Piezoelectric Module, Electronic Device and Piezoelectric Module Assembly Process

Abstract

The present disclosure relates to a piezoelectric module, an electronic device, and a piezoelectric module assembly process, belonging to the technical field of piezoelectric modules. The piezoelectric module has the characteristics of small volume and easy processing, and is suitable for mass production. The piezoelectric module includes: at least two piezoelectric components, a positive electrode circuit board, and a negative electrode circuit board; the piezoelectric component includes: a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion; the first surface of the main body portion and the connecting portion is the positive electrode, the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite to each other. The main body portions of at least two piezoelectric components are stacked, the connecting portions of at least two piezoelectric components are distributed in a staggered manner along the edge, and the orientations of the first surfaces of the connecting portions are the same. The positive electrode circuit board is connected to the first surface of the connecting portion, and the negative electrode circuit board is connected to the second surface of the connecting portion.

Description

Technical Field

[0001] The present disclosure relates to the technical field of piezoelectric modules, and particularly to a piezoelectric module, an electronic device, and a piezoelectric module assembly process. Background Art

[0002] The poreless design of electronic devices is a current trend in devices such as mobile phones, tablet computers, and wearable devices. In order to remove the sound holes on the electronic devices, the piezoelectric module drives the overall vibration of the screen to achieve sound emission. Therefore, a piezoelectric module adapted to the electronic device needs to be provided. Summary of the Invention

[0003] The present disclosure provides a piezoelectric module, an electronic device, and a piezoelectric module assembly process, and the piezoelectric module can be applied to an electronic device.

[0004] In a first aspect, an embodiment of the present disclosure provides a piezoelectric module, which includes: at least two piezoelectric components, a positive electrode circuit board, and a negative electrode circuit board;

[0005] The piezoelectric component includes: a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion;

[0006] The first surface of the main body portion and the connecting portion is the positive electrode, and the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite to each other;

[0007] The main body portions of at least two piezoelectric components are stacked, the connecting portions of at least two piezoelectric components are distributed alternately along the edge, and the orientations of the first surfaces of the connecting portions are the same;

[0008] The positive electrode circuit board is connected to the first surface of the connecting portion, and the negative electrode circuit board is connected to the second surface of the connecting portion.

[0009] In one embodiment, the connecting portion includes:

[0010] a bearing section, the first surface of the bearing section is the positive electrode, and the second surface of the bearing section is the negative electrode; and

[0011] a bending section, connected to the bearing section, and the bending direction of the bending section is configured such that the bearing sections of at least two piezoelectric components approach each other along the thickness direction of the connecting portion.

[0012] In one embodiment, between any two piezoelectric components, the distance between the first surfaces of the bearing sections is less than or equal to a set threshold.

[0013] In one embodiment, at least two piezoelectric components include: a first piezoelectric component and a second piezoelectric component;

[0014] The bent section of the first piezoelectric component includes a first bent section, and the bearing section of the first piezoelectric component includes a first bearing section. The first bent section and the first bearing section are sequentially connected from the set edge;

[0015] The bent section of the second piezoelectric component includes a second bent section, and the bearing section of the second piezoelectric component includes a second bearing section. The second bent section and the second bearing section are sequentially connected from the set edge;

[0016] The bending directions of the first bent section and the second bent section are opposite, so that the distance between the first surfaces of the first bearing section and the second bearing section is less than or equal to a set threshold value.

[0017] In one embodiment, the first bearing section and the second bearing section connect the positive electrode circuit board and the negative electrode circuit board; or

[0018] The first bearing section and the second bearing section connect one of the positive electrode circuit board and the negative electrode circuit board.

[0019] In one embodiment, the bent section of the first piezoelectric component includes a third bent section, and the bearing section of the first piezoelectric component further includes a third bearing section. The third bent section and the third bearing section are sequentially connected from the end of the first bearing section away from the first bent section;

[0020] The bent section of the second piezoelectric component includes a fourth bent section, and the bearing section of the second piezoelectric component includes a fourth bearing section. The fourth bent section and the fourth bearing section are sequentially connected from the end of the second bearing section away from the second bent section;

[0021] The bending directions of the third bent section and the fourth bent section are the same;

[0022] The first bearing section and the second bearing section are used to connect one of the positive electrode circuit board and the negative electrode circuit board, and the third bearing section and the fourth bearing section are used to connect the other of the positive electrode circuit board and the negative electrode circuit board.

[0023] In one embodiment, at least two piezoelectric components include: a third piezoelectric component and a fourth piezoelectric component;

[0024] The bearing section of the third piezoelectric component includes a fifth bearing section connected to the set edge;

[0025] The bent section of the fourth piezoelectric component includes a fifth bent section, and the bearing section of the fourth piezoelectric component includes a sixth bearing section. The fifth bent section and the sixth bearing section are sequentially connected from the set edge;

[0026] The bending direction of the fifth bending section is configured such that the distance between the sixth bearing section and the first surface of the fifth bearing section is less than or equal to a set threshold; and the fifth bearing section and the sixth bending section are connected to the positive circuit board or the negative circuit board.

[0027] In one embodiment, the bending section of the third piezoelectric component further includes a sixth bending section, and the bearing section of the third piezoelectric component further includes a seventh bearing section. The sixth bending section and the seventh bearing section are sequentially connected from the end of the fifth bearing section away from the set edge.

[0028] The bending section of the fourth piezoelectric component further includes a seventh bending section, and the bearing section of the fourth piezoelectric component further includes an eighth bearing section. The seventh bending section and the eighth bearing section are sequentially connected from the end of the sixth bearing section away from the fifth bending section.

[0029] The bending directions of the sixth bending section and the seventh bending section are the same, and the seventh bearing section and the eighth bearing section are used to connect the positive circuit board or the negative circuit board.

[0030] In one embodiment, along the extending direction of the connecting portion, the positive circuit board and the negative circuit board are arranged alternately.

[0031] In one embodiment, the piezoelectric component includes a first main body portion and a second main body portion, and two ends of the connecting portion are respectively connected to the first main body portion and the second main body portion.

[0032] In a second aspect, an embodiment of the present disclosure provides an electronic device, and the electronic device includes the piezoelectric module provided in the first aspect above.

