Production and processing system and preparation technology of flexible conductive coil

Abstract

The invention discloses a production and processing system and a preparation process for a flexible conductive coil, and relates to the field of substrate coating. The production and processing system comprises a first vacuum coating device, which is used to form a magnetron sputtering coating on the surface of a thin film substrate; a second vacuum coating device, which is located behind the first vacuum coating device, is used to form a first metal coating layer on the magnetron sputtering coating; a first water plating device, which is located behind the second vacuum coating device, uses an alkaline water plating device to form a transition metal coating layer on the first metal coating layer; a second water plating device, which is located behind the third vacuum coating device, uses an acidic water plating device to form a thickened metal coating layer on the first metal coating layer; the invention has the beneficial effects of avoiding the influence of high temperature factors of the evaporation process on bubbles and holes on the film surface, can effectively solve the bubble problem, and at the same time solve the hole problem caused by high temperature metal particles in the original evaporation process penetrating the base film.

Description

Technical Field

[0001] The present invention relates to the field of flexible coiled material processing, and more specifically, to a production and processing system and a preparation process for a flexible conductive film coiled material. Background Art

[0002] Vacuum coating mainly refers to a type of coating that needs to be carried out under a high vacuum degree. There are many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, and many other types. It is mainly divided into two types: evaporation and sputtering. Evaporation coating generally heats the target material to evaporate the surface components in the form of atomic groups or ions, and settles on the surface of the substrate, and forms a thin film through the film forming process (scattered points-island structure-vagal structure-layered growth). For sputtering coating, it can be simply understood as bombarding the target material with electrons or high-energy lasers, and sputtering the surface components in the form of atomic groups or ions, and finally depositing on the surface of the substrate, undergoing a film forming process, and finally forming a thin film.

[0003] Chinese patent document CN108531876A discloses a coating process flow, specifically disclosing the following content: it is to coat a metal film on an ultra-thin substrate to obtain a coating product with improved adhesion, and the process flow is as follows: first use magnetron coating 5-50nm on the surface of the ultra-thin substrate, then water-coat 600-1000nm; or the process flow is as follows: first use magnetron coating 5-50nm on the surface of the ultra-thin substrate, then evaporate 100-700nm, and finally water-coat 100-800nm. In the specific application of lithium battery current collectors, the substrate, the properties of the coating (metal coating) and the thickness range of the coating are a better choice combination, on this basis, the bonding force between the magnetron coating and the water-coated coating is better reflected in performance.

[0004] The process route of evaporation coating combined with water plating has the following two prominent technical problems when producing flexible conductive film coils: 1. Bubble problem: The base film used in the flexible conductive film coil product is a stretching process, which is prone to local deformation during the process. During the evaporation coating process, due to the high temperature of the evaporation coating process, the deformation of the base film will worsen, resulting in a series of deformations in the film direction, which is called bubble. There are two problems in the process of using the flexible conductive film coil product for post-industry chain processing: ① During the film process, due to the bubble on the film surface, wrinkles are easily generated in the bubble area, affecting the product quality rate. ② In the user's post-processing process, due to the bubble area on the film surface, the uniformity of the tape and various surface treatments in the post-process cannot be guaranteed, thereby affecting the consistency of the product. In response to this problem, the current process route cannot meet the requirements of product consistency and quality rate. From an actual estimate, bubble will cause about 30% of the product quality rate loss. 2. Hole problem: When the base film of the flexible conductive film coil product undergoes the evaporation coating process, the evaporation coating process has a high temperature and slight fluctuations. The high-temperature metal particles caused by uneven evaporation during the film-flowing process can easily penetrate the base film and form holes. The size of the holes can reach the millimeter level at most. The usual requirement for the qualified rate of flexible conductive film products is that the holes must not be larger than 500um. This defect will cause leakage during the surface treatment process during the post-industry chain processing and use, which may cause a great safety risk to the terminal product. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a production and processing system and a preparation process for a flexible conductive coil, which solve the bubble and hole problems in the production of flexible conductive coils in the prior art.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a production and processing system of a flexible conductive coil, the improvement of which is that it includes:

[0007] A first vacuum coating device, used for forming a magnetron sputtering coating on the surface of the thin film substrate;

[0008] A second vacuum coating device, located behind the first vacuum coating device, is used to form a first metal coating layer on the magnetron sputtering coating;

[0009] A first water coating device, located behind the second vacuum coating device, forms a transition metal coating layer on the first metal coating layer;

[0010] The second water plating device is located behind the first water plating device and forms a thickened metal plating layer on the transition metal plating layer.

