Semiconductor manufacturing equipment system and operation method thereof

Abstract

Embodiments of the present invention relate to a semiconductor manufacturing equipment system and an operating method thereof. The system includes an orientation tool and a transport tool configured to transport at least one customized part. The orientation tool includes a port configured to receive the workpiece, a sensor configured to detect the orientation of the workpiece received in the port, and a rotation mechanism configured to rotate the workpiece received in the port.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor manufacturing equipment system and an operating method thereof. Background Art

[0002] Integrated circuits are typically manufactured in automated or semi-automated equipment by passing a substrate / wafer (in and on which the device is manufactured) through a number of manufacturing operations used to complete the device. The number and type of manufacturing operations that a semiconductor device must pass through may depend on the specifications of the semiconductor device to be manufactured. For example, a complex chip may require hundreds of manufacturing operations.

[0003] In addition, modern semiconductor manufacturing equipment ("FABS") employs systems to transport workpieces (e.g., substrates / wafers and reticles) to tools required in the manufacturing process. Therefore, reticle transport devices and wafer transport devices have been employed in semiconductor manufacturing tools / equipment used in manufacturing operations (e.g., semiconductor exposure equipment used in photolithography operations). Therefore, there is a need for systems that can safely and efficiently transport workpieces in order to improve processing capacity and output rate. Summary of the invention

[0004] An embodiment of the present invention relates to an apparatus for orienting a workpiece, comprising: a port configured to receive the workpiece; a sensor configured to detect the orientation of the workpiece received in the port; and a rotation mechanism configured to rotate the workpiece received in the port.

[0005] An embodiment of the present invention relates to a system for semiconductor manufacturing equipment, comprising: a first manufacturing tool configured to load a workpiece to face a first direction; a second manufacturing tool configured to load the workpiece to face a second direction, wherein the second direction is different from the first direction; an orientation tool configured to adjust the orientation of the workpiece; and a transport tool configured to move the workpiece, wherein the first manufacturing tool, the second manufacturing tool, and the orientation tool are arranged along a motion path of the workpiece.

[0006] An embodiment of the present invention relates to a method for operating a system of semiconductor manufacturing equipment, which includes: moving a workpiece to an orientation device by a transport tool; detecting the orientation of the workpiece received in the orientation device by a sensor; rotating the workpiece received in the orientation device by a rotating mechanism; and moving the workpiece away from the device by the transport tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion.

[0008] Figure 1A is a side view of a system for semiconductor manufacturing equipment according to some embodiments of the present invention.

[0009] Figure 1B is a side view of a system for semiconductor manufacturing equipment according to some embodiments of the present invention.

[0010] Figure 2 is a block diagram of an apparatus for transporting a workpiece according to some embodiments of the present invention.

[0011] Figure 3 is a flow chart representing a method for operating a system for semiconductor manufacturing equipment according to some embodiments of the present invention.

[0012] Figure 4 is a flow chart representing example operations of a method for operating an apparatus for transporting a workpiece according to some embodiments of the present invention.

[0013] Figure 5 is a top view of a system for semiconductor manufacturing equipment according to some embodiments of the present invention. DETAILED DESCRIPTION

[0014] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. The following describes the specific examples of components and arrangements to simplify this disclosure. Of course, these are only examples and do not wish to be restrictive. For example, the first component in the following description is formed on or above the second component and may include an embodiment in which the first component and the second component are formed as direct contacts, and may also include an embodiment in which an additional component may be formed between the first component and the second component so that the first component and the second component may not directly contact. In addition, this disclosure may repeat element symbols and / or letters in various examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0015] This description of illustrative embodiments is intended to be read in conjunction with the accompanying drawings, which will be considered as part of the complete written description. In the description of the embodiments disclosed herein, any reference to direction or orientation is intended only for convenience of description and is not intended to limit the scope of the present disclosure in any way. Relative terms such as "lower", "upper", "horizontal", "vertical", "above", "below", "upward", "downward", "top" and "bottom" and their derivatives (e.g., "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the orientation as described next or as shown in the drawings in the discussion. These relative terms are only for convenience of description and do not require the device to be constructed or operated in a specific orientation. Terms such as "attach", "attach", "connect" and "interconnect" refer to a relationship in which structures are fixed or attached to each other directly or indirectly through an intermediary structure, as well as both removable or rigid attachments or relationships, unless otherwise explicitly described. In addition, the features and benefits of the present disclosure are illustrated by reference to the embodiments. Therefore, the present disclosure should not be explicitly limited to such embodiments that illustrate a possible non-limiting combination of features that may exist alone or in other combinations of features; the scope of the present disclosure is defined by the claims attached thereto.

