Wire-to-board signal transmission mechanism

Abstract

A wire-to-board signal transmission mechanism includes a first high-frequency signal line group and a first shielded signal line group located in a first area, and a second high-frequency signal line group and a second shielded signal line group located in a second area, so as to transmit a shielded signal by means of a first shielding structure and a second shielding structure respectively formed by a shielding component in the first area and the second area of ​​the wire-to-board signal transmission mechanism, and provide shielding for the transmission of high-frequency signals in the first area and the second area respectively. Therefore, in addition to suppressing overflow waves to prevent signal attenuation, the wire-to-board signal transmission mechanism of the present application also has good anti-interference performance, which makes the high-frequency signal transmission stable and enables the high-frequency signal to be transmitted over a longer distance.

Description

Technical Field

[0001] The present application relates to signal transmission technology, and more specifically, to a wire-to-board signal transmission mechanism that can effectively suppress interference and spillover between signals. Background Art

[0002] The 5G wireless communication era is coming after 2020. According to the specifications of the Wireless Gigabit Alliance (WiGig), 5G wireless communication will use high-frequency signals from the 6GHz band to the 55-67GHz band, and even ultra-high frequency signals in the 80GHz band may be used.

[0003] Since 5G wireless communication needs to be achieved through high-frequency signals, the transmission of high-frequency signals will be affected by interference and spillover between signals, especially when transmitting high-frequency signals through conventional FPC and PCB circuits. The transmission of high-frequency signals is most seriously affected. The existing wire-to-board signal transmission mechanism is limited by the poor shielding effect of the mechanism design, and there are problems of signal attenuation and interference caused by spillover, which makes it impossible to effectively transmit high-frequency signals over long distances. It can usually only be used to transmit low-frequency signals below 6GHz, such as GPS or WIFI. Therefore, for the transmission of high-frequency signals, how to suppress interference and prevent spillover will be the first technical problem to be solved.

[0004] Therefore, it is necessary and urgent to develop a wire-to-board signal transmission mechanism that can effectively transmit high-frequency signals over long distances. This has become a technical problem that the industry is eager to challenge and overcome. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present application provides a wire-to-board signal transmission mechanism that can effectively solve the problem that high-frequency signal transmission is susceptible to interference and signal attenuation caused by spillover, thereby avoiding signal attenuation and improving the stability of high-frequency signal transmission.

[0006] The present application provides a wire-to-board signal transmission mechanism, in which a first area and a second area are defined, and the wire-to-board signal transmission mechanism includes a wire group assembly, a wire end connector and a shielding component, the wire group assembly includes a first high-frequency signal wire group, a second high-frequency signal wire group, a first shielded signal wire group and a second shielded signal wire group, wherein the first high-frequency signal wire group and the second high-frequency signal wire group respectively transmit high-frequency signals, the first shielded signal wire group and the second shielded signal wire group respectively transmit shielded signals, and wherein the first high-frequency signal wire group and the second high-frequency signal wire group each have a shielding conductor, and wherein the first high-frequency signal wire group and the first shielded signal wire group are located in the first area, and the second high-frequency signal wire group and the first shielded signal wire group are located in the first area. Two shielded signal line groups are located in the second area; the line end connector is electrically connected to the first high-frequency signal line group and the second high-frequency signal line group respectively to receive the high-frequency signal, and the line end connector also has a metal shell; the shielding component provides a shielded conductor of the first high-frequency signal line group in the first area and the first shielded signal line group is electrically connected to the metal shell of the line end connector to form a first shielding structure, and provides a shielded conductor of the second high-frequency signal line group in the second area and the second shielded signal line group is electrically connected to the metal shell of the line end connector to form a second shielding structure, and transmits the shielding signal through the first shielding structure and the second shielding structure to provide shielding for the transmission of the high-frequency signal in the first area and the second area respectively.

[0007] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, a third area located between the first area and the second area is further defined in the wire-to-board signal transmission mechanism, the wire-to-board signal transmission mechanism also includes at least one printed circuit board located in the third area, and the wire-to-board signal transmission mechanism also includes a low-frequency signal circuit group arranged on the printed circuit board for transmitting the low-frequency signal

[0008] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the shielding assembly also has an outer shielding member, which provides electrical connection between the wire group assembly and the metal shell, and the shielding assembly also has a jumper structure, which spans the third area to provide electrical connection between the first shielding structure and the second shielding structure.

