Drive system, lithography device and method for manufacturing article

Abstract

The present invention relates to a drive system, a photolithography device, and an article manufacturing method. In order to provide a drive system capable of high-precision driving, the drive system comprises: a motor including a stator and a mover; a position detection unit for detecting the relative position of the stator and the mover of the motor; an acquisition unit for acquiring magnetic flux density information corresponding to the relative position as a reference; a measuring unit for measuring the actual magnetic flux density information corresponding to the relative position; and a control unit for setting the relative position when the magnitude of the magnetic flux density information as a reference is consistent with a predetermined setting value as a first relative position, setting the relative position when the magnitude of the magnetic flux density information measured by the measuring unit is consistent with the predetermined setting value as a second relative position, acquiring the difference between the first relative position and the second relative position multiple times during a period in which the measured magnetic flux density information changes by one cycle, and controlling the driving of the motor according to the difference each time in the multiple times.

Description

Technical Field

[0001] The invention relates to a driving system, a photolithography device and an article manufacturing method. Background Art

[0002] In order to accurately drive the motor, a current command value that matches the spatial distribution of the magnetic flux density generated by the mover or stator must be provided. However, there is an error between the magnetic flux density calculated based on the value of the position detection unit referenced by the current command value and the magnetic flux density actually generated by the mover or stator.

[0003] In order to reduce this error, Japanese Patent No. 3765287 and Japanese Patent Application Laid-Open No. 2008-178237 disclose a system for correcting the value of a position detection unit or a current command value by obtaining the difference between a position where the calculated magnetic flux density becomes zero and a position where the measured magnetic flux density becomes zero. In Japanese Patent No. 3765287 and Japanese Patent Application Laid-Open No. 2008-178237, the value of the position detection unit or the current command value is corrected by measuring the back electromotive force of the motor proportional to the magnetic flux density instead of the magnetic flux density and calculating the position where the magnetic flux density becomes zero. Summary of the invention

[0004] That is, in Japanese Patent No. 3765287 and Japanese Patent Publication No. 2008-178237, the difference between the position where the calculated magnetic flux density becomes zero and the position where the measured magnetic flux density becomes zero is obtained in the entire driving range or during one cycle of magnetic flux change to correct the value of the position detection unit or the current command value. However, in the conventional method, only one difference appears in the entire driving range or during one cycle of magnetic flux change, so the accuracy is low, and even the deviation of the magnetic flux density within one cycle caused by the installation error of multiple magnets cannot be corrected. Therefore, it is not enough to be applied to, for example, photolithography equipment.

[0005] An object of the present invention is to provide a drive system capable of performing high-precision position control.

[0006] Means of solving problems

[0007] In order to achieve the object, a driving system according to one aspect of the present invention is characterized by having:

[0008] A motor, including a stator and a mover;

[0009] A position detection unit, detecting the relative position of the stator and the mover of the motor;

[0010] an acquisition unit that acquires reference magnetic flux density information corresponding to the relative position;

[0011] a measuring unit for measuring actual magnetic flux density information corresponding to the relative position; and

[0012] A control unit sets the relative position when the magnitude of the magnetic flux density information serving as a reference is consistent with a predetermined set value as a first relative position, sets the relative position when the magnitude of the magnetic flux density information measured by the measuring unit is consistent with the predetermined set value as a second relative position, obtains the difference between the first relative position and the second relative position multiple times during a period in which the measured magnetic flux density information changes for one cycle, and controls the drive of the motor based on the difference each time in the multiple times.

[0013] Effects of the Invention

[0014] According to one aspect of the present invention, it is possible to provide a drive system capable of performing position control with high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 1 is a plan view showing a schematic structure of a positioning stage using a linear motor in the embodiment.

[0016] Figure 2 is a structural diagram of a linear motor in an embodiment.

[0017] Figure 3 This is a relationship diagram between the arrangement and magnetic flux density when the arrangement of the origin of the magnet, coil, and position detector in the embodiment is all in accordance with the designed values.

[0018] Figure 4 1 is a diagram showing the force that the mover receives from the coils 121 a to 121 c in the embodiment.

[0019] Figure 5 1 is a diagram for explaining the relationship between the arrangement of the magnet, coil, and position detector and the magnetic flux density when the arrangement of the origin is offset in the embodiment. Figure 5 A is a diagram in which the magnets 114, 119, and the coil 121 are arranged according to the design values, and only the origin of the position detector is offset. Figure 5 B is a diagram in which the origin of the position detector is at a position according to the design value, and the magnets 114, 119, and the coil 121 are misaligned due to manufacturing errors, mounting errors, and the like.

[0020] Figure 6 It is a control block diagram of the drive system in this embodiment.

[0021] Figure 7 This is a flowchart showing a calibration method when the setting value is 1 in the embodiment.

[0022] Figure 8 This is a diagram showing a deviation between an actual magnetic flux density and an ideal magnetic flux density and one set value in the example.

[0023] Fig. 9 This is a flowchart showing a calibration method when there are multiple setting values ​​in the embodiment.