[0011] In the above system, the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acidic water plating equipment; or both the first water plating device and the second water plating device adopt acidic water plating equipment.

[0012] In the above system, a third vacuum coating device is arranged between the first water coating device and the second water coating device. The third vacuum coating device is used to form a second metal coating layer on the transition metal coating layer, and the thickened metal coating layer is formed on the second metal coating layer.

[0013] In the above system, the first metal coating, the transition metal coating, the second metal coating and the thickened metal coating are all copper-plated metals, that is, the first metal coating, the transition metal coating, the second metal coating and the thickened metal coating are all copper-plated layers.

[0014] In the above system, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all adopt magnetron sputtering coating equipment, and the thickness of the first metal coating layer and the second metal coating layer are both 8-15nm.

[0015] In the above system, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device can be the same magnetron sputtering coating equipment; the first water plating device and the second water plating device can also use the same acid water plating equipment.

[0016] In the above system, the magnetron sputtering coating is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.

[0017] In the above system, the thickness of the magnetron sputtering coating is 2-10 nm.

[0018] In the above system, the thickness of the transition metal coating is 50-250 nm.

[0019] In the above system, the thickness of the thickened metal coating is 600-950 nm.

[0020] In the above system, the film substrate includes but is not limited to PP film, PE film or PET film.

[0021] In addition, the present invention also provides a preparation process of a flexible conductive coiled material for coating a metal film on a film substrate surface, wherein the improvement is that the preparation process comprises the following steps:

[0022] S1. Coating the film on the surface of the film substrate using a vacuum coating device to form a 2-10 nm magnetron sputtering alloy layer;

[0023] S2, forming a first metal coating layer of 8-15 nm on the magnetron sputtering alloy layer by a vacuum coating device;

[0024] S3, forming a transition metal coating layer of 50-250 nm on the first metal coating layer by a first water plating device;

[0025] S4. Forming a thickened metal coating layer with a thickness of 600-950 nm on the transition metal coating layer through a second water plating device.

[0026] In the above steps, there is a step S31 between the step S3 and the step S4: forming a second metal coating layer of 8-15 nm on the transition metal coating layer by a vacuum coating device;

[0027] The step S4 is: forming a thickened metal coating layer with a thickness of 600-950 nm on the second metal coating layer by a second water plating device.

[0028] In the above steps, in step S31, the uniformity and density of the overall coating of the flexible conductive coil are compensated by forming the second metal coating, so that the elongation of the film coil is not less than 3%.

[0029] In the above steps, in step S3, the square resistance of the metal coating formed on the outer surface of the flexible conductive coil is reduced to below 800 mΩ by forming a transition metal coating.

[0030] In the above steps, the first water plating device uses alkaline water plating equipment, and the second water plating device uses acidic water plating equipment; or the first water plating device and the second water plating device both use acidic water plating equipment; or the first water plating device and the second water plating device both use alkaline water plating equipment.

[0031] In the above steps, the first water plating device and the second water plating device use the same acid water plating equipment.

[0032] In the above steps, the thickness of the magnetron sputtering alloy layer is 9nm, the thickness of the first metal coating layer is 11nm, the thickness of the transition metal coating layer is 80-120nm, the thickness of the second metal coating layer is 11nm, and the thickness of the thickened metal coating layer is 750-800nm.

[0033] The beneficial effects of the present invention are as follows: since water plating equipment is used instead of vacuum evaporation equipment, the presence of the transition metal coating can avoid the influence of high temperature factors of the evaporation process on bubbles and holes on the membrane surface, and can effectively solve the bubble problem; at the same time, it solves the problem of holes caused by high-temperature metal particles piercing the base film in the original evaporation process, and can more than double the product quality rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The figure is a diagram of an embodiment of the production and processing system of the flexible conductive coil of the present invention.