[0016] During manufacturing, custom parts, such as reticles or wafers, are typically transported from their storage location to a manufacturing apparatus / tool ​​and back again by a transport device in a specific standardized carrier. When the transport device is positioned on and aligned with the manufacturing tool, the carrier is lowered to the load port of the manufacturing tool to load or unload the custom parts.

[0017] The present disclosure provides an apparatus and system for semiconductor manufacturing equipment that automatically changes and corrects the orientation of a workpiece moved by a transport device. The system includes an orientation tool configured to automatically adjust the orientation of the workpiece so that the orientation of the workpiece can meet different specifications of different manufacturing tools.

[0018] Figure 1A is a side view of a system 1 for semiconductor manufacturing equipment according to some embodiments of the present invention. In some embodiments, system 1 may be an automated material handling system (AMHS) that automatically handles custom parts (e.g., wafer(s) or reticle(s)) and transports them to manufacturing tools. The AMHS in a semiconductor manufacturing equipment includes many types of automated and manual carriers for moving and transporting reticle carriers and / or wafer carriers throughout the manufacturing equipment during manufacturing operations. This may include, for example, but not limited to, automated guided vehicles (AGVs), personal guided vehicles (PGVs), rail guided vehicles (RGVs), overhead shuttles (OHSs), and overhead hoist transports (OHTs).

[0019] like Figure 1AAs shown in FIG. 1 , system 1 includes at least two manufacturing tools 10 and 20. Manufacturing tools 10, 20 may be any type of wafer handling, manufacturing, testing, metrology or other facilities commonly used in semiconductor manufacturing equipment. In some embodiments of the present invention, manufacturing tool 10 may be, for example, but not limited to, a lithography tool, such as an extreme ultraviolet (EUV) lithography tool. Manufacturing tool 10 includes at least a loading port 101 for inserting customized parts into the first manufacturing tool 10 or removing customized parts from the first manufacturing tool 10. In some embodiments of the present invention, loading port 101 may include separate loading units and unloading units. In some embodiments of the present invention, when a customized part is inserted into the first manufacturing tool 10, the customized part should face a specific orientation. Therefore, the customized part received on the loading port 101 of the first manufacturing tool 10 should also face a specific direction. As Figure 1A As shown in FIG, the carrier 5 received on the loading port 101 of the first manufacturing tool 10 has a front side 51 facing away from the first manufacturing tool 10. In addition, the manufacturing tool 20 includes at least a loading port 201 for inserting customized parts into the manufacturing tool 20 or removing customized parts from the manufacturing tool 20. In some embodiments of the present invention, the loading port 201 may include a separate loading unit and an unloading unit. In some embodiments of the present invention, when the customized part is inserted into the second manufacturing tool 20, the customized part should face another specific direction. Therefore, the customized part received on the loading port 201 of the second manufacturing tool 20 should also face the other specific direction. Figure 1A , the carrier 5 received in the load port 201 of the second manufacturing tool 20 has a front side 51 facing the second manufacturing tool 20 .