[0009] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, a first shielding signal circuit group and a second shielding signal circuit group are also arranged on the printed circuit board, wherein the first shielding signal circuit group is arranged at the junction of the first area and the third area, and the second shielding signal circuit group is arranged at the junction of the second area and the third area; the shielding component also has a first longitudinal extension structure and a second longitudinal extension structure; the first longitudinal extension structure extends toward the printed circuit board and electrically contacts the first shielding signal circuit group to provide shielding between the first area and the third area; the second longitudinal extension structure extends toward the printed circuit board and electrically contacts the second shielding signal circuit group to provide shielding between the second area and the third area.

[0010] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the metal shell includes a first metal shell and a second metal shell; the wire group assembly also includes a first wire group layer arranged adjacent to the first metal shell and a second wire group layer arranged adjacent to the second metal shell, the first wire group layer and the second wire group layer respectively include the first high-frequency signal wire group, the second high-frequency signal wire group, the first shielded signal wire group and the second shielded signal wire group; and the shielding component also includes an intermediate shielding member, which is located between the first wire group layer and the second wire group layer; wherein the shielding component also includes providing shielding conductors of the first high-frequency signal wire group and the second high-frequency signal wire group in the first wire group layer, respectively electrically connecting the wire end connection The first metal shell and the intermediate shielding component of the connector form a third shielding structure for providing shielding for the first high-frequency signal line group and the second high-frequency signal line group in the first line group layer to be electrically connected to the periphery of the line end connector; and the shielding conductors of the first high-frequency signal line group and the second high-frequency signal line group in the second line group layer are respectively electrically connected to the second metal shell and the intermediate shielding component of the line end connector to form a fourth shielding structure for providing shielding for the first high-frequency signal line group and the second high-frequency signal line group in the second line group layer to be electrically connected to the periphery of the line end connector; and wherein the signal transmission of the first line group layer and the second line group layer is prevented from interfering with each other by the intermediate shielding component.

[0011] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the low-frequency signal circuit group also includes a first circuit layer arranged adjacent to the first metal shell and a second circuit layer arranged adjacent to the second metal shell, the first circuit layer and the second circuit layer each contain the printed circuit board, and the intermediate shielding member is located between the first circuit layer and the second circuit layer to provide shielding between the first circuit layer and the second circuit layer.

[0012] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the first wire group layer and the second wire group layer are stacked up and down.

[0013] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the first circuit layer and the second circuit layer are stacked up and down.

[0014] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the intermediate shielding component is a metal plate.

[0015] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the first high-frequency signal wire group and the second high-frequency signal wire group are each a wire group composed of at least one coaxial line, and the first shielded signal wire group and the second shielded signal wire group are each a wire group composed of at least one electronic wire.

[0016] As can be seen from the above, the wire-to-board signal transmission mechanism of the present application forms a first shielding structure and a second shielding structure in the first area and the second area respectively by means of a shielding component, thereby providing shielding for the transmission of high-frequency signals in the first area and the second area respectively.

[0017] In addition, the shielding component also provides a first longitudinal extension structure extending between the first area and the third area and a second longitudinal extension structure extending between the second area and the third area, respectively, and provides shielding between the first area and the three areas and between the second area and the third area, respectively, so as to avoid signal transmission interference between the two high-frequency signal line groups. Therefore, in addition to suppressing overflow waves and preventing signal attenuation, the wire-to-board signal transmission mechanism of the present application also has excellent anti-interference performance, which can make the high-frequency signal transmission stable and enable the high-frequency signal to be transmitted over longer distances, thereby solving the problem that the existing wire-to-board signal transmission mechanism cannot transmit high-frequency signals over long distances. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall architecture of the wire-to-board signal transmission mechanism of the present application;

[0019] Figures 2A to 9 A partial schematic diagram of the wire-to-board signal transmission mechanism of the present application; and

[0020] Figure 10 to Figure 11 Different cross-sectional views of the wire-to-board signal transmission mechanism of the present application.