[0033] In a third aspect, an embodiment of the present disclosure provides an assembling process of a piezoelectric module. The process is used to assemble the piezoelectric module provided in the first aspect above, and the process includes:

[0034] Providing at least two piezoelectric components, the piezoelectric component includes a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion; the first surface of the main body portion and the connecting portion is the positive electrode, the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite to each other.

[0035] Stacking the main body portions of at least two piezoelectric components such that the first surface of one piezoelectric component faces the second surface of another piezoelectric component, and the connecting portions of at least two piezoelectric components are distributed alternately along the set edge.

[0036] Connect the first surface of the connecting portion to the positive electrode circuit board, connect the second surface of the connecting portion to the negative electrode circuit board, and different connecting portions are connected to different positions of the positive electrode circuit board, and different connecting portions are connected to different positions of the negative electrode circuit board.

[0037] In one embodiment, before connecting the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board, the process further includes:

[0038] Bend the connecting portion so that the distance between the first surfaces of any two connecting portions of the piezoelectric components after bending is less than or equal to a set threshold.

[0039] In one embodiment, at least two piezoelectric components include: a first piezoelectric component and a second piezoelectric component;

[0040] The bending of the connecting portion includes:

[0041] Perform a first bend on the connecting portions of the first piezoelectric component and the second piezoelectric component in opposite directions so that the distance between the first surfaces of the connecting portions of the first piezoelectric component and the second piezoelectric component after the first bend is less than or equal to a set threshold.

[0042] In one embodiment, connecting the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes:

[0043] After the first bend, connect the first surface of the connecting portion of the first piezoelectric component and the second piezoelectric component to the positive electrode circuit board, and connect the second surface of the connecting portion of the first piezoelectric component and the second piezoelectric component to the negative electrode circuit board.

[0044] In one embodiment, connecting the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes:

[0045] After the first bend, connect the connecting portion of the first piezoelectric component and the second piezoelectric component to one of the positive electrode circuit board and the negative electrode circuit board;

[0046] Perform a second bend on the connecting portions of the first piezoelectric component and the second piezoelectric component in the same direction;

[0047] After the second bend, connect the connecting portion of the first piezoelectric component and the second piezoelectric component to the other of the positive electrode circuit board and the negative electrode circuit board.

[0048] In one embodiment, at least two piezoelectric components include: a third piezoelectric component and a fourth piezoelectric component; the bending of the connecting portion includes:

[0049] Perform a first bend on the connecting portion of the fourth piezoelectric component so that the distance between the fourth piezoelectric component and the first surface of the connecting portion of the third piezoelectric component is less than or equal to a set threshold value.

[0050] In one embodiment, connecting the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes:

[0051] After the first bend, connect the connecting portion of the third piezoelectric component and the fourth piezoelectric component to one of the positive electrode circuit board and the negative electrode circuit board;

[0052] Perform a second bend on the connecting portion of the third piezoelectric component and the fourth piezoelectric component in the same direction;

[0053] After the second bend, connect the connecting portion of the third piezoelectric component and the fourth piezoelectric component to the other of the positive electrode circuit board and the negative electrode circuit board.

[0054] In one embodiment, along the extending direction of the connecting portion, the connection position of the positive electrode circuit board and the first surface and the connection position of the negative electrode circuit board and the second surface are staggered.

[0055] The piezoelectric module, electronic device, and piezoelectric module assembly process provided by the present disclosure at least have the following beneficial effects:

[0056] The piezoelectric module provided by the embodiments of the present disclosure, through the staggered connecting portions, makes the thickness at the connection of the piezoelectric module and the circuit boards (positive electrode circuit board and negative electrode circuit board) always the thickness of the connection of one piezoelectric component and the circuit board. Accordingly, the thickness at the connection of the piezoelectric component and the positive electrode circuit board and the negative electrode circuit board is reduced. Furthermore, the volume of the piezoelectric module is reduced for easy installation. In addition, the piezoelectric module provided by the embodiments of the present disclosure also has the advantages of simple processing and easy mass production. Description of the Drawings

[0057] The drawings here are incorporated into the specification and constitute a part of this specification, showing the embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0058] Figure 1 is a schematic structural diagram of a piezoelectric module shown according to an exemplary embodiment;

[0059] Figure 2-1 is a schematic structural diagram of a piezoelectric component shown according to an exemplary embodiment;

[0060] Figure 2-2 is a schematic structural diagram of a piezoelectric component shown according to another exemplary embodiment;

[0061] Figure 3is a schematic structural diagram of a piezoelectric module shown according to another exemplary embodiment;

[0062] Figure 4 is a schematic structural diagram of a piezoelectric module shown according to another exemplary embodiment;

[0063] Figure 5 is a schematic structural diagram of a piezoelectric module shown according to another exemplary embodiment;

[0064] Figure 6 is a schematic structural diagram of a piezoelectric module shown according to another exemplary embodiment;

[0065] Figure 7 is a schematic structural diagram of a piezoelectric module shown according to another exemplary embodiment;

[0066] Figure 8 is a flowchart of a piezoelectric module assembly process shown according to an exemplary embodiment;

[0067] Figure 9 is a flowchart of a piezoelectric module assembly process shown according to another exemplary embodiment;

[0068] Figure 10 is a flowchart of a piezoelectric module assembly process shown according to another exemplary embodiment. Detailed Description of the Invention

[0069] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0070] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this disclosure should have the ordinary meanings understood by those of ordinary skill in the art to which this disclosure pertains. The use of words such as "a" or "an" in the specification and claims of this disclosure does not denote a limitation of quantity but rather indicates the presence of at least one. Unless otherwise indicated, words such as "comprising" or "including" mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections and may include electrical connections, whether direct or indirect. The singular forms of "a", "the", and "said" used in the specification and claims of this disclosure are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to any and all possible combinations of one or more of the associated listed items.

[0071] In some embodiments, the piezoelectric module includes at least two piezoelectric components stacked, a positive electrode circuit board connected to the positive electrode of the piezoelectric component, and a negative electrode circuit board connected to the negative electrode of the piezoelectric component. An electric field is applied to the piezoelectric component through the positive electrode circuit board and the negative electrode circuit board to stimulate the inverse piezoelectric effect of the piezoelectric component, causing the piezoelectric component to deform under the action of the electric field, and then driving the screen to vibrate and generate sound.