[0020] The transport tool 4 integrated in the system 1 is configured to transport at least one customized part (e.g., a wafer or a reticle). For example, when the manufacturing tool 10 is a photolithography tool, the transport tool 4 transports at least one reticle. In some embodiments of the present invention, the transport tool 4 may be (e.g., but not limited to) an overhead crane transport (OHT). The transport tool 4 includes a track 42 (including rails) and an OHT carrier 41. The track 42 is attached to the ceiling and suspended from the ceiling. The OHT carrier 41 is movably mounted on the track 42 and is operable to transport customized parts (e.g., a reticle) in a carrier through the manufacturing equipment. As shown in FIG. Figure 1A , the OHT carrier 41 is configured to supplement the track 42 and cooperate with the track 42 for rolling along the track 42 and transporting the carrier 5 from one location to another. In addition, the OHT carrier 41 is configured and operable to vertically pick up, raise / lower, articulate and release the carrier 5 to and from the manufacturing tool 10, 20.

[0021] refer to Figure 1A, the system 1 includes a device 3 substantially positioned between two manufacturing tools 10 and 20. The device 3 includes a port 31 for receiving a carrier 5 transported by a transport tool 4. That is, the OHT carrier 41 can release the carrier 5 in the port 31 of the device 3 or pick up the carrier 5 from the port. The device 3 includes a sensor 32. The sensor 32 is configured to detect and identify the orientation of the carrier 5. That is, the sensor 32 can detect and identify which direction the carrier 5 is facing. In some embodiments of the present invention, the sensor 32 may include at least two tag readers, RFID readers, or CCD cameras, etc. In addition, the device 3 includes a rotating mechanism 35 configured to rotate the carrier 5 received in the port 31. In some embodiments of the present invention, for example, the rotating mechanism 35 includes a turntable 351 integrated in the port 31. As Figure 1A , when the port 31 of the device 3 receives the carrier 5, the carrier 5 is arranged on the turntable 351. Therefore, the turntable 351 will cause the carrier 5 to rotate.

[0022] like Figure 1A , the transport tool 4 is configured to move the carrier 5 from the first manufacturing tool 10 to the second manufacturing tool 20. However, when the carrier 5 is inserted into the first manufacturing tool 10, the carrier 5 should face the right side, and when the carrier 5 is inserted into the second manufacturing tool 20, the carrier 5 should face the left side. Figure 1A , the carrier 5 received in the load port 101 of the first manufacturing tool 10 faces away from the first manufacturing tool 10, and the carrier received in the load port 201 of the second manufacturing tool 20 faces the second manufacturing tool 20. Therefore, if the carrier 5 is moved from the first manufacturing tool 10 to the second manufacturing tool 20, the carrier 5 should be rotated 180 degrees before loading the carrier 5 into the second manufacturing tool 20.

[0023] refer to Figure 1A , the carrier 5 has a label 513 at its front side 51. When the carrier 5 is received in the loading port 101 of the first manufacturing tool 10, the carrier 5 faces the right side and therefore, the label 513 faces away from the first manufacturing tool 10. The OHT carrier 41 picks up the carrier 5 from the loading port 101 of the first manufacturing tool 10 and moves the carrier 5 to the right above the device 3 along the track 42. Then, the OHT carrier 41 lowers the carrier 5 and releases the carrier 5 on the port 31 of the device 3. The sensor 32 detects the label 513 of the carrier 5 and thus identifies the orientation of the carrier 5. In addition, the turntable 351 rotates the carrier 5 so that it turns 180 degrees so that the carrier 5 faces the left side. After rotating the carrier 5 180 degrees, the OHT carrier 41 picks up the carrier 5 from the port 31 of the device 3 and moves the carrier 5 to the right above the loading port 201 of the second manufacturing tool 20 along the track 42. Then, the OHT carrier 41 lowers the carrier 5 and releases the carrier 5 on the loading port 201 of the second manufacturing tool 20. As Figure 1A, when the carrier 5 is released on the load port 201 of the second manufacturing tool 20 by the OHT carrier 41 , the carrier 5 faces the left side and the label 513 faces the second manufacturing tool 20 .