[0021] Explanation of symbols:

[0022] 1 Wire-to-board signal transmission mechanism

[0023] 1A First Area

[0024] 1B Second Area

[0025] 1C Third Area

[0026] 11 Line assembly

[0027] 11A First Line Group Layer

[0028] 11B Second Line Group Layer

[0029] 111 The first high-frequency signal line group (coaxial line)

[0030] 111A, 111B First high-frequency signal line group (coaxial line)

[0031] 1111 Shielded conductor

[0032] 112 Second high-frequency signal line group (coaxial line)

[0033] 112A, 112B Second high-frequency signal line group (coaxial line)

[0034] 1121 Shielded conductor

[0035] 113 First shielded signal line group

[0036] 113A, 113B First shielded signal line group

[0037] 114 Second shielded signal line group

[0038] 114A, 114B Second shielded signal line group

[0039] 115 Low frequency signal circuit group

[0040] 1151 First Circuit Layer

[0041] 1152 Second Circuit Layer

[0042] 116 First shielding signal circuit group

[0043] 117 Second shielding signal circuit group

[0044] 118, 119 Power supply lines

[0045] 12-wire connector

[0046] 121 First Metal Shell

[0047] 122 Second Metal Shell

[0048] Port 123

[0049] 123A First sub-port

[0050] 123B Second subport

[0051] 125 Insulation seat

[0052] 13 Shielding components

[0053] 13A, 13B Outer shield

[0054] 131A First lateral extension structure

[0055] 131B Second lateral extension structure

[0056] 132 Crossover structure

[0057] 133A First longitudinal extension structure

[0058] 133B Second longitudinal extension structure

[0059] 134 Intermediate shield

[0060] 14. Printed Circuit Board

[0061] 15 Electrical contact

[0062] 16 Insulation structure

[0063] 211-219 Connection terminals

[0064] S1 First shielding structure

[0065] S2 Second shielding structure

[0066] S3 Third shielding structure

[0067] S4 Fourth shielding structure DETAILED DESCRIPTION

[0068] The following content will be accompanied by the accompanying drawings to illustrate the technical content of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. In particular, the proportional relationship and relative position of each component in the accompanying drawings are for exemplary purposes only and do not represent the actual situation of the implementation of the present application.

[0069] See also Figures 1 to 11 , which is a schematic diagram of multiple embodiments of the wire-to-board signal transmission mechanism 1 of the present application.

[0070] like Fig.10 As shown, the wire-to-board signal transmission mechanism 1 of the present application is defined with a first area 1A and a second area 1B. In this embodiment, the first area 1A and the second area 1B are respectively located on opposite sides of the wire-to-board signal transmission mechanism 1. Optionally, a third area 1C is also provided between the first area 1A and the second area 1B.

[0071] refer to Figure 2AThe wire-to-board signal transmission mechanism 1 of the present application mainly includes a wired group assembly 11, a wire end connector 12, and a shielding component 13.

[0072] refer to Figure 1 and Figure 4 , the wire group assembly 11 includes a first high-frequency signal wire group 111, a second high-frequency signal wire group 112, a first shielded signal wire group 113 and a second shielded signal wire group 114. The first high-frequency signal wire group 111 and the second high-frequency signal wire group 112 are respectively used to transmit high-frequency signals, while the first shielded signal wire group 113 and the second shielded signal wire group 114 are respectively used to transmit shielded signals, and the first high-frequency signal wire group 111 and the second high-frequency signal wire group 112 each have a shielded conductor 1111, 1121. As shown in the figure, in this embodiment, the first high-frequency signal wire group 111 and the first shielded signal wire group 113 are arranged in the first area 1A of the wire-to-board signal transmission mechanism 1, and the second high-frequency signal wire group 112 and the second shielded signal wire group 114 are arranged in the second area 1B of the wire-to-board signal transmission mechanism 1.

[0073] Optionally, the first high-frequency signal line group 111 and the second high-frequency signal line group 112 are, for example, line groups composed of at least one coaxial line, and the shielded conductors 1111 and 1121 are, for example, shielding layers (braided layers) in the coaxial lines.

[0074] Optionally, the first shielding signal wire group 113 and the second shielding signal wire group 114 are, for example, wire groups composed of at least one electronic wire.

[0075] In another embodiment, the wire-to-board signal transmission mechanism 1 further includes a low-frequency signal circuit group 115. Specifically, at least one printed circuit board 14 is provided in the third area 1C, and the low-frequency signal circuit group 115 can be arranged on the printed circuit board 14 for transmitting low-frequency signals.

[0076] refer to Figure 3 Optionally, an insulating structure 16 (such as insulating resin) may be provided on the outer layer of the printed circuit board 14 to prevent the low-frequency signal circuit group 115 on the printed circuit board 14 from unexpectedly being electrically short-circuited.

