A wafer handling device including drainage function

Abstract

The present invention discloses a wafer handling device with drainage function, including a drainage unit, the drainage unit including a dripping drainage subunit, the dripping drainage subunit including an upper water receiving tray and a lower water receiving tray, the upper water receiving tray is fixed on the θ axis, the lower water receiving tray is fixed on the Z axis body, and the upper water receiving tray and the θ axis can rotate and lift relative to the Z axis body; the upper water receiving tray includes a first drainage hole, the lower water receiving tray includes a first drainage port, the first drainage hole is connected to the lower water receiving tray through a first drainage pipe; water on the wafer falls into the upper water receiving tray, enters the lower water receiving tray through the first drainage hole and the first drainage pipe, and is discharged from the wafer handling device through the first drainage port. The device can ensure that the water on the wafer is discharged through a specific drainage structure, thereby ensuring the service life of the wafer handling device.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor devices, and in particular to a wafer transport device with a drainage function. Background Art

[0002] In the semiconductor field, wafer handling and transmission, wafer handling robots are needed to transfer wafers between various stations. For polishing purposes, some stations need to clean the wafers, which results in a layer of water on the wafers and a small amount of splashing water around them. When the wafer is being transferred or flipped, water will enter the robot, shortening the robot's life and damaging some key components inside.

[0003] In the attached Figure 1 In the single-arm wafer flipping robot, when wafer 1 is flipped and transported, due to inertia and flipping, water will flow from wafer 1 to the fixed flange 2. Part of the water on the fixed flange 2 flows to the outside of the flange, and part of the water flows into the robot through the inner hole of the flange, affecting the robot, especially the internal electrical components.

[0004] In the attached Figure 2 In the dual-arm wafer handling robot, during the wafer handling process, due to inertia, water will also flow onto the flange and enter the robot, affecting it.

[0005] As attached Figure 1 and attached Figure 2 In addition to the impact of dripping water on the robot, splashing water will also enter the robot and affect it.

[0006] In order to solve this problem, the traditional method is to add a telescopic tube to the cleaning device or the robot arm. This method is only suitable for occasions with large amounts of water and splashing, and has a small scope of application. At the same time, there are also problems such as high cost and difficulty in transformation, resulting in high cost of the entire device, long transformation cycle, and cumbersome maintenance. In addition, the life of the telescopic tube is short, and it is easy to generate particles when it is stretched back and forth, and it is troublesome to replace it. Summary of the invention

[0007] In order to solve the above problems, the present invention provides a wafer handling device including a drainage function; the device can ensure that water on the wafer is discharged through a specific drainage structure, thereby ensuring the service life of the wafer handling device.

[0008] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a wafer handling device with a drainage function, comprising a Z-axis body, a θ-axis located at the upper end of the Z-axis body, a mechanical arm located at the upper end of the θ-axis, a flip unit located at the front end of the mechanical arm, and a drainage unit, wherein the drainage unit comprises a dripping drainage subunit, wherein the dripping drainage subunit comprises an upper water receiving tray and a lower water receiving tray, wherein the upper water receiving tray is fixed on the θ-axis, and the lower water receiving tray is fixed on the Z-axis body, and the upper water receiving tray and the θ-axis can perform rotation and lifting motion relative to the Z-axis body;

[0009] The upper water receiving tray comprises a first drainage hole, the lower water receiving tray comprises a first drainage port, and the first drainage hole is connected to the lower water receiving tray through a first drainage pipe;

[0010] The robotic arm and flip unit are used to transport and flip wafers. During the wafer transport and flipping process, water on the wafer falls into the upper water tray, enters the lower water tray through the first drain hole and the first drain pipe, and is discharged from the wafer transport device through the first drain port.

[0011] Furthermore, the lower water receiving tray includes a boss that is in close contact with the Z-axis body.

[0012] Furthermore, the first drain port is located outside the lower water receiving tray.