[0072] However, the portion where the piezoelectric component is connected to the positive electrode circuit board or the negative electrode circuit board is relatively thick, increasing the volume of the overall piezoelectric module and affecting the installation of the piezoelectric module. In addition, the connection process between the piezoelectric component and the circuit board is difficult and not suitable for mass production.

[0073] Based on the above situation, the embodiments of this disclosure provide a piezoelectric module, an electronic device, and a piezoelectric module assembly process.

[0074] Figure 1 is a schematic structural diagram of a piezoelectric module shown according to an exemplary embodiment. As Figure 1 shown, the piezoelectric module provided by the embodiments of this disclosure includes at least two piezoelectric components 100, a positive electrode circuit board 200, and a negative electrode circuit board 300.

[0075] Among them, a piezoelectric component 100 includes a main body portion 110 and a connecting portion 120. The first surface 100a of the main body portion 110 and the connecting portion 120 is the positive electrode, and the second surface 100b of the main body portion 110 and the connecting portion 120 is the negative electrode. Among them, the first surface 100a and the second surface 100b are two opposite surfaces of the piezoelectric component 100. Exemplarily, the first surface 100a is the upper surface of the main body portion 110 and the connecting portion 120, and the second surface 100b is the lower surface of the main body portion 110 and the connecting portion 120.

[0076] In addition, in the main body portion 110, a piezoelectric element is disposed between the positive electrode 110a and the negative electrode 110b. The piezoelectric element is prepared from a material with piezoelectric properties. For example, the material of the piezoelectric element includes polyvinylidene fluoride (pure polyvinylidene fluoride, or a mixture of polyvinylidene fluoride and materials such as zirconia, alumina, carbon nanotubes, etc.). Through the electric field action of the positive electrode and the negative electrode, the inverse piezoelectric effect of the piezoelectric element is excited, converting electrical energy into mechanical energy, that is, the piezoelectric module realizes vibration.

[0077] The connecting portion 120 protrudes from a set edge 110x of the main body portion 110. Figure 2-1 and Figure 2-2 are schematic structural diagrams of the piezoelectric component shown according to different exemplary embodiments.

[0078] Exemplarily, as Figure 2-1 shown, the piezoelectric component 100 includes a main body portion 110. At this time, the connecting portion 120 is connected to the set edge 110x of the main body portion 110. Exemplarily, as Figure 2-2 shown, the piezoelectric component 100 includes: a first main body portion 111 and a second main body portion 112. Two ends of the connecting portion 120 are respectively connected to the set edge 110x of the first main body portion 111 and the set edge 110x of the second main body portion 112.

[0079] Optionally, the piezoelectric component 100 is a complete piezoelectric thin film component, and the main body portion 110 and the connecting portion 120 are formed by processes such as cutting and shearing.

[0080] Figure 3 is a schematic structural diagram of the piezoelectric module shown according to another exemplary embodiment. As Figure 1 and Figure 3 shown, the piezoelectric module includes at least two piezoelectric components 100. Among them, Figure 1 taking 2 piezoelectric components 100 as an example, Figure 3 taking 3 piezoelectric components 100 as an example. Of course, the number of piezoelectric components 100 can also be selected as 4, 5, 6, etc.

[0081] In the piezoelectric module, the main body portions 110 of at least two piezoelectric components 100 are stacked. Optionally, the main body portions 110 of adjacent piezoelectric components 100 are connected by an optical adhesive.

[0082] Moreover, in two adjacent main body parts 110, the first surface 100a of one main body part 110 is arranged facing the second surface 100b of the other main body part 110. In this way, the orientations of the first surfaces 100a of the connecting parts 120 in at least two piezoelectric assemblies 100 are the same. For example Figure 1 in, the first surfaces 100a of the two connecting parts 120 are both arranged upward, and the second surfaces 100b of the two connecting parts 120 are both arranged downward.

[0083] In addition, the connecting parts 120 of at least two piezoelectric assemblies 100 are staggeredly distributed along the set edge 110x of the main body part 110. Staggered distribution means that: in a plane perpendicular to the thickness direction of the piezoelectric assembly 100, the projections of the connecting parts 120 of different piezoelectric assemblies 100 do not overlap. Optionally, in different piezoelectric assemblies 100, the distances from the connecting parts 120 to the designated end of the set edge 110x of the main body part 110 are different.

[0084] For example Figure 1 as shown, in the plane formed by the x-axis and the y-axis, the projections of the connecting parts 120 of the two piezoelectric assemblies 100 do not overlap. Another example is Figure 3 as shown, in the plane formed by the x-axis and the y-axis, the projections of the connecting parts 120 of the three piezoelectric assemblies 100 do not overlap.

[0085] The positive electrode circuit board 200 is connected to the first surfaces 100a of at least two connecting parts 120, and the negative electrode circuit board 300 is connected to the second surfaces 100b of at least two connecting parts 120. Accordingly, a driving signal is input to the piezoelectric assembly 100 through the positive electrode circuit board 200 and the negative electrode circuit board 300 to drive the piezoelectric assembly 100 to vibrate. Optionally, the positive electrode circuit board 200 and the negative electrode circuit board 300 are flexible printed circuit boards (FPCBs).

[0086] In such a case, the orientations of the first surfaces 100a of at least two connecting parts 120 are the same, which is convenient for the connection between the positive electrode circuit board 200 and the connecting parts 120. The orientations of the second surfaces 100b of at least two connecting parts 120 are the same, which is convenient for the connection between the negative electrode circuit board 300 and the connecting parts 120.

[0087] Moreover, at least two connecting parts 120 are staggeredly distributed, so that only one connecting part 120 is connected to the parts of the positive electrode circuit board 200 and the negative electrode circuit board 300 within the set length range. Taking Figure 1 the positive electrode circuit board 200 as an example, the positive electrode circuit board 200 is divided into a first section 210 and a second section 220 along the length direction. Among them, the first section 210 is only used to connect the connecting part 120 of the upper piezoelectric assembly 100, and the second section 220 is only used to connect the connecting part 120 of the lower piezoelectric assembly 100.