[0024] Fig.10 It is a diagram showing the deviation between the actual magnetic flux density and the ideal magnetic flux density and a plurality of set values ​​in the embodiment.

[0025] Fig.11 It is a diagram showing an example of a scanning exposure device in the embodiment.

[0026] Fig.12 1 is a flowchart showing the sequence of the exposure apparatus in the embodiment. DETAILED DESCRIPTION

[0027] Hereinafter, the preferred embodiment of the drive system of the present invention will be described in detail based on the embodiments and the attached drawings. In addition, in each figure, the same reference numerals are added to the same parts or elements, and repeated descriptions are omitted or simplified.

[0028] [Example 1]

[0029] Figure 1 1 is a top view showing a schematic structure of a positioning stage using a linear motor in an embodiment. In this embodiment, a stage for carrying a substrate of a photolithography device is used as an example for explanation. In addition, in this embodiment, a linear motor including a stator having a plurality of coils and a mover requiring a plurality of permanent magnets is used, but a linear motor including a mover having a plurality of coils and a stator requiring a plurality of permanent magnets may also be used. Alternatively, a conventional rotary type motor may be used instead of a linear motor.

[0030] exist Figure 1 In the embodiment, a pair of movers 31 are provided on both sides of the mounting table 11 in the driving direction (Y-axis direction). The pair of movers 31 cooperate with the corresponding pair of stators 32 to form a linear motor 13A and a linear motor 13B. The structure of the linear motor will be described later.

[0031] The stage 11 is provided with a reflector 12, which reflects the measurement light from the laser interferometer (measurement unit) not shown, and measures the displacement amount in the Y-axis direction or the position P1 [m] of the stage 11. In addition, the linear motor 13A and the linear motor 13B are provided with an encoder not shown, and thereby the displacement amount in the Y-axis direction or the position P2 [m] of the stator 32 of the linear motor 13A and the linear motor 13B is measured.

[0032] At this time, C[m], which is the relative position (hereinafter referred to as commutation position) between the mounting table 11 and the stator 32, is expressed by the formula (1).

[0033] C=P1-P2…(1)

[0034] Figure 2 1 is a configuration diagram of a linear motor in the embodiment, and shows a specific configuration example of a linear motor 13A and a linear motor 13B.

[0035] Figure 1 The mover 31 has a magnet array 111A and a magnet array 111B which are formed as a magnet group consisting of a plurality of permanent magnets, and also has a yoke 115 and a housing 116 which are mounted on the surface of the mounting table for holding the magnet array 111A and the magnet array 111B.

[0036] The magnet array 111A and the magnet array 111B are composed of main pole magnets 114 whose magnetic poles are oriented in the Z direction and auxiliary pole magnets 119 whose magnetic poles are oriented in the Y direction.

[0037] The magnetic pole directions of the main pole magnets 114 are opposite to each other across the auxiliary pole magnets 119 , and the main pole magnets 114 are arranged at equal intervals in the Y direction.

[0038] The auxiliary pole magnet 119 is provided in a direction such that the polarity of the portion of the main pole magnet 114 facing the coil 121 is repelled from the auxiliary pole magnet 119 .

[0039] Figure 1 The stator 32 has coils 121 spaced evenly in the Y direction in a jacket 122, and is arranged to sandwich the stator 31 from above and below. Here, there is a relationship represented by the following formula (2) between the pitch MP of the main pole magnets 114 and the pitch CP of the coils 121.

[0040] CP=1.5*MP…(2)

[0041] Figure 3 This is a relationship diagram between the configuration and magnetic flux density when the configuration of the magnets 114, 119, coil 121, and the origin of the position detector in the embodiment is all in accordance with the design value. If the design value is followed, the ideal magnetic flux density and the actual magnetic flux density are consistent. The ideal magnetic flux density here refers to the magnetic flux density determined by the commutation position C obtained from a sensor such as a laser interferometer and an encoder and the spacing MP on the design value of the main pole magnet 114. In other words, the magnetic flux density information that becomes the reference is the value obtained from the magnet spacing and relative position of the mover or stator.

[0042] The actual magnetic flux density refers to the magnetic flux density generated by the magnet included in the mover 31 in the coil 121 of the stator 32 .

[0043] Figure 4 1 is a diagram showing the force that the mover receives from the coils 121a to 121c in the embodiment. Figure 2The force applied to the mover 31 from each coil when a constant current flows in the same direction through the coils 121a, 121b, and 121c shown in the figure to move the mover 31 in the Y-axis direction. In the coil 121a, the force becomes a sinusoidal wave between -2.5MP and 0.5MP, and at positions below -2.5MP and above 0.5MP before and after it, only a part of the coil faces the magnet of the mover 13, so the force becomes smaller. In the coil 121b, the force becomes a sinusoidal wave at -1MP to 2MP, and the phase is 90 degrees away from the coil 121a.