[0035] Figure 2 This is a diagram showing a specific embodiment of the second water plating device of the production and processing system of the flexible conductive coil of the present invention.

[0036] Figure 3 The present invention is a flowchart of an embodiment of a process for preparing a flexible conductive coiled material.

[0037] Figure 4 FIG. 2 is another embodiment of the production and processing system of the flexible conductive coil of the present invention.

[0038] Figure 5 The flowchart is another embodiment of the process for preparing the flexible conductive coil of the present invention. DETAILED DESCRIPTION

[0039] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0040] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the invention can be combined interchangeably without conflicting with each other.

[0041] Example 1

[0042] The present invention discloses a production and processing system for a flexible conductive coil. Specifically, the flexible conductive coil produced by the production and processing system solves the bubble and hole problems in the production of flexible conductive coils in the prior art. Figure 1 As shown, the production and processing system of the flexible conductive coil includes a first vacuum coating device 1, a second vacuum coating device 2, a first water coating device 3 and a second water coating device 5 arranged in sequence, and the two adjacent devices are also provided with a material transfer device 6 to facilitate the transfer of the processed film substrate, wherein the first vacuum coating device 1 is used to form a magnetron sputtering coating on the surface of the film substrate. In this embodiment, the magnetron sputtering coating is a magnetron sputtering alloy layer, and the thickness of the magnetron sputtering alloy layer is 2nm.

[0043] The magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer. The nickel-copper alloy layer includes 70% nickel and 30% copper by mass.

[0044] Furthermore, the second vacuum coating device 2 is used to form a first metal coating on the magnetron sputtering coating. In this embodiment, the first metal coating is a copper coating, and the thickness of the first metal coating is 8nm; the first water plating device 3 adopts alkaline water plating equipment to form a transition metal coating on the first metal coating. In this embodiment, the transition metal coating is a copper coating, and the thickness of the transition metal coating is 50nm; the second water plating device 5 adopts acidic water plating equipment to form a thickened metal coating on the first metal coating. In this embodiment, the thickened metal coating is a copper coating, and the thickness of the thickened metal coating is 600nm.

[0045] After the magnetron sputtering alloy layer and the first metal coating are formed, the square resistance of the copper film can only reach 10-30Ω. The transition metal coating formed by alkaline copper plating can reduce the square resistance to less than 800mΩ before acid copper plating can be performed. Since the film substrate is made of PP film, PE film or PET film, it will shrink and deform under certain temperature conditions. At the same time, high-temperature particles will inevitably splash and melt through the film substrate to form holes during the evaporation process. Therefore, the use of alkaline copper plating process to form a transition metal coating instead of the evaporation process can avoid the influence of the high temperature factors of the evaporation process on the film surface bubbles and holes, which can effectively solve the bubble problem. At the same time, it solves the problem of holes caused by the high-temperature copper vapor particles in the original evaporation process that penetrate the base film, which makes the product quality rate more than doubled.

[0046] In the above-mentioned embodiment, for the second water plating device 5, the present invention provides a specific embodiment, such as Figure 2 As shown, the second water plating device 5 includes a plurality of conductive segments 501 and a plurality of copper plating segments 502, and the conductive segments 501 and the copper plating segments 502 are arranged in sequence. The conductive segment 501 includes an upper conductive roller 503 and a lower conductive roller 504, and the flexible film coil passes between the upper conductive roller 503 and the lower conductive roller 504, and the upper conductive roller 503 and the lower conductive roller 504 are respectively used to realize the electrification of the two sides of the flexible film coil; further, the copper plating segment 502 includes a plating liquid tank 505, an upper liquid retaining roller 506 and a lower liquid retaining roller matched therewith, and the upper liquid retaining roller 506 and the lower liquid retaining roller are both arranged in the plating liquid tank 505, and the flexible film coil passes between the upper liquid retaining roller 506 and the lower liquid retaining roller, and the flexible film coil is located below the plating liquid level of the plating liquid tank 505.