[0024] Figure 1B is a side view of a system 1' for semiconductor manufacturing equipment according to some embodiments of the present invention. Figure 1B As shown in FIG. 3 , the rotating mechanism 35 includes a robot arm 353. Figure 1B , the robot arm 353 is configured to grasp the carrier 5 and rotate the carrier 5 .

[0025] Figure 2 is a block diagram of an apparatus 3 for transporting a workpiece according to some embodiments of the present invention. Figure 2 , the device 3 includes a processor 37 connected to the sensor 32 and the rotating mechanism 35. The processor 37 is configured to receive information from the sensor 32 and drive the rotating mechanism 35. After the sensor 32 detects and identifies the orientation of the carrier 5 received in the port 31, the sensor 32 sends this information to the processor 37. In addition, the processor 37 automatically or on demand drives the rotating mechanism 35 to rotate the carrier. The device 3 further includes a communication device 33 connected to the processor 37. In some embodiments of the present invention, the communication device 33 may be (for example (but not limited to)) E84 communication. In addition, the communication device 33 is connected to the conveyance tool 4 and is configured to communicate with the conveyance tool 4. When the conveyance tool 4 moves the carrier 5 to the device 3 or takes the carrier 5 away from the device 3, the communication device 33 can send information to the conveyance tool 4 and communicate with the conveyance tool 4. In addition, the host 2 connects the conveyance tool 4 with the processor 37 of the device 3. The host 2 is configured to monitor and control the conveyance tool 4 and the device 3. In addition, the host 2 is also configured to send commands to the processor 37 of the device 3. In other words, the host 2 is configured to manage the operation of the system 1.

[0026] refer to Figure 3 And also refer to Figure 1A and Figure 1B , Example method 6 illustrates the Figure 1A System 1 and / or Figure 1B A possible flow for System 1.

[0027] In operation 61, the transport tool 4 moves the carrier 5 from the load port 101 of the first manufacturing tool 10 to the port 31 of the device 3. Referring to FIG1 , when the carrier 5 is received in the load port 101 of the first manufacturing tool 10, the front side 51 of the carrier 5 faces away from the first manufacturing tool 10. The OHT carrier 41 picks up the carrier 5 from the load port 101 of the first manufacturing tool 10 and moves the carrier 5 along the rail 42. After the carrier 5 is moved to the right above the port 31 of the device 3 by the OHT carrier 41, the OHT carrier 41 lowers the carrier 5 and releases the carrier 5 in the port 31 of the device 3.

[0028] In operation 62, after the carrier 5 is released in the port 31 of the device 3, the sensor 32 (e.g., a tag reader, an RFID reader, or a CCD camera, etc.) detects the tag 513 of the carrier 5 and thus identifies the orientation of the carrier 5. That is, the device 3 can identify the position of the front side 51 of the carrier 5 by detecting the tag 513 of the carrier 5 and determine whether the carrier 5 should be rotated.

[0029] In operation 63, the rotating mechanism 35 is driven to rotate the carrier 5 so as to change the direction of the front side 51 of the carrier 5. In some embodiments of the present invention, the rotating mechanism 35 includes a robot arm 353. The robot arm can grasp the carrier 5 and rotate the carrier 5. In addition, in some embodiments of the present invention, the rotating mechanism 35 includes a turntable 351 integrated in the port 31. Therefore, when the turntable is rotated, the carrier 5 received in the port 31 is rotated accordingly. Figure 1A , when the OHT carrier 41 releases the carrier 5 in the port 31 of the device 3, the front side 51 of the carrier faces the right side, and then the turntable 351 rotates the carrier 5 to rotate it 180 degrees so that the front side 51 of the carrier 5 faces the left side. Figure 1B When the OHT carrier 41 releases the carrier 5 in the port 31 of the device 3 , the front side 51 of the carrier faces the right side, and then the robot arm 353 rotates the carrier 5 to turn it 180 degrees so that the front side 51 of the carrier 5 faces the left side.