[0088] At this time, the thickness at the connection between the positive electrode circuit board 200 and the piezoelectric component 100 is: the thickness at the connection between the positive electrode circuit board 200 and a connection part 120. In other words, in the case where the piezoelectric module includes at least two piezoelectric components 100, the thickness at the connection between the positive electrode circuit board 200 and the connection part 120 will not increase either. Similarly, the thickness at the connection between the negative electrode circuit board 300 and the piezoelectric component 100 is always: the thickness at the connection between the negative electrode circuit board 300 and a connection part 120.

[0089] In summary, by using the piezoelectric module provided in the embodiments of the present disclosure, the thickness at the connection between the piezoelectric component 100 and the circuit boards (the positive electrode circuit board 200 and the negative electrode circuit board 300) is reduced by the stagger - arranged connection parts 120. Moreover, by setting the first surfaces 100a of at least two connection parts 120 to face the same direction and the second surfaces 100b of at least two connection parts 120 to face the same direction, it is convenient for the circuit boards to be connected to the connection parts 120, simplifies the assembly process, and makes the piezoelectric module suitable for mass production.

[0090] In one embodiment, as Figure 1 shown, along the extending direction of the connection part 120, the positive electrode circuit board 200 and the negative electrode circuit board 300 are stagger - arranged. Specifically, the connection part 120 extends along the x - axis. At this time, the projections of the positive electrode circuit board 200 and the negative electrode circuit board 300 in the plane formed by the x - axis and the y - axis do not overlap. Accordingly, by the stagger - distribution of the positive electrode circuit board 200 and the negative electrode circuit board 300, the thickness at the connection between the circuit board and the piezoelectric module is further reduced.

[0091] In one embodiment, Figure 4 is a schematic structural diagram of a piezoelectric component shown according to an exemplary embodiment. As Figure 4 shown, the connection part 120 in the piezoelectric component 100 includes: a bearing section 121 and a bending section 122.

[0092] The first surface 100a of the bearing section 121 is the positive electrode, and the first surface 100a of the bearing section 121 is used to connect the positive electrode circuit board 200. The second surface 100b of the bearing section 121 is the negative electrode, and the second surface 100b of the bearing section 121 is used to connect the negative electrode circuit board 300.

[0093] The bending section 122 is connected to the bearing section 121. Optionally, the bending section 122 includes a curved surface or at least one inclined surface. Among them, the bending direction of the bending section 122 is configured such that the bearing sections 121 of at least two piezoelectric components 100 approach each other along the thickness direction (z - axis) of the connection part 120. In this way, the height difference between the connection points between the bearing sections 121 and the circuit boards (the positive electrode circuit board 200 and the negative electrode circuit board 300) in different connection parts 120 is reduced.

[0094] Optionally, between any two piezoelectric components, the distance between the first surfaces 100a of the bearing segments 121 is less than or equal to a set threshold. For example, the set threshold is 1 mm, 1.5 mm, 2 mm, etc. Accordingly, the bearing segments 121 in different connecting portions 120 can be connected to one surface of the circuit board. In this way, the structural thickness at the connection between the connecting portion 120 and the positive circuit board 200, and at the connection between the connecting portion 120 and the negative circuit board 300 is reduced, and the volume at the connection between the connecting portion 120 and the circuit board is further reduced.

[0095] In the embodiments of the present disclosure, the bearing segments 121 and the bending segments 122 have various implementation manners. Hereinafter, a piezoelectric module including two piezoelectric components 100 will be taken as an example for illustration.

[0096] The first implementation manner

[0097] As Figure 4 shown, the piezoelectric module includes: a first piezoelectric component 100A and a second piezoelectric component 100B, and the main body portion 110A of the first piezoelectric component 100A is disposed above the main body portion 110B of the second piezoelectric component 100B.

[0098] The bending segment of the first piezoelectric component 100A includes a first bending segment 122A, and the bearing segment of the first piezoelectric component 100A includes a first bearing segment 121A. Among them, the first bending segment 122A and the first bearing segment 121A are sequentially connected from a set edge of the main body portion 110A.

[0099] The bending segment of the second piezoelectric component 100B includes a second bending segment 122B, and the bearing segment of the second piezoelectric component 100B includes a second bearing segment 121B. Among them, the second bending segment 122B and the second bearing segment 121B are sequentially connected from a set edge of the main body portion 110B.

[0100] Among them, the bending directions of the first bending segment 122A and the second bending segment 122B are opposite, so that the distance between the first surfaces 100a of the first bearing segment 121A and the second bearing segment 121B is less than or equal to the set threshold. Exemplarily, as Figure 4 shown, the first bending segment 122A is bent downward, and the second bending segment 122B is bent upward, so that the first bearing segment 121A and the second bearing segment 121B are close to each other.

[0101] Optionally, the bending curvatures and lengths of the first bending segment 122A and the second bending segment 122B satisfy: the first surface 100a of the first bearing segment 121A is flush with the first surface 100a of the second bearing segment 121B, and the second surface 100b of the first bearing segment 121A is flush with the second surface 100b of the second bearing segment 121B.

[0102] In this implementation, the first bearing segment 121A and the second bearing segment 121B are used to connect the positive electrode circuit board 200 and the negative electrode circuit board 300. Specifically, the first surface 100a of the first bearing segment 121A and the second bearing segment 121B is used to connect the positive electrode circuit board 200, and the second surface 100b of the first bearing segment 121A and the second bearing segment 121B is used to connect the negative electrode circuit board 300.

[0103] In this way, through the first bending segment 122A and the second bending segment 122B, in the thickness direction (z-axis), the first bearing segment 121A and the second bearing segment 121B are converged at the middle position of the piezoelectric module, reducing the thickness at the connection between the piezoelectric component 100 and the positive electrode circuit board 200 and the negative electrode circuit board 300.

[0104] The second implementation

[0105] Figure 5 is a schematic structural diagram of the piezoelectric component in the piezoelectric module shown according to an exemplary embodiment. The second implementation is an improvement based on the first implementation. Among them, the first bearing segment 121A and the second bearing segment 121B are connected to one of the positive electrode circuit board 200 and the negative electrode circuit board 300. As Figure 5 shown, the first surface 100a of the first bearing segment 121A and the second bearing segment 121B is connected to the positive electrode circuit board.