[0013] Furthermore, the Z-axis body includes a lifting tube, a lifting tube flange, a synchronous pulley, a bearing, an outer ring flange and an inner ring flange; the lifting tube is fixed on the lifting tube flange, and the lifting tube flange is connected to the outer ring flange through a synchronous pulley; the outer ring flange presses the outer ring of the bearing, and the inner ring flange presses the inner ring of the bearing;

[0014] The drainage unit also includes a splash water discharge subunit, which includes a third drainage hole, a fourth drainage hole and a second drainage pipe; a second drainage pipe is arranged between the lifting circular tube flange and the inner ring flange, and the lifting circular tube flange includes a third drainage hole, the third drainage hole is connected to one end of the second drainage pipe, and the other end of the second drainage pipe extends to the inner ring flange; the inner ring flange includes a fourth drainage hole, and water on the lifting circular tube flange is discharged from the device through the third drainage hole, the second drainage pipe and the fourth drainage hole.

[0015] Furthermore, the outer ring flange comprises an outer ring upper pressure flange and an outer ring lower pressure flange, and the outer ring upper pressure flange and the outer ring lower pressure flange press the outer ring of the bearing.

[0016] Furthermore, the inner ring flange includes an inner ring upper pressure flange and an inner ring lower pressure flange, and the inner ring upper pressure flange and the inner ring lower pressure flange press the inner ring of the bearing; the inner ring upper pressure flange includes a drainage groove and a fourth drainage hole, and the inner ring lower pressure flange includes a second drainage port; and the fourth drainage hole and the second drainage port overlap in the vertical direction.

[0017] Furthermore, the lower end of the second drain outlet of the inner ring downward pressure flange is connected to a joint, and the joint is connected to the outside of the device through the bottom plate drain hole.

[0018] Furthermore, the upper end of the second drain pipe includes a sealing ring, and the sealing ring is pressed by the lifting circular pipe flange and the synchronous pulley to achieve sealing.

[0019] Furthermore, the cross-sectional area of ​​the lifting circular tube flange is larger than the cross-sectional area of ​​the lifting circular tube.

[0020] Furthermore, the synchronous pulley is connected to the driving wheel via a synchronous belt, the driving wheel is connected to the driving unit, and the driving unit drives the lifting tube to rotate via the driving wheel, the synchronous belt, the synchronous pulley and the lifting tube flange.

[0021] The present invention has the following beneficial effects: the present invention ensures that water on the wafer will not enter the robot or the transport device through the cooperation between the drainage unit outside the transport device and the internal drainage structure, thereby solving the problem of the impact of wafer cleaning on the semicircular device in the prior art. The entire structure is simple in design, easy to install and maintain without changing the original robot structure, low in cost, and will not generate particles, which can further improve the cleaning and transmission efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Attached Figure 1 It is a schematic diagram of the structure of a single-arm robot in the prior art;

[0023] Attached Figure 2 It is a schematic diagram of the structure of a dual-arm robot in the prior art;

[0024] Attached Figure 3 This is a schematic diagram of the structure of the single-arm robot in the present invention;

[0025] Attached Figure 4 This is a schematic diagram of the structure of the dual-arm robot in the present invention;

[0026] Attached Figure 5 It is a schematic diagram of the structure of the Z-axis body in the present invention;

[0027] Attached Figure 6 It is a partial enlarged schematic diagram of the Z-axis body;

[0028] Attached Figure 7 It is a structural schematic diagram of the lifting circular pipe flange in the present invention;

[0029] Attached Figure 8 It is a structural schematic diagram of the inner ring upper pressure flange in the present invention;