[0047] The function of the upper liquid-blocking roller 506 and the lower liquid-blocking roller is to raise the liquid level of the plating solution so that when the flexible film coil passes between each set of liquid-blocking rollers, the upper and lower surfaces of the flexible film coil are both located below the liquid level of the plating solution, so as to achieve uniform copper plating on both sides of the coating, thereby ensuring uniform plating on the upper and lower surfaces of the flexible film coil; an upper titanium basket and a lower titanium basket are also provided in the plating tank 505, and copper balls are contained in the upper and lower titanium baskets. In the electroplating process, copper ions in the plating solution are compensated according to the setting of the plating thickness. In this embodiment, the thickness of the thickened metal coating, that is, the thickened copper coating is 600nm, and the flexible film coil needs to pass through a total of 10-15 conductive segments 501 and copper-plated segments 502 in sequence to enable the thickened metal coating to reach the required thickness.

[0048] In addition, the second water plating device 5 further includes an unwinding roller 508, a winding roller 509 and a tension detection section 510. The unwinding roller 508 and the winding roller 509 are respectively located on both sides of the plating tank. The tension detection section 510 is located at the end of the plating tank (multiple tension detection sections can also be provided and the number is not limited), and the tension of the flexible film coil entering the winding roller 509 is detected. Before entering the winding roller 509, an anti-oxidation section and a drying section (not shown in the figure) are also provided. This part of the technology belongs to the scope of the prior art, so it will not be described in detail in this embodiment.

[0049] Based on the above embodiments, a production and processing system based on a flexible conductive coil is provided. Figure 3 As shown, the present invention provides a process for preparing a flexible conductive coil, which comprises the following steps:

[0050] S1, coating the surface of the thin film substrate using the first vacuum coating device 1 to form a 2nm magnetron sputtering alloy layer;

[0051] S2, forming a first metal coating layer of 8 nm on the magnetron sputtering alloy layer by a second vacuum coating device;

[0052] S3, forming a 50 nm transition metal coating layer on the first metal coating layer by a first water plating device;

[0053] S4. Forming a thickened metal coating layer with a thickness of 600 nm on the transition metal coating layer through a second water plating device.

[0054] The first vacuum coating device and the second vacuum coating device are both magnetron sputtering coating devices, the first water plating device is an alkaline water plating device, and the second water plating device is an acidic water plating device.

[0055] Through the above-mentioned preparation process, a transition metal coating is formed on the first metal coating, which can avoid the influence of the high temperature factors of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the bubble problem. At the same time, it solves the hole problem caused by the high-temperature copper vapor particles in the original evaporation process penetrating the base film.

[0056] Example 2

[0057] The present invention provides a production and processing system for a flexible conductive coil. In this embodiment, the technical solution is the same as that in Example 1, and the only difference lies in the thickness of the magnetron sputtering alloy layer, the first metal coating layer, the transition metal coating layer and the thickened metal coating layer. In this embodiment, the thickness of the magnetron sputtering alloy layer is 10nm, the thickness of the first metal coating layer is 15nm, the thickness of the transition metal coating layer is 250nm, and the thickness of the thickened metal coating layer is 950nm.

[0058] Example 3

[0059] The present invention provides a production and processing system and preparation process for a flexible conductive coil. In this embodiment, the technical solution is the same as that in Example 1, and the only difference is that the first vacuum coating device and the second vacuum coating device are both the same magnetron sputtering coating equipment, that is, the same vacuum coating device is used in two adjacent processes.

[0060] Therefore, based on the production and processing system of the flexible conductive coiled material according to this embodiment, as Figure 3 As shown, the present invention provides a process for preparing a flexible conductive coil, which comprises the following steps:

[0061] S1, coating the surface of the film substrate using a vacuum coating device to form a 2nm magnetron sputtering alloy layer;

[0062] S2, forming a first metal coating layer of 8 nm on the magnetron sputtering alloy layer by the vacuum coating device again;

[0063] S3, forming a 50 nm transition metal coating layer on the first metal coating layer by a first water plating device;

[0064] S4. Forming a thickened metal coating layer with a thickness of 600 nm on the transition metal coating layer through a second water plating device.