[0106] In the second implementation, the bending segment of the first piezoelectric component 100A further includes a third bending segment 122C, and the bearing segment of the first piezoelectric component 100A further includes: a third bearing segment 121C. Among them, the third bending segment 122C and the third bearing segment 121C are sequentially connected from the end of the first bearing segment 121A far from the first bending segment 122A.

[0107] The bending segment of the second piezoelectric component 100B further includes a fourth bending segment 122D, and the bearing segment of the second piezoelectric component 100B further includes a fourth bearing segment 121D. Among them, the fourth bending segment 122D and the fourth bearing segment 121D are sequentially connected from the end of the second bearing segment 121B far from the second bending segment 122B.

[0108] The bending directions of the third bending segment 122C and the fourth bending segment 122D are the same. As Figure 5 shown, the third bending segment 122C and the fourth bending segment 122D are bent upward. In this way, the heights of the third bearing segment 121C and the fourth bearing segment 121D are raised. Furthermore, the second surface 100b of the third bearing segment 121C and the fourth bearing segment 121D is connected to the negative electrode circuit board.

[0109] Except Figure 5In addition to the above-described manner, optionally, the second surface 100b of the first bearing section 121A and the second bearing section 121B is connected to the negative circuit board. At this time, the third bending section 122C and the fourth bending section 122D are bent downward to reduce the height of the third bearing section 121C and the fourth bearing section 121D. Furthermore, the first surface 100a of the third bearing section 121C and the fourth bearing section 121D is connected to the positive circuit board.

[0110] That is, the first bearing section 121A and the second bearing section 121B are connected to one of the positive circuit board and the negative circuit board, and the third bearing section 121C and the fourth bearing section 121D are connected to the other of the positive circuit board and the negative circuit board.

[0111] In this implementation manner, a piezoelectric component 100 is respectively connected to the positive circuit board and the negative circuit board through different bearing sections (121C and 121D). And, through the third bending section 122C and the fourth bending section 122D, the positions of the third bearing section 121C and the fourth bearing section 121D are changed in the thickness direction (z-axis), thereby providing an installation space for the circuit board.

[0112] Adopting such a manner, in the thickness direction (z-axis), the positive circuit board and the negative circuit board do not exceed the upper surface of the main body portion 110A and the lower surface of the main body portion 110B, effectively reducing the thickness of the connection portion 120 at the connection with the positive circuit board and the negative circuit board.

[0113] The third implementation manner

[0114] Figure 6 is a schematic structural diagram of a piezoelectric component in a piezoelectric module shown according to an exemplary embodiment. As Figure 6 shown, the piezoelectric module includes: a third piezoelectric component 100C and a fourth piezoelectric component 100D, and the main body portion 110C of the third piezoelectric component 100C is disposed above the main body portion 110D of the fourth piezoelectric component 100D.

[0115] The bearing section of the third piezoelectric component 100C includes: a fifth bearing section 121E connected to a set edge of the main body 110C. The bending section of the fourth piezoelectric component 100D includes a fifth bending section 122E, and the bearing section of the fourth piezoelectric component 100D includes a sixth bearing section 121F. The fifth bending section 122E and the sixth bearing section 121F are sequentially connected from a set edge of the main body portion 110D.

[0116] Wherein, the bending direction of the fifth bending section 122E is configured such that the distance between the sixth bearing section 121F and the first surface 100a of the fifth bearing section 121E is less than or equal to a set threshold value. As Figure 6As shown, the fifth bending section 122E bends upward, causing the sixth bearing section 121F to approach the fifth bearing section 121E. Preferably, the fifth bending section 122E causes the sixth bearing section 121F not to exceed the upper surface of the main body 110C of the third piezoelectric component 100C.

[0117] One of the positive circuit board or the negative circuit board is connected to the fifth bearing section 121E and the sixth bearing section 121F. Optionally, the fifth bearing section 121E and the sixth bearing section 121F are connected to the positive circuit board and the negative circuit board. The main body 110C of the third piezoelectric component 100C is disposed above the main body 110D of the fourth piezoelectric component 100D. To prevent the circuit board from exceeding the upper surface of the main body 110C, it is preferable to utilize the space below the fifth bearing section 121E and the sixth bearing section 121F. That is, the second surface of the fifth bearing section 121E and the sixth bearing section 121F is connected to the negative circuit board.

[0118] In addition, the bending section of the third piezoelectric component 100C further includes a sixth bending section 122F, and the bearing section of the third piezoelectric component 100C further includes a seventh bearing section 121G. The sixth bending section 122F and the seventh bearing section 121G are sequentially connected from the end of the fifth bearing section 121E away from the main body 110C.

[0119] The bending section of the fourth piezoelectric component 100D further includes a seventh bending section 122G, and the bearing section of the fourth piezoelectric component 100D further includes an eighth bearing section 121H. The seventh bending section 122G and the eighth bearing section 121H are sequentially connected from the end of the sixth bearing section 121F away from the fifth bending section 122E.

[0120] Among them, the bending directions of the sixth bending section 122F and the seventh bending section 122G are the same. For example Figure 6 As shown, the sixth bending section 122F and the seventh bending section 122G bend downward to reduce the heights of the seventh bearing section 121G and the eighth bearing section 121H. At this time, there is more space above the seventh bearing section 121G and the eighth bearing section 121H, and it is preferable to connect the positive circuit board.

[0121] This implementation method rationally utilizes the space above or below the bearing section 121 by setting the bending section 122 to reduce the thickness at the connection between the connecting portion 120 and the positive circuit board and the negative circuit board. And, in this way, the connecting portion 120, the positive circuit board, and the negative circuit board form a braided structure, optimizing the connection stability among the three, and further improving the structural stability of the overall piezoelectric module.

[0122] Of course, it is also optional that the connecting portion of the third piezoelectric component 100C first bends downward, and then the connecting portion of the fourth piezoelectric component 100D bends upward synchronously. At this time, the positive circuit board is disposed close to the main body 110, and the negative circuit board is disposed away from the main body 110.

[0123] In addition, in a vibration module having more than two piezoelectric components 100, the setting manner of the connection portion 120 of the piezoelectric component 100 can also refer to the above three implementation manners. Figure 7 It is a schematic structural diagram of a piezoelectric component in a piezoelectric film group shown according to an exemplary embodiment.