[0044] In coil 121c, a sinusoidal force is generated at 0.5MP to 3.5MP, and the phase is 180 degrees away from 121a. Here, in coils 121a and 121c, when a current flows through coil 121a up to 0.5MP, and a current in the opposite direction to the current flows through coil 121c above 0.5MP, a sinusoidal force can be continuously generated. At this time, if a current driver is used to connect the directions of the coils in 121a and 121c in reverse, and a selection switch is used to flow current only in one coil according to the positional relationship between the coil and the magnet, it is not necessary to prepare a current driver in each coil.

[0045] Similarly, by passing a current through the coils in alternating directions at intervals of 3 MP, a sinusoidal force can be continuously generated. In exactly the same way, by passing a current through the coil represented by 121b and the coil next to it in alternating directions, a sinusoidal force can be continuously generated. Here, the coil group represented by 121a is referred to as phase A, and the coil group represented by 121b is referred to as phase B.

[0046] The thrust F generated in the mover 31 is the sum of the thrust received from the A phase and the thrust received from the B phase, as shown in Formula (3).

[0047] F=L*Ba(C)'*Ia(C)+L*Bb(C)'*Ib(C)...(3)

[0048] L is the length of the conductor of the coil and is the same in all coils.

[0049] Ba(C)' is the actual magnetic flux density generated by the magnet of the mover 31 in the coil of the A phase of the stator 32, and Ia(C) is the current flowing through the coil of the A phase of the stator 32. In addition, Bb(C)' is the actual magnetic flux density generated by the magnet of the mover 31 in the coil of the B phase of the stator 32, and Ib(C) is the current flowing through the coil of the B phase of the stator 32. At this time, the ideal magnetic flux densities Ba(C) and Bb(C) are expressed by the following formulas (4) and (5).

[0050] Ba(C)=B*sin(2×π×C / MP)…(4)

[0051] Bb(C)=B*cos(2×π×C / MP)…(5)

[0052] B is the amplitude of the magnetic flux density, and C is the commutation position. When the arrangement of the magnets 114, 119, the coil 121, and the origin of the position detector are all in accordance with the design values, the actual magnetic flux densities Ba(C)' and Bb(C)' are consistent with the ideal magnetic flux densities Ba(C) and Bb(C), and therefore are equivalent.

[0053] In order to make the thrust F generated in the mover 31 constant, the currents Ia(C) and Ib(C) flowing through the A-phase and B-phase of the coil 121 may be matched with the ideal magnetic flux density to be expressed as in equations (6) and (7).

[0054] Ia(C)=I*sin(2×π×C / MP)…(6)

[0055] Ib(C)=I*cos(2×π×C / MP)…(7)

[0056] When equations (4), (5), (6), and (7) are substituted into equation (3), we get

[0057] F=L*B*I*sin(2×π×C / MP)^2+L*B*I*cos(2×π×C / MP)^2

[0058] =L*B*I…(8)

[0059] If the arrangements of the magnets 114, 119, the coil 121, and the origin of the position detector are all in accordance with the designed values, B becomes constant with the amplitude of the magnetic flux density, and I becomes constant with the amplitude of the current, so the thrust F becomes constant.

[0060] Figure 5 This is a diagram showing the relationship between the arrangement and magnetic flux density of the magnet, coil, and position detector in the embodiment when the arrangement of the origin is offset. Figure 5 A is a diagram when the magnets 114, 119, and coils 121 are arranged according to the design values, and only the origin of the position detector is offset. In this case, there is an offset between the ideal magnetic flux density and the actual magnetic flux density. This is because the ideal magnetic flux density calculated by the commutation position C and the pitch MP of the main pole magnet 114 is calculated based on the commutation position output by the position detector with the origin offset.

[0061] Figure 5B is a diagram when the origin of the position detector is at the position according to the design value, and the magnets 114, 119, and coil 121 are offset due to manufacturing errors, installation errors, etc. Depending on the configuration of the magnets 114, 119, and coil 121, the actual magnetic flux density deviates from the ideal magnetic flux density. This is because the pitch MP, which should be constant under the ideal magnetic flux density, varies depending on the position. In the actual linear motor, Figure 5 A. Figure 5 The factor B creates a complex offset between the ideal magnetic flux density and the actual magnetic flux density.

[0062] Therefore, even if the currents Ia(C) and Ib(C) are passed through the linear motor 13 so that the thrust F becomes constant for an ideal magnetic flux density, the thrust generated in the linear motor 13 is not constant because the formula (8) does not hold. In order to make the thrust constant, in this embodiment, the currents Ia(C) and Ib(C) are corrected to match the actual magnetic flux density generated by the magnet of the mover 31.

[0063] Figure 6 1 is a control block diagram of the drive system in this embodiment. In the linear motor 13A and the linear motor 13B, the current driver 42, the switch 43, the back electromotive force acquisition port 48, the commutation position calculator 51, the ideal magnetic flux density calculator 52, the actual magnetic flux density calculator 53, and the offset calculator 54 are independently configured. The commutation position calculator 51, the ideal magnetic flux density calculator 52, the actual magnetic flux density calculator 53, and the offset calculator 54 constitute the processing unit 44.