[0077] The line end connector 12 is electrically connected to the first high-frequency signal line group 111 and the second high-frequency signal line group 112 to receive high-frequency signals, and the line end connector 12 also has a metal shell. In this embodiment, the metal shell includes a first metal shell 121 and a second metal shell 122, and the first metal shell 121 and the second metal shell 122 are, for example, an upper shell and a lower shell of the line end connector 12, respectively.

[0078] Optionally, the line end connector 12 includes a port 123 (eg, Figure 2A , Figure 4 , Figure 6 As shown), the line end connector 12 is electrically connected to the first high-frequency signal line group 111 and the second high-frequency signal line group 112 to receive the high-frequency signal, and is electrically connected to the low-frequency signal circuit group 115 to receive the low-frequency signal transmitted by the low-frequency signal circuit group 115 (please describe in detail later).

[0079] Optionally, the line-end connector 12 may also be inserted into a board-end connector (not shown) to further transmit the high-frequency signal and the low-frequency signal to the board-end connector.

[0080] Please refer to Figure 2A , Figure 2B , Figure 4 , Figures 7 to 11 The shielding component 13 provides that the shielding conductor 1111 and the first shielding signal line group 113 of the first high-frequency signal line group 111 in the first area 1A are respectively electrically connected to the metal shell (the first metal shell 121 and / or the second metal shell 122) of the line end connector 12 to form a first shielding structure S1; and the shielding component 13 also provides that the shielding conductor 1121 and the second shielding signal line group 114 of the second high-frequency signal line group 112 in the second area 1B are respectively electrically connected to the metal shell (the first metal shell 121 and / or the second metal shell 122) of the line end connector 12 to form a second shielding structure S2, and the shielding signal is transmitted by the first shielding structure S1 and the second shielding structure to provide shielding for the transmission of high-frequency signals in the first area 1A and the second area 1B, respectively, so as to solve the problem that the high-frequency signal transmission is easily interfered and the signal is attenuated by the overflow wave.

[0081] refer to Figure 2B In an optional embodiment, the shielding assembly 13 includes two outer shielding members 13A and 13B, wherein the outer shielding member 13A is disposed between the line assembly 11 and the first metal shell 121 of the line end connector 12, and is used to provide an electrical connection between the line assembly 11 and the first metal shell 121, and the outer shielding member 13B is disposed between the line assembly 11 and the second metal shell 122 of the line end connector 12, and is used to provide an electrical connection between the line assembly 11 and the second metal shell 122. It should be noted that in Figure 2A Only the outer shielding member 13A disposed between the line group assembly 11 and the first metal shell 121 of the line end connector 12 is shown, while the outer shielding member 13B disposed between the line group assembly 11 and the second metal shell 122 of the line end connector 12 is omitted due to viewing angle issues.

[0082] Please refer to Figure 4 and Fig.11 In this embodiment, a first lateral extension structure 131A and a second lateral extension structure 131B are respectively disposed on opposite sides of each of the outer shielding members 13A and 13B.

[0083] Among them, the first lateral extension structure 131A of each of the outer shielding parts 13A and 13B is located above and below the first high-frequency signal line group 111 and the first shielded signal line group 113 in the first area 1A, and the first lateral extension structure 131A is electrically in contact with the shielded conductor 1111 of the first high-frequency signal line group 111 and the shielded signal core wire of the first shielded signal line group 113, and is electrically in contact with the first metal shell 121 / second metal shell 122 located above and below the first area 1A, thereby, the shielded signal of the first shielded signal line group 113 can be transmitted to the first metal shell 121 / second metal shell 122 of the line end connector 12 via the first lateral extension structure 131A, thereby forming a first shielding structure S1, thereby providing shielding for the transmission of high-frequency signals in the first area 1A.

[0084] Similarly, the second lateral extension structure 131B of each of the outer shielding parts 13A and 13B is located above and below the second high-frequency signal line group 112 and the first shielded signal line group 114 in the second area 1B, and the second lateral extension structure 131B is electrically in contact with the shielded conductor 1121 of the second high-frequency signal line group 112 and the shielded signal core wire of the first shielded signal line group 114, and is electrically in contact with the first metal shell 121 / second metal shell 122 located above and below the second area 1B. Thereby, the shielded signal of the first shielded signal line group 114 can be transmitted to the first metal shell 121 / second metal shell 122 of the line end connector 12 via the second lateral extension structure 131B, thereby forming a second shielding structure S2 to provide shielding for the transmission of high-frequency signals in the second area 1B.