[0124] As Figure 7 shown, in the order from top to bottom, the connection portions 120 of the three upper piezoelectric components 100 are bent downward to be flush with the connection portion 120 of the lowermost piezoelectric component 100 to connect to the positive electrode circuit board 200. Then, the connection portions 120 of the four piezoelectric components 100 are bent upward synchronously to connect to the negative electrode circuit board 300.

[0125] It should be noted that Figure 7 it is only an exemplary implementation manner of four piezoelectric components. Those skilled in the art can arbitrarily select and combine the setting manners of the above-provided connection portion 120 based on the number of piezoelectric components 100, and the implemented manners are all the content disclosed in the present disclosure.

[0126] In a second aspect, the embodiments of the present disclosure further provide an electronic device, and the electronic device includes the piezoelectric module provided in the first aspect above. Optionally, a display screen and the piezoelectric module provided in the first aspect above.

[0127] By using the electronic device provided in the embodiments of the present disclosure, the piezoelectric module has a small volume and is convenient for installation, effectively reducing the assembly difficulty of the overall electronic device, and at the same time can also meet the design requirements of the electronic device for being thin and light.

[0128] In an embodiment, the electronic device further includes a display screen, and the piezoelectric module is connected to the back surface of the display screen. For example, the piezoelectric module is attached to the back surface of the display screen; or the piezoelectric module is connected to the back surface of the display screen through other transmission members. Among them, the back surface of the display screen refers to the part of the display screen facing the inside of the electronic device. In this way, the piezoelectric module vibrates to drive the display screen to vibrate to realize screen sound, achieving the purpose of removing the sound holes of the electronic device.

[0129] In an embodiment, the electronic device further includes a middle frame, and the middle frame is used to fix the display screen. The piezoelectric module is attached to the middle frame. In this way, the piezoelectric module vibrates to drive the middle frame to vibrate to generate sound, also achieving the purpose of removing the sound holes of the electronic device.

[0130] In addition, in the embodiments of the present disclosure, the electronic device includes but is not limited to: mobile phones, tablet computers, wearable devices (such as smart watches, smart bracelets, etc.), vehicle-mounted devices, and medical devices.

[0131] In a third aspect, embodiments of the present disclosure provide an assembly process for a piezoelectric module. This assembly process is used to process the piezoelectric module provided in the first aspect above. Figure 8 It is a flowchart of an assembly process for a piezoelectric module shown according to an exemplary embodiment.

[0132] As Figure 8 shown, the assembly process provided by the embodiments of the present disclosure includes:

[0133] Step 801, provide at least two piezoelectric components.

[0134] Among them, for the structure of the piezoelectric component, refer to the implementation provided in the first aspect above. Specifically, a piezoelectric component includes a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion; the first surface of the main body portion and the connecting portion is the positive electrode, the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite. And, refer to Figure 2-1 and Figure 2-2 , in different piezoelectric components, the setting positions of the connecting portions along the set edge are different.

[0135] Step 802, stack the main body portions of at least two piezoelectric components such that the first surface of one piezoelectric component faces the second surface of another piezoelectric component, and the connecting portions of at least two piezoelectric components are staggered along the set edge. Optionally, the main body portions of different piezoelectric components are connected by an optical adhesive.

[0136] Step 803, connect the first surface of the connecting portion to the positive electrode circuit board, connect the second surface of the connecting portion to the negative electrode circuit board, and different connecting portions are connected to different positions of the positive electrode circuit board, and different connecting portions are connected to different positions of the negative electrode circuit board.

[0137] Using the assembly process for a piezoelectric module provided by the embodiments of the present disclosure, through the staggered connecting portions, the thickness at the connection between the connecting portion and the circuit board is always the thickness of the connection between the circuit board and one connecting portion. In this way, in the case of having at least two piezoelectric components, the connection thickness between the connecting portion and the circuit board is reduced. And, the positive electrode circuit board is connected to the first surface of the connecting portion, the negative electrode circuit board is connected to the second surface of the connecting portion, and the overall process is simple and easy to operate, which is suitable for mass-producing piezoelectric modules.

[0138] In one embodiment, the piezoelectric component is a flexible component, for example, the piezoelectric component is a thin-film piezoelectric component. At this time, before step 803, this process further includes: bending the connecting portion such that the distance between the first surfaces of the connecting portions of any two piezoelectric components after bending is less than or equal to a set threshold.

[0139] In this way, the connecting portions of any two piezoelectric components are close to each other in the thickness direction of the piezoelectric module, further reducing the thickness at the connection between the connecting portion and the circuit board.

[0140] In the embodiments of the present disclosure, there are multiple implementation manners for the bent piezoelectric component and step 803. These will be introduced separately in different examples below.

[0141] In the first example, at least two piezoelectric components include: a first piezoelectric component and a second piezoelectric component. At this time, the bent connecting portion specifically includes: performing a first bend on the connecting portions of the first piezoelectric component and the second piezoelectric component in opposite directions, such that the distance between the first surfaces of the connecting portions of the first piezoelectric component and the second piezoelectric component after the first bend is less than or equal to a set threshold.

[0142] Combined with Figure 4 the shown structure, the connecting portion of the first piezoelectric component is bent downward, and the connecting portion of the second piezoelectric component is bent upward. In this way, the connecting portions of the first piezoelectric component and the second piezoelectric component converge towards the middle position in the thickness direction of the piezoelectric module. Further, the overall thickness at the connection between the connecting portion and the circuit board is further reduced.

[0143] Based on the above process steps of the bent connecting portion, step 803 has two implementation manners.

[0144] Optionally, step 803 includes: after the first bend, connecting the first surface of the connecting portions of the first piezoelectric component and the second piezoelectric component to the positive circuit board, and connecting the second surface of the connecting portions of the first piezoelectric component and the second piezoelectric component to the negative circuit board.

[0145] Optionally, Figure 9 is a flowchart of the piezoelectric module assembly process shown according to another exemplary embodiment. As Figure 9 shown, step 803 includes:

[0146] Step 8031: After the first bend, connect the connecting portions of the first piezoelectric component and the second piezoelectric component to one of the positive circuit board and the negative circuit board.