[0064] The EEPROM 45, the control unit 41, and the mounting table 11 shown in the dotted line frame are structures common to the linear motor 13A and the linear motor 13B. In addition, the control unit 41 has a built-in CPU as a computer, which functions as a control unit that executes various operations of the entire device according to a computer program stored in a memory not shown.

[0065] The commutation position calculator 51 calculates the commutation position C according to the formula (1) using the position P1 of the mounting table 11 obtained by the laser interferometer and the position P2 of the stator 32 obtained by the encoder.

[0066] Here, the commutation position calculator 51 functions as a position detection unit that detects the relative position (commutation position) of the stator and the mover of the motor.

[0067] The ideal magnetic flux density calculator 52 calculates the ideal (reference) magnetic flux density according to equations (4) and (5). The ideal magnetic flux density calculator 52 functions as an acquisition unit that acquires reference magnetic flux density information (voltage value corresponding to magnetic flux) corresponding to the relative position.

[0068] The actual magnetic flux density calculator 53 calculates the actual magnetic flux density based on the back electromotive force acquired from the back electromotive force acquisition port 48. That is, the actual magnetic flux density calculator 53 functions as a measuring unit that measures the actual magnetic flux density information (voltage value) corresponding to the relative position.

[0069] The offset calculator 54 compares the ideal magnetic flux density with the actual magnetic flux density and calculates the difference (offset) in the commutation position when the magnetic flux density reaches the set value H. The ΔC calculated by the offset calculator 54 is associated with the commutation position and stored in a storage medium such as the EEPROM 45.

[0070] The control unit 41 corrects the current command value based on the offset stored in the EEPROM 45 , and sends the command to the current driver 42 .

[0071] The current driver 42 causes a current corresponding to a command value to flow through the linear motor 13 to drive the motor. As a result, the mounting table 11 is driven.

[0072] The following describes in detail the method of correcting the current command value by the control unit 41 (control unit). The control unit 41 executes the following program stored in a memory (not shown). Figure 7 Processing shown.

[0073] Figure 7 is a flowchart showing a calibration method when the setting value is 1 in the embodiment. Figure 7 The flowchart of will be described in detail the correction method of the current command value. In S101, the linear motor 13B is driven at a constant speed v.

[0074] In S102, the switch 43 of the linear motor 13A is connected to the back electromotive force acquisition port 48 to measure the back electromotive forces Va(C) and Vb(C) generated in the coils 121 of the A phase and the B phase of the linear motor 13A when the linear motor 13B is driven at a constant speed v. That is, the measured magnetic flux density information is determined based on the back electromotive force obtained when the actuator is operated.

[0075] Next, in S103, the actual magnetic flux density calculator 53 calculates the actual magnetic flux densities Ba(C)' and Bb(C)' based on the measured back electromotive force.

[0076] Here, a method for calculating the actual magnetic flux density will be described. The back electromotive forces Va(C) and Vb(C) when the mover 31 is operated are expressed by the following formulas.

[0077] Va(C)=v*Ba(C)'*L…(9)

[0078] Vb(C)=v*Bb(C)'*L…(10)

[0079] At this time, if the mover 31 is operated at a constant speed v, L is the length of the conductor and is the same in all coils, so the back electromotive force Va(C) and Vb(C) are proportional to the actual magnetic flux density Ba(C)' and Bb(C)'. Therefore, the previously obtained back electromotive force Va(C) and Vb(C) can be regarded as the actual magnetic flux density Ba(C)' and Bb(C)' of the linear motor 13A.

[0080] In S104 , the ideal magnetic flux density calculator 52 calculates the ideal magnetic flux density using the commutation position calculated by the commutation position calculator 51 and the pitch MP of the main pole magnets 114 .

[0081] In S105, the actual magnetic flux density and the ideal magnetic flux density are normalized. That is, the relative position difference is obtained while the amplitudes are aligned. The actual magnetic flux densities Ba(C)' and Bb(C)' are equivalent to the back electromotive force Va(C) and Vb(C), so the normalized actual magnetic flux density Ba_nor(C)' and Bb_nor(C)' can be obtained by dividing Ba(C)' and Bb(C)' by the amplitude V of the back electromotive force. Similarly, the normalized ideal magnetic flux density Ba_nor(C) and Bb_nor(C) can be obtained by dividing the ideal magnetic flux density Ba(C) and Bb(C) obtained in S104 by the amplitude B.

[0082] This normalization is performed to match the amplitude when calculating the offset between the ideal magnetic flux density Ba(C) and Bb(C) and the actual magnetic flux density Ba(C)' and Bb(C)'. Figure 8 The offset is calculated using any set value between -1 and 1.

[0083] Figure 8 This is a diagram showing a deviation between an actual magnetic flux density and an ideal magnetic flux density and one set value in the example.

[0084] In S106, the offset amount is calculated using the normalized actual magnetic flux density Ba_nor(C)′ and the normalized ideal magnetic flux density Ba_nor(C) obtained previously.