[0030] Figure numerals: 1 wafer, 2 fixed flange, 3 upper arm, 4 lower arm, 5θ axis, 6Z axis body, 7 single-arm upper water tray, 8 single-arm lower water tray, 9 first drain hole, 10 third arm, 11 double-arm upper water tray, 12 double-arm lower water tray, 13 first drain pipe, 14 flip unit, 15 end effector, 16 lifting circular tube, 17 lifting circular tube flange, 18 synchronous pulley, 19 outer ring upper pressure flange, 20 outer ring lower pressure flange, 21 inner ring upper pressure flange, 22 inner ring lower pressure flange, 23 second drain pipe, 24 sealing ring, 25 joint, 26 bearing, 27 bottom plate drain hole, 28 third drain hole, 29 fourth drain hole, 30 drainage groove. DETAILED DESCRIPTION

[0031] In order to make the objectives, technical solutions and advantages of the present invention more clear, the specific implementation modes of the present invention are further described in detail below with reference to the accompanying drawings.

[0032] The present invention provides a wafer handling device with a drainage function, comprising a Z-axis body, a θ-axis located at the upper end of the Z-axis body, a mechanical arm located at the upper end of the θ-axis, a flip unit located at the front end of the mechanical arm, and a drainage unit, wherein the drainage unit comprises a dripping drainage subunit, and the dripping drainage subunit comprises an upper water receiving tray and a lower water receiving tray, wherein the upper water receiving tray is fixed on the θ-axis, and the lower water receiving tray is fixed on the Z-axis body, and the upper water receiving tray and the θ-axis can rotate and lift relative to the Z-axis body; and the lower water receiving tray is fixed like the Z-axis body. In the present invention, the mechanical arm, flip unit and θ-axis structure can adopt any structure in the prior art, as long as they can realize the flipping and movement of the wafer. Usually, the flip unit is used to clamp the wafer and drive the wafer to flip under power. The robotic arm drives the wafer to move, and the θ-axis drives the robotic arm, the flip unit and the wafer to rotate and lift together. When the θ-axis drives the wafer to rotate and lift, the upper water tray fixed on the θ-axis rotates together with the θ-axis, and the water on the wafer can drip into the upper water tray. The lower water tray fixed on the Z-axis body is always fixed and does not rotate.

[0033] Furthermore, the upper water tray includes a first drain hole, and the lower water tray includes a first drain port, and the first drain hole is connected to the lower water tray through a first drain pipe; in order to prevent water on the lower water tray from entering the interior of the handling device, the lower water tray includes a boss that is close to the Z-axis body, and the first drain port is located on the outside of the lower water tray, ensuring that the water entering the lower water tray is discharged through the first drain port and does not enter the interior of the Z-axis body. The robotic arm and the flip unit are used to transport and flip the wafers. During the wafer transport and flipping process, the water on the wafer falls into the upper water tray, enters the lower water tray through the first drain hole and the first drain pipe, and is discharged from the wafer handling device through the first drain port; specifically, the first drain port can directly drain the water on the lower water tray, or it can be connected to a drainage pipe at the lower end to drain the water, and it is only necessary to discharge the water dripping during the wafer cleaning process out of the handling device.

[0034] As attached Figure 3 and attached Figure 4 The following is a schematic diagram of the structure of a single-arm robot and a dual-arm robot. Figure 3 In the single-arm robot, the flip unit is mounted on the upper arm 3, the upper arm 3 is mounted on the lower arm 4, the lower arm 4 is mounted on the θ axis 5, the θ axis 5 is mounted on the Z axis body 6, the θ axis 5 can rotate and lift, the upper water tray 7 of the single arm and the upper flange of the θ axis 5 are made into one piece, and can rotate and lift with the θ axis 5, the lower water tray 8 of the single arm is mounted on the fixed flange 2 of the robot, and the lower water tray 8 of the single arm is in a stationary state when the θ axis 5 is lifted and rotated. When the wafer 1 is flipped and transported, the water on it will flow onto the upper water tray of the single arm, and the water in the upper water tray of the single arm will gather into the first drainage hole 9, and flow to the lower water tray 8 of the single arm through the first drainage pipe. The inner side of the lower water tray 8 of the single arm prevents the water from flowing into the robot, but flows to the outside through the first drainage port of the lower water tray 8 of the single arm.

