first dielectric layer and the second dielectric layer, and greater than the dielectric constant of the reinforcing layer.

2. The antenna according to claim 1, wherein, The elastic modulus of the reinforcing layer is higher than that of each of the first adhesive layer and the second adhesive layer.

3. The antenna according to claim 1, wherein, The first pattern layer is embedded in the first adhesive layer.

4. The antenna according to claim 1, wherein, The reinforcing layer has one or more first vent holes, and Each of the one or more first vent holes is exposed to the outer surface of the first cavity and the reinforcing layer.

5. The antenna according to claim 1, wherein, At least one of the first adhesive layer and the second adhesive layer includes a second cavity, the second cavity extending through the first adhesive layer and the first adhesive layer in the thickness direction and connected to the first cavity in the thickness direction.

6. The antenna according to claim 5, wherein, At least one of the first adhesive layer and the second adhesive layer has one or more second vent holes, and Each of the one or more second vents is exposed to at least one of the outer surfaces of the second cavity and the first adhesive layer and the second adhesive layer.

7. The antenna according to claim 1, wherein, The first adhesive layer has a second cavity, the second adhesive layer has a third cavity, the second cavity and the third cavity respectively penetrate the first adhesive layer and the second adhesive layer and are connected to the first cavity in the thickness direction, and At least a portion of the first patterned layer is disposed in the second cavity.

8. The antenna according to claim 7, wherein, The reinforcing layer, the first adhesive layer, and the second adhesive layer each have one or more first vent holes, one or more second vent holes, and one or more third vent holes, and The one or more first vent holes, the one or more second vent holes, and the one or more third vent holes are respectively connected to the first cavity, the second cavity, and the third cavity, respectively exposed to the outer surface of the reinforcing layer, the outer surface of the first adhesive layer, and the outer surface of the second adhesive layer, and are connected to each other in the thickness direction.

9. The antenna according to claim 7, wherein, The first dielectric layer has a first through-hole penetrating the first surface and the second surface. The second dielectric layer has a second through-hole penetrating the third surface and the fourth surface, and The first through hole and the second through hole are respectively connected to the second cavity and the third cavity in the thickness direction.

10. The antenna according to claim 1, wherein, The edge of the second patterned layer is not parallel to the edge of the second dielectric layer.

11. The antenna according to claim 1, wherein, The dielectric constant of the second adhesive layer is greater than that of the first adhesive layer.

12. The antenna according to claim 1, wherein, The first dielectric layer, the second dielectric layer, and the reinforcing layer comprise polytetrafluoroethylene, ceramic filler, and woven glass fiber.

13. The antenna according to claim 1, wherein, The thickness of each of the first dielectric layer and the second dielectric layer is greater than the thickness of the reinforcing layer, and The thickness of the reinforcing layer is greater than the thickness of each of the first adhesive layer and the second adhesive layer.

14. The antenna according to claim 1, further comprising: A third pattern layer is disposed on the first surface of the first dielectric layer; as well as The via layer penetrates the first dielectric layer.

15. The antenna according to claim 14, wherein, The first pattern layer, the second pattern layer, and the third pattern layer each include a patch pattern, a coupling pattern, and multiple pad patterns. Wherein, the patch pattern and the coupling pattern are superimposed on each other in the thickness direction, and The via layer connects the patch pattern to at least one of the plurality of pad patterns.

16. The antenna according to claim 14, wherein, The first pattern layer, the second pattern layer, and the third pattern layer each include one or more power feed patterns, patch patterns, and multiple pad patterns. Wherein, the planar area of ​​each of the one or more feed patterns is smaller than the planar area of ​​the patch pattern, and The via layer connects one or more feed patterns to one or more of the plurality of pad patterns.

17. An antenna, comprising: The main body includes multiple dielectric layers and multiple adhesive layers disposed between the multiple dielectric layers; as well as The patterned portion includes a first pattern layer disposed in the main body portion and a second pattern layer disposed on the main body portion. Among the plurality of dielectric layers, the dielectric layer disposed between the plurality of adhesive layers has a cavity, the cavity being stacked with a portion of each of the first patterned layer and the second patterned layer in the stacking direction of the dielectric layer and the adhesive layer. The dielectric constant of each of the plurality of adhesive layers is less than that of each of the dielectric layers disposed above the uppermost adhesive layer and below the lowermost adhesive layer, and is greater than that of the dielectric layer disposed between the plurality of adhesive layers.

18. The antenna according to claim 17, wherein, At least one through-hole extends from the cavity to the outer surface of the antenna.

19. The antenna according to claim 18, wherein, The at least one via extends through at least one of the plurality of dielectric layers.

20. The antenna according to claim 17, wherein, The composition of the dielectric layer disposed between the plurality of adhesive layers is different from that of the dielectric layer disposed above the uppermost adhesive layer and the dielectric layer disposed below the lowermost adhesive layer.

21. An antenna, comprising: A first dielectric layer and a second dielectric layer are stacked, and a third dielectric layer is disposed between the first dielectric layer and the second dielectric layer; The first conductive pattern and the second conductive pattern are disposed on different dielectric layers among the first dielectric layer, the second dielectric layer and the third dielectric layer; as well as A first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed between the first dielectric layer and the third dielectric layer, and the second adhesive layer is disposed between the second dielectric layer and the third dielectric layer. The composition of the third dielectric layer differs from that of the first and second dielectric layers, and the third dielectric layer provides a cavity extending between the first and second dielectric layers. The dielectric constant of each of the first adhesive layer and the second adhesive layer is less than the dielectric constant of each of the first dielectric layer and the second dielectric layer, and greater than the dielectric constant of the third dielectric layer.

22. The antenna according to claim 21, wherein, At least one through-hole extends from the cavity to the outer surface of the antenna.

23. The antenna according to claim 22, wherein, The at least one via extends through the first dielectric layer and / or the second dielectric layer.

24. The antenna according to claim 22, wherein, The at least one via extends from the cavity through the third dielectric layer to the outer surface of the third dielectric layer.

25. The antenna according to claim 21, wherein, The first conductive pattern and the second conductive pattern are stacked with the cavity in the stacking direction of the first dielectric layer, the second dielectric layer and the third dielectric layer.

26. The antenna according to claim 21, wherein, The first conductive pattern is disposed between the first dielectric layer and the second dielectric layer, and the second conductive pattern is disposed on the outer surface of the second dielectric layer.

27. The antenna of claim 26, further comprising at least one via extending through the first dielectric layer and connected to the first conductive pattern.

28. The antenna according to claim 26, wherein, The second conductive pattern is disposed on the upper surface of the second dielectric layer, and The edge of the second conductive pattern is not parallel to the edge of the second dielectric layer.

29. The antenna according to claim 21, wherein, The elastic modulus of the third dielectric layer is higher than that of each of the first adhesive layer and the second adhesive layer.

30. The antenna according to claim 21, wherein, The first conductive pattern is disposed between the first dielectric layer and the second dielectric layer and is embedded in the first adhesive layer.

31. The antenna according to claim 21, wherein, At least one of the first adhesive layer and the second adhesive layer has a gap formed therein, the gap providing a through hole extending from the cavity to the outer surface of the antenna.

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