[0085] like Figure 8As shown, an arbitrary predetermined set value H is set in the range of -1 to 1, and the first commutation position and the second commutation position are obtained based on the intersection of the actual magnetic flux density Ba_nor(C)' and the ideal magnetic flux density Ba_nor(C) and the set value H. Here, the set value H is a predetermined set value within the amplitude of the reference magnetic flux density information and the measured magnetic flux density information.

[0086] A plurality of first commutation positions and second commutation positions can be obtained during one cycle of magnetic flux change.

[0087] The first commutation position (first relative position) as the intersection of H and Ba_nor (C) is set to C1, C2, C3, ..., and the second commutation position (second relative position) as the intersection of H and Ba_nor (C)' is set to C1', C2', C3', .... That is, the control unit sets the relative position when the magnitude of the magnetic flux density information (voltage) that becomes the reference coincides with the predetermined set value as the first relative position, and sets the relative position when the magnitude of the magnetic flux density information measured by the measuring unit coincides with the predetermined set value as the second relative position.

[0088] The commutation positions that are closest to each other, such as C1 and C1', are set as a pair.

[0089] ΔC1=C1-C1'…(11)

[0090] The offset ΔC is calculated using each pair as in the above equation (11).

[0091] In S107, if Figure 8 As shown, the section between the second commutation position C1 ′ and the next second commutation position C2 ′ is defined as INT1, and the calculated offset ΔC1 is associated with INT1 and stored in a storage medium such as the EEPROM 45.

[0092] Similarly, the interval between the second commutation position C2' and the next second commutation position C3' is set as INT2, and the calculated offset ΔC2 is stored in association with INT2. These actions are performed using all offsets. That is, the difference (offset ΔC) between the first relative position and the second relative position is obtained and stored multiple times during a period in which the measured magnetic flux density information changes by one cycle.

[0093] In S108, it is confirmed that the offset amount has been calculated in the linear motor 13B. If it has not been calculated, in S109, the linear motor 13A is driven at a constant speed v this time. Then, S102 to S108 are performed and ended. In this way, both the offset amount data of the linear motor 13A and the offset amount of the linear motor 13B are obtained.

[0094] Thus, in this embodiment, the characteristic point is that the motor 13A and the other motor 13B are provided, and the control unit measures the back electromotive force of the motor 13A by driving the other motor 13B. In addition, the back electromotive force of the other motor 13B is measured by driving the motor 13A. Moreover, the characteristic point is that it is configured so that the mounting table (object) can be moved in the same direction by driving both motors at the same time.

[0095] Next, a method for correcting the current command value using these offsets is described. At the commutation position of the interval of INT1, ΔC1 is substituted into ΔC of the following formulas (12) and (13) to correct the current command value. Similarly, at the commutation position of the interval of INT2, ΔC2 is substituted into ΔC of the formulas (12) and (13) to correct the current command value. That is, the control unit controls the drive current of the motor according to the difference of each of the multiple times.

[0096] Ia(C)=I*sin(2×π×(C-ΔC) / MP)…(12)

[0097] Ib(C)=I*cos(2×π×(C-ΔC) / MP)…(13)

[0098] By adding the offset amount associated with the section including the commutation position at each commutation position and correcting the current command value in detail in this way, it is possible to correct the variation of the offset amount within one cycle in detail.

[0099] That is, it can make Figure 5 The ideal magnetic flux density curve shown in B and the actual magnetic flux density curve match with high accuracy. In addition, in the section until the initial offset is calculated, correction is performed using ΔC1 as the initial offset.

[0100] The current driver 42 causes the current of the corrected command value to flow through the linear motor 13 to drive the motor. Thus, the mounting table 11 is driven with high precision.

[0101] In the above description, a linear motor using coils in the stator and permanent magnets in the mover is used, but the opposite structure may be used.

[0102] [Example 2]

[0103] Fig. 9 is a flowchart showing a correction method when the setting value is multiple in the embodiment, using Fig. 9 The processing for performing a more detailed correction will be described.

[0104] Since the processing of S201 to S205 is the same as that of S101 to S105, the description thereof will be omitted.

[0105] In S206, if Fig.10 In this way, the number of setting values ​​H which is one in the first embodiment is set to a plurality. Fig.10 It is a diagram showing the deviation between the actual magnetic flux density and the ideal magnetic flux density and a plurality of set values ​​in the embodiment.

[0106] In this embodiment, the set value H is set to H1 and H2 from top to bottom. In S207, the offset amount is calculated using the set value set in S206 in the same manner as in S106.

[0107] In S208, it is determined whether S207 has been performed using all the setting values ​​set in S206. If not, S207 is repeated using the next setting value H. When the number of offsets that can be calculated using one setting value is N_sh and the number of setting values ​​is N_st, a total of N_sh*N_st offsets can be obtained.

[0108] In S209, the calculated ΔC is rearranged in the order of the second commutation position C from small to large. Then, in S210, as Fig.10 As shown, the interval between the second commutation position C1' and C2' which is the next second commutation position in the order rearranged in S209 is set as INT1. Then, the calculated offset ΔC1 is associated with INT1 and stored in a storage medium such as EEPROM 45.