[0030] In operation 64, after the carrier 5 is rotated 180 degrees by the rotation mechanism 35 of the device 3, the OHT carrier 41 picks up the carrier 5 from the port 31 of the device 3 and moves the carrier 5 to the second manufacturing tool 20. After the carrier 5 is moved to the right above the load port 201 of the second manufacturing tool 20 by the OHT carrier 41, the OHT carrier 41 lowers the carrier 5 and releases the carrier 5 in the load port 201 of the second manufacturing tool 20. Figure 1A and Figure 1B When the carrier 5 is received in the load port 201 of the second manufacturing tool 20 , the front side 51 of the carrier 5 faces the second manufacturing tool 20 .

[0031] refer to Figure 4And also refer to Figure 1A , Figure 1B and Figure 2 , Example method 7 illustrates the Figure 2 A possible process of device 3.

[0032] In operation 71, the carrier 5 is moved from the loading port 101 of the first manufacturing tool 10 to the port 31 of the device 3 by the transport tool 4. At the same time, the transport tool 4 sends information to the communication device 33 of the device 3 and communicates with the communication device 33 so that the carrier 5 can be safely moved to the port 31 of the device 3. For example, when the OHT carrier 41 moves the carrier 5 to the device 3, the transport tool 4 may send information to the communication device 33 of the device 3. After receiving this information, the communication device 33 of the device 3 instructs and guides the OHT carrier 41 to lower the carrier 5 and release the carrier 5 in the port 31 of the device 3.

[0033] In operation 72, after receiving the carrier 5 in the port 31 of the device 3, the sensor 32 of the device 3 will detect the carrier 5 and identify the orientation of the carrier 5. Figure 1A and Figure 1B , the carrier 5 has a tag 513 at its front side 51. When the carrier 5 is received in the port 31 of the device 3, the sensor 32 of the device 3 (such as a tag reader, RFID reader or CCD camera) detects the tag 513 of the carrier 5 and thus identifies the orientation of the carrier 5.

[0034] In operation 73, the sensor 32 sends the orientation information of the carrier 5 to the processor 37. After receiving this information, the processor 37 can identify the position of the front side 51 of the carrier 5 and determine whether the carrier 5 should be rotated.

[0035] In operation 741, the processor 37 is configured to automatically drive the rotation mechanism 35 to rotate the carrier 5 after identifying the orientation of the carrier 5. For example, the processor 37 may be configured to drive the rotation mechanism 35 to rotate the carrier 5 180 degrees when the sensor 32 detects that the carrier 5 faces a specific direction. Therefore, once the processor 37 receives information from the sensor 32 that the carrier 5 faces a specific direction, the processor 37 automatically drives the rotation mechanism 35 until the carrier 5 is rotated 180 degrees.

[0036] In operations 743, 745, and 747, the processor 37 drives the rotating mechanism 35 by a host command instead. In operation 743, the processor 37 is configured to send the orientation information of the carrier 5 to the host 2. Figure 2 , the processor 37 is connected to the host 2. After the processor 32 receives the orientation information of the carrier 5 from the sensor 32, the processor 32 can transmit this information to the host 2.

[0037] In operation 745, after receiving information from processor 37, host 2 may determine whether rotation mechanism 35 should rotate carrier 5. If host 2 identifies the orientation of carrier 5 and determines that carrier 5 needs to be rotated, host 2 will command processor 37 to drive rotation mechanism 35 to rotate carrier 5.

[0038] In operation 747, after receiving the command from the host 2, the processor 37 drives the rotation mechanism 35 to rotate the carrier 5. As previously stated, the host 2 is configured to determine whether the carrier 5 received in the port 31 of the device 3 needs to be rotated. Once the host 2 determines that the carrier 5 received in the port 31 of the device needs to be rotated, the host 2 may send a command to the processor 37. After receiving the command, the processor 37 drives the rotation mechanism 35 to rotate the carrier 5.