[0035] In the attached Figure 4 In the dual-arm robot, the third arm 10 is fixed on the upper arm 3, the upper arm 3 is mounted on the lower arm 4, the lower arm 4 is mounted on the θ axis 5, the θ axis 5 is mounted on the Z axis body 6, the θ axis 5 can rotate and lift, the upper water tray 11 of the dual arm and the upper flange of the θ axis are made into one piece, and can rotate and lift with the θ axis, the lower water tray 12 of the dual arm is mounted on the fixed flange 2 of the robot, and the lower water tray 12 of the dual arm is in a stationary state when the θ axis 5 is lifted and rotated. When the wafer 1 is transported, the water on it will flow onto the upper water tray 11 of the dual arm due to inertia, and the water in the upper water tray 11 of the dual arm will gather into the first drainage hole 9, and flow to the lower water tray 12 of the dual arm through the first drainage pipe 13. The inner side of the lower water tray 12 of the dual arm has a boss to prevent the water from flowing into the robot, but flows to the outside through the first drainage port of the lower water tray 12 of the dual arm.

[0036] The Z-axis structure of the single-arm and double-arm robots is the same, as shown in the attached Figure 5 and attached Figure 6 As shown in the figure, although the above water tray system can prevent dripping water from entering the robot, a small amount of splashing water will still enter the robot when the robot is in the raised state; for example, the splashing water flows along the outer wall of the lifting tube to the flange of the lifting tube. In order to solve this problem, the present invention is designed as shown in the attached figure. Figure 6 The structure shown, that is, the drainage unit also includes a splash water discharge subunit, and the splash water discharge subunit includes a third drainage hole, a fourth drainage hole and a second drainage pipe; the Z-axis body includes a lifting tube 16, a lifting tube flange 17, a synchronous pulley 18, a bearing 26, an outer ring flange and an inner ring flange; the lifting tube 16 is fixed on the lifting tube flange 17, and the lifting tube flange 17 is connected to the outer ring flange through the synchronous pulley 18; the outer ring flange presses the outer ring of the bearing, and the inner ring flange presses the inner ring of the bearing. Specifically, the outer ring flange includes an outer ring upper pressure flange 19 and an outer ring lower pressure flange 20, and the outer ring upper pressure flange 19 and the outer ring lower pressure flange 20 press the outer ring of the bearing 26. The inner ring flange includes an inner ring upper pressure flange 21 and an inner ring lower pressure flange 22, and the inner ring upper pressure flange 21 and the inner ring lower pressure flange 22 press the inner ring of the bearing 26. In the present invention, the synchronous pulley is connected to the driving wheel through a synchronous belt, and the driving wheel is connected to the driving unit. The driving unit can be, for example, a motor, etc. The driving unit drives the lifting tube to rotate through the driving wheel, synchronous belt, synchronous pulley and lifting tube flange; when the lifting tube rotates, the θ axis and all components fixed on the θ axis, including the upper water tray, rotate together; during the rotation process, the outer ring of the bearing and the outer ring upper pressure flange and the outer ring lower pressure flange rotate together, while the inner ring upper pressure flange and the inner ring lower pressure flange and the inner ring of the bearing do not rotate. The cross-sectional area of ​​the lifting tube flange is larger than the cross-sectional area of ​​the lifting tube, ensuring that water entering the gap of the lifting tube will drip into the lifting tube flange and be discharged along the third drain hole and the second drain pipe, and will not enter between the lifting tube flange and the outer wall of the Z-axis body. The structure of the lifting tube flange is shown in the attached figure. Figure 7 As shown, the third drainage hole can be designed at the recessed part of the lifting circular pipe flange.