[0065] Among them, the first water plating device is an alkaline water plating device, and the second water plating device is an acidic water plating device.

[0066] It is worth noting that in this specific embodiment, although the preparation of the magnetron sputtering alloy layer in step S1 and the preparation of the first metal coating layer in step S2 use the same vacuum coating device, that is, the same magnetron sputtering coating device; however, the target materials used in the two processes may be different, and the magnetron sputtering target material needs to be replaced between the two processes. In this specific embodiment, the target material used in the preparation of the magnetron sputtering alloy layer in step S1 is a nickel-copper alloy target material, and the target material needs to be replaced with a pure copper target material when preparing the first metal coating layer in step S2.

[0067] Example 4

[0068] The present invention provides a production and processing system and a preparation process for a flexible conductive coil. In this embodiment, the technical solution is the same as that in Embodiment 3, except that the first water plating device and the second water plating device are both acidic water plating devices. Moreover, the first water plating device and the second water plating device can be the same acidic water plating device, that is, the same acidic water plating device is used repeatedly in both processes.

[0069] Example 5

[0070] like Figure 4 As shown, based on Example 1, the present invention also provides a specific embodiment for the production and processing system of flexible conductive coiled materials, and in this embodiment, the production and processing system of flexible conductive coiled materials also includes a first vacuum coating device 1, a second vacuum coating device 2, a first water coating device 3 and a second water coating device 5 arranged in sequence, and their structure is exactly the same as that in Example 1, so they are not described in detail in this embodiment.

[0071] In this embodiment, a third vacuum coating device 4 is further provided between the first water coating device 3 and the second water coating device 5. The third vacuum coating device 4 is used to form a second metal coating layer on the transition metal coating layer, and the thickened metal coating layer is formed on the second metal coating layer. The first vacuum coating device 1, the second vacuum coating device 2 and the third vacuum coating device 4 all use magnetron sputtering coating equipment. In this embodiment, the second metal coating layer is a copper coating layer, and the thickness of the second metal coating layer is 11 nm. It should be noted that the thickness of the second metal coating layer can be adjusted according to actual needs and controlled between 8-15 nm.

[0072] In this embodiment, after the film substrate passes through the first vacuum coating device 1, the second vacuum coating device 2 and the first water coating device 3 in sequence, the copper layer on the surface of the film substrate is uneven and not dense, and the second water coating device 5 is an acid coating device, and the acid plating solution used in the acid coating device has a strong metal dissolving effect on the metal coating layer. Therefore, the transition metal coating layer on the surface of the film substrate formed by the alkali coating device of the first water coating device 3 is not recommended to directly enter the second water coating device 5, i.e., the acid coating device, to perform the next step of thickening the coating layer. It is necessary to enter the vacuum magnetron coating process again after forming the transition metal coating layer, i.e., to form the second metal coating layer on the transition metal coating layer through the third vacuum coating device 4. By adding the third vacuum coating device 4, the uniformity and density of the copper layer on the surface of the flexible film coil are compensated, and the subsequent acid water coating process can be made more efficient. Moreover, since the copper layer has good uniformity and density, the elongation of the flexible film coil reaches 3%, solving the problem of poor product elongation.

[0073] based on Figure 4 For the preparation process of the flexible conductive coil, the present invention also provides a specific embodiment, such as Figure 5 As shown, specifically, the preparation process of the flexible conductive coil includes the following steps:

[0074] S1, coating the surface of the thin film substrate using a first vacuum coating device to form a 9 nm magnetron sputtering alloy layer;

[0075] S2, forming a first metal coating layer of 11 nm on the magnetron sputtering alloy layer by a second vacuum coating device;

[0076] S3, forming a 120nm transition metal coating on the first metal coating by a first water plating device; through the formation of the transition metal coating, the square resistance of the copper film formed on the outer surface of the flexible conductive film coil is reduced to less than 800mΩ;

[0077] S31, forming a second metal coating layer of 11 nm on the transition metal coating layer by a third vacuum coating device; in this step, the elongation of the flexible conductive film coil is greater than 3% by the second metal coating;

[0078] S4. Forming a thickened metal coating layer with a thickness of 800 nm on the second metal coating layer through a second water plating device.