[0147] Combined with Figure 5 the shown structure, after the first bend, the first surface of the connecting portions of the first piezoelectric component and the second piezoelectric component is connected to the positive circuit board.

[0148] Step 8032: Perform a second bend on the connecting portions of the first piezoelectric component and the second piezoelectric component in the same direction.

[0149] Combined with Figure 5 the shown structure, the connecting portions of the first piezoelectric component and the second piezoelectric component are bent upward.

[0150] Step 8033: After the second bend, connect the connecting portions of the first piezoelectric component and the second piezoelectric component to the other of the positive circuit board and the negative circuit board.

[0151] Combined with Figure 5In the structure shown, after the second bending, the second surface of the connecting portion between the first piezoelectric component and the second piezoelectric component is connected to the negative circuit board. It can be seen that through the second bending in step 8032, the connecting portion between the first piezoelectric component and the second piezoelectric component is lifted, providing an installation space for the negative circuit board.

[0152] Of course, optionally, in step 8031, the second surface of the connecting portion between the first piezoelectric component and the second piezoelectric component is connected to the negative circuit board. In step 8031, the connecting portion between the first piezoelectric component and the second piezoelectric component is bent downward. In step 8033, after the second bending, the first surface of the connecting portion between the first piezoelectric component and the second piezoelectric component is connected to the positive circuit board.

[0153] In the second example, at least two piezoelectric components include: a third piezoelectric component and a fourth piezoelectric component. At this time, the bending of the connecting portion specifically includes:

[0154] Perform a first bending on the connecting portion of the fourth piezoelectric component so that the distance between the first surfaces of the connecting portions of the fourth piezoelectric component and the third piezoelectric component is less than or equal to a set threshold. In this way, the connecting portion of the first piezoelectric component approaches the connecting portion of the third piezoelectric component.

[0155] Optionally, Figure 10 is a flowchart of a piezoelectric module assembly process shown according to another exemplary embodiment. As Figure 10 shown, step 803 specifically includes:

[0156] Step 8034: After the first bending, connect the connecting portion between the third piezoelectric component and the fourth piezoelectric component to one of the positive circuit board and the negative circuit board.

[0157] Combined with Figure 6 the structure shown, the second surface of the connecting portion between the third piezoelectric component and the fourth piezoelectric component is connected to the negative circuit board.

[0158] Step 8035: Perform a second bending on the connecting portion between the third piezoelectric component and the fourth piezoelectric component in the same direction.

[0159] Combined with Figure 6 the structure shown, the connecting portion between the third piezoelectric component and the fourth piezoelectric component is bent downward.

[0160] Step 8036: After the second bending, connect the connecting portion between the third piezoelectric component and the fourth piezoelectric component to the other of the positive circuit board and the negative circuit board.

[0161] Combined with Figure 6 the structure shown, the first surface of the connecting portion between the third piezoelectric component and the fourth piezoelectric component is connected to the positive circuit board.

[0162] In one embodiment, in step 803, along the extending direction of the connecting portion, the connection position of the positive electrode circuit board and the first surface and the connection position of the negative electrode circuit board and the second surface are staggered. That is, along the extending direction of the connecting portion, the connection position of the positive electrode circuit board and the first surface and the connection position of the negative electrode circuit board and the second surface are offset. Accordingly, the thickness at the connection between the positive electrode circuit board and the negative electrode circuit board and the connecting portion is reduced.

[0163] It should be noted that the above embodiments do not specifically limit the number of piezoelectric components. When there are more than two piezoelectric components in the piezoelectric module, the assembly process can refer to the process steps provided above.

[0164] Through the piezoelectric module assembly process provided by the embodiments of the present disclosure, it is possible to effectively reduce the thickness at the connection between the piezoelectric components and the circuit board in the assembled piezoelectric module, and reduce the volume of the overall piezoelectric module. Moreover, the overall process is simple and easy to operate, and is suitable for mass-producing piezoelectric modules.

[0165] After considering the specification and practicing the disclosure herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common general knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the following claims.

Claims

1. A piezoelectric module, characterized in that, the piezoelectric module includes: at least two piezoelectric components, a positive electrode circuit board, and a negative electrode circuit board; the piezoelectric component includes: a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion; the first surface of the main body portion and the connecting portion is the positive electrode, the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite; wherein, in the main body portion, a piezoelectric element is arranged between the positive electrode and the negative electrode; the main body portions of at least two of the piezoelectric components are stacked, the connecting portions of at least two of the piezoelectric components are staggered along the edge, and the orientations of the first surfaces of the connecting portions are the same; the positive electrode circuit board is connected to the first surface of the connecting portion, and the negative electrode circuit board is connected to the second surface of the connecting portion; the connecting portion of at least one piezoelectric component includes: a bearing section, the first surface of the bearing section is the positive electrode, and the second surface of the bearing section is the negative electrode; and a bending section, connected to the bearing section, and the bending direction of the bending section is configured such that the bearing sections of at least two of the piezoelectric components approach each other in the thickness direction of the connecting portion.

2. The piezoelectric module according to claim 1, characterized in that, in any two of the piezoelectric components, the distance between the first surfaces of the bearing sections is less than or equal to a set threshold value.

3. The piezoelectric module according to claim 1, characterized in that, at least two piezoelectric components include: a first piezoelectric component and a second piezoelectric component; the bending section of the first piezoelectric component includes a first bending section, the bearing section of the first piezoelectric component includes a first bearing section, and the first bending section and the first bearing section are sequentially connected from the set edge; the bending section of the second piezoelectric component includes a second bending section, the bearing section of the second piezoelectric component includes a second bearing section, and the second bending section and the second bearing section are sequentially connected from the set edge; the bending directions of the first bending section and the second bending section are opposite, so that the distance between the first surfaces of the first bearing section and the second bearing section is less than or equal to a set threshold value.

4. The piezoelectric module according to claim 3, characterized in that, the first bearing section and the second bearing section connect the positive electrode circuit board and the negative electrode circuit board; or the first bearing section and the second bearing section connect one of the positive electrode circuit board and the negative electrode circuit board.