[0085] like Fig.11 As shown, in another embodiment, an electrical contact body 15, for example made of a solder block, may be further arranged near (for example, at a lower position) the first high-frequency signal line group 111, the second high-frequency signal line group 112, the first shielded signal line group 113, and the second shielded signal line group 114 to ensure that the first high-frequency signal line group 111, the second high-frequency signal line group 112, the first shielded signal line group 113, and the second shielded signal line group 114 maintain good electrical contact with the first lateral extension structure 131A and the second lateral extension structure 131B of the shielding component 13, and further ensure that the first lateral extension structure 131A and the second lateral extension structure 131B of the shielding component 13 maintain good electrical contact with the first metal shell 121 / the second metal shell 122 of the line end connector 12.

[0086] Optional, reference Figure 4 , Figure 5 and Fig.11A first shielding signal circuit group 116 and a second shielding signal circuit group 117 are also arranged on the printed circuit board 14, wherein the first shielding signal circuit group 116 is arranged at the junction of the first area 1A and the third area 1C, and the second shielding signal circuit group 117 is arranged at the junction of the second area 1B and the third area 1C.

[0087] Correspondingly, the two outer shielding members 13A and 13B of the shielding assembly 13 each further have a first longitudinal extension structure 133A and a second longitudinal extension structure 133B, wherein:

[0088] The first longitudinal extension structure 133A extends from the outer shielding component 13A / outer shielding component 13B body to the printed circuit board 14 and electrically contacts the first shielding signal circuit group 116 to provide shielding between the first area 1A and the third area 1C; the second longitudinal extension structure 133B extends from the outer shielding component 13A / outer shielding component 13B body to the printed circuit board 14 and electrically contacts the second shielding signal circuit group 117 to provide shielding between the second area 1B and the third area 1C.

[0089] As mentioned above, when a third area 1C is provided between the first area 1A and the second area 1B, the outer shielding members 13A and 13B in the shielding assembly 13 also each have a bridging structure 132, which spans the third area 1C to provide an electrical connection between the first shielding structure S1 located in the first area 1A and the second shielding structure S2 located in the second area 1B.

[0090] like Figure 4 As shown, the jumper structure 132 of the shielding component 13 is arranged across the printed circuit board 14 of the third area 1C, and the above-mentioned insulating structure 16 (for example, a plate-like body made of insulating resin) is clamped between the shielding component 13 and the printed circuit board 14 to avoid electrical short circuit between the shielding component 13 and the printed circuit board 14.

[0091] In another embodiment, the cable assembly 11 may be designed as a double-layer flat cable structure, and the cable assembly 11 further includes a first cable assembly layer 11A disposed adjacent to the first metal shell 121 and a second cable assembly layer 11B disposed adjacent to the second metal shell 122. Figure 2B , Fig.11 The first wire group layer 11A and the second wire group layer 11B are stacked up and down, wherein the first wire group layer 11A located at the upper layer includes a first high-frequency signal wire group 111A, a second high-frequency signal wire group 112A, a first shielded signal wire group 113A and a second shielded signal wire group 114A, and the second wire group layer 11B located at the lower layer includes a first high-frequency signal wire group 111B, a second high-frequency signal wire group 112B, a first shielded signal wire group 113B and a second shielded signal wire group 114B.

[0092] See also Figures 7 to 9 In the case where the line group assembly 11 is designed as a double-layer flat cable structure, the shielding component 13 further includes an intermediate shielding member 134, which is located between the first line group layer 11A and the second line group layer 11B. Optionally, the intermediate shielding member 134 is, for example, a metal plate disposed between the first line group layer 11A and the second line group layer 11B.

[0093] Correspondingly, the port 123 of the line end connector 12 also includes a first sub-port 123A and a second sub-port 123B (please refer to Figure 2B and Figure 3 ), wherein the first sub-port 123A provides electrical connection to the first wiring group layer 11A, and the second sub-port 123B provides electrical connection to the second wiring group layer 11B.

[0094] Optionally, the line end connector 12 further includes an insulating base 125, wherein the first sub-port 123A electrically connected to the first line group layer 11A and the second sub-port 123B electrically connected to the second line group layer 11B can be respectively mounted on the insulating base 125. In addition, the insulating base 125 also provides a first metal shell 121 and a second metal shell 122 to be mounted thereon, so as to assemble and form the overall structure of the line end connector 12.