[0109] Similarly, the section between the second commutation position C2 ′ and C5 ′ which is the next second commutation position in the order rearranged in S209 is defined as INT2, and the calculated offset ΔC2 is associated with INT2 and stored.

[0110] These operations are performed using all the offsets. In S211, it is confirmed that the offset has been calculated in the linear motor 13B. If it has not been calculated, the linear motor 13A is driven at a constant speed v in S212. Then, S202 to S211 are performed and ended. In this way, both the offset data of the linear motor 13A and the offset of the linear motor 13B are obtained.

[0111] Regarding the correction, the correction is performed at each commutation position using the offset associated with the section to which the commutation position belongs, similarly to Embodiment 1. This allows the correction to be performed in finer sections, so that more accurate correction can be performed sequentially.

[0112] In addition, in this description, a linear motor using coils in the stator and permanent magnets in the mover is used, but the opposite structure may be used.

[0113] In addition, the offset obtained in this embodiment can be used to correct the current command value (drive current) and can also be used to correct the timing of coil switching. As mentioned above, the linear motor controls the coil through which the current flows to drive. When switching the coil, it is ideal to switch in a way that the current observed in the entire phase becomes smooth.

[0114] The switching timing is determined by the design value of the coil, but if Figure 5 As shown in B, the magnets 114, 119, and the coil 121 are offset due to manufacturing errors, installation errors, etc. When switching is performed at the commutation position T1, which is the switching timing based on the design value, the corrected current command value cannot be smooth. Therefore, by correcting the switching timing T1 using the offset calculated in this embodiment and setting it to T2, the current can be switched smoothly.

[0115] Next, an example in which a drive system that performs correction taking into account the deviation of magnetic flux density within one cycle is applied to scanning exposure device 600 will be described.

[0116] Fig.11 6 is a diagram showing an example of a scanning exposure device in the embodiment, and the scanning exposure device 600 is a step-and-scan exposure device that uses slit light shaped by a slit to perform scanning exposure on a substrate 14. The scanning exposure device 600 includes an illumination optical system 23, an original plate stage 26, a projection optical system 27, a substrate stage 15, an original plate stage position measuring unit 17, a substrate stage position measuring unit 18, a substrate mark measuring unit 21, a substrate conveying unit 22, and a control unit 24.

[0117] The substrate stage 15 is a stage for moving while holding a substrate, and is driven by the driving system of the embodiment.

[0118] The control unit 24 controls the illumination optical system 23 , the original plate stage 26 , the projection optical system 27 , the substrate stage 15 , the original plate stage position measuring unit 17 , the substrate stage position measuring unit 18 , the substrate mark measuring unit 21 , and the substrate conveying unit 22 .

[0119] The control unit 24 controls a process of transferring a pattern formed on the original plate to the substrate 14 (a process of performing scanning exposure on the substrate 14 ).

[0120] The control unit 24 is formed of, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array).

[0121] Alternatively, it may be constituted by an ASIC (Application Specific Integrated Circuit), a general-purpose computer with an embedded program, or a combination of all or part of them. In addition, the control unit 24 also includes a driver for controlling the actuator.

[0122] The illumination optical system 23 illuminates the original plate 25. The illumination optical system 23 uses a masking blade or other light shielding member to shape the light emitted from a light source (not shown) into a slit light having a long strip or arc shape in the X direction, for example, and uses the slit light to illuminate a portion of the original plate 25. The original plate 25 and the substrate 14 are held by the original plate stage 26 and the substrate stage 15, respectively, and are respectively arranged at positions that are substantially optically conjugate with the projection optical system 27 interposed therebetween (the object plane and the image plane of the projection optical system 27).

[0123] The projection optical system 27 has a predetermined projection magnification (e.g., 1 / 2 times, 1 / 4 times), and projects the pattern of the original plate 25 onto the substrate 14 using slit light. The area on the substrate 14 where the pattern of the original plate 25 is projected (the area irradiated with the slit light) is called the irradiation area. The original plate stage 26 and the substrate stage 15 are configured to be movable in a direction (Y direction) orthogonal to the optical axis direction (Z direction) of the projection optical system 27. The original plate stage 26 and the substrate stage 15 are relatively scanned at a speed ratio corresponding to the projection magnification of the projection optical system 27 while being synchronized with each other.

[0124] Thus, the substrate 14 is scanned in the Y direction with respect to the irradiation area, and the pattern formed on the original plate 25 is transferred to the shot area on the substrate 14. Then, while the substrate stage 15 is moved, such scanning exposure is sequentially performed on each of the plurality of shot areas of the substrate 14, thereby completing the exposure process on one substrate 14.

[0125] The plate stage position measuring unit 17 includes, for example, a laser interferometer, and measures the position of the plate stage 26. The laser interferometer irradiates, for example, a laser beam toward a reflector (not shown) provided on the plate stage 26, and detects the displacement of the plate stage 26 (displacement from the reference position) by interference between the laser beam reflected by the reflector and the laser beam reflected by the reference surface.