[0037] A second drain pipe 23 is arranged between the lifting circular tube flange and the inner ring flange. The lifting circular tube flange 17 includes a third drain hole 28, which is connected to one end of the second drain pipe 23, and the other end of the second drain pipe 23 extends to the inner ring upper pressure flange 21; the inner ring upper pressure flange 21 includes a fourth drain hole 29, and the water on the lifting circular tube flange 17 is discharged from the device through the third drain hole 28, the second drain pipe 23 and the fourth drain hole 29. The upper end of the second drain pipe includes a sealing ring 24, which is pressed by the lifting circular tube flange 17 and the synchronous pulley 18 to achieve sealing. The sealing ring 24 and the second drain pipe 23 rotate together with the outer ring of the bearing 26 to ensure the sealing between the upper end of the second drain pipe and the lifting circular tube flange; the specific sealing ring can cover the top end of the second drain pipe and the upper end of the side of the second drain pipe, which are pressed and fixed by the lifting circular tube flange and the synchronous pulley respectively.

[0038] As attached Figure 8 As shown, the inner ring upper pressure flange 21 includes a drainage groove 30 and a fourth drainage hole 29, wherein the fourth drainage hole is located in the drainage groove. Since the inner ring upper pressure flange is fixed and does not rotate, while the second drainage pipe is rotating, during the rotation process, the second drainage pipe rotates with the central axis of the bearing in the vertical direction as the center of the circle. The drainage groove is provided to ensure that no matter which position the second drainage pipe rotates to, the lower end of the second drainage pipe can be aligned with the drainage groove, thereby allowing the water in the second drainage pipe of the mirror cabinet to first collect in the drainage groove and then flow out through the fourth drainage hole. The inner ring lower pressure flange 22 includes a second drainage port; and the fourth drainage hole and the second drainage port overlap in the vertical direction. Since the inner ring upper pressure flange and the inner ring lower pressure flange are fixed and do not rotate, the fourth drainage hole and the second drainage port form a drainage channel in the vertical direction, which is similar to the shape of a pipe. At the same time, since the second drainage pipe rotates with the lifting circular pipe flange and the synchronous pulley, the lower end of the second drainage pipe does not directly contact the fourth drainage hole on the inner ring upper pressure flange. It is only necessary to drain the water from the second drainage pipe to the inner ring upper pressure flange. The fourth drainage hole on the inner ring upper pressure flange can be designed as a drainage hole in a recessed position, as shown in the attached figure. Figure 8 As described, water dripping on the inner ring upper pressure flange automatically gathers in the low-lying area and is discharged through the fourth drainage hole and the second drainage port; the lower end of the second drainage port of the inner ring lower pressure flange is connected to a joint, and the joint is connected to the outside of the device through the bottom plate drainage hole; at this point, when the robot is in a raised state, a small amount of splashing water entering the robot is discharged through the lifting circular pipe flange, the second drainage pipe, the fourth drainage hole, the second drainage port, the interface and the bottom plate drainage hole.

[0039] It is worth noting that the dripping water discharge subunit including the upper water tray and the lower water tray in the present invention is mainly used for the function of preventing dripping water, that is, when water drops on the wafer fall to the upper water tray, the water flows to the lower water tray through the first drainage hole, and then is discharged from the robot body through the first drainage port; the splashing water discharge subunit is mainly used for the function of preventing splashing water, for example, after the Z axis rises, the splashing water will enter the Z axis body along the outer wall of the lifting tube (the splashing water has no direction), and then be discharged from the robot through the third drainage hole, the second drainage pipe, the fourth drainage hole and the second drainage port. For ease of understanding, the present invention only sets the first drainage port and the second drainage port as drainage holes for discharging the robot.

[0040] For example, the present invention can be specifically applied to CMP (wafer polishing) equipment, and the robot can be used to transfer wafers at various polishing and cleaning stations. When the wafer is flipped and transferred, due to the effects of inertia and flipping, water will flow into the robot and damage the robot, thereby shortening the maintenance cycle of the entire equipment. The structure is simple in design, easy to install and maintain, does not change the original robot structure, has low cost, and does not generate particles.