[0039] Thus, in operation 741, the processor 37 may (be configured to) automatically drive the rotating mechanism 35. In operations 743, 745, and 747, the processor follows the host command to drive the rotating mechanism 35. In some embodiments of the present invention, operations 743, 745, and 747 are operated by a user. The user may monitor the orientation of the carrier 5 received in the port 31 of the device 3 and send a command to the processor 37 of the device 3 through the host 2.

[0040] In operation 75, the rotation mechanism 35 is driven to rotate the carrier 5. In some embodiments of the present invention, the rotation mechanism 35 includes a robot arm 353. The robot arm can grasp the carrier 5 and rotate the carrier 5. In addition, in some embodiments of the present invention, the rotation mechanism 35 includes a turntable 351 integrated in the port 31. When the carrier is received in the port 31, the carrier 5 is positioned on the turntable 351. When the turntable 351 rotates, the carrier 5 received in the port 31 is rotated accordingly.

[0041] In operation 76 , after rotating the carrier 5 by the rotating mechanism 35 , the communication device 33 transmits information to and communicates with the transport tool 4 . Then, the OHT carrier 41 picks up the carrier 5 and moves the carrier 5 from the port 31 of the device 3 to the load port 201 of the second manufacturing tool 20 .

[0042] Figure 5 FIG. 8 is a top view of a system 8 for semiconductor manufacturing equipment according to some embodiments of the present invention. Figure 5 As shown in FIG. 8 , the system 8 includes a transport vehicle 84 configured to move a carrier 85. The transport vehicle 84 includes a track 842 (including rails) and an OHT carrier 841. Figure 5841 is configured to supplement the track 842 and cooperate with the track 842 for rolling along the track 842 and transporting the carrier 85 from one position to another. The third manufacturing tool 810, the fourth manufacturing tool 820, the fifth manufacturing tool 860 and the orientation tool 83 are arranged along the track 842. In other words, they are arranged along the motion path of the carrier 85. When the carrier 85 is inserted into the third manufacturing tool 810, the front side of the carrier 85 faces the east. When the carrier 85 is inserted into the fourth manufacturing tool 820, the front side of the carrier 85 faces the north. In addition, when the carrier 85 is inserted into the fifth manufacturing tool 860, the front side of the carrier 85 faces the west. Therefore, when the transport tool 84 moves the carrier 85 from the third manufacturing tool 810 to the fifth manufacturing tool 860, the OHT carrier 841 picks up the carrier 85 from the third manufacturing tool 810 and moves the carrier 85 to the orientation tool 83. Then, the orientation tool 83 rotates the carrier 85 so that the front side of the carrier 85 faces the west. After the orientation tool 83 rotates the carrier 85, the OHT carrier 841 picks up the carrier 85 from the orientation tool 83 and moves the carrier 85 to the fifth manufacturing tool 860. In addition, when the transport tool 84 moves the carrier 85 from the fifth manufacturing tool 860 to the fourth manufacturing tool 820, the OHT carrier 841 picks up the carrier 85 from the fifth manufacturing tool 860 and moves the carrier 85 to the orientation tool 83. Then, the orientation tool 83 rotates the carrier 85 so that the front side of the carrier 85 faces north. After the orientation tool rotates the carrier 85, the OHT carrier 841 picks up the carrier 85 from the orientation tool 83 and moves the carrier 85 to the fourth manufacturing tool 820.

[0043] It should be understood that in the foregoing method, the orientation of the workpiece (e.g., carrier 5) in the system can be automatically corrected. When the system is to move a workpiece from one tool to another but the orientations of the workpieces loaded in the two tools are different, the system can utilize a device to rotate the orientation of the workpiece so that the workpiece can be automatically moved from one tool to another by the system.

[0044] It should be further understood that the aforementioned apparatus and system can be used in an automated material handling system (AMHS) of a semiconductor manufacturing facility. Thus, the manufacturing tool is not limited solely to EUV lithography, and the OHT carrier is not limited solely to transporting (several) reticle plates. The OHT carrier can be appropriately configured to accommodate any type customized by a person skilled in the art without undue experimentation.