[0126] The plate stage position measuring unit 17 can obtain the current position of the plate stage 26 based on the displacement. Here, the plate stage position measuring unit 17 measures the position of the plate stage 26 by a laser interferometer using a laser, but is not limited to this. For example, the position of the plate stage 26 may be measured by an encoder.

[0127] The substrate stage position measuring unit 18 includes, for example, a laser interferometer, and measures the position of the substrate stage 15. The laser interferometer irradiates, for example, a laser toward a reflector (not shown) provided on the substrate stage 15, and detects the displacement (displacement from the reference position) of the substrate stage 15 by interference between the laser reflected by the reflector and the laser reflected by the reference surface. The substrate stage position measuring unit 18 can obtain the current position of the substrate stage 15 based on the displacement.

[0128] Here, the substrate stage position measuring unit 18 measures the position of the substrate stage 15 by a laser interferometer using laser light, but the present invention is not limited thereto, and for example, the position of the substrate stage 15 may be measured by an encoder.

[0129] The substrate mark measuring unit 21 includes, for example, an imaging element, and can detect the position of a mark provided on the substrate.

[0130] Here, the substrate mark measuring unit 21 of the present embodiment detects the mark by an imaging element, but the present invention is not limited thereto, and for example, the mark may be detected by a transmission type sensor.

[0131] The substrate transport unit 22 supplies and recovers the substrate to the substrate mounting table 15 .

[0132] use Fig.12 The flowchart shows the sequence when printing the pattern of the original plate of the exposure device onto the substrate. Fig.12 1 is a flowchart showing the sequence of the exposure apparatus in the embodiment.

[0133] In step S700, the exposure sequence is started, and in step S701, the substrate transport unit 22 supplies (loads) the substrate (wafer) 14 onto the substrate stage 15. Next, in step S702, the substrate stage 15 is driven so that the mark on the substrate 14 defined in the exposure plan enters the measurement field of the substrate mark measurement unit 21, and the substrate is aligned.

[0134] Thereafter, in step S703 , the original plate mounting stage 26 and the substrate mounting stage 15 are synchronized and scan-driven, and the original plate pattern is sequentially exposed on the substrate 14 via the projection optical system 27 .

[0135] At this time, the exposure sequence and exposure angle defined in the exposure plan are followed. Finally, in step S704, the substrate transport unit 22 recovers (unloads) the substrate 14 from the substrate stage. This completes the process of exposing a pattern on the substrate.

[0136] Next, a case where the configuration of the first embodiment is applied to the control of the substrate stage 15 of the second embodiment will be described. Figure 6The control unit 41 corresponds to the control unit 24 , the current driver 42 corresponds to the control unit 24 , the processing unit 44 corresponds to the control unit 24 , the EEPROM 45 corresponds to the control unit 24 , the linear motor 13 corresponds to the substrate stage 15 , and the stage 11 corresponds to the substrate stage 15 .

[0137] By applying a drive system that takes into account the deviation of the magnetic flux density within one cycle to the substrate stage 15, the thrust of the stage can be made close to constant, so the accuracy of the exposure apparatus can be improved.

[0138] When applied to the substrate stage 15 of the scanning exposure device, either a method of setting one setting value as in the first embodiment or a method of setting a plurality of setting values ​​as in the second embodiment can be applied.

[0139] in addition, Figure 7 , Fig. 9 The offset saving process shown is in progress Fig.12 Then, the substrate stage 15 is driven while applying the correction method of the current command value shown in the first or second embodiment using the offset amount stored in advance.

[0140] In this way, by applying a drive system that stores a plurality of offsets and uses them to correct the current command value when controlling the substrate stage 15, an effect is achieved in which exposure can be performed with high accuracy in the exposure sequence of S703.

[0141] Furthermore, when the control of the first or second embodiment is applied to the position control of the original plate mounting table 26, Figure 6 The control unit 41, the current driver 42, the processing unit 44, the EEPROM 45, etc. are included in the control unit 24. In addition, the linear motor 13 corresponds to a motor for driving the original plate mounting table 26, and the mounting table 11 corresponds to the original plate mounting table 26.

[0142] Similar to the case of applying to the substrate stage 15, this embodiment can also be applied to the original plate stage 26 that holds the original plate. Even when applied to the original plate stage 26, the offset amount can be stored and the current command value can be corrected with high accuracy.

[0143] That is, similarly to the substrate stage 15 , the original plate stage 26 also stores a plurality of offset amounts and uses them to correct the current command value, thereby achieving an effect of being able to perform exposure with high accuracy in the exposure sequence of S703 .

[0144] Next, a method for manufacturing an article (semiconductor IC element, liquid crystal display element, MEMS, etc.) using the above-mentioned exposure apparatus will be described.

[0145] The article is manufactured, for example, by exposing a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent using the above-mentioned exposure device, developing the substrate (photosensitive agent), and processing the developed substrate in a post-processing step.

[0146] Alternatively, the article is manufactured by using a mold as a master plate in an imprint apparatus through a post-processing step (a step of manufacturing an article from the imprinted substrate) of imprinting a substrate coated with an imprint material and a step of demoulding.