[0079] The first vacuum coating device, the second vacuum coating device and the third vacuum coating device are all magnetron sputtering coating devices, the first water plating device is an alkaline water plating device, and the second water plating device is an acidic water plating device.

[0080] Example 6

[0081] The present invention provides a production and processing system and preparation process for a flexible conductive coil. In this embodiment, the technical solution is the same as that in Example 5, and the only difference lies in the thickness of the transition metal coating and the thickened metal coating. In this embodiment, the thickness of the transition metal coating is 80nm, and the thickness of the thickened metal coating is 750nm.

[0082] Example 7

[0083] The present invention provides a production and processing system and preparation process for a flexible conductive coil. In this embodiment, the technical scheme is the same as that in Example 5, and the only difference is that the first vacuum coating device, the second vacuum coating device and the third vacuum coating device are all the same magnetron sputtering coating equipment, that is, the same vacuum coating device is used in the three previous and subsequent processes.

[0084] Therefore, based on the production and processing system of the flexible conductive coiled material according to this embodiment, as Figure 5As shown, the present invention provides a process for preparing a flexible conductive coil, which comprises the following steps:

[0085] S1, coating the surface of the film substrate using a vacuum coating device to form a 10nm magnetron sputtering alloy layer;

[0086] S2, forming a first metal coating layer of 15 nm on the magnetron sputtering alloy layer by the vacuum coating device again;

[0087] S3, forming a 150 nm transition metal coating layer on the first metal coating layer by a first water plating device;

[0088] S31: forming a second metal coating layer of 15 nm on the transition metal coating layer by the vacuum coating device again;

[0089] S4. Forming a thickened metal coating layer with a thickness of 750 nm on the second metal coating layer through a second water plating device.

[0090] Among them, the first water plating device is an alkaline water plating device, and the second water plating device is an acidic water plating device.

[0091] It is worth noting that in this specific embodiment, although the same vacuum coating device, i.e., the same magnetron sputtering coating device, is used for the preparation of the magnetron sputtering alloy layer in step S1, the preparation of the first metal coating layer in step S2, and the preparation of the second metal coating layer in step S31; however, the target materials used in the three steps may be different, and the magnetron sputtering target materials need to be replaced between different steps. In this specific embodiment, the target material used in the preparation of the magnetron sputtering alloy layer in step S1 is a nickel-copper alloy target material, and the target material needs to be replaced with a pure copper target material when preparing the first metal coating layer and the second metal coating layer in steps S2 and S31.

[0092] In addition, the first water plating device and the second water plating device may both use acidic water plating equipment, or both use alkaline water plating equipment, or even the first water plating device and the second water plating device may use the same device.

[0093] In all the above-mentioned embodiments 1-7, the first vacuum coating device 1, the second vacuum coating device 2 and the third vacuum coating device 4 are all magnetron sputtering coating equipment, which generally include a vacuum chamber and an unwinding mechanism, a winding mechanism, a cooling main drum, an unwinding swing frame and a winding swing frame arranged inside the vacuum chamber. The unwinding mechanism and the winding mechanism are arranged up and down, and there are two cooling main drums, which are located between the unwinding mechanism and the winding mechanism and are symmetrically arranged on the left and right. After the film substrate passes through the unwinding mechanism, it is coated on one side through a cooling main drum, and then coated on the other side through another cooling main drum, and then the material is collected through the winding mechanism, so that the film substrate is coated on both sides at the same time.

[0094] Furthermore, the first water plating device 3 can be an alkaline water plating device, which generally includes a feed roll, a reel, and multiple electroplating devices arranged between the feed roll and the reel. The electroplating device includes several plating solution pools and antioxidant pools, and also includes transition rollers, flattening rollers, tension rollers and other structures. Its purpose is to pass the film substrate through multiple plating solution pools in sequence to form a metal coating that meets the requirements on the surface of the film substrate.

[0095] Since the structures of the magnetron sputtering coating device and the alkaline water plating device are relatively common in the prior art, all embodiments of the present invention do not provide a detailed description of the structures of the first vacuum coating device 1, the second vacuum coating device 2, the third vacuum coating device 4 and the alkaline water plating equipment.