[0045] According to one embodiment of the present invention, an apparatus for orienting a workpiece includes a port configured to receive the workpiece, a sensor configured to detect the orientation of the workpiece received in the port, and a rotation mechanism configured to rotate the workpiece received in the port.

[0046] According to another embodiment, a system for semiconductor manufacturing equipment includes: a first manufacturing tool configured to load a workpiece facing a first direction; a second manufacturing tool configured to load the workpiece facing a second direction; an orientation tool configured to adjust the orientation of the workpiece; and a transport tool configured to move the workpiece. The first direction is different from the second direction. In addition, the first manufacturing tool, the second manufacturing tool, and the orientation tool are arranged along a motion path of the workpiece.

[0047] According to one embodiment of the present invention, a method for operating a system for semiconductor manufacturing equipment includes: moving a workpiece to a device by a transport tool; detecting the orientation of the workpiece received in the device by a sensor; rotating the workpiece received in the device by a rotating mechanism; and moving the workpiece away from the device by the transport tool.

[0048] The features of several embodiments are summarized above so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art will also appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure and that various changes, substitutions and modifications may be made herein without departing from the spirit and scope of the present disclosure.

[0049] Explanation of symbols

[0050] 1: System

[0051] 1': System

[0052] 2: Host

[0053] 3: Installation

[0054] 4: Transportation tools

[0055] 5: Carrier

[0056] 6: Methods

[0057] 7: Methods

[0058] 8: System

[0059] 10: Manufacturing tools / first manufacturing tools

[0060] 20: Manufacturing tool / second manufacturing tool

[0061] 31:Port

[0062] 32: Sensor

[0063] 33: Communication devices

[0064] 35: Rotating mechanism

[0065] 37: Processor

[0066] 41: Overhead Hoist Transport (OHT) Vehicle

[0067] 42: Track

[0068] 51:Front

[0069] 61: Operation

[0070] 62: Operation

[0071] 63: Operation

[0072] 64: Operation

[0073] 71: Operation

[0074] 72: Operation

[0075] 73: Operation

[0076] 75: Operation

[0077] 76: Operation

[0078] 83: Orientation Tools

[0079] 84:Transportation tools

[0080] 85: Carrier

[0081] 101: Loading port

[0082] 201: Loading port

[0083] 351: Turntable

[0084] 353:Robot Arm

[0085] 513: Tags

[0086] 741: Operation

[0087] 743: Operation

[0088] 745: Operation

[0089] 747: Operation

[0090] 810: The third manufacturing tool

[0091] 820: Fourth Manufacturing Tool

[0092] 841: Overhead Hoist Transport (OHT) Vehicle

[0093] 842: Track

[0094] 860: The fifth manufacturing tool.

Claims

1. A device for orienting a workpiece, comprising: a port configured to receive the workpiece; a sensor configured to detect orientation information of the workpiece received in the port; a rotation mechanism configured to rotate the workpiece received in the port based on the orientation information of the workpiece detected by the sensor; and A communication device configured to communicate with a vehicle; The transport tool is configured to move the workpiece from a first manufacturing tool to the device, and then move the workpiece from the device to a second manufacturing tool. wherein the first manufacturing tool is configured to load the workpiece to face a first direction, and the second manufacturing tool is configured to load the workpiece to face a second direction, wherein the second direction is different from the first direction; After the transport tool removes the workpiece loaded on the first manufacturing tool, the transport tool communicates with the communication device of the device, and the device guides the transport tool to move the workpiece to the port. When the transport tool moves the workpiece to the port, the workpiece faces the first direction. At the same time, the sensor detects the orientation information of the workpiece, and the rotating mechanism rotates the workpiece to face the second direction according to the orientation information of the workpiece detected by the sensor. After the workpiece is rotated by the rotating mechanism to face the second direction, the communication device communicates with the transport tool again, and the transport tool moves the workpiece from the device to the second manufacturing tool.