[0147] In addition, post-processing steps include etching, resist stripping, dicing, bonding, packaging, etc.

[0148] According to the article manufacturing method using the present invention as described above, high-precision position control can be performed, so that articles with higher quality than before can be manufactured.

[0149] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist of the present invention.

[0150] For example, in the embodiments, the description is given using the stage control device and the exposure device, but the invention can also be applied to other photolithography devices.

[0151] For example, as the photolithography apparatus, a planarization apparatus that performs molding so as to planarize a component of a substrate using a mold (a flat template) having a flat portion without a concavo-convex pattern may be used.

[0152] In addition, as another example of the photolithography apparatus, there may be an apparatus such as a drawing apparatus that draws on a substrate using charged particle beams (electron beams, ion beams, etc.) via a charged particle optical system to form a pattern on the substrate.

[0153] In addition, part or all of the control in this embodiment can also be realized by supplying a computer program that realizes the functions of the above-mentioned embodiment to the drive system via a network or various storage media. Moreover, the program can also be read out and executed by a computer (or CPU, MPU, etc.) in the drive system. In this case, the program and the storage medium storing the program constitute the present invention.

[0154] In addition, the present application claims priority based on Japanese Patent Application No. 2020-74809 filed in Japan on April 20, 2020, and the entire contents of the above-mentioned Japanese Patent Application No. 2020-74809 are hereby incorporated by reference into the present application.

Claims

1. A drive system, characterized in that: have: A motor, including a stator and a mover; A position detection unit, detecting the relative position of the stator and the mover; an acquisition unit that acquires reference magnetic flux density information corresponding to the relative position; A measuring unit, measuring actual magnetic flux density information corresponding to the relative position; as well as A control unit controls the driving of the motor, The control unit obtains, for each of the N_st predetermined setting values, the difference between the first relative position when the magnitude of the magnetic flux density becoming the reference is consistent with the predetermined setting value and the second relative position when the magnitude of the magnetic flux density measured by the measuring unit is consistent with the predetermined setting value N_sh times during one cycle of the measured change in the magnetic flux density information, and controls the drive of the motor based on all N_sh*N_st differences obtained regarding the N_st predetermined setting values, where N_st>1, N_sh>1.

2. The drive system according to claim 1, characterized in that: The stator includes a plurality of coils, and the mover includes a plurality of permanent magnets.

3. The drive system according to claim 1, characterized in that: The stator includes a plurality of permanent magnets, and the mover includes a plurality of coils.

4. The drive system according to any one of claims 1 to 3, characterized in that: The magnetic flux density information serving as the reference is a value obtained from the magnet interval and relative position of the mover or stator.

5. The drive system according to claim 1, characterized in that: The measured magnetic flux density information is determined based on the back electromotive force obtained when the mover is operated.

6. The drive system according to claim 5, characterized in that: The drive system further includes another motor for moving the mover, and the control unit drives the motor and the other motor simultaneously to move a predetermined object in the same direction.

7. The drive system according to claim 6, characterized in that: The control unit measures magnetic flux density information of the other motor based on a back electromotive force obtained when a mover of the other motor is operated by driving the motor.

8. The drive system according to claim 1, characterized in that: The magnetic flux density information is a voltage value corresponding to the magnetic flux.

9. The drive system according to claim 1, characterized in that: The predetermined set value is a predetermined set value within the amplitude of the reference magnetic flux density information and the measured magnetic flux density information including 0.

10. The drive system according to claim 1, characterized in that: The control unit acquires the difference in a state where the amplitudes of the reference magnetic flux density information and the measured magnetic flux density information are aligned.

11. The drive system according to claim 1, characterized in that: The control unit controls the driving current of the motor according to the difference each time among the plurality of times.

12. The drive system according to claim 1, characterized in that: The control unit controls the switching timing of the coils of the motor according to the difference each time among the plurality of times.

13. A photolithography apparatus for forming a pattern of an original plate on a substrate, characterized in that: have: a mounting table for holding the substrate or the original plate; and A driving system drives the mounting table. The drive system comprises: A motor, including a stator and a mover; A position detection unit, detecting the relative position of the stator and the mover; an acquisition unit that acquires reference magnetic flux density information corresponding to the relative position; A measuring unit, measuring actual magnetic flux density information corresponding to the relative position; as well as A control unit controls the driving of the motor, The control unit obtains, for each of the N_st predetermined setting values, the difference between the first relative position when the magnitude of the magnetic flux density becoming the reference is consistent with the predetermined setting value and the second relative position when the magnitude of the magnetic flux density measured by the measuring unit is consistent with the predetermined setting value N_sh times during one cycle of the measured change in the magnetic flux density information, and controls the drive of the motor based on all N_sh*N_st differences obtained regarding the N_st predetermined setting values, where N_st>1, N_sh>1.

14. A method of manufacturing an article, comprising: A process of forming a pattern on a substrate using the photolithography apparatus according to claim 13; and A step of manufacturing an article from the substrate having the pattern formed thereon.

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