[0096] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A production and processing system for a flexible conductive coil, characterized in that: include: A first vacuum coating device is used to form a magnetron sputtering coating on the surface of the thin film substrate, wherein the thickness of the magnetron sputtering coating is 2-10 nm; A second vacuum coating device, located behind the first vacuum coating device, is used to form a first metal coating layer on the magnetron sputtering coating; A first water plating device is located behind the second vacuum coating device, and forms a transition metal coating layer on the first metal coating layer, wherein the thickness of the transition metal coating layer is 50-250 nm; A second water plating device is located behind the first water plating device, and forms a thickened metal plating layer on the transition metal plating layer, wherein the thickness of the thickened metal plating layer is 600-950 nm; The first water plating device is alkaline water plating equipment, and the second water plating device is acidic water plating equipment; or both the first water plating device and the second water plating device are acidic water plating equipment; A third vacuum coating device is also provided between the first water coating device and the second water coating device, and the third vacuum coating device is used to form a second metal coating layer on the transition metal coating layer, and the thickened metal coating layer is formed on the second metal coating layer; the uniformity and density of the overall coating of the flexible conductive coil are compensated by the formed second metal coating layer, so that the elongation of the film coil is not less than 3%; The first vacuum coating device, the second vacuum coating device and the third vacuum coating device all adopt magnetron sputtering coating equipment, and the thickness of the first metal coating layer and the second metal coating layer are both 8-15nm; The film substrate is a PP film, a PE film or a PET film.

2. The production and processing system of the flexible conductive coil according to claim 1, characterized in that: The metals plated on the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickened metal plating layer are all copper, that is, the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickened metal plating layer are all copper plating layers.

3. The production and processing system of the flexible conductive coil according to claim 1, characterized in that: The first vacuum coating device, the second vacuum coating device and the third vacuum coating device may be the same magnetron sputtering coating device; the first water plating device and the second water plating device may also be the same acid water plating device.

4. The production and processing system of the flexible conductive coil according to claim 1, characterized in that: The magnetron sputtering coating is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.

5. A process for preparing a flexible conductive coiled material, used for coating a metal film on a film substrate surface, characterized in that: The preparation process comprises the following steps: S1. Coating the film on the surface of the film substrate using a vacuum coating device to form a 2-10 nm magnetron sputtering alloy layer; S2, forming a first metal coating layer of 8-15 nm on the magnetron sputtering alloy layer by a vacuum coating device; S3, forming a transition metal coating layer of 50-250 nm on the first metal coating layer by a first water plating device; S4, forming a thickened metal coating layer with a thickness of 600-950 nm on the transition metal coating layer by a second water plating device; There is a step S31 between the step S3 and the step S4: forming a second metal coating layer of 8-15 nm on the transition metal coating layer by a vacuum coating device; The step S4 is: forming a thickened metal coating layer with a thickness of 600-950 nm on the second metal coating layer by a second water plating device; In the step S31, the uniformity and density of the overall coating of the flexible conductive coil are compensated by forming the second metal coating, so that the elongation of the film coil is not less than 3%; The first water plating device is alkaline water plating equipment, and the second water plating device is acidic water plating equipment; or both the first water plating device and the second water plating device are acidic water plating equipment; The film substrate is a PP film, a PE film or a PET film.

6. The process for preparing the flexible conductive coiled material according to claim 5, characterized in that: In the step S3, the sheet resistance of the metal coating formed on the outer surface of the flexible conductive coil is reduced to below 800 mΩ by forming a transition metal coating.

7. The process for preparing the flexible conductive coiled material according to claim 5, characterized in that: The first water plating device and the second water plating device use the same acid water plating equipment.

8. The process for preparing the flexible conductive coiled material according to claim 5, characterized in that: The magnetron sputtering alloy layer has a thickness of 9 nm, the first metal coating layer has a thickness of 11 nm, the transition metal coating layer has a thickness of 80-120 nm, the second metal coating layer has a thickness of 11 nm, and the thickened metal coating layer has a thickness of 750-800 nm.

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