[0041] The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the patent protection scope of the present invention. Therefore, all equivalent structural changes made using the description and drawings of the present invention should be included in the protection scope of the claims attached to the present invention.

Claims

1. A wafer handling device including a drainage function, It is characterized in that The device comprises a Z-axis body, a θ-axis located at the upper end of the Z-axis body, a mechanical arm located at the upper end of the θ-axis, a flip unit located at the front end of the mechanical arm, and a drainage unit, wherein the drainage unit comprises a dripping drainage subunit, and the dripping drainage subunit comprises an upper water receiving tray and a lower water receiving tray, wherein the upper water receiving tray is fixed on the θ-axis, and the lower water receiving tray is fixed on the Z-axis body, and the upper water receiving tray and the θ-axis can perform rotation and lifting motion relative to the Z-axis body; The upper water receiving tray comprises a first drainage hole, the lower water receiving tray comprises a first drainage port, and the first drainage hole is connected to the lower water receiving tray through a first drainage pipe; The mechanical arm and the flip unit are used to transport and flip the wafer. During the wafer transport and flip process, water on the wafer falls into the upper water receiving tray, enters the lower water receiving tray through the first drainage hole and the first drainage pipe, and is discharged from the wafer transport device through the first drainage port; The lower water receiving tray includes a boss that is close to the Z-axis body; The first drain port is located outside the lower water receiving tray; The Z-axis body includes a lifting tube, a lifting tube flange, a synchronous pulley, a bearing, an outer ring flange and an inner ring flange; the lifting tube is fixed to the lifting tube flange, and the lifting tube flange is connected to the outer ring flange through a synchronous pulley; the outer ring flange presses the outer ring of the bearing, and the inner ring flange presses the inner ring of the bearing; The drainage unit also includes a splash water discharge subunit, which includes a third drainage hole, a fourth drainage hole and a second drainage pipe; a second drainage pipe is arranged between the lifting circular tube flange and the inner ring flange, and the lifting circular tube flange includes a third drainage hole, the third drainage hole is connected to one end of the second drainage pipe, and the other end of the second drainage pipe extends to the inner ring flange; the inner ring flange includes a fourth drainage hole, and water on the lifting circular tube flange is discharged from the device through the third drainage hole, the second drainage pipe and the fourth drainage hole.

2. The wafer transport device with drainage function according to claim 1, It is characterized in that The outer ring flange comprises an outer ring upper pressure flange and an outer ring lower pressure flange, and the outer ring upper pressure flange and the outer ring lower pressure flange press the outer ring of the bearing.

3. The wafer transport device with drainage function according to claim 1, It is characterized in that The inner ring flange includes an inner ring upper pressure flange and an inner ring lower pressure flange, and the inner ring upper pressure flange and the inner ring lower pressure flange press the inner ring of the bearing; the inner ring upper pressure flange includes a drainage groove and a fourth drainage hole, and the inner ring lower pressure flange includes a second drainage port; and the fourth drainage hole and the second drainage port overlap in the vertical direction.

4. The wafer transport device including a drainage function according to claim 3, It is characterized in that The lower end of the second drain port of the inner ring downward pressure flange is connected with a joint, and the joint is connected to the outside of the device through the bottom plate drain hole.

5. The wafer transport device with drainage function according to claim 1, It is characterized in that The upper end of the second drain pipe includes a sealing ring, and the sealing ring is pressed by the lifting circular pipe flange and the synchronous belt pulley to achieve sealing.

6. The wafer transport device with drainage function according to claim 1, It is characterized in that The cross-sectional area of ​​the lifting circular tube flange is larger than the cross-sectional area of ​​the lifting circular tube.

7. The wafer transport device with drainage function according to claim 1, It is characterized in that The synchronous pulley is connected to the driving wheel through a synchronous belt, the driving wheel is connected to the driving unit, and the driving unit drives the lifting tube to rotate through the driving wheel, the synchronous belt, the synchronous pulley and the lifting tube flange.

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