2. The device of claim 1, wherein the sensor comprises at least two readers.

3. The device of claim 1, wherein the rotating mechanism comprises a turntable.

4. The device of claim 1, wherein the rotation mechanism comprises a robotic arm.

5. The device of claim 1, further comprising a processor connected to the sensor and the rotation mechanism.

6. The device of claim 5, wherein the processor is configured to receive the orientation information from the sensor and drive the rotation mechanism.

7. The device of claim 1, wherein the device is further in communication with a host.

8. A system for semiconductor manufacturing equipment, comprising: a first manufacturing tool configured to load a workpiece facing in a first direction; a second manufacturing tool configured to load the workpiece to face in a second direction, wherein the second direction is different from the first direction; Targeting tools, including: a sensor for detecting orientation information of the workpiece; a rotating mechanism for rotating the workpiece; and Communications devices; and A transport tool configured to move the workpiece, wherein the first manufacturing tool, the second manufacturing tool, and the orientation tool are arranged along a motion path of the workpiece, and the communication device of the orientation tool is communicatively connected with each other; Wherein, during the process in which the transport tool moves the workpiece from the first manufacturing tool to the second manufacturing tool, the system is configured to: When the transport tool moves out the workpiece loaded on the first manufacturing tool and facing the first direction, the communication devices of the transport tool and the orientation tool communicate with each other, thereby guiding the transport tool to move the workpiece to the orientation tool; After the workpiece moves to the orientation tool, detecting the orientation information of the workpiece by the sensor; Based on the orientation information of the workpiece detected by the sensor, rotating the workpiece by the rotating mechanism so that the workpiece faces the second direction; and The communication devices of the transport tool and the orientation tool are enabled to communicate with each other, thereby guiding the transport tool to move the workpiece from the orientation tool and load it onto the second manufacturing tool.

9. The system of claim 8, wherein the orientation tool further comprises a processor connected to the sensor and the rotation mechanism.

10. The system of claim 9, wherein the processor is configured to drive the rotation mechanism based on the orientation information of the workpiece detected by the sensor.

11. The system of claim 8, wherein the sensor comprises at least two readers.

12. The system of claim 8, wherein the rotating mechanism comprises a turntable.

13. The system of claim 8, wherein the rotation mechanism comprises a robotic arm.

14. The system of claim 9, further comprising a host computer connected to the processor of the transport tool and the orientation tool.

15. The system of claim 14, wherein the host is configured to receive orientation information of the workpiece from the processor and is configured to send commands to the processor to drive the rotation mechanism.

16. The system of claim 8, wherein the transport comprises an overhead crane transport (OHT).

17. A method for operating a system of semiconductor manufacturing equipment, comprising: By communicating with the orientation device through a transport tool, the transport tool moves the workpiece facing a first direction and loaded on a first manufacturing tool to the orientation device, wherein the first manufacturing tool is configured to load the workpiece when the workpiece faces the first direction; detecting, by a sensor of the orientation device, orientation information of the workpiece received in the orientation device; Based on the orientation information of the workpiece detected by the sensor, the workpiece received in the orientation device is rotated by a rotating mechanism of the orientation device so that the workpiece faces a second direction; and The transport tool communicates with the orientation device to move the workpiece from the orientation device to a second manufacturing tool, wherein the second manufacturing tool is configured to load the workpiece when the workpiece faces the second direction, wherein the first direction is different from the second direction.

18. The method according to claim 17, further comprising: The orientation information of the workpiece detected by the sensor is transmitted to a processor of the orientation device.

19. The method according to claim 18, further comprising: The processor of the orientation device drives the rotating mechanism to rotate based on the orientation information of the workpiece.

20. The method of claim 18, further comprising: The processor of the orientation device transmits the orientation information of the workpiece to an external host; The external host sends a command to the processor of the directional device; The processor of the orientation device drives the rotating mechanism to rotate based on the command.

Images