5. The piezoelectric module according to claim 4, characterized in that, the bending section of the first piezoelectric component includes a third bending section, the bearing section of the first piezoelectric component further includes a third bearing section, and the third bending section and the third bearing section are sequentially connected from the end of the first bearing section away from the first bending section; the bending section of the second piezoelectric component includes a fourth bending section, the bearing section of the second piezoelectric component includes a fourth bearing section, and the fourth bending section and the fourth bearing section are sequentially connected from the end of the second bearing section away from the second bending section; the bending directions of the third bending section and the fourth bending section are the same; The first bearing section and the second bearing section are used to connect one of the positive circuit board and the negative circuit board, and the third bearing section and the fourth bearing section are used to connect the other of the positive circuit board and the negative circuit board.

6. The piezoelectric module according to claim 1, wherein, at least two piezoelectric components include: a third piezoelectric component and a fourth piezoelectric component; the bearing section of the third piezoelectric component includes a fifth bearing section connected to the set edge; the bending section of the fourth piezoelectric component includes a fifth bending section, the bearing section of the fourth piezoelectric component includes a sixth bearing section, and the fifth bending section and the sixth bearing section are sequentially connected from the set edge; the bending direction of the fifth bending section is configured such that the distance between the sixth bearing section and the first surface of the fifth bearing section is less than or equal to a set threshold; and the fifth bearing section and the sixth bearing section connect the positive circuit board or the negative circuit board.

7. The piezoelectric module according to claim 6, wherein, the bending section of the third piezoelectric component further includes a sixth bending section, the bearing section of the third piezoelectric component further includes a seventh bearing section, and the sixth bending section and the seventh bearing section are sequentially connected from the end of the fifth bearing section away from the set edge; the bending section of the fourth piezoelectric component further includes a seventh bending section, the bearing section of the fourth piezoelectric component further includes an eighth bearing section, and the seventh bending section and the eighth bearing section are sequentially connected from the end of the sixth bearing section away from the fifth bending section; the bending directions of the sixth bending section and the seventh bending section are the same, and the seventh bearing section and the eighth bearing section are used to connect the positive circuit board or the negative circuit board.

8. The piezoelectric module according to claim 1, wherein, along the extending direction of the connecting portion, the positive circuit board and the negative circuit board are arranged alternately.

9. The piezoelectric module according to claim 1, wherein, the piezoelectric component includes: a first main body portion and a second main body portion, and two ends of the connecting portion are respectively connected to the first main body portion and the second main body portion.

10. An electronic device, wherein, the electronic device includes the piezoelectric module according to any one of claims 1 to 9.

11. An assembling process of a piezoelectric module, wherein, the process includes: providing at least two piezoelectric components, the piezoelectric components include a main body portion and a connecting portion, and the connecting portion protrudes from a set edge of the main body portion; the first surface of the main body portion and the connecting portion is the positive electrode, the second surface of the main body portion and the connecting portion is the negative electrode, and the first surface and the second surface are opposite to each other; stacking the main body portions of at least two piezoelectric components such that the first surface of one piezoelectric component faces the second surface of another piezoelectric component, and the connecting portions of at least two piezoelectric components are distributed alternately along the set edge; connecting the first surface of the connecting portion to the positive circuit board, connecting the second surface of the connecting portion to the negative circuit board, and different connecting portions are connected to different positions of the positive circuit board, and different connecting portions are connected to different positions of the negative circuit board; Wherein, before connecting the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board, the process further includes: Bending the connecting portion of at least one piezoelectric component such that the bent connecting portion forms a bearing section and a bent section; the first surface of the bearing section is the positive electrode, and the second surface of the bearing section is the negative electrode; the bent section is connected to the bearing section, and the bending direction of the bent section is configured such that the bearing sections of at least two piezoelectric components approach each other in the thickness direction of the connecting portion.

12. The assembly process according to claim 11, wherein, The distance between the first surfaces of the connecting portions of any two piezoelectric components after bending is less than or equal to a set threshold value.

13. The assembly process according to claim 12, wherein, At least two piezoelectric components include: a first piezoelectric component and a second piezoelectric component; The bending of the connecting portion includes: Performing a first bending on the connecting portions of the first piezoelectric component and the second piezoelectric component in opposite directions such that the distance between the first surfaces of the connecting portions of the first piezoelectric component and the second piezoelectric component after the first bending is less than or equal to a set threshold value.

14. The assembly process according to claim 13, wherein, The connecting of the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes: After the first bending, connecting the first surfaces of the connecting portions of the first piezoelectric component and the second piezoelectric component to the positive electrode circuit board, and connecting the second surfaces of the connecting portions of the first piezoelectric component and the second piezoelectric component to the negative electrode circuit board.

15. The assembly process according to claim 13, wherein, The connecting of the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes: After the first bending, connecting the connecting portions of the first piezoelectric component and the second piezoelectric component to one of the positive electrode circuit board and the negative electrode circuit board; Performing a second bending on the connecting portions of the first piezoelectric component and the second piezoelectric component in the same direction; After the second bending, connecting the connecting portions of the first piezoelectric component and the second piezoelectric component to the other of the positive electrode circuit board and the negative electrode circuit board.

16. The assembly process according to claim 12, wherein, At least two piezoelectric components include: a third piezoelectric component and a fourth piezoelectric component; the bending of the connecting portion includes: Performing a first bending on the connecting portion of the fourth piezoelectric component such that the distance between the first surfaces of the connecting portions of the fourth piezoelectric component and the third piezoelectric component is less than or equal to a set threshold value.

17. The assembly process according to claim 16, wherein, The connecting of the first surface of the connecting portion to the positive electrode circuit board and the second surface of the connecting portion to the negative electrode circuit board includes: After the first bending, connecting the connecting portions of the third piezoelectric component and the fourth piezoelectric component to one of the positive electrode circuit board and the negative electrode circuit board; Performing a second bending on the connecting portions of the third piezoelectric component and the fourth piezoelectric component in the same direction; After the second bending, connect the connecting portion of the third piezoelectric component and the fourth piezoelectric component to the other one of the positive electrode circuit board and the negative electrode circuit board.

18. The assembly process according to claim 11, wherein, along the extending direction of the connecting portion, the connection position of the positive electrode circuit board and the first surface and the connection position of the negative electrode circuit board and the second surface are staggered.

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