[0095] In this embodiment, please refer to Figure 2B and Fig.11 The outer shielding member 13A in the shielding component 13 can provide the shielding conductors 1111 and 1121 of the first high-frequency signal line group 111A and the second high-frequency signal line group 112A in the first line group layer 11A, respectively electrically connected to the first metal shell 121 and the intermediate shielding member 134 of the line end connector 12 to form a third shielding structure S3, which is used to provide shielding for the periphery of the first high-frequency signal line group 111A and the second high-frequency signal line group 112A of the first line group layer 11A where they are electrically connected to the line end connector 12. At the same time, the outer shielding member 13B in the shielding assembly 13 can provide the shielding conductors 1111 and 1121 of the first high-frequency signal line group 111B and the second high-frequency signal line group 112B in the second line group layer 11B, which are respectively electrically connected to the second metal shell 122 and the intermediate shielding member 134 of the line end connector 12 to form a fourth shielding structure S4, which is used to provide shielding for the periphery of the first high-frequency signal line group 111B and the second high-frequency signal line group 112B of the second line group layer 11B where they are electrically connected to the line end connector 12.

[0096] It should also be noted that the intermediate shielding member 134 located between the first wiring group layer 11A and the second wiring group layer 11B can also prevent the signal transmissions of the first wiring group layer 11A and the second wiring group layer 11B from interfering with each other.

[0097] In another embodiment, when the line group assembly 11 also includes a low-frequency signal circuit group 115, the intermediate shielding member 134 is also simultaneously spaced between the first circuit layer 1151 and the second circuit layer 1152 of the low-frequency signal circuit group 115 to provide shielding between the first circuit layer 1151 and the second circuit layer 1152.

[0098] Please refer to Figure 4 and Figure 6 , showing a connection diagram of various signal lines between the line group assembly 11 and the port 123 of the line end connector 12.

[0099] In this embodiment, the first high-frequency signal line group 111 and the second high-frequency signal line group 112 in the line group assembly 11 are, for example, line groups composed of coaxial lines, which are electrically connected to the connection terminals 211 and 212 of the port 123 respectively; the first shielded signal line group 113 and the second shielded signal line group 114 in the line group assembly 11 are, for example, line groups composed of electronic wires for grounding purposes (i.e., grounding wires), which are electrically connected to the connection terminals 213 and 214 of the port 123 respectively; the printed circuit board 14 is, for example, FFC or FPC, the low-frequency signal circuit group 115 arranged on the printed circuit board 14 is electrically connected to the connection terminal 215 of the port 123; the first shielding signal circuit group 116 and the second shielding signal circuit group 117 on the printed circuit board 14 are, for example, grounding circuits, which are respectively electrically connected to the connection terminals 216 and 217 of the port 123; in addition, power supply circuits 118 and 119 are also arranged on the printed circuit board 14, which are respectively electrically connected to the connection terminals 218 and 219 of the port 123.

[0100] In summary, the wire-to-board signal transmission mechanism of the present application can form independent first and second shielding structures in the first and second regions respectively through the setting of the shielding component, so as to provide shielding functions for the transmission of high-frequency signals in the first and second regions respectively. Therefore, in addition to suppressing overflow waves to prevent signal attenuation, the wire-to-board signal transmission mechanism of the present application also has excellent anti-interference performance, which makes the high-frequency signal transmission stable and enables the high-frequency signal to be transmitted over longer distances, thereby solving the problem that the existing wire-to-board signal transmission mechanism cannot transmit high-frequency signals over long distances.

[0101] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person skilled in the art may modify and change the above embodiments without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be as set forth in the claims of the present application.

Claims

1. A wire-to-board signal transmission mechanism, wherein a first area and a second area are defined in the wire-to-board signal transmission mechanism, and the wire-to-board signal transmission mechanism comprises: A line group assembly, the line group assembly comprising a first high-frequency signal line group, a second high-frequency signal line group, a first shielded signal line group, and a second shielded signal line group, wherein the first high-frequency signal line group and the second high-frequency signal line group transmit high-frequency signals respectively, the first shielded signal line group and the second shielded signal line group transmit shielded signals respectively, and wherein the first high-frequency signal line group and the second high-frequency signal line group each have a shielded conductor, and wherein the first high-frequency signal line group and the first shielded signal line group are located in the first area, and the second high-frequency signal line group and the second shielded signal line group are located in the second area; A line end connector, the line end connector is electrically connected to the first high-frequency signal line group and the second high-frequency signal line group to receive the high-frequency signal, and the line end connector also has a metal shell; and A shielding component, wherein the shielding conductor of the first high-frequency signal line group in the first area and the first shielding signal line group are electrically connected to the metal shell of the line end connector to form a first shielding structure, and the shielding conductor of the second high-frequency signal line group in the second area and the second shielding signal line group are electrically connected to the metal shell of the line end connector to form a second shielding structure, and the shielding signal is transmitted by the first shielding structure and the second shielding structure to provide shielding for the transmission of the high-frequency signal in the first area and the second area respectively.

2. The wire-to-board signal transmission mechanism according to claim 1, wherein: The wire-to-board signal transmission mechanism also defines a third area located between the first area and the second area. The wire-to-board signal transmission mechanism also includes at least one printed circuit board located in the third area. The wire-to-board signal transmission mechanism also includes a low-frequency signal circuit group arranged on the printed circuit board for transmitting low-frequency signals.

3. The wire-to-board signal transmission mechanism according to claim 2, wherein: The shielding assembly also has an outer shielding member, which provides electrical connection between the wire group assembly and the metal shell, and the shielding assembly also has a bridging structure, which spans across the third area to provide electrical connection between the first shielding structure and the second shielding structure.

4. The wire-to-board signal transmission mechanism according to claim 2, further comprising: A first shielding signal circuit group and a second shielding signal circuit group are arranged on the printed circuit board, wherein: The first shielding signal circuit group is arranged at the junction of the first area and the third area, and the second shielding signal circuit group is arranged at the junction of the second area and the third area; The shielding assembly also has a first longitudinal extension structure and a second longitudinal extension structure; the first longitudinal extension structure extends toward the printed circuit board and electrically contacts the first shielding signal circuit group to provide shielding between the first area and the third area; The second longitudinally extending structure extends toward the printed circuit board and electrically contacts the second shielding signal circuit group to provide shielding between the second area and the third area.

5. The wire-to-board signal transmission mechanism according to claim 2, wherein: The metal shell includes a first metal shell and a second metal shell; The line group assembly further includes a first line group layer disposed adjacent to the first metal shell and a second line group layer disposed adjacent to the second metal shell, the first line group layer and the second line group layer each including the first high-frequency signal line group, the second high-frequency signal line group, the first shielding signal line group and the second shielding signal line group; And wherein, the shielding component also includes: an intermediate shielding member, the intermediate shielding member being located between the first wire group layer and the second wire group layer; wherein, The shielding assembly also includes providing shielding conductors of the first high-frequency signal line group and the second high-frequency signal line group in the first line group layer to respectively electrically connect the first metal shell and the intermediate shielding member of the line end connector to form a third shielding structure to provide shielding at the periphery where the first high-frequency signal line group and the second high-frequency signal line group in the first line group layer are electrically connected to the line end connector; and providing shielding conductors of the first high-frequency signal line group and the second high-frequency signal line group in the second line group layer to respectively electrically connect the second metal shell and the intermediate shielding member of the line end connector to form a fourth shielding structure to provide shielding at the periphery where the first high-frequency signal line group and the second high-frequency signal line group in the second line group layer are electrically connected to the line end connector; and wherein, The intermediate shielding member prevents signal transmissions of the first wire group layer and the second wire group layer from interfering with each other.

6. The wire-to-board signal transmission mechanism according to claim 5, wherein: The first wire group layer and the second wire group layer are stacked one on top of the other.

7. The wire-to-board signal transmission mechanism according to claim 5, wherein: The low-frequency signal circuit group also includes a first circuit layer disposed adjacent to the first metal shell and a second circuit layer disposed adjacent to the second metal shell, and the intermediate shielding member is located between the first circuit layer and the second circuit layer to provide shielding between the first circuit layer and the second circuit layer.

8. The wire-to-board signal transmission mechanism according to claim 7, wherein: The first circuit layer and the second circuit layer are stacked one above the other.

9. The wire-to-board signal transmission mechanism according to claim 5, wherein: The intermediate shielding member is a metal plate.

10. The wire-to-board signal transmission mechanism according to claim 1, wherein: The first high-frequency signal line group and the second high-frequency signal line group are each a line group consisting of at least one coaxial line, and the first shielded signal line group and the second shielded signal line group are each a line group consisting of at least one electronic line.

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